With Coating Or Impregnating A Face To Be Adhered Patents (Class 156/307.3)
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Patent number: 6761790Abstract: The present invention provides a method of manufacturing a wiring board, including the steps of forming a through hole on a prepreg having a releasing resin film on at least one of its surfaces, the prepreg being obtained by impregnating a porous film having a thickness of 5 to 90 &mgr;m and a porosity of 30 to 98% with a half cured thermosetting resin, filling the through hole with a conductive paste containing a conductive filler, peeling the resin film, laminating a metal foil on a surface from which the resin film is peeled, and heating and pressurizing the laminated product.Type: GrantFiled: April 30, 2002Date of Patent: July 13, 2004Assignee: Nitto Denko CorporationInventors: Toshiyuki Kawashima, Nobuharu Tahara, Kenichi Ikeda
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Publication number: 20040112531Abstract: The method of adhering members includes positioning of an adhesive material between an attachment surface of a first member (e.g., a door beam) and a second member (e.g., a bracket). Thereafter, the adhesive material is at least partially cured to adhere the material to the attachment surface to form an assembly and the assembly is assembled to an article of manufacture (e.g., an automotive vehicle).Type: ApplicationFiled: October 9, 2003Publication date: June 17, 2004Applicant: L&L Products, Inc.Inventors: Ronald Bogert, Christopher Hable
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Publication number: 20040112530Abstract: A product and process for bonding porous materials, such as piezoelectric materials, to substantially non-porous substrates is described. The non-porous substrate contains a plurality of apertures extending through the bonding surface. Adhesive is dispensed on the bonding substrate to at least partially fill the apertures. The porous material is then pressed against the bonding surface and the combination is cured. During curing, a portion of the adhesive is absorbed into the porous material from the apertures, however, sufficient adhesive remains in the apertures to bond the porous material to the substantially non-porous substrate.Type: ApplicationFiled: September 16, 2003Publication date: June 17, 2004Applicant: Palo Alto Research Center, Inc.Inventors: Steven A. Buhler, Karl A. Littau
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Patent number: 6706145Abstract: An aqueous adhesive dispersion comprising an adhesive polymer in dispersed form, an anionic or cationic polyelectrolyte, and optionally at least one polyalkylene glycol having a molar mass of 200 to 100,000 g/mol, and other additives; and a process for producing multilayered paper or a material using the aqueous adhesive dispersion.Type: GrantFiled: January 3, 2001Date of Patent: March 16, 2004Assignee: Ahlstrom GmbHInventors: Joachim Werres, Bernd Reinhardt, Klaus Rienaecker
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Publication number: 20040045931Abstract: This invention relates to the printing of a substrate having a pre-printed “print pattern” with a “design layer” of ink where there is differential adhesion within and without the print pattern. The print pattern is receptive to an ink, and the design layer ink forms a durable image material with good bond to the print pattern, but the ink does not form a durable image material on the portions of the substrate outside the print pattern. The design layer ink is a UV-curable ink, and the print pattern may have a higher surface energy than the portions of the substrate outside the print pattern.Type: ApplicationFiled: January 23, 2003Publication date: March 11, 2004Inventors: George Roland Hill, Chris David Parry
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Publication number: 20040016501Abstract: A method of producing embossed-in-register building products. Reference edges are milled on a board. A resin soaked paper having a decorative motif is located on that board using the reference edges as a guide such that the decorative motif has a predetermined position relative to the reference edges. The board and paper are then located in a press machine having a press plate with a three dimensional surface that is registered with the decorative motif. The press plate presses into the board and paper at a predetermined pressure and predetermined temperature to set the resin, producing a final product. Resin and paper parameters are carefully controlled. The press plate is manufactured such that the plate's surface registers with the decorative motif when the press plate is hot. Appropriate hollowing and milling of the board can even out pressure distributions and to provide a completely closed surface without porosity.Type: ApplicationFiled: June 30, 2003Publication date: January 29, 2004Inventor: Eugenio Cruz
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Patent number: 6676797Abstract: A single membrane insulation material including a nonwoven insulation mat, a fluoropolymer dispersion surface coated to one side of the mat and a fluoropolymer film component laminated to the thus coated side of the mat under conditions of elevated temperature and pressure. The coating has a depth of penetration which is less than the total thickness of said mat.Type: GrantFiled: April 4, 2001Date of Patent: January 13, 2004Assignee: Textiles Coated Inc.Inventor: Stephen W. Tippett
