Abstract: A method includes forming a release film over a carrier, forming a polymer buffer layer over the release film, forming a metal post on the polymer buffer layer, encapsulating the metal post in an encapsulating material, performing a planarization on the encapsulating material to expose the metal post, forming a redistribution structure over the encapsulating material and the metal post, and decomposing a first portion of the release film. A second portion of the release film remains after the decomposing. An opening is formed in the polymer buffer layer to expose the metal post.

Abstract: A method for initiating separation of a first layer from a second layer of a multilayer composite structure having a free edge, the method includes steps of securing the multilayer composite structure to a work surface; and applying cyclic pressure to at least a portion of the free edge of the multilayer composite structure.

Abstract: A method for manufacturing a discontinuous vacuum-metalized thin film includes the following steps: step 1: coating a corona surface of a flexible thin film (1) with a longitudinal discontinuous stripping layer; step 2: coating the corona surface and the stripping layer with a metal layer (3); and step 3: removing the stripping layer and the metal layer (3) on the stripping layer to obtain a discontinuous vacuum-metalized thin film. A method for manufacturing a discontinuous vacuum-metalized wire, a discontinuous vacuum-metalized thin film and a discontinuous vacuum-metalized wire are further disclosed.

Abstract: An object adhesion/peeling method according to an embodiment includes adhering a adhesion target object to a second surface side of an adhesive sheet, wherein the adhesive sheet includes adhesive surfaces on a first surface side and the second surface side, and a first electrode and a second electrode provided to be adjacent to the first electrode are provided on the first surface side; adhering the first surface side of the adhesive sheet to a fixation target surface; inputting a predetermined voltage to the first electrode and the second electrode to generate a potential difference based on the predetermined voltage in a direction orthogonal to a layer thickness direction of the adhesive sheet; and causing an electrochemical reaction on the first surface side of the adhesive sheet to peel off the adhesive sheet from the fixation target surface.

Abstract: A thermosetting adhesive sheet capable of reducing semiconductor wafer warping and chipping and a method for manufacturing a semiconductor device includes a thermosetting adhesive layer formed from a resin composition containing a resin component and a filler, the resin component containing an epoxy compound and a curing agent, a total value obtained by multiplying the reciprocal of epoxy equivalent of the epoxy compound by content of the epoxy compound in the resin component being 1.15E?04 or more, and blending amount of the filler being 50 pts. mass or more with respect to 100 pts. mass of the resin component; the thermosetting adhesive sheet is applied to a ground surface of a semiconductor and cured before dicing.

Abstract: A wafer separating apparatus is provided which includes a wafer supporting member having an upper surface on which a bonded wafer formed of two wafers bonded with each other is placed; an arm portion arranged outside of the wafer supporting member, the arm portion being movable closer to and away from a bonded portion of the bonded portion of the bonded wafer supported by the supporting portion; and an inflating portion provided in an distal end portion of the arm portion, the inflating portion being inflatable in a direction intersecting the upper surface of the wafer supporting member.

Abstract: There is provided a carrier plate removing method for removing a carrier plate from a workpiece disposed on a top surface of a carrier plate via a provisional bonding layer. The carrier plate removing method includes a stepped portion forming step of forming a stepped portion in which the workpiece projects sideward as compared with the carrier plate by processing the carrier plate so as to remove a peripheral portion of the carrier plate along a peripheral edge of the carrier plate from an undersurface side opposite from the top surface of the carrier plate, a carrier plate holding step of holding the carrier plate by a carrier plate holding unit, and a removing step of removing the carrier plate from the workpiece by applying a force from the carrier plate side to the stepped portion, and moving the workpiece in a direction of separating from the carrier plate.

Abstract: The present invention relates to a method for recycling an intermediate film for laminated glass, comprising a step of separating a layer comprising an A layer and a layer comprising a B layer from the intermediate film for laminated glass (1) comprising at least the A layer and the B layer.

