Abstract: A server casing includes a shell, a top cover, two first slide rails and two second slide rails. The shell includes two side frames. The two side frames are connected to the two sides of the shell. The top cover is movably disposed on the shell and includes an upper part. The two side parts are connected to the two sides of the upper part. Each first slide rail includes a first body part and a first extension part. The two first body parts are fixed to the two side frames of the shell. Each second slide rail includes a second body part and a second extension part. The two second body parts are fixed to the two side parts of the top cover. Each first extension part of each first slide rail are corresponding to and assembled with each second extension parts of each second slide rail.

Abstract: An electronic device includes one or more electronic components and an electronic enclosure enclosing the electronic components. The electronic enclosure includes venting holes and flaps blocking visibility of the electronic components through the venting holes and from outside the electronic device. In addition, air readily flows through the venting holes providing adequate cooling of the electronic device.

Abstract: An apparatus, and method of constructing such an apparatus, conducts and insulates materials with intervening coolant channels, wherein the conducting materials form an electromagnet.

Abstract: This disclosure relates to an apparatus and method 10 for protecting an electronic circuit from an airflow. The apparatus 10 comprises a base 12, wherein said base 12 comprises a cover means for covering at least part of the electronic circuit. The apparatus further comprises a guide means for guiding an airflow around the electronic circuit.

Abstract: An electronic device includes a motherboard, a plurality of heating modules arranged on the motherboard, a first electronic module arranged on a front side of the motherboard along a longitudinal direction, a second electronic module stacked above the first electronic module, a wind scooper and a fan module being located on a rear side of the motherboard along the transverse direction and facing the heating modules and the second electronic module. The wind scooper covers the heating modules, and has a partition board to form a lower-layer airflow passage and an upper-layer airflow passage. The wind scooper guides a first airflow from the fan module to flow through the heating modules along the lower-layer airflow passage, and guides a second airflow from the fan module to flow to the second electronic module through the upper-layer airflow passage, without flowing through the heating modules.

Abstract: The purpose of the present invention is to provide a power semiconductor device which has a light weight, high heat dissipation efficiency, and high rigidity. The power semiconductor device including a base 1, semiconductor circuits 2 which are arranged on the base 1, and a cooling fin 3 which cools each of the semiconductor circuits 2, in which one or more protruding portions 1a, 1b are formed on the base 1, widths of the protruding portions 1a, 1b in a direction parallel to the base 1 surface being longer than a thickness of the base 1, thereby providing power semiconductor devices 100, 200, 300, 400 which have a light weight, high heat dissipation efficiency, and high rigidity.

Abstract: A semiconductor switch insulation protection device and a power supply assembly. Said semiconductor switch protection device comprises a semiconductor switch having a metal component, an insulation component, and a pin installed at a bottom plane of said insulation component, and an insulation protection cover having a body with a second hole and a side belt. A front surface of said metal component is installed on a back surface of said insulation component. A metal portion, with a first hole and having a first height, is extended above an upper plane of said insulation component. Said second hole and said side belt are extended toward a back surface of said body, respectively, to form a hole column having a second height and a sidewall having a third height. Said metal portion is disposed in a groove formed by said back surface of said body, hole column and sidewall.

Abstract: An electronic device is provided that includes a base having a top portion and a bottom portion. The bottom portion may include a first bottom part and a second bottom part. The first bottom part may form a first plane, and the second bottom part may form a second plane, the second plane being non-planar with the first plane. The second bottom part may include an input opening. The top portion of the base may include an output opening. The input opening and the output opening may allow air to flow from behind the electronic device to over the base.

Abstract: When testing or powering up a magnet in a magnetic resonance imaging device, a switch is provided that switches a winding between resistive and superconductive modes. The switch includes a housing that contains a winding wound about a bobbin, and an internal coolant cavity that contains coolant that cools the winding, A baffle separates the internal coolant cavity from an external coolant reservoir. The baffle has small apertures that permit influx of liquid coolant into the internal cavity to cool the winding, At high temperatures, the coolant in the internal cavity vaporizes causing the winding to further increase its temperature and resistance, Upon reduction of heat to the winding, the winding cools sufficiently to permit influx of liquid coolant, thereby restoring a superconductive mode of operation to the winding.