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Publication number: 20040003888Abstract: A process for the manufacture of a floor element, which floor element comprises an upper decorative surface, a lower surface, core forming a carrying structure and edges intended for joining. An upper surface web and a lower surface web is fed between the belts of a continuous belt press. A mixture comprising at least one di, tri or polyhydric alcohol and at least one isocyanate, having an isocyanate functionality at least two, in a ratio yielding a polyurethane with a density in the range of 600-1400 kg/m3 is applied between the upper surface web and the lower surface web while said webs are fed between the belts of the continuous belt press. The belts are arranged to allow a substantially uniform and specified material thickness to form, whereby a polyurethane core is formed between said surface webs and whereby said surface webs bond to said core.Type: ApplicationFiled: April 24, 2003Publication date: January 8, 2004Inventors: Laurence Mott, Roger Hwatz
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Patent number: 6673190Abstract: This invention concerns lasable bond-ply materials comprising a nonwoven reinforcing material and at least one resin material. The present invention also includes methods for using the bond-ply of this invention to manufacture high density multilayer printed wiring boards.Type: GrantFiled: April 4, 2001Date of Patent: January 6, 2004Assignee: Honeywell International Inc.Inventors: David Haas, Chengzeng Xu, Mavyn McAuliffe, Scott Zimmerman, Laura Miller, Meifang Qin, Baopei Xu, Richard Pommer
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Patent number: 6667108Abstract: A resin impregnated overlay is applied to a wood veneer, which in turn may be adhered to a substrate.Type: GrantFiled: February 7, 2002Date of Patent: December 23, 2003Inventor: Erick Ellstrom
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Patent number: 6667229Abstract: A method of connecting a conductive trace and an insulative base to a semiconductor chip includes providing a semiconductor chip, a conductive trace and an insulative base, wherein the chip includes a conductive pad, the conductive trace includes a bumped terminal, the bumped terminal includes a cavity that extends through the insulative base, and the insulative base contacts the conductive trace on a side opposite the chip, then forming a through-hole that extends through the insulative base and exposes the conductive trace and the pad, and then forming a connection joint that contacts and electrically connects the conductive trace and the pad. Preferably, an insulative adhesive that attaches the chip to the conductive trace or an encapsulant that encapsulates the chip fills the cavity and provides compressible mechanical support for the bumped terminal.Type: GrantFiled: October 6, 2001Date of Patent: December 23, 2003Assignee: Bridge Semiconductor CorporationInventors: Charles W. C. Lin, Cheng-Lien Chiang
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Patent number: 6653742Abstract: A semiconductor chip assembly includes a semiconductor chip, a conductive trace, a connection joint, an insulative adhesive and an encapsulant. The conductive trace includes a routing line and a pillar. The routing line extends within and outside a periphery of the chip, and the pillar is disposed outside the periphery of the chip and extends away from the chip. The connection joint contacts and electrically connects the routing line and the pad. The adhesive is sandwiched between the routing line and the chip and contacts a surface of the routing line that faces away from the chip, thereby interlocking the routing line to the assembly. The encapsulant extends into a channel in the pillar, thereby interlocking the pillar to the assembly.Type: GrantFiled: September 5, 2002Date of Patent: November 25, 2003Inventor: Charles W. C. Lin
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Patent number: 6641687Abstract: A pipe repair apparatus includes an outer carrier tube, an inner bladder tube within the carrier tube, and a repair sleeve within the bladder tube. The bladder tube and the carrier tube are formed by one unitary tube which is folded back upon itself. A wick extends from the repair sleeve to the rear end of the bladder tube and permits evacuation of gases from the bladder tube when the bladder tube is flattened by a vacuum during insertion of a curable resin into the bladder tube at its forward end. The bladder tube can be inverted out of the carrier tube so as to place the repair sleeve in contact with an area to be repaired within a sewer pipe. This method may also be used to repair the damaged joint between a lateral sewer line and a main sewer line.Type: GrantFiled: June 19, 2002Date of Patent: November 4, 2003Assignee: LMK EnterprisesInventors: Larry W. Kiest, Jr., Gary VanAmeyde
