With Heat Sink Patents (Class 174/16.3)
  • Patent number: 10438862
    Abstract: A recess in a metal housing accommodating a high frequency package includes a first space and a second space and has a winners podium shape in cross-sectional view. A thermally conductive material is sandwiched between the metal housing having heat dissipating fins and the high frequency package.
    Type: Grant
    Filed: December 24, 2015
    Date of Patent: October 8, 2019
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Yasuo Morimoto, Hideharu Yoshioka, Akimichi Hirota, Naofumi Yoneda, Takuma Ishibashi
  • Patent number: 10440813
    Abstract: High thermal performance microelectronic modules containing thermal extension levels are provided, as are methods for fabricating such microelectronic modules. In various embodiments, the microelectronic module includes a module substrate having a substrate frontside and a substrate backside. At least one a microelectronic device, such as a semiconductor die bearing radio frequency circuitry, is mounted to the substrate frontside. A substrate-embedded heat spreader, which is thermally coupled to the microelectronic device, is at least partially contained within the module substrate, and extends to the substrate backside. A thermal extension level is located adjacent the substrate backside and extends away from the substrate backside to terminate at a module mount plane. The thermal extension level contains a heat spreader extension, which is bonded to and in thermal communication with the substrate-embedded heat spreader.
    Type: Grant
    Filed: June 28, 2018
    Date of Patent: October 8, 2019
    Assignee: NXP USA, Inc.
    Inventors: Lu Li, Elie A. Maalouf, Lakshminarayan Viswanathan, Mahesh K. Shah
  • Patent number: 10420220
    Abstract: Various embodiments may include an electronic assembly comprising: a first circuit carrier having a first mounting face for electronic components; a second circuit carrier having a second mounting face for electronic components; wherein the second mounting face faces the first mounting face and is connected thereto; and an electronic component connected both to the first mounting face and the second mounting face; wherein the first mounting face includes a contact region between the first circuit carrier and the component; and the contact region is flexible in a direction perpendicular to the first mounting face in comparison to an adjacent region of the first circuit carrier surrounding the contact region and in comparison to the second circuit carrier.
    Type: Grant
    Filed: May 2, 2017
    Date of Patent: September 17, 2019
    Assignee: SIEMENS AKTIENGESELLSCHAFT
    Inventors: Thomas Bigl, Alexander Hensler, Stephan Neugebauer, Stefan Pfefferlein, Jörg Strogies, Klaus Wilke
  • Patent number: 10414277
    Abstract: A vehicle battery charger includes a charger housing that contains electrical circuitry that is configured to couple with a power source for charging a vehicle battery. The battery charger also includes two projecting members that are coupled with the electrical circuitry and that extend through spaced apart apertures in the charger housing. An exterior portion of each of the two projecting members comprises an exposed conductive surface that is configured to be engaged by a clamp of a jumper cable that extends to the vehicle battery.
    Type: Grant
    Filed: April 12, 2017
    Date of Patent: September 17, 2019
    Assignee: Drew Technologies, Inc.
    Inventors: Brian J. Herron, Michael L. Drew
  • Patent number: 10405419
    Abstract: An embodiment of the present invention provides a wiring substrate which allows bending of the wiring substrate to be carried out concurrently with reflow for mounting an electronic component to the wiring substrate. A component-mounted body (1) of an embodiment of the present invention includes a wiring substrate (10) and at least one bend assisting body (30) which is belt-like and formed on the wiring substrate (10). The wiring substrate (10) is bent so that a straight bending line is formed along a direction in which the at least one bend assisting body (30) extends. This forms, in the wiring substrate (10), a depressed portion (14) which can contain an IC chip (20).
    Type: Grant
    Filed: May 1, 2017
    Date of Patent: September 3, 2019
    Assignee: FUJIKURA LTD.
