Abstract: Plasma processing systems and methods are disclosed. The plasma processing system includes a high-frequency generator configured to deliver power to a plasma chamber and a low-frequency generator configured to deliver power to the plasma chamber. A filter is coupled between the plasma chamber and the high-frequency generator, and the filter suppresses mixing products of high frequencies produced by the high-frequency generator and low frequencies produced by the low-frequency generator.

Abstract: Disclosed are a method of plasma etching and a method of fabricating a semiconductor device including the same. The method of plasma etching includes loading a substrate including an etch target onto a first electrode in a chamber, the chamber including the first electrode and a second electrode arranged to face each other, and etching the target. The etching the target includes applying a plurality of RF powers to one of the first and second electrodes. The plurality of RF powers may include a first RF power having a first frequency in a range from about 40 MHz to about 300 MHz, a second RF power having a second frequency in a range from about 100 kHz to about 10 MHz, and a third RF power having a third frequency in a range from about 10 kHz to about 5 MHz.

Abstract: A film in a dry state is efficiently dissolved and removed. A film removing method includes steps of moving a nozzle head (10B) close to a soluble film (201) formed on a substrate (200), forming a liquid pool (302) of chemical liquid (300) between the nozzle head (10B) and the film (201) by continuously and simultaneously discharging and sucking the chemical liquid (300) from the nozzle head (10B), and horizontally moving the substrate (100) in a state in which the nozzle head (10B) and the surface of the film (201) are not contacted so as to relatively move the liquid pool (302) of the chemical liquid on the substrate (100).

Abstract: An etchant is stored in a treating tank; a glass substrate is transported with transport rollers into the treating tank; the etchant is discharged from below the substrate to raise the substrate to a position above the transport rollers and below the surface of the etchant; the discharge of the etching liquid is stopped and the glass substrate is lowered to a position for contacting the transport rollers; the etchant is drained from the treating tank; and the glass substrate is unloaded with the transport rollers out of the treating tank. The disclosed method and apparatus can treat both front and back surfaces of the substrate uniformly.

Abstract: The invention relates to a method of cleaning the surface of a material that is coated with an organic substance. The inventive method is characterized in that it comprises the following steps, consisting in: introducing the material into a treatment chamber, having a pressure of between 10 mbar and 1 bar therein, which is supplied with a gas stream containing at least 90 volume percent of oxygen; and generating a plasma by passing an electric discharge between the surface of the material and a dielectric-covered electrode in order to break down the organic substance under the action of the free radicals O thus produces. The invention also relates to an installation that is used to carry out said method.

Abstract: A method for patterning an article, the article comprising a first layer of a first material, a first major surface of the first layer being in intimate contact with some or all of a first major surface of a second layer of a second different material the method comprising providing a first thread carrying a first species to remove at least a portion of the first layer, and providing a second thread aligned with and adjacent the first thread and contacting the first and second threads with the first layer to remove at least part of the first layer.

Abstract: The present invention provides an electronic component manufacturing method including a step of embedding a metal film. An embodiment of the present invention includes a first step of depositing a barrier layer containing titanium nitride on an object to be processed on which a concave part is formed and a second step of filling a low-melting-point metal directly on the barrier layer under a temperature condition allowing the low-melting-point metal to flow, by a PCM sputtering method while forming a magnetic field by a magnet unit including plural magnets which are arranged at grid points of a polygonal grid so as to have different polarities between the neighboring magnets.

Abstract: A method for patterning an article, the article comprising a first layer of a first material, a first major surface of the first layer being in intimate contact with some or all of a first major surface of a second layer of a second different material the method comprising providing a first thread carrying a first species to remove at least a portion of the first layer, and providing a second thread aligned with and adjacent the first thread and contacting the first and second threads with the first layer to remove at least part of the first layer.

Abstract: A method for patterning an article, the article comprising a first layer of a first material, the method comprising providing a thread carrying a first species, e.g. a solvent in which the first material is soluble, and contacting the thread with the first layer to remove at least part of the first layer.

