Abstract: A touch and display sensing integrated circuit and a touch display device using the same are provided. The touch display device includes a display and touch sensing integrated circuit and a glass substrate. The glass substrate includes touch/display common voltage electrodes, pixels, pads and conductive lines. Each pixel includes Q sub-pixels. The pads are electrically connected to the touch and display sensing integrated circuit. The Pth and (P+Q+1)th pads are electrically connected to the touch/display common voltage electrode through the corresponding conductive lines, respectively. The (P+1)th to (P+Q)th pads are electrically connected to 1st to Qth sub-pixels of a pixel through the corresponding conductive lines, respectively. The pads are arranged in a first direction, and the conductive lines, which are electrically connected to the pads in a second direction, are non-interlaced.

Abstract: A system for reducing processing defects during processing of a semiconductor wafer prior to back-grinding the wafer includes a table having one or more holes formed therein, wherein the table comprises at least one of a chuck table or a support table, wherein the holes are perpendicular to the surface upon which a pre-back-grinding (PBG) process occurs. The system further includes one or more sensors disposed in said holes for monitoring a parameter during the PBG process. The system further includes a computer-implemented process control tool coupled with the one or more sensors and configured to determine whether the PBG process will continue.

Abstract: A method for repairing damage to a composite part includes creating an aperture through the composite part and preparing the surfaces surrounding the aperture on both sides of the part; inserting a plurality of resin impregnated fibers through the aperture and spreading the end portions of the plurality of fibers radially against the prepared surfaces on both sides of the part; and maintaining contact of the plurality of fibers with the prepared surfaces while the resin cures.

Abstract: An assembled mandrel for forming a hollow structure having a shape similar to that of the assembled mandrel, by layering a prepreg on the surface of the longitudinally oriented assembled mandrel, covering the same with a vacuum bag, heating while creating a vacuum inside the vacuum bag, and heat-curing the prepreg while pressing the same into the assembled mandrel, the assembled mandrel being characterized by being equipped with: two outer mandrel members (first mandrel members) extending in the longitudinal direction; a center mandrel member (second mandrel member) sandwiched between the two outer mandrel members, and capable of being withdrawn in the lengthwise direction from between the two outer mandrel members after the hollow structure has been formed; and a tape (detachable member) formed from a low-friction material and adhered to one or more of the contact surfaces between the two outer mandrel members and the center mandrel member.

Abstract: A device for absorbing heat generated by curing of a curable matrix material, particularly heat generated by curing of a curable matrix material embedding a textile structure including a number of reinforcing fibers is provided. The device includes at least one envelope element defining at least one inner volume, and at least one thermally conductive heat absorbing element disposed within the at least one inner volume of the at least one envelope element. In a further embodiment, the at least one envelope element may be built of or include at least one non-adhering material which does not adhere to the curable or cured matrix material.

Abstract: Devices, systems and methods for compacting a charge of composite material across an edge are disclosed herein. The devices include a vacuum compaction device including a compaction force transfer structure, a sealing structure, and a vacuum distribution manifold. The compaction force transfer structure includes a first barrier structure, a second barrier structure, and a junction support that extends at least partially between the first barrier structure and the second barrier structure. The junction support is configured to maintain the first barrier structure and the second barrier structure at an angle with respect to one another and to permit limited angular motion of the first barrier structure and the second barrier structure relative to one another. The systems include composite structure fabrication systems that include the vacuum compaction device. The methods include methods of operating the vacuum compaction device.

Abstract: System and method for compacting a composite ply layup comprising a forming tool comprising a top surface and a composite ply layup laid up along the top surface of the forming tool. A single release film comprising a top surface and a bottom surface, wherein the bottom surface of the single release film comprises a first non-planar bottom surface. The first non-planar bottom surface placed over a top surface of the composite ply layup. A venting port operatively coupled directly to the top surface of the single release film. A vacuum source operatively coupled to the venting port and configured to generate a vacuum to the single release film, such that the first non-planar bottom surface of the single release film defines a breather path for the vacuum generated by the vacuum source to distribute over the top surface of the composite ply layup.

