Utilizing Formed Bubble Patents (Class 165/104.29)
  • Patent number: 10612811
    Abstract: A housing for an electronic device includes a rear wall with an exterior surface, a top wall, a ledge with an exterior surface, and an air outlet formed between the top wall and the ledge. The ledge is positioned below the top wall. The exterior surface of the ledge is positioned at an exterior angle less than 90° relative to the exterior surface of the rear wall.
    Type: Grant
    Filed: May 2, 2017
    Date of Patent: April 7, 2020
    Assignee: Johnson Controls Technology Company
    Inventor: Daniel J. Spors
  • Patent number: 10602638
    Abstract: In one or more embodiments, energy transfer device may include: a sealed housing having an evaporating region and a condensing region; a fluid; a Tesla valve enclosed in the housing, between the evaporating region and the condensing region and configured to transfer the fluid in a gaseous state from the evaporating region to the condensing region; and a first liquid fluid transfer structure enclosed in the housing, between the first condensing region and the first evaporating region and configured to transfer the fluid in a liquid state from the first condensing region to the first evaporating region. In one example, the liquid fluid transfer structure may include the Tesla valve. In another example, the liquid fluid transfer structure may include metal sintered particles. In one or more embodiments, the fluid may include one or more of acetone, ammonia, water, and a chlorofluorocarbon, among others.
    Type: Grant
    Filed: March 1, 2018
    Date of Patent: March 24, 2020
    Assignee: Dell Products L.P.
    Inventors: Travis Christian North, Qinghong He
  • Patent number: 10321609
    Abstract: A cooling system includes an immersion tank that includes a liquid coolant sealed therein, a housing that includes through-holes formed in a top portion and a bottom portion thereof, respectively, and disposed within the immersion tank, an electronic device disposed in the housing in a state of being immersed in the coolant, a coolant flow path formed between an inner surface of the immersion tank and an outer surface of the housing to couplet he through-hole in the top portion of the housing to the through-hole in the bottom portion of the housing so that the coolant flows therethrough, and a heat transfer member that transports heat of the coolant in the coolant flow path to an outside of the immersion tank.
    Type: Grant
    Filed: October 19, 2017
    Date of Patent: June 11, 2019
    Assignee: FUJITSU LIMITED
    Inventors: Keita Hirai, Tsuyoshi So, Naofumi Kosugi
  • Publication number: 20150138723
    Abstract: A method of cooling two or more heat-providing surfaces using a cooling apparatus having two or more fluidly connected heat sink modules in a series configuration can include providing a flow of single-phase liquid coolant to a first heat sink module mounted on a first heat-providing surface. The method can include projecting the flow of single-phase liquid coolant against the first heat-providing surface within the first heat sink module and causing phase change of a first portion of the liquid coolant and thereby forming two-phase bubbly flow with a first quality. The method can include transporting the two-phase bubbly flow to a second heat sink module and projecting the two-phase bubbly flow against a second heat-providing surface within the second heat sink module and causing phase change of a second portion of the coolant and formation of two-phase bubbly flow with a second quality greater than the first quality.
    Type: Application
    Filed: February 2, 2015
    Publication date: May 21, 2015
    Inventors: Timothy A. Shedd, Brett A. Lindeman
  • Patent number: 8933860
    Abstract: A thermal management system and method for active cooling of high speed seeker missile domes or radomes comprising bonding to an IR dome or RF radome a heat pipe system having effective thermal conductivity of 10-20,000 W/m*K and comprising one or more mechanically controlled oscillating heat pipes, employing supporting integrating structure including a surface bonded to the IR dome or RF radome that matches the coefficient of thermal expansion the dome or radome material and that of said one or more mechanically controlled oscillating heat pipes, and operating the heat pipe system to cool the IR dome or RF radome while the missile is in flight.
    Type: Grant
    Filed: June 12, 2013
    Date of Patent: January 13, 2015
    Assignees: Integral Laser Solutions, Inc., The Curators of the University of Missouri
    Inventors: LaVerne Arthur Schlie, Hongbin Ma
  • Patent number: 8919426
    Abstract: A heat pipe device and a corresponding method in which micro-channel embedded pulsating heat pipes are incorporated into a substrate. A volume of fluid in a vacuum is introduced into a micro-channel which will become slugs of liquid. Heating of the contents of the micro-channel at an evaporator region (heat source) will cause vaporization within the micro-channel and cooling at a heat sink will cause condensation within the micro-channel, acting to both drive fluid flow within the micro-channel and efficiently transfer heat. Such devices could be used in a number of different configurations, including one as a stacked set of micro-channel embedded substrates.