Abstract: A cooling system for a subterranean power line may include a cooling tube configured to house a fluid. Heat generated by the subterranean power line may be radiated and/or conducted to the cooling tube and absorbed by the fluid within the cooling tube. As the fluid heats up, it may change phase from a liquid to a gas. The hot gas may rise to a heat-exchanging condenser configured to dissipate the heat and condense the fluid back into a liquid. The cool, condensed liquid my return from the heat-exchanging condenser to the cooling tube. Risers, gas transport tubes, pressure regulation systems, fluid storage tanks, and other components described herein may increase the efficiency of the cooling system and/or otherwise improve the viability of the cooling system for subterranean power lines.

Abstract: An apparatus for cooling a semiconductor element is provided. The apparatus can include an electron emitter configured to emit electrons such that at least some of the emitted electrons become attached to air particulates and an air accelerator configured to generate an electric field that accelerates the air particulates toward the air accelerator to create an air flow over at least a portion of the semiconductor element. The air flow carries heat away from the at least a portion of the semiconductor element.

Abstract: A system for cooling a heat generating device comprises a heat sink and a plurality of ion emitter elements that form an electrohydrodynamic (EHD) air flow device. The heat sink has a base disposed in thermal communication with a heat generating device, such as a processor. A plurality of heat sink fins is coupled to electrical ground to form ion collectors. Ion emitter elements are disposed in a non-planar pattern along first ends of the plurality of fins so that each ion emitter element is equidistant from the first end of a nearest fin. A power supply applies an electrical potential between the plurality of ion emitter elements and the plurality of fins to induce a flow of ions that cause airflow across the heat sink. It is preferable to have at least three ion emitter elements that are equidistant from each fin of the heat sink.

Abstract: A heat sink and method for gaseous cooling of superconducting power devices. Heat sink is formed of a solid material of high thermal conductivity and attached to the area needed to be cooled. Two channels are connected to the heat sink to allow an inlet and an outlet for cryogenic gaseous coolant. Inside the hollow heat sink are fins to increase metal surface in contact with the coolant. The coolant enters through the inlet tube, passes through the finned area inside the heat sink and exits through the outlet tube.

Abstract: According to one embodiment, a display device includes a housing, a circuit board device, a fan, and a wall portion. The housing includes an exhaust port. The circuit board device is housed in the housing. The fan includes an ejection port and is housed in the housing at a position separated from the exhaust port. The fan sends cooling wind to between the circuit board device and the inner surface of the housing. The wall portion is located between the inner surface of the housing and the circuit board device, and constitutes a ventilation path from the ejection port to the exhaust port. The wall portion includes a first member located in the inner surface of the housing and a second member attached to the first member and abutting on the circuit board device. The second member has a rigidity lower than the rigidity of the first member.

Abstract: A method of cooling a computer server that includes a plurality of server modules, and is positioned in an enclosed room, includes transferring heat generated by a server module of the plurality of server modules to a hot plate of a liquid cooling system. The liquid cooling system may be positioned within the server module, and the hot plate may have a surface exposed to the enclosed room. The method may also include positioning a cold plate of a room-level cooling system in thermal contact with the hot plate. The method may also include directing a cooling medium through the room-level cooling system to transfer heat from the hot plate to a cooling unit positioned outside the room.

Abstract: An apparatus for supplemental cooling of a docked mobile device that includes a docking module having a docking interface that provides a communication connection for a separable mobile device having several heat generating electronic components that emanate heat when the separable mobile device is in an operating mode. In addition, the separable mobile device has an integrated heat sink structure that spreads the heat emanating from the operating heat generating electronic components across the entire heat sink structure. An air mover is integrated into the docking module to provide a volume of air flow that is directed to the separable mobile device while it is docked to the docking module. Accordingly, an air mover controller receives a first signal from an input sensor and therein controls the air mover to modulate the volume of air flow according to a predetermined tolerance corresponding to the heat generating electronic components.

