With External Support Patents (Class 165/67)
-
Publication number: 20130299132Abstract: Heat exchanger assemblies and manufacturing methods that are capable of promoting continuously downward and/or horizontal flow of fluids through a coolant tube of a heat exchanger assemble to reduce the risk of internal clogging. The heat exchanger assembly includes at least one coil adapted to contain a fluid therein and at least two support members supporting the coil. The coil is formed of at least one tube having an inlet at an uppermost extent thereof, an outlet at a lowermost extent thereof, a plurality of parallel horizontal rows, and a plurality of bends at opposite ends of the horizontal rows and fluidically interconnecting the horizontal rows thereof in series to define a serpentine configuration. The coil is adapted to achieve a continuously downward and/or horizontal flow of the fluid therein.Type: ApplicationFiled: May 13, 2013Publication date: November 14, 2013Applicant: Blissfield Manufacturing CompanyInventor: Dallas Guilford
-
Publication number: 20130299131Abstract: According to embodiments of the present invention, there is provided an adjustable heat dissipation assembly and a method for manufacturing and assembling same. The heat dissipation assembly may include: a heat dissipation frame including a base with at least two side walls, the base and the side walls define an internal space suitable for accommodating a device that requires cooling; and an adjustable plate, configured to be placed over the device in between the side walls, and secured to the side walls, the distance of the adjustable plate from the base of the heat dissipation frame when it is not secured to the side walls being adjustable.Type: ApplicationFiled: May 14, 2012Publication date: November 14, 2013Inventors: Alexander TIMASHOV, Oxana SAVVATYEYEV, Evgenia GIDVARG
-
Patent number: 8583289Abstract: A climate control system or a data center includes a computer room air conditioner (CRAC) and an air economizer. A control module determines whether outside air is suitable for use in cooling the data. If the outside air is suitable for use, outside air and not the CRAC is used to cool the data center when the dry bulb temperature of the outside air is below a minimum set point. The outside air is conditioned before it is introduced as supply air so that it is above a minimum temperature. If the outside air is suitable for use and the dry bulb temperature of the outside air is above the set point, the control module determines a cooling percentage of cooling of the data center to be provided by the CRAC and a cooling percentage to be provided by the outside air.Type: GrantFiled: February 16, 2009Date of Patent: November 12, 2013Assignee: Liebert CorporationInventors: John F. Stack, Stephen A. Mowrer
-
Publication number: 20130292087Abstract: A gasification reactor with a heat exchange unit having a gas flow channel and one or more heat exchangers arranged within the gas flow channel, the heat exchangers having one or more heat exchange surfaces and one or more associated structures, such as a support structure or deflector plates. The associated structures are provided with fouling protection devices, such as blasters or flow guiding surfaces.Type: ApplicationFiled: August 26, 2011Publication date: November 7, 2013Inventors: Alfons Heitmann, Thomas Paul Von Kossak-Glowczewski, Juergen Kowalow
-
Publication number: 20130284399Abstract: A heat dissipating apparatus includes an enclosure, a supporting frame attached in the enclosure, and a heat exchanger. The enclosure includes two opposite side plates, each of which defines at least one guiding groove. The heat exchanger is mounted to the supporting frame. The heat exchanger includes two opposite sidewalls and at least one positioning post protruding from each of the two sidewalls. Each of the at least one positioning posts is slidably received in, positioned by, and held captive in, one of the at least one guiding grooves.Type: ApplicationFiled: December 29, 2012Publication date: October 31, 2013Applicants: HON HAI PRECISION INDUSTRY CO., LTD., HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTDInventor: XU YANG
-
Patent number: 8561678Abstract: A heat exchanger (such as a radiator) that provides for a consistent tank-to-header joint location. The tank generally includes at least two indentations and at least one isolator having a base at least partially disposed in one of the indentations and a coupler extending from the base for coupling the tank to at least one other component of the heat exchanger.Type: GrantFiled: May 13, 2010Date of Patent: October 22, 2013Assignee: Richardson Cooling Packages, LLCInventors: David J. Richardson, Brian Meier
-
Patent number: 8561679Abstract: A heat exchanger (such as a radiator) that provides for a consistent tank-to-header joint location. The header generally includes a drafted wall that is movable adjacent to or within a tank and may include a curved fillet to maintain header alignment.Type: GrantFiled: May 13, 2010Date of Patent: October 22, 2013Assignee: Richardson Cooling Packages, LLCInventors: David J. Richardson, Brian Meier
-
