Including Means To Move Heat Exchange Material Patents (Class 165/104.28)
  • Patent number: 10768677
    Abstract: A heat dissipating device includes a bottom assembly, a first light guide positioned on the bottom assembly, a first light assembly positioned on the first light guide, and an outer cover positioned on the bottom assembly and at least partially enclosing the bottom assembly, the first light guide, and the first light assembly. The outer cover defines a first opening on a top surface thereof, at least a portion of the first light guide is received in the first opening, and light from the first light assembly is emitted from the heat dissipating device through the exposed portion of the first light guide.
    Type: Grant
    Filed: April 13, 2018
    Date of Patent: September 8, 2020
    Assignee: COOLER MASTER TECHNOLOGY INC.
    Inventors: Roger Lin, Tzyy-Ing Wang
  • Patent number: 10648369
    Abstract: Modular cooling water assemblies for combined cycle power plant systems are disclosed. Each of the assemblies may include a pump and a heat exchanger, both positioned on a support structure. Additionally, each of the assemblies may include a closed cooling water system supported by the support structure. The closed cooling water system may include a return header fluidly coupled to a return conduit for receiving cooling water previously utilized by the combined cycle power plant system. The closed cooling water system may also include a supply header positioned adjacent the return header, and fluidly coupled to a supply conduit for supplying the cooling water to the combined cycle power plant system. Additionally, the closed cooling water system may include a closed cooling water circuit fluidly coupling the return header to the supply header. The closed cooling water circuit may be fluidly coupled to the heat exchanger and the pump.
    Type: Grant
    Filed: June 25, 2018
    Date of Patent: May 12, 2020
    Assignee: General Electric Company
    Inventors: Borislav Dokic, Aleksandar Naskovic
  • Patent number: 10645844
    Abstract: A liquid cooling module for cooling an electronic component includes a housing supporting the electronic component, where the housing includes a cavity containing a cooling liquid. A liquid flow channel can be in fluid communication with the cavity and define a liquid cooling loop. A cold plate supporting the housing can have a cooling channel thermally coupled to the liquid flow channel.
    Type: Grant
    Filed: April 17, 2018
    Date of Patent: May 5, 2020
    Assignee: GE Aviation Systems LLC
    Inventors: Nader Dariavach, Michel Engelhardt, Liqiang Yang
  • Patent number: 10566264
    Abstract: A flow path member may include silicon nitride ceramics. The flow path member may have an inlet port, an outlet port, and a flow path connected to the inlet port and the outlet port inside the flow path member. A plurality of needle-shaped crystals may be arranged on a surface of the flow path where the needle-shaped crystals intersect each other.
    Type: Grant
    Filed: December 16, 2016
    Date of Patent: February 18, 2020
    Assignees: KYOCERA CORPORATION, TOSHIBA MATERIALS CO., LTD.
    Inventors: Yuusaku Ishimine, Takeshi Muneishi, Kazuhiko Fujio, Yoshiyuki Fukuda, Kentaro Takanami, Takao Shirai
  • Patent number: 10390466
    Abstract: Systems and methods for dissipating heat from an electrical component using an external structure of a trailer or shed as a heat sink are disclosed. A heat-producing electrical component such as a variable frequency drive (VFD) using an insulated-gate bipolar transistor (IGBT) is housed in a trailer and is thermally coupled to an exterior wall of the trailer to use the wall as a heat sink to dissipate heat from the VFD and IGBT. An adapter can be used to couple VFDs and IGBTs of different sizes and configurations to a support site on the exterior wall.
    Type: Grant
    Filed: July 31, 2017
    Date of Patent: August 20, 2019
    Assignee: SCHLUMBERGER TECHNOLOGY CORPORATION
    Inventors: Kurt Held, Nick Paul Krippner, Kasey Herman
  • Patent number: 10168750
    Abstract: In accordance with embodiments of the present disclosure, a system may include an information handling resource and an expansion cold plate thermally coupled to the information handling resource and configured to be fluidically coupled to a refrigeration system and configured to expand a refrigerant within the expansion cold plate in order to cool the information handling resource.
    Type: Grant
    Filed: October 14, 2016
    Date of Patent: January 1, 2019
    Assignee: Dell Products L.P.
    Inventors: Kevin W. Mundt, Robert B. Curtis
  • Patent number: 9797310
    Abstract: A turbomachine includes a compressor having an inter-stage gap between adjacent rows of rotor blades and stator vanes. A combustor is connected to the compressor, and a turbine is connected to the combustor. An intercooler is operatively connected to the compressor, and includes a first plurality of heat pipes that extend into the inter-stage gap. The first plurality of heat pipes are operatively connected to a first manifold, and the heat pipes and the first manifold are configured to transfer heat from the compressed airflow from the compressor to heat exchangers. A cooling system is operatively connected to the turbine, and includes a second plurality of heat pipes located in the turbine nozzles. The second plurality of heat pipes are operatively connected to a second manifold, and the heat pipes and the second manifold are configured to transfer heat from the turbine nozzles to the heat exchangers.
