Abstract: A flexible display device and a method for changing shape of the flexible display device are provided. The flexible display device includes a flexible display panel and a shape memory structure on the flexible display panel and including a shape memory component. The shape memory component includes a first memory layer, a first thermal insulation layer and a second memory layer stacked sequentially in a direction away from the flexible display panel, the first and second memory layers each have shape memory function, the first memory layer has a first memory shape and the second memory layer has a second memory shape different from the first memory shape. The shape memory structure is configured to switch shape of the shape memory component between the first and second memory shapes by controlling temperatures of the first and second memory layers, thereby driving the flexible display panel to change shape.

Abstract: The present invention relates to a reactive hot melt adhesive composition, which at least partially loses its adhesiveness upon application of an electric voltage and thus allows debonding of substrates that have been bonded using said adhesive. Furthermore, the present invention relates to a method for its production and a method for forming a bonded substrate using such a reactive hot melt adhesive composition.

Abstract: Semiconductor device assemblies may include a carrier wafer and a thermoset adhesive on a surface of the carrier wafer. A metal barrier material may be located on the thermoset adhesive. A thermoplastic adhesive may be located on an opposite side of the metal barrier material from the thermoset adhesive. A device wafer may be located on an opposite side of the thermoplastic material from the metal barrier material. Semiconductor device processing systems may include a carrier wafer having a thermoset adhesive adhered to a surface thereof and a metal barrier material adhered to the thermoset adhesive opposite the carrier wafer. A laser apparatus may be located on an opposite side of the carrier wafer from the metal barrier material and positioned to aim a laser beam through the carrier wafer to impinge on the metal barrier material.

Abstract: A wafer chuck includes a support structure having a first side structurally configured to support a wafer, and a vacuum zone formed on the first side of the support structure. The vacuum zone may be at least partially bounded by a ring extending from a recessed surface of the first side of the support structure. The wafer chuck further includes a plurality of suction cups disposed in the vacuum zone, where one or more of the plurality of suction cups is coupled with a channel extending through the support structure. One or more vacuums are in fluid communication with the channel, where a vacuum is structurally configured to provide suction through the channel.

Abstract: A method of producing a vacuum insulated glass (VIG) unit comprising, providing first and second substantially parallel glass panes, a plurality of pillars, and a peripheral seal between the first and second glass panes; providing an evacuation hole in the first glass pane for evacuating a void through the evacuation hole to a pressure less than atmospheric pressure; covering the evacuation hole with an evacuation head, wherein the evacuation head is configured to have a substantially hermetic contact to a surface of the first glass pane; evacuating the void through the evacuation head, wherein the evacuation head comprises a ceramic heating element; and heating the ceramic heating element and sealing an evacuation tube tip of an evacuation tube disposed in the evacuation hole.

Abstract: A method of manufacturing an electronic device includes: in transferring one or a plurality of element sections onto a first substrate from a second substrate, forming part or all of the one or the plurality of element sections on the second substrate with a resin layer in between; peeling off the one or the plurality of element sections that are formed on the second substrate from the second substrate through laser irradiation performed on the resin layer, and disposing, onto the first substrate, the one or the plurality of element sections peeled off; and using, as the resin layer, resin having glass-transition temperature and thermal decomposition temperature that differ from each other by 150 degrees centigrade or less.

Abstract: Methods of detaching semiconductor device structures from carrier structures may involve directing a laser through a carrier structure comprising a semiconductor material to a barrier material located between the carrier structure and a semiconductor device structure adhere to an opposite side of the barrier material. A bond between the carrier structure and an adhesive material temporarily securing the carrier structure to the semiconductor device structure may be released in response to heating of the barrier material by the laser beam. The carrier structure may be removed from the semiconductor device structure, the barrier material removed, and an adhesive bonding the semiconductor device structure to the barrier material removed.