Abstract: A system and method for clamping wafers together in alignment using pressure. The system and method involves holding a first wafer and a second wafer together in alignment using a wafer clamp within an ambient environment maintained at a first pressure and creating a second pressure at least partially around and between the first wafer and the second wafer held together by the wafer clamp, wherein the first pressure is greater than the second pressure. The first wafer and the second wafer are clamped together in alignment using a pneumatic force created by a pressure differential between the first pressure and the second pressure.

Abstract: The present disclosure provides a method of repairing a damaged portion of a panel formed of composite material. The method includes preparing the damaged portion for repair and applying a pressure responsive adhesive layer to substantially cover the damaged portion. The method also includes disposing a vacuum-assisted resin transfer molding repair patch assembly to substantially cover the damaged portion and substantially covering the repair patch assembly with a vacuum bag assembly. Resin is introduced into and impregnates the repair patch assembly. The repair patch assembly is cured after being impregnated.

Abstract: Methods of and systems for assembling stiffened composite structures are disclosed. Some methods include forming a stiffener assembly by compacting it within a trough formed in a trunnion. A single trunnion may accommodate two or more different types of stiffeners, thereby avoiding the need for multiple sets of tooling. In some methods, a plurality of stiffener segments may be spliced together, thereby avoiding the need to transport and handle an entire stiffener. A vacuum chuck may be utilized in some examples to transfer the stiffener assembly from the trunnion to a transfer tool. The same vacuum chuck may be transferred along with the stiffener assembly on the transfer tool and loaded onto an inner mold line layup mandrel, where the vacuum chuck may be used to compact the stiffener assembly to the inner mold line layup mandrel.

Abstract: A circuit board structure includes an inner circuit structure and a first build-up circuit structure. The inner circuit structure includes a core layer having an upper surface and a lower surface, a first patterned circuit layer disposed on the upper surface, a second patterned circuit layer disposed on the lower surface and a conductive through hole connecting the first and the second patterned circuit layers. The first build-up circuit structure at least has a cavity and an inner dielectric layer. The inner dielectric layer has an opening communicating the cavity and a pad of the first patterned circuit layer is located in the opening. A hole diameter of the opening is smaller than a hole diameter of cavity. An inner surface of the inner dielectric layer exposed by the cavity and a top surface of the pad are coplanar or have a height difference.

Abstract: A method and apparatus for compacting composite stringers. In one illustrative embodiment, an apparatus comprises a compacting structure, a compactor vacuum system, and a carrier vacuum system. The compacting structure has a shape configured to contact layers of uncured composite material for a composite stringer. The compactor vacuum system is associated with the compacting structure. The compactor vacuum system is configured to cause the compacting structure to apply a pressure to the layers of uncured composite material when a compactor vacuum is applied to the compactor vacuum system. The carrier vacuum system is associated with the compacting structure. The carrier vacuum system is configured to hold the layers of uncured composite material against the compacting structure when a carrier vacuum is applied to the carrier vacuum system.

Abstract: A substrate fixing apparatus includes a back-up member which is located between a pair of conveying members arranged at a distance from each other in a plan view and is below a film-like substrate conveyed along the conveyance path and supported from below by the pair of conveying members. An elevation driver moves at least one of a back-up member and a substrate pressing member upward and downward. The elevation driver elevates the back-up member and/or lowers the substrate pressing member together with the pair of conveying members, thereby separating the substrate upward from the pair of conveying members while supporting the substrate from below by the back-up member and pressing the surface of the outer peripheral part of the substrate downward by the substrate pressing member to correct warpage of the outer peripheral part of the substrate.

Abstract: A method for laminating substrates to form a laminated assembly includes positioning a first substrate and a second substrate within a lamination device having a first cavity and a second cavity; pressurizing the first cavity to a first pressure to move a flexible member into contact with one of the first and second substrate; depressurizing the first cavity to move the flexible member out of contact with the one of the first and second substrate; and pressurizing a second cavity to a second pressure higher than the first pressure to apply air pressure at the second pressure to the first and second substrate to form a laminated assembly.