Abstract: A tape ejection guide structure (8) is a structure which guides ejection of a component storing tape (100) ejected from a tape ejection port (23) of a component supply unit (1A), and includes a guide body (81), and a pair of restraining portions (83). The guide body (81) guides an upper surface portion (100A) of the component storing tape (100) which is ejected from the tape ejection port (23) in a tape ejection direction (H2). A pair of restraining portions (83) is connected to both end portions of the guide body (81) in a tape width direction (H3) respectively, and restrains the displacement in the tape width direction (H3) of the component storing tape (100) which is ejected in a state where the upper surface (100A) is guided by the guide body (81).

Abstract: An apparatus for supporting a process of debonding a carrier glass sheet and an ultrathin glass sheet. A suction plate includes a plurality of suction hole portions defining suction holes for suction-holding a glass laminate seated thereon and at least one recess portion defining at least one recess accommodating at least one device layer protruding from one surface of an ultrathin glass sheet of the glass laminate. A plurality of suction cups are fitted to the plurality of suction hole portions, respectively, such that the plurality of suction cups are elastically compressible, in response to contact pressure of the ultrathin glass sheet and the device layer. A vacuum pump is connected to the plurality of suction hole portions to apply negative pressure to the plurality of suction hole portions. A controller controls the vacuum pump to adjust the negative pressure applied to the plurality of suction hole portions.

Abstract: A peeling apparatus includes a holding table for holding a plate-shaped workpiece having an upper surface and a lower surface, the upper surface being covered with a protective member. The lower surface of the workpiece is held on the holding table. A peeling mechanism peels off the protective member from the workpiece, and a recovery box is set in the peeling apparatus for recovering the protective member. The recovery box has an upper opening from which the protective member is put into the recovery box. The peeling apparatus further includes a removing mechanism for allowing the protective member to be put into the recovery box from the upper opening, and also allowing the protective member recovered into the recovery box to be removed from the recovery box, while operating the peeling mechanism to peel off the protective member.

Abstract: A method of removing a carrier plate is used to peel off and remove the carrier plate from a workpiece of a disk-shaped composite substrate in which the workpiece is disposed on a face side of the carrier plate with a temporary adhesive layer interposed therebetween. The method includes a step forming step of forming a step protruding laterally from the carrier plate more on a reverse side of the carrier plate than on the face side of the carrier plate, by removing an outer circumferential portion of the workpiece, an outer circumferential portion of the temporary adhesive layer, and a face-side side of an outer circumferential edge of the carrier plate, a starting point region forming step of forming a starting point region that acts as a starting point in peeling off the carrier plate from the workpiece.

Abstract: The present disclosure discloses a display panel and a manufacturing method thereof, and a display device, and belongs to the field of display technology. The method includes: fixing a base substrate on a supporting plate; disposing the supporting plate on which the base substrate is fixed at a specified position in a process apparatus; and performing a process corresponding to the process apparatus on the base substrate which is fixed on the supporting plate by means of the process apparatus.

Abstract: An instant lottery scratch ticket and method of playing a lottery instant scratch ticket game comprises a plurality of physical tickets, wherein each ticket provides a removable sticker that may provide wins or enhanced wins.

Abstract: A system for regenerating fastener holes in a replacement tip section of a rotor blade includes a first fixture, a second fixture, and a third fixture positionable adjacent a tip section of the rotor blade. The first fixture is used to verify a position of an opening formed in the spar. The second fixture includes a removable bushing having a drillable opening. The drillable opening is aligned with the at least one opening formed in the spar and defines at least one hole to be formed in the replacement tip section. The third fixture includes a countersink opening. The countersink opening is aligned with the at least one hole to be formed in the replacement tip section and the at least one opening formed in the spar to define a countersink feature to be formed in the at least one hole.

