With External Support Patents (Class 165/67)
  • Patent number: 8408346
    Abstract: A motor vehicle front end has a frame, which supports a heat exchanger and has an upper horizontal crosspiece connected to two uprights by means of connection elements, which are plastically deformable so as to allow the upper horizontal crosspiece to be lowered in the event of an accident; the upper horizontal crosspiece comprises a rigid rear portion and a plastically deformable, front portion which is made of plastic material and is fixed to the rigid rear portion.
    Type: Grant
    Filed: April 11, 2012
    Date of Patent: April 2, 2013
    Assignee: Fiat Group Automobiles S.p.A.
    Inventor: Rosario Iania
  • Publication number: 20130075076
    Abstract: The disclosure relates to an apparatus including a first heat transfer element having a base plate, with a first surface for receiving an electric component and channels for transferring a heat load received via the first surface into a fluid in the channels, at least some of the channels protrude from a second surface of the base plate, and a second heat transfer element for receiving fluid from the first heat transfer element and passing a heat load from said fluid to surroundings. In order to obtain an efficient cooling, a phase change material is arranged at a second surface of the base plate between at least two of the channels, the phase change material absorbing heat by changing phase at a phase change temperature during operation of the electric component.
    Type: Application
    Filed: August 31, 2012
    Publication date: March 28, 2013
    Applicant: ABB Research Ltd
    Inventors: Bruno Agostini, Mathieu Habert, Matti Kauranen, Markku Elo
  • Publication number: 20130071720
    Abstract: The invention relates to a cooling element, which is designed and equipped in particular to be disposed between electrochemical energy storage cells, comprising a heat exchanger structure through which a heat transfer medium can flow and which is formed at least substantially of two film layers or film layer structures, the opposing surfaces of which are placed against one another and which are connected at junctures within the surfaces, wherein the junctures define cavities between the surfaces, wherein the heat transfer medium can be conducted through said cavities.
    Type: Application
    Filed: May 19, 2011
    Publication date: March 21, 2013
    Applicant: Li-Tec Battery GmbH
    Inventor: Christian Zahn
  • Publication number: 20130068546
    Abstract: A work vehicle includes a frame and a cooling package carried by the frame. The cooling package includes a housing with an opening, and a fluid cooler covering the opening. The fluid cooler includes at least one hinge along one side thereof, and at least one latch along another side thereof, whereby the fluid cooler can be pivoted open to access an inner side of the fluid cooler.
    Type: Application
    Filed: September 21, 2011
    Publication date: March 21, 2013
    Inventor: Ryan R. Neilson
  • Publication number: 20130062036
    Abstract: A retention element for a spacer plane of a pipe bundle is illustrated and described. In order to be able to provide large coherent free faces of the spacer plane with simplified assembly of the spacer plane, it is proposed that two guide elements each for receiving a pipe of the pipe bundle and a spacing element which is arranged between the guide elements be provided and that an opening for the passage of a rod-like support be provided between the guide elements.
    Type: Application
    Filed: March 15, 2011
    Publication date: March 14, 2013
    Applicant: BABCOCK BORSIG SERVICE GMBH
    Inventors: Hans-Dieter Treptow, Holger Friebel, Michael Arlt
  • Publication number: 20130048244
    Abstract: An exemplary heat dissipation apparatus includes a number of fins and a heat pipe. Each fin defines a through hole therein. A collar extends from each fin at an edge of the through hole. The collar inclines toward a center of the through hole. An inner diameter of the collar gradually decreases along a direction away form the fin. A diameter of the heat pipe is larger than a minimum inner diameter of the collar when the collar in a natural state. When the heat pipe extends through the through hole of the fin, the collar is pushed by the heat pipe to expand outwardly, so that the heat pipe intimately contacts an inner face of the collar.
    Type: Application
    Filed: October 11, 2011
    Publication date: February 28, 2013
    Applicants: FOXCONN TECHNOLOGY CO., LTD., FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD.
    Inventors: CHUN-CHI CHEN, XING-HUA HE
  • Publication number: 20130043002
    Abstract: A heat dissipating module supporting apparatus includes a bracket, a heat conducting member, and a latch member. The bracket includes a securing portion. The securing portion defines a holding hole. The heat conducting member is engaged in the holding hole and comprises a body. The body comprises a first touching surface and a second touching surface opposite to the first touching surface. The first touching surface is configured to abut a heat dissipating module, and the second touching surface is configured to abut a heat generating part. The latch member secures the body to the securing portion and is removable from the securing portion to disengage the body from securing portion.
    Type: Application
    Filed: May 30, 2012
    Publication date: February 21, 2013
    Applicants: HON HAI PRECISION INDUSTRY CO., LTD., HONG FU JIN PRECISION INDUSTRY (WUHAN) CO., LTD.