Abstract: A laptop cooling pad having one or more heat-dissipating fans adjustable in position is disclosed. The laptop cooling pad is provided with a ventilation portion so that a heat-dissipating fan can be mounted on the ventilation portion through a fan support. The ventilation portion has a groove for receiving pushing nodes of the fan support so that a user can push the pushing nodes to move the heat-dissipating fan inside the laptop cooling pad and make the heat-dissipating fan close to a heat source, thereby ensuring the heat-dissipating effect of the laptop cooling pad.

Abstract: A shielding device is provided for protecting wires, cables and the like from rays, heat and the like, in a wire harness manufacturing assembly. The shielding device comprises at least one wire-covering member, such as a tube through which the wire extends. The tube is adapted to be displaced between a wire-revealing position and a wire-concealing position, wherein in the former position, the tube allows the wire to be exposed to the rays, whereas in the latter position, the tube is in a ray-exposure area and at least partly shields the wire from the rays. Typically there are two aligned tubes slidably displaceable towards and away from each other so as to respectively assume the wire-concealing and wire-revealing positions. A compressed air source, in fluid communication with an inside of the tubes, cools the wire when in the wire-concealing position.

Abstract: A semiconductor cooling device for transferring heat from a semiconductor die (111). The semiconductor cooling device includes a heat dissipator (112) that may be thermally coupled to a semiconductor module (111) to be cooled for dissipating heat from the semiconductor die (111); a housing (150) in or on which the semiconductor die (111) is mounted; a fluid flow passage (153) for providing a forced fluid flow within the housing (150); and a fluid path (155) arranged to guide the forced fluid flow in a first direction between the fluid flow passage (153) and the heat dissipator (112) and further arranged to guide the fluid flow along the heat dissipator (112) in a second direction different to the first direction. In a particular embodiment, the semiconductor cooling device is used to dissipate heat from an array of LEDs.

Abstract: An information handling system's thermal management is selectively altered by coupling a thermal barrier to the bottom surface of the information handling system chassis so that an air channel insulates against the passage of thermal energy from the bottom surface. A vent opening in a side of the thermal barrier allows airflow through the air channel to a vent opening of the information handling system. The airflow through the air channel cools the base of the thermal barrier so that an end user will experience reduced thermal energy if the information handling system rests on the end user, such as in the end user's lap.

Abstract: An insulation gas recovery and charge apparatus is provided comprising a pump, a connect, an inflatable collection device and at least one valve.

Abstract: A method, system, and structure are provided for implementing a flex circuit cable and connector with a dual shielded air plenum. A flex circuit cable is provided with a connector. The flex circuit cable includes a stack of three spaced flex cable members with a plurality of gasket separators that are configured to form a pair of air plenums between the inner flex cable member and the respective outer flex cable members carrying cooling air coupled to the connector. The respective outer flex cable members together with the gasket separators provide a shielding function.

Abstract: A flat-panel display apparatus comprises a display panel, a circuit board, and a cover. The circuit board includes a first and second circuit boards. The first circuit board is arranged above the second circuit board so that, on the back side of the display panel, a mounting surfaces of the first and second circuit boards are approximately in parallel with a display surface of the display panel and do not overlap each other. Each of the first and second circuit boards have a primary mounting surface on which a large number of electrical components are mounted, and a secondary mounting surface that is opposite the primary mounting surface. The primary mounting surface of the first circuit board is arranged in an inverted orientation to the primary mounting surface of the second circuit board. A radiator with fins is provided on the secondary mounting surface side of the first circuit board.

Abstract: Devices including a polydiorganosiloxane polyamide containing material having a microstructured surface are disclosed herein. Such devices can optionally include a flex circuit attached to the microstructured surface and can be useful, for example, in fluid handling applications.