    Type: Grant
    Filed: April 2, 2015
    Date of Patent: October 24, 2017
    Assignee: General Electric Company
    Inventors: Sanji Ekanayake, Joseph Paul Rizzo, Alston Ilford Scipio, Timothy Tahteh Yang, Thomas Edward Wickert
  • Patent number: 9756685
    Abstract: A plane heating element includes a mesh that has warp threads and weft threads. A coating containing carbon nanotubes can be applied to the mesh. A water-repellent and electrically-insulating protective layer made of styrene butadiene copolymer can be additionally applied to the mesh.
    Type: Grant
    Filed: April 13, 2015
    Date of Patent: September 5, 2017
    Assignee: THERMOFER GMBH & CO. KG
    Inventors: Soeren Tuengler, Hans-Georg Koch, Margarete Franziska Althaus
  • Patent number: 9534508
    Abstract: An energy storage power plant for harvesting electric energy, and suitable for converting electric energy into thermal energy is provided. The thermal energy can be temporarily stored in at least two thermal stores until demanded and retrieved to increase the energy content of water in a water circuit upon demand. The power plant has the at least two thermal stores, each has at least one converting device that allows electric energy to be directly or indirectly converted into thermal energy, the thermal stores being thermally chargeable by temporarily storing thermal energy, wherein one thermal store is for storing sensible heat and one thermal store is for storing latent heat; and at least one energy generating unit operated using the water in the water circuit, the energy content of the water having been increased by the temporary storage of thermal energy, in order to generate electric energy when operated.
    Type: Grant
    Filed: March 12, 2013
    Date of Patent: January 3, 2017
    Assignee: SIEMENS AKTIENGESELLSCHAFT
    Inventors: Christian Brunhuber, Carsten Graeber, Gerhard Zimmermann
  • Patent number: 9402336
    Abstract: A cooling structure for an inverter (31) controls a motor (6) to drive an automobile. This inverter device (22) includes a power circuit section (28) having an inverter (31) to convert a DC power of a battery (19) to an AC power for the motor (6), and a casing (39) enclosing the power circuit section (28). A fin (41) is provided in an outer surface of the casing (39), a coolant path (42) for the flow of a cooling medium is provided within the casing (39) or in the outer surface thereof, and a pump (43) circulating the cooling medium in the coolant path (42) is disposed on or in the casing (39). With this structure, the flow resistance for cooling the inverter (31) is reduced to allow the pump (43) to be downsized and a proper cooling can be accomplished to the amount of heat by the inverter (31).
    Type: Grant
    Filed: April 3, 2013
    Date of Patent: July 26, 2016
    Assignee: NTN CORPORATION
    Inventors: Minoru Suzuki, Tetsuya Yamamoto, Koichi Okada
  • Publication number: 20150136362
    Abstract: A heat conveying structure for an electronic device, the heat conveying structure including an evaporating section that has a chamber structure with first fins erected therein, is thermally connected to the electronic device, evaporates a liquid coolant on the surfaces of the first fins to thereby change the liquid coolant to a vapor coolant, and sends out liquid coolant present near the first fins along with the vapor coolant as a gas-liquid two-phase flow coolant, a condensing section that has a chamber structure with second fins erected therein, and changes the gas-liquid two-phase flow coolant in contact with the second fins to a liquid coolant, a vapor pipe that connects the evaporating section and the condensing section, and moves the gas-liquid two-phase flow coolant sent out from the evaporating section to the condensing section, and a liquid pipe that connects the evaporating section and the condensing section.
    Type: Application
    Filed: December 23, 2014
    Publication date: May 21, 2015
    Inventor: Minoru Yoshikawa
  • Publication number: 20150128594
    Abstract: A system for regulating the temperature and flow rate of a heat transfer fluid for use in a hybrid steam-generating plant is described. A bypass section may be incorporated into the piping network of a primary steam-generating source to route heat transfer fluid from a hot source to a mixer downstream of at least one heat exchanger. Heat transfer fluid from the hot source may be mixed with cooler heat transfer fluid exiting the heat exchanger in the event that the supply from a secondary steam-generating source is lost or becomes intermittent. The result is a system that maintains a constant flow rate of heat transfer fluid through the heat exchangers while minimizing adverse temperature gradient effects that may result from steam production variability and plant operation outside of design point parameters.
    Type: Application
    Filed: November 11, 2014
    Publication date: May 14, 2015
    Applicant: eSolar Inc.
    Inventors: Gaurav Soni, Michael Slack
  • Publication number: 20150122464
    Abstract: A flow path member 1 according to one aspect of the invention includes a main body 4 formed of a ceramic sintered body in which a first flow path 6 is provided so as to allow a fluid to flow therethrough, wherein the main body 4 includes a projection 10 formed of part of the ceramic sintered body on an inner wall of the first flow path 6. An adsorption device according to one aspect of the invention includes the flow path member 1 that adsorbs a workpiece 2 and a fluid supplying unit that supplies a fluid to the first flow path 6 of the flow path member 1. A cooling device according to one aspect of the invention includes the flow path member 1 that cools an object and a fluid supplying unit that supplies a fluid which is a cooling fluid to the first flow path 6 of the flow path member 1.
