Abstract: A motor-fan shroud is formed at its lower portion with a supporting portion having a hole and at its upper portion with a first and second clip portions arranged apart from each other in a width direction. A reservoir tank is formed at its lower portion with a projection extending downward and insertable into the hole of the supporting portion and at its upper portion with a first and second ear portions insertable from above into the first and second clip portions, respectively. A first clipping surface of the first clip portion has a substantial half-ball shaped projection to be fitted in a hole of the first ear portion, while the second ear portion has a claw to be latched by the second clip portion so that unlatch, in an upward direction, of them can be prevented.

Abstract: A condenser assembly adapted to condense an evaporated refrigerant for use in a retail store refrigeration system. The condenser assembly includes at least one microchannel condenser coil including an inlet manifold and an outlet manifold. The inlet manifold includes an inlet port for receiving the refrigerant, and the outlet manifold includes an outlet port for discharging the refrigerant. The condenser assembly also includes a frame supporting the at least one microchannel condenser coil.

Abstract: The present invention is a fan tray assembly in a computer chassis which allows fan assemblies to be removed and installed without shutting down the computer device. The fan tray assembly includes two or more fan assemblies for cooling the interior of the chassis. The fan tray assembly has a first position in which the fan tray assembly is received in the chassis and an extended position in which the fan tray assembly extends from an opening in the chassis. The fan tray assembly has an endplate, a left side, a right side, and at least one of the sides includes one or more slots for receiving a fan assembly. A hot tap board mounted to the fan tray assembly is connected to a power cable. The fan assemblies are hot tap connected to the hot tap board. The present invention allows the fan assembly to be removed without shutting down the device by extending the fan tray assembly from the computer chassis and removing the fan assembly from the fan tray assembly.

Abstract: A cooling system is provided with a heat exchanger that has a thermally conductive tube over-molded with a plurality of thermally conductive fins. To form the heat exchanger, a thermally conductive tube is provided. Insert molding, over molding or injection molding is utilized to incorporate thermally conductive fins with the thermally conductive tubes. The molding process may also simultaneously create any required features, such as mounting features and fittings for tubing to be connected to the heat exchanger.

Abstract: A modular capillary pump loop (CPL) cooling system and associated components. The modular CPL cooling system transfers heat from high-power circuit components, such as microprocessors disposed within computer chassis, to other locations within or external to the chassis, where the heat can be more easily removed. In various embodiments, the CPL cooling system includes one or more evaporators connected to one or more condensers via flexible liquid transport and vapor transport lines. A wicking structure, such as a volume of sintered copper, is disposed within each condenser. The wicking structure draws working fluid (e.g., water) in a liquid state into the evaporator based on a capillary mechanism and a pressure differential across a meniscus/vapor interface on an upper surface of the wicking structure. As the liquid meniscus is evaporated, additional fluid is drawn into the evaporator. The working fluid is then condensed back into a liquid in the condenser.

Abstract: A hybrid cooling system is provided which is particularly useful for cooling electronic circuit components disposed on circuit boards arranged in a plurality of drawers within a cabinet or frame. Air cooling is provided locally with a supplementary, auxiliary, or secondary cooling system being provided at more distant frame level locations. This configuration permits optimal sizing of the respective hybrid cooling system components without negatively impacting the coefficient of performance (COP). Hybrid heat sinks are employed to accommodate the hybrid cooling system design.

Abstract: A compact air-ventilator with high efficiency thermal exchanger and air filter in which the thermal exchanger utilize a light-weight assembly of parallelly stacked thin metallic plates with pre-formed spaces. The high efficiency air filter includes a combination of filter elements including a mesh grid, an activated carbon layer and a HEPA filter. This air-ventilator can be built-in as part of an air-conditioner or as a stand alone unit to provide additional air circulating to conventional air-conditioners to improve indoor air quality. The thermal exchanger as well as the filters can be made with modular design to allow for easy periodic maintenance and replacement.

Abstract: The invention relates to a plate-type heat exchanger, in which at least one first flow passage (16) for a first medium is provided between two plates (12 and 14), which form a plate pair (13). A plurality of second flow passages (18), which are connected in parallel, for a second medium are provided between two plate pairs (13). To provide a novel, improved heat exchanger, which is easier to produce, it is proposed that the second, parallel-connected flow passages (18) are formed in each case by one plate (14, 12) from adjacent plate pairs (13).