    Type: Grant
    Filed: October 22, 2007
    Date of Patent: December 30, 2014
    Assignee: The Peregrine Falcon Corporation
    Inventor: Robert E. Hardesty
  • Patent number: 8848371
    Abstract: A cooling system has an inlet plenum and at least one cooling channel which communicates with the inlet plenum. The cooling channel passes adjacent to a component to be cooled from an upstream inlet to a downstream outlet. A pair of electrodes are positioned adjacent the inlet to create an electric field tending to resist a bubble formed in an included dielectric liquid from moving in an upstream direction due to a dielectrophoretic force. Instead, a dielectrophoretic force urges the bubble in a downstream direction.
    Type: Grant
    Filed: October 1, 2012
    Date of Patent: September 30, 2014
    Assignee: Hamilton Sundstrand Corporation
    Inventor: Matthew Robert Pearson
  • Patent number: 8763681
    Abstract: An evaporator for a cooling circuit is provided, for cooling at least one heat emitting device by evaporation of a cooling fluid. The evaporator includes a top collector, a bottom collector, and an evaporator body. The evaporator body includes at least one thermoconducting wall that is thermally connectable to the at least one heat emitting device, a plurality of evaporation channels, and a plurality of return channels.
    Type: Grant
    Filed: August 3, 2010
    Date of Patent: July 1, 2014
    Assignee: ABB Research Ltd
    Inventors: Francesco Agostini, Berk Yesin, Bruno Agostini
  • Patent number: 8636052
    Abstract: An integrated circuit dual-fluid heat exchanger has a housing containing first and second immiscible fluids. A heat-introducing base element contacts the first fluid. A heat-receiving surface on the base element is configured for interfacial contact with a heat-radiating surface of an integrated circuit device. A heat-removing condenser element contacts the second fluid, or is separated therefrom by a gap. The first and second fluids are selected to controllably remove heat from the integrated circuit device by forming heated mass units of the first fluid that migrate through the second fluid and come into contact with the condenser element, where they are cooled and allowed to return to the base element. A heat-expulsion portion on the condenser element is configured to dissipate heat removed by the condenser element to an exterior environment outside the heat exchanger.
    Type: Grant
    Filed: September 8, 2009
    Date of Patent: January 28, 2014
    Assignee: International Business Machines Corporation
    Inventors: Eric Kline, Paul N. Krystek, Paul R. Michels, Susan J. Swenson, Stephen M. Zins
  • Publication number: 20130319639
    Abstract: In a cooling device using an ebullient cooling system, it is difficult to improve the cooling performance without increasing manufacturing costs, therefore, a cooling device according to an exemplary aspect of the invention includes a heat receiving unit storing a refrigerant and receiving the heat from an object to be cooled; a heat radiating unit radiating heat by condensing and liquefying a vapor-state refrigerant arising from a refrigerant vaporizing in the heat receiving unit; and a connection connecting the heat receiving unit to the heat radiating unit; wherein the heat receiving unit includes a base thermally contacting with the object to be cooled, and a container connected to the connection; the base includes a heat receiving unit outer wall composing a part of an outer wall of the heat receiving unit, and a plurality of projections disposed on a heat receiving unit undersurface of an undersurface at an inner wall side contacting with the refrigerant; the base includes a bubble nucleus forming surfa
    Type: Application
    Filed: February 17, 2012
    Publication date: December 5, 2013
    Applicant: NEC CORPORATION
    Inventors: Hitoshi Sakamoto, Minoru Yoshikawa, Masaki Chiba, Kenichi Inaba, Arihiro Matsunaga
  • Publication number: 20130048254
    Abstract: A heat transfer bridge for absorbing heat from electronic circuits and electrical distribution transformers to thereby cool said components is disclosed. The heat transfer bridge includes a passive pump for pumping a fluid having a low boiling point that readily creates bubbles when heated to its boiling point. The bubbles are directed via selected flow paths to effectively push or drive the fluid from adjacent a heat source such as an electronic circuit or transformer to heat dissipating components such as cooling fins. In one embodiment, the fluid in the inventive heat transfer bridge comprises a fluid comprising metallic slurry that provides many times the heat dissipation rate as compared to a clear fluid.