    Type: Application
    Filed: May 21, 2013
    Publication date: May 7, 2015
    Applicant: KYOCERA Corporation
    Inventors: Kou Ito, Kouji Teramoto, Hiroyasu Momikura
  • Publication number: 20150124399
    Abstract: A heat dissipating assembly suited for an electronic device is provided. The electronic device has at least one heat source. The heat dissipating assembly includes a first tube, a second tube, and a fluid. The first tube has an inlet and an outlet, wherein a bore size of the inlet is smaller than a bore size of the outlet. Heat generated from the heat source is transferred to the first tube. Two opposite ends of the second tube are connected to the inlet and the outlet such that the first and the second tubes are formed into a closed loop. The fluid is filled in the closed loop. The fluid in the first tube transferred from the inlet toward the outlet absorbs the heat and is transferred to the second tube for heat dissipating. An electronic device is also provided.
    Type: Application
    Filed: February 26, 2014
    Publication date: May 7, 2015
    Applicant: ACER INCORPORATED
    Inventors: Cheng-Wen Hsieh, Wen-Neng Liao
  • Publication number: 20150116942
    Abstract: A cooling member includes a heat-transfer member, a refrigerant introducing pipe and a covering material. The heat-transfer member has a surface with a groove opened to the surface of the heat-transfer member. The refrigerant introducing pipe is pressed into the groove. The covering material coats the surface of the heat-transfer member and the refrigerant introducing pipe.
    Type: Application
    Filed: January 9, 2015
    Publication date: April 30, 2015
    Inventors: Junichi TERAKI, Mitsuhiro TANAKA, Noriyuki OKUDA
  • Publication number: 20150114008
    Abstract: A heat exchanger is provided, in particular for a motor vehicle, with at least one thermoelectric element to generate a heat flow, wherein the thermoelectric element is arranged on a carrier element, wherein several carrier elements arranged on top of one another along a stacking spindle form a carrier element stack, in which a first fluid channel for a first fluid and a second fluid channel for a second fluid, fluidically separated from the first, are constructed.
    Type: Application
    Filed: October 30, 2014
    Publication date: April 30, 2015
    Inventors: Stefan HIRSCH, Manuel WEHOWSKI, Florin MOLDOVAN
  • Publication number: 20150101386
    Abstract: A water-blocking apparatus for cooling water for a hot-rolled steel sheet according to the present invention, which blocks cooling water sprayed onto a hot-rolled steel sheet at a sprayed water density of higher than 4 m3/m2/min and equal to or less than 10 m3/m2/min when the hot-rolled steel sheet is cooled after finish rolling of a hot-rolling process, includes: a plurality of water-blocking nozzles which spray water-blocking water onto the hot-rolled steel sheet. Impact areas of the water-blocking water respectively sprayed from the water-blocking nozzles are continuously lined up in a straight line in a width direction of the hot-rolled steel sheet on a surface of the hot-rolled steel sheet and the adjacent impact areas partially overlap.
    Type: Application
    Filed: June 6, 2013
    Publication date: April 16, 2015
    Applicant: Nippon Steel & Sumitomo Metal Corporation
    Inventors: Hitoshi Nikaido, Yoshihiro Serizawa, Noriyuki Hishinuma
  • Publication number: 20150096722
    Abstract: A cooling device for cooling heat-generating devices such as disk laser according to a desired thermal profile to generate desired edge effects and optical properties. An example cooling device includes a back plate for supporting the heat-generating device. The back plate is part of a cooling device housing with a wall providing an enclosure that contains a nozzle member. The nozzle member encloses the cooling device housing on a side opposite the back plate. A nozzle coolant surface is formed on an end of the nozzle member. The nozzle coolant surface extends outward from its center to an edge to form a coolant chamber with the back plate. Coolant fluid may enter the coolant chamber through inlet paths formed in the nozzle member and exit through a chamber gap between the nozzle coolant surface edge and inside of the housing wall.
    Type: Application
    Filed: March 4, 2013
    Publication date: April 9, 2015
    Inventors: Jason Zweiback, Claudio Filippone
  • Publication number: 20150083938
    Abstract: The disclosure provides a cooler for use in a plasma generation chamber of a radiation source for an extreme ultraviolet wavelength range. The cooler has a heat sink which is at least partially manufactured of a substrate material having a thermal conductivity of greater than 50 W/mK. A coolant duct is formed in the substrate material, and the coolant duct is configured to have a coolant flow therethrough. The cooler also includes a connection piece made of a metal or a metal alloy for connecting a coolant line to the coolant duct. The cooler further includes a connecting element for connecting the connection piece to the heat sink so that, when the connection piece is connected to the heat sink, a continuous line is formed by the coolant duct and the coolant line.