    Inventors: CHAO-JUN ZHU, JIN-BIAO JI, ZHI-JIANG YAO
  • Publication number: 20130042998
    Abstract: A mounting holder for securely connecting a thermal module to a mainboard is disclosed. The mounting holder includes a main body, which has a receiving section and a plurality of extended sections outwardly extended from an outer periphery of the receiving section, and defines a first and a second open side at two axially opposite ends of the receiving section. A heat sink of the thermal module can be fitly set in and securely connected to the receiving section. Each of the extended sections has a locating section formed at a distal end thereof. Securing elements can be inserted into and moved in along the locating sections to align with mounting holes provided on the mainboard, so as to mount the thermal module atop a central processing unit on the mainboard. With these arrangements, the mounting holder provides good mounting flexibility and saves costs for making different molds.
    Type: Application
    Filed: August 17, 2011
    Publication date: February 21, 2013
    Inventor: Bin Chen
  • Publication number: 20130044476
    Abstract: A lighting unit light emitting elements supported by a circuit board contacting a support structure. A remote luminescent material may be provided on one or more optical elements. Light emitting elements, such as light emitting diodes, may be directed towards and, excite the luminescent material. The circuit board may conduct heat from a heat source to an exposed surface of the circuit board. A heat dissipating circuit board may have a passageway permitting the formation of a convection path to remove heat. Such lighting units may replace conventional fluorescent light tubes, or may be provided as standalone lighting units.
    Type: Application
    Filed: October 12, 2011
    Publication date: February 21, 2013
    Inventors: Eric Bretschneider, Zach Berkowitz, Randall Sosnick
  • Publication number: 20130042999
    Abstract: A heat dissipation device with mounting structure includes a main body and a plurality of mounting elements. The main body includes an internally defined chamber having a first side and an opposite second side; a plurality of supports located in the chamber and respectively having two ends connected to the first side and the second side of the chamber; a working fluid filled in the chamber; and a plurality of connection sections in the form of recesses formed on an outer surface of the main body at positions corresponding to the supports in the chamber. The mounting elements are connected to the connection sections. With these arrangements, the heat dissipation device with the mounting elements connected to one outer surface thereof can maintain the chamber in the main body in an airtight state and ensure tight contact of it with a heat-generating element.
    Type: Application
    Filed: September 6, 2011
    Publication date: February 21, 2013
    Applicant: ASIA VITAL COMPONENTS CO., LTD.
    Inventor: Hsiu-Wei Yang
  • Publication number: 20130043001
    Abstract: A heat dissipation device includes a fixing bracket and a heat sink connected to the fixing bracket in a horizontal rotation manner The fixing bracket includes a fixing plate defining a through hole. Two blocks extend up from a top of the fixing plate around the through hole. A latching portion extends towards the through hole from a top of an inner side of each block. The heat sink includes a bottom plate, a number of fins extending up from a top of the bottom plate, and a base extending down from a bottom of the bottom plate. The base is received in the through hole of the fixing bracket and includes a main body, and two flanges extending outwards from a bottom circumference of the main body, to engage with bottoms of the latching portions, respectively.
    Type: Application
    Filed: October 11, 2011
    Publication date: February 21, 2013
    Applicants: HON HAI PRECISION INDUSTRY CO., LTD., HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD.
    Inventor: XIANG WANG
  • Publication number: 20130043000
    Abstract: A heat dissipation unit with mounting structure includes a main body and a plurality of mounting elements. The main body internally defines a chamber, and includes a plurality of supports located in the chamber, a working fluid filled in the chamber, and at least one wick structure formed on inner wall surfaces of the chamber. The mounting elements are externally connected to one side of the main body at positions corresponding to the supports in the chamber, and respectively define an internally threaded coupling bore therein. With these arrangements, it is able to ensure the air-tightness of the chamber of the heat dissipation unit having the mounting elements provided thereon. Further, the mounting elements with internally threaded coupling bore also provide good locking effect for the heat dissipation unit to securely connect with other elements via the mounting elements.
    Type: Application
    Filed: September 6, 2011
    Publication date: February 21, 2013
    Applicant: ASIA VITAL COMPONENTS CO., LTD.
