Abstract: A system and method for clamping wafers together in alignment using pressure. The system and method involves holding a first wafer and a second wafer together in alignment using a wafer clamp within an ambient environment maintained at a first pressure and creating a second pressure at least partially around and between the first wafer and the second wafer held together by the wafer clamp, wherein the first pressure is greater than the second pressure. The first wafer and the second wafer are clamped together in alignment using a pneumatic force created by a pressure differential between the first pressure and the second pressure.

Abstract: A process using a vacuum ring or vacuum bag to produce glass laminates with improved optical distortion and shape consistency using thin glass having a thickness not exceeding 1.0 by using a soak temperatures not exceeding 120° C. or not exceeding 100° C. and a vacuum not exceed about ?0.6 bar. One or more assembled stacks of two glass sheets and a polymer interlayer being laminated may be stacked on a single reference mold and processed simultaneously in a single vacuum bag or vacuum ring. One more thin glass sheets may be placed on top the assembled stack(s) on the reference mold to protect the assembled stack from irregular forces applied by the vacuum bag or the vacuum ring.

Abstract: A method for laminating essentially plate-shaped work pieces with a thermally activated adhesive layer, particularly photovoltaic modules. Work pieces are inserted into a vacuum chamber having a compression element dividing the vacuum chamber in a gas tight fashion that can be raised and lowered by pressure differences. The compression element presses against the work piece which in turn presses against a heating plate which forms a lower side of the vacuum chamber, with processing heat being transferred into the work piece to soften the adhesive. The work piece is first impinged by the compression element with a slight load from approx. 2% to 10% of the defined processing load, and is simultaneously kept below the adhesive activation temperature. Thereafter, the slight load is lifted off the work piece and the work piece is heated to the activation temperature and impinged via the compression element with the processing load.

Abstract: The present invention provides a technique which can disassemble a mandrel having a substantially cylindrical shape and being dividable into a plurality of segments, easily and efficiently. The disassembling method comprises, in the mandrel adhesively attached with a composite material structure on an outer peripheral surface thereof, a rotation step of rotating the pair of support rings along with the mandrel to position a segment which is a detached target to an uppermost portion; and a segment detaching step of detaching the segment which is the detached target positioned at the uppermost portion, from the pair of support rings; wherein in the segment detaching step, the segment which is the detached target is moved in a vertically downward direction to a position inside of the mandrel, between the pair of support rings, and is carried out from between the pair of support rings.

Abstract: An apparatus for laminating a fabric material to a part broadly comprises a cutting element, a heating system, a vertical pressure unit, and a compaction roller assembly. The cutting element may cut scrap material from the sides of the fabric material. The heating system may heat the fabric material after the material exits the vacuum conveyor assembly. The vertical pressure unit may apply a downward force on the compaction roller assembly, which may receive the fabric material and press the fabric material against a surface of the part. The compaction roller assembly may include a roller operable to have a variable curvature along its longitudinal axis and an actuating device operable to apply a variable torque to opposing ends of the roller to vary the curvature of the roller.

Abstract: The bonding apparatus is capable of effectively increasing temperature of a substrate and reducing occurrence of position gaps and poor connection in a process of flip-chip-bonding semiconductor devices to the substrate. The bonding apparatus comprises: a supporting unit for supporting the substrate, on which the semiconductor devices have been adhered by a non-conductive; and a heating/pressing unit for heating and pressing the substrate, the heating/pressing unit having a built-in heat source and a clamping face, onto which the substrate supported by the supporting unit is pressed. The substrate supported by the supporting unit is moved toward the clamping face of the heating/pressing unit so as to preheat the substrate and the semiconductor devices by radiation heat. Then, the semiconductor devices are pressed onto the clamping face of the heating/pressing unit so as to cure the non-conductive adhesive and bond bumps of the semiconductor devices to terminal sections of the substrate.