Abstract: A circuit board structure includes an inner circuit structure and a first build-up circuit structure. The inner circuit structure includes a core layer having an upper surface and a lower surface, a first patterned circuit layer disposed on the upper surface, a second patterned circuit layer disposed on the lower surface and a conductive through hole connecting the first and the second patterned circuit layers. The first build-up circuit structure at least has a cavity and an inner dielectric layer. The inner dielectric layer has an opening connecting the cavity and exposing a portion of the first patterned circuit layer. A hole diameter of the opening is smaller than a hole diameter of cavity. A height difference is between an inner surface of the inner dielectric layer exposed by the cavity and a top surface of the first patterned circuit layer exposed by the opening.

Abstract: A display apparatus includes a display panel including lower and upper substrates confronting each other, and a film member combined with the upper substrate; and a panel support member to support the display panel to expose the front and lateral sides of the display panel to the outside.

Abstract: Systems and methods for compacting a charge of composite material. These systems and methods may utilize a vacuum compaction device to compact the charge of composite material on a supporting surface. The vacuum compaction device may be reusable and may be configured to define an enclosed volume when positioned on the supporting surface and may include a barrier structure and a sealing structure that is configured to form a fluid seal when compressed between the supporting surface and the barrier structure. The vacuum compaction device also may include a vacuum distribution manifold that is in fluid communication with and configured to selectively apply a vacuum to the enclosed volume. Application of the vacuum to the enclosed volume may decrease a pressure within the enclosed volume and transition the vacuum compaction device from an undeformed configuration to a deformed configuration, thereby compacting the charge of composite material on the supporting surface.

Abstract: A reinforced fiber base material is placed on a forming die having a concave part and fixed to the forming die by at least a pair of fixing members disposed on either side of the concave part so as to form a gap between the reinforced fiber base material and a bottom surface of the concave part of the forming die. Subsequently, the reinforced fiber base material fixed to the forming die is covered by a bag film, a forming space that is formed between the forming die and the bag film is decompressed, and a matrix resin is allowed to flow inside the decompressed forming space. The matrix resin is then hardened so as to obtain a composite material in which the reinforced fiber base material and the matrix resin are integrally formed.

Abstract: A method for obtaining a composite material part from a preform of layers of fibers pre-impregnated with resin stacked on top of one another on a tool, the preform being delimited by a lower surface, an upper surface, and a peripheral flank. The method includes attaching to the tool, after the last layer has been laid, a peripheral part comprising a wing adapted to cover the peripheral edge of the upper surface, so as to create, in the periphery of the preform, a peripheral cavity adjacent to the flank of the preform and, before the polymerization phase, to withdraw the gas present in the peripheral cavity so as to tension filaments of the preform by exerting a traction force at the ends of the filaments.

Abstract: A method for fabricating a repair laminate for a composite part having an exposed surface includes applying a bonding material to the exposed surface and forming an uncured ply stack assembly on the bonding material. The uncured ply stack assembly is formed by forming and compacting a series of uncured ply stacks. The ply stack assembly and bonding material are then cured.

Abstract: A method and apparatus are used to fit a metallic or composite doubler on an uneven surface. A three dimensional digital map of the gap between the doubler and the uneven surface is generated by digitally scanning the uneven surface. The digital map is then used to fabricate a stack of adhesive plies tailored to substantially fill the gap between the doubler and the uneven surface.

Abstract: A method for laminating essentially plate-shaped work pieces with a thermally activated adhesive layer, particularly photovoltaic modules. Work pieces are inserted into a vacuum chamber having a compression element dividing the vacuum chamber in a gas tight fashion that can be raised and lowered by pressure differences. The compression element presses against the work piece which in turn presses against a heating plate which forms a lower side of the vacuum chamber, with processing heat being transferred into the work piece to soften the adhesive. The work piece is first impinged by the compression element with a slight load from approx. 2% to 10% of the defined processing load, and is simultaneously kept below the adhesive activation temperature. Thereafter, the slight load is lifted off the work piece and the work piece is heated to the activation temperature and impinged via the compression element with the processing load.