    Type: Application
    Filed: September 22, 2014
    Publication date: March 26, 2015
    Inventors: Willi Anderl, Bernhard Weigl, Ann-Kathrin Wandner, Holger Kierey, Arno Schmittner, Markus Bauer, Marcus Schmelzeisen, Andreas Kolloch
  • Publication number: 20150075754
    Abstract: A single-pass cold plate assembly having a base and a cover arranged in confronting relationship to define a cold plate with a spiral channel and a manifold with the manifold having a manifold inlet and a manifold outlet and where coolant may be introduced into the manifold inlet and may complete a single pass through the cold plate assembly.
    Type: Application
    Filed: September 17, 2013
    Publication date: March 19, 2015
    Applicant: GE Aviation Systems LLC
    Inventors: Michel Engelhardt, Paul Otto Stehlik, Kerry Liu, Hanif Ramzan Sebro
  • Publication number: 20150062822
    Abstract: A heat-receiver includes: a first plate that receives heat at one face from a heat generating body; a second plate that is disposed facing another face of the first plate with a spacing therebetween, and that has a greater plate thickness than a plate thickness of the first plate; a first coupling portion that couples together the first plate and the second plate; and a second coupling portion that couples together the first plate and the second plate at a position that faces across the first plate toward the heat generating body, with a gap between the second coupling portion and the first coupling portion through which a coolant is capable of passing, and that has a width along the other face of the first plate that is greater than a width of the first coupling portion, as viewed along the coolant passing direction.
    Type: Application
    Filed: July 25, 2014
    Publication date: March 5, 2015
    Applicant: FUJITSU LIMITED
    Inventors: Michimasa AOKI, Masumi Suzuki, Jie Wei, Fumihiro Tawa, Kenji Sasabe
  • Publication number: 20150053375
    Abstract: A temperature control system for a semiconductor manufacturing process having at least one target includes: a heat exchange loop operatively associated with each target, and a mixing valve operatively associated with each heat exchange loop. This mixing valve has a body defining a mixing chamber. The mixing chamber has an inlet, an outlet, a hot inlet, a cold inlet, and a closure means associated with each inlet. Alternatively, the mixing valve may include: a body defining a mixing chamber, the mixing chamber having an inlet, an outlet, a hot inlet, and a cold inlet, a moveable gate operatively associated with each inlet for controlling the flow of fluid through said inlets, and a motor for moving the gates. A process for manufacturing semiconductors includes the step of providing a temperature control system having at least one target including a mixing valve, as described above.
    Type: Application
    Filed: August 20, 2013
    Publication date: February 26, 2015
    Applicant: Noah Precision, LLC
    Inventor: Boris ATLAS
  • Publication number: 20150049437
    Abstract: An adjustable frequency drive including a number of power modules and a heat management system is provided. Each of the number of power modules includes a number of inverters. Each inverter includes a number of power poles. The heat management system includes a housing assembly, a first heat management assembly, and a second heat management assembly. The housing assembly defines a power module enclosure and a liquid cooling assembly enclosure. The first heat management assembly is substantially disposed in the power module enclosure. The second heat management assembly is not substantially disposed in the power module enclosure.
    Type: Application
    Filed: August 15, 2013
    Publication date: February 19, 2015
    Applicant: EATON CORPORATION
    Inventors: Harry Broussard, Thomas Arthur Farr
  • Publication number: 20150036261
    Abstract: A member 10 for a semiconductor manufacturing apparatus includes an AlN electrostatic chuck 20, a cooling plate 30, and a cooling plate-chuck bonding layer 40. The cooling plate 30 includes first to third substrates 31 to 33, a first metal bonding layer 34 between the first and second substrates 31 and 32, a second metal bonding layer 35 between the second and third substrates 32 and 33, and a refrigerant path 36. The first to third substrates 31 to 33 are formed of a dense composite material containing SiC, Ti3 SiC2, and TiC. The metal bonding layers 34 and 35 axe formed by thermal compression bonding of the substrates 31 to 33 with an Al—Si—Mg metal bonding material interposed between the first and second substrates 31 and 32 and between the second and third substrates 32 and 33.
    Type: Application
    Filed: October 16, 2014
    Publication date: February 5, 2015
    Inventors: Asumi JINDO, Katsuhiro INOUE, Yuji KATSUDA, Takashi KATAIGI, Shingo AMANO, Hiroya SUGIMOTO
  • Publication number: 20150034271
    Abstract: Embodiments of the present invention disclose a liquid cooling apparatus, which includes a cold plate (202), a fast connector (204), and a first interface (2011), where the fast connector (204) includes a first connector (2041) and a second connector (2042), where the first connector (2041) is fixedly connected to the cold plate (202); the first interface (2011) is configured to connect to a second interface (2012) corresponding to the first interface; and the liquid cooling apparatus further includes a guide rail (203), where the guide rail (203) is a moving rail of the second connector (2042), and when the first connector (2041) and the second connector (2042) are in a connected state and the second connector (2042) is located at an end on the guide rail (203) that is close to a board (201), a distance between the first interface (2011) and the second interface (2012) is greater than 0.