Abstract: A drum for cutting linerless labels from a continuous strip and transferring the labels to a container movable with a given trajectory and speed on a machine, the drum including a side surface suitable for guiding the strip by contacting a non-adhesive surface of the labels, the side surface defining a vertical slit, a coaxial and concentric sleeve for centering the drum on a corresponding support spindle, a cutting blade parallel to a vertical direction of the drum, the cutting blade being displaceable in a radial direction from a position retracted inside the drum to a position at least partially extended through the vertical slit outside the side surface of the drum, a fixed cam relative to which the drum rotates and that is configured to press against the cutting blade so as to cause the cutting blade to extend out in a predefined angular position, and a seat that extends in the vertical direction (Z-Z) and is connected to the cam and which is suitable for engagement with a corresponding fixed reference p

Abstract: An airfoil is fabricated by assembling cured skins with spars having cured spar webs and uncured spar chords. The skins are bonded to the spars by curing the spar chords.

Abstract: A vacuum bag sealing system may include a composite bagging sheet, and at least one interlocking strip connected to a surface of the composite bagging sheet, wherein the interlocking strip is configured to join a first section of the composite bagging sheet to a second section of the composite bagging sheet to form a sealed vacuum bag.

Abstract: An apparatus for laminating a scintillator panel and an imaging device panel includes a chamber, a membrane, a first vacuum pump, a second vacuum pump, a heater plate, and a heater power supply. The chamber includes a chamber cover, defining a sealed space. The membrane defines the sealed space in the bottom of the chamber cover by being coupled to the bottom surface of the chamber cover and is made of a contractable and expandable material. The first vacuum pump is coupled to the chamber cover and vents vacuum in the sealed space between the bottom surface of the chamber cover and the membrane. The second vacuum pump vents vacuum in the chamber by being coupled to one side of the chamber. The heater plate is coupled into the chamber to support and heat the panel assembly with an adhesive interposed between the scintillator panel and the imaging device panel.

Abstract: A method of molding a wind turbine blade in a mold is provided. The method includes applying a film to an inside surface of a mold, assembling component layers for the wind turbine blade on the film, performing curing to harden the component layers, and subsequently removing the cured wind turbine blade from the mold. Also provided is a film suitable for use in a wind turbine blade molding process and a mold suitable for molding a wind turbine blade.

Abstract: The invention provides a method of bonding a first wafer onto a second wafer by molecular adhesion, the method comprising applying a point of initiation of a bonding wave between the first and second wafers, the method further comprising projecting a gas stream between the first wafer and the second wafer generally toward the point of initiation of the bonding wave while the bonding wave is propagating between the wafers. The invention also provides a bonding apparatus for carrying out the bonding method.

Abstract: A room temperature bonding apparatus includes angle adjustment means supporting a first sample stage holding a first substrate so as to be able to change a direction of the first sample stage; a first driving device driving the first stage in a first direction; a second driving device driving a second sample stage holding a second substrate in a second direction not parallel to the first direction; and a carriage support table supporting the second sample stage in the first direction when the second substrate and the first substrate are brought into contact. The apparatus can impose a load exceeding a withstand load of the second driving device on the first and second substrates. Further, the apparatus uses angle adjustment means to change direction of the first substrate to be parallel with the second substrate and uniformly impose the larger load on a bonding surface.

Abstract: The invention relates to a method and a device for a bubble-free bonding of large-surface glass panes in an automatic production process. An embodiment of the device comprises: a) a pivoting bench plate having a securing device for receiving a glass pane, b) a barrier material application head having a camera for monitoring, at least one ventilation element being mounted by a mounting head, c) an adhesive metering and application head having a process control sensor for the application of adhesive, d) a gripping device having a covering plate gripper for receiving a covering plate, and e) a vacuum suction device and a closing device for the ventilation system.

Abstract: The invention relates to a method for bonding two substrates, in particular, two semiconductor substrates that, in order to be able to improve the reliability of the process, provides the step of providing a gaseous flow over the bonding surfaces of the substrates. The gaseous flow is preferably a laminar flow that is essentially parallel to the bonding surfaces of the substrates, and has a temperature in a range of from room temperature up to 100° C.