Abstract: A machine for processing of a web through a process tank containing process liquid and a tank containing wash water has in each tank an upper submerged guide and a pair of lower submerged guides, whereby the web passes on a sinusoidal path through the tank. Four drying guides are provided one above the over above the down-stream end of the processing tank. The guides have outlet slits 18 facing alternately up-stream and down-stream. A blower is provided for blowing air into the guides and out through the slits onto the web passing sinuously around the ducts. It acts both as a bearing medium holding the web off the surfaces of the ducts and as a drying medium.

Abstract: A vacuum processing apparatus includes a transfer unit disposed at a center thereof, plural processing chambers, each processing chamber having a processing table for supporting an object to be processed and carrying out processing using a gas, and a mass flow controller unit interposed between two of the processing chambers for supplying gas to the chambers.

Abstract: The present invention relates to an apparatus for spraying an etchant and a method for manufacturing a printed circuit board. In one exemplary embodiment the apparatus includes a manifold, a plurality of feed pipes in fluid communication with the manifold, each of the feed pipes having a plurality of spray nozzles mounted thereon, the feed pipes cooperatively constitute a spray region, and a pressure-boosting device configured for increasing a spray pressure of the spray nozzles which are located at a central area of the spray region. The apparatus can overcome “the puddle effect” on an upper surface of the printed circuit board.

Abstract: A method and an apparatus for processing display laminate, wherein the display laminate comprises a front electrode layer (106), a display material layer (104) and a protective film layer (102). The display laminate is continuous. A section of protective film layer (102) is continuously removed from the edge of the display laminate by a cutting unit (304) while the display laminate is running through the cutting unit (304). After removing the section of the protective film layer (102), a section of the display material layer (104) located at the same edge as the removed section of the protecting film layer (102) is continuously removed by spraying medium in a spraying unit (310) while the display laminate is running through the spraying unit (310).

Abstract: The present disclosure relates to roll-to-roll doping method of graphene film, and doped graphene film.

Abstract: In one aspect, a roll-to-roll substrate transfer apparatus is provided that includes: a feed roll and a take-up roll between which a printed circuit board substrate extends; and a plurality of drive roller rows transmitting motive power to the substrate for moving the substrate in a transferring direction, each drive roller row of the plurality includes a roller axis arranged in a direction perpendicular to the transferring direction of the substrate, and a plurality of spaced-apart drive rollers on the roller axis, wherein drive rollers of one drive roller row are arranged in spaces between drive rollers of adjacent drive roller rows. In other aspects, a wet etching apparatus and an apparatus for manufacturing a printed circuit board that include the roll-to-roll substrate transfer apparatus are provided.

Abstract: A method and an apparatus are proposed for simultaneously coating the inner walls of a plurality of hollow containers, such as bottles, with fluid-impermeable barrier layers applied by a PECVD method with the use of transversal antennas capable of creating plasma having density increased in the vicinity of the inner walls of the containers. The barrier-layer application period is divided into a coating period and a noncoating cooling period, with RF energy constantly maintained under working conditions with shunting thereof from the coating station to the dummy loads during noncoating periods used for cooling the plastic containers. The apparatus comprises a vacuum chamber with a conveyor that transports the containers in a preoriented state for interaction with a plurality of aligning elements that can be inserted into the container openings for subsequent fixation at equal distances in positions aligned with the antennas that can be inserted into the containers for generation of the coating-applying plasma.

Abstract: Methods and apparatus are disclosed for etching flexible glass sheets (13) in which the sheets (13) are transported in a vertical or near vertical orientation past non-contact, liquid-ejecting bearings (3) which apply an etching solution (e.g., an aqueous NaF/H3PO4 solution) to one or both sides of the sheets (13). In certain embodiments, the uppermost liquid-ejecting bearing (3) is above the top edge of the sheet (13) and thus is able to apply etching solution to the top of the sheet. In other embodiments, a top shower (11), which includes a set of spray nozzles (21) located above and distributed along the length of the apparatus, is used to apply etching solution to the top of the sheet (13). Using the disclosed methods and apparatus, glass sheets (13) produced by a fusion process are provided which have areas greater than five square meters and average surface roughness values in the range of 0.5 nanometers to 1.1 nanometers.

