Abstract: A label-rejecting station, where labels are carried by a support band along an advancing path. The rejecting station includes a deviator element and a contrast element. The deviator element is arranged along the advancing path and movable between an inactive position and an active position wherein it contacts the support band at a first surface thereof, deviating the advancing path. The contrast element is arranged along the advancing path downstream of the deviator element and includes: an abutting surface provided for receiving partially thereon a second surface of the support band, opposite to the first surface; and a detachment edge provided for detaching a label from the support band when the deviator element moves into its active position.

Abstract: A label printer includes a print head configured to perform printing on a label sheet, a transporting roller configured to transport the label sheet downstream, a peeling roller configured to transport a backing sheet in a direction different from a travelling direction of a label to peel the label from the backing sheet, and a control unit configured to control rotation of the transporting roller and rotation of the peeling roller, wherein when controlling a current value supplied to a peeling motor configured to rotate the peeling roller, the control unit supplies, to the peeling motor, a current value that is greater in an acceleration period for accelerating the rotation of the peeling roller than in any of a constant-speed period for rotating the peeling roller at a constant-speed and a deceleration period for decelerating the rotation of the peeling roller.

Abstract: In accordance with an aspect of the present invention, an apparatus to discard defective label form a labeling machine is provided. The invention includes a label path to move a label web containing a plurality of labels from an origin station to a destination station. The invention then includes an inspection unit to detect the defective labels from the plurality of labels in the label path. The invention also includes a defective label discarding unit configured to discard the defective labels from the label path. The invention further includes, a collecting unit to collect the plurality of defective labels. The invention then includes, a labeling unit configured to label the good label in a required product and a processor to synchronize the label path, the inspection unit, the defective label discarding unit, the collecting unit and the labeling unit.

Abstract: A separating device includes a separating unit and a crack front line adjusting unit. The separating unit is adapted to separate the flexible film and the substrate. During the process of separating the flexible film from the substrate, a crack front line is formed between a portion of the flexible film not separated from the substrate and a portion of the flexible film separated from the substrate. The crack front line adjusting unit is adapted to sense a relative displacement state of the flexible film and the substrate for determining a distribution of the crack front line, and is adapted to apply a down pressing force to the flexible film or the substrate and increase or decrease the down pressing force according to the relative displacement state, so as to adjust the distribution of the crack front line.

Abstract: A tape feeder includes a gate, a gate drive mechanism, and a tape feed mechanism. The gate is provided in an insertion port through which a carrier tape storing components is inserted. In the gate drive mechanism, a tape feed mechanism which drives the gate in opening and closing directions feeds the components stored in the inserted carrier tape to a pickup position. The gate drive mechanism includes a spring member which biases the gate in the closing direction, and a solenoid which drives the gate in the opening direction against a biasing force of the spring member.

Abstract: A pick-and-place machine and method includes use of a passive component feeder cartridge including a feeder gear. Rotation of the feeder gear causes a component-bearing tape to be fed through the feeder cartridge. A pickup head includes a vacuum nozzle to pick up the components from the tape and a rack gear to engage and drive the feeder gear of the feeder cartridge via translational motion of the pickup head when operatively disposed with respect to a selected feeder cartridge.

Abstract: A apparatus for stripping flexible device including: a chassis; a stage; a pick-up device mounted on the chassis through a pivot shaft parallel to a bearing surface, the pick-up device being movable with respect to the stage along a direction perpendicular to a rotation axis of the pivot shaft and parallel with the bearing surface of the stage, and having a surface facing the stage, and having a fixing mechanism configured to fasten a lateral side of the flexible device; an auxiliary device which is mounted on the chassis, an end part of the auxiliary device providing a force to the flexible substrate for its separation from the carrier plate at a separation position between the flexible substrate of the flexible device and the carrier plate when the flexible device is picked up from the carrier plate by the pick-up device; a first driving device mounted on the chassis.

Abstract: A film peeling apparatus that peels a film attached to a substrate includes a chamber, a transfer unit, and first peeling rollers. The transfer unit is disposed in the chamber to transfer the substrate. The first peeling rollers are disposed in the chamber, each of the first peeling rollers includes a first electrostatic chuck to adsorb a first film attached to the substrate. The first peeling rollers roll the adsorbed first film to peel the first film from the substrate.

