Abstract: A power converter system includes a printed circuit board having a first connector for receiving low voltage control signals and a second connector for receiving input voltages from one or more power generators and transmitting output voltages to a power distribution unit. Power devices are mounted onto the printed circuit board to manage the input voltages and to generate the output voltages. An enclosure is mounted around the printed circuit board and power devices. The power devices engage interior surfaces of the enclosure forming a conductive heat path between the power devices, the interior surfaces, and exterior surfaces of the enclosure. The heat path conductively transfers heat from the power devices to the exterior surfaces.

Abstract: A heat dissipation assembly is disclosed and includes a frame and a fan. The frame includes a heat conduction channel and an airflow intake. The heat conduction channel is communication with an exterior through airflow intake. The frame includes a first plane, a second plane and an inclined plane. The first plane is disposed adjacent to the airflow intake. The inclined plane is connected between the first plane and the second plane. The second plane includes an inlet. The heat conduction channel is in communication between the airflow intake and the inlet. A cross-section area of the heat conduction channel adjacent to the airflow intake is greater than that of the heat conduction channel adjacent to the inlet. The fan is spatially corresponding to the inlet, and assembled with the frame to form an outlet in communication with the airflow intake and the heat conduction channel through the inlet.

Abstract: An apparatus includes a cabinet; an air-mover attached to the cabinet; a circuit board mounted in the cabinet; and an air-cooled heat sink attached in thermal contact with a heat-generating component on the circuit board. The heat sink includes a heat sink base; primary heat removal fins protruding from the heat sink base in a direction away from the circuit board; and secondary heat removal fins protruding from the heat sink base in a direction toward the circuit board. The air-mover is configured to force air between the primary heat removal fins and between the secondary heat removal fins.

Abstract: A board unit includes: a board stack including a first circuit board and a second circuit board that are supported while being spaced apart from each other; an electronic component mounted on the first circuit board; a first heat dissipation member that covers the board stack from outside of the first circuit board; a second heat dissipation member that covers the board stack from outside of the second circuit board; a first heat transfer portion that thermally connects the electronic component and the first heat transfer portion; and a second heat transfer portion that thermally connects the electronic component and the second circuit board. The electronic component has a body located between the first circuit board and the second circuit board, and the second heat transfer portion is partially provided at a position that corresponds to the body of the electronic component.

Abstract: A connector module that is provided with an input port and an output port that are configured to be connected to an external member, and is to be mounted on a substrate, the connector module including: a bus bar that is separated from the substrate and connects a terminal of the input port and a terminal of the output port to each other; and an insulating member that is interposed between the bus bar and the substrate.

Abstract: A power conversion device comprises: a housing having a space formed therein and including a first opening and a second opening; a fan coupled to the second opening and allowing air to flow in a first direction from the first opening toward the second opening; a first electronic component arranged in the space; a heat dissipation member arranged at the rear of the first electronic component with respect to a flow direction of air; a printed circuit board arranged on the heat dissipation member; and a second electronic component arranged under the printed circuit board to be in contact with the upper surface of the heat dissipation member.

Abstract: An electronic device includes an electronic component on ae printed circuit board, an electrical shield extended around the electronic component and defining an opening corresponding to the electronic component, a heat diffusion pattern on the electronic component, and a shielding sheet which extends across the opening of the electrical shield and commonly overlaps the electronic component, the electrical shield and the heat diffusion pattern. The shielding sheet includes a first heat diffusion member which is inside the opening of the electrical shield and contacts the heat diffusion pattern, and a second heat diffusion member which is attached to the first heat diffusion member, extends across the opening of the electrical shield and contacts both an upper portion of the electrical shield and the first heat diffusion member.

Abstract: Computer processing systems are cooled and the otherwise wasted heat is extracted for space heating by providing a cooling dielectric liquid in a tank which passes from a manifold at the bottom of the tank through an array of tubular housings each having open top and bottom ends and containing row of the circuit boards. The housings sit on a divider sheet which has arrays of openings aligned with the housings allowing the liquid to pass from the manifold under little or no pressure so that the liquid flows through the housings by convection and stratifies to generate a layer of heated liquid above the open tops of the housings which can be tapped off to a heat exchanger. A heat pump acts on the cooling liquid to transfer heat to a heat transfer liquid which can be further heated by a boiler and transferred to existing heat dissipating loads.