Publication number: 20130264027Abstract: A heat exchanger door and heat exchanger core optimization method are provided. The door resides at an air inlet or outlet side of an electronics rack, and includes an air-to-coolant heat exchanger with a heat exchanger core. The core includes a first coolant channel coupled to a coolant inlet manifold downstream from a second coolant channel, and the first channel has a shorter channel length than the second channel. Further, coolant channels of the core are coupled to provide counter-flow cooling of an airflow passing across the core. The core optimization method determines at least one combination of parameters that optimize for a particular application at least two performance metrics of the heat exchanger. This method includes obtaining performance metrics for boundary condition(s) of possible heat exchanger configurations with different variable parameters to determine a combination of parameters that optimize the performance metrics for the heat exchanger.Type: ApplicationFiled: April 10, 2012Publication date: October 10, 2013Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Eric A. ECKBERG, Howard V. MAHANEY, JR., William M. MEGARITY, Roger R. SCHMIDT, Tejas SHAH, Scott A. SHURSON
-
Publication number: 20130264026Abstract: An air-cooling apparatus is provided which includes a heat exchanger door and a catch bracket. The door is hingedly mounted to the air inlet or outlet side of an electronics rack, and includes: a door frame spanning at least a portion of the air inlet or outlet side of the rack, wherein the frame includes an airflow opening which facilitates airflow through the rack; an air-to-coolant heat exchanger supported by the door frame and disposed so that airflow through the airflow opening passes thereacross; and a door latch mechanism to selectively latch the heat exchanger door to the rack. The catch bracket is attached to the rack and sized to extend from the rack into the heat exchanger door through a catch opening, and the door latch mechanism is configured and mounted within the heat exchanger door to physically engage the catch bracket within the heat exchanger door.Type: ApplicationFiled: April 10, 2012Publication date: October 10, 2013Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Eric A. ECKBERG, Howard V. MAHANEY, JR., William M. MEGARITY, Roger R. SCHMIDT, Tejas SHAH, Scott A. SHURSON
-
Patent number: 8550148Abstract: A structure of heat plate with clip includes a heat plate and at least one clip. The heat plate is a hollow body having an interior cavity containing a capillary structure and a working fluid. The heat plate has a surface forming a receiving chamber. The clip is a resilient plate having mounting sections, which are mounted to the heat plate. The mounting sections have a portion received in the receiving chamber. In this way, replacement of inside-cavity supporting structure can be realized and advantages of thinned structure, flexible adjustment of positioning, and being hard to cause stress induced deformation can be achieved.Type: GrantFiled: October 13, 2010Date of Patent: October 8, 2013Assignee: Kunshan Jue-Choung Electronics Co., Ltd.Inventors: Yu-Po Huang, Tung-Jung Kuo
-
Publication number: 20130255914Abstract: A heat sink assembly includes a heat sink, a bracket, and an airflow guide member. The heat sink defines an air outlet at a rear end of the heat sink. The bracket includes two side plates respectively fastened to rear ends of opposite sides of the heat sink. A number of vertically arrayed protrusions are formed on a rear end of an inner surface of one of the side plates. The airflow guide member is pivotably connected between the side plates. An end of the airflow guide member engages with a different one of the protrusions, to position the airflow guide member at a different angle relative to the heat sink.Type: ApplicationFiled: June 4, 2012Publication date: October 3, 2013Applicants: HON HAI PRECISION INDUSTRY CO., LTD., HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTDInventors: SHAO-GUANG SU, XIAO-FENG MA
-
Publication number: 20130255913Abstract: A transport refrigeration system generally includes a support structure, a heat exchanger, and at least two pairs of mounts for mounting the heat exchanger to the support structure. The support structure is configured to be coupled to a transport container. The heat exchanger includes two sides and defines a longitudinal direction that extends from one side to the other side. Each pair of mounts includes a fixed mount coupled to one side of the heat exchanger, and a floating mount coupled to the other side of the heat exchanger, the floating mount positioned substantially opposite to the fixed mount in the longitudinal direction.Type: ApplicationFiled: March 30, 2012Publication date: October 3, 2013Applicant: Thermo King CorporationInventor: Scott A. Zwiefel
-
Patent number: 8544584Abstract: A construction vehicle includes a cooling device. The cooling device includes a radiator disposed on a vehicle body frame, an oil cooler disposed adjacent to the radiator with a rear surface side thereof being arranged to face in roughly parallel to a lower part of a front surface of the radiator, and an opening/closing mechanism including a rotary shaft. The rotary shaft is obliquely disposed with a top end portion thereof being arranged closer to the front surface of the radiator than a bottom end portion thereof is. The opening/closing mechanism is configured to pivot the oil cooler about the rotary shaft and simultaneously move the oil cooler with respect to the radiator. Either a counterweight mounted on a rear part of the vehicle body frame or a part of the vehicle body frame is disposed on a line horizontally extended from a bottom end portion of the oil cooler.Type: GrantFiled: December 15, 2011Date of Patent: October 1, 2013Assignee: Komatsu Ltd.Inventors: Takuya Takeda, Shingo Hidaka