Abstract: An apparatus for laminating a fabric material to a part broadly comprises a cutting element, a heating system, a vertical pressure unit, and a compaction roller assembly. The cutting element may cut scrap material from the sides of the fabric material. The heating system may heat the fabric material after the material exits the vacuum conveyor assembly. The vertical pressure unit may apply a downward force on the compaction roller assembly, which may receive the fabric material and press the fabric material against a surface of the part. The compaction roller assembly may include a roller operable to have a variable curvature along its longitudinal axis and an actuating device operable to apply a variable torque to opposing ends of the roller to vary the curvature of the roller.

Abstract: A vacuum insulated panel includes a fiberglass insulation blanket and a barrier layer. The barrier layer is sealed around the fiberglass insulation blanket. Gas inside the barrier layer is evacuated such that the fiberglass insulation blanket is compressed.

Abstract: An airfoil is fabricated by assembling cured skins with spars having cured spar webs and uncured spar chords. The skins are bonded to the spars by curing the spar chords.

Abstract: A method for adhesive application in vehicle construction during joining of joining partners which are subject to tolerances comprises the following steps: detecting the geometric data of the joining partners in an automated manner, detecting the joint gap dimensions of the joining partners from the detected geometric data, joining the joining partners in the joining position thereof, and applying the adhesive in the joint gap.

Abstract: A room temperature bonding apparatus includes angle adjustment means supporting a first sample stage holding a first substrate so as to be able to change a direction of the first sample stage; a first driving device driving the first stage in a first direction; a second driving device driving a second sample stage holding a second substrate in a second direction not parallel to the first direction; and a carriage support table supporting the second sample stage in the first direction when the second substrate and the first substrate are brought into contact. The apparatus can impose a load exceeding a withstand load of the second driving device on the first and second substrates. Further, the apparatus uses angle adjustment means to change direction of the first substrate to be parallel with the second substrate and uniformly impose the larger load on a bonding surface.

Abstract: The invention relates to a method and a device for a bubble-free bonding of large-surface glass panes in an automatic production process. An embodiment of the device comprises: a) a pivoting bench plate having a securing device for receiving a glass pane, b) a barrier material application head having a camera for monitoring, at least one ventilation element being mounted by a mounting head, c) an adhesive metering and application head having a process control sensor for the application of adhesive, d) a gripping device having a covering plate gripper for receiving a covering plate, and e) a vacuum suction device and a closing device for the ventilation system.

Abstract: A method of molding a wind turbine blade in a mold is provided. The method includes applying a film to an inside surface of a mold, assembling component layers for the wind turbine blade on the film, performing curing to harden the component layers, and subsequently removing the cured wind turbine blade from the mold. Also provided is a film suitable for use in a wind turbine blade molding process and a mold suitable for molding a wind turbine blade.

Abstract: A substrate attachment system, including a portable chamber for receiving a pair of substrates which are aligned; a conveyor transportation device which continuously moves the portable chamber and to which a vacuum generator that is connected to a vacuum port of the portable chamber to evacuate the inside of the portable chamber is provided; and a heating device for performing a heating process in which the aligned substrates are attached to each other in the portable chamber, wherein the conveyor transportation device is arranged to pass through the heating device. The substrate attachment system may contribute to high attachment accuracy, and also, since the size of a chamber is reduced, a spatial utilization rate may be high, and also, since an attachment process is continuously performed by using a conveyor transportation device, a process time may be reduced.

Abstract: The invention relates to a method for applying a label to an article travelling along an article path, said label being received on a movable surface at an input location to be retained against said surface whilst being glued and advanced to an output location, at which the label is transferred to the article; the article being rotated with a tangential speed about an axis whilst travelling at a speed along the path including providing at least three portions of surface with independent and controllable vacuum means for retaining the label, including curtailing the application of vacuum means at the first portion of the surface upon the first portion reaching the output location and interrupting the application of vacuum means at the third portion of the surface, with the trailing edge of the label being retained at the second portion of the surface.

Abstract: An embodiment of the present invention provides a method for manufacturing a composite preform from tape material, including feeding a tape section into a tape section guide that suspends the tape across a tooling surface, moving at least one of the tape section guide and the tooling surface relative to each other to position the tape section at a desired location and orientation relative to the tooling surface, moving the tape section toward a pre-existing tape section disposed on the tooling surface, and tacking the tape section to the pre-existing tape section. A corresponding apparatus for manufacturing composite preforms is also disclosed.