Abstract: The invention relates to a method for applying a label to an article travelling along an article path, said label being received on a movable surface at an input location to be retained against said surface whilst being glued and advanced to an output location, at which the label is transferred to the article; the article being rotated with a tangential speed about an axis whilst travelling at a speed along the path including providing at least three portions of surface with independent and controllable vacuum means for retaining the label, including curtailing the application of vacuum means at the first portion of the surface upon the first portion reaching the output location and interrupting the application of vacuum means at the third portion of the surface, with the trailing edge of the label being retained at the second portion of the surface.

Abstract: A substrate attachment system, including a portable chamber for receiving a pair of substrates which are aligned; a conveyor transportation device which continuously moves the portable chamber and to which a vacuum generator that is connected to a vacuum port of the portable chamber to evacuate the inside of the portable chamber is provided; and a heating device for performing a heating process in which the aligned substrates are attached to each other in the portable chamber, wherein the conveyor transportation device is arranged to pass through the heating device. The substrate attachment system may contribute to high attachment accuracy, and also, since the size of a chamber is reduced, a spatial utilization rate may be high, and also, since an attachment process is continuously performed by using a conveyor transportation device, a process time may be reduced.

Abstract: Multi-layer printed wiring boards may be produced by: (1) conveying an adhesive sheet from an adhesive sheet roll wherein an adhesive sheet having a prepreg formed on a support film is wound in a roll and placing the adhesive sheet such that a prepreg surface contacts one or both of the surfaces of a circuit board, (2) partially adhering the adhesive sheet to the circuit board by heating and pressing a part of the adhesive sheet from the support film side, and cutting the adhesive sheet according to the size of the circuit board with a cutter, (3) heating and pressing the temporarily fitted adhesive sheet under reduced pressure to laminate the adhesive sheet on the circuit board, (4) forming an insulating layer by thermally curing the prepreg, and (5) detaching the support film after the thermal curing step.

Abstract: An embodiment of the present invention provides a method for manufacturing a composite preform from tape material, including feeding a tape section into a tape section guide that suspends the tape across a tooling surface, moving at least one of the tape section guide and the tooling surface relative to each other to position the tape section at a desired location and orientation relative to the tooling surface, moving the tape section toward a pre-existing tape section disposed on the tooling surface, and tacking the tape section to the pre-existing tape section. A corresponding apparatus for manufacturing composite preforms is also disclosed.

Abstract: In one aspect, a vacuum drum assembly for use with a labeling apparatus includes apertures for supporting labels on an outer surface using vacuum pressure. The vacuum drum assembly may include air distributors for providing vacuum pressure to selected apertures to accommodate various lengths or widths of labels. The vacuum drum assembly may also be adjustable to vary the spacing between apertures to accommodate various lengths of labels.

Abstract: An insulated container includes a first laminated structure having a metal layer and a second laminated structure having a metal layer. The metal layer of the first laminated structure faces the metal layer of the second laminated structure. The insulated container also includes a foam material layer disposed between the first laminated structure and the second laminated structure. The metal layer of the first laminated structure is bonded to the metal layer of the second laminated structure at a plurality of locations.

Abstract: A curable adhesive that is modified to allow spray application and polymerization seamlessly during the process of epoxy resin vacuum infusion.

Abstract: In assembling a portion of a microfluidic device by conducting bonding action by contacting faces of opposed bondable materials, one comprising a flexible sheet, the method, while maintaining continual contact of the faces in a region R1 until bonding is completed, of employing repeated make-and-break-contact manufacturing protocol on a second region R2 of the contacted faces of the bondable materials, thereby over time neutralizing the tendency for permanent bonds to form in that region R2, thus to enable making and breaking actuated movements of the second region R2 of the flexible sheet relative to the portion of the other material that it opposes.

