Abstract: A V-shaped heat exchanger apparatus providing a support pedestal on which on at least one side thereof a frame assembly is removably coupled to the pedestal structure. The frame assembly includes preferably as a unitary element, a frame and at least one heat exchanger fixedly secured thereto.

Abstract: A heat-transfer system is provided for conveying heat from a heat source, the heat-transfer system generally including a frame for coupling to the heat source, wherein the frame is insertable into a first slot of a cooling chassis, and a heat-transfer rail extending parallel to the frame at an offset distance, wherein the offset distance is dimensioned such that the heat-transfer rail is insertable into a second slot of the cooling chassis. At least one heat-transfer device couples the heat-transfer rail to the frame.

Abstract: A mounting bracket for use in core device such as a heat exchanger is disclosed. The device has a plurality of tubes disposed in stacked, spaced relation such that side surfaces thereof define opposed faces of the core device. The bracket comprises a cap portion and a filler portion. The cap portion, in use, is disposed against and secured to a portion of one of the faces of the core device defined by side surfaces of a pair of adjacent tubes. The filler portion extends from the cap portion and is interleaved, in use, between the pair of adjacent tubes, and has opposed faces abutting and secured to respective portions of said adjacent tubes. The bracket can be brazed to the core device and have an aperture for threadingly receiving a threaded shaft for mounting a component to the core device. The tubes can be of the stacked-plate type.

Abstract: An exemplary heat dissipation apparatus includes a bracket, a reticular cover fixed to the bracket and a receiving space being defined with the bracket, and a tray received in the receiving space. The tray includes a first surface and a second surface. A number of first through holes is defined on the bracket. A number of second through holes is defined on the tray respectively corresponding to the first through holes, each of the second through holes extends obliquely from the first surface of the tray to the second surface of the tray relative to a vertical line of the first and second surfaces of the tray. A first magnet is installed on the first surface of the tray, a second magnet corresponding to the first magnet is installed on the bracket.

Abstract: A cooling arrangement for the stator of an electric machine provided with coils including heads is described herein. The cooling arrangement includes a generally cylindrical cooling body provided with opposite longitudinal ends. Heat transfer material embeds the heads of the coils and contact the cooling body. A coil head embedding assembly and method are also described herein.

Abstract: A heat engine system is disclosed and includes first and second condensers fluidly and structurally coupled to first and second recuperators. An expansion device is coupled to the condensers at a drive end and suspended from the recuperators at a non-drive end. The recuperators can be printed circuit heat exchangers which provide superior heat transfer capabilities but are also robust enough to support the expansion device, and thereby form an integral part of a structural baseplate for mounting and aligning various components of the heat engine system. Exhaust conduits extending between the expansion device and the recuperators also provide added structural support for the expansion device.

Abstract: A method for cooling an imaging device includes providing, by a cold finger, a cold sink to the imaging device and conducting heat from a cold shield, a sensor chip assembly and a leadless chip carrier towards the cold finger through a plurality of parallel paths. The imaging device includes a dewar assembly having a cold shield, a sensor chip assembly disposed on a leadless chip carrier (LCC) and configured to capture an infrared image, a cold finger configured to cool the dewar assembly; and a thermal adapter. The thermal adapter is configured to draw heat from the cold shield and sensor chip assembly through a plurality of parallel paths towards the cold finger.

Abstract: An immersion cooling tank includes: a tank comprised of a base wall, and perimeter walls, and having a lower tank volume in which a liquid can be maintained and heated to a boiling point to generate a rising plume of vapor; a rack structure within the tank volume that supports insertion of multiple, heat dissipating electronic devices in a side-by-side vertical configuration; and a condenser configured as a plurality of individually rotatable condenser sub-units, with each condenser sub-unit located above a vertical space that extends vertically from the lower tank volume and within which an electronic device can be inserted. Each individual condenser sub-unit can be opened independent of the other sub-units and each other condenser sub-unit can remain in a closed position while a first condenser sub-unit is opened to allow access to a first vertical space and any existing electrical device contained therein below the first condenser sub-unit.