Abstract: An insulated container includes a first laminated structure having a metal layer and a second laminated structure having a metal layer. The metal layer of the first laminated structure faces the metal layer of the second laminated structure. The insulated container also includes a foam material layer disposed between the first laminated structure and the second laminated structure. The metal layer of the first laminated structure is bonded to the metal layer of the second laminated structure at a plurality of locations.

Abstract: An in-situ double vacuum debulk (DVD) composite repair system designed to produce partially or fully cured autoclave-quality hot-bond composite repairs on contoured structures. The system provides vacuum pressure for hot bond repairs to be performed on flat and contoured structures using one set-up capable of debulking (partially curing) and then fully curing composite repairs on composite and metallic aircraft structures. The use of in-situ DVD also eliminates handling of the patch/adhesive when transferring from an off-aircraft DVD chamber to the repair site on the aircraft. This can increase the probability of successful repairs because the possibility of contaminating and misaligning the adhesive and repair patch are eliminated.

Abstract: A method of manufacturing a component having first and second layers, the first and/or second layers including one or more depressions provided on a surface of the respective layer. The method including: arranging the first and second layers so that they face one another and with the depressions on inner facing surfaces of the layers; diffusion bonding the first and second layers together about their edges; applying a first differential pressure across each of the first and second layers to evacuate an inner space defined by the layers, thereby forming one or more depressions on an outer facing surface of the first or second layer; and applying a second differential pressure across each of the first and second layers to expand the inner space defined by the layers.

Abstract: A method for applying fibre material on a vertical surface is provided. The method has the following steps: spraying an adhesive on the vertical surface; applying the fibre material on the sprayed surface; spraying additional adhesive on the fibre material for another layer of fibre material; applying another layer of fibre material on the sprayed fibre material; and injecting the layers of fibre material with a resin.

Abstract: A label applicator that includes an applicator housing having a flow chamber and a suction side. The suction side has one or more openings that allow air to pass therethrough. The label applicator also includes first and second air flow generators that are fluidly coupled with the flow chamber. The first and second air flow generators are configured to generate first and second air flows, respectively, through the flow chamber. The label applicator also includes a valve mechanism that is positioned in the flow chamber to direct the first and second air flows through the flow chamber of the applicator housing. The valve mechanism includes a diverter valve and an electric actuator. The actuator is configured to move the diverter valve within the flow chamber to different positions during a label application operation.

Abstract: Disclosed is a method for placing fiber-reinforced, pre-impregnated, planar semi-finished products on a placement tool for the manufacture of a non-crimp fabric, wherein a placement film is clamped on the placement tool for purposes of holding the non-crimp fabric, and by means of evacuation and/or the application of pressure is fixed in position on the placement tool and/or can be released from the latter. Also disclosed is a placement tool for the execution of such a method.

Abstract: A method for joining, by adhesive bonding, at least two large joining partners in vehicle construction, in particular in aircraft construction, comprises the following steps: detecting the geometric data of the joining partners in an automated manner, detecting the joint gap dimensions of the joining partners from the geometric data, applying adhesive to one or both joint faces of the two joining partners to be joined as a function of the joint gap dimensions, joining the joining partners in the joining position, and sequentially applying joining pressure to the joint faces along the joint gap to bring the joining partners into the final joining position.

Abstract: A bow wave in a composite laminate generated during part consolidation is reduced by transmitting atmospheric pressure loads to a region of the part having low compaction pressure due to bridging of a vacuum bag at an edge of the part.

Abstract: A structural panel includes a closed-cell foam core formed of a metallic material; a first carbon-fiber panel bonded to a first side of the closed-cell foam core; and a second carbon-fiber panel bonded to a second side of the closed-cell foam core such that the foam core is disposed between the first carbon-fiber panel and the second carbon-fiber panel.

Abstract: A variety of methods for fabricating organic photovoltaic-based electricity-generating military aircraft windows are described. In particular, a method for fabricating curved electricity-generating military aircraft windows utilizing lamination of highly flexible organic photovoltaic films is described. High-throughput and low-cost fabrication options also allow for economical production.