Abstract: A modular heat recovery ventilation system includes a modular heat exchanger and a modular apparatus spaced from the heat exchanger for delivering both fresh air and exhaust air to the heat exchanger. The apparatus includes separate blowers for generating two separate air streams. The apparatus includes an access plate at the bottom thereof allowing access to the interior of the enclosure of the apparatus through a ceiling.

Abstract: Disclosed herein is a fan cylinder for a cooling tower, which is configured to prevent the air discharged from the cooling tower from flowing back thereinto. The fan cylinder is fixed to the upper side of the cooling tower, and is configured to mount a cooling fan therein. The fan cylinder comprises a linear portion having a constant inner diameter, and mounted therein with the cooling fan; an inlet portion connected at an upper end thereof to a lower end of the linear portion, and having an inner diameter increasing downwardly; an extension portion connected at a lower end thereof to an upper end of the linear portion; and having an inner diameter increasing upwardly, and an outlet portion connected to an upper end of the extension portion, and having an inner diameter decreasing upwardly.

Abstract: A cooling system is provided with a heat exchanger that has a thermally conductive tube over-molded with a plurality of thermally conductive fins. To form the heat exchanger, a thermally conductive tube is provided. Insert molding, over molding or injection molding is utilized to incorporate thermally conductive fins with the thermally conductive tubes. The molding process may also simultaneously create any required features, such as mounting features and fittings for tubing to be connected to the heat exchanger.

Abstract: An electronic apparatus includes a housing, a first heat-generating member provided in the housing, a heat-radiating member thermally connected to the first heat-generating member, a first fan module guiding air to the heat-radiating member, a second heat-generating member provided in the housing, a second fan module discharging air out of the housing, and a wall section provided in the housing, located between the first fan module and the second fan module.

Abstract: A thermo-electro sub-assembly comprises a gas supply, a first duct, a first heatsink adjacent a first device, a second duct, and a second heat sink adjacent a second device. The gas supply may be realized as a fan, a blower, or a compressed gas source. The first duct provides a passageway for delivering pressurized gas from the gas supply to the first heat sink. The duct may include a plurality of vanes for reducing the turbulence and air boundary separation within the duct. The first heatsink is in thermal communication with a first heat-producing device such as a microprocessor. In a preferred embodiment the heatsink comprises an axial shaped folded fin heatsink. The second duct is used to provide a pathway for the air leaving the first heatsink and delivers the air to the second heatsink. The second duct may also include a plurality of vanes for reducing turbulence and boundary flow separation within the second duct.

Abstract: A horizontal rooftop engine cooling system includes one or more radiator units horizontally mountable to the rooftop of a bus and including a radiator interconnected to one or more passages of an engine of the bus to allow coolant to flow between the engine and the rooftop cooling system to cool the engine. The cooling system can incorporate a fan mounting shroud, a ram-air aerodynamic shroud, and/or an ornamental aesthetic appearance shroud.

Abstract: A fan housing of a fan unit includes a housing wall standing from the surface of a printed circuit board. The printed circuit board serves to establish the fan housing in cooperation with the housing wall. The fan housing further includes a ceiling wall connected to the housing wall. The ceiling wall extends along a datum plane parallel to the surface of the printed circuit board. A high speed airflow can be generated within the fan housing. The airflow promotes the heat radiation from the printed circuit board. An electrically conductive wiring pattern extending over the surface of the printed circuit board may further promote the heat radiation from the printed circuit board.

Abstract: An electronic device cooling system includes a heat exchange unit; at least one cooling interface disposed at a heat-transfer interface of an electronic device, where the cooling interface is thermally coupled to the heat exchange unit; and a heat exhaust that is thermally coupled to the heat exchange unit. The heat exhaust exhausts heat from the heat exchange unit to a remote location from the electronic device.

Abstract: A guard device for an externally mounted vehicle refrigeration unit is provided, comprising an open frame assembly constructed from steel tubing, and having a mounting base, wherein the mounting base includes at least two rigid members adapted to connect to a vehicle body. The guard device includes a front airflow portion, a top access port, and a bottom access port. A front airflow panel is connected to and covers the front airflow portion. A pair of side access ports are also provided within the frame assembly, wherein each side access port is adjacent to the front airflow portion. The side access ports are each covered by reinforced side access panels.