-
Publication number: 20130248144Abstract: A fan module includes a heat transfer unit, a heat radiation unit, and at least one cross-flow fan. The heat radiation unit has an air-in side and an air-out side. The cross-flow fan is located against the heat radiation unit, and includes a frame and a centrifugal fan blade assembly. The frame has an air outlet, a plurality of air inlets, and a plurality of frame sections. The frame sections respectively have a receiving recess therein, and the receiving recesses are communicable with one another to together define a receiving space for receiving the centrifugal fan blade assembly therein. With the above arrangements, the cross-flow fan can create increased air flow volume, the space occupied by the fan module can be reduced, and upgraded heat dissipation performance can be achieved.Type: ApplicationFiled: March 26, 2012Publication date: September 26, 2013Inventors: Bor-Haw Chang, Liang-Ji Chang
-
Publication number: 20130248145Abstract: A heat dissipation device includes a mounting bracket and a thermal module. The mounting bracket has at least one retaining hole and a mounting section, and the thermal module includes a plurality of radiating fins, to which the mounting bracket is connected. On the radiating fins, at least one engaging zone is provided for correspondingly engaging with the mounting bracket, and at least one locking portion is formed for correspondingly engaging with the retaining hole. With the above structural design, the mounting bracket can be more firmly and stably connected to the thermal module and be more accurately located on the radiating fins without the need of welding, so that the manufacturing cost for welding is saved. A method of manufacturing the heat dissipation device is also disclosed.Type: ApplicationFiled: March 26, 2012Publication date: September 26, 2013Inventors: Sheng-Huang Lin, Yen-Lin Chu
-
Publication number: 20130228306Abstract: A heat exchanger is provided and includes a frame defining a volumetric body with substantially flat upper and lower sides, heat exchange elements disposed within an interior of the body, sorbent material disposed among the heat exchange elements within the interior of the body, retainer screens disposed at upper and lower sides of the heat exchange elements and sorbent material and structural foam layers supportively disposed between the retainer screens and the substantially flat upper and lower sides to absorb loading applied to the retainer screens.Type: ApplicationFiled: March 2, 2012Publication date: September 5, 2013Applicant: HAMILTON SUNDSTRAND SPACE SYSTEMS INTERNATIONAL, INC.Inventor: James R. O'Coin
-
Patent number: 8522860Abstract: The invention relates to a fastening and joining element (4) for fixing and connecting heat exchangers of a heat exchanger assembly in a motor vehicle. Said fastening and joining element (4) comprises at least one hole (4b) for positively accommodating a heat exchanger as well as a fastening part (4a) encompassing a profiled fastening member.Type: GrantFiled: August 31, 2006Date of Patent: September 3, 2013Assignee: HBPO GmbHInventors: Dirk Kersting, Andre Schmidt, Walter Korte
-
Patent number: 8521332Abstract: An actuator for an HVAC system having a stored model definition defining an HVAC control application, and an element library including a variety of stored model elements and controller modules (D, E) having instructions for controlling a processor of the actuator. The controller modules (D, E) include model elements and are configured to control the sequential order of their execution. The controller modules (D, E) are further configured to propagate any external data input (S66?, S68?) to their model elements prior to executing their first model element, and to propagate any data output (S63, S65, S67, S69) to external components after executing their last model element. The controller modules (D, E) are instantiated in different threads of execution, so that data is interchanged asynchronously between instantiated controller modules (D, E) and neither temporal dependencies nor change of value links are imposed on components of the HVAC control application.Type: GrantFiled: July 3, 2008Date of Patent: August 27, 2013Assignee: BELIMO Holding AGInventors: Dirk Tiemann, Urs Gort
-
Publication number: 20130213602Abstract: The invention relates to a cooling system for cooling a heat generating unit comprising an exchangeable heat sink unit being arranged removably connected to the heat generating unit in an assembled state of the cooling system, wherein further comprises a heat dissipation structure and a heat output connector arranged in the heat generating unit, where the heat dissipation structure is arranged to dissipate heat from at least one heat generating componentin the heat generating unit to the heat output connector, where further the exchangeable heat sink unit comprises a heat sink and a heat sink heat dissipation structure and a heat input connector, where the heat input connector is arranged to connect to said heat output connector to dissipate heat from said heat output connector via the heat sink heat dissipation structure to the heat sink. The invention also relates to a method for cooling a heat generating unit.Type: ApplicationFiled: December 28, 2012Publication date: August 22, 2013Applicant: HUAWEI TECHNOLOGIES CO., LTD.Inventor: Huawei Technologies Co., Ltd.
