Materials Of Manufacture Patents (Class 165/905)
  • Patent number: 6746768
    Abstract: A thermal interface and a thermal interface as part of a thermal management system that comprises a heat source, and a cooling module. The heat source has an external surface; the thermal interface is a flexible graphite sheet article having two parallel planar surfaces, with the first planar surface of the thermal interface being in operative contact with the external surface of the heat source and the second planar surface being in contact with the cooling module. The graphite sheet contains oil.
    Type: Grant
    Filed: December 26, 2001
    Date of Patent: June 8, 2004
    Assignee: Advanced Energy Technology Inc.
    Inventors: Ronald A. Greinke, Daniel W. Krassowski
  • Publication number: 20040104021
    Abstract: It is an object of the present invention to provide an inexpensive heat radiating fin having a high cooling effect. A coating metal layer consisting of a metallic material with ionization tendency larger than that of silver is stacked on a surface of a heat radiating fin main body by plating or the like to form the heat radiating fin such that the coating metal layer has a layer thickness which increases a difference between a heat capacity of the coating metal layer and a heat capacity of the air, and facilitates chemical adsorption of molecules in the air. The heat radiating fin radiates heat while being brought into contact with the air serving as a cooling fluid.
    Type: Application
    Filed: September 17, 2003
    Publication date: June 3, 2004
    Inventor: Masami Kujirai
  • Patent number: 6736204
    Abstract: This invention relates to a heat transfer surface (3) or tubular or plate-like bodies (4) having a microstructure (7) projecting out of the base surface (3a) and consisting of projections (6) which are galvanized onto the base surface (3) with a minimum height of 10 &mgr;m. The object of this invention is to create a heat transfer surface (3) of this type which is characterized by an increase in thermal efficiency of its heat transfer surfaces (3) with the smallest possible temperature differences and is suitable for both nucleate boiling and film condensation with a justifiable manufacturing expense. The object is achieved according to this invention by the fact that the base surface (3a) is covered entirely or partially with projections (6); these projections (6) are applied in the form of ordered microstructures (7) and they have a pin shape, extending with their longitudinal axis (6c) either at a right angle to the base surface (3a) or at an angle (&agr;) between 30° and 90°.
    Type: Grant
    Filed: November 27, 2002
    Date of Patent: May 18, 2004
    Assignee: SDK-Technik GmbH
    Inventors: Dieter Gollan, Jovan Mitrovic, Andreas Schulz, Helmut Pietsch
  • Publication number: 20040089440
    Abstract: A cellular reservoir flexible pressure vessel is formed as a series of closely packed tubes fitted into a pair of opposing end caps. The end caps have individual receptacles sized and shaped to receive the tube ends that are secured with adhesive or radio frequency welding. At least one end cap has a passageway for connection of the vessel. The vessel may be formed in a variety of useful shapes and the tubes may have various internal and external cross-sections. The end caps may be filled with sintactic foam with canals leading to the passageway. Microtubes through the syntactic foam may connect the tubes to the passageway. The vessel is further strengthened by overwrapping with high-strength braiding material, hoop winding or by overlayment with high-strength fabric. The vessel is further strengthened by coating with plastic resin. Apparatus and methods for forming the cellular reservoir flexible vessels are described.
    Type: Application
    Filed: November 13, 2002
    Publication date: May 13, 2004
    Inventor: Stan A. Sanders
  • Publication number: 20040079917
    Abstract: The increase of temperature of heat sensitive devices during heat generating conditions is prevented through the absorption of heat, by providing boric acid in an amount sufficient to effect the required heat absorption. Where the heat generating conditions are generated by a heat generator, separate and distinct from the heat sensitive device, the boric acid may be supported in a position between the heat sensitive device and the heat generator. Where the heat sensitive device is itself the heat generator, the boric acid is in contact with the heat sensitive device, either directly or indirectly.
    Type: Application
    Filed: February 20, 2001
    Publication date: April 29, 2004
    Inventor: Claude Q.C. Hayes
  • Patent number: 6725911
    Abstract: A condensing heat exchanger structure in contact with a combustion environment and which structure includes a ferrous substrate is provided with a corrosion resistant diffusion coating applied to the ferrous substrate via a fluidized bed application. Also provided is a method for improving the corrosion resistance of a condensing heat exchanger structure which includes a ferrous substrate and a surface portion at least partially exposed to a combustion product-containing environment. In such method, a corrosion resistant diffusion coating is applied onto the ferrous substrate via a fluidized bed application.