Abstract: An exhaust gas cooler for a motor vehicle is provided that includes a first collector box on an inlet side and a second collector box on an outlet side, and a plurality of exchanger tubes extending between the collector boxes for exhaust gas to flow through. Air can flow around the exchanger tubes so as to cool the exhaust gas. At least one supporting member is attached to at least one of the collector boxes, a force produced by the thermal expansion of the exchanger tubes being passed into the supporting member.

Abstract: A bracket for stabilizing a heat exchanger has a base member extending between first and second ends. An aperture at the first end of the base member receives a fastener. The bracket is fixedly secured to a vehicle through the fastener. A flex zone extends between the first and second ends of the base member. The flex zone is movable between a first, relaxed position and a second, flexed position.

Abstract: A heat exchanger comprises a stack of mutually spaced apart plates. The plates are separated by respective spacings therebetween. Alternate spacings respectively provide a flow path for a first fluid and a second fluid. The heat exchanger further comprises a first header for inflow of the first fluid and a second header for outflow of the first fluid. The first and second headers are connected to the plate stack by flexible tubular ducting means.

Abstract: Air exchange device for buildings, comprising: an elongated casing; a heat exchanger housed inside said casing; and a first fan unit and a second fan unit arranged to generate respective airflows in a relationship of mutual heat exchange in said heat exchanger, wherein the first and the second fan units each comprise at least one electric fan having a hollow support casing having an intake opening and a discharge opening, wherein a duct for the passage of an airflow is defined within said support casing, which contains an electric motor that drives a rotor; a damping elastic support of low-density polymeric material housed inside said casing, wherein said electric fans of said fan units are supported in a freely floating manner within their respective seats formed within said damping elastic support.

Abstract: A liquid coolant supplying header is configured on a central portion in the width direction between an upper portion heatsink and a partitioning plate, a liquid coolant discharging header is configured on a central portion in the width direction between a lower portion heatsink and the partitioning plate so as to be parallel to the liquid coolant supplying header, vertical flow channels are formed so as to pass through the partitioning plate vertically on two sides in the width direction so as to be parallel to the liquid coolant supplying header, a liquid coolant distributing structural body is disposed inside the liquid coolant supplying header, and an external shape of the liquid coolant distributing structural body is formed such that flow channel cross-sectional area of the liquid coolant supplying header becomes gradually smaller from an upstream end toward a downstream end.

Abstract: An exemplary heat sink assembly includes a heat sink, a connecting member, and a mounting member. A mounting hole and a receiving hole are defined in the heat sink and communicating with each other. The connecting member is adapted for fixing the heat sink. The connecting member includes a connecting section and an extending section extending from the connecting section. The mounting member fixes the connecting member to the heat sink. The connecting section is received in the receiving hole of the heat sink, the extending section is protruding from the heat sink, and the mounting member extends through the mounting hole and engaging with the connecting section to fix the connecting member to the heat sink.

Abstract: A cooling system utilizing a potential energy that provides cooling with low power consumption is disclosed. The cooling system may comprise a heat dissipating member, a support structure, a movable assembly, and a coil. In one embodiment, the movable assembly may be configured to oscillate above the heat dissipating member by utilizing induction from the coil and the potential energy to generate air flow that provide cooling on the heat dissipating member. In other embodiments, the movable assembly may be configured to oscillate substantially within the recess of the heat dissipating member.

Abstract: An air cooled condenser fan deck subassembly system and method including eight subassembly parts which are pre-assembled prior to arrival at the final assembly location. The eight subassembly parts include four inner subassembly parts and four outer subassembly parts, each of which are sized to fit in a standard sea container. Once the eight fan deck subassembly parts are delivered to the site, they are unloaded and bolded together, resulting in significant time and cost savings to the purchaser and erector.

Abstract: A heat pipe mounting method and a heat pipe assembly thereof are disclosed. The method includes the step of providing a heat-transfer block and a plurality of heat pipes. A plurality of heat pipe grooves is formed on the heat-transfer block. The heat pipes are then press-fitted to respective heat pipe grooves. During the press-fitting step, the heat pipes are flattened to force the flattened part of one heat pipe into abutment against the flattened part of another heat pipe in a flushed manner. Thereby, the heat pipes are abutted to each other with no separation therebetween. Hence, the heat transfer performance is increased.