    Type: Application
    Filed: March 5, 2012
    Publication date: February 28, 2013
    Inventor: Troy W. Livingston
  • Publication number: 20130020053
    Abstract: Systems and fabrication methods are disclosed for a heat spreader to cool a device. The heat spreader has first and second opposing proximal surfaces defining a chamber having a liquid therein; and one or more structures mounted in the chamber to induce a liquid flow pattern during a boiling of the liquid to distribute heat.
    Type: Application
    Filed: June 6, 2012
    Publication date: January 24, 2013
    Inventors: Seung Mun You, Joo Han Kim, Sang M. Kwark, Jesse Jaejin Kim
  • Publication number: 20120285664
    Abstract: An enhanced boiling apparatus includes a substrate having at least one heated region, at least one outer surface, and one or more asymmetric shaped cavities extending into the substrate along the at least one outer surface. Each of the one or more asymmetric shaped cavities has a sidewall which intersects at a corner with a bubble pathway surface with a different slope from the sidewall. Each of the asymmetric shaped cavities is configured to non-gravitationally direct fluid that is moving along the sidewall out along the bubble pathway surface.
    Type: Application
    Filed: May 14, 2012
    Publication date: November 15, 2012
    Applicant: ROCHESTER INSTITUTE OF TECHNOLOGY
    Inventor: Satish G. Kandlikar
  • Publication number: 20120247737
    Abstract: A cooling chamber for computers and for electronic components includes a conductive chamber containing a low boiling point fluid. The components are mounted in the chamber to be bathed by the fluid. The heat energy developed by the components causes the fluid to reach a temperature above the boiling point thus forming bubbles. Bubble guide tubes guide the bubbles upwardly, and fluid confined in the tubes between the bubbles is moved (pushed) upwardly. The cumulative action of the bubbles will cause circulation of the fluid in the chamber thus circulating fluid flow around the electronic components and flow around the chamber. Cooling fins mounted on the exterior of the chamber dissipate the heat generated by the components.
    Type: Application
    Filed: March 5, 2012
    Publication date: October 4, 2012
    Inventor: Troy W. Livingston
  • Publication number: 20120097373
    Abstract: A method and apparatus for pool boiling includes introducing a fluid into a chamber of a housing which has one or more protruding features. One or more diverters extend at least partially across the one or more protruding features in the chamber. One or more bubbles are formed in the fluid in the chamber as a result of bubble nucleation. At least one of growth and motion of the one or more of the bubbles are diverted with the one or more diverters to generate additional localized motion of the fluid along at least one of the one or more protruding features and other surfaces in the chamber of the housing to at least one of transfer additional heat to the liquid and increase the critical heat flux limit.
    Type: Application
    Filed: October 25, 2010
    Publication date: April 26, 2012
    Applicant: Rochester Institute of Technology
    Inventor: Satish G. Kandlikar
  • Publication number: 20100300657
    Abstract: An ebullient cooling device that can maintain favorable cooling-medium circulation is provided. An ebullient cooling device according to the present invention is characterized in that it is an ebullient cooling device that includes a heat receiving unit to which a heating element is installed, and which has a cooling medium in the inside, a condensing unit which communicates with the heat receiving unit, and which condenses the cooling medium that has been boiled by means of heat resulting from the heating element, a cooling-medium circulating unit which communicates with the heat receiving unit and condensing unit, into which the cooling medium having been condensed at the condensing unit flows and additionally which supplies the cooling medium to the heat receiving unit, and an inner bottom face of the condensing unit includes a guiding portion which guides the cooling medium to the cooling-medium circulating unit by means of gravity.