    Type: Grant
    Filed: September 28, 2001
    Date of Patent: April 27, 2004
    Assignee: Gas Research Institute
    Inventors: Palitha Jayaweera, Angel Sanjurjo, Kai-Hung Lau
  • Publication number: 20040069466
    Abstract: The heat transfer surfaces of a condensation heat exchanger are provided with a coating according to the invention which comprises a sequence of layers which includes at least one hard layer which comprises amorphous carbon or a plasma polymer and at least one soft layer which comprises amorphous carbon or a plasma polymer. The hard and soft layers are applied alternately, the first layer on the heat transfer surface being a hard layer and the last layer of the coating being a soft layer. The last, soft layer is distinguished in particular by hydrophobic properties. The layer sequence ensures condensation of drops and, at the same time, protects against drop impingement erosion.
    Type: Application
    Filed: October 9, 2003
    Publication date: April 15, 2004
    Inventors: Francisco Blangetti, Harald Reiss
  • Publication number: 20040069455
    Abstract: A heat pipe heat spreader is provided having a substantially L-shaped enclosure with an internal surface and a plurality of post projecting from the surface. A working fluid is disposed within the enclosure, and a grooved wick is formed on at least a portion of the internal surface. The grooved wick includes a plurality of individual particles having an average diameter, and including at least two lands that are in fluid communication with one another through a particle layer disposed between the at least two lands that comprises less than about six average particle diameters. A method for making a grooved heat pipe wick on an inside surface of a heat pipe container a layer of sintered powder between adjacent grooves that comprises no more than about six average particle diameters.
    Type: Application
    Filed: June 26, 2003
    Publication date: April 15, 2004
    Inventors: James E. Lindemuth, John H. Rosenfeld
  • Publication number: 20040069452
    Abstract: A thermal interface wafer for facilitating heat transfer from an electronic component to a heat sink. The wafer is formed from at least one elongate, vertically-oriented strip of thermally conductive material having a layer of conformable, heat-conducting material formed thereon. Preferably, the substrate comprises a metal foil, such as aluminum or some other thermally-conductive metal, that is formed as a flat, spiral-like coil. Such strip may further be configured to have a serpentine configuration, or may alternatively be formed from a multiplicity of strips. The present invention further provides for methods of transferring heat from an electronic component to a heat sink, as well as methods for fabricating the thermal interface wafers of the present invention.
    Type: Application
    Filed: September 24, 2003
    Publication date: April 15, 2004
    Inventor: Robert A. Rauch
  • Publication number: 20040069468
    Abstract: A heat exchanger having a manifold defined by a plurality of connected closure pieces. A corner of the manifold is defined by the connected joint of three closure pieces, where one closure piece has a bent edge abutting an end of a second closure piece adjacent a generally flat section of a third closure piece. The bent edge of the one closure piece adjacent the manifold corner is a bend in a thin portion of the one closure piece, where the thin portion has a sheet thickness which is less than the sheet thickness of the adjacent portions of the one closure piece. Multiple corners of the manifold can be formed in this manner by thinning the thin and bending the portion, then connecting the closure pieces using solder to form a seal in the open cross section at the corners.
    Type: Application
    Filed: August 1, 2003
    Publication date: April 15, 2004
    Inventors: Bernhard Lamich, Stanislaus Lesjak, Viktor Brost
  • Publication number: 20040069456
    Abstract: A cold and/or heat accumulator with a plurality of carrier elements (10) which are charged with a cold or heat storage medium, and with a heat exchanger (12) which is designed to have a heat transfer medium flow through it in order to cause heat exchange between the cold or heat storage medium and the heat transfer medium. The heat exchanger (12) has at least one serpentine hollow section (14), and at least at least one carrier element (10) is provided between the legs of at least some of the loops of the serpentine hollow section. In a process for producing the cold and/or heat accumulator, the height of the carrier elements is coordinated to a distance between the legs of the at least one loop such that, after a force-fit connection is formed between the serpentine hollow section and the carrier elements.
    Type: Application
    Filed: June 24, 2003
    Publication date: April 15, 2004
    Applicant: WEBASTO THERMOSYSTEME INTERNATIONAL GmbH
    Inventors: Robert Lang, Kemal-Edip Yildirim, Wolfgang Kramer
  • Publication number: 20040072013
    Abstract: A plate type heat exchanger wherein contacting portions of laminated plural plates and fins or contacting portions of laminated plural plates are brazed to form a heat exchange area, characterized in that at least the surface of a plate or fin contacting with a fluid is covered with an alloy comprising in weight ratio 25-35% of chromium, 5-7% of phosphorus, 3-5% of silicon, 0.001-0.1% of at least one selected from the group consisting of aluminum, calcium, yttrium and mischmetal, and balance containing mainly nickel. The alloy may contain 15% or less of iron and or 10% or less of molybdenum.