    Type: Application
    Filed: October 20, 2014
    Publication date: February 5, 2015
    Inventors: Youlin Jin, Taqing Feng
  • Publication number: 20150036294
    Abstract: A housing or other enclosure used to facilitate fluid cooling of a circuitry of a battery charger, such as but not limited to a battery charger of the type used to facilitate charging a high voltage vehicle battery with AC energy provided from a utility power grid. The housing may include a groove and seal arrangement operable to seal a fluid coolant chamber used to cool the circuitry from leaking fluid during use.
    Type: Application
    Filed: October 21, 2014
    Publication date: February 5, 2015
    Inventors: Nadir Sharaf, John M. Van Dyke, Richard J. Hampo, Slobodan Pavlovic, Rutunj D. Rai, Reinhard Pusch
  • Publication number: 20150009631
    Abstract: Cooling assemblies and power electronics modules having multiple-level porosity structures with both a micro- and macro-level porosity are disclosed. In one embodiment, a cooling assembly includes a jet impingement assembly including a fluid inlet channel fluidly coupled an array of orifices provided in a jet plate, and a heat transfer substrate having a surface. The heat transfer substrate is spaced apart from the jet plate. A first array of metal fibers is bonded to the surface of the heat transfer substrate in a first direction, and a second array of metal fibers is bonded to the first array of metal fibers in a second direction. Each metal fiber of the first array of metal fibers and the second array of metal fibers includes a plurality of metal particles defining a micro-porosity. The first array of metal fibers and the second array of metal fibers define a macro-porosity.
    Type: Application
    Filed: July 5, 2013
    Publication date: January 8, 2015
    Inventor: Shailesh N. Joshi
  • Publication number: 20150007965
    Abstract: Cooling assemblies including a porous three dimensional surface such as a heat sink are disclosed. In one embodiment, a cooling assembly includes a heat transfer substrate having a surface, a thermally conductive fin extending from the surface, a metal mesh bonded to a surface of the thermally conductive fin, and sintered metal particles bonded to the metal mesh and the surface of the thermally conductive fin. The metal mesh defines a macro-level porosity, and the sintered metal particles define a micro-level porosity. In another embodiment, a cooling assembly includes a heat transfer substrate having a surface, a thermally conductive fin extending from the surface of the heat transfer substrate, and sintered metal particles bonded to the surface of the thermally conductive fin. An average diameter of the sintered metal particles increases from a base of the thermally conductive fin to a top of the thermally conductive fin.
    Type: Application
    Filed: July 5, 2013
    Publication date: January 8, 2015
    Inventor: Shailesh N. Joshi
  • Publication number: 20150000624
    Abstract: The invention relates to a device for heating the heat engine (7) of a vehicle, comprising: a reactor (3) in which a reagent that can cause an exothermic reaction with a reaction fluid is disposed, a circuit (5) for supplying reaction fluid to the reactor (3), a heat-exchange circuit (8) between the reactor (3) and the heat engine (7) of the vehicle, and a circuit (9) for regenerating the reagent.
    Type: Application
    Filed: January 31, 2013
    Publication date: January 1, 2015
    Applicant: VALEO SYSTEMES DE CONTROLE MOTEUR
    Inventors: Damien Alfano, Pauline Lartigue, Thierry Cheng
  • Publication number: 20140373798
    Abstract: The invention relates to a heat exchanger (1) for a vehicle comprising a heat engine, said exchanger comprising a first circuit, a second circuit and a tank. According to the invention, the first circuit comprises first ducts for conveying exhaust gases, the second circuit comprises second ducts for conveying a heat-transfer fluid, and the tank can receive a reagent.
    Type: Application
    Filed: January 31, 2013
    Publication date: December 25, 2014
    Inventors: Damien Alfano, Pauline Lartigue, Thierry Cheng, José Antonio De La Fuente
  • Publication number: 20140376178
    Abstract: Heat dissipating system and method are disclosed. An example method includes removing heat from a rack component via a thermal transport. The method also includes applying a pressure at a fluid cooled thermal bus bar on a rack system to form a thermally conductive dry disconnect interface and form a heat path between the thermal transport and the fluid cooled thermal bus bar.
    Type: Application
    Filed: February 9, 2012
    Publication date: December 25, 2014
    Inventors: David A Moore, John P. Franz, Tahir Cader, Michael L. Sabotta
  • Patent number: 8910706
    Abstract: An apparatus for cooling a heat-generating component is disclosed. The apparatus includes a cooling chamber containing a liquid metal. The cooling chamber has a heat-conducting wall thermally coupled to the heat-generating component. A plurality of extendable tubes making up an array of cooling pin fins is attached to the cooling chamber. Each of the extendable tubes has a port end that opens into the cooling chamber and a sealed end that projects away from the cooling chamber. Moreover, each of the extendable tubes has an extended position when filled with liquid metal from the cooling chamber and a retracted position when emptied of the liquid metal. A pump system is included for urging the liquid metal from the cooling chamber into the plurality of extendable tubes.