Abstract: A delamination apparatus that includes a stage to which a lower support, an acceptor substrate disposed on the lower support, and a donor film laminated with the lower support along the edge of the acceptor substrate, interposing the acceptor substrate therebetween are mounted. The delamination apparatus further includes a first gripper disposed in an end side of the stage to move an end of the donor film to a direction far away from the acceptor substrate by gripping the end of the donor film; and a first peeling roll disposed on the donor film to support the donor film disposed between the acceptor substrate and the first gripper, and rotating itself to a direction of the first gripper.

Abstract: A delamination apparatus includes a stage mounted with a lower supporting member, an acceptor substrate positioned on the lower supporting member, and a donor film laminated along with the lower supporting member via the acceptor substrate interposed therebetween according to the edge of the acceptor substrate, a gripper positioned at an end side of the stage to grip the end of the donor film and moving in a direction away from the acceptor substrate, and a peeling roll positioned on the donor film, including a supporting region supporting a portion of the donor film positioned between the acceptor substrate and the gripper, and including a peeling roll main body rotating itself in a direction of the gripper and a blind selectively covering the supporting region.

Abstract: A delamination apparatus includes a stage mounted with a lower supporting member, a donor film laminated to the lower supporting member, and an acceptor substrate sealed between the lower supporting member and the donor film, a first gripper positioned at an end side of the stage, the first gripper being configured to grip an end of the donor film and to move with the end of the donor film away from the acceptor substrate, and a first filling roll positioned over the donor film, the first filling roll being configured to blow ions toward the donor film while rotating toward the first gripper.

Abstract: A film peeling apparatus includes: a pair of rollers configured to peel films from a target object having the films adhered on surfaces thereof; a transporter configured to transport the target object toward the rollers; a sensor configured to obtain peeling target information; a calculator configured to calculate roller distance information or peeling condition information based on the peeling target information; and a controller configured to control a movement of the pair of rollers based on the roller distance information or the peeling condition information.

Abstract: A method of detection and removal of auxiliary material suitable for the manufacturing of an aircraft element includes providing an auxiliary material having at least one detection label, scanning the element with a label detector suitable to detect the detection label once the element has been manufactured, detecting the auxiliary material by means of a warning signal emitted by the label detector and removing the auxiliary material from the element. An auxiliary material suitable for the manufacturing of an aircraft element includes a detection label.

Abstract: A peeling device according to the present disclosure includes a holding unit, a plurality of suction moving units, a state detection unit and a control unit. The holding unit is configured to hold a first substrate of a superposed substrate having the first substrate and a second substrate joined. The suction moving units are configured to suction-hold the second substrate of the superposed substrate and move the second substrate in a direction away from a surface of the first substrate. The state detection unit is configured to detect a peeled-off state of the second substrate from the first substrate. The control unit is configured to control operation timings of the suction moving units so that the second substrate is peeled off from the first substrate gradually from one end of the second substrate toward the other end thereof, based on the peeled-off state detected by the state detection unit.

Abstract: There is provided a substrate warpage removal apparatus and method which can remove warpage of a substrate which has a patterned surface having a film with a pattern, and a non-patterned surface having a film without a pattern. The substrate warpage removal apparatus includes: a holding plate configured to hold a substrate; a processing liquid supply pipe, provided on the side of the non-patterned surface of the substrate, configured to supply an etching liquid to the surface to remove a surface film; and a first laser displacement meter and a second laser displacement meter configured to detect warpage of the substrate. When the controller, based on signals from the first laser displacement meter and the second laser displacement meter, determines that warpage of the substrate has been eliminated, the controller stops the supply of an etching liquid from the processing liquid supply pipe.