    Type: Application
    Filed: November 20, 2008
    Publication date: December 2, 2010
    Applicant: KABUSHIKI KAISHA TOYOTA JIDOSHOKKI
    Inventor: Satoshi Hariu
  • Patent number: 7841387
    Abstract: A pump-free water-cooling system includes a heat-exchange circulating solution container containing heat-exchange circulating solution and vapor of the circulating solution, at least one solution outlet to discharge the circulating solution from the container, and a gas-liquid two-phase fluid inlet to charge into the container gas-liquid two-phase fluid composed of the circulating solution. The system also includes a circulating-solution transporting route in which a first transportation route is linked to a second transportation route which is linked to a third transportation route. A sensible-heat-emitting heat exchanger is provided along the first transportation route. The first transportation route is linked with the solution outlet. Heat exchange is carried out along the second transportation route at least between circulating solution therein and the circulating solution in the container. A heating heat exchanger is provided along the third transportation route.
    Type: Grant
    Filed: May 21, 2008
    Date of Patent: November 30, 2010
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Shigetoshi Ippoushi, Nobuaki Uehara, Akira Yamada, Tetsuro Ogushi
  • Patent number: 7828047
    Abstract: A cooling unit has a heat receiving unit that receives heat from a body radiating heat; a radiator disposed at a distance from the heat receiving unit and radiating recovered heat; a liquid coolant transporting heat generated at the heat receiving unit to the radiator; and a hollow tube disposed so that the liquid coolant circulates between the heat receiving unit and the radiator, a circulating flow of the liquid coolant formed by an elevating force of air bubbles generated from the heat received at the heat receiving unit, the radiator having an air pocket forming one part of the circulation path of the liquid coolant together with the hollow tube and capable of collecting the air bubbles.
    Type: Grant
    Filed: December 28, 2007
    Date of Patent: November 9, 2010
    Assignee: Fujitsu Limited
    Inventors: Ryuuji Miyazaki, Masumi Suzuki, Minoru Hirano
  • Publication number: 20100132384
    Abstract: A thermal energy transfer system utilizes a composition containing one or more polyols, such as 1,3-propanediol, and one or more ionic liquids as a thermal energy transfer composition. There is also provided a method of transferring thermal energy and a process for temperature adjustment, either cooling or heating, using such a composition.
    Type: Application
    Filed: April 3, 2008
    Publication date: June 3, 2010
    Inventors: Mark Brandon Shiflett, Akimichi Yokozeki
  • Publication number: 20100126702
    Abstract: The present invention provides a high-efficient method for cooling a structure by spraying water. An air/water mixture (31) including microbubbles each having a diameter of 75 ?m or less is generated by an air/water mixture generating unit (29) mounted in a part extending from a water supply source (2a) to a water spray port (7, 30, 49), the water spray port (7, 30, 49), or in a water tank (14). By spraying the generated air/water mixture (31) from the water spray port (7, 30, 49), a target surface such as a roof (24a) of a structure (24) is covered with the air/water mixture (31), and the target surface is cooled by heat of evaporation of water.
    Type: Application
    Filed: November 21, 2007
    Publication date: May 27, 2010
    Inventors: Itsuki Tsunemori, Kazuo Nagahashi
  • Publication number: 20100061062
    Abstract: The present invention relates to a multi-orientational cooling system with a bubble pump for generation of a circulating flow of cooling fluid. The cooling system is a closed cooling system comprising at least one hollow member facilitating flow of the cooling fluid, comprising a first heat-receiving part, a heat-emitting part, and a tubular first part adapted for functioning, in a first angular orientation of the system, as a first bubble pump for generation of a fluid flow in the system and being positioned down-stream the first heat-receiving part, and a tubular second part adapted for functioning, in a second angular orientation of the system, as a second bubble pump for generation of a fluid flow in the system and being positioned downstream the first heat-receiving part.
    Type: Application
    Filed: December 23, 2005
    Publication date: March 11, 2010
    Applicant: Noise Limit ApS
    Inventors: Henry Madsen, Henrik Olsen
  • Publication number: 20090260783
    Abstract: The invention provides a boil cooling method, a boil cooling apparatus, a flow channel structure, and applied products thereof, by which noise and vibration attending on cooling by microbubble emission boiling can be effectively reduced, and efficient boil cooling can be realized. A subcooled cooling liquid is caused to flow through a flow channel structure, which is formed by using a surface of an object 10 to be cooled as a surface 10A to be cooled and the surface 10A to be cooled as a tubular wall and has a tubular flow channel 16, through which the subcooled cooling liquid is caused to flow, and a structure that a group of rigid needles N1, N2, . . . Ni . . . is protruded within the tubular flow channel 16 from the tubular wall of the tubular flow channel, thereby conducting cooling by microbubble emission boiling.