Abstract: A method for bonding a contact surface of a first substrate to a contact surface of a second substrate comprising of the steps of: positioning the first substrate on a first receiving surface of a first receiving apparatus and positioning the second substrate on a second receiving surface of a second receiving apparatus; establishing contact of the contact surfaces at a bond initiation site; and bonding the first substrate to the second substrate along a bonding wave which is travelling from the bond initiation site to the side edges of the substrates, wherein the first substrate and/or the second substrate is/are deformed for alignment of the contact surfaces.

Abstract: A peeling method for peeling off a substrate provided over a support plate through a peel layer from the support plate includes: a first holding step of holding one of the support plate and the substrate by a first holding unit; a start point region forming step of blowing a fluid to an end portion of the peel layer exposed at an end portion of the support plate and the substrate, to form a start point region which will serve as a start point when peeling off the substrate from the support plate; a second holding step of holding the other of the support plate and the substrate by a second holding unit; and a peeling step of relatively moving the first holding unit and the second holding unit in directions for spacing away from each other, to peel off the substrate from the support plate.

Abstract: A pad removal device includes a pad guide extending along a first direction. The pad guide includes a first affixing component configured to affix a first end of the pad guide to a pad at a first pad edge location, and a second affixing component configured to affix a second end of the pad guide to the pad at a second pad edge location opposite the first pad edge location. The pad removal device further includes an actuator attached to the pad guide, and a control assembly coupled to the actuator and configured to cause the actuator to move the first end toward the second end along the first direction. The pad guide is configured to extend in a second direction different from the first direction by an amount dependent on a distance between the first end and the second end.

Abstract: At least one wafer is embedded in a carrier to eliminate or at least reduce edge effect. The wafer reconfiguration is designed to improve a quality not only for spin coating process but also for electric plating process. An edge bead is formed on top of the carrier instead of being formed on top of the wafer so that a full top surface of the wafer can be active to the fabrication of chips and therefore more chips are yielded for a single wafer. The backside of the wafer is not contaminated by the coating according to the present invention. Further, dummy circuits can be made on top of the carrier so that electric plating uniformity for full area of a wafer can be improved.

Abstract: The present invention relates to a peeling bar, apparatus, and method for peeling a polarizing film from a panel. This invention can minimize friction between the peeling bar and the polarizing film since the peeled polarizing film is in contact with a front part of the peeling bar. The radius of a curved surface at the tip of the front part and an inclined upper surface of the front part are designed to minimize the Z-axis component of a shearing force applied to the polarizing film. Also, in order to equalize tension applied to the polarizing film in a peeling process, this invention makes both ends of the polarizing film closely adhere to the peeling bar. According to this invention, fracture of the polarizing film is prevented, and thereby the polarizing film can be stably peeled from the panel without fracture.

Abstract: A dismantling mechanism with convex curved backplate and dismantling device for a display module are disclosed. The dismantling mechanism for the display module includes: a screen fixture configured to carry and secure a screen of the display module when dismantling the display module; a convex curved backplate arranged opposite to the screen fixture, configured to support a cover board of the display module when dismantling the display module; a moveable first dismantling structure configured to drive a first end of the cover board to move in a direction adjacent to the convex curved backplate when dismantling the display module; a first actuator connected with the first dismantling structure and configured to drive the first dismantling structure to move; and a second dismantling structure configured to at least partially support a second end of the cover board away from the first end when dismantling the display module.

Abstract: Provided are a wafer bonding apparatus for accurately detecting a bonding state of wafers in a wafer bonding process and/or in a wafer bonding system including the wafer bonding apparatus. The wafer bonding apparatus includes a first supporting plate including a first surface and vacuum grooves for vacuum-absorption of a first wafer disposed on the first surface, a second supporting plate including a second surface facing the first surface. A second wafer is on the second surface. The wafer bonding apparatus and/or the wafer bonding system include a bonding initiator at a center portion of the first supporting plate, and an area sensor on the first supporting plate and configured to detect a propagation state of bonding between the first wafer and the second wafer.