Abstract: The invention relates to the prepeeling phase of methods for detaching a semiconductor chip from a foil. According to a first aspect, the invention relates to the determination of time periods, which each defines a duration of a prepeeling step. In a setup phase, the following steps are carried out for each prepeeling step: Initiating the method step; Repeating the two steps Recording of an image of the semiconductor chip and assignment of a time period to the image which has passed since the initiation of the prepeeling step, and Checking whether in the image a peripheral region of the semiconductor chip is darker than a predetermined brightness value; until the check leads to the result that no peripheral region of the semiconductor chip is darker than the predetermined brightness value. According to a second aspect, the detachment of the semiconductor chip from the foil is monitored in realtime.

Abstract: In a method for manufacturing ceramic plates, a Pd paste which does not diffuse into ceramic is formed; metal films each having a thickness such that ceramic layers to be formed after firing are not connected to each other in the lamination direction are formed on surfaces of ceramic green sheets using the Pd paste; then, a firing treatment at a firing temperature, which is a high temperature at which no glass component remains on surfaces of the ceramic layers after the firing and which is equal to or lower than a decomposition temperature of a ceramic material forming the ceramic layers, is performed for a laminate; oxygen present at the interfaces between the ceramic layers and the metal layers is removed by immersing a sintered body in n-butyl alcohol so as to separate the ceramic layers and the metal layers.

Abstract: A first holding table suction-holds an annular projection of a wafer remaining on a rear face thereof for surrounding a back grinding region. A second holding table having an outer peripheral wall adjacent to an inner wall of the annular projection is inserted into a flat portion inside the annular projection for joining a separating adhesive tape to a protective tape on a surface of the wafer while a flat plane of the flat portion is suction-held. Thereafter, the adhesive tape is separated. Accordingly, the adhesive tape is separated from the surface of the wafer together with the protective tape.

Abstract: A method of making scrolls is provided that includes providing a tape having a first side and second side wherein the first side of the tape is has an adhesive disposed thereon and the second side of the tape has a release coating disposed thereon, affixing the adhesive to a solid surface, buff-coating exfoliatable particles on the release side of the tape to form a coating; and peeling the tape from the solid surface at an angle. The coating separates from the release side of the tape and curls inwards to form scrolls. The scrolls can include graphite. Also provided is a continuous method of making scrolls and an apparatus.

Abstract: Doped adhesive tape is used during the manufacture of aircraft, including positioning marks, covering orifices from debris, allowing locations to be marked. Any doped adhesive tape inadvertently left in sub-assemblies during the manufacturing process can be detected using backscatter X-ray inspection technology. Detection is facilitated in one embodiment by making the tape thicker, to produce an increased mass density, and in another embodiment by adding a dopant comprising an element that is readily detected by the backscatter X-ray technology. The element can be iodine, and can be incorporated into the backing layer or the adhesive layer of the tape during manufacturing. The use of both thicker tape and a dopant can be used in combination to facilitate detection. If the doped adhesive tape is detected after components are assembled using a backscatter X-ray inspection device, then the doped adhesive tape is removed.

Abstract: Fiberglass batts are installed between the side-by-side studs in the interior walls of a home or building to insulate the walls and minimize sound transfer. Each fiberglass batt has a paper backing that projects from the side edges of the batt to provide for attachment to the spaced, side-by-side wall studs that comprise the internal frame to which the walls are secured. However, a significant percentage of the backing is produced with a noncompliant, reduced width and thus those batts are discarded. In the present invention a stripper mechanism between an input conveyor that receives the inferior batts and an output conveyor strips the backing therefrom so that the fiberglass may be used in other applications.

Abstract: There is provided a substrate warpage removal apparatus and method which can remove warpage of a substrate which has a patterned surface having a film with a pattern, and a non-patterned surface having a film without a pattern. The substrate warpage removal apparatus includes: a holding plate configured to hold a substrate; a processing liquid supply pipe, provided on the side of the non-patterned surface of the substrate, configured to supply an etching liquid to the surface to remove a surface film; and a first laser displacement meter and a second laser displacement meter configured to detect warpage of the substrate. When the controller, based on signals from the first laser displacement meter and the second laser displacement meter, determines that warpage of the substrate has been eliminated, the controller stops the supply of an etching liquid from the processing liquid supply pipe.