    Type: Application
    Filed: March 6, 2007
    Publication date: October 22, 2009
    Applicant: TOKYO UNIVERSITY OF SCIENCE EDUCATIONAL FOUNDATION
    Inventors: Koichi Suzuki, Yosuke Goto
  • Patent number: 7499278
    Abstract: The method and apparatus of the present invention dissipate heat from an electronic device to provide an efficient and universally applied thermal solution for high heat generating electronic devices. The apparatus comprises an evaporator, a condenser, a heater and conduits. The evaporator, condenser, and conduits define a closed system that has an interior volume which is partially filled with a liquid coolant. The evaporator is thermally connected to an electronic device, such as a processor, and removes thermal energy from the processor by evaporating the liquid coolant. When the apparatus is oriented such that no liquid coolant is in contact with the evaporator, the heater applies thermal energy to the coolant until the coolant begins to boil. Boiling the liquid coolant causes bubbles to form within the liquid coolant. The volume of the bubbles generated by boiling raises the level of the liquid coolant within the closed system until the liquid coolant comes into contact with the evaporator.
    Type: Grant
    Filed: September 16, 2005
    Date of Patent: March 3, 2009
    Assignee: Intel Corporation
    Inventors: Ioan Sauciuc, Ward Scott, Gregory M. Chrysler
  • Publication number: 20090008077
    Abstract: A cooling apparatus includes a brine circuit through which brine flows, a pump disposed on the brine circuit, and a heat exchanger unit including a heat absorbing member and a heat radiating member. The heat absorbing member is in communication with the brine circuit. The heat absorbing member is capable of conducting heat generated from a cooling object to the brine for cooling the cooling object. The heat radiating member is in communication with the brine circuit and capable of receiving the heat from the brine. The brine circuit is configured such that the brine passes through the heat exchanger unit at a pressure equal to or lower than an atmospheric pressure.
    Type: Application
    Filed: June 30, 2008
    Publication date: January 8, 2009
    Applicant: DENSO CORPORATION
    Inventors: Takahisa Fujii, Yuji Ito, Yasuhiko Niimi
  • Patent number: 7455101
    Abstract: The present invention provides a micro loop thermosyphon cooler, having a thermal absorption unit and a condenser sequentially arranged therein, wherein the condenser is arranged at a position higher than that of the thermal absorption unit by a height. The thermal absorption unit further comprises a microchannel system formed by superimposing a cover on a substrate having a plurality of micro-grooves arranged thereon, so that the microchannel system is capable of allowing a fluid with a plurality of magnetic particles to flow in and through. In this regard the thermal absorption unit is used for absorbing thermal energy and thus enabling the fluid to vaporize and generate bubbles accordingly for elevating and driving the remaining fluid to flow into the condenser for discharging heat.
    Type: Grant
    Filed: January 26, 2005
    Date of Patent: November 25, 2008
    Assignee: Industrial Technology Research Institute
    Inventor: Li-Chieh Hsu
  • Publication number: 20080236797
    Abstract: A cooling unit has a heat receiving unit that receives heat from a body radiating heat; a radiator disposed at a distance from the heat receiving unit and radiating recovered heat; a liquid coolant transporting heat generated at the heat receiving unit to the radiator; and a hollow tube disposed so that the liquid coolant circulates between the heat receiving unit and the radiator, a circulating flow of the liquid coolant formed by an elevating force of air bubbles generated from the heat received at the heat receiving unit, the radiator having an air pocket forming one part of the circulation path of the liquid coolant together with the hollow tube and capable of collecting the air bubbles.
    Type: Application
    Filed: December 28, 2007
    Publication date: October 2, 2008
    Applicant: FUJITSU LIMITED
    Inventors: Ryuuji Miyazaki, Masumi Suzuki, Minoru Hirano
  • Patent number: 7405930
    Abstract: An electronic apparatus has a housing which is formed with a suction port and an exhaust port. The interior of the housing is partitioned with a first chamber and a second chamber by a partition wall. The first chamber accommodates a CPU generating heat. The suction port and the exhaust port are open to the second chamber. A heat pipe which transfers a heat of the CPU from the first chamber to the second chamber is disposed pass through the partition wall. A fan is disposed in the second chamber. The fan suctions air from the suction ports and discharges the suctioned air from the exhaust port. The heat of the CPU transferred to the second chamber is emitted out of the housing. A part where the heat pipe pass through the partition wall is liquid-tightly sealed through a sealing member.