Abstract: Disclosed herein is an inspecting apparatus including an illuminating unit adapted to be positioned in the periphery of a transparent member for illuminating the transparent member from the outside of the circumference thereof, an imaging unit adapted to be opposed to the transparent member for imaging the transparent member illuminated by the illuminating unit, and a displaying monitor for displaying an image obtained by the imaging unit.

Abstract: A method for producing a gypsum plasterboard comprising the steps of providing bundler dust obtained from gypsum plasterboard leftovers of a plasterboard trimming process by a trimming device, in particular by a bundler saw; and adding at least a part of the bundler dust to a gypsum slurry for producing the gypsum plasterboard.

Abstract: A foil peeling apparatus adapted to a substrate having a foil thereon includes a foil peeling member, a connector and a controller. The foil peeling member has a foil peeling surface. The controller controls the connector to drive the peeling member to move along a path. The foil peeling surface of the peeling member in contact with, with an initial angle, the substrate, feeds toward the substrate for a first displacement, and then moves upwards and toward the substrate when the first feeding angle is decreased.

Abstract: The present disclosure relates to a technical field of solar cells, and more particularly to an independently-driven film separation mechanism. The separation mechanism includes a mounting platform. A plurality of first suction components for sucking the bottom surfaces of wafers respectively are provided on one side of the mounting platform. Each of the first suction components is corresponding to one of the wafers. The mounting platform is provided with a plurality of second suction components for sucking films respectively, each of the films is provided on a top surface of the corresponding wafer. The first suction components and the second suction components are provided in a one to one correspondence, and a suction direction of each of the plurality of first suction components and a suction direction of each of the plurality of second suction components are opposite.

Abstract: A processing apparatus of a stack is provided. The stack includes two substrates attached to each other with a gap provided between their end portions. The processing apparatus includes a fixing mechanism that fixes part of the stack, a plurality of adsorption jigs that fix an outer peripheral edge of one of the substrates of the stack, and a wedge-shaped jig that is inserted into a corner of the stack. The plurality of adsorption jigs include a mechanism that allows the adsorption jigs to move separately in a vertical direction and a horizontal direction. The processing apparatus further includes a sensor sensing a position of the gap between the end portion in the stack. A tip of the wedge-shaped jig moves along a chamfer formed on an end surface of the stack. The wedge-shaped jig is inserted into the gap between the end portions in the stack.

Abstract: A feeder includes a discharge guide member which is provided on a feeder main body to communicate with a tape discharging section and guides such that a carrier tape which is discharged from the tape discharging section heads downward, a peeling member which is provided on the feeder main body and peels a cover tape from the carrier tape before the carrier tape which is conveyed by a front side sprocket reaches the tape discharging section, and a contacting and positioning member which is provided on the feeder main body, causes the cover tape which covers the carrier tape which is conveyed by the front side sprocket to contact the peeling member, and positions the carrier tape from which the cover tape is peeled and which is discharged from the tape discharging section at a regular position inside the discharge guide member.

Abstract: The present invention includes a tape peeling mechanism provided with a peeling member configured to enter a leading end surface in a feeding direction of fed component supply tape made from carrier tape and cover tape so as to peel the cover tape from the carrier tape, enabling a component to be supplied from at a component supply position, wherein the peeling member is displaced upwards after entering the leading end surface of the carrier tape as the component supply tape is fed. Accordingly, cover tape is reliably peeled without damaging components, and changeover work on the leading end of the component supply tape is not required.

Abstract: A starting point for separating a separation layer and a layer to be separated is formed in a process member. A first step of irradiating a first portion of the process member with first laser light in a frame-like shape and a second step of irradiating at least part of a region which is irradiated with the first laser light with second laser light are performed. The process member includes a first substrate, the separation layer, the layer to be separated, and an adhesive layer which are stacked in this order. In the first portion, the adhesive layer overlaps with the first substrate with the separation layer and the layer to be separated provided therebetween. In the first step, the first laser light is absorbed by at least the layer to be separated and the adhesive layer. In the second step, the second laser light is absorbed by at least the separation layer.