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Patent number: 6632873Abstract: One aspect of the present invention is an adhesive composition formed from two packs. One pack includes an isocyanate-functional prepolymer formed by reacting a polyisocyanate with an alcohol (e.g., polyol). The isocyanate equivalents from the polyisocyanate exceed the hydroxyl equivalents from the alcohol. The second pack is an aqueous polymer emulsion. These two packs are combined to form the novel adhesive composition. Another aspect of the invention is a method for joining together two surfaces of wood products by application of an adhesive thereto. The first step in this method is to mist with water the wood product surfaces to be joined. An adhesive composition then is applied to the misted wood product surfaces. Alternatively, the water misting can be replaced with an aqueous emulsion being part of the adhesive composition. Finally, the adhesive composition is cured.Type: GrantFiled: November 19, 2001Date of Patent: October 14, 2003Assignee: Ashland, Inc.Inventors: Gang-Fung Chen, Gary J. Walsworth
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Patent number: 6630048Abstract: The present invention describes a die to manufacture pieces of plastic materials, molded by injection, projection or blowing processes that does not need end finishing during its construction, and that does not need to employ additional demolding agents during its whole useful life to release the objects molded. Said die is specially useful to obtain pieces of plastic materials that must be painted or must be dealt superficially with the purpose of being employed in various industries, such as the automobile industry, electro-domestic accessories manufacturing, communications, computers, or decoration, etc. This die is also specially useful to obtain pieces that must be adhered in an efficient and substantially permanent way to others as are the soles for the industrial manufacturing of shoes and of sports shoes.Type: GrantFiled: June 19, 2001Date of Patent: October 7, 2003Inventors: Julio Eduardo Pertusio, Jorge Alberto Escudero
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Publication number: 20030183334Abstract: A process for the manufacture of a decorative boards, which boards includes a decorative layer, wherein a decor sheet is placed as a surface layer on a base layer and bonded thereto by pressing under elevated temperature and pressure. The decor sheet is cut to a predetermined format from a web, the cut being arranged on a fixed position related to possible repetition frequency of a decor pattern of the web. The decor sheet is then accurately placed on a base layer with a predetermined format. The decor sheet is spot welded to the base layer. A number of such base layers with attached decor sheets are then, one after the other, fed in between the belts of a continuous laminate press, optionally together with an uppermost wear layer. The base layers, the decor sheets and possibly the optional wear layer is then laminated together under heat and pressure in the laminate press.Type: ApplicationFiled: March 27, 2003Publication date: October 2, 2003Inventors: Ake Sjoberg, Fredrik Fackler, Hans Persson, Tomas Stjernberg, Patricio Villarroel, Roger Johansson, Anders Karlsson
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Patent number: 6627022Abstract: A continuous process for manufacturing decorative panels includes the steps of forming a first continuous fiber reinforced resin layer, laying a continuous decorated sheet on the first fiber reinforced resin layer, forming a second continuous fiber reinforced resin layer on the continuous decorated sheet, eliminating a substratum of the decorated sheet so that the first and second fiber reinforced resin layers can join one another to form a continuous consolidated strip of fiber reinforced resin with an image suspended therein, curing the continuous consolidated strip, and cutting a panel from the continuous consolidated strip. The first fiber reinforced resin layer is preferably at least partially cured in a first curing step before the second fiber reinforced resin layer is formed.Type: GrantFiled: December 19, 2000Date of Patent: September 30, 2003Inventor: Luciano Fusco
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Patent number: 6620488Abstract: A skin material which can be precisely and easily bonded to a cushion main body while preventing the working atmosphere from becoming worse due to solvent volatilization; a skinned cushion excellent in air permeability and cushioning properties in the seating area; and a process for producing the skinned cushion are described. The skin material comprises an air-permeable sheet and an adhesive layer formed on the back side of the sheet by applying a melt of a hot-melt adhesive in such a manner as to form scattering dots of the melt or to leave scattering uncoated dot areas and hardening the melt.Type: GrantFiled: February 21, 2001Date of Patent: September 16, 2003Assignee: Inoac CorporationInventors: Tsunenori Oguri, Hiroshi Fujii, Tsutomu Yano
