Abstract: A carbon fiber recovery method for recovering carbon fibers from a fiber reinforced plastic member having a carbon fiber reinforced plastic (CFRP) layer on which a glass fiber reinforced plastic (GFRP) layer is formed is provided. This method includes: forming a cut that penetrates through the GFRP layer and reaches the CFRP layer in the fiber reinforced plastic member; causing a heated phosphorus-containing solution to penetrate from the cut and separating the CFRP layer from the GFRP layer in the vicinity of an interface between the CFRP layer and the GFRP layer; and dissolving, by a resin solution, a resin part of the CFRP layer from which the GFRP layer has been removed and then recovering the remaining carbon fibers.

Abstract: Method for recovering carbon fibers from carbon fiber reinforced polymer composites is provided. The recovered carbon fibers can be separable and can be substantially free of thermosetting resins. Compositions comprising said recovered carbon fibers are also provided.

Abstract: A method is disclosed which includes: forming at least one layer of material on at least part of a surface of a first substrate, wherein a first surface of the at least one layer of material is in contact with the first substrate thereby defining an interface; attaching a second substrate to a second surface of the at least one layer of material; forming bubbles at the interface; and applying mechanical force; whereby the second substrate and the at least one layer of material are jointly separated from the first substrate. Related arrangements are also described.

Abstract: A synthetic quartz glass substrate having a resist film coated thereon is treated by immersing it in a terpene-containing solvent until the resist film is released, and rinsing the substrate with water.

Abstract: Method for isolating a flexible film from a support substrate and method for fabricating an electronic device are provided. The method for isolating a flexible film from a support substrate includes providing a substrate with a top surface. A surface treatment is subjected to the top surface of the substrate, forming a top surface with detachment characteristics. A flexible film is formed on the top surface with detachment characteristics. The flexible film within the top surface with detachment characteristics is cut and isolated.

Abstract: In an embodiment of the disclosure, there is provided a method and system for recycling a cured composite laminate material into a delaminated recyclate that maintains a fiber volume fraction and a lamina level fiber alignment substantially the same as the cured composite laminate material. The method provides a cured composite laminate material having a fiber volume fraction and a lamina level fiber alignment. The cured composite laminate material undergoes solvent soak preconditioning, liquid solvent removal, pre-heating, and rapid heating with phase change delamination of the cured composite laminate material to obtain the delaminated recyclate that maintains a fiber volume fraction and a lamina level fiber alignment substantially the same as the cured composite laminate material.

Abstract: A method for assembling an electrodeionization device comprising providing in a sequential arrangement: an anode, membrane cell assembly, cathode; wherein the membrane cell assembly comprises at least one sequential arrangement of: a cation exchange membrane, concentrating chamber, anion exchange membrane, diluting chamber, cation exchange membrane, concentrating chamber and anion exchange membrane. The method includes locating an ion exchange spacer in at least one chamber of the membrane cell assembly wherein an ion exchange spacer comprises an ion exchange resin and a dissolvable binder.

Abstract: A method for bonding a thin film piece includes: forming a support layer on each upper face of a plurality of thin film pieces; fixing the plurality of thin film pieces to a first substrate through a temporary fixing layer provided on a lower face of the first substrate so that the temporary fixing layer contacts with the upper face and at least a part of a side face of each support layer; bonding a lower face of the plurality of thin film pieces to a second substrate; and removing the first substrate from the plurality of thin film pieces by removing at least one of the support layer and the temporary fixing layer.

Abstract: A method of manufacturing a package substrate. A carrier member is formed on an insulation protection layer on either of two surfaces of a core layer. The package substrate has the carrier member combined with one side thereof, and is prevented from being damaged during transportation or packaging due to reduced thickness.

Abstract: Embodiments of the disclosed technology disclose a method for fixing glass substrates and a method for preparing a flexible display device. The method for fixing glass substrates comprises coating an edge portion of a first glass substrate corresponding to a second glass substrate with epoxy resin and screeding the coated epoxy resin layer, adhering the second glass substrate to the first glass substrate, and annealing the two glass substrates. With the technical solution of this disclosed technology, the time period for fixing the adhered glass substrates can be reduced with an improved productivity.

Abstract: A separating fluid, method and use for separating multilayer systems, especially photovoltaic modules, for the purpose of recycling, which allow the separation of multilayer systems. Especially photovoltaic modules, in comparatively simple manner in terms of the processes used, in as environmentally friendly a manner as possible, at high recycling rates. For this purpose, the separating fluid is a nanoscale dispersion or a precursor thereof.

Abstract: In an embodiment of the disclosure, there is provided a method and system for recycling a cured composite laminate material into a delaminated recyclate that maintains a fiber volume fraction and a lamina level fiber alignment substantially the same as the cured composite laminate material. The method provides a cured composite laminate material having a fiber volume fraction and a lamina level fiber alignment. The cured composite laminate material undergoes solvent soak preconditioning, liquid solvent removal, pre-heating, and rapid heating with phase change delamination of the cured composite laminate material to obtain the delaminated recyclate that maintains a fiber volume fraction and a lamina level fiber alignment substantially the same as the cured composite laminate material.

Abstract: A cleaning composition for removing temporary wafer bonding material is provided. The cleaning composition comprises an alkylarylsulfonic acid and an aliphatic alcohol dispersed or dissolved in a hydrocarbon solvent system. Methods of separating bonded substrates and cleaning debonded substrates using the cleaning composition are also provided. The invention is particularly useful for temporary bonding materials and adhesives. The methods generally comprise contacting the bonding material with the cleaning solution for time periods sufficient to dissolve the desired amount of bonding material for separation and/or cleaning of the substrates.

