Abstract: A technique for protecting a portion of a screen panel during a process for disassembling and servicing a display screen device is provided. A first part of the display screen device is separated from a screen panel part of the display screen device, where the screen panel part includes a main screen portion and a circuit of flexible printable circuit board (FPCB) portion. An encapsulant is applied onto a break protectable layer (BPL) of the circuit of flexible printable circuit board (FPCB) portion. The screen panel part is washed, with a solvent to remove residue from the main screen portion.

Abstract: An apparatus for supplying a support having a clean surface is provided. Alternatively, an apparatus for manufacturing a stack including a support and a remaining portion of a processed member whose one surface layer is separated is provided. A positioning portion, a slit formation portion, and a peeling portion are included. The positioning portion is provided with a first transfer mechanism of a stacked film including a support and a separator and a table for fixing the stacked film. The slit formation portion is provided with a cutter that can form a slit which does not pass through the separator. The peeling portion is provided with a second transfer mechanism and a peeling mechanism extending the separator and then peeling the separator. In addition, a pretreatment portion activating a support surface is included.

Abstract: A method of detaching a sub-substrate from a substrate includes providing a first sub-substrate attached to a first substrate having a rectangular shape with first and second sides extending in a first direction and third and fourth sides extending in a second direction crossing the first direction, inserting a separating member between the first sub-substrate and the first substrate to partially detach therebetween, attaching a plurality of pads arranged in a matrix pattern to the first sub-substrate, lifting first pads among the plurality of pads arranged in a third direction crossing the first and second directions, lifting second pads, at least two of the second pads being arranged in the second direction, and at least two of the second pads being arranged in the third direction, and lifting third pads arranged in the second direction.

Abstract: A film-removing mechanism configured to cooperate with a mechanical arm to remove a protecting film from a workpiece can include a base, a blowing member coupled to the base, and a holding assembly positioned adjacent to the blowing member. The base can be configured to support the workpiece. The blowing member defining an air outlet can be configured to communicate with an external air resource. The holding assembly can include a supporting member positioned adjacent to the base and a driving member coupled to the supporting member. The supporting member can correspond to the air outlet and the driving member can be configured to connect to the external mechanical arm.

Abstract: Device for stripping a product substrate from a carrier substrate connected to the product substrate by an interconnect layer by means of a flexible film that is mounted on a film frame and that comprises an adhesive layer for holding the product substrate in a bonding surface section of the film, the film being mounted on the film frame in an attachment section of the film that surrounds the bonding surface section, and the film comprising a stripping section that is located between the bonding surface section and the attachment section, the device having stripping means for effecting a stripping of the product substrate from the carrier substrate from a periphery of the product substrate.

Abstract: Disks stuck together in a stack are separated by placing the disks on a shaft of a vibratory apparatus and vibrating the shaft to vibrate the disks by contact of the disks with the vibrating shaft to separate them and also constrain the disks with the shaft as the disks are vibrated.

Abstract: Improved semiconductor wafer debonding system, method, and apparatus, including a stress-free means for multi-axis debonding utilizing a specialized tool or fixture having at least one ultrasonic transducer.

Abstract: A method of separating an atomically thin material, such as graphene, from a substrate, such as copper, is disclosed. The method provides a composite sheet, such as a graphene-copper sheet, and then applies hypersonic waves to the composite sheet so as to break the bonds therebetween and separate a graphene sheet from the copper substrate. A system to implement the separation is also disclosed.

Abstract: Disks stuck together in a stack are separated by placing the disks on a shaft of a vibratory apparatus and vibrating the shaft to vibrate the disks by contact of the disks with the vibrating shaft to separate them and also constrain the disks with the shaft as the disks are vibrated.

Abstract: Parts stuck together in a stack are separated by placing the parts in a vibratory apparatus and vibrating the stack of parts with a vibratory head of the vibratory apparatus to separate them and also constrain the parts with the vibratory head as the parts are vibrated.