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Patent number: 6616794Abstract: A method for producing integral capacitance components for inclusion within printed circuit boards. Hydrothermally prepared nanopowders permit the fabrication of a very thin dielectric layers that offer increased dielectric constants and are readily penetrated by microvias. Disclosed is a method of preparing a slurry or suspension of a hydrothermally prepared nanopowder and solvent. A suitable bonding material, such as a polymer is mixed with the nanopowder slurry, to generate a composite mixture which is formed into a dielectric layer. The dielectric layer may be placed upon a conductive layer prior to curing, or conductive layers may be applied upon a cured dielectric layer, either by lamination or by metallization processes, such as vapor deposition or sputtering.Type: GrantFiled: May 4, 1999Date of Patent: September 9, 2003Assignee: TPL, Inc.Inventors: William F. Hartman, Kirk M. Slenes, Kristen J. Law
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Publication number: 20030155071Abstract: The invention relates to aqueous adhesive dispersions containing A) 0.1-10 wt. % adhesive polymer in the form of a dispersion with respect to the overall weight of the dispersion, B) 0.1-100 parts by weight of constituent A), an anionic or cationic polyelectrolyte and C) 0-50 parts by weight in relation to the 100 parts by weight of constituents A) of at least one polyalkyleneglycol with a molar mass of 200-100,000 g/mol. The invention also relates to the use of said dispersions in the production of multi-layered paper or paper material.Type: ApplicationFiled: January 3, 2001Publication date: August 21, 2003Inventors: Joachim Werres, Bernd Reinhardt, Klaus Rienaecker
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Patent number: 6599954Abstract: An object of the present invention is to completely cure a resin composition highly capable of screening energy radiation, such as a carbon fiber-reinforced composite material (CFRP), simply by exposing the resin composition to UV radiation in the presence of a specific photopolymerization initiator system (reaction catalyst system) comprising at least two components. To this end, the present invention provides a resin curing method wherein, when a resin composition is exposed to energy radiation typified by UV radiation, another kind of first energy than the energy from an energy radiation source is autogenously generated within the resin, and the same kind of second energy is successively generated by the autogenously generated energy, so that the resin composition is cured by means of the first and second energies, or both the first and second energies and the energy from the energy radiation source, whether or not the resin composition contains a substance capable of screening energy radiation.Type: GrantFiled: June 17, 1999Date of Patent: July 29, 2003Assignee: Mitsubishi Heavy Industries, Ltd.Inventors: Noriya Hayashi, Shunichi Hayashi
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Patent number: 6589655Abstract: A veneer-based product is made of a plurality of veneer layers, a resin binding the layers, and a filler having a high thermal conductivity.Type: GrantFiled: July 13, 2001Date of Patent: July 8, 2003Assignee: Board of Control of Michigan Technological UniversityInventors: Laurent Malanda Matuana, Julia A. King
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Publication number: 20030125449Abstract: One aspect of the present invention is an adhesive composition formed from two packs. One pack includes an isocyanate-functional prepolymer formed by reacting a polyisocyanate with an alcohol (e.g., polyol). The isocyanate equivalents from the polyisocyanate exceed the hydroxyl equivalents from the alcohol. The second pack is an aqueous polymer emulsion. These two packs are combined to form the novel adhesive composition. Another aspect of the invention is a method for joining together two surfaces of wood products by application of an adhesive thereto. The first step in this method is to mist with water the wood product surfaces to be joined. An adhesive composition then is applied to the misted wood product surfaces. Alternatively, the water misting can be replaced with an aqueous emulsion being part of the adhesive composition. Finally, the adhesive composition is cured.Type: ApplicationFiled: November 19, 2001Publication date: July 3, 2003Inventors: Gang-Fung Chen, Gary J. Walworth
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Patent number: 6586089Abstract: Reinforcing sheets that exhibit improved adhesion to cold and/or oily substrates have an adhesive layer that contains an epoxy-terminated adduct of an epoxy resin and a rubber that contains a low amount of a nitrile monomer.Type: GrantFiled: June 5, 2001Date of Patent: July 1, 2003Assignee: Dow Global Technologies Inc.Inventor: Michael R. Golden
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Publication number: 20030116269Abstract: The subject invention pertains to an aqueous primer for use on metal surfaces to which a composite or a metal adherend is bonded. The primer composition includes an aqueous dispersion of: (a) at least one thermosetting resin curable at an elevated temperature; (b) at least one organosilane, each said organosilane containing at least one hydrolyzable group; and (c) a curing agent. The aqueous primer composition contains substantially no volatile organic solvent, is environmentally superior to solvent-based primers, is storage stable, exhibits excellent solvent resistance and performs without loss of physical properties.Type: ApplicationFiled: August 30, 2002Publication date: June 26, 2003Inventors: Daqlip Kohli, Elaine Dickerson