Abstract: A method of manufacturing a component having first and second layers, the first and/or second layers including one or more depressions provided on a surface of the respective layer. The method including: arranging the first and second layers so that they face one another and with the depressions on inner facing surfaces of the layers; diffusion bonding the first and second layers together about their edges; applying a first differential pressure across each of the first and second layers to evacuate an inner space defined by the layers, thereby forming one or more depressions on an outer facing surface of the first or second layer; and applying a second differential pressure across each of the first and second layers to expand the inner space defined by the layers.

Abstract: An in-situ double vacuum debulk (DVD) composite repair system designed to produce partially or fully cured autoclave-quality hot-bond composite repairs on contoured structures. The system provides vacuum pressure for hot bond repairs to be performed on flat and contoured structures using one set-up capable of debulking (partially curing) and then fully curing composite repairs on composite and metallic aircraft structures. The use of in-situ DVD also eliminates handling of the patch/adhesive when transferring from an off-aircraft DVD chamber to the repair site on the aircraft. This can increase the probability of successful repairs because the possibility of contaminating and misaligning the adhesive and repair patch are eliminated.

Abstract: A reusable vacuum bag for processing parts is made by encapsulating a generally rigid frame within a flexible diaphragm.

Abstract: An autoclave may be reconfigured to accommodate differently shaped parts by relatively rotating portions of the autoclave.

Abstract: An apparatus is provided for laminating a first and a second sheet (1, 2) comprising—a chamber (10) having a first, a second and a third compartment (11, 12, 13 resp.) subsequently arranged along a first axis (Z), each compartment having a port (21, 22, 23 resp.

Abstract: Provided is an apparatus and a method of holding a device. The apparatus includes a wafer chuck having first and second holes that extend therethrough, and a pressure control structure that can independently and selectively vary a fluid pressure in each of the first and second holes between pressures above and below an ambient pressure. The method includes providing a wafer chuck having first and second holes that extend therethrough, and independently and selectively varying a fluid pressure in each of the first and second holes between pressures above and below an ambient pressure.

Abstract: Example embodiments relate to an insert and a method for attaching the insert to a structure. In example embodiments the structure may be comprised of a composite material, a metal, and a ceramic.

Abstract: A label applicator that includes an applicator housing having a flow chamber and a suction side. The suction side has one or more openings that allow air to pass therethrough. The label applicator also includes first and second air flow generators that are fluidly coupled with the flow chamber. The first and second air flow generators are configured to generate first and second air flows, respectively, through the flow chamber. The label applicator also includes a valve mechanism that is positioned in the flow chamber to direct the first and second air flows through the flow chamber of the applicator housing. The valve mechanism includes a diverter valve and an electric actuator. The actuator is configured to move the diverter valve within the flow chamber to different positions during a label application operation.

Abstract: Systems and methods for assembling a skin of a composite structure on an outer surface of an inner mold line layup mandrel. The systems and methods include receiving a plurality of ply kits, assembling the plurality of ply kits to form a skin segment that defines a portion of the skin, and affixing the skin segment to the outer surface of the layup mandrel. The assembling includes transferring a respective ply kit of the plurality of ply kits to a non-planar transfer tool, compacting the respective ply kit on the non-planar transfer tool, and repeating the transferring and the compacting for each ply kit in the plurality of ply kits to form the skin segment.

Abstract: Disclosed is a method for placing fiber-reinforced, pre-impregnated, planar semi-finished products on a placement tool for the manufacture of a non-crimp fabric, wherein a placement film is clamped on the placement tool for purposes of holding the non-crimp fabric, and by means of evacuation and/or the application of pressure is fixed in position on the placement tool and/or can be released from the latter. Also disclosed is a placement tool for the execution of such a method.

Abstract: A method of applying graphics to a set of articles with a graphic transfer assembly is disclosed. The method includes a step of selecting an article from a set of articles comprising different types of articles. After selecting a last that may be associated with the article, the last may be attached to a last assembly of the graphic transfer assembly. With the article attached to the graphic transfer assembly, a deformable membrane may apply graphics to curved portions of the article.

Abstract: A bow wave in a composite laminate generated during part consolidation is reduced by transmitting atmospheric pressure loads to a region of the part having low compaction pressure due to bridging of a vacuum bag at an edge of the part.