Abstract: A system and method for manipulating environmental conditions in an infrastructure containing a fluid moving device are disclosed that include identifying correlations between operational settings of the fluid moving device and environmental conditions resulting from changes to the operational settings. In addition, an environmental condition detected at a location proximate to or within the plenum following supply of fluid into the plenum by the fluid moving device is received and errors between the received environmental condition and a reference environmental condition are identified. Operational settings for the fluid moving device to achieve the reference environmental condition are determined based upon the identified correlations and errors.

Abstract: A bracket for supporting an electronic device includes receiving part and a heat-radiating unit. The receiving part detachably receives the electronic device and defines a receiving groove. The head radiating unit is detachably received in the receiving groove. The heat-radiating unit comprises at least one heat dissipating element received in the receiving groove. The heat dissipating elements are positioned corresponding to heat-generating components of the electronic device. Heat generated by the heat-generating components is absorbed by the heat dissipating elements and then immediately.

Abstract: A variable-thermal-resistance mounting system may include a cylinder coupled to a heat source, or heat load and a rod movably engaged to the cylinder and coupled to a remaining one of the heat source and heat load. The rod may be coupled to a heat load. The rod may be axially slidable relative to the cylinder between a collapsed position and an extended position in a manner causing a change in heat flow between the heat source and the heat load such that the warm-side temperature of the heat load is initially set at a substantially optimal value.

Abstract: Provided is a solar light concentrating system which realizes suppression of power generation costs by applying a receiver 2 that is capable of suppressing a manufacturing cost to a low level, facilitating recovery work when a failure occurs, and quickly recovering a heating medium circulating inside in case of an emergency. The receiver 2 is formed by three-dimensionally combining multiple modules 20. At least a part of the modules is a trapezoid-shaped module 20B. The trapezoid-shaped module includes an upper header 21B, a lower header 22B being shorter than the upper header, and multiple heat receiving tubes 23 which connect the two headers. The heat receiving tubes are formed by successively altering their cross-sectional shapes in away that makes each heat receiving tube shaped like a wedge that becomes narrower from its top toward its bottom in a front view, and like a wedge that becomes wider from its top toward its bottom in a side view.

Abstract: A heat exchange system can include a heat exchange unit and a magnetic element. The heat exchange unit can have a housing and a heat exchange surface configured to thermally couple to a subject of heat exchange. The housing can define an outer surface spaced apart from the heat exchange surface. A magnetic element, a ferrous element, or both, can be positioned within the housing. A coupling agent can have a complementary magnetic element, ferrous element, or both. The coupling agent can interact with the magnetic element, the ferrous element, or both, positioned within the housing. The coupling agent can be coupled to a substrate to retain the heat exchange unit relative to the substrate.

Abstract: A cooling system for a high performance computing system includes a closed-loop cooling cell having two compute racks and a cooling tower between the compute racks. Each compute rack includes at least one blade enclosure, and the cooling tower includes at least one water-cooled heat exchanger and one or more blowers configured to draw warm air from a side of the compute racks towards a back, across the water-cooled heat exchanger, and to circulate cooled air to a side of the compute racks towards a front. The cooling cell further includes a housing enclosing the compute racks and the cooling tower to provide a closed-loop air flow within the cooling cell. The cooling system further includes cooling plate(s) configured to be disposed between two computing boards within the computing blade, and a fluid connection coupled to the cooling plate and in fluid communication with the blade enclosure.

Abstract: A method of harnessing geothermal energy to produce electricity by lowering a geothermal generator deep into a pre-drilled well bore below the Earth's surface. The Self Contained In-Ground Geothermal Generator (SCI-GGG) includes a boiler, a turbine compartment, an electricity generator, a condenser and produces electricity down at the heat sources and transmits it up to the ground surface by cable. The Self Contained Heat Exchanger (SCHE) is integral part of (SCI-GGG) system and can function independently. It consists of a closed loop system with two heat exchangers. No pollution is emitted during production process. There is no need for hydro-thermal reservoirs although not limited to hot rocks. It can be implemented in many different applications. The SCHE also includes an in-line water pump operatively coupled to the closed loop system and can be used in many different applications.