Abstract: Fluctuations in a plasma characteristic such as load impedance are compensated by a controller that modulates a stabilization RF generator coupled to the plasma having a frequency suitable for stabilizing the plasma characteristic, the controller being responsive to the fluctuations in the plasma characteristic.

Abstract: A method is provided in plasma processing of a workpiece for stabilizing the plasma against engineered transients in applied RF power, by modulating an unmatched low power RF generator in synchronism with the transient.

Abstract: The present invention relates to treatment units for the wet-chemical or electrolytic treatment of flat workpieces (1), such as metal foils, printed circuit foils or printed circuit boards, in which the workpieces (1) are transported on a conveying path by means of conveying members (6, 6?, 6?, 7). The treatment unit comprises carrier elements (4) with recesses (21), said carrier elements (4) being oriented to be parallel to the conveying path, and at least one module system for carrying the conveying members (6, 6?, 6?, 7) that consist of insertion elements (14, 26), preferably arranged in pairs, the at least one module system being configured such that it registers with and is preferably slidable into the recesses (21) of the carrier elements (4). The treatment unit is preferably utilized in horizontal conveyorized lines.

Abstract: Apparatus and methods adapted to polish an edge of a substrate include a polishing film, a frame adapted to tension and load the polishing film so that at least a portion of the film is supported in a plane, and a substrate rotation driver adapted to rotate a substrate against the plane of the polishing film such that the polishing film is adapted to apply force to the substrate, contour to an edge of the substrate, the edge including at least an outer edge and a first bevel, and polish the outer edge and the first bevel as the substrate is rotated. Numerous other aspects are provided.

Abstract: A vacuum processing apparatus includes a transfer unit disposed at a center thereof, plural processing chambers, each processing chamber having a processing table for supporting an object to be processed and carrying out processing using a gas, and a mass flow controller unit interposed between two of the processing chambers for supplying gas to the chambers.

Abstract: A workpiece is processed in a plasma reactor chamber using stabilization RF power delivered into the chamber, by determining changes in load impedance from RF parameters sensed at an RF source or bias power generator and resolving the changes in load impedance into first and second components thereof, and changing the power level of the stabilization RF power as a function one of the components of changes in load impedance.

Abstract: In a method and apparatus for transferring carbonaceous material layer, a carbonaceous material layer is grown on a growth substrate, and a first continuous conveying unit is used to feed the growth substrate and a transfer material, so that a gluing layer of the transfer material is attached to the carbonaceous material layer on the growth substrate. Then, a transformation device changes a viscosity of the gluing layer for the latter to adhere to the carbonaceous material layer. A second continuous conveying unit is further used to transfer and then separate the mutually adhered transfer material and growth substrate from each other, so that some part of the carbonaceous material layer is transferred onto the gluing layer while other part of the carbonaceous material layer remains on the growth substrate. Thus, at least a one-layer-thickness of the carbonaceous material layer is transferred.

Abstract: The invention relates to a sealing lock, for an in vacuo chamber for deposition on a, preferably metallic, endless strip, characterized in that: the metal rollers are mounted on brackets, fixed to the covers and are immovable like the latter, the rollers of the same pair have the axes thereof arranged in the same vertical plane and are of different diameter, the position of the roller with the smaller diameter being alternated up and down on passing from a given pair to the next pair, the support cradles for the two rollers of the same pair have a lateral projection towards the center, the spacing of which with regard to the base for said rollers defines a second gap.

Abstract: Reduction in a space of a manufacturing line, improvement of efficiency, improvement of utilization efficiency of materials, additionally, reduction in the manufacturing cost is realized by applying a means for describing a wiring pattern or a resist pattern directly on a substrate, a means for locally performing a vapor phase process such as film formation or etching under atmospheric pressure or adjacent to atmospheric pressure.