Abstract: An apparatus for manufacturing an absorbent body, including a recessed form die formed on a predetermined face of a predetermined member, moving in one direction along a moving path along the predetermined face; a duct disposed in a predetermined position in the moving path, discharging a gas including fluid absorbent fibers from an opening section toward the predetermined face; and a polymer casting member disposed inside the duct, casting a superabsorbent polymer from a casting opening toward a center area of the opening section in a direction along the moving path, wherein in the case of the form die passing the duct position, by the gas being sucked through air intake holes in a bottom section of the form die, the fluid absorbent fibers and the superabsorbent polymer in the gas are stacked in the form die to form an absorbent body, wherein an air pressure inside the duct is made lower than the air pressure outside the duct because of the gas being sucked through the bottom section of the form die, wherein

Abstract: A structural panel includes a closed-cell foam core formed of a metallic material; a first carbon-fiber panel bonded to a first side of the closed-cell foam core; and a second carbon-fiber panel bonded to a second side of the closed-cell foam core such that the foam core is disposed between the first carbon-fiber panel and the second carbon-fiber panel.

Abstract: The invention relates to a method for producing a fiber composite workpiece. In the method according to the invention, cross-linking silicone is used with the aid of a volatile diluent for infiltrating individual mats of a mat composite. A further object of the present invention is a device for performing the method according to the invention.

Abstract: Systems and methods for bonding include selectively heating an initial location of a sample to melt a bonding layer at an interface between a first layer and a second layer of the sample. The heating is propagated in a direction away from the initial location such that a melt front of the bonding layer is translated across the interface to provide a void free bond between the first layer and the second layer.

Abstract: A method of manufacturing “T” shaped stringers for an aircraft whereby the “T” shaped stringers have a stringer web and a stringer foot, the method comprising: a first step of hot-forming a carbon fiber laminate in order to achieve semi-stringers with an “L” shaped cross-section, a second step of placing together two hot-formed “L” shaped semi-stringers in order to form a “T” shaped stringer, a third step of co-bonding the resulting “T” shaped stringer on a cured skin with an adhesive line between them, and a fourth step of curing the obtained “T” shaped stringer inside a vacuum bag using invar alloy angles as curing tools. The invar alloy angles are cut at a radius area eliminating a part of the invar alloy angles covering the stringer foot in order to define an invar alloy piece having no foot.

Abstract: A method of fabricating a semiconductor device comprises loading a circuit board including a semiconductor chip into underfill equipment, positioning the circuit board on a depositing chuck of the underfill equipment, filling an underfill material in a space between the semiconductor chip and the circuit board placed on the depositing chuck; transferring the circuit board including the underfill material so that it is positioned on a post-treatment chuck of the underfill equipment; heating the underfill material of the circuit board placed on the post-treatment chuck in a vacuum state, and unloading the circuit board, of which the underfill material has been heated in the vacuum state, from the underfill equipment.

Abstract: This disclosure concerns bonding a thin film of diamond to a second thick diamond substrate in a way that does not cause the exposed (un-bonded) diamond surface to become contaminated by the bonding process or when the bonded diamond is held at high temperature for many hours in vacuum.

Abstract: A structural panel comprises phenolic skins formed over a honeycomb core. The skins are bonded to the honeycomb under vacuum and heat, providing a panel capable of forming to desired shapes. The panel is 30% lighter than aluminum honeycomb panels of similar thickness, equivalent in strength to aluminum honeycomb panels, and meets the very stringent fire, smoke and toxicity norms of the industry. Additionally the product also reduces the thermal load, has very high heat resistance and is corrosion resistant. The use of this product is not limited to flat profiles, but can also be used to mould double curved or other three dimensional profiles.