Abstract: A label for removable application to an article such as a beverage bottle includes a backing layer (2) comprising a laminate of a bi-axially oriented polyester such as PET (12) and a bi-axially oriented polypropylene (14). The polyester film (12) has a lower coefficient of thermal expansion than the polypropylene film (14). Consequently, when the label is heated, it will tend to curl and this effect can be used to assist in the removal of the label from the article in a hot washing bath during recycling of the article.

Abstract: Device for separating a substrate from a carrier substrate which is connected to the substrate by an interconnect layer. The device includes a carrier substrate holder with a holding surface for holding the carrier substrate, and a substrate holder which is located opposite the carrier substrate holder with a substrate holding surface which can be located parallel to the holding surface for accommodating the substrate. There are separating means for parallel displacement of the substrate relative to the carrier substrate in the interconnected state of the substrate and carrier substrate.

Abstract: A method for automatic removal of a sealant member from a nozzle plate that includes applying a sealant member to a surface of the nozzle plate, attaching the sealant member with a pull tab, one end of the pull tab being attached to a maintenance sled of a maintenance mechanism at a first position, the maintenance sled moves from a first position to a second position thereby removing the sealant member at a 180 degree angle and with a speed of about 10 mm/sec.

Abstract: Apparatus and a method for operating the apparatus to remove at least one chip-type semiconductor component from an adhesive film. The method comprises: arranging a lifting device with respect to the film, wherein a contact region of the lifting device bears against a second main surface of the film, opposite a chip-type semiconductor component that is arranged on a first main surface and is to be lifted off. Then, applying either a constant vacuum to a plurality of suction cutouts of the lifting device, by means of an assigned vacuum regulating device, or applying different values of the vacuum for different suction cutouts or groups of suction cutouts. Next, partially deforming the film in the contact region by using lifting means arranged in assigned cutouts of the lifting device to lift the film. Finally, using a removal device to remove the at least one semiconductor component from the film.

Abstract: The present invention relates to a striping apparatus and a striping method. The apparatus for stripping a film from a product comprising a transfer device for transferring the product; a film stripping device disposed above a stripping operation area of the transfer device for stripping the film from the product; and a plurality of guiding devices disposed on both sides of the transfer device in the stripping operation area for guiding the transfer direction of the product.

Abstract: In an acoustic sheet which can be used as a head material of a percussion instrument or a head material for a sound box of a string instrument, a plurality of change regions having a crystalline orientation different from a base are dispersed into the base made of a synthetic resin sheet having a uniform crystalline orientation. The acoustic sheet can include a delamination which is formed by delaminating the synthetic resin sheet in a thickness direction.

Abstract: A surface height of a protective tape joined to a wafer mounted and held on a separation table is detected, an operation amount of approaching a joining member to the protective tape until a separation tape wound around the joining member contacts the protective tape based on detected information, the joining member is operation controlled to approach the protective tape based on the calculated operation amount, the joining member and the separation table are relatively moved along a direction of a surface of the protective tape in a state of maintaining the height of the joining member to join the separation tape to the protective tape, and the separation tape is separated from the surface of the wafer integrally with the protective tape.

Abstract: A surface height of a protective tape joined to a wafer mounted and held on a separation table is detected, a lowering operation distance of a needle is calculated based on such detected information, and a lowering operation amount for approaching a joining member to the protective tape until the separation tape winded around the joining member contacts the protective tape is calculated. A separating site is formed in the protective tape and the protective tape is separated while controlling a height of each member based on the calculated lowering operation amount.

Abstract: A sheet peeling apparatus 10 includes: a supporting means 11 for supporting a semiconductor wafer W stuck with an adhesive sheet S; a tape sticking means 14 for sticking a peeling tape T to the adhesive sheet S; a pulling means 13 for pulling the peeling tape T; a peeling assisting means 15 including an endless member 45 which is positioned on the adhesive sheet S, and wound on a guide member 41; and a sandwiching means 16 for sandwiching the adhesive sheet S between the endless member 45 and the sandwiching means 16. In the sheet peeling apparatus 10, the adhesive sheet S is peeled off due to the relative movement of the pulling means 13 and the supporting means 11 in a state that the adhesive sheet S is sandwiched between the peeling assisting means 15 and the sandwiching means 16.