    Type: Grant
    Filed: February 5, 2009
    Date of Patent: December 16, 2014
    Assignee: International Business Machines Corporation
    Inventors: Don Alan Gilliland, Maurice Francis Holahan, Cary Michael Huettner
  • Publication number: 20140345833
    Abstract: An undercover for a vehicle, connected to an underbody below a muffler mounted on the underbody, includes: a main body panel in a plate shape, through which insertion holes are formed; a heat absorption plate to be connected to the insertions holes; and a heat radiation plate to be connected to the heat absorption plate, the remote ends of which are exposed below the main body panel. A heat exchange function is added to an undercover that has been used simply as a cover for protecting the muffler from foreign substance, thereby cooling more efficiently the muffler.
    Type: Application
    Filed: December 14, 2013
    Publication date: November 27, 2014
    Applicant: Hyundai Motor Company
    Inventor: Dae-Gil Hwang
  • Patent number: 8894921
    Abstract: An improved flue gas cooler 10, or bank of coolers 10, handles flue gas G from aluminum reduction cells in an aluminum smelter plant. Each flue gas cooler 10 has a gas inlet chamber 14, a gas outlet chamber 16, and a matrix of gas cooling tubes 18 extending between the inlet chamber and the outlet chamber. Each cooling tube 18 has a bell-shaped inlet end 19 comprising an aerodynamically curved gas-accelerating profile effective to facilitate streamlined flow of flue gas G into the tube. The improved flue gas cooler makes it possible to connect the flue gas cooler to receive flue gas G direct from the aluminum reduction cells without getting clogged by dust and sublimates present in the flue gas.
    Type: Grant
    Filed: March 12, 2008
    Date of Patent: November 25, 2014
    Assignee: ALSTOM Technology Ltd.
    Inventors: Geir Wedde, Ole K. Bockman
  • Publication number: 20140334095
    Abstract: A radiator includes: a tube through which a coolant flows; and a single tank including: a supplying chamber communicating with an end of the tube, for supplying the tube with the coolant; and a collecting chamber communicating with the other end of the tube, partitioned to the supplying chamber, and for collecting the coolant discharged from the tube.
    Type: Application
    Filed: July 25, 2014
    Publication date: November 13, 2014
    Inventors: Masumi Suzuki, Michimasa Aoki, Yosuke Tsunoda, Masaru Sugie, Shinichirou Kouno, Hiroshi Muto, Kenji Katsumata
  • Publication number: 20140307388
    Abstract: A heat dissipation device that includes a base plate having a plurality of substantially circular channels which are substantially concentrically arranged; and a fluid distribution structure adjacent the base plate, wherein the fluid distribution structure has a plurality of inlet conduits extending substantially radially from a central area with each of the plurality of inlet conduits having at least one fluid delivery port extending through the fluid distribution structure to at least one base plate circular channel, and wherein the fluid distribution structure has a plurality of outlet zones defined between adjacent inlet conduits with each of the plurality of outlet zones having at least one fluid removal port extending through the fluid distribution structure to at least one base plate circular channel.
    Type: Application
    Filed: April 11, 2013
    Publication date: October 16, 2014
    Inventor: Chia-Pin Chiu
  • Patent number: 8857057
    Abstract: An apparatus for facilitating servicing of a liquid-cooled electronics rack is provided. The apparatus includes a coolant tank, a coolant pump in fluid communication with the coolant tank, multiple parallel-connected coolant supply lines coupling the coolant pump to a coolant supply port of the apparatus, and a coolant return port and a coolant return line coupled between the coolant return port and the coolant tank. Each coolant supply line includes a coolant control valve for selectively controlling flow of coolant therethrough pumped by the coolant pump from the coolant tank. At least one coolant supply line includes at least one filter, and one coolant supply line is a bypass line with no filter. When operational, the apparatus facilitates filling of coolant into a cooling system of a liquid-cooled electronics rack by allowing for selective filtering of coolant inserted into the cooling system.
    Type: Grant
    Filed: April 16, 2012
    Date of Patent: October 14, 2014
    Assignee: International Business Machines Corporation
    Inventors: Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madusudan K. Iyengar, Robert E. Simons, Prabjit Singh
  • Patent number: 8851154
    Abstract: A cooling module includes a casing with a thermal-transmittance wall having an interior surface and an exterior surface, a coolant inlet, a vapor outlet, and a converting component with a plurality of orifices and dividing an interior of the casing into a coolant chamber and a vaporization chamber. A liquid coolant is ejected through the plurality of orifices to form plumes toward the interior surface of the thermal-transmittance wall and exchange heat with the thermal-transmittance wall resulting in coolant vapor. In a cooling system, a vapor conduit then carries the vapor to a condenser, and a coolant conduit returns the condensed coolant to the cooling module. The cooling system is used to cool a lamp device.