Abstract: A heat exchange assembly includes a component heat exchanger that has a component thermal interface configured to thermally interface with an electrical component of an electrical device. The heat exchange assembly includes a device heat exchanger having a separable thermal interface configured to extend to an exterior of a device housing of the electrical device to interface with an external heat exchanger. The device heat exchanger is configured to transfer heat to the external heat exchanger across the separable thermal interface. The heat exchange assembly includes a thermal conduit between the component heat exchanger and the device heat exchanger.

Abstract: A heat sink is provided. The heat sink includes a base board and a rib board. The base board includes a base board cavity, and the rib board includes a rib board cavity. The base board includes a first board face and a second board face. A groove is disposed on the second board face. The base board cavity is filled with a liquid working medium. The rib board includes at least one partition board. The at least one partition board separates the rib board cavity into at least two chambers. The at least two chambers are separately connected to the base board cavity. One end of the rib board is inserted in the base board through the groove. One end of the partition board is located in the base board. A communication device that includes the heat sink is also provided.

Abstract: In one or more embodiments, one or more systems comprise a heat exchanger comprising a first heat sink coupled to a first portion of a set of heat pipes, a first fan for generating a first airflow in a first direction through the first heat sink, a second heat sink coupled to a second portion of the set of heat pipes and a second fan for generating a second airflow in a second direction through the second heat sink, wherein the first heat sink is separated from the second heat sink by a gap with a distance configured to thermally isolate the first heat sink and the second heat sink and the first direction is opposite the second direction. The heat exchanger may be oriented such that the first fan and the second fan generate airflows perpendicular to a main airflow.

Abstract: An electrical distribution enclosure includes an electrically insulated panel defining an access portion of the enclosure and a load portion of the enclosure; at least one electrically insulated compartment panel positioned within the access portion; and two or more compartments within the access portion, each compartment separated from an adjacent compartment by an electrically insulated compartment panel, each of the two or more compartments having a front-accessible neutral connection, at least one front-accessible phase connection and a at least rear phase connection.

Abstract: A heat sink is provided. The heat sink includes a cylindrical body and a plurality of fins. The fins are connected to and protruding from the cylindrical body. At least a part of the plurality of fins each include a first protrusion portion and a second protrusion portion, a distal edge of the first protrusion portion is located farther away from a central axis of the cylindrical body than a distal edge of the second protrusion portion. In addition, the disclosure also provides a heat dissipation device having the heat sink.

Abstract: In some examples, the disclosure describes a connector comprising a cover comprising a cover top, a first clip coupled to a first end of the cover, the first clip including a first lever and a first hook, a second clip coupled to a second end of the cover, the second clip including a second lever and a second hook, and a biasing member coupled to the cover top and disposed between the first clip and the second clip, the biasing member to apply pressure to the connector while the connector is disposed between the biasing member and the first hook and the second hook.

Abstract: A rear perception module is utilized in conjunction with a work vehicle having a work vehicle cabin and a cabin roof. In an embodiment, the rear perception module includes an environmental depth perception (EDP) sensor system including a first EDP device having a field of view encompassing an environmental region to a rear of the work vehicle, a rear module housing mounted to an upper trailing edge portion of the cabin roof, and vents formed in exterior walls of the rear module housing to facilitate airflow through the rear module housing along a cooling airflow path. A heat-generating electronic component is electrically coupled to the first EDP device and positioned in or adjacent the cooling airflow path such that excess heat generated by the heat-generating electronic component is dissipated by convective transfer to airflow conducted along the cooling airflow path during operation of the rear perception module.

Abstract: A two-phase cold plate that includes a manifold body having a fluid inlet and a fluid outlet each fluidly coupled to a fluid pathway housed within the manifold body and a vaporization structure housed within the manifold body such that the fluid pathway is disposed over the vaporization structure. The vaporization structure includes a cavity cover, a porous surface, a vapor cavity disposed between the cavity cover and the porous surface, and one or more porous feeding posts extending between the cavity cover and the porous surface. The one or more porous feeding posts fluidly coupled the fluid pathway with the porous surface of the vaporization structure and the porous surface includes a plurality of nucleation sites configured to induce vaporization of a cooling fluid and facilitate vapor flow into the vapor cavity of the vaporization structure.