    Type: Application
    Filed: June 20, 2003
    Publication date: April 15, 2004
    Inventor: Kaoru Tada
  • Patent number: 6712131
    Abstract: The exchanger is made from a number of tubes sealingly connected to a pipe plate which is further connected to an enclosure. The pipe plate is realized by positioning enclosure and tubes in a mould and pouring a ceramic slurry which is subsequently sintered.
    Type: Grant
    Filed: November 27, 2000
    Date of Patent: March 30, 2004
    Assignee: Nederlandse Organisatie Voor Toegepast - Natuurwetenschappelijk Onderzoek TNO
    Inventors: Hendrik Willem Brinkman, Harrie Gorter, Rinse Alle Terpstra, Johannes Coenradus Theodorus Van Der Heijde, Joost Petrus Gerardus Maria Van Eijk, Godefridus Hendricus Maria Gubbels
  • Patent number: 6705388
    Abstract: A thermal dissipator disposable in a heat transfer relationship with a heat-generating source, such as an electronic component, which is mounted on a substrate, such as a printed circuit board. The dissipator includes a thermal dissipation member having a top and bottom surface, and a pressure sensitive adhesive layer disposed on the thermal dissipation member to cover at-least a portion of the bottom surface thereof. The dissipation member is formed of a thermally-conductive, electrically-nonconductive ceramic material. The pressure sensitive adhesive layer has an inner surface adhered to the bottom surface of the thermal dissipation member, and an outer surface bondable to a heat transfer surface of the source for attaching the dissipator to the source in a heat transfer relationship therewith.
    Type: Grant
    Filed: September 11, 1998
    Date of Patent: March 16, 2004
    Assignee: Parker-Hannifin Corporation
    Inventor: Miksa de Sorgo
  • Patent number: 6697253
    Abstract: A liquid cooling system for a personal computer is suitable for cooling a semiconductor device, etc, generating high heat and is designed to suppress undesirable influence on the personal computer following corrosion in the liquid cooling system, thereby ensuring the dependability of the system as a whole. The liquid cooling system has a pump for supplying cooling liquid; a heat receiving jacket supplied with the cooling liquid and positioned to receive heat generated from a heat generation body; a heat radiation pipe for radiating heat which is supplied by the cooling liquid passing through the heat receiving jacket; and a passage for circulating the cooling liquid passing through the heat radiation pipe into said pump. The heat radiation pipe is made of a material having a corrosion resistance that is higher than that of the heat receiving jacket.
    Type: Grant
    Filed: August 6, 2001
    Date of Patent: February 24, 2004
    Assignee: Hitachi, Ltd.
    Inventors: Rintaro Minamitani, Makoto Kitano, Noriyuki Ashiwake, Shigeo Ohashi, Yoshihiro Kondo, Takashi Naganawa, Yuji Yoshitomi, Tsuyoshi Nakagawa
  • Publication number: 20040031588
    Abstract: A heat sink 28 is provided for removing heat from a component 30 on a circuit board 22. The heat sink 28 includes a base 12 having a top 14, a bottom 16, and opposing sides 18 and 20. The top is generally planar for being adhered to a circuit board. Each of the opposing sides has a cutout defining a stepped shoulder 26. The heat sink also includes a plurality of fins 24 extending from the bottom of the base. Locating structure 50 is provided on the top of the heat sink for locating the heat sink with respect to the circuit board 22. Since the heat sink can be glued to the circuit board, a common heat sink can be used for any power electronics component.
    Type: Application
    Filed: June 6, 2003
    Publication date: February 19, 2004
    Applicant: Siemens VDO Automotive Inc.
    Inventor: John Makaran
  • Publication number: 20040031597
    Abstract: A heat exchanger includes at least two ducts for separating a first heat exchange fluid, inside the ducts, from a second heat exchange fluid, outside the ducts, the ducts having longitudinal axes that are substantially parallel to one another. A substantially planar cooling element is formed with apertures through which the ducts extend. The cooling element is inclined at a first predetermined acute angle to the longitudinal axes of the ducts. The cooling element is provided with louvers that are inclined at a second predetermined acute angle to the general plane of the cooling element. The first and second predetermined acute angles are substantially equal in magnitude.
    Type: Application
    Filed: June 16, 2003
    Publication date: February 19, 2004
    Inventor: Per Sandberg
  • Patent number: 6675880
    Abstract: A high temperature air heater including a heat transfer conduit located in higher temperature gas. The heat transfer conduit is made up of a heat transfer pipe through which the air to be heated flows and a refractory protective pipe covering the heat transfer pipe. A clearance is provided between the heat transfer pipe and the refractory protective pipe. The clearance makes it possible to accommodate the differences in thermal expansion between the heat transfer pipe and the refractory protective pipe to prevent damaging the refractory protective pipe, thus extending the service life of the high temperature air heater.