Abstract: A heat dissipation apparatus has an enclosure, in which a lateral fan seat is integrally formed with the enclosure. The lateral fan seat divides the interior space of the enclosure into an upper chamber and a lower chamber. An axis is installed across the upper and the lower chambers through a center of the fan seat. A coil set, a magnetic element and a plurality of blades are mounted about the axis in each of the upper and lower chambers. Thereby, two sets of fans are formed in a single enclosure to increase the heat dissipation effect while the assembly convenience is improved.

Abstract: A drive cooling baffle suitable for rack mount computing systems is disclosed. The drive cooling baffle generally includes a main body defining and extending between inlet and outlet openings, at least one opening is configured to cooperate with a fan to cool an electronics component, the main body portion being configured to generally enclose the electronics component and hook and loop material such as Velcro secured to an interior surface of the main body portion, the hook and loop material being configured and disposed to engage with a corresponding hook and loop material secured to the fan and/or the electronics component. The hook and loop material may be secured to indentations defined in the interior surface of the baffle. The baffle may include a flange to be in contact with an electronics components base to which the baffle, the fan, and the electronics component are attached, the flange being configured to engage with a hold down tab defined in the electronics components base.

Abstract: Numerous embodiments of a channeled heat dissipation device and a method of fabrication are disclosed. In one embodiment, a channeled heat dissipation device comprises a base portion having a dissipation surface and a substantially opposed mounting surface, and at least one channel defined in the base portion, wherein said at least one channel extends from said dissipation surface to said mounting surface.

Abstract: A system and method decreases the transmission of structure-borne noise by cooling fans to electronic components and structurally integrated enclosures for the electronic components. The system has a machined isolation plate that fits onto a rear plate on the structurally integrated enclosure. The cooling fans are fitted onto the opposite side of the isolation plate. Fitted between the isolation plate and the rear plate, and/or the isolation plate and the cooling fans are soft elastomeric isolators. These isolators dampen and prevent the transmission of structure-borne noise from the cooling fans to the electronic components and the structurally integrated enclosure. This dampening is advantageous on platforms in which stealth is desired, such as on submarines.

Abstract: A weatherproof cabinet with multiple-compartment cooling includes a housing and a door attached to the housing. The door includes a heat exchanger core, a first duct located at least partially between the heat exchanger door and an exterior of the door, and a second duct located at least partially between the heat exchanger door and an electronics compartment. The door also includes an inlet vent and an outlet vent that are pneumatically interconnected with the first duct. A fan is located at least partially within the first duct and is operative to draw external air into the first duct via the inlet vent, direct at least the first portion of the external air across the heat exchanger core, and then direct the first portion of the external air out of the first duct via the outlet vent. A partition is located within the first duct and separates the inlet vent from the outlet vent so that external air is not drawn into the first duct via the outlet vent during operation of the fan.

Abstract: A front end structure includes a front end panel (400) that is configured as a duct structure for preventing the air introduced from a grille opening (452) from bypassing a condenser (200) and a radiator (100). A fan unit (300) is arranged on the most upstream side portion of the structure. As a result, without the need to provide parts making up a separate duct structure, fresh air flow temperature can be blown in, while at the same time, the air that has passed through the condenser (200) can be prevented from bypassing the radiator (100). Thus, the heat releasing capacity of the condenser (200) and the radiator (100) can be improved while simultaneously preventing leakage between the condenser (200) and the radiator (100) without adding complex structure.

Abstract: Systems and methods for weatherproof cabinets with variably cooled compartments are provided. One such embodiment includes a housing having a door attached thereto, and in which a cooling compartment and a battery compartment are disposed. An electronics compartment is disposed within the cooling compartment, and an external fan is also disposed within the housing. Methods are also provided for transferring heat from inside the electronics compartment to the cooling compartment, from the cooling compartment to the outside of the housing, and from the battery compartment to the outside of the housing.

Abstract: A very thin fan motor with an attached heat sink that has high heat radiation and air cooling effects in a small, flat, thin package, that has a simple and easily assembled overall structure as a fan motor, and that has superior cooling efficiency.