-
Patent number: 8511411Abstract: A cooling module is provided for motor vehicles with a plurality of modular elements. At least one first modular element is provided for the arrangement in a deformation region of the motor vehicle and at least one second modular element is also arranged. The at least one first modular element is displaceable relative to the at least one second modular element.Type: GrantFiled: March 16, 2011Date of Patent: August 20, 2013Assignee: GM Global Technology Operations LLCInventor: Claus Steller
-
Publication number: 20130208428Abstract: The rear cover of an electronics device is made up of two sections including an external heat sink and a rear cover frame. The electronics for the computing device are directly coupled to the heat sink section. The two sections are fastened together with a layer of cushioning material to simultaneously provide shock-vibration protection as well as efficient cooling of the electronics.Type: ApplicationFiled: February 8, 2013Publication date: August 15, 2013Applicant: COOPER TECHNOLOGIES COMPANYInventor: Cooper Technologies Company
-
Patent number: 8505615Abstract: A cooling fan rack includes a frame defining a union section; a plurality of stoppers arranged at four corners in the frame to cooperate with the frame to define an accommodating space; and a plurality of airflow paths formed between two adjacent stoppers to communicate with the accommodating space. The frame is provided at two lateral lower sides with a notch each, which communicate with the accommodating space. The two notches are sized for straddling two upper outer sides of a radiating fin assembly, so that the radiating fin assembly with a reduced volume can be upward fitly received in the accommodating space. A cooling fan is downward firmly fitted in the union section. Part of the cooling airflow produced by the cooling fan can flow through the airflow paths to two opposite ends of the radiating fin assembly, enabling upgraded heat dissipation effect.Type: GrantFiled: March 24, 2009Date of Patent: August 13, 2013Assignee: Asia Vital Components (China) Co., Ltd.Inventor: Sheng-Huang Lin
-
Publication number: 20130199752Abstract: A cooling module for cooling a semiconductor is provided and includes a land grid array (LGA) interposer, a substrate with an LGA side and a chip side, a cooler, a load frame attached to the substrate and formed to define an aperture in which the cooler is removably disposable, a spring clamp removably attachable to the load frame and configured to apply force from the load frame to the cooler such that the substrate and the cooler are urged together about the semiconductor and a load assembly device configured to urge the load frame and the LGA interposer together.Type: ApplicationFiled: February 7, 2012Publication date: August 8, 2013Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Evan G. Colgan, Michael A. Gaynes, Jeffrey A. Zitz
-
Patent number: 8499823Abstract: A radiant heating panel has a receptacle for heat transfer tubing and divided into immediately-adjacent tracks, each for receiving respective heat transfer tubing, and with a partition extending between the immediately-adjacent tracks and defining a wall therebetween.Type: GrantFiled: April 18, 2008Date of Patent: August 6, 2013Assignee: One SourceInventors: Todd Shaw, Frank Bilotta
-
Publication number: 20130192794Abstract: Several apparatuses and methods for providing cooling system interchangeability. One apparatus includes a thermally conductive plate thermally coupled to an integrated circuit. The thermally conductive plate is configured to couple interchangeably to a liquid cooling assembly or an air cooling assembly, and the liquid cooling assembly and the air cooling assembly are separate devices.Type: ApplicationFiled: January 30, 2012Publication date: August 1, 2013Applicant: International Business Machines CorporationInventors: Timothy J. Chainer, David P. Graybill, Madhusudan K. Iyengar, Vinod Kamath, Bejoy J. Kochuparambil, Roger R. Schmidt, Mark E. Steinke
-
Publication number: 20130186594Abstract: For tube supports in heat exchangers used to exchange heat energy from one fluid to another without mixing them and, more particularly, supports for an exchange tube bundle forming, in a cutting plane, a mesh, a support (400) includes a ring (40), wherein the ring (40) has a fastening device making it possible to fasten, respectively, on either side of the cutting plane of the ring, a first set (41) of rods (410) and a second set (42) of rods (420). The rods (410, 420) each have a form which constitutes a median plane, the median planes of the first set (41) being parallel to one another and the median planes of the second set (42) being parallel to one another, the orientation of the median planes of the first set (41) and of the median planes of the second set (42) forming a first angle greater than zero.Type: ApplicationFiled: January 22, 2013Publication date: July 25, 2013Applicant: ALSTOM TECHNOLOGY LTD.Inventor: ALSTOM Technology Ltd.