Abstract: An air duct includes a top panel and a blocking member rotatable secured to the top panel. A through hole is defined in the top panel, and a pair of clipping portions are located an edge of the through hole. The blocking member includes an operating portion and a blocking portion connected to the operating portion. The operating portion is located on an outside of the top panel, and the blocking portion is located on an inside of the top panel. The operating portion of the blocking member is passed through a bottom surface of the top panel through the through hole, extends to a top surface of the top panel, and engaged with the pair of clipping portions.

Abstract: A cooling system includes a moving rotor system which in turn includes: a rotating disk on which a plurality of heat conducting structures are distributed, the heat conducting structures including an inner arrangement of spiral blades; an air flow generating fan element; and an outer arrangement of heat transfer pins distributed along a perimeter of the rotating disk, the heat transfer pins having a high aspect ratio that maximizes a surface area to footprint area; wherein the spiral blades generate a mass fluid flow of ambient fluid toward the heat transfer pins such that the heat transfer pins are persistently cooled.

Abstract: A case includes a box, a top cover, a first airflow guide member, and a second airflow guide member. The box has an opening sealed by the top cover. The first airflow guide member and the second airflow guide member are fixed on at least one of the top cover and a side plate of the box. The first airflow guide member and the second airflow guide member are spaced from each other, and cooperatively define a guide channel. The box defines an inlet and an outlet communicating with the guide channel.

Abstract: A heat dissipation device for dissipating heat from an electronic component. The heat dissipation device includes a shroud having a bottom wall and a sidewall partially surrounding the bottom wall, a base mounted on a bottom of the bottom wall, a bracket fixed on a top of the bottom wall, an impeller rotatably mounted on the bracket, a fin assembly arranged on the bottom wall, a plurality of heat pipes connecting the fin assembly with the base, and a cover secured on the sidewall. An end of the bottom wall extends beyond the sidewall to support the fin assembly thereon. An opening and a window are respectively defined in the bottom wall and the cover. A plate is formed within the opening of the bottom wall and connects the bracket with the base.

Abstract: A method, system, and structure are provided for implementing a flex circuit cable and connector with a dual shielded air plenum. A flex circuit cable is provided with a connector. The flex circuit cable includes a stack of three spaced flex cable members with a plurality of gasket separators that are configured to form a pair of air plenums between the inner flex cable member and the respective outer flex cable members carrying cooling air coupled to the connector. The respective outer flex cable members together with the gasket separators provide a shielding function.

Abstract: Provided is an electronic apparatus capable of preventing an unnecessary space from being made inside the housing, and of improving ventilation efficiency of the air flowing along the power circuit. An electronic apparatus includes: a power circuit; a power circuit case (4) housing the power circuit; and a housing (2) for housing the electronic apparatus and the power circuit case (4). The power circuit case (4) includes a rear wall portion (43) having an air outlet (43a) formed therein, and the housing (2) having an opening (2a) formed therein, a shape of the opening corresponding to the rear wall portion (43) of the power circuit case (4). The power circuit case (4) is arranged such that the rear wall portion (43) is exposed through the opening (2a).

Abstract: An electronic device includes a chassis, a circuit board installed in the chassis, a memory card coupled to the circuit board, and a heat sink for cooling the memory card. The heat sink includes a first cooling plate, a second cooling plate, and a connection member connected between corresponding sides of the first cooling plate and the second cooling plate. A conducting member extends from the connection member, and contacts the chassis.

Abstract: A method, system, and apparatus are disclosed. In one embodiment method includes causing a cooling medium to flow through a hollow cable. The cable couples an external cooling station to a heat exchanging unit. The heat exchanging unit is located within a mobile computing device. The method then transfers heat from within the mobile computing device to the cooling medium at the heat exchanging unit. Then the cooling medium contained the transferred heat is expelled out of the mobile computing device.

Abstract: A computer includes an enclosure, at least one disk drive, a panel and a fan. The at least one disk drive is located in the enclosure. The panel is mounted to a side of the enclosure. The panel has different material relative to the enclosure. The fan is mounted to the panel. The vibration generated from fan is indirectly transferred to the at least one disk drive.