Abstract: A combined liquid tank and fan air flow housing is molded as a unit to combine needed functions in a compact preassembled unit. Separate spaced side tank portions are formed that are joined together with a front end tank to form a central opening with upper and lower ends. The opening is closed with a top plate that defines a plenum chamber and a lower fan support plate that forms a fan chamber in the central opening. A fan in the fan chamber creates an airflow from the exterior through the plenum chamber and out lateral ducts formed in the side tank portions. The inlet air flows through an oil cooler, water radiator and if desired, an air conditioner condenser in the plenum chamber. The tank formed is used for storage of hydraulic fluid.

Abstract: A refrigerated cold beverage merchandiser (10) includes an enclosure defining an insulated, refrigerated display cabinet (25) and a compartment (30) heat insulated therefrom wherein a compressor (40) a condenser (50) and a condenser fan (60) are disposed. The condenser (30) is formed by a plurality of in-line tube banks (52). Each tube bank (52) is a serpentine tube formed a plurality of parallel straight tube segments (54) extending in horizontal rows (55) between a pair of spaced, opposed end plates (58) and elbow turns (56) connecting neighboring straight tube segments (56) in a conventional manner. Each successive tube bank (52) is aligned with the other tube banks so that respective parallel tube rows (55) are disposed in-line from the front to the rear of the condenser (50).

Abstract: An enhanced heat dissipation device to extract heat from an integrated circuit device includes a thermally conductive core having upper and lower outer surface areas. The device further includes a first array of radially extending pin fin structures. The first array is thermally coupled to the upper surface area such that a cooling medium introduced around the core and the first array creates an omni-directional flow around the first array and the core to enhance heat dissipation from the integrated circuit device. The core including the first array and the lower surface area are of sufficient size to allow components on a motherboard to encroach onto the integrated circuit device when the heat dissipation device is mounted onto the integrated circuit device.

Abstract: An engine cooling module 10 which includes a shroud 12, a heat exchanger 18, a fan 14, a motor 13 for driving fan 14, and a plurality of air dams 1. Shroud 12, circumscribing the fan, has a main opening to allow air to pass through the fan to or from a heat exchanger 18. Fan 14 is associated with the shroud 12 to be adjacent to the fan opening to permit air moved by the fan to pass through the heat exchanger. Air dams 1 allow air to flow more easily in one direction than the opposite direction. In the fan flow direction, air dams 1 provide relatively little resistance to the flow. In the direction opposite to fan flow direction, air dams 1 provide more resistance than as compared to the resistance when air flows in the fan flow direction. Under ram air conditions (e.g., when the vehicle is moving), the use of air dams can reduce the load on the fan's motor by cooling properties of ram air, while reducing recirculation, thereby increasing efficiency.

Abstract: Piezoelectric fan assemblies are provided to provide a conduction path and forced convection for space-limited electronic devices in accordance with embodiments of the present invention. The fan blade of a piezoelectric fan is thermally coupled to the heat source, such as, but not limited to, the fins of a heat sink, the condenser of the heat pipe, and to the thermal mass of a heat spreader or block. The high amplitude resonant vibration of the fan blade causes formation of a high velocity unidirectional flow stream. Maximum airflow occurs on axes of the piezoelectric fan's centerline, relative to both width and height dimensions. Air intake is above and below the swept out plane of the fan blade. The air flow provides forced convection for the fan blade and, secondarily, for the heat source.

Abstract: A system and method for securing a fan within an electrical device. The system comprising a housing adapted to capture the fan therein. The housing may comprise a first catch adapted to capture a fan having an having a first thickness within the housing. The system may comprise a second catch adapted to capture a fan having a second thickness within the housing. The method comprises disposing a fan within a fan housing operable to capture fans of different thickness therein.

Abstract: Information handling system component cooling is enhanced with an airflow shroud that directs a primary airflow by a primary fan across the component, the airflow shroud having an opening proximate the component so that a secondary airflow is directed at the component by a secondary fan mounted on the airflow shroud at the opening. The secondary fan removably mounts to the airflow shroud to support hot swapping of a replacement fan and the airflow shroud pivots about a hinge to expose processing components, such as a central processing unit and memory. A finger guard mounted to the airflow shroud across the opening prevents accidental contact with an installed fan.

Abstract: A heat circulation apparatus includes a housing that has a perimeter wall for defining an interior space. The interior space includes an intake port and an exhaust port. The housing is designed for positioning under the steam radiator. A fan member is rotatably coupled to the housing such that the fan member is positioned in the interior space of the housing. The fan member is for drawing air through the intake port into the interior space of the housing and forcing air out of the interior space of the housing through the exhaust port. The fan member is designed for drawing cooler air into the housing and forcing the air out of the housing to be warmed by the steam radiator when the fan member is rotated with respect to the housing.