Abstract: Cooling apparatuses and methods are provided for facilitating pumped immersion-cooling of electronic components. The cooling apparatus includes a housing forming a compartment about one or more components, a supply manifold, a return manifold, and a coolant loop coupling in fluid communication the supply and return manifolds and the housing. Coolant flowing through the coolant loop flows through the compartment of the housing and at least partially immersion-cools the component(s) by flow boiling. A pump facilitates circulation of coolant within the loop, and a coolant bypass line is coupled between the supply and return manifolds. The return manifold includes a mixed-phase manifold section, and the bypass line provides coolant from the supply manifold directly to the mixed-phase manifold section. Coolant flows from the coolant bypass line into the mixed-phase manifold section in a direction counter to the direction of any coolant vapor flow within that manifold section.

Abstract: A zone-control unit for use in a heating, ventilation, and air conditioning (HVAC) system, the zone-control unit includes a heat exchanger, an inlet piping assembly coupled with the heat exchanger for supplying fluid to the heat exchanger, an outlet piping assembly coupled with the heat exchanger for receiving fluid from the heat exchanger, a bracket that maintains the inlet piping assembly and the outlet piping assembly in positional relationship, and an ancillary component coupled with the heat exchanger.

Abstract: A heat engine system is disclosed and includes first and second condensers fluidly and structurally coupled to first and second recuperators. An expansion device is coupled to the condensers at a drive end and suspended from the recuperators at a non-drive end. The recuperators can be printed circuit heat exchangers which provide superior heat transfer capabilities but are also robust enough to support the expansion device, and thereby form an integral part of a structural baseplate for mounting and aligning various components of the heat engine system. Exhaust conduits extending between the expansion device and the recuperators also provide added structural support for the expansion device.

Abstract: An apparatus for removing heat comprises a heat sink having a cavity, and a synthetic jet stack comprising at least one synthetic jet mounted within the cavity. At least one rod and at least one engaging structure to provide a rigid positioning of the at least one synthetic jet with respect to the at least one rod. The synthetic jet comprises at least one orifice through which a fluid is ejected.

Abstract: Heat exchanger and a retention element for the heat exchanger, the retention element having a receiving region and a spacing element, and the receiving region at least partially receiving the heat exchanger, wherein the receiving region has a contour which substantially corresponds to an outer contour of the heat exchanger, the receiving region having fixing means, by means of which the retention element can be fixed to the heat exchanger, the spacing element protruding outwards from the retention element and protruding beyond the outer contour of the heat exchanger.

Abstract: An exemplary heat dissipation device includes a bracket, and heat sink and a pressing member. The bracket includes a bottom plate. An opening is defined in the bottom plate. Two supporting portions are formed from an underside of the bottom plate. The heat sink extends through the opening of the bracket, with bottom edges of the heat sink rested on the supporting portions. The pressing member is mounted on the bracket and elastically presses the heat sink onto the supporting portions.

Abstract: A heat-transfer device and system for conducting heat from a heat source. The heat-transfer device can include an evaporator having one or more reinforcement elements occupying respective recesses defined in a body of the evaporator, wherein the reinforcement elements are more resistant to deformation under clamp load than the material of the evaporator body, while still having desirable heat conductivity. In some embodiments, the heat-transfer system includes a plurality of serially coupled evaporators for generating a respective vapor; at least one reinforcement element interposed between adjacent evaporators; and a condenser in fluid communication with the evaporator.

Abstract: A machine has a mount, a support mounted pivotally to the mount to pivot relative to the mount about a first pivot axis between a first support position and a second support position, and a heat exchanger. The heat exchanger is mounted pivotally to the support to pivot relative to the support about a second pivot axis between a first exchanger position and a second exchanger position.

Abstract: A machine tool includes a frame providing the setting in motion of a tool and a workpiece holder module to be machined. The machine tool includes a plurality of heat exchangers inside of which flows a heat-transfer fluid, the exchangers being connected together and coming into contact with the frame as well as with the workpiece holder module, characterised by the fact that it comprises a climatization unit with scalable power.