    Inventor: Jui-Pin Wang
  • Publication number: 20130037239
    Abstract: The present invention is to provide a heat exchange device which can facilitate assembling operations of a plurality of heat exchangers, the heat exchange device being featured in that a first heat exchanger 11 and a second heat exchanger 12 are arranged adjacent to each other so that the ventilation surfaces of the heat exchangers face each other, in that a first mounting plate 13 fixed to the side surface of the first heat exchanger, and a second mounting plate 14 fixed to the side surface of the second heat exchanger are fastened and fixed to each other so as to face each other At this time, the first mounting plate 13 has a space of a size such that the second mounting plate 14 can be connected and fixed to the first mounting plate 13 so as to face each other, in that insertion holes 25 are formed in a plurality of stages in the space so as to receive therein tube ends of refrigerant tubes 16 in a plurality of stages, the tube ends laterally projecting from the second mounting plate 14, in that the insert
    Type: Application
    Filed: April 4, 2011
    Publication date: February 14, 2013
    Applicant: SHARP KABUSHIKI KAISHA
    Inventor: Yoshinobu Shiborino
  • Publication number: 20130037238
    Abstract: A fastener for fixing heat dissipation devices includes a shaft, a cap and an elastic member. The shaft includes a first end, an opposite second end, and a flange between the first and second ends. The cap is detachably engaged with the second end of the shaft. The elastic member partly encloses the shaft, and is retained between the flange and the cap. A heat dissipation device matching with the fastener is also provided.
    Type: Application
    Filed: October 30, 2011
    Publication date: February 14, 2013
    Applicants: Foxconn Technology Co., Ltd., Fu Zhun Precision Industry (Shen Zhen) Co., Ltd.
    Inventors: Xiang-Yang YANG, Jing ZHANG
  • Patent number: 8365809
    Abstract: An integrated heat exchanger has a first heat exchanger and a second heat exchanger. The first heat exchanger has a first bracket and a second bracket on header parts thereof, respectively. The first bracket and the second bracket are connected to header parts of the second heat exchanger with a first bolt and a second bolt, respectively, for integrating the first heat exchanger with the second heat exchanger. The header parts of the second heat exchanger are provided with a first bolt-receiving portion and a second bolt-receiving portions for receiving the first bolt and the second bolt therein, respectively. The first bolt-receiving portion and the second bolt-receiving portion define a first axis and a second axis, respectively. The first axis and the second axis are nonparallel to each other. Thus, the first bolt and the second bolt are disposed nonparallel to each other.
    Type: Grant
    Filed: December 20, 2006
    Date of Patent: February 5, 2013
    Assignee: Denso Corporation
    Inventors: Naoki Sugimoto, Kaoru Tsuzuki
  • Publication number: 20130025818
    Abstract: Some modular heat-transfer systems can have an array of at least one heat-transfer element being configured to transfer heat to a working fluid from an operable element. A manifold module can have a distribution manifold and a collection manifold. A decoupleable inlet coupler can be configured to fluidicly couple the distribution manifold to a respective heat-transfer element. A decoupleable outlet coupler can be configured to fluidicly couple the respective heat-transfer element to the collection manifold. An environmental coupler can be configured to receive the working fluid from the collection manifold, to transfer heat to an environmental fluid from the working fluid or to transfer heat from an environmental fluid to the working fluid, and to discharge the working fluid to the distribution manifold.
    Type: Application
    Filed: July 26, 2012
    Publication date: January 31, 2013
    Applicant: COOLIT SYSTEMS, INC.
    Inventors: Geoff Sean Lyon, Mike Holden, Brydon Gierl
  • Publication number: 20130025822
    Abstract: A ventilation apparatus is provided. The apparatus may include a casing having first and second indoor air suction holes formed at opposite ends thereof, an indoor air discharge hole and an outdoor air suction hole formed at a rear side thereof, and an outdoor air discharge hole formed at an upper side thereof. First and second heat exchanger installed within the casing, with a partition plate partitioning the interior of the casing into an indoor air exhaust chamber and an outdoor air suction chamber having an exhaust fan disposed and first and second supply fans respectively provided therein. Use of first and second air supply fan may reduce noise generated during operation, and simplified indoor and outdoor air flow paths may further reduce noise and enhance efficiency.
    Type: Application
    Filed: July 26, 2012
    Publication date: January 31, 2013
    Inventor: Jeongtae RYU
  • Publication number: 20130020050
    Abstract: An adaptor is provided for use with the heat sink, said heat sink comprising a base for contacting a heat source and a plurality of protrusions extending from said base. The adaptor itself comprises a base and a structure projecting therefrom. The structure is arranged to mate with one or more protrusions on the heat sink to enable heat transfer by conduction from the heat sink to the adaptor.
    Type: Application
    Filed: July 20, 2012
    Publication date: January 24, 2013
    Inventor: Jonathan Robert Holman
  • Patent number: 8355481
    Abstract: Provided is a sliding support and a system using the sliding support unit. The sliding support unit may include a fulcrum capture configured to attach to a support flange, a fulcrum support configured to attach to the fulcrum capture, and a baseplate block configured to support the fulcrum support. The system using the sliding support unit may include a pressure vessel, a pedestal bracket, and a plurality of sliding support units.