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Publication number: 20030105453Abstract: The present invention relates to fabrication methods and apparatus for irrigating medical catheters. Such catheters include at least one section of standard thermoplastic catheter tubing coupled to a section of porous tubing (e.g., ePTFE and the like). A source of fluid couples to the porous portion of tubing to dispense diverse fluids. The manufacturing technique overcomes the inability of such porous material to liquefy and/or bond to most available adhesives by creating a mechanical-based coupling. One aspect of the present invention involves pre-treatment of a portion of a porous material such as ePTFE; that is, a “pre-imbibing” process is employed wherein the ePTFE is saturated with a solution of solvent and dissolved thermoplastic resin. After the solution evaporates a resin-based interstitial residue provides suitable structure that fuses to adjacent thermoplastic material during application of heat, such as during thermal bonding.Type: ApplicationFiled: October 4, 2002Publication date: June 5, 2003Inventors: Mark T. Stewart, James R. Skarda, Patrick R. Vettling
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Publication number: 20030096133Abstract: The present invention relates in a first aspect to (with reference to FIG. 1) a method of bonding together first (10) and second (12) components with an adhesive (13) in which Xylan (11) is applied to a surface of at least one (10) of the components (10, 12) and then the adhesive (13) is applied over the Xylan coated surface and then the adhesive (13) is used to bond the first (10) and second (12) components together with the adhesive (13) adhering to the Xylan coated surface. In a second aspect the present invention relates to a bonded structure which has at least first (10) and second (12) components bounded together with an adhesive (13) and wherein Xylan (11) is used as a surface coating on at least one (10) of the bonded components to improve the strength of the bond.Type: ApplicationFiled: November 30, 2002Publication date: May 22, 2003Inventor: Richard Alan Rackham
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Patent number: 6562277Abstract: A method for attaching a workpiece, for example a semiconductor die, to a workpiece holder, for example a lead frame die support, comprises the steps of interposing an uncured adhesive between the semiconductor die and the die support and preheating the adhesive from an ambient temperature to a preheat temperature of between about 150° C. and about 160° C. over a period of about 1.5 seconds. Next, the preheat temperature is maintained for about 1.5 seconds, then the adhesive is further heated to a temperature of between about 190° C. and about 200° C. over a period of about 1.0 second. The inventive method quickly cures the adhesive to secure the die to the support with acceptably low levels of voiding. An apparatus which can be adapted to perform the inventive method is further described.Type: GrantFiled: August 29, 2000Date of Patent: May 13, 2003Assignee: Micron Technology, Inc.Inventors: Ed Schrock, Tongbi Jiang
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Publication number: 20030087715Abstract: There is provided a power transmission belt which comprises a compression layer and an adhesive rubber layer which are adhered to each other by vulcanizing together and which has aramid fiber cords embedded in the adhesive rubber layer, wherein the compression layer and the adhesive rubber layer are formed of vulcanizate of an ethylene-&agr;-olefin-diene rubber compound and wherein the aramid fiber cords having a first twisting coefficient and a final twisting coefficient both in the range from 650 to 950 are adhesion treated with a resorcin-formalin-latex adhesive composition wherein the latex comprises at least one of chlorosulfonated polyethylene and alkylated chlorosulfonated polyethylene in an amount of 50-100% by weight based on the solid components of the resorcin-formalin-latex and adhered to and embedded in the adhesive rubber layer. A process for the production of such power transmission belt is also provided.Type: ApplicationFiled: August 7, 2002Publication date: May 8, 2003Applicant: Bando Chemical Industries, Ltd.Inventor: Hiroshi Fujimoto
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Patent number: 6558503Abstract: The method comprises positioning two components adjacent each other so as to define a space between them, bridging edges of the space with webs and filling the space with flowable material such as adhesive. A fabric is preferably arranged in the space and is impregnated by the flowable material as it is drawn into the space.Type: GrantFiled: October 23, 2000Date of Patent: May 6, 2003Assignee: BAE Systems plcInventor: Michael J Healey