Abstract: A system for cooling a canister has first, second and third heat pipes. The first heat pipe has an evaporator and a condenser. The first heat pipe is mounted with its evaporator inside the canister and its condenser outside the canister. The second heat pipe has an evaporator conductively coupled to the condenser of the first heat pipe. The second heat pipe has a condenser. The third heat pipe has an evaporator conductively coupled to the condenser of the second heat pipe. The third heat pipe has a condenser with a plurality of fins on the condenser of the third heat pipe.

Abstract: A cooling device for cooling an inner part of an approximately sealed box includes a casing and a heat exchanger disposed in the casing. Plural inside air passages through which air inside the box flows and plural outside air passages through which air outside the box flows are alternately adjacently arranged in the heat exchanger. In the cooling device, both outside air introduction port and outside air discharge port are provided in an outer side plate of the casing, and a drain space is provided between the heat exchanger and the outer side plate of the casing so that outside air passages communicate with the outside air discharge port through the drain space. Thus, even when rain water is introduced into the casing from the outside air discharge port, almost rain water flows downwardly through the drain space, and it can restrict rain water from being introduced into the heat exchanger.

Abstract: A removable fan module is featured. The removable fan module comprises a first member securable to a fan. The first member comprises a portion adapted to engage a corresponding portion of an electrical device. An electronic device also is featured. The electronic device comprises a plurality of removable fan modules. At least one of the plurality of removable fan modules has a first type of fan and at least one of the plurality of removable fan modules has a second type of fan. The removable fan module comprises a fan retainer securable to the first and second type of fan. A portion of the electronic device and the fan retainer are adapted to enable the fan retainer to be received by the electronic device.

Abstract: A heat exchanger having a fluid conveying conduit and a plurality of heat exchange elements thermally coupled with the conduit. The heat exchange elements have heat transfer surfaces that define at least one air flow passage through the heat exchanger that is non-perpendicularly aligned with the conduit. An air blower is operatively associated with the heat exchanger and generates airflow in a direction that is non-perpendicular to the heat exchanger conduit. The air flow direction generated by the blower and the air flow passage defined by the heat transfer surfaces through the heat exchanger may be substantially parallel or form an angle of no greater than approximately 30 degrees.

Abstract: In an air conditioner having a vertical wind deflector in an air outlet, in order to blow almost all of a warm air flow toward a floor surface without leakage on the ceiling surface side at the heating operation time, a recess connecting with an air passage in a housing is formed at the front part of the air outlet, and a vertical wind deflector is disposed in the recess via a support frame. At the cooling operation time, the support frame and the vertical wind deflector are opened integrally, and at the heating operation time, only the vertical wind deflector is opened in a state in which the support frame is stored in the recess.

Abstract: An improved heat exchange apparatus for insertion in a housing comprises heat exchange tubes extending substantially parallel to a direction of fluid flow through the housing and a plurality of spaced and circumferential fins formed along the heat exchange tubes and extending substantially perpendicular to the direction of fluid flow through the housing. Preferably the housing is fit with a fluid mover for driving the fluid over the tubes. The improved heat exchanger can be applied in a method for extermination of pests comprising providing a minimal envelope, heating ambient air within the envelope using the improved heat exchanger and discharging the heated air into the envelope so that the temperature of air in the envelope is sufficiently high to kill pests. Moving air across steam filled tubes enables use of the system in explosion classified areas and without damage to goods or equipment.

Abstract: A heat dissipation system includes an enclosure (10), a motherboard (30), a CPU module, a plurality of first system fan (80) and a second fan (90). The enclosure includes a first panel (12), a second panel (14) perpendicular to the first panel and a third panel (16) parallel to the first panel. A plurality of air inlets (18) is defined in the third panel. The motherboard is mounted inside the enclosure parallel to but opposite from the second panel. The CPU module is secured to the motherboard. The first fan is secured to the first panel for expelling air inside the enclosure to an outside of the enclosure. The second fan is secured to the second panel for causing air entering the enclosure via the air inlets to be directed generally toward the CPU module.