-
Publication number: 20130180684Abstract: A heat dissipation bracket for a battery pack assembly, comprises: a plurality of battery support brackets with an open end in a lower portion thereof; and a baffle mated with the open end, wherein the open end and the upper end of the battery support bracket and the two sides of the baffle are provided with corresponding horizontal protruding edges; the open end of one of the plurality of battery support brackets is provided with the baffle, while the rest of the battery support brackets are vertically stacked and disposed on the upper end of the battery support brackets; the battery support bracket, the baffle, and the stacked battery support brackets are connected through bolts in the corresponding horizontal protruding edges; a plurality of battery positioning slots are formed by the battery support brackets and the inner wall of the baffle; a plurality of raised bars are formed on the outer wall of the baffle along the longitudinal axial direction of the battery positioning slots, and a heat exchange chaType: ApplicationFiled: September 7, 2011Publication date: July 18, 2013Applicant: FOSHAN SHANRI MOTOR ELECTRIC HUB CO., LTD.Inventors: Shugang Gong, Xingyin Wu, Zhiling Guo, Zhilong Ouyang, Peng He, Lei Peng, Fanguo Kong
-
Patent number: 8479804Abstract: An exemplary heat dissipation device includes a fan having fixing cylinders, a heat sink having a supporting board, and fasteners fixing the fan to the heat sink. Each fastener includes a screwing pole, a first elastic member and a second elastic member encircling the screwing pole, and a fastening cylinder engaging with the screwing pole. Each screwing pole includes a head, a shaft extending coaxially downwardly from the head, and a post extending coaxially downwardly from the shaft. For each fastener, the screwing pole extends through a corresponding fixing cylinder of the fan, the first elastic member is compressed between the head and the corresponding fixing cylinder, the second elastic member is compressed between the corresponding fixing cylinder and the fastening cylinder, and the post protrudes from the fastening cylinder and is engaged with the supporting board.Type: GrantFiled: October 12, 2010Date of Patent: July 9, 2013Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.Inventor: Jian Liu
-
Publication number: 20130168043Abstract: A radiator frame (10) for a cooling module of an internal combustion engine, having a fastening element (100) for fastening the cooling module to/on/in a radiator of the internal combustion engine, the fastening element (100) having a retaining face (123), by which the cooling module (1) can be locked in a translational and optionally a rotational direction, and an individual fastening element (100) has at least two retaining faces (123) in such a way that said fastening element (100) can be seated on mating faces at/on/in the radiator.Type: ApplicationFiled: December 31, 2012Publication date: July 4, 2013Applicant: ROBERT BOSCH GMBHInventor: ROBERT BOSCH GMBH
-
Publication number: 20130170142Abstract: An electrical device is described herein. The electrical device includes a housing that includes an inner surface that defines a cavity, a heat sink that is coupled to the housing and oriented along a first plane, and at least one electrical component positioned within the housing cavity and oriented along a second plane that is different than the first plane. A heat exchange assembly is coupled to the electrical component and the heat sink for adjusting a temperature of the electrical component. The heat exchange assembly includes an evaporator section, a condenser section, and a transport section extending between the evaporator section and the condenser section for channeling a working fluid between the evaporator section and the condenser section. The heat exchange assembly is configured to bend along at least one bending axis oriented with respect to the transport section.Type: ApplicationFiled: December 29, 2011Publication date: July 4, 2013Applicant: GENERAL ELECTRIC COMPANYInventors: Stanton Earl Weaver, JR., Tao Deng, Hendrik Pieter Jacobus de Bock, Shakti Singh Chauhan
-
Publication number: 20130164578Abstract: A modular battery module that includes a plurality of substantially identical cartridges, a chassis, and a compression member, wherein each cartridge includes a heat sink with a thermal management channel; a prismatic cell coupled to the heat sink; and a first and a second manifold fluidly coupled to the thermal management channel, wherein the first and second manifolds form opposing edges of a frame, wherein the frame supports the edges of the heat sink. The plurality of cartridges is coupled together in the thickness direction to form a stack with a first and a second end. The chassis is formed from a first end plate, a second end plate, and the plurality of frames, wherein the first and second end plates cap the ends of the stack. The compression member couples the end plates and cartridges together, wherein the compression member applies a compressive force over a face of the batteries.Type: ApplicationFiled: December 21, 2011Publication date: June 27, 2013Inventors: Edward Thomas Sweet, Paul Young Durkee, Nathaniel Hall-Snyder