Abstract: A heat dissipating system includes an enclosure, a first fan module, a second fan module of a computer power source. The enclosure has a front panel, a rear panel parallel to the front panel, a side panel, and a top panel. The rear panel defines an output vent therein. A disk drive module is disposed on the front panel and near the top panel. A motherboard with a CPU is disposed on the side panel. The first fan module is configured to dissipate heat generated by the CPU. The second fan module is placed on the rear panel and is aligned with the output vent of the rear panel. The top panel defines a plurality of airflow holes corresponding to the disk drive module. The plurality of the airflow holes is capable of allowing air to flow to the disk drive module for heat dissipating.

Abstract: An electric drive is disclosed which includes at least a choke unit, a power step unit, and a capacitor unit for implementing power supply to an electricity-consuming device. A cooling arrangement is disclosed for cooling the choke unit, the power step unit, and the capacitor unit. The choke unit, the power step unit, and the capacitor unit can be distributed into at least two separate and separately coolable entities, and the cooling arrangement can include parallel cooling apparatuses for cooling the at least two separate and separately coolable entities.

Abstract: A method of arranging a plurality of components of a circuit board for optimal heat dissipation and a circuit apparatus having a plurality of components arranged by performing the method are provided. The method includes arranging a predetermined number of the plurality of components in the order of size of the components in a heat dissipation area having a predetermined width on a virtual straight line connecting the air inlet unit and the air outlet unit.

Abstract: An industrial computer includes a first casing, a second casing, a storage unit, a cover, and a heat dissipation unit. The second casing and the first casing form a closed casing, and the outside of the second casing has a containing area. The storage unit is disposed at the containing area. The cover is removably assembled at the second casing to cover the containing area and contact the storage unit. The heat dissipation unit is disposed at the cover.

Abstract: A system for cooling processor assembly is disclosed which comprises a printed circuit board (PCB) with a plurality of heat emitting electronic components and a housing for each PCB with a heat collector. The heat collector is constructed in one-piece material covering the plurality of heat emitting electronic components through heat collecting areas with different heights adapted to the different heights of the electronic components as regard to the PCB surface wherein the heat collecting areas being in thermal contact with the electronic components.

Abstract: An electronic gaming machine interface system including a first circuit board, a bracket coupled to the first circuit board, a fan coupled to the bracket and disposed over the first circuit board, a second circuit board coupled to the bracket, a first cable coupled between a connector of the first circuit board and a connector of the second circuit board; and a second cable coupled between a connector of the first circuit board and a connector of the second circuit board.

Abstract: A display device includes a substrate having light emitting elements for display on a front surface; a substrate supporting body having an opening in the center and positioned on the back surface side of the substrate to support a peripheral region of the substrate; a case body positioned on the back surface side of the substrate supporting body and covering a part of the center opening; a fan unit arranged in the case body; a wind path plate arranged between the fan unit and the back surface of the substrate and forming a wind path to pass airflow generated by driving the fan unit only on the back surface side of the substrate; and a power supply arranged in the case body and on the back surface of the wind path plate; and wherein the airflow impinges the wind path plate through the fan, thereafter passes through the wind path and is discharged to the outside from the back side of the wind path plate.

Abstract: A high-density integrated circuit module structure comprises a substrate and a heat sink at least wherein the substrates form a reversely-staggered contacting stack structure by electrically contacting heat sinks and heat conductors on the heat sink have a non-flat structure at least to realize the present invention which extends the product's functions within an electronic product's restricted height and has a better vibration resistance capability, heat dissipation effect, and no steps involving junctions between solder balls and a carrier in an assembling procedure to simply an assembling procedure with improved functions, increased capacity, and reduced manufacturing costs.

Abstract: A heat dissipation device for a first electronic component and a second electronic component mounted on a circuit board includes a first base mounted on the first electronic component and a second base mounted on the second electronic component. The second base is movably connected with the first base. An electronic system incorporating the heat dissipation device is also provided.