    Type: Grant
    Filed: June 29, 2005
    Date of Patent: July 29, 2008
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Takeshi Hongo, Hiroshi Nakamura
  • Patent number: 7380584
    Abstract: A pump-free water-cooling system is provided wherein external power supply is not involved; heat can be transported in any direction; and high reliability and low thermal resistance are ensured.
    Type: Grant
    Filed: December 10, 2004
    Date of Patent: June 3, 2008
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Shigetoshi Ippoushi, Nobuaki Uehara, Akira Yamada, Tetsuro Ogushi
  • Publication number: 20080087406
    Abstract: A cooling assembly, system, and method are provided. The cooling assembly includes a plate comprising a plurality of channels defined in a surface of the plate and at least one pulsating heat pipe comprising tubing. At least a portion of the tubing is positioned within the channels, and the tubing is configured for carrying coolant therein.
    Type: Application
    Filed: October 13, 2006
    Publication date: April 17, 2008
    Inventors: Julie F. Asfia, Marianne E. Mata, Chung-Lung Chen, Qingjun Cai, Bruce L. Drolen
  • Patent number: 7352580
    Abstract: A CPU cooler includes a heat-conducting unit and a heat-dissipating unit. The heat-conducting unit consists of a heat-conducting block, a heat-conducting piping, an inflow pipe and an outflow pipe. The heat-conducting block is closely positioned on the CPU and the heat-conducting piping is disposed in the heat-conducting block for making liquid to flow therethrough. The heat-conducting piping has its inflow port connected with the inflow pipe and its outflow port connected with the outflow pipe, and the inflow port of the heat-conducting piping is positioned lower than the outflow port. The heat-dissipating unit has one end communicating with the outflow pipe and the other end communicating with the inflow pipe for dissipating the heat and lowering the temperature of the liquid, able to incessantly repeat the cycle of heat dissipation and temperature reduction.
    Type: Grant
    Filed: February 14, 2006
    Date of Patent: April 1, 2008
    Inventor: Ming-Kun Tsai
  • Patent number: 7337829
    Abstract: A cooling unit has a heat receiving unit that receives heat from a body radiating heat; a radiator disposed at a distance from the heat receiving unit and radiating recovered heat; a liquid coolant transporting heat generated at the heat receiving unit to the radiator; and a hollow tube disposed so that the liquid coolant circulates between the heat receiving unit and the radiator, a circulating flow of the liquid coolant formed by an elevating force of air bubbles generated from the heat received at the heat receiving unit, the radiator having an air pocket forming one part of the circulation path of the liquid coolant together with the hollow tube and capable of collecting the air bubbles.
    Type: Grant
    Filed: April 7, 2003
    Date of Patent: March 4, 2008
    Assignee: Fujitsu Limited
    Inventors: Ryuuji Miyazaki, Masumi Suzuki, Minoru Hirano
  • Patent number: 7261144
    Abstract: A heat transfer assembly for transferring heat from a heat generating device to a circulating fluid, said heat transfer assembly comprising an evaporator device having at least one microchannel formed therein, in thermally conductive contact with said heat generating device, a condenser device, actuating means and manifold means for circulating said fluid between said evaporator device and said condenser device, wherein said heat transfer assembly further comprises a bubble generator capable to create bubbles in said at least one microchannel at a controlled frequency.
    Type: Grant
    Filed: September 14, 2004
    Date of Patent: August 28, 2007
    Assignee: Ecole Polytechnique Fédérale de Lausanne (EPFL)
    Inventors: John R. Thome, Vincent Dupont
  • Patent number: 7225861
    Abstract: A bubble cycling heat exchanger includes a closed fluid loop in contact with a heat absorbing source through a heat conducting block. The loop has a bubble generator. An expanding area for generating bubbles is installed at the loop. The loop is also formed with a radiator and a guide region from which bubbles are easily separable. The heat conducting block is connected to the heat absorbing source. Since the overheating of the heat absorbing source will cause the loop to generate bubbles by an unequilibrium formed at the guide region of the loop, the bubbles will separate from the guide region so that the liquid in the loop flows for transferring heat and so that heat is radiated by the fins or other elements of the radiator from the primary element of a computer at the heat absorbing source. The loop operates continuously until a thermal equilibrium is achieved.