-
Publication number: 20130163174Abstract: A heat dissipation apparatus is used for accelerating heat dissipation of a memory card mounted to a circuit board. The heat dissipation apparatus includes a mounting bracket supported on the circuit board and a fan mounted to the mounting bracket. The mounting bracket includes to a mounting plate arranged over the memory card, and a plurality of legs extending down from the mounting plate to be fixed to the circuit board. The fan is attached to the mounting plate to align with the memory card.Type: ApplicationFiled: December 30, 2011Publication date: June 27, 2013Applicants: HON HAI PRECISION INDUSTRY CO., LTD., HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD.Inventors: WEI-MIN HE, JUN-HUI WANG
-
Publication number: 20130153171Abstract: A heat exchanger includes a shell made of a composite material, and a heat exchanger housed substantially within the shell. The shell is made of a composite material further comprises planks positioned in the outer periphery of the shell. The planks, in one embodiment, are substantially hollow or include substantially hollow portions. In some embodiments, the planks are formed of pultruded plastic. The shell of the heat exchanger further includes layers of fiberglass. The pultruded plastic planks are sandwiched between at least a first layer of fiberglass and a second layer of fiberglass. The layers of fiberglass are infused with resin. A floating portion of an Ocean Thermal Energy System includes shells made of composite material. The cold seawater intake can also be an elongated tube of composite material.Type: ApplicationFiled: December 14, 2012Publication date: June 20, 2013Applicant: LOCKHEED MARTIN CORPORATIONInventor: Lockheed Martin Corporation
-
Patent number: 8467906Abstract: In a data center that cools servers using an airflow from a central fan, rather than individual server fans, the cooling needs for each server are met by creating a sufficient pressure differential across each server. Because the pressure differential is the same for all of the servers, it is desirable to operate the data center such that each server needs the same pressure differential for proper cooling. Accordingly, a load balancer assigns tasks to the servers based on the known cooling needs of each server in order to balance the pressure differential needed to cool the server. This information may also be sent to the central fan to ensure that a sufficient pressure is created by the fan. Determining the cooling needs beforehand avoids spikes in server temperature, thereby enabling the servers to operate safely at a temperature closer to their maximum rated temperatures.Type: GrantFiled: August 10, 2010Date of Patent: June 18, 2013Assignee: Facebook, Inc.Inventors: Amir Meir Michael, Michael Paleczny
-
Publication number: 20130146252Abstract: A heat sink assembly includes a fixing plate, a heat sink, a number of first fasteners, and a second fastener. The fixing plate includes a number of first poles and a second pole extending from a top of the fixing plate. A first threaded hole is defined in a top of each first pole, and a first threaded portion is formed on a top of the second pole. The heat sink includes a base. The first and second fasteners are extended through the base. A second threaded portion is formed on a bottom of each first fastener, and engages in a corresponding one of the first threaded holes. A second threaded hole is defined in a bottom of the second fastener, and engages with the first threaded portion. The second pole and the second fastener can limit the heat sink fixed to the fixing plate to only one angle.Type: ApplicationFiled: December 26, 2011Publication date: June 13, 2013Applicant: HON HAI PRECISION INDUSTRY CO., LTD.Inventor: CHENG-HSIU YANG
-
Publication number: 20130135811Abstract: Example rack systems that support computing platforms and related hardware are provided. Multiple instances of the example rack system may be combined to create scalable systems. The example racks may incorporate a universal backplane upon which one or more backplane boards may be mounted. Modules of varied functions may be inserted into the backplane boards via a module insertion area. The example racks may include a power bus for powering the backplane boards. The rack system may also include thermal plates, coolant transmission, and cable management solutions to promote heat dissipation. Related apparatuses and methods are also provided.Type: ApplicationFiled: July 21, 2011Publication date: May 30, 2013Applicant: Birchbridge IncorporatedInventors: John Craig Dunwoody, Teresa Ann Dunwoody
-