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Publication number: 20030070753Abstract: A stencil having a porous resin layer provided on one side of a thermoplastic resin film, and a porous fiber layer bonded by an adhesive to the surface of the porous resin layer, wherein the bonding between the thermoplastic resin film and the porous fiber layer is performed by using the amount of the adhesive in a determined amount ranges from 0.05 g/m2 to 15.0 g/m2 by dry basis, so that an interruption of the passing-through the layers by printing ink is eliminated, and a desired degree of the bonding strength to inhibit an undesirable expansion or breaking-down of the printing stencil is ensured.Type: ApplicationFiled: February 13, 2002Publication date: April 17, 2003Applicant: Ricoh Company, Ltd.Inventor: Hideyuki Yamaguchi
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Publication number: 20030047277Abstract: The invention provides a labelling process comprising providing a container and a polymeric film label, applying water-based adhesive to one side of the label and applying the side of the label to which adhesive has been applied to the container, characterised in that the adhesive is applied to the label in a discontinuous pattern. The pattern is preferably formed from non-contiguous indicia, in particular dots.Type: ApplicationFiled: September 16, 2002Publication date: March 13, 2003Inventors: Norman Bell, Etienne Lernoux
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Publication number: 20030024637Abstract: Abrasion resistant laminates which are aesthetically pleasing, water-resistant/water-repellant, and flexible are formed by laminating a wear-resistant durable multi-layer top assembly to a base layer formed from an inexpensive, water resistant, polymeric substrate. The durable multi-layer wear-resistant top layer assembly comprises a wear resistant upper layer, a decorative layer, and a core layer. The polymeric base layer comprises a water resistant substrate which is positioned beneath the top layer assembly and is laminated thereto with a water resistant adhesive. This abrasion resistant laminate could be applicable in a variety of situations wherever a decorative and/or abrasion resistant product could be used and would be particularly useful in the floor covering industry.Type: ApplicationFiled: September 25, 2002Publication date: February 6, 2003Inventor: Ill Hong Min
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Patent number: 6514370Abstract: An apparatus for producing a hybrid boron reinforced polymer matrix composite from precursor tape and a linear array of boron fibers. The boron fibers are applied onto the precursor tapes and the precursor tape processed within a processing component having an impregnation bar assembly. After passing through variable-dimension forming nip-rollers, the precursor tape with the boron fibers becomes a hybrid boron reinforced polymer matrix composite. A driving mechanism is used to pulled the precursor tape through the method and a take-up spool is used to collect the formed hybrid boron reinforced polymer matrix composite.Type: GrantFiled: June 8, 2000Date of Patent: February 4, 2003Assignee: The United States of America as represented by the Administrator of the National Aeronautics and Space AdministrationInventors: Harry L Belvin, Roberto J. Cano
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Patent number: 6508910Abstract: Resin compositions are provided which are used in combination with fibers to form self-adhesive prepreg sheets that are applied to core materials to form sandwich panels. The prepreg resin includes a thermoset resin, a curing agent and a viscosity control agent. The prepreg resin further includes certain thermoplastic particles which are used to control the flow characteristics of the prepreg resin and the formation of fillets during bonding of the prepreg to the core material.Type: GrantFiled: February 27, 2001Date of Patent: January 21, 2003Assignee: Hexcel CorporationInventors: Ligui Zhou, Philippe D. Christou
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Publication number: 20030000641Abstract: A method for using a three-dimensional, woven preform to assemble two components. The woven preform is infused with an adhesive, and at least one surface of the preform is bonded to at least one surface of one of the components using the adhesive within the preform. The other of the components is attached to the preform, and this may occur with fasteners after the adhesive is cured or by bonding the second component to the preform with the adhesive. Use of an adhesive, instead of a resin, creates a stronger joint, especially with fiber-reinforcement of the adhesive. The thickness of the compressible, three-dimensional weave provides for a larger dimensional tolerance at each bond line.Type: ApplicationFiled: July 2, 2001Publication date: January 2, 2003Inventor: Ronald P. Schmidt
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Patent number: 6495265Abstract: The invention relates to a laminate including a decorative layer, a first resin impregnated core layer, a radiation barrier layer and a second resin impregnated core layer. The laminate prevents the penetration of radiation therethrough and maybe used in the construction of ceiling and wall panels, flooring, furniture, fixtures, cabinet and door cladding, protective screens and other objects which will effectively prevent the passage of radiation from an isolated enclosure.Type: GrantFiled: August 28, 2000Date of Patent: December 17, 2002Assignee: Premark RWP Holdings, Inc.Inventors: Robert R. Krebs, Ernest L. Phelps, Genevieve L. Tepera