    Type: Grant
    Filed: July 29, 2011
    Date of Patent: October 7, 2014
    Assignee: MicroBase Technology Corp.
    Inventors: Kai-An Cheng, Chia-Chen Liao, Chun-Hsien Wu, Hsien-Chun Meng, Hsien Meng
  • Publication number: 20140251582
    Abstract: A fluid heat exchanger can define a plurality of microchannels each having a first end and an opposite end and extending substantially parallel with each other microchannel. Each microchannel can define a continuous channel flow path between its respective first end and opposite end. A fluid inlet opening for the plurality of microchannels can be positioned between the microchannel first and opposite ends, a first fluid outlet opening from the plurality of microchannels can be positioned adjacent each of the microchannel first ends, and an opposite fluid outlet opening from the plurality of microchannels can be positioned adjacent each of the microchannel opposite ends such that a flow of heat transfer fluid passing into the plurality of microchannels flows along the full length of each of the plurality of microchannels outwardly from the fluid inlet opening. Related methods are disclosed.
    Type: Application
    Filed: May 20, 2014
    Publication date: September 11, 2014
    Applicant: COOLIT SYSTEMS INC.
    Inventor: Geoff Sean Lyon
  • Publication number: 20140238642
    Abstract: A heat exchange device comprising a fluid flow passage having a plurality of successive segments in fluid flow communication with one another, the segments being adapted to maintain a developing flow therein and thereby improve heat transfer.
    Type: Application
    Filed: February 26, 2013
    Publication date: August 28, 2014
    Applicant: Pratt & Whitney Canada Corp.
    Inventors: Joseph Horace Brand, Kevin Allan Dooley, Cameron Todd Walters, Michael Dowhan
  • Publication number: 20140076523
    Abstract: Devices, systems, and methods for cooling electronic component heat spreaders, for example, a heat spreader mounted over a CPU of personal computer, are disclosed. The devices, systems, and methods employ a housing having an internal cavity with an open bottom; a gasket positioned between the open bottom and the heat spreader; a cooling fluid inlet to the housing adapted to direct a cooling fluid upon the heat spreader in a direction substantially normal to heat spreader; and a cooling fluid outlet positioned to remove the cooling fluid from the housing. Though aspects of the invention can be applied to any electronic component that can benefit from enhanced heat dissipation, users of high-performance computer equipment, such as, gamers, scientific and mathematical modelers, and engineers may find aspects of the invention particularity advantageous.
    Type: Application
    Filed: September 19, 2012
    Publication date: March 20, 2014
    Inventors: AARON RAY BATKER PRITZKER, JOSHUA PATRICK NIXON, JOHN HOWE, ALEXANDER GAILOR, GEORGE KAPLAN
  • Patent number: 8650896
    Abstract: A system, configured to be disposed in a information technology equipment rack for providing ice thermal storage, includes a tank configured to hold water, a heat exchanger disposed in water in the tank and configured to convey a two-phase liquid and vapor refrigerant and to transfer heat between the water and the refrigerant, a first valve connected to a liquid and a vapor refrigerant line and configured to selectively connect the liquid refrigerant line to a first port and the vapor refrigerant line to a second port in a first mode and to connect the liquid refrigerant line to the second port and the vapor refrigerant line to the first port in a second mode, a thermostatic expansion valve connected to an inlet of the heat exchanger, and a liquid/vapor pump connected to an outlet of the heat exchanger and to the second port of the first valve.
    Type: Grant
    Filed: March 8, 2010
    Date of Patent: February 18, 2014
    Assignee: Schneider Electric It Corporation
    Inventor: John H. Bean, Jr.
  • Publication number: 20140000835
    Abstract: Low void fraction thermal energy storage articles, systems, and methods for making and using such thermal energy storage articles and systems. Thermal energy storage units include a thermal energy storage body having a particular void volume and a mixing cavity-creating element. Thermal energy storage modules include two or more thermal energy storage bodies arranged adjacently with an intervening cavity defined by a cavity-creating element. The total void volume of a thermal energy storage module (i.e., the sum of the void volume of the passages of the thermal energy storage bodies and the cavity) is between about 10% and about 40%.
    Type: Application
    Filed: June 25, 2013
    Publication date: January 2, 2014
    Inventors: Hassan S. NIKNAFS, Daniel C. SHERMAN, Thomas SZYMANSKI
  • Publication number: 20130319631
    Abstract: An integrated cooling and climate control system for an offshore wind turbine featuring a reservoir having first and second chambers located in an upper region of the tower. Upper and lower cooling circuits distribute coolant fluid through heat generating structures in the nacelle to a lower portion of the wind turbine where the heated coolant fluid is thermally connected to a sea water heat sink. The cooled coolant fluid is then distributed back to the reservoir. The reservoir has a hollow center and is positioned on a platform having a hollow center. The inlet and outlet pipes of the upper cooling circuit freely hang inside the reservoir chambers so that they may be displaced as the nacelle yaws in order to maintain sufficient circulation of the coolant fluid in the upper cooling circuit. In jacket foundation configurations, the tubular support structures may serve as the lower cooling circuit pipes.