Abstract: Examples of a supporting assembly for supporting an installable component are described. The supporting assembly comprises a supporting member. The supporting assembly may further include a latch bar extending longitudinally to support the installable component. The supporting assembly may further include a coupling arm and a control knob. In an example, the control knob may be rotatable, and is to control rotation of the latch bar.

Abstract: A thermal management device for a circuit breaker includes: a heat pipe having an evaporator section, an adiabatic section and a condenser section; a busbar having a first portion including at least a portion of the adiabatic section of the heat pipe; a conducting busbar having a first end, a second end opposite the first end and a groove disposed on a top surface of the conducting busbar, the first end disposed adjacent to primary contacts, the second end integrated in the first portion of the busbar, the groove extending from the first end to the second end and including the evaporator section and the at least a portion of the adiabatic section of the heat pipe embedded therein; and an array of fins integrated to the second portion of the busbar, the condenser section of the heat pipe extending through the array of fins.

Abstract: A water block assembly comprising a water block unit and an insulating housing, and a method for insulating a water block unit are provided. The water block unit has an external thermal transfer surface configured to be in contact with a heat generating component to be cooled, and defines an internal fluid conduit for circulating fluid therein, a fluid inlet for feeding fluid into the internal fluid conduit, and a fluid outlet for discharging fluid from the internal fluid conduit. The insulating housing at least partly embeds the water block unit therein to limit heat transfer from the water block unit to a surrounding environment thereof, the insulating housing having an internal surface in contact with the water block unit.

Abstract: Heat pipes and low-pressure working fluids used for heat pipes are described, by charging the low pressure working fluids with a level of non-condensable gases of less than 1% by volume, and the heat pipes can provide better thermal performance than aluminum plates while little or no additional cost is introduced for degassing.

Abstract: A power distribution device has a resin part covering a portion of a power line and a portion of a signal line and having a switch adjacent to one surface of the resin part, and a cooling part disposed adjacent to a back surface of the resin part opposite to the one surface. The power line and the signal line each have, inside the resin part, a laid-out portion extending in a planar direction orthogonal to an arrangement direction in which the one surface and the back surface are arranged, and a led-out portion extending from the laid-out portion toward the one surface. The laid-out portion of the power line and the laid-out portion of the signal line are located in a projection area of the cooling unit projected in the arrangement direction, and are separated from each other and arranged in the arrangement direction.

Abstract: An apparatus is described. The apparatus includes a housing including a base and sidewalls. The housing is to support a circuit board. The apparatus also includes a heat sink to be supported by the housing independent of the circuit board. The heat sink is to be thermally coupled to a semiconductor package attached to the circuit board. The heat sink is to be closer to the base of the housing than the circuit board is to be to the base of the housing.

Abstract: Disclosed are a PCB heat dissipation assembly (100) and a server having same. The PCB heat dissipation assembly (100) includes: a PCB board (1), a plurality of chips (11) being arranged on the PCB board (1); at least one heat sink (2), the heat sink (2) being arranged on the plurality of chips (11), and the heat sink (2) including a heat dissipation air duct (21); and an air baffle (3), the air baffle (3) being arranged adjacent to the at least one heat sink (2), the air baffle (3) being located on one side of the at least one heat sink (2), and the air baffle (3) extending along the heat dissipation air duct (21).

Abstract: A semiconductor device assembly (10) includes a multi-layer printed circuit board (PCB—40), a thermoelectric cooler (TEC—30), a chip (22), and packaged integrated circuitry (IC—26). The multi-layer PCB includes a lateral heat conducting path (60) formed in a recessed area (44) of the PCB. The TEC and the chip are disposed on the PCB, side-by-side to one another over the lateral heat conducting path. The TEC is configured to evacuate heat from the chip via the lateral heat conducting path, and to dissipate the evacuated heat via a first end of a heat sink (33) in thermal contact with the TEC. The packaged IC is disposed on an un-recessed area of the PCB, wherein the packaged IC is configured to dissipate heat via a second end of the heat sink that is in thermal contact with the packaged IC.