Abstract: A membrane support assembly is configured to be used with an energy exchanger, and is configured to be positioned within a fluid channel between first and second membranes. The assembly may include at least one support member configured to span between the first and second membranes, wherein the support member(s) is configured to support the fluid channel, and at least one turbulence promoter connected to the support member(s). The turbulence promoter(s) is configured to promote fluid turbulence within the fluid channel. The fluid turbulence within the fluid channel enhances energy transfer between the fluid channel and the first and second membranes.

Abstract: Dehumidifying cooling apparatus and method are provided for an electronics rack. The apparatus includes an air-to-liquid heat exchanger disposed at an air inlet or outlet side of the rack, wherein air flows through the rack from the air inlet to the air outlet side. The heat exchanger is positioned for air passing through the electronics rack to pass across the heat exchanger, and is in fluid communication with a coolant loop for passing coolant therethrough at a temperature below a dew point temperature of the air passing across the heat exchanger so that air passing across the heat exchanger is dehumidified and cooled. A condensate collector, disposed below the heat exchanger, collects liquid condensate from the dehumidifying of air passing through the electronics rack, wherein the heat exchanger includes a plurality of sloped surfaces configured to facilitate drainage of liquid condensate from the heat exchanger to the condensate collector.

Abstract: A ram outlet header includes a ram outlet header body. A ram air fan mounting neck and a ram air fan mounting flange are configured to couple the ram outlet header to a ram air fan housing. A heat exchanger mounting flange is configured to couple the ram outlet header to a heat exchanger assembly. A lower face includes a first stiffener. A mid-section includes a second stiffener, a third stiffener, and a fourth stiffener. The ram air fan mounting flange is positioned between the lower face and the mid-section. A ratio of thickness of the second stiffener to the third stiffener is between 1.04 and 1.16, and a ratio of thickness of the fourth stiffener to the third stiffener is between 1.04 and 1.16.

Abstract: A handheld jig for placement on a radiator and associated method to repair broken welds of tabs of a radiator mounting cradle used to hold a radiator of a vehicle such as a HMMVE where the tabs may be pressed against angled surfaces of the radiator, the jig having a base, a first arm extending from the base, a second arm extending from the base, and a third arm extending from the base, the first arm, second arm and third arm each capable of holding an adjustable pin to selectively contact a tab of the cradle to press the respective contacted tabs against respective angled surfaces of the radiator.

Abstract: In a radiator core support 1 having a hood lock stay member 3, which is provided with a hood lock 14, on a radiator core support 1 of a motor vehicle, a transmission means is provided to connect between the hood 7 of a vehicle body to directly transmit load acting on the hood lock 14 from an engine hood from the hood lock stay member 3 to the side members 1.

Abstract: The add-on heat sink includes an elongate base having a plurality of fins extending from a surface thereof. A magnetic layer is disposed on the bottom of the base, which permits the add-on heat sink to be installed on any ferromagnetic heated surface. The magnetic layer is composed of either a polymer matrix having a plurality of thermally conductive structural components and a plurality of magnetic particles dispersed therein, or a thermally conductive polymer having magnetic particles dispersed therein. Alternatively, if the heated surface is not ferromagnetic, the heat sink may be magnetically attached by adhesively attaching mating magnetic and ferromagnetic pads to the heat sink and to the heated surface. This configuration allows the add-on heat sink to be installed with minimal footprint. Optionally, a fan may be magnetically attached to the heat sink to cool the heated surface by both conduction and convection.

Abstract: A data center cooling system includes a plurality of cooling units positioned adjacent a warm air plenum that is in airflow communication with a plurality of electronic devices supported in a plurality of racks. Each of the cooling units includes a heat exchanger arranged to cool warmed air circulated into the warm air plenum from a human-occupiable workspace adjacent the plurality of racks opposite the plurality of cooling units, and a fan arranged to circulate the warmed air from the warm air plenum through the heat exchanger and to the human-occupiable workspace. The cooling system includes a control system electrically coupled to the fan and configured to modulate a fan speed of the fan of each cooling unit to induce a pressure gradient in the warm air plenum.

Abstract: A thermal interface unit includes a pedestal, a first contact surface below the pedestal to interface with a first die and a flat spring to enable the first contact surface to adapt to a variable height of a first die of a multi-chip package (MCP).