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Publication number: 20020174946Abstract: Ae without causing movement or peeling of the relief film and yet may facilitate the re-sticking thereto.Type: ApplicationFiled: March 8, 2002Publication date: November 28, 2002Applicant: KYOEISHA CHEMICAL CO., LTD.Inventors: Junichi Ikeda, Richard Danon
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Patent number: 6485823Abstract: A laminated panel having an abrasion resistant surface is provided. The laminated panel includes a web being impregnated with a thermo-set resin, a bottom coat and an abrasion resistant top coat; a substrate; and thermo-fusing a bottom sheet to a second surface of the substrate opposite the first surface. The web is thermo-fused to one surface of the substrate, and the bottom sheet is simultaneously thermo-fused to the opposite surface of the substrate. A process for making an abrasion resistant laminated panel is also provided. The process includes the steps of partially impregnating a paper sheet or web with a thermosetting resin, drying it, coating the top side of the partially impregnated paper sheet or web with an abrasion resistant coat, simultaneously coating the bottom side of the paper sheet or web with a thermosetting resin composition, thermo-fusing the coated paper sheet or web to a first surface of a substrate and a bottom sheet to produce the laminated panel.Type: GrantFiled: October 15, 2001Date of Patent: November 26, 2002Assignee: Panolam Industries International Inc.Inventor: Fouad Torkum Karam
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Publication number: 20020172787Abstract: Thermosetting resin pipes and pipe fittings are provided which are prepared by polymerizing a cyclic olefin monomer in the presence of a ruthenium or osmium metathesis polymerization catalyst. These articles may be prepared by various methods, such as centrifugal casting. Reinforced articles may also be prepared by filament winding.Type: ApplicationFiled: May 20, 2002Publication date: November 21, 2002Applicant: Cymetech, LLC and A.O. Smith CorporationInventors: Mark M. Warner, Steven D. Drake, Larry L. Cagle, Charles S. Woodson
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Publication number: 20020170668Abstract: A method of fabricating a microstructure is provided. The method includes the step of providing a layer of a polyermizable material. A solid is brought into contact with the layer of polymerizable material so as to alter the shape of the upper surface of the layer. Thereafter, the layer of polymerizable material is polymerized such that the layer solidifies and the upper surface thereof assumes a desired three-dimensional configuration.Type: ApplicationFiled: April 17, 2002Publication date: November 21, 2002Applicant: WISCONSIN ALUMNI RESEARCH FOUNDATIONInventors: David J. Beebe, Joseph M. Bauer
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Patent number: 6475328Abstract: To present printed wiring boards and other electronic components having excellent cockroach repelling performance even after solder reflow or solder flow. A conductive layer having a mounting land is provided on a insulating layer as a substrate, a solder resist is applied to cover the conductive layer excluding the mounting land, and an electronic component material containing a cockroach repellent is applied on the solder resist. This electronic component material is a paste containing a resin curable by crosslinking, a cockroach repellent, and a filler such as silica or talc, and by crosslinking and curing the resin by chemical reaction, a dried cockroach repelling layer is exposed and formed on the surface of the printed wiring board.Type: GrantFiled: December 7, 1999Date of Patent: November 5, 2002Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Hirohiko Haniu, Toshikazu Tomioka, Katsumi Tomita, Susumu Kobayashi
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Patent number: 6471800Abstract: A method and apparatus for fabricating a three-dimensional object from porous solid preform layers and at least a pore-filling material.Type: GrantFiled: November 29, 2000Date of Patent: October 29, 2002Assignee: Nanotek Instruments, Inc.Inventors: Bor Z. Jang, Erjian Ma
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Patent number: 6472083Abstract: The invention relates to the bonding of a phenolic resin impregnated core and a metal sheet into a high pressure laminate. A binding layer of a styrene-maleic anhydride copolymer is positioned between the core and the metal sheet to ensure bonding of the layers when a lay-up containing the desired layers is heated and pressed.Type: GrantFiled: August 16, 2000Date of Patent: October 29, 2002Assignee: Premark RWP Holdings, Inc.Inventors: Robert R. Krebs, Ernest L. Phelps, Genevieve L. Tepera