Abstract: The present invention discloses a graphene platelet fabrication method, which comprises Step (A): providing a highly-graphitized graphene having a graphitization degree of 0.8-1.0; and Step (B): providing a shear force acting on the highly-graphitized graphene to separate the highly-graphitized graphene into graphene platelets, wherein the graphene platelets have a length of 10-500 ?m and a width of 10-500 ?m and have a single-layer or multi-layer structure. The present invention also discloses a graphene platelet fabricated according to the abovementioned method.

Abstract: The systems and methods of the present disclosure relate to safely coupling and decoupling various solid objects with the use of pressure-sensitive adhesive. In particular, the disclosure relates to methods and systems for delivering vibrational energy to a pressure-sensitive coupled structure, sufficient to decrease coupling strength of the pressure-sensitive adhesive as well as to de couple or reposition the coupled objects.

Abstract: The present disclosure generally describes techniques suitable for use in the construction or recycling of composite materials. An article may comprise a thermoplastic coupled to a bonding interface layer, with a coating layer applied to the surface of the bonding interface layer. A bonding interface layer may comprise catalytic nanoparticles embedded within and/or encapsulated by one or more radiatively unstable polymers. Application of ionizing radiation to the article may release a catalyst at the bonding interface. Application of heat and/or stress to the article may enhance catalytic degradation of the remaining bonding interface and uncoupling of the thermoplastic from the coating layer. Embodiments of methods, compositions, articles and/or systems may be disclosed and claimed.

Abstract: The invention provides a method of bonding a first part on a second part made of composite material by means of an adhesive, wherein said adhesive is filled with elements of shape memory alloy. The invention also provides a method of un-sticking the first part adhesively bonded on the composite material second part, said un-sticking method comprising a step of weakening the adhesive interface that consists in subjecting the adhesively bonded parts to heat treatment performed at a temperature that is lower or higher than the martensitic transformation temperature of the shape memory alloy elements.

Abstract: The present invention provides a method and machine for separating a liquid crystal panel and a liner pad. The method includes (1) providing a separation machine and a combination of the liquid crystal panel and liner pad to be separated, the separation machine including a separation device that includes a suction device, air blasting devices and shaking devices; (2) the suction device moving toward the combination; (3) a central suction nozzle first engaging and sucking a liner pad of the combination and later the first suction nozzles engaging the sucking the liner pad of the combination; (4) the shaking devices being operated to subject the combination to vibration and the air blasting devices being operated to eject air streams to side edges of the combination; and (5) the combination, after being subjected to vibration and air streams, being separated so as to realize separation of the liquid crystal panel and liner pad.

Abstract: Improved semiconductor wafer debonding system, method, and apparatus, including a stress-free means for multi-axis debonding utilizing a specialized tool or fixture having at least one ultrasonic transducer.

Abstract: A method for reworking a bonded display (e.g., a bonded LCD) having a substrate (e.g., plate or film) adhesively bonded to a face (e.g., front face) of the display. The method provides for efficient and clean removal of the substrate from the bonded display when necessary (e.g., when defect(s) are present) to afford a de-bonded display that is undamaged such that the resulting de-bonded display (e.g., de-bonded LCD) can subsequently be re-bonded as a component in a device being manufactured.

Abstract: The invention can firmly and easily remove a finely divided weft piece without leaving the weft piece by constituting a method and an apparatus of removing weft from a cord fabric for a topping sheet in a calender line for topping rubber on a number of pieces of aligned cords by a calender roll. In the midst of transferring a cord fabric transferred to a calender apparatus, weft is finely divided by passing the cord fabric through weft dividing means, thereafter, a plurality of blades arranged movably in a width direction on an upper face side of the cord fabric are reciprocally moved in the width direction over an entire width thereof to be brought into contact with the cord fabric, and the divided weft piece is wiped off to remove by respectively striking respective cords of the cord fabric by the respective blades.