Abstract: The object of this invention is to provide a winding type plasma CVD apparatus in which quality of a layer can be made uniform by supplying a reaction gas uniformly to a deposition area of a film, and can perform a self-cleaning process of a deposition portion in the path of deposition onto the film. A film (22) is supported between a pair of movable rollers (33, 34) arranged on the upstream side and downstream side of the deposition portion (25) with regard to the traveling direction of the film, and then the film (22) is made to travel substantially linearly at the deposition position. Consequently, the distance between a shower plate (37) and the film (22) is kept constant, and the quality of the layer is made homogeneous. The film is heated by means of a metal belt (40) traveling simultaneously on the back side of the film. The moveable rollers (33, 34) ascend from the deposition position to the self-cleaning position, and the film (22) can be separated from the shower plate (37).

Abstract: An aperture mask assembly includes a rotatable frame and a mask having apertures. A clamping arrangement is used to tension the mask and to conform the mask to a shape defined by the frame. Tension is applied to the mask in a direction substantially parallel to an axis of the frame and/or around the circumference of the shape defined by the frame. Deposition material emanating from a deposition source located within the rotatable frame is deposited through the mask apertures onto a web.

Abstract: Methods and apparatus for spectrum-based endpointing. An endpointing method includes selecting a reference spectrum. The reference spectrum is a spectrum of white light reflected from a film of interest on a first substrate and has a thickness greater than a target thickness. The reference spectrum is empirically selected for particular spectrum-based endpoint determination logic so that the target thickness is achieved when endpoint is called by applying the particular spectrum-based endpoint logic. The method includes obtaining a current spectrum. The current spectrum is a spectrum of white light reflected from a film of interest on a second substrate when the film of interest is being subjected to a polishing step and has a current thickness that is greater than the target thickness. The method includes determining, for the second substrate, when an endpoint of the polishing step has been achieved. The determining is based on the reference and current spectra.

Abstract: In one aspect, a roll-to-roll substrate transfer apparatus is provided that includes: a feed roll and a take-up roll between which a printed circuit board substrate extends; and a plurality of drive roller rows transmitting motive power to the substrate for moving the substrate in a transferring direction, each drive roller row of the plurality includes a roller axis arranged in a direction perpendicular to the transferring direction of the substrate, and a plurality of spaced-apart drive rollers on the roller axis, wherein drive rollers of one drive roller row are arranged in spaces between drive rollers of adjacent drive roller rows. In other aspects, a wet etching apparatus and an apparatus for manufacturing a printed circuit board that include the roll-to-roll substrate transfer apparatus are provided.

Abstract: Polishing pads, planarizing machines and methods for mechanical and/or chemical-mechanical planarization of microelectronic-device substrate assemblies. The polishing pads, for example, can be web-format pads, and the planarizing machines can be web-format machines. In a typical application, the web-format machines have a pad advancing mechanism and stationary table with a first dimension extending along a pad travel path, a second dimension transverse to the first dimension, and an illumination site from which a laser beam can emanate from the table. The pad advancing mechanism moves the pad along the pad travel path to replace worn portions of the pad with fresh portions. In one embodiment of the invention, a web-format polishing pad includes a planarizing medium and an optical pass-through system having a plurality of view sites through which a light beam can pass through the pad.

Abstract: An etching apparatus and an etching method, wherein pressure exerted on a substrate is minimized, and an entire surface of the substrate is uniformly pressed during an etching process. The breakage of the substrate is prevented, and the substrate is uniformly etched. Accordingly, the thickness of the substrate may be reduced.

Abstract: An agitated wet process machine comprises a delivery system and many jets. The delivery system comprises a delivery belt and many rollers, wherein the rollers on the upper side or the lower side of the delivery belt are used to deliver workpieces. Many blades are added on each of the rollers to agitate a chemical solution. The jets above and below the delivery belt are used to spray or supply the chemical solution to the workpieces.