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Patent number: 6472067Abstract: Non-flammable, fibrous-siloxane cured composites derived from the polymerization of dialkoxysilanes, trialkoxysilanes and tetraalkoxysilanes, in an aqueous medium, to obtain viscous polysiloxane resins. These siloxane resins are used to impregnate or coat various fibrous materials such as carbon fibers or glass cloth which are subsequently subjected to heat and pressure to form cured, non-flammable siloxane-impregnated composites e.g. panels having a density of about 1 to 3 g/cc. and a limited oxygen index above 30. These non-flammable, fibrous-siloxane composites are particularly useful in the manufacture of fire-proof materials for various transportation vehicles and for building materials e.g. panels as a fire barrier.Type: GrantFiled: September 27, 2001Date of Patent: October 29, 2002Assignee: HC Chem Research and Service Corp.Inventors: Ming-Ta S. Hsu, Timothy S. Chen
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Patent number: 6468654Abstract: A treating agent comprises a nitrile group-containing highly saturated polymer rubber latex (A) having an iodine value of 120 or less, a rubber latex (B) other than the highly saturated polymer rubber latex, and a water-soluble resorcinol/formaldehyde condensate in amounts of 15 to 80%, 5 to 70% and 2 to 15%, all by weight in terms of solids, respectively. A rubber-reinforcing fiber product is coated with the treating agent. A rubber article such as a toothed belt, a tire and the like is made using this rubber-reinforcing fiber product. The glass fiber product coated with the treating agent may be further coated with a halogen-containing polymer-based adhesive as a secondary treating agent. Thus, the treating agent exhibits a large bonding force between the reinforcing fiber product and a matrix. Even if the rubber article is repeatedly subjected to a flexing stress, the strength thereof cannot be reduced. A peel-off cannot occurs between the reinforcing fiber product and the rubber matrix.Type: GrantFiled: August 13, 1998Date of Patent: October 22, 2002Assignee: Nippon Glass Fiber Co., Ltd.Inventors: Akira Okamura, Masato Sekiguchi
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Patent number: 6468666Abstract: A magnetically active laminate is disclosed. The magnetically active laminate is composed of a resin impregnated layer bonded to a distinct, magnetically active sheet. The laminate is especially well suited for use in the construction of erasable markerboards and cubicle panels, although many applications are possible within the scope of the present invention.Type: GrantFiled: November 22, 1999Date of Patent: October 22, 2002Assignee: Premark RWP Holdings, Inc.Inventors: Robert R. Krebs, Ernest L. Phelps
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Publication number: 20020144773Abstract: Techniques to bond two or more smaller bodies or subunits to produce a unitary SiC composite structure extend the capabilities of reaction-bonded silicon carbide, for example, by making possible the fabrication of complex shapes. In a first aspect of the present invention, two or more preforms are bonded together with a binder material that imparts at least strength sufficient for handling during subsequent thermal processing. In a second aspect of the present invention, instead of providing the subunits to be bonded in the form of preforms, the subunits may be dense, SiC composite bodies, e.g., RBSC bodies. In each of the above embodiments, a preferable means for bonding two or more subunits combines aspects of adhesive and mechanical locking characteristics. One way to accomplish this objective is to incorporate a mechanical locking feature to the joining means, e.g., a “keyway” feature.Type: ApplicationFiled: January 23, 2002Publication date: October 10, 2002Inventors: Michael A. Richmond, Michael K. Aghajanian, Allyn L. McCormick, W. Michael Waggoner, Brian E. Schultz
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Patent number: 6451430Abstract: A composite polyurethane foam structure and method of preparing the composite structure, which structure includes a semirigid-rigid polyurethane foam layer having bonded, free, unreacted, ethylenically unsaturated groups like allyl or acrylic groups. The structure includes a cured, unsaturated resin composition layer which is chemically bonded to one or both surfaces of the polyurethane foam layer through the polymerization of the allyl or acrylic group in the foam surface with the polyester resin composition.Type: GrantFiled: January 8, 1999Date of Patent: September 17, 2002Assignee: Hehr International Inc.Inventor: Stuart B. Smith
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Patent number: 6440257Abstract: Resin compositions are provided which are used in combination with fibers to form self-adhesive prepreg sheets that are applied to core materials to form sandwich panels. The prepreg resin includes a thermoset resin, a curing agent and a viscosity control agent. The prepreg resin further includes certain thermoplastic particles which are used to control the flow characteristics of the prepreg resin and the formation of fillets during bonding of the prepreg to the core material.Type: GrantFiled: May 18, 2000Date of Patent: August 27, 2002Assignee: Hexcel CorporationInventors: Ligui Zhou, Philippe D. Christou