Abstract: A method for stripping a wafer from a supporting plate to which the wafer is adhered via an adhesive agent, wherein the supporting plate has a through hole penetrating the supporting plate in a thickness direction thereof, the method including dissolving the adhesive agent with a stripping solution by contacting the stripping solution with the adhesive agent via the through hole. The adhesive agent has a hydrocarbon resin as a viscous component, and the stripping solution is a hydrocarbon-based solvent having a viscosity of 1.3 mPa·s or less and a dissolving rate of 30 nm/sec or greater to dissolve the adhesive agent.

Abstract: The present invention provides a system and method of mechanical abrasive surface conditioning for wallcovering removal. The method employs a system of mechanized sanding tools and dust collection means that are used to prepare a wallcovering surface for application of an adhesive removing mixture that allows for relatively quick and easy removal of various kinds, styles, ages, etc. of wallcoverings with a minimum of time, effort, and damage to the underlying wall. A key component to the system is the proper marriage of sanding tools utilizing relatively course grit size and the application of the random orbital and/or oscillating motion. The system can thereby reduce the physical effort required to properly abrade the wallcovering surface in order to allow a wetting solution to adequately penetrate the wallcovering such that removal of the wallcovering can be accomplished more easily.

Abstract: A separating apparatus includes a sucking plate for sticking to a support plate by suction. The sucking plate has sucking holes for expelling gas from a space between the sucking plate and the support plate. Each of the sucking holes has a diameter of not less than 0.3 mm and not more than an outer diameter of the support plate. This makes it possible to separate a supporting plate from a wafer without breaking the wafer.

Abstract: Embodiments of the invention provide a method for debonding chamber component used in a semiconductor processing chamber. In one embodiment, a method for debonding chamber components used in a semiconductor processing chamber includes providing a first chamber component and a second chamber component bonded by an adhesive material disposed at an interface defined between the first and the second chamber components, soaking the bonded first and the second chamber components into an organic solution for between about 8 hours to about 240 hours, and removing the bonded first and the second chamber from the organic solution; and mechanically separating the soaked first and the second chamber components.

Abstract: Exfolilation of graphene from graphite using multilayer coextrusion is generally disclosed. In some example embodiments, graphite may be dispersed within a first processing material, and the first processing material and a second processing material may be co-extruded through a plurality of series coupled layer multiplication dies to exfoliate graphene from the graphite. The graphene may be separated from the resulting multi-layered material. In some example embodiments, graphite flake and/or expanded graphite may be dispersed within the first processing material.

Abstract: There are provided an interlayer film separation solution and an interlayer film separation method capable of separating an interlayer film and a glass for a short period of time and collecting the separated interlayer film in a recyclable condition. An interlayer film separation solution 21 having etching ability for a glass is introduced into a container 22, and the introduced interlayer film separation solution 21 was controlled to a temperature of 30 to 60° C., and a laminated glass 10 with glass plates 11, 12 crushed is introduced into a barrel 23 from a lid portion 23a, and simultaneously, 50 to 60 metal pieces 25 are, introduced into the barrel 23 from the lid portion 23a in order to easily separate the laminated glass 10 into the glass plates 11, 12 and an interlayer film 13. The barrel 23 containing the laminated glass 10 and the metal pieces 25 introduced thereinto is rotated at a predetermined rotational speed.

Abstract: A synthetic quartz glass substrate having a resist film coated thereon is treated by immersing it in a terpene-containing solvent until the resist film is released, and rinsing the substrate with water.

Abstract: [Object] To provide an additive for dust scattering preventing coating water of which the coating water can permeate into a mineral-fiber-containing installation layer of asbestos, etc., to suppress scattering of dust and thereby enable stripping removal of the mineral-fiber-containing installation layer to be performed efficiently, at low cost, and safely. [Solution Means] An additive for dust scattering preventing coating water used by adding and dissolving in a coating water and coating onto a mineral-fiber-containing installation layer. The additive contains fructose as a water retention imparting agent, glycerin as a moisture retention maintaining agent, and a surfactant as a permeation promoter, and furthermore contains a sugar alcohol.

Abstract: A method for stripping a wafer from a supporting plate to which the wafer is adhered via an adhesive agent, wherein the supporting plate has a through hole penetrating the supporting plate in a thickness direction thereof, the method including dissolving the adhesive agent with a stripping solution by contacting the stripping solution with the adhesive agent via the through hole. The adhesive agent has a hydrocarbon resin as a viscous component, and the stripping solution is a hydrocarbon-based solvent having a viscosity of 1.3 mPa·s or less and a dissolving rate of 30 nm/sec or greater to dissolve the adhesive agent.

Abstract: A process for forming a patterned thin film structure on a substrate is disclosed. A pattern is printed with a material, such as a masking coating or an ink, on the substrate, the pattern being such that, in one embodiment, the desired thin film structures will be formed in the areas where the printed material is not present, i.e., a negative image of thin film structure to be formed is printed. In another embodiment, the pattern is printed with a material that is difficult to strip from the substrate, and the desired thin film structures will be formed in the areas where the printed material is present, i.e., a positive image of the thin film structure is printed. The thin film material is deposited on the patterned substrate, and the undesired area is stripped, leaving behind the patterned thin film structures.