Abstract: A stripping method for stripping a support plate from a laminate including a substrate and the support plate adhered to the wafer via an adhesive layer, in which the adhesive layer is formed from an adhesive compound soluble in a non-polar solvent or a highly polar solvent; and the stripping method includes supplying the non-polar solvent or the highly polar solvent, so that the non-polar solvent or the highly polar solvent is retained at least on an edge portion of that surface of the laminate which faces the support plate, and on a lateral surface of the laminate.

Abstract: Parts stuck together in a stack are separated by placing the parts in a vibratory apparatus and vibrating the stack of parts with a vibratory head of the vibratory apparatus to separate them and also constrain the parts with the vibratory head as the parts are vibrated.

Abstract: A method includes positioning a layer of adhesive between a first structural component and a second structural component, positioning a first evaluation film between the first structural component and the layer of adhesive, curing the adhesive at least partially, separating the first structural component and the first evaluation film by a relative movement therebetween, and inspecting bond line quality of the adhesive.

Abstract: A stripping method for stripping a support plate from a laminate including a substrate and the support plate adhered to the wafer via an adhesive layer, in which the adhesive layer is formed from an adhesive compound soluble in a non-polar solvent or a highly polar solvent; and the stripping method includes the step of supplying the non-polar solvent or the highly polar solvent, so that the non-polar solvent or the highly polar solvent is retained at least on an edge portion of that surface of the laminate which faces the support plate, and on a lateral surface of the laminate.

Abstract: The invention can firmly and easily remove a finely divided weft piece without leaving the weft piece by constituting a method and an apparatus of removing weft from a cord fabric for a topping sheet in a calender line for topping rubber on a number of pieces of aligned cords by a calender roll. In the midst of transferring a cord fabric (F) transferred to a calender apparatus, weft is finely divided by passing the cord fabric (F) through weft dividing means, thereafter, a plurality of blades (45) arranged movably in a width direction on an upper face side of the cord fabric (F) are reciprocally moved in the width direction over an entire width thereof to be brought into contact with the cord fabric (F), and the divided weft piece (W1) is wiped off to remove by respectively striking respective cords (C) of the cord fabric (F) by the respective blades (45).

Abstract: There are provided an interlayer film separation solution and an interlayer film separation method capable of separating an interlayer film and a glass for a short period of time and collecting the separated interlayer film in a recyclable condition. An interlayer film separation solution 21 having etching ability for a glass is introduced into a container 22, and the introduced interlayer film separation solution 21 was controlled to a temperature of 30 to 60° C., and a laminated glass 10 with glass plates 11, 12 crushed is introduced into a barrel 23 from a lid portion 23a, and simultaneously, 50 to 60 metal pieces 25 are, introduced into the barrel 23 from the lid portion 23a in order to easily separate the laminated glass 10 into the glass plates 11, 12 and an interlayer film 13. The barrel 23 containing the laminated glass 10 and the metal pieces 25 introduced thereinto is rotated at a predetermined rotational speed.

Abstract: A process for forming a patterned thin film structure on a substrate is disclosed. A pattern is printed with a material, such as a masking coating or an ink, on the substrate, the pattern being such that, in one embodiment, the desired thin film structures will be formed in the areas where the printed material is not present, i.e., a negative image of thin film structure to be formed is printed. In another embodiment, the pattern is printed with a material that is difficult to strip from the substrate, and the desired thin film structures will be formed in the areas where the printed material is present, i.e., a positive image of the thin film structure is printed. The thin film material is deposited on the patterned substrate, and the undesired area is stripped, leaving behind the patterned thin film structures.

Abstract: A method for reworking a bonded display (e.g., a bonded LCD) having a substrate (e.g., plate or film) adhesively bonded to a face (e.g., front face) of the display. The method provides for efficient and clean removal of the substrate from the bonded display when necessary (e.g., when defect(s) are present) to afford a de-bonded display that is undamaged such that the resulting de-bonded display (e.g., de-bonded LCD) can subsequently be re-bonded as a component in a device being manufactured.