Abstract: Methods processing substrates are provided. The method may include providing a bonding layer between a substrate and a carrier to bond the substrate to the carrier, processing the substrate while the substrate is supported by the carrier, and removing the bonding layer to separate the substrate from the carrier. The bonding layer may include a thermosetting glue layer and thermosetting release layers provided on opposing sides of the thermosetting glue layer.

Abstract: Large area graphene (LAG) sheets can be embedded in a polymer-based material as a mechanical reinforcement or to otherwise enhance the properties of the polymer-based material. The LAG sheets can be nanoperforated and/or functionalized to enhance interaction between the graphene and the polymer. Reactive functional groups can facilitate formation of covalent bonds between the graphene and the polymer so that the LAG sheets become an integral part of the cross-linked structure in curable polymer-based materials. Nanoperforations in the LAG sheets provide useful sites for the functional groups and can allow cross-links to form through the nanoperforations.

Abstract: An embodiment method for separating semiconductor devices from a wafer comprises using a carrier which acts an adjustable adhesive force upon the semiconductor devices and removing the semiconductor devices from the carrier by applying a mechanical or acoustical impulse to the carrier.

Abstract: A method of repairing a semiconductor device includes turning a press member to apply pressure on an electronic component which is mounted on a substrate. A heat sink which is provided on the electronic component via a bonding layer is thus displaced with respect to the electronic component in a transverse direction. The heat sink is removed from the electronic component by shearing the bonding layer with the press member.

Abstract: A method for removing a label affixed to a material includes exposing the label to one or more of heat, hot gas, or hot liquid having a predetermined temperature, in the absence of any caustic solution, for a period sufficient for the label to release from the material to which it was affixed.

Abstract: Provided is a method of disassembling a photovoltaic module. The method includes: applying heat to the photovoltaic module in an oxidizing atmosphere; removing an insulating protective layer wrapping a photovoltaic cell of the photovoltaic module; and obtaining the photovoltaic cell of the photovoltaic module.

Abstract: A device for peeling off silicon wafers, including: a supporting member that is configured to support a board-shaped member to which plural silicon wafers are bonded via an adhesive; a heating unit for heating the board-shaped member; a shifting mechanism that is configured to shift, in a horizontal direction, the supporting member relatively with respect to the heating unit; a peeling-off mechanism that is configured to peel off the silicon wafers one by one; and a container for allowing the silicon wafers, the board-shaped member and the supporting member to soak in a liquid.

Abstract: In some embodiments, a method of manufacturing electronic devices including providing a carrier substrate having a first side, a second side, and a first adhesive at the first side; providing a first flexible substrate; and bonding the first flexible substrate to the first side of the carrier substrate. The first adhesive bonds the first flexible substrate to the first side of the carrier substrate. The carrier substrate comprises a mechanism configured to compensate for a deformation of the carrier substrate. Other embodiments are disclosed.

Abstract: An adhesive article includes a first substrate, a first adhesive layer positioned adjacent the first substrate, a second substrate, and a first meltable layer positioned adjacent to the first adhesive layer and the second substrate. The meltable layer has a ring and ball (R&B) softening point of between about 60° C. and about 180° C.

Abstract: A method for debonding two temporary bonded wafers, includes providing a debonder comprising a top chuck assembly, a bottom chuck assembly, a static gantry supporting the top chuck assembly, an X-axis carriage drive supporting the bottom chuck assembly and an X-axis drive control configured to drive horizontally the X-axis carriage drive and the bottom chuck assembly from a loading zone to a process zone under the top chuck assembly and from the process zone back to the loading zone. Next, loading a wafer pair comprising a carrier wafer bonded to a device wafer via an adhesive layer upon the bottom chuck assembly at the loading zone oriented so that the unbonded surface of the device wafer is in contact with the bottom assembly. Next, driving the X-axis carriage drive and the bottom chuck assembly to the process zone under the top chuck assembly. Next, placing the unbonded surface of the carrier wafer in contact with the top chuck assembly and holding the carrier wafer by the top chuck assembly.