    Type: Grant
    Filed: August 14, 2009
    Date of Patent: January 15, 2013
    Assignee: GE-Hitachi Nuclear Energy Americas LLC
    Inventors: Michael R. Breach, David J. Keck, Gerald A. Deaver
  • Publication number: 20130008626
    Abstract: A heat dissipating apparatus for a data storage device includes a mounting bracket, and a dissipating structure. The mounting bracket is configured for securing the data storage device. The dissipating structure includes a first heat dissipating panel, a second heat dissipating panel, and a plurality of heat dissipating pieces located between the first heat dissipating panel and the second heat dissipating panel. Each of the first heat dissipating panel and the second heat dissipating panel is secured to the mounting bracket. The data storage device abuts the first heat dissipating panel or the second heat dissipating panel.
    Type: Application
    Filed: March 5, 2012
    Publication date: January 10, 2013
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: CHIH-HANG CHAO, WEI-CHENG CHENG, CHIH-HSIANG CHIANG
  • Publication number: 20130000309
    Abstract: An adaptive cooling structure comprises a mounting support, a liner, and a spacer. The mounting support has a coolant aperture for directing cooling air through the support. The liner has a first surface facing away from the mounting support and a second surface facing towards the support. The liner is coupled to the mounting support, and the spacer is positioned between the support and the liner. The positioning of the spacer creates a chamber between the mounting support and the liner, thus allowing the cooling air to impinge on the second surface of the liner. The liner wall is configured to deflect away from the mounting support to expand the chamber, thus allowing the cooling air to further impinge on the second surface of the liner.
    Type: Application
    Filed: June 30, 2011
    Publication date: January 3, 2013
    Applicant: UNITED TECHNOLOGIES CORPORATION
    Inventor: James A. Dierberger
  • Publication number: 20130003316
    Abstract: A system is disclosed for releasably locking a circuit card assembly to a cold plate of a chassis. The system includes a locking mechanism having a base and a locking wedge. The base and locking wedge have triangular cross-sections, and mate with each other along respective diagonal surfaces of the base and locking wedge. The locking wedge is mounted to the base such that axial movement of the locking wedge relative to the base also results in sliding of the locking wedge up the diagonal surface of the base to increase the overall height of the base and locking wedge together.
    Type: Application
    Filed: December 27, 2011
    Publication date: January 3, 2013
    Applicant: ELMA ELECTRONIC INC.
    Inventor: Robert Alan Martin
  • Publication number: 20130000347
    Abstract: This disclosure presents a heat exchanger that comprises a header frame having end plates, a plurality of rows of finned hairpins, each extending through a cooling fin and each having ends extending through the end plates, and at least one finless hairpin having ends extending through the end plates. A method of manufacturing the heat exchanger is also presented as well as a heat ventilation air conditioning system in which the heat exchanger may be employed.
    Type: Application
    Filed: November 30, 2011
    Publication date: January 3, 2013
    Inventors: Dae-Hyun Jin, Christopher D. Beck
  • Publication number: 20130000865
    Abstract: Provides a cooling device (100) for cooling at least one pluggable module (200) each having a pluggable component (20) and a frame (32) for accommodating the pluggable component, the frame having an opening (33) on a top wall thereof. The cooling device comprises at least one thermal conductive block (40), a heat radiator (70) and a resilient thermal conductive pad (60). The resilient thermal conductive pad being adapted to be in a substantially released position when the pluggable component is decoupled from the frame and substantially biased when the pluggable component is inserted into the frame thus exerting a biasing force on the thermal conductive block and the heat radiator whereby the thermal conductive block is pressed through the opening of the frame into direct thermal contact with the pluggable element of the pluggable module for conducting the heat generated by the pluggable component to the heat radiator through the thermal conductive block and the resilient thermal conductive pad.
    Type: Application
    Filed: March 29, 2010
    Publication date: January 3, 2013
    Applicant: TELEFONAKTIEBOLAGET LM ERICSSON (PUBL)
    Inventor: Kris Shi
  • Publication number: 20120325430
    Abstract: A fin type heat sink includes a heat conducting base, fins, pressing plates and positioning members. The fins are parallely installed with an interval apart from each other on the heat conducting base, and a fixing plate is perpendicularly extended from the bottom of each fin. The fixing plate includes through holes, and the pressing plate is installed corresponding to the fin. Each pressing plate is installed on the fixing plate and has combining holes corresponding to the through holes, and the positioning member is fixed onto the heat conducting base, and the positioning member is passed through the through hole and the combining hole and fixed onto the pressing plate, such that the pressing plate presses the fixing plate flatly onto the heat conducting base. Therefore, heat at the heat conducting base can be conducted to the fins quickly to enhance the thermal conduction effect.