Abstract: A microcavity-forming system for making microcavities in a wire (especially a tungsten filament wire). The system has a coating station receiving the wire and applying a polymer coating to the wire. A mask-forming station receives the polymer-coated wire and blows moist air over it to form air bubbles which result in holes in the polymer coating, thereby creating a mask. An etching station receives the wire, as coated with the polymer mask, from the mask-forming station and etches the wire through the holes in the polymer mask to form microcavities in the wire. A stripping station receives the wire from the etching station and removes the polymer mask from the wire, leaving the wire with microcavities. Processes of forming microcavities in a wire and, more generally, of making an etching mask having arrays of holes and conforming to substantially any surface, including an arbitrary curved surface, are provided.

Abstract: A pulsed electric field system for inactivation of biological agents on a dielectric sheet material. The pulsed electric field (PEF) system includes a dielectric layer located between an active electrode and a ground electrode, wherein said dielectric layer has a uniform surface profile. A pulsed electric field is provided in a gap between the dielectric layer and the active electrode. A transport assembly moves the dielectric sheet material through the gap. In a preferred embodiment, the system also includes sensors for sensing the position of the dielectric sheet material as it passes through the pulsed electric field.

Abstract: A novel modular muffle etch injector assembly for use in a gas blanketed down-flow chemical vapor deposition apparatus of the type having a muffle and a modular gas injector assembly for introducing chemical vapors into a deposition chamber, the muffle being adapted for receiving and supporting the gas injector assembly, wherein deposition material residue collects on a lower surface of the muffle. The etch injector assembly of the present invention comprises an etch chamber having vertical sidewalls, a closed top end and an open bottom end, a supply mechanism for introducing a liquid etchant into the etch chamber, and a sealing device disposed along the open end of the etch chamber for providing a seal between the etch chamber and the lower surface of the muffle to confine the etchant to the etch chamber. The etch injector assembly preferably also includes an exhaust means for removing chemical vapors from the etch chamber.

Abstract: An invention is provided for a chemical mechanical planarization apparatus for processing 300 millimeter wafers. The CMP apparatus includes a polishing belt having a belt tension in a range of about 3000 lbs to 4000 lbs. In addition, a platen is disposed below the polishing belt at a positive platen height. The platen includes at least three air pressure zones, with each air pressure zone being capable of providing air pressure to a backside of the polishing belt. The platen can include, for example, eight air pressure zones. In this aspect, a second air pressure zone adjacent to a first outermost air pressure zone provides an air pressure in a range of about 30 psi to 50 psi, such as about 34 psi. In addition, a third air pressure zone a fourth pressure zone can each provide an air pressure in a range of about 4 psi to 13 psi, such as about 7 psi. In this aspect, the remaining air pressure zones can be set to 0 psi, which conserves fluid consumption.

Abstract: A method and apparatus for supporting a web of polishing material are generally provided. In one embodiment, an apparatus for supporting a web of polishing material includes a web of polishing media having a first portion disposed across a support surface of a platen assembly and a second portion wound on a first roll coupled to the platen assembly. A tensioning mechanism is coupled to the platen assembly and adapted to tension the web of polishing media in response to a diameter of the second portion of the web of polishing material wound on the first roll.

Abstract: A unit for on-demand chemical etch. Stencil media is unwound from a stencil unwind hub and passed underneath the thermal print head and printed. The stencil media is a sandwich that is comprised of a porous material married to a pressure-sensitive adhesive coated carrier to supply stiffness and support to the mesh. After the stencil is printed, the carrier is peeled away and is rewound onto a carrier rewind hub, leaving only the printed stencil. This printed stencil is transported underneath the etching electrode, at which time, the electrode actuates downward, sandwiching the printed stencil between the electrode and the target object so that the chemical etching process may be performed. The spent stencil rewinds onto a stencil rewind hub. The stencil printing and etch functions can be provided in a handheld unit. The handheld unit is comprised of an actuating etching head, a print head, a ribbon support system and media support system.