Abstract: A fixing structure of an electronic component includes a fixing member configured to fix an electronic component while pressing the electronic component against a wall surface of a housing in a pressing direction; and a fastened portion which is provided at a position away from the wall surface of the housing and to which the fixing member is fastened and fixed. The fixing member includes a fixing portion that is fastened and fixed to the fastened portion, a pressing portion that extends from the fixing portion toward the electronic component and is configured to press the electronic component against the wall surface in the pressing direction, and an engaging portion which is provided at the fixing portion. The fastened portion includes an engaged portion that is engaged with the engaging portion, and is configured to limit movement of the fixing portion in a direction opposite to the pressing direction.

Abstract: A heat sink is provided having at least one receiving section configured for thermal coupling to at least one lighting module. The heat sink includes at least two connection sections on opposite sides of the at least one receiving section. Each of the at least two connection sections includes at least one reference pin protruding at least partially from a first surface of the at least one connection section and at least one alignment recess protruding into the first surface of the at least one connection section such that the heat sink is configured for thermal coupling to another heat sink via the at least two connection sections.

Abstract: Methods, systems, and devices for providing computer-implemented services are disclosed. To provide the computer-implemented services, hardware components that generate heat may be used. To manage the heat generated by the hardware components, a heat sink assembly may be used. The heat sink assembly may include features for adjusting its shape and/or size to accommodate other nearby components. By accommodating other components, the heat sink assembly may be used in spaces that would otherwise be unusable for thermal dissipation purposes due to the risk of mechanical interference between the heat sink assembly and the other components.

Abstract: Systems for cooling semiconductor devices that can comprise a heatsink and a cleaning element for the heatsink. The heatsink can have fins spaced apart from each other by channels. The cleaning element can have a base and one or more arms extending from the base. The cleaning element can be positioned with respect to the heatsink such that each arm is aligned with a corresponding channel between the fins, and the arms are moveable between a flow configuration in which the arms are in the channels and a cleaning configuration in which the arms are outside of the channels.

Abstract: A heat dissipation structure for a belt starter generator (BSG) which reduces the temperature of one or more ground screws used to connect a printed circuit board (PCB) to a cooling device of the BSG. The PCB is part of an inverter, and the inverter of the BSG is grounded using two ground screws that fix the PCB to the cooling device. A heat dissipation bridge is connected to the two ground screws, the PCB, and the cooling device. The heat dissipation bridge is connected to the grounds screws such that the heat dissipation bridge is located and in contact with an area of the cooling device where the coolant is flowing through a flow cavity. The heat dissipation bridge absorbs the colder temperature from the cooling device therefore lowers the temperatures of the ground screws to a safe level for the components of the PCB.

Abstract: A semiconductor device includes a base plate, a case, and a collar. The base plate includes a metal or an alloy. The base plate has a first bolt hole. The case includes a resin. The case has a first main surface and a second main surface. The second main surface is in contact with the base plate. The case has a through-hole. The collar includes a metal or an alloy. The collar is located within the through-hole. The collar has a first end and a second end. The first end is located on a side where the first main surface is located. The second end is located on a side where the second main surface is located. The collar has a second bolt hole. The first end has a flange. Alternatively, the collar has an outer circumferential surface. The outer circumferential surface has a straight knurling.

Abstract: Described herein is a compact combined active and passive cooling system to cool electronic audio-video circuitry, wherein all of the AV circuitry and cooling system fits within an enclosure that can be installed in a standard wall gang-box located in interior walls of structures. The combined active and passive cooling system uses convection, conduction, and radiation in active and passive cooling modes to dissipate heat generated by the AV circuitry into the room in which the gang box is located, and further uses the wall plate surface to dissipate heat into the room.

Abstract: Methods and systems are provided for an electrical system of a vehicle. In one example, the system may include a first electrical device and a second electrical device that moves relative to the first electrical device. The second electrical device may be coupled to the first electrical device by an electrical conduit formed of one or more plate conductors connected in series by a coupler configured to enable pivoting of the one or more plate conductors.