    Type: Grant
    Filed: November 6, 2001
    Date of Patent: January 13, 2004
    Assignee: Mitsui Engineering and Shipbuilding Company Limited
    Inventors: Masao Namba, Kenzo Miura, Yoshitada Tomoyasu, Hidehiro Kiuchi, Yasuaki Harada, Teruo Urayama, Kazuo Shimamura, Norio Tezuka
  • Patent number: 6673260
    Abstract: The increase of temperature in heat sensitive devices during heat generating conditions is prevented through the absorption of heat, by providing Carbonate Salts in an amount sufficient to effect the required heat absorption. Where the heat generating conditions are generated by a heat generator, separate and distinct from the heat sensitive device, the Carbonate Salt is supported in a position between the heat sensitive device and the heat generator. Where the heat sensitive device is itself the heat generator, the Carbonate Salt is contacted to the heat sensitive device either directly or indirectly.
    Type: Grant
    Filed: March 14, 2001
    Date of Patent: January 6, 2004
    Inventor: Claude Q. C. Hayes
  • Publication number: 20030234097
    Abstract: An oil cooler for a vehicle with an automatic transmission that includes a core contained between two end pipes. A first one of the end pipes includes an oil inlet, for directing oil from the transmission, and an oil outlet, directing oil back to the transmission, and a dividing plate having a flow control orifice. An oil filter is positioned around the flow control orifice to filter the oil flowing through the orifice, thereby removing contaminants from the oil, while the oil flowing through the core is cooled.
    Type: Application
    Filed: June 21, 2002
    Publication date: December 25, 2003
    Applicant: Ford Global Technologies, Inc.
    Inventor: Patrick Kevin Holub
  • Patent number: 6667115
    Abstract: The present invention is directed to a brazing sheet comprising an aluminum 3xxx series core alloy, wherein at least one side thereof is provided with an aluminum clad material comprising 0.7-2.0% Mn and 0.7-3.0% Zn, wherein the clad is capable of being used as an inner-liner of a heat exchanger product. In one embodiment, one side of the core alloy is provided with a material that comprises 0.7-2.0% Mn and 0.7-3.0% Zn and the other side of the core is provided with an aluminum alloy comprising at least 5.5% Si. There are further provided methods for preparing brazing sheets as described herein as well as methods for use of brazing sheet materials including as tube stock and as heat exchangers, as well as other applications.
    Type: Grant
    Filed: January 16, 2002
    Date of Patent: December 23, 2003
    Assignee: Pechiney Rolled Products
    Inventors: H. Scott Goodrich, Scott L. Palmer, Gregory R. Johnson, Zayna M. Connor
  • Publication number: 20030230404
    Abstract: A heat exchanger arrangement, especially for a vehicle heater, has a fluid flow space (30) surrounded by a housing arrangement (26, 28) as well as a temperature sensor arrangement (34) for detecting a variable related to the temperature of a fluid flowing through the fluid flow space (30). The temperature arrangement (34) includes at least one temperature sensor (36, 38), which is at least partially embedded in the material of a housing element (28) forming at least one part of the housing arrangement (26, 28).
    Type: Application
    Filed: May 21, 2003
    Publication date: December 18, 2003
    Inventors: Jesko Herrmann, Walter Blaschke
  • Patent number: 6659172
    Abstract: A heat exchanger includes a plurality of spaced-apart plates and a plurality of spacers that separate the plates. The plates and spacers cooperate to form hot-side and cold-side passageways. The plates are made of a thermally and electrically conductive material, and the spacers are made of an electrically non-conductive material. A voltage is applied across the plates to electro-hydrodynamically increase heat transfer efficiency of the heat exchanger.
    Type: Grant
    Filed: March 29, 1999
    Date of Patent: December 9, 2003
    Assignee: AlliedSignal Inc.
    Inventors: Douglas MacGregor Dewar, Alexander F. Anderson
  • Publication number: 20030217834
    Abstract: A room air conditioner is provided which includes a compressor, a condenser coil, an evaporator coil, a wall positioned between the condenser coil and the evaporator coil, a chassis for supporting said compressor, condenser coil and wall, with the evaporator coil being secured to and supported by the wall, and at least a portion of the evaporator coil extending forwardly of a front edge of the chassis. The chassis is preferably formed of metal while the wall is preferably formed at least partially of plastic, in an upper and a lower mating piece. A plastic front panel may be positioned in front of the evaporator coil and secured to the wall. A series of air conditioners can be provided with a single sized chassis, but differing sized evaporator coils, to provide models with different cooling capacities utilizing a single sized chassis, with smaller cooling capacity air conditioners having a smaller size than larger capacity air conditioners of the series.