Abstract: A printed wiring board having a conductor pattern on which a pre-flux film of a stabilized quality is to be formed using a water-soluble pre-flux liquid. To this end, such an apparatus is used which includes an etching unit 12 for etching lands 5b, 6b formed on the printed wiring board 1, a rinsing unit 13 for rinsing the printed wiring board 1, a bubble removing unit 14 for removing air bubbles 58 attached to the printed wiring board 1 on immersing the printed wiring board 1 in a water-soluble pre-flux liquid 9a in a processing vessel 56, a pre-flux forming unit 15 for forming a pre-flux film 9 on the lands 5b, 6b of the printed wiring board 1 in the pre-flux liquid 9a using an in-liquid spraying unit 61, a liquid removing unit 16 for removing the pre-flux liquid 9a from the printed wiring board 1 transported from the processing vessel 56 and a rinsing unit 17 for rinsing the printed wiring board 1.

Abstract: A novel modular muffle etch injector assembly for use in a gas blanketed down-flow chemical vapor deposition apparatus of the type having a muffle and a modular gas injector assembly for introducing chemical vapors into a deposition chamber, the muffle being adapted for receiving and supporting the gas injector assembly, wherein deposition material residue collects on a lower surface of the muffle. The etch injector assembly of the present invention comprises an etch chamber having vertical sidewalls, a closed top end and an open bottom end, a supply mechanism for introducing a liquid etchant into the etch chamber, and a sealing device disposed along the open end of the etch chamber for providing a seal between the etch chamber and the lower surface of the muffle to confine the etchant to the etch chamber. The etch injector assembly preferably also includes an exhaust means for removing chemical vapors from the etch chamber.

Abstract: A slit type blow nozzle 14 for ejecting a blow gas 1 and a slit type chemical rinse nozzle 12 for ejecting a rinse chemical 2 are arranged such that the blow gas removes a coating film dissolved by the chemical rinse from the end surface of a glass substrate.

Abstract: An apparatus for forming a loop in a filament comprising a first wall having a first guide slot formed therein and a second wall having a second guide slot formed therein coplanar and parallel to the first guide slot. The first wall is opposite the second wall and each of the guide slots has opposing ends. A first gripper holds a filament at a first location. The first gripper is mounted from the first wall to the second wall at an end of each of the first guide slot and the second guide slot. The apparatus also includes a movable gripper to hold the filament at a second location. The movable gripper has a separation from the first gripper and is mounted from the first wall to the second wall adjacent to the other end of each of the first guide slot and the second guide slot for movement towards the first gripper to reduce the separation between them. This produces a loop of filament between the first gripper and the moveable gripper.

Abstract: An apparatus for forming a loop in a filament comprising a first wall having a first guide slot formed therein and a second wall having a second guide slot formed therein coplanar and parallel to the first guide slot. The first wall is opposite the second wall and each of the guide slots has opposing ends. A first gripper holds a filament at a first location. The first gripper is mounted from the first wall to the second wall at an end of each of the first guide slot and the second guide slot. The apparatus also includes a movable gripper to hold the filament at a second location. The movable gripper has a separation from the first gripper and is mounted from the first wall to the second wall adjacent to the other end of each of the first guide slot and the second guide slot for movement towards the first gripper to reduce the separation between them. This produces a loop of filament between the first gripper and the moveable gripper.

Abstract: A method and apparatus for improving the corrosion resistance of chrome plated materials. After the materials to be chrome plated are mechanically abrasively polished, but before they are reverse etched, they are power washed with a high-pressure liquid. A sprayer with nozzles directed inwardly towards the materials directs water onto the material at pressures in the range of 1000 or 2500 to 3000 psi. After the materials are chrome plated, they are heated above the melting point of a buffing compound, and then the heated materials with the buffing compound applied are buffed. An induction heater is used, before or after the buffing compound is applied. Computer controls, responsive to operator input of the cross-sectional size, composition and/or speed of movement of the chrome plated materials, to in turn regulate the power to an induction coil heater.