Abstract: A robotic placement machine including a base operably connected to the Y axis actuator and the X axis actuator, a first Z axis actuator coupled to the first end of the base, the first Z axis actuator capable of moving up and down a first Z axis, a second Z axis actuator coupled to the second end of the base, the second Z axis actuator capable of moving up and down a second Z axis, and a pick and place plate operably connected to the first Z axis actuator and the second Z axis actuator, wherein the first Z axis actuator and the second Z axis actuator are each capable of moving independently of each other to tilt the pick and place plate is provided. Furthermore, a system comprising a first machine, second machine, and third machine to eliminate air bubbles when bonding two substrates is also provided. A method of optical bonding is further provided.

Abstract: An electronic component package includes a carrier tape in which a plurality of substantially recess-shaped electronic component holding portions are provided in an elongated, narrow base material configured of a resin so that the electronic component holding portions include openings on one surface of the base material and bulge outward on the other surface of the base material, and a cover tape affixed to the one surface of the carrier tape so as to cover the openings in the respective electronic component holding portions. A thickness dimension of a base portion of the electronic component holding portion is smaller than a thickness dimension of the base material.

Abstract: The present invention relates to a peeling bar, apparatus, and method for peeling a polarizing film from a panel. This invention can minimize friction between the peeling bar and the polarizing film since the peeled polarizing film is in contact with a tip of a front part of the peeling bar. The radius of a curved surface at the tip of the front part and an inclined upper surface of the front part are designed to minimize the Z-axis component of a shearing force applied to the polarizing film. Also, in order to equalize tension applied to the polarizing film in a peeling process, this invention makes both ends of the polarizing film closely adhere to the peeling bar. According to this invention, fracture of the polarizing film is prevented, and thereby the polarizing film can be stably peeled from the panel without fracture.

Abstract: A separation method allows a carrier substrate and a resin layer to be separated without, for example, breaking the resin layer for use in a final product, such that the resin layer can be rendered easy to handle thereafter. A protection step coats the surface of a resin layer with a protective film. A holding-by-suction step retains by suction the coated resin layer on a suction stage with a flat suction surface. After the back surface of the carrier substrate is supported at or near a first end by a support roller capable of moving from the first end to a second end of the carrier substrate, a peeling step lowers the first end of the carrier substrate while moving the support roller toward the second end, thereby peeling the carrier substrate from the resin layer while bending the carrier substrate at a portion supported by the support roller.

Abstract: This disclosure relates to a device for separating two substrates to be utilized in electronics, optics, optoelectronics and/or photovoltaics. The device separates the substrates at an interface, the device comprising a holder; a member for retaining the structure, the member being mounted on the holder; a tool for separating the two substrates, also mounted on the holder; and means for moving the separating tool and/or means for moving the retaining member relative to the holder so as to bring them closer together or move them farther apart from each other, preferably over a limited range of travel. This device is noteworthy in that the separating tool comprises a leading edge that has, in cross-section, in succession from its tip or its front edge to its back, a tapered portion that is extended by a flared portion.

Abstract: A semiconductor mounting apparatus includes a storing unit that stores a liquid or a gas, a contact unit that comes into contact with a semiconductor chip when the storing unit is filled with the liquid or the gas, and a sucking unit that sucks up the semiconductor chip to bring the semiconductor chip into close contact with the contact unit.

Abstract: Provided are an initiator and a method for debonding a wafer supporting system. The initiator for debonding a wafer supporting system includes a rotation chuck having an upper surface on which a wafer supporting system (WSS), which includes a carrier wafer, a device wafer, and a glue layer for bonding the carrier wafer and the device wafer to each other, is seated to rotate the wafer supporting system, a detecting module detecting a height and a thickness of the glue layer and a laser module generating a fracture portion on the glue layer through irradiating a side surface of the glue layer with a laser on the basis of the height and the thickness of the glue layer.