    Type: Application
    Filed: June 21, 2011
    Publication date: December 27, 2012
    Inventor: Shih-Ming CHEN
  • Publication number: 20120325432
    Abstract: A heat dissipation system for a computer enclosure comprises a base plate comprising a motherboard mounted thereon; and a first heat-generating component fixed on the motherboard; a front plate defining a second air outlet opening and a third air outlet opening; and a second heat-generating component mounted on the base plate; and an air guiding device fixed on the first heat-generating component; the air guiding device defining a first air inlet opening, a second air inlet opening, and a first air outlet opening, wherein airflow flows into the computer enclosure through the first air inlet opening and the second air inlet opening, the air guiding device directs the airflow toward the first heat-generating component and the second heat-generating component via the first air outlet opening, and the airflow flows out of the computer enclosure via the second air outlet opening and the third air outlet opening.
    Type: Application
    Filed: November 23, 2011
    Publication date: December 27, 2012
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventor: CHEN-LU FAN
  • Publication number: 20120325431
    Abstract: A heat dissipation device adapted for dissipating heat generated by an electronic component mounted on a printed circuit board. The heat dissipation device includes a heat sink attached to the electronic component, a fan, and a fan holder. The fan includes a frame and a rotor received in the frame. The fan holder mounts the fan onto the heat sink and includes a base fixed on the heat sink, four clasps extending upward from four corners of a top surface of the base, and four elastic portions corresponding to the clasps and configured to resiliently urge the frame of the fan. The frame of the fan is arranged on the base of the fan holder and sandwiched between the clasps and the elastic portions.
    Type: Application
    Filed: August 23, 2011
    Publication date: December 27, 2012
    Applicants: FOXCONN TECHNOLOGY CO., LTD., FURUI PRECISE COMPONENT (KUNSHAN) CO., LTD.
    Inventor: BEN-FAN XIA
  • Publication number: 20120325433
    Abstract: A heat exchanger unit that enables a quick interchanging of function, form and size of the different heat exchanger modules. The interchanging may be possible in regard to the sequence of the individual heat exchanger modules. The heat exchanger unit in includes inserts configured such that appropriately configured cassettes can be inserted, and an inner shape of the cassettes is configured so that different heat exchanger modules can be accommodated therein. The cassettes are thus designed specific to the heat exchanger, while the outer shape of all cassettes conforms to the shape of the uniformly configured inserts.
    Type: Application
    Filed: June 27, 2012
    Publication date: December 27, 2012
    Applicant: VISTEON GLOBAL TECHNOLOGIES, INC.
    Inventors: Juergen Hoppen, Raymond Ambs, Christian Rebinger, Dirk Schroeder
  • Publication number: 20120318477
    Abstract: A fastener includes a fastening element, a fixture, and a spring. The fastening element includes a pole portion, a head portion extending from an end of the pole portion, and an engaging portion extending from another opposite end of the pole portion. The pole portion forms a flange on a periphery thereof. Blocks protrude outwardly from a periphery of the head portion. The fixture defines cutouts and buckling grooves therein, corresponding to the blocks of the fastening element. The blocks extend through the cutouts of the fixture and are rotated by an angle to be buckled in the buckling grooves. The spring circles the fastening element and is compressed between the flange and the fixture.
    Type: Application
    Filed: October 11, 2011
    Publication date: December 20, 2012
    Applicants: FOXCONN TECHNOLOGY CO., LTD., FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD.
    Inventors: XIANG-YANG YANG, JING ZHANG
  • Publication number: 20120305218
    Abstract: The present disclosure pertains to a heat sink having a base, a heat exchanger being thermally coupled to a top surface of the base, a housing having a chamber formed therein and being placed over the base with the heat exchanger enclosed within the chamber, an inlet connected to the inlet chamber for directing heat transfer medium into the heat sink, and an outlet connected to the outlet chamber for discharging the heat transfer medium from the heat sink, wherein the heat exchanger has a plurality of plates and a plurality of spacers, thereby providing for a plurality of channels.
    Type: Application
    Filed: September 23, 2011
    Publication date: December 6, 2012
    Inventors: Benjamin Masefield, Brian Farrell
  • Publication number: 20120305217
    Abstract: Heat transfer sheets (70) for a rotary regenerative heat exchanger (10) have a alternating first and second undulation surfaces (71,81). The first and second undulation surfaces (71,81) are composed of parallel ridges (75,85) angled in alternating directions. When the heat transfer sheets (70) are stacked, they create passageways (79) between them that direct air/gas through them. The ridges (75,85) redirect the air flow near the surface of the heat transfer sheet (70) imparting turbulence reducing laminar flow to improve heat transfer. The heat transfer sheets (80) employ curved ridges (95) having valleys (97) between them that define passageways (99) that constantly redirect the air/gas flow minimizing turbulence, creating efficient heat transfer.