    Type: Grant
    Filed: July 26, 2001
    Date of Patent: June 5, 2007
    Inventor: Jia Hao Li
  • Patent number: 7201215
    Abstract: A vapor-lift pump heat transport apparatus having a small heat resistance and a large heat transport capacity. A heat exchange circulating solution container has a first space and a second space communicating with the first space through a communication opening and contains a heat exchange circulating solution, and vapor thereof, in each space. A circulating solution transport passage includes a pipe connected to the solution outlet of the container and provided with a sensible heat releasing heat exchanger, a pipe disposed in the container, and a pipe connected to a vapor-liquid two-phase fluid inlet and provided with a heating heat exchanger. A vapor-liquid two-phase fluid flows into only the first space through the vapor-liquid two-phase fluid inlet. When the entrance of the vapor-liquid two-phase fluid has caused a pressure difference between the first and second spaces, a difference occurs between the positions of the vapor-liquid interfaces in the first and second spaces.
    Type: Grant
    Filed: January 13, 2004
    Date of Patent: April 10, 2007
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Shigetoshi Ippoushi, Nobuaki Uehara, Akira Yamada, Tetsuro Ogushi, Hisaaki Yamakage
  • Patent number: 6820683
    Abstract: A bubble cycling heat exchanger comprises a sealing fluid loop, a heat absorbing source, a bubble generator, an expanding area for generating bubbles to be transferred to a fluid loop and a radiator. As one end of the seal loop is connected to the heat absorbing source, another end being connected to the radiator. The bubble generator is installed in the loop. Overheat will generate bubbles in the loop. As an unequilibrium occurs, the bubble will separate so that the fluid in the loop will flow to transfer heat, and thus heat is radiated from the radiator. As a result, the loop operating continuously until a heat equilibrium is achieved.
    Type: Grant
    Filed: January 4, 2000
    Date of Patent: November 23, 2004
    Inventor: Li Jia Hao
  • Publication number: 20040194929
    Abstract: A vapor-lift pump heat transport apparatus having a small heat resistance and a large heat transport capacity. A heat exchange circulating solution container has a first space and a second space communicating with the first space through a communication opening and contains a heat exchange circulating solution, and vapor thereof, in each space A circulating solution transport passage includes a pipe connected to the solution outlet of the container and provided with a sensible heat releasing heat exchanger, a pipe disposed in the container, and a pipe connected to a vapor-liquid two-phase fluid inlet and provided with a heating heat exchanger. A vapor-liquid two-phase fluid flows into only the first space through the vapor-liquid two-phase fluid inlet. When the entrance of the vapor-liquid two-phase fluid has caused a pressure difference between the first and second spaces, a difference occurs between the positions of the vapor-liquid interfaces in the first and second spaces.
    Type: Application
    Filed: January 13, 2004
    Publication date: October 7, 2004
    Applicant: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Shigetoshi Ippoushi, Nobuaki Uehara, Akira Yamada, Tetsuro Ogushi, Hisaaki Yamakage
  • Patent number: 6789611
    Abstract: A bubble cycling heat exchanger is disclosed. A closed fluid loop is in contact with a heat absorbing source through a heat conducting block; the loop has a bubble generator, an expanding area for generating bubbles is installed at loop; the loop is also formed with a guide region from which bubbles is easily separable and a radiator; a heat conducting block of the closed loop is connected to a heat absorbing source; since the overheat of the heat absorbing source will cause the loop to generate bubble; by an unequilibrium formed at the guide region of the loop, the bubbles will separate from the heat absorbing source so that the liquid in the loop flows for transferring heat so that heat is radiated by the fins or other elements of the radiator from the primary element of a computer at the heat absorbing source, the loop operates continuously until a heat equilibrium is achieved.