    Inventor: Daisuke Awaji
  • Patent number: 10381945
    Abstract: Two insulation covers that can be vertically separated clamp a gate-driving-circuit substrate so as to form a gate driving apparatus. The gate driving apparatus is fixed to a cooler by fixing screws inserted through a pair of insertion bores in the two insulation covers that are arranged in a horizontal direction. A gate control terminal and a ground control terminal provided on the gate-driving-circuit substrate are screwed and fixed to, and thus electrically and mechanically connected to, a corresponding gate control terminal and a corresponding ground control terminal of a power module attached to the cooler. This allows the gate-driving-circuit substrate to be covered with the insulation covers for insulation protection and to be fixed to the cooler using a fixing member such as a screw.
    Type: Grant
    Filed: September 27, 2017
    Date of Patent: August 13, 2019
    Assignee: FUJI ELECTRIC CO., LTD.
    Inventor: Kiyoshi Takahashi
  • Patent number: 10348064
    Abstract: A submodule includes a power pack including a plurality of switching modules, first and second input bus bars connected with the switching modules to protrude toward a first outside of the power pack and a bypass switch provided at the first outside of the power pack and coupled to the first and second input bus bars.
    Type: Grant
    Filed: January 12, 2018
    Date of Patent: July 9, 2019
    Assignee: LSIS CO., LTD.
    Inventor: Teag Sun Jung
  • Patent number: 10338987
    Abstract: A module is tested for compatibility with a chassis without being inserted into the chassis. A platform specification and chassis configuration is obtained. Information about the module is received from an NFC tag attached to the module. The information about the module is analyzed against the platform specification and chassis configuration. Based on the analysis, one of a set of conditions is determined to exist. A first condition exists when the module will not be supported according to the platform specification. A second condition exists when the module will be supported and there are no empty slots for which the module will be compatible with the chassis configuration. A third condition exists when the module will be supported and there is at least one empty slot for which the module will be compatible with the chassis configuration. An indication, perceptible to a user, of a determined condition is generated.
    Type: Grant
    Filed: August 7, 2017
    Date of Patent: July 2, 2019
    Assignee: Dell Products LP
    Inventors: Vinay Sawal, Marimuthu Sakthivel, Joseph LaSalle White
  • Patent number: 10327345
    Abstract: An electric device including a first metal layer, a second metal layer, and a buffer layer. The first metal layer includes a first groove. The second metal layer includes a second groove. The buffer layer is located between the first metal layer and the second metal layer. A through hole passes through the first metal layer, the buffer layer and the second metal layer. The bottom of the first groove is interconnected with the bottom of the second groove via the through hole. The width of the second groove is greater than the width of the first groove.
    Type: Grant
    Filed: November 17, 2017
    Date of Patent: June 18, 2019
    Assignee: INNOLUX CORPORATION
    Inventor: Gang-Bo Cao
  • Patent number: 10327356
    Abstract: An electronic apparatus includes a substrate, a heat radiating member which faces the substrate with a gap therebetween, a fixing assembly which fixes the heat radiating member to the substrate, a heat transfer plate disposed on a side of the substrate with respect to the heat radiating member, and a thermal bonding material which is interposed between the heat radiating member and the heat transfer plate, and has elasticity, wherein an electronic device is inserted between the substrate and the heat transfer plate.
    Type: Grant
    Filed: April 30, 2018
    Date of Patent: June 18, 2019
    Assignee: FUJITSU LIMITED
    Inventors: Jie Wei, Keizou Takemura
  • Patent number: 10320230
    Abstract: A thermal management system for an electromagnetic induction-power transfer system. The system may include a charging apparatus including a housing that defines an interface surface. An accessory or induction-power consuming apparatus may be positioned proximate to the interface surface. The housing of the charging apparatus may include a power source and a power-transferring coil coupled to the power source and positioned below the interface surface. A thermal mass may be positioned within the housing and spaced apart from the interface surface. The housing may include a thermal path that is configured to conduct heat from the interface surface to the thermal mass.