Abstract: An organic light emitting display device and a method of manufacturing the same are proposed. The organic light emitting display device includes: a first film formed of an organic material, and having first and second surfaces facing each other and a third surface perpendicular to the first and second surfaces; a second film formed on the first film to cover the second and third surfaces of the first film; an organic light emitting unit disposed on the second film; a third film disposed on the second film to cover the organic light emitting unit; and a fourth film disposed on the third film, formed of an organic material, and having fourth and fifth surfaces facing each other, wherein the fifth surface faces the third film.

Abstract: Embodiments of systems, computer program product, and related computer implemented methods to issue a closed-loop retail prepaid card including a user-designed external face using a chit, the chit being defined by an identification mechanism representing a financial commitment to issue a closed-loop retail prepaid card in an amount associated with a value paid for the chit, are provided. Embodiments of the present invention advantageously provide a service that enables a consumer to purchase, at the storefront of a retail establishment, a chit card that the consumer can subsequently redeem through a graphical user interface of an Internet website for a closed-loop retail prepaid card with a user-designed external face. The user-designed closed-loop retail prepaid card, for example, can be subsequently printed and delivered to an intended recipient. Advantageously, such a service can be made available to any retail establishment that uses a point-of-sale system.

Abstract: A centrifuge screening system and method of testing MEMS devices using the system. The wafer level centrifuge screening system can include a base centrifuge system and a cassette mounting hub coupled to the base centrifuge system. The method can include applying a smooth and continuous acceleration profile to one or more MEMS components via the base centrifuge system. Each of the one or more MEMS components can have one or more MEMS devices formed thereon. The one or more MEMS components can be provided in one or more cassettes configured on the cassette mounting hub. The method can also include identifying one or more target MEMS components, which can include identifying stiction in one or more MEMS devices on the one or more MEMS components.

Abstract: A delamination method for delaminating a laminated substrate which includes a first and a second substrates bonded to each other, includes: adjusting a position of the laminated substrate at a holding unit by a position adjusting unit and disposing the holding unit at a predetermined height position; disposing a sharp member of a delamination inducing unit at a predetermined height position; detecting a contact of the sharp member by bringing the sharp member into contact with a side surface of one end portion of the laminated substrate; inserting the sharp member into the side surface of the one end portion of the laminated substrate; and delaminating the second substrate from the first substrate by a plurality of suction movement units which sucks the second substrate of the laminated substrate to move the second substrate away from the first substrate.

Abstract: A semiconductor device includes a standardized carrier. A semiconductor wafer includes a plurality of semiconductor die and a base semiconductor material. The semiconductor wafer is singulated through a first portion of the base semiconductor material to separate the semiconductor die. The semiconductor die are disposed over the standardized carrier. A size of the standardized carrier is independent from a size of the semiconductor die. An encapsulant is deposited over the standardized carrier and around the semiconductor die. An interconnect structure is formed over the semiconductor die while leaving the encapsulant devoid of the interconnect structure. The semiconductor device is singulated through the encapsulant. Encapsulant remains disposed on a side of the semiconductor die.

Abstract: In a wafer processing method, a protective film is formed by applying a liquid resin to the front side of a wafer. A protective tape is adhered to a surface of the protective film. A modified layer is formed by applying a laser beam having such a wavelength as to be transmitted through the wafer along each of division lines, with a focal point positioned inside the wafer. The modified layer is formed inside the wafer along each of the division lines. The back side of the wafer is ground while supplying grinding water to thin the wafer to a predetermined thickness and to crack the wafer along the division lines using the modified layers as crack starting points so as to divide the wafer into individual device chips, after the protective film is formed, the protective tape is adhered, and the modified layer is formed.