    Type: Grant
    Filed: January 4, 2000
    Date of Patent: September 14, 2004
    Inventor: Jia Hao Li
  • Publication number: 20030205364
    Abstract: The method and apparatus of the present invention dissipate heat from an electronic device to provide an efficient and universally applied thermal solution for high heat generating electronic devices. The apparatus comprises an evaporator, a condenser, a heater and conduits. The evaporator, condenser, and conduits define a closed system that has an interior volume which is partially filled with a liquid coolant. The evaporator is thermally connected to an electronic device, such as a processor, and removes thermal energy from the processor by evaporating the liquid coolant. When the apparatus is oriented such that no liquid coolant is in contact with the evaporator, the heater applies thermal energy to the coolant until the coolant begins to boil. Boiling the liquid coolant causes bubbles to form within the liquid coolant. The volume of the bubbles generated by boiling raises the level of the liquid coolant within the closed system until the liquid coolant comes into contact with the evaporator.
    Type: Application
    Filed: June 29, 2001
    Publication date: November 6, 2003
    Inventors: Ioan Sauciuc, Ward Scott, Gregory M. Chrysler
  • Patent number: 6564861
    Abstract: A cooling unit has a heat receiving unit that receives heat from a body radiating heat; a radiator disposed at a distance from the heat receiving unit and radiating recovered heat; a liquid coolant transporting heat generated at the heat receiving unit to the radiator; and a hollow tube disposed so that the liquid coolant circulates between the heat receiving unit and the radiator, a circulating flow of the liquid coolant formed by an elevating force of air bubbles generated from the heat received at the heat receiving unit, the radiator having an air pocket forming one part of the circulation path of the liquid coolant together with the hollow tube and capable of collecting the air bubbles.
    Type: Grant
    Filed: April 12, 2000
    Date of Patent: May 20, 2003
    Assignee: Fujitsu Limited
    Inventors: Ryuuji Miyazaki, Masumi Suzuki, Minoru Hirano
  • Publication number: 20010045271
    Abstract: A bubble cycling heat exchanger is disclosed. A closed fluid loop is in contact with a heat absorbing source through a heat conducting block; the loop has a bubble generator, an expanding area for generating bubbles is installed at loop; the loop is also formed with a guide region from which bubbles is easily separable and a radiator; a heat conducting block of the closed loop is connected to a heat absorbing source; since the overheat of the heat absorbing source will cause the loop to generate bubble; by an unequilibrium formed at the guide region of the loop, the bubbles will separate from the heat absorbing source so that the liquid in the loop flows for transferring heat so that heat is radiated by the fins or other elements of the radiator from the primary element of a computer at the heat absorbing source, the loop operates continuously until a heat equilibrium is achieved.
    Type: Application
    Filed: July 26, 2001
    Publication date: November 29, 2001
    Inventor: Jia Hao Li
  • Publication number: 20010040022
    Abstract: A bubble cycling heat exchanger is disclosed. A closed fluid loop is in contact with a heat absorbing source through a heat conducting block; the loop has a bubble generator, an expanding area for generating bubbles is installed at loop; the loop is also formed with a guide region from which bubbles is easily separable and a radiator; a heat conducting block of the closed loop is connected to a heat absorbing source; since the overheat of the heat absorbing source will cause the loop to generate bubble; by an unequilibrium formed at the guide region of the loop, the bubbles will separate from the heat absorbing source so that the liquid in the loop flows for transferring heat so that heat is radiated by the fins or other elements of the radiator from the primary element of a computer at the heat absorbing source, the loop operates continuously until a heat equilibrium is achieved.
    Type: Application
    Filed: July 26, 2001
    Publication date: November 15, 2001
    Inventor: Li Jia Hao
  • Patent number: 6178293
    Abstract: In a method for improving heat transfer in a heat exchanger, in which a heating medium passes through heat exchange elements 1,8 which transfer their heat to a liquid with which they are in contact and which is located in the jacket region 3 of the heat exchanger, the liquid between the heat exchange elements in the jacket region 3 is heated locally to such a high temperature by means of additional heating elements 2,9 that nucleate boiling occurs in the liquid on the surface of these additional heating elements 2,9 and the resulting vapour bubbles ascend between the normal heating exchange elements 1,8 in the jacket region 3.
    Type: Grant
    Filed: May 22, 1998
    Date of Patent: January 23, 2001
    Assignee: Bayer Aktiengesellschaft
    Inventors: Peter Clasen, Hans-Joachim Brockhaus, Clemens Casper, Karl-Heinz Jonen