    Type: Grant
    Filed: March 25, 2015
    Date of Patent: June 11, 2019
    Assignee: Apple Inc.
    Inventors: Albert J. Golko, Eric S. Jol, Christopher S. Graham, Paul J. Thompson, Jeffrey M. Alves, Stephen E. Yao, Makiko K. Brzezinski, Todd K. Moyer, Daniel Wagman, Micah Lewis-Kraus
  • Patent number: 10321553
    Abstract: An apparatus is described for suppressing EMI emissions in an electrical device. In one example, the apparatus includes absorbing material surrounding at least a portion of an electrical component and electrically conductive material configured to contact at least one side of the absorbing material.
    Type: Grant
    Filed: August 4, 2014
    Date of Patent: June 11, 2019
    Assignee: CISCO TECHNOLOGY, INC.
    Inventors: Hailong Zhang, Xiaoxia Zhou, Jinghan Yu, Philippe Sochoux, Xiao Li, Alpesh Bhobe
  • Patent number: 10309635
    Abstract: A circuitry assembly including an electrical component, a peripheral circuitry that supports the electrical component, a support assembly affixed to the peripheral circuitry to evacuate heat excess generated by the electrical component and the peripheral circuitry, a main circuitry separated from the support assembly by a spacing, the main circuitry having a plurality of detection bands, and a plurality of ribbons electrically connecting the peripheral circuitry with the main circuitry and deformable between an undamaged state and a damaged state, wherein in the undamaged state the plurality of ribbons steps over the spacing and the plurality of detection bands and in the damaged state at least one ribbon of the plurality of ribbons contacts at least one detection band of the plurality of detection bands and generate a short circuit.
    Type: Grant
    Filed: December 20, 2017
    Date of Patent: June 4, 2019
    Assignee: Valeo North America, Inc.
    Inventors: Gavin Warner, Julien Hemon, Jonathan Blandin
  • Patent number: 10290441
    Abstract: An electronic device may have buttons, a display, and a vibrator unit. Buttons may be included in electronic devices such as glass buttons, metal buttons, buttons that are assembled on printed circuit boards, and buttons that are partly formed from antenna structures. Button coatings may be used to improve the sliding performance of metal-on-metal buttons. A layer of polymer may be interposed between a button plate and a housing structure. A glass button member may have an underside on which a layer of patterned ink is formed. Elastomeric members may be used to reduce button rattle. Portions of a button may be provided with conductive features that form portions of an antenna.
    Type: Grant
    Filed: September 2, 2013
    Date of Patent: May 14, 2019
    Assignee: APPLE INC.
    Inventors: Trent Weber, Michael B. Wittenberg, Michelle Yu, Scott A. Myers, Kurt Stiehl
  • Patent number: 10264668
    Abstract: A circuit component arrangement includes a base and a plurality of circuit components mounted to the base. A bonding agent adheres the circuit components in intimate contact to the base. The bonding agent is disposed in a respective open channel defined in an outward facing surface of the base in contact with each of the circuit components. A method of assembling a circuit component arrangement includes temporarily fastening a plurality of circuit components to a base. A bonding agent is injected into a respective open channel defined in the base to adhere each of the plurality of circuit components to the base. The plurality of circuit components are unfastened from the base. Injecting a bonding agent can include ceasing injection of bonding agent upon appearance of bonding agent in a window opening in fluid communication with the open channel.
    Type: Grant
    Filed: October 24, 2016
    Date of Patent: April 16, 2019
    Assignee: Hamilton Sundstrand Corporation
    Inventors: David Perley, Kenneth J. Trotman
  • Patent number: 10256203
    Abstract: A semiconductor package includes a die, a passivation layer, a plurality of first electrical conductive vias, a plurality of second electrical conductive vias, a plurality of thermal conductive vias and a connecting pattern. The die includes a plurality of first pads and a plurality of second pads. The passivation layer is disposed on the die. The first electrical conductive vias and the second electrical conductive vias extend through the passivation layer and contact the first pads and the second pads respectively. The thermal conductive vias are disposed on the passivation layer. Each of the thermal conductive vias is spaced apart from the first and second electrical conductive vias. The connecting pattern is disposed on the passivation layer and connects the first electrical conductive vias and the thermal conductive vias. The thermal conductive vias are connected to the first pads through the connecting pattern and the first electrical conductive vias.