Abstract: A washable label may include a heat-shrinkable layer and a heat-activatable layer. The label may be attached to an item by a method including: heating a portion of the heat-activatable layer by intense visible or infrared light so as to transform the surface of the heat-activatable layer from a non-tacky state to a tacky state, and attaching the label to the item when the surface of the heat-activatable layer is in the tacky state, wherein the intensity of the light is selected such that spatially averaged temperature of the heat-shrinkable layer remains lower than the threshold shrinking temperature of the heat-shrinkable layer. The label may be easily separated from the item by heating the label such that shrinking of the heat-shrinkable layer peels at least a portion of the label away from the item.

Abstract: A method of fabricating a crystal oscillator includes applying an adhesive to an electrode pad; determining whether the applied adhesive is in an area outside of the electrode pad; removing at least part of the adhesive in the area outside of the electrode pad using a laser beam when a portion of the applied adhesive is determined to be in the area outside of the electrode pad; and disposing an electrode of a crystal resonator on the adhesive applied to the electrode pad.

Abstract: A method and apparatus for replacement of damages display shield (typically glass) covering a display screen on a device, typically a mobile phone. Mobile phones have an electronic display protected by a glass shield. Between the glass and the display is often a plastic polarizing or other intermediary sheet. Removal of a damage glass can be accomplished by cutting thru the polarizer with a moving wire or blade. This separates the glass from the sensitive display and allows replacement of the glass without damaging the more expensive display.

Abstract: The present invention relates to a process for retreading a radial tyre (1) for a motor vehicle, comprising: a crown (2) comprising a tread (3) provided with at least a radially outer part (3a) intended to come into contact with the road; two non-stretchable beads (4), two sidewalls (5) connecting the beads (4) to the tread (3), a carcass reinforcement (6) passing into the two sidewalls (5) and anchored in the beads (4); a crown reinforcement or belt (7) positioned circumferentially between the radially outer part (3a) of the tread (3) and the carcass reinforcement (6); a radially inner elastomer layer (8), referred to as “underlayer”, having a formulation different from the formulation of the radially outer part (3a) of the tread, this underlayer being itself positioned circumferentially between the radially outer part (3a) of the tread (3) and the crown reinforcement (7); the said underlayer comprising at least one thermoplastic elastomer, the said thermoplastic elastomer being a block copolymer compri

Abstract: Systems and methods of separating bonded wafers are disclosed. In one embodiment, a system for separating bonded wafers includes a support for the bonded wafers and means for applying a sheer force to the bonded wafers. The system also includes means for applying a vacuum to the bonded wafers.

Abstract: A peeling apparatus for peeling a device substrate from a stacked workpiece obtained by attaching the device substrate through a thermoplastic adhesive to a support substrate. The peeling apparatus includes a first surface plate having a first holding surface for holding the entire surface of the support substrate under suction and a first heating member for heating the first holding surface, a second surface plate having a second holding surface for holding the entire surface of the device substrate under suction and a second heating member for heating the second holding surface, and a moving unit for relatively moving the first surface plate and the second surface plate so that the first holding surface and the second holding surface are relatively moved away from each other in a direction perpendicular to the first holding surface and the second holding surface.

Abstract: A support assembly includes a first functional element, a second functional element adjacent to the cooling plate, and an adhesive layer disposed between the cooling plate and the substrate. An intermediate layer is disposed between the cooling plate and the substrate. The intermediate layer has a melting temperature less than a temperature that the adhesive layer melts or decomposes at in order to provide for recycling of the support assemblycar.

Abstract: Disclosed is a method for detaching two plates bonded through a double-coated pressure-sensitive adhesive sheet without substantially applying such a force (load) to the plates as to cause large distortion (deformation) leading to fracture or breakage of the plates. The method detaches two plates bonded through a double-coated pressure-sensitive adhesive sheet by applying a force to at least one of the two plates at least in a direction normal to the plate at such a temperature that the double-coated pressure-sensitive adhesive sheet has a storage elastic modulus of 1.0×107 Pa or more as measured by dynamic viscoelastic measurement.