    Type: Application
    Filed: June 1, 2011
    Publication date: December 6, 2012
    Applicant: ALSTOM TECHNOLOGY LTD
    Inventors: Lawrence G. Cowburn, Scott R. Duffney, Dennis R. Grantier, Jeffery E. Yowell
  • Publication number: 20120291990
    Abstract: A heat dissipation apparatus comprises: one or more thermosiphon heat exchange units, one or more first partitions, and a frame having at least two lattices; wherein, each of the one or more thermosiphon heat exchange units is embedded in one lattice of the at least two lattices; each lattice of the at least two lattices having no thermosiphon heat exchange unit embedded is disposed with the first partition to partition the lattice into an upper portion and a lower portion, where the first partition is detachable. The outdoor communication device comprises the heat dissipation apparatus and one or more service board. Through a modular design, the number of the embedded thermosiphon heat exchange units can be increased or decreased at any time depending on heat dissipation performance that is required.
    Type: Application
    Filed: May 16, 2012
    Publication date: November 22, 2012
    Applicant: Huawei Technologies Co., Ltd.
    Inventors: Hui Lin, Taqing Feng
  • Patent number: 8312951
    Abstract: An arrangement for mounting a heat exchanger on a vertical structural element forming a motor vehicle front end panel. The heat exchanger includes a mechanism attaching it to the structural element that are formed by fingers, and the structural element includes housings respectively capable of engaging with the fingers. A locking mechanism is capable of at least longitudinally immobilizing the heat exchanger so as to lock it in a final vertical position corresponding to its use position.
    Type: Grant
    Filed: October 13, 2008
    Date of Patent: November 20, 2012
    Assignee: RENAULT s.a.s.
    Inventors: Joseph Bui, Michael Flandin
  • Patent number: 8312950
    Abstract: A modular vehicle front end comprising a frame, a cooling unit mounted to the frame, a conduit running through the cooling unit, and a bracket for securing the conduit to the frame. The bracket can comprise an attachment portion configured for attachment to the frame and a retainer overmolded on the conduit. The bracket can further comprise at least one flexible clamp portion configured to receive and retain a second conduit. A vehicle comprising an engine and the modular front end taught herein is also disclosed.
    Type: Grant
    Filed: March 3, 2008
    Date of Patent: November 20, 2012
    Assignee: Nissan North America, Inc.
    Inventors: Mark Contardi, Dave VanLooy
  • Patent number: 8302670
    Abstract: An air cooled condensing tower system has a framework supporting a fan deck, a plurality of steam headers running longitudinally above the fan deck, a plurality of condensing coils extending downward and at an angle from the steam headers, and above the fan deck, a plurality of collector tubes disposed at the bottom of the condenser coils and above the fan deck. At least one substantially non-porous side wall is disposed on at least one side of the tower spanning from a height generally proximate the steam supply headers downward to a height generally proximate the fan deck. A downwardly and outwardly projecting substantially non-porous elongated upper air guide extends downwardly and outwardly from the side wall.
    Type: Grant
    Filed: December 28, 2007
    Date of Patent: November 6, 2012
    Assignee: SPX Cooling Technologies, Inc.
    Inventors: Jidon Yang, Glenn S. Brenneke, Eldon F. Mockry
  • Publication number: 20120267353
    Abstract: The present invention is directed to methods and apparatus for tempering the temperature of a liquid in a fluid conducting system. More particularly, the invention relates to tempering the temperature of water supplied to a fixture from a water heater in a fluid conducting system. In some embodiments, the invention includes a restrictor for decreasing the fluid pressure in one of the hot inlet or cold inlet of the mixing valve.
    Type: Application
    Filed: July 2, 2012
    Publication date: October 25, 2012
    Applicant: Magarl, LLC
    Inventors: Robert Eveleigh, Gary Cook
  • Publication number: 20120255709
    Abstract: A heat exchanger comprises an end mounting arrangement including a mounting bracket having a first portion for attachment to a support structure and a second portion attached to the heat exchanger. A projection rigidly attached to the end of the heat exchanger is resiliently received in an aperture in the second portion of the mounting bracket. The projection may comprise a pin extending from a plate pair of the heat exchanger, and one end of the pin may be secured between the plates of the plate pair. The mounting bracket may be metal with a resilient element such as a rubber grommet provided in each aperture, or the bracket may comprise plastic in which case a grommet may not be required.
    Type: Application
    Filed: April 5, 2012
    Publication date: October 11, 2012
    Applicant: Dana Canada Corporation
    Inventors: Lee M. Kinder, Michael Bardeleben, Sachin Bhatia
  • Publication number: 20120255708
    Abstract: A heat exchange apparatus includes an enclosure and a heat exchanger. The enclosure internally defines a first space and a second space isolated from each other, and is provided with a first and a second air inlet communicating with the first and the second space, respectively. The heat exchanger is arranged inside the enclosure and located between the first and the second space. By providing the heat exchanger between the first and the second space inside the enclosure, heat can be exchanged between the first and the second space to enable effectively upgraded heat exchange efficiency, and a device using the heat exchange apparatus is protected against invasion by foreign matters via the heat exchange apparatus.