    Type: Grant
    Filed: July 27, 2017
    Date of Patent: April 9, 2019
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Lipu Kris Chuang, Han-Ping Pu, Hsin-Yu Pan, Sen-Kuei Hsu
  • Patent number: 10249573
    Abstract: A semiconductor device package has a die, a pattern of dielectric material formed on an active surface of the die, a plurality of metal contacts electrically connected to the die and surrounded by the pattern, a mold compound formed around the pattern, the die and the metal contacts, and a redistribution layer formed on a grinded surface of the mold compound and electrically connected to the metal contacts. The dielectric material has a young's modulus lower than a young's modulus of the mold compound, and the dielectric material has a coefficient of thermal expansion lower than a coefficient of thermal expansion of the mold compound.
    Type: Grant
    Filed: March 16, 2017
    Date of Patent: April 2, 2019
    Assignee: POWERTECH TECHNOLOGY INC.
    Inventors: Ting-Feng Su, Chia-Jen Chou
  • Patent number: 10212852
    Abstract: The disclosed apparatus may include (1) a cage that houses at least one field-replaceable electronic module that, when operational, emits heat within a computing device, wherein the cage comprises (A) a front entry side that facilitates installation of the field-replaceable electronic module and (B) a back side that is located opposite the front entry side, (2) a heatsink that removably interfaces with the field-replaceable electronic module when the field-replaceable electronic module is installed in the cage, and (3) a spring plate that (A) is coupled to the heatsink and (B) applies force to the heatsink such that the heatsink (I) is pressed against the field-replaceable electronic module and (II) establishes thermal contact with the field-replaceable electronic module to facilitate heat transfer from the field-replaceable electronic module to the heatsink. Various other apparatuses, systems, and methods are also disclosed.
    Type: Grant
    Filed: July 18, 2017
    Date of Patent: February 19, 2019
    Assignee: Juniper Networks, Inc
    Inventors: Anuya Reddy, Raveen Jagadeesan, Senthil Kumar Ramaswamy Venkat
  • Patent number: 10206309
    Abstract: The present disclosure relates to an electronic control apparatus for a vehicle, and the electronic control apparatus includes: an electronic control board which has a top side on which a heating element is mounted; a heat sink which radiate heat generated from the heating element to the outside; at least one screw which couples the electronic control board and the heat sink; and a heat radiating pad which transfer heat of the heating element to the heat sink, in which a stepped portion having a predetermined depth is formed on the contact surface of the heat sink so that the heat radiating pad is inserted thereto, and the depth of the stepped portion is formed to be smaller than a thickness of the heat radiating pad so that the heat radiating pad is pressed and inserted between the electronic control board and the heat sink.
    Type: Grant
    Filed: December 23, 2013
    Date of Patent: February 12, 2019
    Assignee: Hyundai Autron Co., Ltd.
    Inventors: Sun Jae Yang, Hyung Joon Moon, Chang Geun Shin, Dong Gi Lee, Seung Mok Song
  • Patent number: 10190715
    Abstract: A fluid pipe device is provided, which includes a pipe member forming a flow channel for flowing a fluid; a heating member for generating heat to heat the pipe member; a metal heat transfer member abutting against the heating member and conducting the heat to the pipe member; and a terminal member electrically connecting the heating member and the heat transfer member. The heat transfer member includes a first heat transfer member and a second heat transfer member, and at least one of the first heat transfer member and the second heat transfer member forms the terminal member at one portion, and the first heat transfer member is provided in the pipe member in such a way as not to be exposed inside the flow channel of the pipe member.