Abstract: A debonder apparatus for debonding two via an adhesive layer temporary bonded wafers includes a top chuck assembly, a bottom chuck assembly, a static gantry supporting the top chuck assembly, an X-axis carriage drive supporting the bottom chuck assembly, and an X-axis drive control. The top chuck assembly includes a heater and a wafer holder. The X-axis drive control drives horizontally the bottom chuck assembly from a loading zone to a process zone under the top chuck assembly and from the process zone back to the loading zone. A wafer pair comprising a carrier wafer bonded to a device wafer via an adhesive layer is placed upon the bottom chuck assembly at the loading zone oriented so that the unbonded surface of the device wafer is in contact with the bottom assembly and is carried by the X-axis carriage drive to the process zone under the top chuck assembly and the unbonded surface of the carrier wafer is placed in contact with the top chuck assembly.

Abstract: The present invention relates to a method for transferring graphene using a hot press, comprising: a step of contacting graphene, having a thermal-releasable sheet attached thereto, with a target substrate; and a step of pressing and heating the graphene having the thermal-releasable sheet attached thereto and the target substrate using the upper press and lower press of a hot press so as to separate the thermal-releasable sheet and the graphene and transfer the separated graphene to the target substrate. The present invention also relates to a graphene-transfer hot press apparatus for said transfer process.

Abstract: A method for disconnecting a first mechanical part from a second magnetic mechanical part, the first mechanical part being adhered to the second magnetic mechanical part by an adhesive film along a connecting area. In the method, a magnetic field is generated at least within the connecting area so as to generate, by induction, eddy currents in the second magnetic mechanical part, to soften the adhesive film and enable disconnection of the first and second mechanical parts.

Abstract: The method and the apparatus are used for preparing fold lines on laminated materials on the basis of cardboard. At least one region intended for providing the fold line is subjected to heat such that an at least partial local reduction of shear fracture stresses of the material is produced in said region. The application of heat is done using a heating device, which is disposed adjacent to a guide device for the laminate. The local reduction of the shear fracture stresses supports local delamination, which supports the formation of a folding joint.

Abstract: A method and apparatus for replacement of damages display shield (typically glass) covering a display screen on a device, typically a mobile phone. Mobile phones have an electronic display protected by a glass shield. Between the glass and the display is often a plastic polarizing or other intermediary sheet. Removal of a damage glass can be accomplished by cutting thru the polarizer with a moving wire or blade. This separates the glass from the sensitive display and allows replacement of the glass without damaging the more expensive display.

Abstract: An adhesive resin composition of the present invention includes an expandable sticky polymer having a structure derived from a Meldrum's acid derivative, or a Meldrum's acid derivative represented by the following general formula (1) and an adhesive resin.

Abstract: A laminate including a supporting member which is light transmissive; a supported substrate which is supported by the supporting member; an adhesive layer which is provided on a surface of the supported substrate on which surface the supported substrate is supported by the supporting member; and a release layer, which (i) is provided between the supporting member and the supported substrate and (ii) contains a polymer including, in a repeating unit, a structure having a light absorption property, a property of the polymer being changed when the polymer absorbs light irradiated via the supporting member.

Abstract: In an embodiment of the disclosure, there is provided a method and system for recycling a cured composite laminate material into a delaminated recyclate that maintains a fiber volume fraction and a lamina level fiber alignment substantially the same as the cured composite laminate material. The method provides a cured composite laminate material having a fiber volume fraction and a lamina level fiber alignment. The cured composite laminate material undergoes solvent soak preconditioning, liquid solvent removal, pre-heating, and rapid heating with phase change delamination of the cured composite laminate material to obtain the delaminated recyclate that maintains a fiber volume fraction and a lamina level fiber alignment substantially the same as the cured composite laminate material.

Abstract: Improved semiconductor wafer debonding system, method, and apparatus, including a stress-free means for multi-axis debonding utilizing a specialized tool or fixture having at least one ultrasonic transducer.