    Type: Application
    Filed: June 5, 2012
    Publication date: December 5, 2013
    Inventors: Peri Sabhapathy, Eduardo Moreno Benito, Dag Jorstad
  • Publication number: 20130308277
    Abstract: A two-phase heat transfer assembly includes a cold plate having an impingement surface, an array of heat generating device coupled to the cold plate, and an array of spray nozzles. The impingement surface has an array of central hydrophilic regions. Each individual central hydrophilic region is surrounded by a hydrophobic perimeter. A wettability of the impingement surface gradually progresses from hydrophilic at each individual central hydrophilic region to hydrophobic at each hydrophobic perimeter. The array of heat generating devices is coupled to a heated surface of the cold plate such that the array of central hydrophilic regions is aligned with the array of heat generating devices. The array of spray nozzles is configured to direct coolant droplets toward the impingement surface. The wettability profile of the impingement surface of the cold plate causes the coolant droplets to move inwardly toward the individual central hydrophilic regions from each hydrophobic perimeter.
    Type: Application
    Filed: May 15, 2012
    Publication date: November 21, 2013
    Applicant: Toyota Motor Engineering & Manufacturing North America, Inc.
    Inventors: Shailesh N. Joshi, Ercan Mehmet Dede
  • Publication number: 20130255601
    Abstract: The present disclosure relates to a multiple zone vehicle radiator, including: a housing; a first zone included in the housing; a second zone included in the housing; a baffle between the first and second zone, located in an outlet manifold of the housing; and a zone modifier configured to regulate coolant distribution between the first zone and second zone according to predetermined conditions.
    Type: Application
    Filed: March 30, 2012
    Publication date: October 3, 2013
    Inventors: James Thomas Gooden, Scott Russo, Michael Joseph Giunta
  • Publication number: 20130248153
    Abstract: Various embodiments of microelectronic package cooling assemblies are described. Those embodiments include a cooling assembly comprising an array of vertically separated micro channels coupled to a heat spreader, wherein the heat spreader is finless, and wherein each inlet micro channel has two adjacent outlet micro channels. A distance between individual vertically separated micro channels comprises less than about 20 microns, and a heat pipe is embedded in the heat spreader.
    Type: Application
    Filed: December 30, 2011
    Publication date: September 26, 2013
    Applicant: Breville Pty Limited
    Inventor: Ioan Sauciuc
  • Publication number: 20130240181
    Abstract: A sample cooling device for cooling a sample container held in a heat conductive rack comprises a cooler; a heat conductive member, on which the rack is placed, to be cooled in contact with the cooler; and a heat conductive water absorbing member disposed at least partly in an opposite region defined between the heat conductive member and the rack in contact with both of the heat conductive member and the rack. The water absorbing member has a structure for absorbing water by a capillary force.
    Type: Application
    Filed: February 22, 2013
    Publication date: September 19, 2013
    Applicant: SHIMADZU CORPORATION
    Inventor: Kenichi Yasunaga
  • Publication number: 20130232950
    Abstract: An exit manifold is disclosed which includes a manifold body that includes a plurality of inlets. The manifold body provides communication between the inlets and a discharge port. At least one of the inlets directs flow in a first direction and at least one of the inlets directs flow in a second direction. The first and second directions are opposite and the material flowing in these opposite directions collides in front of the discharge outlet. The collision of these two oppositely-directed flows creates a high pressure stagnation region that may block or impede flow from one or more inlets that may be in alignment with the discharge port.
    Type: Application
    Filed: March 9, 2012
    Publication date: September 12, 2013
    Inventors: James A. Clark, Charles W. Whipple
  • Publication number: 20130232973
    Abstract: This invention provides a method of extracting geothermal energy, generally comprising the steps of: insertion of a thermal mass into a Heat Absorption Zone, absorbing heat in thermal mass, raising the thermal mass to a Heat Transfer Zone, and transferring the heat from the thermal mass. The acquired heat can be used to generate electricity or to drive an industrial process. The thermal mass can have internal chambers containing a liquid such as molten salt, and can also have structures facilitating heat exchange using a thermal exchange fluid, such as a gas or a glycol-based fluid. In some embodiments, two thermal masses are used as counterweights, reducing the energy consumed in bringing the heat in the thermal masses to the surface. In other embodiments, solid or molten salt can be directly supplied to a well shaft to acquire geothermal heat and returned to the surface in a closed loop system.
    Type: Application
    Filed: February 14, 2013
    Publication date: September 12, 2013
    Inventor: David Alan McBay