    Type: Application
    Filed: April 6, 2011
    Publication date: October 11, 2012
    Inventors: Wen-Yuan Wu, Chih-Chieh Lu
  • Patent number: 8281848
    Abstract: A heat exchanger assembly includes a first heat exchanger having a pair of mounts attached to one of the tanks of the first heat exchanger and a second heat exchanger having a pair of brackets attached to one of the tanks of the second heat exchanger. The brackets are freely insertable into the mounts when the two heat exchangers are at an acute angle with respect to each other. When the two heat exchangers are parallel with each other, an interference condition exists between the brackets and the mounts. The opposite side of the heat exchangers is secured using a retainer on one heat exchanger extending through a strap on the other heat exchanger.
    Type: Grant
    Filed: January 15, 2008
    Date of Patent: October 9, 2012
    Assignee: DENSO International America, Inc.
    Inventor: Sang Bae Park
  • Publication number: 20120247726
    Abstract: A heat dissipation device includes a number of fans and a fixing member. Each fan includes two spaced boards respectively defining a number of through holes. The fixing member is sandwiched between the boards of each fan, at a corner of the fan. The fixing member includes two engaging portions movably relative to each other. A number of pins are formed on each engaging portion for respectively engaging in the through holes of the fans.
    Type: Application
    Filed: April 14, 2011
    Publication date: October 4, 2012
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventor: ZHENG-HENG SUN
  • Publication number: 20120235522
    Abstract: A cooling system for an electrical machine includes a substantially closed housing, a first heat exchanger arranged inside of the housing, a second heat exchanger arranged outside of the housing, a conduit assembly for transferring a heat exchange medium in a closed circuit between the first and the second heat exchangers, a first air circulating means configured to circulate air inside of the housing over the first heat exchanger, and a second air circulating means configured to circulate air outside of the housing over the second heat exchanger, wherein the conduit assembly includes a pump for actively circulating the heat exchange medium between the first and the second heat exchangers.
    Type: Application
    Filed: March 30, 2012
    Publication date: September 20, 2012
    Inventors: Johan Osterberg, Stefan Palmgren, Robert Larsson
  • Publication number: 20120234515
    Abstract: A cooling unit includes a cooling member cooled by a cooling body, a plurality of heat transfer members, and a support member. Each of the plurality of heat transfer members has a first contact portion and a second contact portion, the first contact portion being configured to come into contact with the cooling member, the second contact portion being configured to come into contact with a target to be cooled. The support member supports the plurality of heat transfer members at positions distant from the cooling member so that each of the plurality of heat transfer members is independently movable to be in contact with the cooling member.
    Type: Application
    Filed: February 29, 2012
    Publication date: September 20, 2012
    Applicant: FUJITSU LIMITED
    Inventors: Shinichirou KOUNO, Masumi SUZUKI, Masaru SUGIE, Michimasa AOKI, Kenji KATSUMATA, Yosuke TSUNODA, Wataru NISHIYAMA
  • Publication number: 20120222835
    Abstract: A heat dissipating device includes a heat sink, two support arms, two securing units, four first fasteners, and four second fasteners. The two support arms are attached to the heat sink. Each of the support arms defines a groove and a first slot. Each of the securing units includes a sliding arm and a fixing arm. The sliding arm defines a receiving recess and a second slot. The fixing arm defines a third slot. The sliding arm is configured for moving the fixing arm toward or away from the heat sink to align the third slot with mounting holes of a motherboard. The first fasteners fix the two fixing arms on the circuit board. The second fasteners are engagingly received in the communicating first and second slots to fixedly attach the two sliding arms to the two support arms.
    Type: Application
    Filed: March 24, 2011
    Publication date: September 6, 2012
    Applicants: HON HAI PRECISION INDUSTRY CO., LTD., HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD.
    Inventors: SHA PENG, YU-MEI LI, HUI LI
  • Publication number: 20120222836
    Abstract: A heat sink assembly includes a heat pipe, a plurality of metal support members, and a mounting spring plate. The heat pipe has a first heat-receiving surface. Each metal support member has a second heat-receiving surface. The mounting spring plate has a heat pipe mounting portion for securing the heat pipe by a solder-less press-fit means, a plurality of support portions affixed to respective metal support members, and a plurality of mounting portions for securing to a base of a heat source. After the heat pipe is secured to the mounting spring plate, the first heat-receiving surface of the heat pipe would be protruded from the mounting spring plate. The second heat-receiving surfaces of the metal support members are flushed with the first heat-receiving surface of the heat pipe. Thereby, heat is transferred directly from the heat source to the heat pipe to improve heat transfer efficiency, and the weight of the heat sink can be reduced.