Abstract: A fluid-cooled heat sink (1) for electronic components having a heat exchanger (2) which can be associated with at least one electronic component (3), the heat exchanger having at least one channel (6) with an inlet (7) and an outlet (8) for a cooling fluid. The heat exchanger (2) having a first outer surface (4) for contact with the electronic component (3) and a second outer surface (5). The heat sink (1) having a stiffening element (15) operating on the heat exchanger (2) at the second outer surface (5) for associating and pressing the heat exchanger (2) on the electronic component (3).

Abstract: A heat dissipation apparatus for an electronic component installed in an enclosure of an electronic device includes a bracket and a heat sink. The bracket includes a supporting plate, an elastic positioning plate extending slantingly up from a side of the supporting plate away from the electronic component, and an installation plate extending from the positioning plate to be attached to the enclosure. The heat sink is fixed to the supporting plate to abut against the electronic component.

Abstract: An assembly includes a board, a heat sink, one or more retainers, and/or one or more light-emitting diode packages. The board includes a face surface, a rear surface opposite the face surface, and side edges. The one or more retainers are configured to secure the board to the heat sink. One or more light-emitting diode packages can be secured to the board for creating a light-emitting device assembly.

Abstract: In one aspect, the present invention relates to a structural assembly including a first frame member hingedly coupled to a second frame member. A support member extends outwardly from the first frame member. At least one glazing panel is disposed above the support member. A thermal clip is coupled to the support member. The thermal clip insulates the support member from a building exterior. The support member extends less than an entire length thereof and reduces loss of thermal energy from a building interior to the building exterior via the support member.

Abstract: The present invention relates to a mechanical draft cooling tower that employs air cooled condenser modules. The aforementioned cooling tower operates by mechanical draft and achieves the exchange of heat between two fluids such as atmospheric air, ordinarily, and another fluid which is usually steam. The aforementioned cooling tower utilizes a modular air cooled condenser concept wherein the air cooled condensers utilize heat exchange deltas that use tube bundles that are manufactured and assembled prior to being shipped to the tower site.

Abstract: A coldplate for use with electronic components in an electric vehicle (EV) or a hybrid-electric vehicle (HEV). The coldplate includes a main portion having multiple raised features on a surface thereof. The raised features are configured for attaching the main portion to a printed circuit board having multiple electronic components attached thereto. The raised features are further configured for maintaining the printed circuit board in a spaced relation relative to the main portion to facilitate air flow between the printed circuit board and the main portion for dissipating heat generated by the plurality of electronic components. The coldplate also includes a protrusion extending from the surface of the main portion. The protrusion is configured for contacting one of the plurality of electronic components attached to the printed circuit board for dissipating heat generated by the electronic component.

Abstract: A coldplate for use with a transformer in an electric vehicle (EV) or a hybrid-electric vehicle (HEV). The coldplate includes a main portion having a recess formed therein, the recess having a floor configured for contacting a bottom surface of a transformer for dissipating heat generated by the transformer. The main portion includes a raised feature configured for contacting a winding of the transformer for dissipating heat generated by the transformer. The coldplate also includes a bracket member for use in securing the transformer in the recess of the main portion, the bracket member configured for contacting the main portion and the transformer for dissipating heat generated by the transformer. The bracket member includes a contact surface for contacting a top surface of the transformer, the contact surface having an area sufficient to contact substantially all of the top surface of the transformer.

Abstract: The present invention is directed to apparatus and methods for cooling computer servers and/or electrical equipment in a rack device for data centers or telecommunication centers.

Abstract: An exemplary heat sink assembly includes a base plate, a number of fins, a heat spreader and a heat pipe. The fins are mounted on and thermally connect with the base plate for dissipating heat of the base plate. A bottom one of the fins has a body parallel to the base plate and a number of supporting tabs extending downwardly from the body. The supporting tabs engage with a top surface of the base plate to support the fins onto the base plate and reinforce a whole strength of the heat sink assembly. The heat spreader is mounted below the base plate. The heat pipe includes a horizontal evaporating portion sandwiched between the heat spreader and the base plate and a vertical condensing portion extending from a free end of the evaporation portion and passing through the fins.