    Type: Grant
    Filed: August 25, 2015
    Date of Patent: January 29, 2019
    Assignee: NIFCO INC.
    Inventor: Tsuyoshi Okazaki
  • Patent number: 10172258
    Abstract: A cooling structure for large electronic boards with closely-spaced heterogeneous die and packages is disclosed. The assembly includes a frame having a plurality of openings. The assembly further includes a cold plate mounted to the frame. The cold plate includes at least one inlet and at least one outlet and fluid channels in communication with the at least one inlet and the at least one outlet. The assembly further includes a heat sink mounted within each of the plurality of openings which in combination with sidewalls of the openings of the frame and the cold plate form individual compartments each of which are in fluid communication with the fluid channels.
    Type: Grant
    Filed: March 17, 2017
    Date of Patent: January 1, 2019
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Paul F. Bodenweber, Kenneth C. Marston, Kamal K. Sikka, Hilton T. Toy, Randall J. Werner, Jeffrey A. Zitz
  • Patent number: 10163752
    Abstract: There is provided a semiconductor device provided with a metal base, a frame-shaped resin case adhered to the metal base, a semiconductor chip having a main electrode and being disposed inside the resin case, a main terminal having an internal end which is electrically connected to the main electrode of the semiconductor chip, integrally fixed to the resin case, and exposed inside the resin case and an external end exposed outside the resin case, a heat dissipation member which is placed, in contact with the metal base, between the metal base and the internal end of the main terminal, and has higher thermal conductivity than that of the resin case.
    Type: Grant
    Filed: April 28, 2016
    Date of Patent: December 25, 2018
    Assignee: FUJI ELECTRIC CO., LTD.
    Inventor: Kousuke Komatsu
  • Patent number: 10157957
    Abstract: The present disclosure relates to a solid-state imaging element in which the cost reduction of a curved imaging element can be achieved, a method for manufacturing the solid-state imaging element, and an electronic apparatus. A curvature base is formed so as to be curved in a concave shape at a center leaving a small edge. The curvature base is divided into five portions of an element disposition portion and four peripheral portions. This element disposition portion is formed in a porous state. A pore (air bubble) in the porous state is smaller than a pixel size. A porous material such as a ceramic-based material, a metal-based material, or a resin-based material can be used as the porous material, for example. The present disclosure can be applied to a CMOS solid-state imaging element to be used for an imaging device, for example.
    Type: Grant
    Filed: September 16, 2014
    Date of Patent: December 18, 2018
    Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
    Inventors: Yuichi Yamamoto, Kojiro Nagaoka
  • Patent number: 10159151
    Abstract: A chip package circuit board module including a circuit board and at least one original chip is provided. The circuit board includes at least one first pad, at least one second pad and at least one substitute pad. The at least one second pad is located besides the at least one first pad and separated from the at least one first pad. The at least one substitute pad is adjacent to the at least one second pad and separated from the at least one first pad and the at least one second pad. The at least one original chip is connected to the at least one first pad and at least one the second pad, respectively. A total width of a portion corresponding to each of the at least one second pad and a portion corresponding to the substitute pad adjacent to the second pad of the first pad is greater than or equal to twice a width of the original chip.
    Type: Grant
    Filed: June 14, 2017
    Date of Patent: December 18, 2018
    Assignee: Unimicron Technology Corp.
    Inventors: Wen-Fang Liu, Shao-Chien Lee, Chen-Wei Tseng, Zong-Hua Li, Chien-Tsai Li
  • Patent number: 10150440
    Abstract: A restraints control module (RCM) assembly attached to the tunnel in the floor of a vehicle. The bracket includes a base plate supporting the restraints control module. A helmet shield is secured over the RCM and encloses the RCM on three sides. The helmet shield includes slots that extend downwardly and outwardly from opposite side of the helmet shield that receive a plurality of bolts as the helmet shield is moved in a vertically downward direction. Two vertically extending sidewalls of the helmet shield are assembled over the RCM with a clearance being defined between the sidewalls and the RCM. The helmet shield is adapted to protect the RCM in a side impact collision.