    Type: Application
    Filed: May 23, 2002
    Publication date: November 27, 2003
    Inventors: Timothy J. Campbell, Jatin C. Khanpara
  • Patent number: 6652770
    Abstract: The increase of temperature in heat sensitive devices during heat generating conditions is prevented through the absorption of heat, by providing Organic Acids in an amount sufficient to effect the required heat absorption. Where the heat generating conditions are generated by a heat generator, separate and distinct from the heat sensitive device, the Organic Acid is supported in a position between the heat sensitive device and the heat generator. Where the heat sensitive device is itself the heat generator, the Organic Acid is contacted to the heat sensitive device either directly or indirectly.
    Type: Grant
    Filed: March 27, 2001
    Date of Patent: November 25, 2003
    Inventor: Claude Q. C. Hayes
  • Publication number: 20030213932
    Abstract: The increase of temperature of heat sensitive devices during heat generating conditions is prevented through the absorption of heat, by providing a bicarbonate salt, such as lithium bicarbonate, sodium bicarbonate, potassium bicarbonate, magnesium bicarbonate, calcium bicarbonate, beryllium bicarbonate, aluminum bicarbonate, ammonium bicarbonate and mixtures thereof, in an amount sufficient to effect the required heat absorption. Where the heat generating conditions are generated by a heat generator separate and distinct from the heat sensitive device, the bicarbonate salt may be supported in a position between the heat sensitive device and the heat generator.
    Type: Application
    Filed: April 6, 2001
    Publication date: November 20, 2003
    Inventor: Claude Q.C. Hayes
  • Patent number: 6648067
    Abstract: The invention involves a countercurrent heat exchanger for condensation laundry dryers of the type that is the object of DE 198 38 525 A1. In order to increase the cooling output of the heat exchanger plates (12) stacked into a heat exchanger plate stack (10), which each contain at least one humid air channel (14) and are made out of thermoplastic plastic or from a film consisting of a heat-conducting metal, the heat exchanger plates (12) are equipped with several struts (32) that form cooling lamellas which project outward from them and extend perpendicularly to the humid air channel (14), and which form pockets that open into the humid air channel (14).
    Type: Grant
    Filed: April 27, 2000
    Date of Patent: November 18, 2003
    Assignee: Joma-Polytec Kunststofftechnik GmbH
    Inventor: Alexander Maute
  • Patent number: 6648061
    Abstract: A heating element is described for a regenerative heat exchanger that is constructed as a profiled steel sheet. The aim of the invention is to produce a heating element that is resistant to acids, has anti-soiling properties and, however, has a good thermal output. To these ends, the heating element is provided with an enameling, and a fluoroplastic coating is applied to the enameled surface.
    Type: Grant
    Filed: February 27, 2002
    Date of Patent: November 18, 2003
    Assignee: Alstom
    Inventors: Hermann MĂĽller-Odenwald, Friedrich Weyland
  • Patent number: 6638444
    Abstract: The increase of temperature in heat sensitive devices during heat generating conditions is prevented through the absorption of heat, by providing Hydrated Salt in an amount sufficient to effect the required heat absorption. Where the heat generating conditions are generated by a heat generator, separate and distinct from the heat sensitive device, the Hydrated Salt is supported in a position between the heat sensitive device and the heat generator. Where the heat sensitive device is itself the heat generator, the Hydrated Salt is contacted to the heat sensitive device either directly or indirectly.
    Type: Grant
    Filed: March 27, 2001
    Date of Patent: October 28, 2003
    Inventor: Claude Q. C. Hayes
  • Publication number: 20030183377
    Abstract: A method of manufacturing metal fins suitable for use in a heat exchanger which includes providing a coated patterned fin stock having a series of parallel stripes disposed longitudinally across the width of one surface of the fin stock. The stripe pattern is evenly spaced in the central portion of the fin stock, and staggered or more further spaced apart at the edges of said fin stock. The fin stock is passed through a series of forming dies to form or draw a plurality of tube receiving collared holes in the fin stock, followed by slitting or cutting the fin stock longitudinally to form a plurality of fin strips. The staggered spacing compensates for transverse movement of the fin stock during the drawing operation, and assures for accurate positioning of the collars between the fin stripes. The invention also includes the use of the fins in a high density coil design for use in a heat exchanger.
    Type: Application
    Filed: March 28, 2002
    Publication date: October 2, 2003
    Applicant: Carrier Corporation
    Inventors: Steven J. Spencer, Paul S. Sacks
  • Publication number: 20030183369
    Abstract: A heat sink 28 is provided for removing heat from a component 30 on a circuit board 22. The heat sink 28 includes a base 12 having a top 14, a bottom 16, and opposing sides 18 and 20. The top is generally planar for being adhered to a circuit board. Each of the opposing sides has a cutout defining a stepped shoulder 26. The heat sink also includes a plurality of fins 24 extending from the bottom of the base. Locating structure 50 is provided on the top of the heat sink for locating the heat sink with respect to the circuit board 22. Since the heat sink can be glued to the circuit board, a common heat sink can be used for any power electronics component.