Abstract: A modular liquid-cooled thermal heat sink device configured to thermally engage with a thermal substrate. The device comprises a housing assembly having a body defining a volume, the housing assembly comprising a thermal cooling plate configured to be in thermal contact with the thermal substrate, a fluid inlet and a fluid outlet, the housing assembly being configured to facilitate fluid circulation within the body to effect an operative cooling of the thermal substrate through the thermal cooling plate, the body comprising a plurality of first engaging features spaced about a perimeter of the body.

Abstract: The present invention relates to a heat sink comprising a heat pipe. A heat sink, according to one embodiment of the present invention, comprises: a first heat pipe mounted in a first groove formed on a first surface of a heat sink; a second heat pipe mounted in a second groove formed on a second surface of the heat sink; and a third groove in which at least a portion of the second heat pipe mounted in the second groove is exposed in the direction of the first surface.

Abstract: Embodiments relate to a thermally protective structure that is a case or enclosure for a media communication device (e.g., a set-top box). The thermally protective structure has a plurality of structural feature formations with facets constructed in or on its outer surface to increase the surface area through which heat is dissipated.

Abstract: An integrated circuit assembly may be formed comprising an electronic substrate, at least one integrated circuit device electrically attached to the electronic substrate, a heat dissipation device comprising a main body portion and a resilient portion extending from the main body portion, wherein the resilient portion has a plurality of extensions, a thermal interface material between the at least one integrated circuit device and the heat dissipation device, and a stiffener attached to the electronic substrate, wherein at least a portion of the plurality of extensions of the resilient portion of the heat dissipation device are biased against the stiffener.

Abstract: A socket assembly with liquid cooling frame for a semiconductor integrated circuit (IC) chip is provided. The socket assembly includes a liquid cooling socket frame including a metallic frame body defining an opening sized to receive the semiconductor IC chip, wherein the frame body includes one or more channels transversely positioned through the frame body and positioned in an interior of the frame body, the channels defining a fluid path. The socket assembly also includes a socket cartridge including a metallic cartridge body defining a plurality of cavities each sized to receive a test probe therein, the socket frame covering a portion of the socket cartridge and exposing the plurality of cavities at the opening.

Abstract: A semiconductor package includes a semiconductor chip disposed over a first main surface of a first substrate, a package lid disposed over the semiconductor chip, and spacers extending from the package lid through corresponding holes in the first substrate. The spacers enter the holes at a first main surface of the first substrate and extend beyond an opposing second main surface of the first substrate.

Abstract: Printed circuit board module (30) having a printed circuit board (50) and a heatsink (40), and, provided between the printed circuit board (50) and the heatsink (40), a two-dimensional heat-conducting element (10) comprising a ceramic carrier (12) coated with a phase change material (14, 16). In the printed circuit board (50) or the heatsink (40), a through-bore (59) may be provided to accommodate a screw (80) and one end of the screw (86) may mesh into a receiving hole (49) which preferably has a mating thread and is formed in the heatsink (40) or the printed circuit board (50), wherein a screw head (84) of the screw (80) especially has a sprung washer element (90) beneath it.

Abstract: An electronic assembly is provided. The electronic assembly may include an electronic module mounted to a laminate, a cooling apparatus directly above the module, a single thermal interface material positioned between and directly contacting the module and the cooling apparatus, and a rotating cover rotatably attached to a top frame secured to the laminate, wherein the rotating cover includes an open position and a closed position.

Abstract: Cooling device for cooling a separate object to be cooled, in particular a technical component, wherein the cooling device comprises at least one cooling-rib body comprising a plurality of cooling ribs, and at least one main body that is open on at least one side, in particular when viewed in cross section, and defines a receiving space configured to receive at least one cooling-rib body, wherein the at least one cooling-rib body comprises at least one fastening element, which is configured to interact with the at least one main-body-side fastening element to form a fastening between the at least one cooling-rib body received in the receiving space and the main body, and the main body comprises at least one fastening element, which is configured to interact with at least one cooling-rib-body-side fastening element to form a fastening between the at least one cooling-rib body received in the receiving space and the main body.