    Type: Grant
    Filed: May 9, 2018
    Date of Patent: December 11, 2018
    Assignee: FORD GLOBAL TECHNOLOGIES, LLC
    Inventors: Mohamed Ridha Baccouche, Saied Nusier, David James Bauch, Mahmoud Yousef Ghannam, Jhony J. Barbosa
  • Patent number: 10134718
    Abstract: A power semiconductor module including a positive-side switching device and a positive-side diode device which are mounted on a positive-side conductive pattern, and a negative-side switching device and a negative-side diode device which are mounted on an output-side conductive pattern. When an insulating substrate is viewed in plan view, the positive-side diode device and the negative-side diode device are disposed between the positive-side switching device and the negative-side switching device, and the negative-side diode device is disposed closer to the positive-side switching device than the positive-side diode device is.
    Type: Grant
    Filed: June 28, 2016
    Date of Patent: November 20, 2018
    Assignee: Mitsubishi Electric Corporation
    Inventors: Yasushige Mukunoki, Yoshiko Tamada
  • Patent number: 10121721
    Abstract: A dummy bump electrode for heat-dissipating is provided on a surface of a semiconductor chip. The semiconductor chip is mounted on a wiring substrate. A lead line is formed on the wiring substrate. The heat-dissipating bump electrode and a lead line are connected to each other through a heat dissipation pattern, thereby efficiency of the heat dissipation is improved.
    Type: Grant
    Filed: December 10, 2015
    Date of Patent: November 6, 2018
    Assignee: LAPIS Semiconductor Co., Ltd.
    Inventor: Hiroyoshi Ichikura
  • Patent number: 10117321
    Abstract: A device including a first semiconductor package that includes a semiconductor chip, an encapsulation material at least partly covering the semiconductor chip, and a contact element electrically coupled to the semiconductor chip and protruding out of the encapsulation material. In addition, the device includes a printed circuit board (PCB), wherein the first semiconductor package is mounted on the PCB and the contact element of the first semiconductor package is electrically coupled to the PCB. The device further includes a first metal workpiece mounted on the printed circuit board and electrically coupled to the contact element of the first semiconductor package.
    Type: Grant
    Filed: November 24, 2015
    Date of Patent: October 30, 2018
    Assignee: Infineon Technologies Austria AG
    Inventor: Elvir Kahrimanovic
  • Patent number: 10109547
    Abstract: A device includes a substrate with a die over the substrate. A molding compound surrounds the die and includes a structural interface formed along a peripheral region of the molding compound.
    Type: Grant
    Filed: March 17, 2016
    Date of Patent: October 23, 2018
    Assignee: Taiwan Semiconductor Manufacturing Company, LLC
    Inventors: Shu-Shen Yeh, Po-Yao Lin, Shyue-Ter Leu, Shin-Puu Jeng, Chih-Kung Huang, Tsung-Ming Yeh
  • Patent number: 10107568
    Abstract: A back plate includes flat polygonal shaped body and locking assembly located at bottom surface of the flat polygonal shaped body. The locking assembly includes pivotal member, connecting member and protruding portion with connecting hole and locking hole. The connecting hole is located at a side of the locking hole. The locking hole is a curved hole with the connecting hole as a center. The pivotal member has hinge hole hinged with the connecting hole and a fixing hole matching with the locking hole, and the fixing hole is movable with respect to the locking hole with the hinge hole as a center. The connecting member is disposed through the fixing hole and the locking hole, and is connected to the seat. The connecting member is movable in the locking hole in order to make the fixing hole to move with respect to the locking hole.
    Type: Grant
    Filed: July 2, 2017
    Date of Patent: October 23, 2018
    Assignee: COOLER MASTER TECHNOLOGY INC.