    Type: Application
    Filed: April 2, 2002
    Publication date: October 2, 2003
    Inventor: John Makaran
  • Publication number: 20030183379
    Abstract: An optimized design for a composite heat sink is provided utilizing a high thermal conducting base and low thermal conducting fins. The base preferably is constructed from anisotropic graphite material, and the fins are preferably constructed from a thermally conductive plastic material. In the case of a low profile heat sink having a fin height of no greater than about 15 mm, the composite construction provides superior cooling yet lighter weight as compared to a conventional all-aluminum heat sink of the same dimensions.
    Type: Application
    Filed: March 29, 2002
    Publication date: October 2, 2003
    Inventors: Daniel W. Krassowski, Gary G. Chen
  • Publication number: 20030173057
    Abstract: The present invention provides a floor system that combines a radiant in-floor heating system using heated air as an energy source and sealed floor units as radiant bodies in which it allows for the heated air to circulate internally throughout the floor to heat the metal joists, to heat the radiant metal sheet, to warm the sub-floor and then to warm the surface and the objects within the living space. The invention can be a combined radiant and structural floor system or a penalized floor system. The assembly of radiant/structural floor system consists of a radiant metal sheet under the structural sub-floor for conducting and distributing the heat uniformly throughout entire heating zone, and the structural metal floor joists with mechanically arranged ducts and inner air circulation pathway, as well as the enclosure board with insulation and the wooden rim board for sealing the floor panel.
    Type: Application
    Filed: December 9, 2002
    Publication date: September 18, 2003
    Inventors: Hong Yan, Hongge Wang
  • Patent number: 6615913
    Abstract: The invention relates to a method of fabricating a pyrometallurgical reactor cooling element with flow channels. In order to enhance heat transfer capability, the wall surface area of the flow channel, which is traditionally round in cross-section, is increased without increasing the diameter or length of the channel.
    Type: Grant
    Filed: June 15, 2001
    Date of Patent: September 9, 2003
    Inventors: Eero Hugg, Ilkka Kojo, Pertti Mäkinen, Raimo Koota
  • Publication number: 20030160206
    Abstract: The increase of temperature of heat sensitive devices during heat generating conditions is prevented through the absorption of heat, by providing an organic acid, such as formic acid, acetic acid, propionic acid, butyric acid and mixtures thereof, in an amount sufficient to effect the required heat absorption. Where the heat generating conditions are generated by a heat generator, separate and distinct from the heat sensitive device, the organic acid may be supported in a position between the heat sensitive device and the heat generator. Where the heat sensitive device is itself the heat generator, the organic acid is in contact with the heat sensitive device, either directly or indirectly.
    Type: Application
    Filed: March 1, 2001
    Publication date: August 28, 2003
    Inventor: Claude Q.C. Hayes
  • Publication number: 20030150595
    Abstract: The present invention of a structure and manufacture of a heat sink with high heat transmission mainly uses a shear stress caused by stirring to break or crush the solidified arborescent primary crystal at a solid/liquid two-phase area of a aluminum alloy to form a slag fluid with ball-filled solid crushed grit; then ceramic grains are added in and dispersed by the solid grains scattered in the liquid-phase metal; through continuous stirring, the aluminum alloy becomes a fine mixed fluid of ceramic and aluminum alloy without arborescent forms; finally, the external configuration of a heat sink is accomplished through directly compression casting by using the special nature of the aluminum alloy to mold the entire heat sink and to enhance the effect of heat dissipation of the heat sink of the same structure through the high heat transmission efficiency of the ceramic grains.
    Type: Application
    Filed: February 12, 2002
    Publication date: August 14, 2003
    Inventors: Yung-Cheng Chen, Chuan-Cheng Huang, Chuan-Ching Tung, Jia-Jen Yeh
  • Patent number: 6596413
    Abstract: Disclosed is an aluminium brazing product, such as a brazing sheet product, having a substrate (1) of an aluminium alloy comprising silicon in an amount in the of 2 to 18% by weight, and on at least one outer surface a layer (2) comprising nickel, wherein a separately deposited layer (3) is applied on one side of the layer (2) comprising nickel and the layer (3) comprising a metal such that taken together the aluminium base substrate (1) and all layers exterior thereto form a metal filler having a liquidus temperature in the range of 490 to 570° C., and preferably in the range of 510 to 550° C. The invention also relates to a method of manufacturing such a brazing product and to a brazed assembly comprising at least one component made of the brazing sheet product.