Abstract: A method for transfer of a two-dimensional material includes forming a spreading layer of a two-dimensional material on a substrate, the spreading layer having a monolayer. A stressor layer is formed on the spreading layer, and the stressor layer is configured to apply stress to a closest monolayer of the spreading layer. The closest monolayer is exfoliated by mechanically splitting the spreading layer wherein the closest monolayer remains on the stressor layer.

Abstract: A separation apparatus for separating a superposed substrate into a processing target substrate and a supporting substrate, includes: one holding part holding the processing target substrate via a tape; another holding part holding the supporting substrate; and a moving mechanism moving the another holding part in a vertical direction while holding an outer peripheral portion thereof to continuously separate the supporting substrate held by the another holding part from the processing target substrate held by the one holding part starting from an outer peripheral portion toward a central portion of the supporting substrate, wherein the moving mechanism includes: a first moving part holding the another holding part and moving only the outer peripheral portion of the another holding part in the vertical direction; and a second moving part moving the first moving part and the another holding part in the vertical direction.

Abstract: A heat-debonding adhesive member is provided. The heat-debonding adhesive member attaches electronic device components such as a battery and a housing together. The heat-debonding adhesive includes a heat-generating layer that generates heat for debonding structures that are attached together using the adhesive member. The heat-generating layer includes a conductive layer that generates heat when a current flows through the conductive layer. The heat-debonding adhesive includes additional adhesive layers such as a voided polymer film having air-filled voids and one or more pressure-sensitive adhesive layers. A debonding tool provides current to conductive contacts on the conductive layer for generating heat in the heat-generating layer when it is desired to debond the structures that are attached together using the adhesive member.

Abstract: A method of separating a wafer from a carrier includes placing a wafer assembly on a platform. The wafer assembly includes the wafer, the carrier, and a layer of wax between the wafer and the carrier. A wafer frame is mounted on the wafer of the wafer assembly. The layer of wax is softened. The wafer and the wafer frame mounted thereon are separated, by a first robot arm, from the carrier.

Abstract: A next processing pin is applied as a follow-on pin to a stone, wherein the stone is held by a preceding pin and fixed to the stone by way of a first adhesive bonding location. The preceding pin is separated from the stone. The follow-on pin is fixed to the stone by way of a second adhesive bonding location spaced from the first adhesive bonding location. The follow-on pin frontally receives a fluid adhesive at a spacing from the stone and the spacing between the adhesive-coated front end and the stone is reduced until the adhesive front end contacts the stone. The adhesive is hardened at the contact location as the second adhesive bonding location and heat is transferred by way of the preceding pin to the first adhesive bonding location A force component is exerted on the preceding pin to release the pin from the stone and to hold the stone with the next pin.

Abstract: Implementations and techniques for removing and segregating components from printed circuit boards are generally disclosed.

Abstract: One exemplary method includes providing a first polymer and a second polymer each comprising a first shape memory polymer backbone having at least one surface free side chain, the first polymer and the second polymer each transformable between a permanent shape and a temporary shape; creating an adhesive bond between the first polymer and the second polymer, wherein the creating of the adhesive bond transforms the first polymer to its temporary shape and transforms the second polymer to its temporary shape; and wherein the at least one surface free chain of the first polymer in its temporary shape is interdiffused with the at least one surface free chain of the second polymer in its temporary shape by the creation of the adhesive bond.

Abstract: The present disclosure generally describes techniques suitable for use in the construction or recycling of composite materials, such as thermoplastics. A coated thermoplastic article may comprise a thermoplastic portion coupled to a supramolecular polymer interface layer, with a coating layer applied to a surface of the supramolecular polymer interface layer. Application of heat to the coated thermoplastic article may cause the supramolecular polymer interface layer to undergo a phase change, allowing the coating layer to be removed from the thermoplastic portion. Application of force to the coated thermoplastic article may enhance the removal of the coating layer. Embodiments of methods, compositions, articles and/or systems may be disclosed and claimed.