Publication number: 20130126124Abstract: A connecting device is used in combination with a heat exchanger. The heat exchanger has orthogonally oriented first and second mount members. The connecting device includes a body having opposed first and second sidewalls. A first sidewall extension is integrally connected to and extends orthogonally with respect to the first sidewall, and includes a first planar mount surface. A second sidewall extension is integrally connected to and extends orthogonally with respect to the second sidewall. The second sidewall extension is oppositely facing with respect to the first sidewall extension and includes a second planar mount surface. A mounting wall extension is integrally connected to and extends orthogonally with respect to the first and second sidewall extensions and includes a third planar mount surface. The first, second and third planar mount surfaces are oriented coplanar with respect to each other and are connected to the first mount member using brazing joints.Type: ApplicationFiled: November 18, 2011Publication date: May 23, 2013Applicant: DENSO INTERNATIONAL AMERICA, INC.Inventors: Christopher L. Zuber, Timothy R. West, Kevin S. Bockstanz
-
Publication number: 20130126125Abstract: The heat sink includes a fastener and a heat pipe. The fastener has a receiving space, an upper claw and a lower claw. The upper claw and the lower claw are formed in the receiving space. The heat pipe has a first end and a second end. The first end is received in the receiving space and clipped between the upper claw and the second claw, and the upper claw or the lower claw is partially embedded in the heat pipe to be flush with each other.Type: ApplicationFiled: November 23, 2011Publication date: May 23, 2013Inventors: Cheng-Tu Wang, Chi-Chung Tseng
-
Publication number: 20130118781Abstract: An exemplary heat dissipation device includes a bracket, and heat sink and a pressing member. The bracket includes a bottom plate. An opening is defined in the bottom plate. Two supporting portions are formed from an underside of the bottom plate. The heat sink extends through the opening of the bracket, with bottom edges of the heat sink rested on the supporting portions. The pressing member is mounted on the bracket and elastically presses the heat sink onto the supporting portions.Type: ApplicationFiled: December 29, 2011Publication date: May 16, 2013Applicant: FOXCONN TECHNOLOGY CO., LTD.Inventors: CHING-BAI HWANG, JUI-WEN HUNG
-
Publication number: 20130112369Abstract: An IPM cooling apparatus includes a cooling unit having a cooling fluid channel, and a mounting unit fixed to the cooling unit. A wall portion of the cooling unit, which portion faces the cooling fluid channel, has a mounting surface on which the IPM is mounted. The mounting unit is composed of a heat transfer plate formed of a thermally conductive material and joined to the mounting surface of the cooling unit, and a male screw component which has a plate-like head portion and a male screw portion. The plate-like head portion is caused to bite into the lower surface of the heat transfer plate so as to form a recess on the lower surface. The late-like head portion is fitted into the recess formed on the lower surface such that the plate-like head portion does not project from the lower surface and is prevented from rotating.Type: ApplicationFiled: October 26, 2012Publication date: May 9, 2013Applicant: SHOWA DENKO K.K.Inventor: SHOWA DENKO K.K.
-
Publication number: 20130105112Abstract: A heat sink configured for heat dissipation of a heat-dissipating element on a circuit boards includes a base, a linear fastener and a heat-dissipating fin set. A surface of the base is provided with a groove. The linear fastener includes a fixing section and an engaging section bent to extend from the fixing section. The fixing section is disposed in the groove. The engaging section protrudes out of the base to be fixed onto the circuit board. The heat-dissipating fin set is constituted of a plurality of stamped fins engaged with each other. The heat-dissipating fin set is combined on the base to press the fixing section, thereby clamping the fixing section between the heat-dissipating fin set and the base. The linear fastener makes the heat-dissipating fin set to be combined on the circuit board, thereby increasing the heat-dissipating efficiency of the heat sink.Type: ApplicationFiled: October 31, 2011Publication date: May 2, 2013Inventor: Xue-Hui GAN
-
Publication number: 20130105111Abstract: Disclosed is a power system comprising a mount, a heat exchanger, and a corrugated strap positioned about the heat exchanger for securing the heat exchanger to the mount. The heat exchanger comprises a separation edge, and the corrugated strap may comprise a first corrugated section and a second corrugated section. A separation bend may be positioned between the first corrugated section and the second corrugated section, and the separation bend may overlap the separation edge.Type: ApplicationFiled: October 28, 2011Publication date: May 2, 2013Inventors: Ahmo Krgo, Bradley R. Watkins, Mark A. Taute
-
Publication number: 20130105113Abstract: A magnetic lock system for releasably securing a heat exchanger with a component. The system includes: an electromagnet on one of the heat exchanger or the component and a magnetic region on the other of the heat exchanger or the component; the electromagnet being energizable to attract the magnetic region to secure the component and the heat exchanger in a thermally coupled position; and the electromagnet being de-energizable to release the component and the heat exchanger from the thermally coupled position.Type: ApplicationFiled: October 30, 2012Publication date: May 2, 2013Applicant: 2064818 ONTARIO INC.Inventor: 2064818 Ontario Inc.