    Type: Grant
    Filed: October 31, 2001
    Date of Patent: July 22, 2003
    Assignee: Corus Aluminium Walzprodukte GmbH
    Inventors: Adrianus Jacobus Wittebrood, Jacques Hubert Olga Joseph Wijenberg
  • Publication number: 20030131968
    Abstract: A method and arrangement for dissipating heat from a localized area within a semiconductor die is presented. A semiconductor die is constructed and arranged to have at least one conduit portion therein. At least a portion of the conduit portion is proximate to the localized area. The conduit portion is at least partially filled with a heat-dissipating material. The conduit portion absorbs heat from the localized area and dissipates at least a portion of the heat away from the localized area. As such, thermal stress on the die is reduced, and total heat from the die is more readily dissipated.
    Type: Application
    Filed: January 11, 2002
    Publication date: July 17, 2003
    Inventors: Gregory M. Chrysler, James G. Maveety
  • Publication number: 20030121637
    Abstract: In a heat exchanger for storing or releasing heat, a heat exchanger including a channel unit in which heat transfer medium flows; and a heat exchange unit contacted-combined with the channel unit and having a porous heat transfer member so as to perform heat exchange with thermal storage material is disclosed.
    Type: Application
    Filed: December 30, 2002
    Publication date: July 3, 2003
    Inventors: Dae-Young Lee, Seo-Young Kim
  • Publication number: 20030116312
    Abstract: A thermal management system provides a heat dissipating component using a high thermal conductivity insert. The heat dissipating component may be a spreader or heat sink, and includes a planar graphite member having high thermal conductivity along the plane of the member and having a relatively low thermal conductivity through the thickness of the member. A cavity is formed through the thickness of the member and the high conductivity insert is received in the cavity. The insert may be an isotropic high thermal conductivity material such as copper or an anisotropic material such as graphite oriented to have high conductivity in the direction of the thickness of the planar element.
    Type: Application
    Filed: December 13, 2001
    Publication date: June 26, 2003
    Inventors: Daniel W. Krassowski, Gary G. Chen
  • Publication number: 20030106680
    Abstract: A unitary humidity exchange cell (HUX) is disclosed that includes at least one composite membrane, disposed between at least one first chamber for flow of the first fluid therethrough and at least one second chamber for flow of the second fluid therethrough. The composite membrane include an at least partially sulfonated humidity-conducting polymer comprising residues derived from at least one arylvinyl monomer; and a reinforcing substrate bonded thereto. The product finds utility in a variety of physical and chemical processes and products whereby moisture or other highly polar liquid or gas transfer, exchange removal or delivery is important. A notable application is the Membrane Energy Recovery Ventilator (MERV) in which both heat and moisture is transferred between two air streams, one intake and one exhaust, from an air-conditioned building.
    Type: Application
    Filed: March 13, 2002
    Publication date: June 12, 2003
    Applicant: Dais Analytic Corporation
    Inventors: Joseph M. Serpico, Scott G. Ehrenberg
  • Patent number: 6574950
    Abstract: A microturbine system includes a compressor, a recuperator assembly, a combustor, a turbine, and a generator. The recuperator assembly includes a core that preheats compressed air provided by the compressor with exhaust gas from the turbine. The preheated compressed air is mixed with a fuel and burned in the combustor. The products of combustion are used to drive the turbine, which in turn drives the compressor and generator. The recuperator core is surrounded by a recuperator housing that is intimate with the recuperator core such that the recuperator housing assumes substantially the same temperature as the recuperator core. The recuperator housing is constructed of materials that have a coefficient of thermal expansion that is substantially equal to that of the recuperator core, and that have thicknesses substantially equal to the thickness of the recuperator core materials. A superstructure supports the recuperator core and resists expansion of the core in a stackwise direction.
    Type: Grant
    Filed: October 1, 2001
    Date of Patent: June 10, 2003
    Assignee: Ingersoll-Rand Energy Systems Corporation
    Inventor: James S. Nash
  • Publication number: 20030094269
    Abstract: A heat exchanger for realizing a high degree of humidity exchange efficiency at a low cost. The heat exchanger in which partition members respectively separated from each other by a spacing maintained by one of spacing members facilitate circulation of two different air flows, with total enthalpy heat exchange occurring between these two air flows via the partition members. The partition members comprise an air shielding sheet type material comprising a hydrophilic fiber and also including a moisture absorbent, and the air permeability (JIS P 8117) of the partition members is at least 200 seconds/100 cc.