Abstract: A heat dissipation apparatus for a notebook computer with a desktop central processing unit is described. The heat dissipation apparatus has a heat pipe, a first heat exchanger, a first fan, a second heat exchanger, and a second fan. The heat pipe couples with the desktop central processing unit to absorb heat therefrom. The first heat exchanger couples with the heat pipe directly above the desktop central processing unit. The first fan blows on the first heat exchanger to remove internal heat. The second heat exchanger couples with the heat pipe to absorb the residual heat from the heat pipe and the second fan blows on the second heat exchanger to remove the residual heat. The second fan starts working when the internal temperature of the notebook computer is too high. Both the first fan and second fan comprise two inlets respectively, and therefore the cold air is from both inside and outside of the notebook computer.

Abstract: A computer system employing redundant cooling fans. A system includes a first and a second array of circuit boards and a first and a second cooling fan. The two arrays of circuit boards are positioned such that the first array of circuit boards is substantially perpendicular to the second array of circuit boards. The first fan is positioned close to the first array of circuit boards and the second fan is positioned close to the second array of circuit boards. The first fan is positioned to force intake air across the first and the second arrays of circuit boards and the second fan is positioned to exhaust the forced intake air after it passes over the second array of circuit boards. Each of the fans may be hot swappable.

Abstract: A liquid cooled radiation module for servers is installed in a server to directly dissipate heat from a central processing unit through a liquid cooling fashion. The module includes a body which has a housing compartment to house a liquid tube and a radiator. The radiator has an air sucking section to draw heated air in the housing compartment and an air discharge section to discharge heat through an air vent. The liquid tube has a water delivery device driven magnetically by the radiator to form liquid circulation to continuously disperse heat from the CPU. The module thus made is compact and adaptable to servers of 1U or 2U specifications.

Abstract: The present invention is directed to a thermosyphon heat exchanger. The thermosyphon system eliminates the need for costly and inefficient moving parts in the cooling system. The system also minimizes failures rendering the system inoperable by eliminating mechanical components subject to breakdowns that would render the system inoperable. The design of the heat exchanger coils provides for increased efficiency, reduced cost, and simplified construction and maintenance. The system further reduces the energy consumption required for cooling operation while still providing excellent cooling performance.

Abstract: A horizontal rooftop engine cooling system includes one or more radiator units horizontally mountable to the rooftop of a bus and including a radiator interconnected to one or more passages of an engine of the bus to allow coolant to flow between the engine and the rooftop cooling system to cool the engine. The cooling system can incorporate a fan mounting shroud, a ram-air aerodynamic shroud, and/or an ornamental aesthetic appearance shroud.

Abstract: A cooling system for a processor-based system may include a housing that contains a heat exchanger, a tank, and an internal pump that pumps fluid through the heat exchanger and through a cooling plate coupled thermally to a processor to be cooled.

Abstract: A turbomachinery system for cooling a high power density device includes a turbomachine configured to deliver a high flux cooling medium and a high power density device arranged in fluid communication with the turbomachine, the turbomachine having a motor and a compressor driven by the motor.

Abstract: Numerous embodiments of a channeled heat dissipation device and a method of fabrication are disclosed. In one embodiment, a channeled heat dissipation device comprising a base portion having a dissipation surface and a substantially opposed mounting surface, and at least one channel defined in the base portion, wherein said at least one channel extends from said dissipation surface to said mounting surface.

Abstract: A heat exchanger system includes one or more nonmetallic finless heat exchanging tubes. The heat exchanging tubes are coiled around a central axis, and vehicle fluid flowing through the tubes is cooled or heated by airflow perpendicular to the central axis.

Abstract: A cooler for electronic devices provides cool air to the inlet sides of the heat sink by using a radial blower with blades located around air outlets of the heat sink. This blower is driven by a brushless DC electric motor. The motor has an opening in the center allowing for the transfer of incoming air to the center of the heat sink. Th rotors outer circumferential arrayed poles are rigidly secured to the frame of the radial blower. The stator of the motor is rigidly secured to the heat sink and has an opening in its center. The stator comprises circumferential arrayed coils on circuit board material. When the current flows through the stator coils, the coils acquire a magnetic polarity. The poles of the rotor and stator coils attract and repel depending on the polarities. The cool air comes simultaneously from opposite sides of the heat sink. For this reason the heat sink has a divider located approximately in the middle of the heat sink fins.