Abstract: The plasma processing apparatus is provided with a chamber 11, a plasma source 13 which generates plasma inside the chamber 11, a stage 16 which is provided inside the chamber 11 and places a carrier 5 thereon, a cover 31 which is arranged above the stage 16 to cover a holding sheet 6 and a frame 7 and has a window 33 which is formed on a central part thereof to penetrate the cover 31 in the thickness direction, and a drive mechanism 38 which changes the position of the cover 31 relative to the stage 16 between a first position which is away from the stage 16 and allows the carrier 5 to be placed on and removed from the stage 16 and a second position which allows the cover 31 to cover the holding sheet 6 and the frame 7 of the carrier 5 placed on the stage 16 and a substrate 2 held on the holding sheet 6 to be exposed through the window 33.

Abstract: A method for extracting components includes the steps of heating an electronic device having one or more components to a predetermined temperature so as to substantially weaken a bonding substance arranged to bond the one or more components to the electronic device, and thereafter manipulating the electronic device to extract the one or more components from the electronic device.

Abstract: An automatic film peeling machine for peeling a film adhered on a board, includes a workbench, a frame mounted on the workbench including a movable pushing block, a supporting plate mounted on the frame, a suction plate for locating the board on the supporting plate, and a peeling module. The peeling module includes a sliding member, a resisting member and a movable clamping member mounted on the sliding member. The clamping member includes a clamping portion with a plurality of vents. Air is blown out from the vents for rotating a movable un-adhered portion of the film into a space between the clamping portion and the resisting member. The clamping member is moved toward the resisting member for clamping the movable un-adhered portion. The pushing block is moved to push the sliding member away from the frame, for peeling the first film from the board.

Abstract: A liquid crystal display separator, in which a liquid crystal display includes a liquid crystal panel and a cover glass bonded to each other by means of a resin material disposed therebetween, is disclosed. The separator includes a body unit, which is provided with a first transfer unit, positioned at a higher level, and a second transfer unit, positioned at a lower level, and which moves horizontally, a first suction unit coupled to the first transfer unit to suck a circuit board of the liquid crystal panel using a vacuum, a second suction unit coupled to the second transfer unit to suck the cover glass using a vacuum, and a separation unit for separating the liquid crystal panel and the cover glass from each other while the first or second suction unit moves horizontally on the body unit.

Abstract: At least one water is embedded in a carrier to eliminate or at least reduce edge effect. The wafer reconfiguration is designed to improve a quality not only for spin coating process but also for electric plating process. An edge bead is formed on top of the carrier instead of being formed on top of the wafer so that a full top surface of the wafer can be active to the fabrication of chips and therefore more chips are yielded for a single wafer. The backside of the wafer is not contaminated by the coating according to the present invention. Further, dummy circuits can be made on top of the carrier so that electric plating uniformity for full area of a wafer can be improved.

Abstract: The present invention includes: a slat 3; and a position adjustment mechanism that adjusts an attachment position of the slat 3 to a main wing 1 by causing the slat 3 to swing, the position adjustment mechanism including: a pivot shaft S1 as a center of the swing motion of the slat 3; and a driving shaft S2 that is rotatably supported on a rail 12, and induces the swing motion of the slat 3. The driving shaft S2 includes: a main shaft 30 that causes the slat 3 to swing by acting thereon; an inner-side eccentric bushing 31 that is fixed to the main shaft 30, and eccentric with respect to the main shaft 30; and an outer-side eccentric bushing 32 that is eccentric with respect to the inner-side eccentric bushing 31, rotatably arranged therearound, and supported rotatably with respect to the rail 12.

Abstract: A component supplying apparatus includes a main tape entering port, a component supply port through which components are picked up from a carrier tape, a main tape path extending in a body part from the main tape entering port to the underside of the component supply port, a top tape removing part removing the top tape from the carrier tape on the main tape path upstream of the component supply port, a sub tape entering port, a sub tape path meeting a slope path portion of the main tape path at a meeting point upstream of the top tape removing part, and at least one sprocket wheels engaging with the carrier tape on the main tape path downstream of the meeting point. A length of the sub tape path is shorter than a length of the main tape path from the main tape entering port to the meeting point.