Abstract: A heat dissipation apparatus adapted for simultaneously cooling a first electronic component and a second electronic component includes a heat sink adapted for being thermally attached to the first electronic component, a fan duct receiving the heat sink therein and a fan mounted to the fan duct. The fan duct comprises a top plate and two side plates extending from two opposite sides of the top plate. A receiving space is defined in the fan duct between the top plate and a top of the heat sink and adapted for receiving the second electronic component. Airflow from the fan is guided by the fan duct to blow towards the heat sink and the second electronic component, simultaneously.

Abstract: A printed circuit board assembly includes a printed circuit board, a first heat dissipating module, and a second heat dissipating module. The printed circuit board includes a first heat generating element and a second heat generating element. The first heat dissipating module is disposed on the first heat generating element. The first heat dissipating module includes a heat sink and a first heat pipe. The first heat pipe includes a pipe body and an extending portion extending from the pipe body. The second heat dissipating module is disposed on the second heat generating element. The pipe body is connected to the heat sink and the extending portion is connected to the second heat dissipating module.

Abstract: An electronic device includes a casing, a centrifugal blower and sidewall received in the casing. The casing is adapted for accommodating electronic components therein, and includes a bottom cover and an opposite top cover. The centrifugal blower is surrounded by the sidewall and includes a sleeve directly mounted to the bottom cover, a bearing member mounted in the sleeve, a stator mounted to the sleeve and an impeller rotatably supported by the bearing member. The bottom cover of the electronic device functions as a bottom plate of the centrifugal blower.

Abstract: A network device includes an airflow baffle. The baffle redirects cooling air toward a transceiver cage to increase a rate of heat transfer from electronic devices on the transceiver. The baffle is bi-directional, so that cooling air is redirected regardless of whether it flows in a front-to-back or back-to-front direction.

Abstract: An enclosed electronic apparatus including a first continuous heat-transfer band forming at least a portion of the exterior surface of the enclosure, with continuous lateral edges on either side thereof, and mounting points on an internal side of the continuous heat transfer band to which a printed circuit board assembly is mountable. A printed circuit board assembly is mounted to the heat transfer band at the mounting points, with a thermally conductive portion forming a thermal path between a heat-producing electronic component of the printed circuit board assembly and the heat transfer band. A thermally conductive gasket between the printed circuit board assembly and the heat transfer band at the mounting points facilitates heat transfer. Opposing first and second enclosure portions seal the respective continuous lateral edges of the heat transfer band against penetration of fluid or debris.

Abstract: A centrifugal fan includes a plurality of blades, a housing for receiving the blades therein and an air guiding mechanism. The housing includes a top wall and a sidewall around the top wall. The sidewall defines a first air outlet and a second air outlet adjacent and perpendicular to the first air outlet. The air guiding mechanism is located between the first air outlet and the second air outlet. The air guiding mechanism includes an air guiding wall parallel to the second air outlet and an air partition wall extending inwardly from the air guiding wall towards the blades. The first air outlet is defined between the air partition wall and the sidewall. The second air outlet is defined between the air guiding wall and the sidewall of the housing.

Abstract: A cooling plate for a notebook comprises a base, a deck, a support jig, and a mouse piece, wherein the base is axially connected with the deck and includes an air hole formed thereon, the air hole includes a fin and a fixing panel connected therewith, the base also includes a recessed opening adjacent to the air hole, the deck includes a chamber formed on a middle portion thereof and having a number of positioning tabs attached on two sides of the chamber individually, and includes two covers disposed on two sides thereof respectively, each cover includes a cut mounted on an inner side thereof and a plurality of engaging protrusions adjacent to an inner side of a bottom surface thereof, the support jig is pivotally disposed in the opening of the base, and the support jig includes two retaining foots arranged on two sides of the rear end thereof.

Abstract: A power supply cooling system comprises a computer device having at least one inlet for receiving an airflow generated by a cooling system removably couplable to the computer device, the computer device configured to receive power from the cooling system.