    Type: Application
    Filed: July 6, 2011
    Publication date: September 6, 2012
    Inventor: Tsung-Hsien Huang
  • Publication number: 20120222837
    Abstract: A heat exchanger of a vehicle, comprising a frame, a plurality of parallel tubes extending between two opposite sides of the frame, a pair of headers, each of which is arranged at a corresponding one of the two opposite sides of the frame, and a protection grid, attached at a face of the heat exchanger and including a plurality of parallel grid elements, in which each of the grid elements is adapted to shield a corresponding tube of the heat exchanger. Fastening and supporting means are provided, by means of which opposite side edges of the protection grid are directly connected and firmly fastened to the frame or to the headers, and by means of which the protection grid is supported by the heat exchanger, and anchoring means, by means of which a lower edge of the protection grid is unfirmly retained to a lower side of the heat exchanger.
    Type: Application
    Filed: March 1, 2012
    Publication date: September 6, 2012
    Inventors: Francesco Lanfranco, Marco Moschella
  • Publication number: 20120216988
    Abstract: A fastener for fixing a heat sink on an electronic component is disclosed. The fastener includes a frame seat, a latch and two depressors. The frame seat is formed with a hollow for accommodating the heat sink and the latch is moveably mounted on the frame seat. The depressors may be selectively pressed or released by the latch against the frame seat. The heat sink can be fastened by the depressors when the depressors are pressed by the latch.
    Type: Application
    Filed: February 25, 2011
    Publication date: August 30, 2012
    Inventors: Jen-Hao Kang, Shu-Zhang Wu
  • Publication number: 20120211196
    Abstract: A heat dissipation assembly includes a heat sink, a mounting member fixed to the heat sink, a pivot member pivotably attached to the mounting member, and a latch member attached to the pivot member. The latch member includes a first latch portion and a second latch portion. The pivot member is pivoted to switch between using the first latch portion or the second latch portion to be fixed to different types of circuit boards.
    Type: Application
    Filed: March 31, 2011
    Publication date: August 23, 2012
    Applicants: HON HAI PRECISION INDUSTRY CO., LTD., HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD.
    Inventor: LEI LIU
  • Publication number: 20120205068
    Abstract: A heat exchanger used for wind tunnel temperature control applications. The heat exchanger is a finned tube design with each tube aligned perpendicular to the wind tunnel flow direction but with the tube bundle aligned at an oblique angle to flow direction for increased surface area. Tube fins may be aligned with the bulk flow direction. The heat exchanger is built in modules with horizontal splitter plates separating each tube bundle. The benefit of this heat exchanger design for wind tunnel applications is the combination of low pressure loss and favorable heat transfer performance in a compact design, while maintaining flow quality consistent with stringent test requirements.
    Type: Application
    Filed: October 14, 2011
    Publication date: August 16, 2012
    Inventors: William Robert Martindale, Eugene Addison Tennyson, ChrisTOPHER Bernard Porter
  • Publication number: 20120205067
    Abstract: A heat dissipation device includes a heat sink, a rack, and a fan fixed to an end of the rack. The rack includes two frames. Each frame includes a sidewall and two end walls extending from opposite ends of the sidewall. The two frames form a receiving space receiving the heat sink, with each end wall of one of the frames engaging with a corresponding one of the end walls of the other one of the frames. The two frames are configured to be attached to the heat sink from opposite sides of the heat sink, with the end walls abutting opposite ends of the heat sink. The fan is fixed to two engaging corresponding end walls at one of the opposite ends of the sink via the end board.
    Type: Application
    Filed: February 28, 2011
    Publication date: August 16, 2012
    Applicants: HON HAI PRECISION INDUSTRY CO., LTD., HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD.
    Inventors: HUNG-YI WU, LEI LIU
  • Publication number: 20120205069
    Abstract: A reinforcing element for a heat exchanger of the type having nested dish plates with inclined, peripheral, overlapping walls, where at least one of the nested dish plates is attached to a mounting plate, the mounting plate extending beyond the outer periphery of the walls of the nested dish plates. The reinforcing element has a base flange attached to the mounting plate extending beyond the outer periphery of the walls of the nested dish plates. The reinforcing element also has a peripheral flange located in parallel, overlapping engagement with the inclined peripheral wall of the at least one dish plate attached to the mounting plate.
    Type: Application
    Filed: April 25, 2012
    Publication date: August 16, 2012
    Inventors: Pascal Bradu, Xiaoyang rong, Thomas Chan