    Type: Application
    Filed: July 8, 2002
    Publication date: May 22, 2003
    Inventors: Hidemoto Arai, Kenzou Takahashi, Youichi Sugiyama
  • Publication number: 20030094264
    Abstract: Heat exchanger structures for conducting fluid are provided in the form of multiple spaced-apart polymeric tubes embedded in foil laminate which includes metal and at least one polymer. Useful polymers are polyolefins, polyesters and polyamides. The metal provides barrier protection making the structure suitable for refrigeration uses as well as providing an extended heat transfer surface between the tubes for when the elements are used for heat transfer, and the polymer on the foil permits it to be sealed closely around the tubes to improve heat transfer. The tubes are of a geometry which provides burst strength, so that the metal can be quite thin.
    Type: Application
    Filed: September 26, 2002
    Publication date: May 22, 2003
    Inventor: Kevin Bergevin
  • Patent number: 6565988
    Abstract: The invention provides a component or composite part, such as a divertor plate for the “first wall” of a fusion reactor, adapted to endure a high thermal load, which is made, at least in some sections, of tungsten or a tungsten alloy. In accordance with the invention, the sections are not constructed massively from tungsten or a tungsten alloy, but rather are made as a laminated packet, in order to improve the susceptibility to fissures.
    Type: Grant
    Filed: May 9, 2000
    Date of Patent: May 20, 2003
    Assignee: Plansee Aktiengesellschaft
    Inventors: Laurenz Plöchl, Florian Rainer
  • Patent number: 6558568
    Abstract: The increase of temperature in heat sensitive devices during heat generating conditions is prevented through the absorption of heat, by providing a hydroxide such as Lithium Hydroxide, Sodium Hydroxide, Potassium Hydroxide, Magnesium Hydroxide, Calcium Hydroxide, Beryllium Hydroxide, Aluminum Hydroxide, Ammonium Hydroxide and the mixtures thereof, in an amount sufficient to effect the required heat absorption. Where the heat generating conditions are generated by a heat generator, separate and distinct from the heat sensitive device, the hydroxide is supported in a position between the heat sensitive device and the heat generator. Where the heat sensitive device is itself the heat generator, the hydroxide is contacted to the heat sensitive device either directly or indirectly.
    Type: Grant
    Filed: April 26, 2000
    Date of Patent: May 6, 2003
    Inventor: Claude Q. C. Hayes
  • Publication number: 20030079872
    Abstract: The present invention relates to a plastic tube heat exchanger suitable for refrigerant use is provided by wrapping a layer of tubes around a curved surface, on a base which is generally perpendicular to the surface. Several to many tubes can be in each layer. Then, further layers can be wrapped continuously by overlaying the first layer. Heat exchangers, including refrigerant apparatus, condensers and evaporators, can be made in this configuration. Processes and articles of manufacture are parts of the invention.
    Type: Application
    Filed: August 3, 2001
    Publication date: May 1, 2003
    Inventors: Kevin Bergevin, Gregory Allan Campbell
  • Patent number: 6555251
    Abstract: A four layer composite including a first interliner positioned between a 4xxx series braze clad and a core alloy and a second interliner positioned on the opposite side of the core alloy from the first interliner. At least one of the first and second interliners has higher amounts of Si than that of the core alloy adjacent thereto. The higher Si content interliner preferably contains about 0.02-1.1 wt. % Si.
    Type: Grant
    Filed: December 19, 2001
    Date of Patent: April 29, 2003
    Assignee: Alcoa Inc.
    Inventor: Raymond J. Kilmer
  • Patent number: 6547000
    Abstract: The invention relates to a heat exchange element (1) for a film heat exchanger intended for distillation or for the evaporation of solutions or suspensions, and to a method for manufacturing the same. The substantially bag-like element is formed by bonding from oppositely positioned plastic heat exchange films (2), evaporation of liquid taking place on the exterior surfaces of the films and condensing of the obtained vapor taking place on the interior surfaces. In the bonding the interior (4) of the element is divided into ducts to direct the travel of the vapor, and according to the invention the films are at the same time stretched in the intervals between the bonding points (3) in order to provide leeway for bulging during the pressurization of the interior of the element.
    Type: Grant
    Filed: November 28, 2000
    Date of Patent: April 15, 2003
    Assignee: Hadwaco Ltd. Oy
    Inventors: Reijo Rantala, Leif Ramm-Schmidt
  • Publication number: 20030066631
    Abstract: A condensing heat exchanger structure in contact with a combustion environment and which structure includes a ferrous substrate is provided with a corrosion resistant diffusion coating applied to the ferrous substrate via a fluidized bed application. Also provided is a method for improving the corrosion resistance of a condensing heat exchanger structure which includes a ferrous substrate and a surface portion at least partially exposed to a combustion product-containing environment. In such method, a corrosion resistant diffusion coating is applied onto the ferrous substrate via a fluidized bed application.
    Type: Application
    Filed: September 28, 2001
    Publication date: April 10, 2003
    Inventors: Palitha Jayaweera, Angel Sanjurjo, Kai-Hung Lau