Abstract: A method consistent with certain implementations involves installing a protective film on a display panel by: placing a sheet of protective film adjacent a front surface of a display panel, where the front surface comprises a surface of the display panel that is displayed when in use, and where the display panel has an edge around a periphery of the display panel; drawing protective film into full contact with the front surface of the display panel; sealing the protective film to the front surface of the display panel at a location at or near the edge of the display panel around the periphery thereof to produce a peripheral sealed edge. The protective film can be drawn into full contact with the display panel by using a vacuum. This abstract is not to be considered limiting, since other embodiments may deviate from the features described in this abstract.

Abstract: A method and apparatus for fabricating a composite part, such as a fuselage or internal stiffener, with a shape memory polymer (SMP) apparatus usable as both a rigid lay-up tool and a bladder. The SMP apparatus may be heated until malleable, shaped, and then cooled in a desired rigid tool configuration. For example, cavities may be formed into the SMP apparatus for nesting components therein to co-bond or co-cure with the composite part. Next, composite material may be applied onto the SMP apparatus and then placed into a rigid external tool and heated to composite cure temperatures at which the SMP apparatus is malleable. A pressure differential may be induced which urges the SMP apparatus to compress the composite material against the rigid external tool. When the composite material is cured, the SMP apparatus may be urged away from the cured composite material and removed from within the composite part.

Abstract: There is a method for forming a laminated product having a first substrate and a second substrate. The method may comprise applying a liquid adhesive on a surface of the first substrate for bonding the first substrate to the second substrate. The liquid adhesive located on a circumferential periphery of the first substrate for limiting movement of the liquid adhesive within the circumferential adhesive wall structure. Pressure may be applied on a bond area between the first substrate and the second substrate in a vacuum environment to incrementally increase the bond area between the first substrate and the second substrate to incrementally bond the first substrate to the second substrate. The liquid adhesive may be cured to bond the first and second substrates.

Abstract: An apparatus for tensioning a preform may include a mandrel to receive a preform. The mandrel may have a first mandrel end and a second mandrel end. The preform may have a first preform end and a second preform end. The apparatus may include an anchoring groove disposed at the first mandrel end, and an anchoring device being configured and located to urge the first preform end towards the anchoring groove to secure the first preform end therebetween. The apparatus may include a tensioning groove disposed between the first mandrel end and the second mandrel end, and a tensioning device being configured and located to urge at least a portion of the preform into the tensioning groove.

Abstract: An area of a structure is reworked using resin infusion of a fiber preform. A resin flow hole is formed through the structure from a first side of the structure to a second side of the structure. The fiber preform is placed on the first side of the structure and substantially saturated with resin by flowing resin into the preform and out through the resin flow hole to the second side of the structure.

Abstract: A method and apparatus for fabricating a composite part, such as a fuselage or internal stiffener, with a shape memory polymer (SMP) apparatus usable as a rigid lay-up tool. The SMP apparatus may be heated until malleable, shaped, and then cooled in a desired rigid tool configuration. For example, cavities may be formed into the SMP apparatus for nesting components therein to co-bond or co-cure with the composite part. The composite material and/or nested components may be heated and compressed against the SMP apparatus. The SMP apparatus may be configured to remain rigid during the composite cure cycle. Once the composite material is cured, the SMP apparatus may be triggered to a malleable state and urged away from the cured composite material.

Abstract: A resin composition containing (A) a polyimide having acidic functional groups and (B) a compound having functional groups that react with the acidic functional groups, where (a) a solution rate in 3 mass % aqueous sodium hydroxide at 45° C. is 0.95 or more after a heat history of 90° C. for 10 minutes with the solution rate before the heat history assumed to be 1, (b) the solution rate in 3 mass % aqueous sodium hydroxide at 45° C. ranges from 0.001 ?m/sec to 0.02 ?m/sec after the heat history of 180° C. for 60 minutes, (c) a bleed-out amount is 50 mg/m2 or less in storing at 40° C. for 2 weeks after the heat history of 180° C. for 60 minutes, and (d) a thermogravimetric decrease at 260° C. is 2.0% or less in measuring on a temperature rising condition of 10° C./min from 40° C. by thermogravimetric analysis (TG).