Abstract: A method is described for forming a permanently supported thin lamina using decomposable adhesives between a lamina and a temporary support element. The temporary support element may be bonded to a first surface of the lamina. A permanent support element may be applied to a second surface of the lamina, and the temporary support element debonded from the lamina by decomposing the adhesive.

Abstract: Provided is a method of manufacturing a translucent rigid substrate laminate, which method can improve position precision while increasing production efficiency. Further provided is a translucent rigid substrate bonding apparatus that contributes to improvement of the position precision while increasing production efficiency of a plate-shaped product. In the method of manufacturing a translucent rigid substrate laminate and the translucent rigid substrate bonding apparatus according to the present invention, when translucent rigid substrates are bonded in a predetermined positional relationship by interposing a photo-curable fixing agent including (A) polyfunctional (meth)acrylate, (B) monofunctional (meth)acrylate and (C) a photopolymerization initiator therebetween, only the fixing agent present in outer peripheral portions of both translucent rigid substrates is cured for provisional fastening.

Abstract: A method for fabricating a display device 1 includes a first step of attaching a display panel and a first substrate member to each other with a first adhesive sandwiched between the display panel and the first substrate member, and a second step of attaching a second substrate member to the first substrate member on a surface of the first substrate member opposite to the display panel with a second adhesive sandwiched between the first and second substrate members, where the second step is carried out subsequently to the first step. The second adhesive used in the second step has a glass transition point higher than a glass transition point of the first adhesive.

Abstract: A method includes receiving a carrier with a release layer formed thereon. A first adhesive layer is formed on a wafer. A second adhesive layer is formed over the first adhesive layer or over the release layer. The carrier and the wafer are bonded with the release layer, the first adhesive layer, and the second adhesive layer in between the carrier and the wafer.

Abstract: An object of the invention is to provide a pressure-sensitive adhesive optical film-peeling method capable of easily detaching the pressure-sensitive adhesive optical film from a glass substrate with no damage to the glass substrate or no adhesive deposit on the glass substrate, and to provide a pressure-sensitive adhesive optical film suitable for use in such a peeling method. The invention is directed to a method for peeling a pressure-sensitive adhesive optical film from an optical film-carrying glass substrate including a glass substrate and the pressure-sensitive adhesive optical film bonded thereto, which includes: exposing the optical film-carrying glass substrate to an environment at a temperature of 40 to 98° C. and a relative humidity of 60 to 99% for three minutes or more; and then peeling the pressure-sensitive adhesive optical film from the glass substrate under the environment.

Abstract: One exemplary embodiment includes a thermo-reversible polymer adhesive including a dry adhesive layer and shape memory polymer layer, the shape memory polymer material capable of transitioning from a first shape to a second shape upon heating and imposition of a load to conform to the surface topography of a substrate to which the adhesive is applied.

Abstract: An electrode mask for electrowinning a metal is provided. An example technique forms openings in a solid nonconductive sheet, such as vinyl, polyvinyl chloride (PVC), or other plastic and adheres the sheet as a solid to a cathode surface as a mask. The mask protects the cathode surface from electrical interaction with an electrolyte, while the openings allow controlled electrodeposition of a metal in harvestable rounds, which can be stripped from the cathode. The electrode mask is reusable, and easily removed for recycling and replacement. A matrix design engine calculates pattern and sizes for the openings in the mask to optimize electrodeposition of the metal based on multiple parameters including the metal to be deposited, ions present in an electrolyte, electrolyte concentration, pH level, voltage, electrical current density, solution temperature, electrode temperature, or plating time.

Abstract: During the joining of PTFE parts (10), a binder (20) is applied to the joint surfaces of the PTFE parts, e.g. by welding, before the parts are joined. By establishing a bond between PTFE and binder in a separate, initial process, the parameters of this initial process may be determined regardless of other conditions, such as maintaining the dimensions, and the quality of this bond may be controlled and approved before the subsequent joining of the PTFE parts. During the subsequent joining, the temperature may be kept at a level, which is sufficiently low so as not to deform the PTFE material permanently, or the joining may be carried out by a process, which does not require heating, for example gluing.