Abstract: An electricity-generating coating for commercial aircraft window surfaces and methods for fabricating organic photovoltaic-based electricity-generating aircraft fuselage surfaces are provided. The coating includes a conformal organic photovoltaic device having one or more cells connected in series and/or parallel, adhered to an aircraft window surface, along with wires and power electronics such that the coating provides electricity for mission-critical systems and/or maintenance loads on-board the aircraft.

Abstract: A method of manufacturing “T” shaped stringers for an aircraft whereby the “T” shaped stringers have a stringer web and a stringer foot, the method comprising: a first step of hot-forming a carbon fiber laminate in order to achieve semi-stringers with an “L” shaped cross-section, a second step of placing together two hot-formed “L” shaped semi-stringers in order to form a “T” shaped stringer, a third step of co-bonding the resulting “T” shaped stringer on a cured skin with an adhesive line between them, and a fourth step of curing the obtained “T” shaped stringer inside a vacuum bag using invar alloy angles as curing tools. The invar alloy angles are cut at a radius area eliminating a part of the invar alloy angles covering the stringer foot in order to define an invar alloy piece having no foot.

Abstract: An area of a structure is reworked using resin infusion of a fiber preform. A resin flow hole is formed through the structure from a first side of the structure to a second side of the structure. The fiber preform is placed on the first side of the structure and substantially saturated with resin by flowing resin into the preform and out through the resin flow hole to the second side of the structure.

Abstract: The disclosure provides in one embodiment a method of applying a high temperature hybridized molecular functional group adhesion barrier coating to a surface of a structure. The method includes providing a structure having at least one surface to be bonded, preparing the at least one surface to expose active reactive surface sites, providing one or more liquid or solid phase chemical derivatization compounds, applying heat to the one or more liquid or solid phase chemical derivatization compounds to vaporize the one or more liquid or solid chemical derivatization compounds, depositing the one or more vaporized chemical derivatization compounds on the prepared surface to form a derivatized composite surface having hybridized molecular functional groups, and heat curing the derivatized composite surface to form a high temperature hybridized molecular functional group adhesion barrier coating.

Abstract: A composite layup is formed on a tool and placed on a contoured part. The tool is contoured to substantially match the contour of the part. A set of location data is generated which represents the location of the part in space relative to the tool. An automated manipulator uses the location data to move the tool into proximity to the part and place the contoured layup on the part.

Abstract: The present disclosure is directed to a substrate lamination system and method. A substrate lamination apparatus may comprise: (a) a vacuum chamber; (b) a flexible membrane; and (c) a substrate support. A system for laminating substrates may comprise: (a) a vacuum chamber; (b) a flexible membrane; (c) a substrate support; (d) a vacuum pump; (e) a compressor; and (f) a control unit, wherein the control unit is configured to carry out the steps: (i) evacuating the vacuum chamber; and (ii) applying pressure to at least one of a first substrate and a second substrate.

Abstract: It comprises applying a mould release agent on a compaction tool (1), carrying out its curing and applying a layer with adhesive properties (2) on the mould release agent. It is characterized in that it also comprises extending an aerator blanket (4) along the layer (2) with dimensions larger than the adhesive layer (2), extending a membrane with resilient properties (5) on the entire surface of the tool (1) by applying vacuum to the membrane (5) for compacting the adhesive layer. This method reduces the number of stages required to perform the compaction and avoids the generation of waste materials thus reducing the cost of the process.

Abstract: An attaching method for attaching a support plate to a surface of a substrate with an adhesive involves the steps of applying an adhesive to the surface of the substrate, heating and thereafter cooling the substrate, positioning centers of the substrate and the supporting plate to coincide with each other, and forming a layered structure by pushing the supporting plate onto the substrate with the adhesive therebetween in a pressure-reduced atmosphere. In the positioning step, after the supporting late has been placed on the substrate, it is possible to finely adjust the alignment of the supporting plate and a semiconductor wafer when attached because the adhesive is applied to the surface of the substrate, and thereafter the substrate is heated and cooled.