-
Publication number: 20130098579Abstract: A cooling unit is provided to facilitate cooling of coolant passing through a coolant loop. The cooling unit includes one or more heat rejection units and an elevated coolant tank. The heat rejection unit(s) rejects heat from coolant passing through the coolant loop to air passing across the heat rejection unit. The heat rejection unit(s) includes one or more heat exchange assemblies coupled to the coolant loop for at least a portion of coolant to pass through the one or more heat exchange assemblies. The elevated coolant tank, which is elevated above at least a portion of the coolant loop, is coupled in fluid communication with the one or more heat exchange assemblies of the heat rejection unit(s), and facilitates return of coolant to the coolant loop at a substantially constant pressure.Type: ApplicationFiled: October 25, 2011Publication date: April 25, 2013Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Levi A. CAMPBELL, Richard C. CHU, Milnes P. DAVID, Michael J. ELLSWORTH, JR., Madhusudan K. IYENGAR, Robert E. SIMONS
-
Publication number: 20130092351Abstract: An outdoor unit bracket and an outdoor unit comprising the same, which can ensure safe and simple installation, are provided. An outdoor unit bracket includes an outer wall coupling portion, an upper supporting portion, an outer wall contacting portion and a lower supporting portion. The outer wall coupling portion is coupled to the outer wall of the building. The upper supporting portion is coupled to a rear upper portion of the outdoor unit, being spaced apart from the outer wall coupling portion in the direction vertical to the outer wall of the building. The outer wall contacting portion contacts the outer wall of the building, being spaced apart from the outer wall coupling portion below the outer wall coupling portion. The lower supporting portion contacts a rear lower portion of the outdoor unit, being spaced apart from the outer wall contacting portion in the direction vertical to the outer wall of the building.Type: ApplicationFiled: October 4, 2012Publication date: April 18, 2013Inventors: Jungwoo LEE, Kidong Kim
-
Publication number: 20130094141Abstract: A low profile heat removal system suitable for removing excess heat generated by a component operating in a compact computing environment is disclosed.Type: ApplicationFiled: October 2, 2012Publication date: April 18, 2013Applicant: Apple Inc.Inventor: Apple Inc.
-
Publication number: 20130087311Abstract: A thermal module adapted for dissipating heat of an electronic component includes a heat pipe; and two mounting flakes mounted on the heat pipe. The mounting flakes are configured for mounting the thermal module on a circuit board on which the electronic component is mounted. Each of the mounting flakes is formed integrally as a single piece. The mounting flake includes a fixing body and two mounting arms formed at two opposite ends of the fixing body. The fixing body is directly bonded on the heat pipe. The mounting arms extend beyond the heat pipe and define through holes therein for extension of fasteners.Type: ApplicationFiled: December 21, 2011Publication date: April 11, 2013Applicant: Foxconn Technology Co., Ltd.Inventors: CHIH-PENG LEE, CHING-BAI HWANG
-
Publication number: 20130087310Abstract: A mounting device for fixing a fan includes a board, a frame, and two shockproof members. The board defines a vent. Two blocking pieces perpendicularly extend from the board at opposite sides of the vent. The frame is sandwiched between the blocking pieces. Two tabs extend from opposite sides of the frame. Each shockproof member is mounted between one of the blocking pieces and a corresponding one of the tabs.Type: ApplicationFiled: October 18, 2011Publication date: April 11, 2013Applicants: HON HAI PRECISION INDUSTRY CO., LTD., HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD.Inventor: HAI-QING ZHOU
-
Publication number: 20130087312Abstract: A cooling device for cooling a plurality of light guide plates includes a plurality of positioning members stacked together, a support frame supporting the plurality of positioning members, and a cooling fan positioned in the support frame. Each positioning member includes a bottom plate and a side frame extending from an edge of the bottom plate. The bottom plate and the side frame cooperatively define a receiving groove for receiving the light guide plate. A plurality of support portions are formed on the bottom plate for supporting the light guide plate, and the bottom plate defines a plurality of penetrating holes around the support portions. The cooling device cools all the light guide plates evenly and quickly.Type: ApplicationFiled: March 22, 2012Publication date: April 11, 2013Applicant: HON HAI PRECISION INDUSTRY CO., LTD.Inventors: TAI-CHERNG YU, DA-WEI LIN
-
Publication number: 20130083479Abstract: A liquid submersion cooling system that is suitable for cooling a number of electronic devices in parallel using a plurality of cases connected to a rack system. The system cools heat-generating components in server computers and other devices that use electronic, heat-generating components and are connected in parallel systems. The system includes a housing having an interior space, a dielectric cooling liquid in the interior space, a heat-generating electronic component disposed within the space and submerged in the dielectric cooling liquid. The rack system contains a manifold system to engage and allow liquid transfer for multiple cases and IO connectors to engage electrically with multiple cases/electronic devices. The rack system can be connected to a pump system for pumping the liquid into and out of the rack, to and from external heat exchangers, heat pumps, or other thermal dissipation/recovery devices.Type: ApplicationFiled: November 29, 2012Publication date: April 4, 2013Applicant: Liquidcool Solutions, Inc.Inventor: Liquidcool Solutions, Inc.