Abstract: This document describes a thermal-control system that may be integrated into a mesh network device and associated mesh network devices. The thermal-control system, which may include a heat sink, multiple heat spreaders, and a heat shield, is such that heat originating from IC devices populating a printed circuit board of the mesh network device may be transferred to a housing component of the mesh network device for external dissipation to maintain a desired thermal profile of the mesh network device.

Abstract: A sprung frame assembly that can accommodate varying tolerance device heights while still exerting sufficient pressure/force required to a heatsink to contact and cool a bare die device, or other device of the like. Adapted for space constrained modules where placement of mounting holes is limited, and module density is high. Sprung frames are secured to mounting points at available locations on support structures as to eliminate any mounting holes in the PCB. The required force/pressure can be evenly achieved by methodically tightening a plurality of screws with springs at the corners of the sprung frames in sequence, pressure is applied evenly without damaging the device, while also taking up any tolerances in the device height.

Abstract: A disclosed apparatus may include (1) a heat-emitting component, (2) a heatsink that includes a designated area thermally coupled to the heat-emitting component, (3) a plurality of springs that apply forces that support the thermal coupling between the designated area of the heatsink and the heat-emitting component, and (4) a pressure plate that concentrates the forces applied by the springs toward the designated area of the heatsink. Various other apparatuses, systems, and methods are also disclosed.

Abstract: The present application discloses an axial diode junction box and a method for manufacturing the same, comprising an axial diode and a junction box body, wherein the axial diode is mounted inside the junction box body; the axial diode comprises a diode body, a first pin, and a second pin, one end of the diode body is connected to the first pin, the other end of the diode body is connected to the second pin, and a direction where the diode body is close to the junction box body is defined as a front direction; the first pin comprises a first connection portion and a first flat portion, one end of the first connection portion is connected to one end of the diode body, and the other end of the first connection portion is connected to the first flat portion; the second pin comprises a second connection portion and a second flat portion, one end of the second connection portion is connected to the other end of the diode body, and the other end of the second connection portion is connected to the second flat portio

Abstract: This application relates to a layout of components within an electronic device. The electronic device includes a circuit board and one or more thermal components located on or proximate to each surface of the circuit board. As a result, thermal energy generated by components of the circuit board are drawn away from the circuit board in a more efficient manner. Additionally, the electronic device may include one or more air movers designed to draw ambient air into the electronic device in a manner that causes the ambient air to cool components upstream from the air movers. Further, the electronic device includes a fin stack that is thermally coupled to the aforementioned thermal components, and further receives air driven in by the air mover(s). Also, the electronic device is designed to receive the ambient air through openings that define a 360-degree air inlet.

Abstract: An EMI attenuation device includes a housing stator, a fan rotor, and an electrical bridge therebetween. The housing stator has an aperture therethrough, and at least a portion of the housing stator is electrically conductive. The fan rotor is adjacent to the aperture and has a rotational axis relative to the housing stator and a proximate surface proximate the housing stator. The fan rotor is electrically conductive, and the proximate surface is continuous around a rotational direction of the fan rotor. The electrical bridge is between the proximate surface of the fan rotor and a contact surface of the housing stator.

Abstract: An information handling system with a cooling system may include a processor; a memory; a power management unit (PMU); a cooling system including: a fan; and a cooling system heat pipe; a detachable thermal module including: a first heat conductive element to be operatively coupled to a heat producing components such as a processor, a radio module, or other component; a second heat conductive element to be operatively coupled to the cooling system heat pipe of the cooling system; and a detachable thermal module heat pipe formed between the first heat conductive element and the second heat conductive element.

Abstract: The application relates to modular electronic apparatus (1) for distribution of RF communication signals. The apparatus comprises a chassis (2) arranged to removably receive plural modules (3), at least some of which are arranged to receive and process RF communication signals. A communication path (17) is provided for modules to communicate with each other and/or with the chassis. Plural modules received in the chassis. When a module is received in the chassis, it is arranged to broadcast a message over the communication path indicating its presence in the chassis and its type. At least one other module is arranged to adapt its behaviour in response to the message.

Abstract: A power converter includes a housing including a convex radiator that radiates heat from a heater element and protrudes toward a board, in which the board and the heater element are arranged, and an urging member that is arranged between the board and a bottom surface of the housing and urges the heater element toward a first side surface of the convex radiator of the housing.