    Inventors: Yu-Te Wei, Ling She
  • Patent number: 10104761
    Abstract: A loudspeaker assembly comprises an enclosure having a first end and a second end, the first end including an opening; an acoustic driver at the second end of the enclosure; an acoustic volume between the first end and the second of the enclosure; a circuit board at the first end of the enclosure; a firebox covering the opening at the first end of the enclosure, the firebox providing a convection flow path in the acoustic volume over heat-generating components of the circuit board; and a heat sink extending from the circuit board in a direction away from the acoustic volume for providing a conduction flow path through the circuit board.
    Type: Grant
    Filed: June 27, 2017
    Date of Patent: October 16, 2018
    Assignee: BOSE CORPORATION
    Inventors: Thomas E. MacDonald, Kevin Brousseau
  • Patent number: 10104806
    Abstract: A semiconductor storage device includes a substrate having a wiring, a first semiconductor memory, a terminal portion, a holder surrounding the terminal portion, a case, and a first plate-shaped member. The first semiconductor memory is disposed on a first principal surface of the substrate and is connected to the wiring. The terminal portion is connected to the substrate at a first end portion of the substrate and has a terminal connected to the wiring. The case houses part of the holder, the substrate, and the first semiconductor memory. Between the first principal surface and a first wall portion of the case facing the first principal surface, the first plate-shaped member is disposed. The first plate-shaped member is connected to the holder and the first principal surface on a second end portion side of the substrate, and has thermal conductivity.
    Type: Grant
    Filed: March 7, 2016
    Date of Patent: October 16, 2018
    Assignee: TOSHIBA MEMORY CORPORATION
    Inventors: Toshiyuki Hayakawa, Shiro Harashima
  • Patent number: 10062623
    Abstract: A semiconductor package substrate includes an insulating substrate, a circuit pattern on the insulating substrate, a protective layer formed on the insulating substrate to cover the circuit pattern on the insulating substrate, a pad formed on the protective layer while protruding from a surface of the protective layer, and an adhesive member on the pad.
    Type: Grant
    Filed: May 24, 2013
    Date of Patent: August 28, 2018
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Sung Wuk Ryu, Dong Sun Kim, Seung Yul Shin
  • Patent number: 10050015
    Abstract: Embodiments of the present disclosure describe multi-device flexible systems on a chip (SOCs) and methods for making such SOCs. A multi-material stack may be processed sequentially to form multiple integrated circuit (IC) devices in a single flexible SOC. By forming the IC devices from a single stack, it is possible to form contacts for multiple devices through a single metallization process and for those contacts to be located in a common back-plane of the SOC. Stack layers may be ordered and processed according to processing temperature, such that higher temperature processes are performed earlier. In this manner, intervening layers of the stack may shield some stack layers from elevated processing temperatures associated with processing upper layers of the stack. Other embodiments may be described and/or claimed.
    Type: Grant
    Filed: March 27, 2014
    Date of Patent: August 14, 2018
    Assignee: Intel Corporation
    Inventors: Ravi Pillarisetty, Sansaptak Dasgupta, Niloy Mukherjee, Brian S. Doyle, Marko Radosavljevic, Han Wui Then
  • Patent number: 10049805
    Abstract: A coil device has a potting resin 60. The potting resin 60 surrounds a bobbin 20 with a coil portion 12. The coil portion 12 is housed in a housing concave portion 42 of an outer case 40. Oblique plate legs 50 arranged obliquely are arranged between an outer peripheral wall 24 of the bobbin 20 and a bottom wall of the housing concave portion 42.
    Type: Grant
    Filed: March 2, 2017
    Date of Patent: August 14, 2018
    Assignee: TDK CORPORATION
    Inventor: Katsumi Kobayashi
  • Patent number: 10041645
    Abstract: The light source unit includes: a semiconductor light emitting element; a lighting circuit configured to operate the semiconductor light emitting element; a first heat dissipation plate on which the semiconductor light emitting element is placed; a second heat dissipation plate on which the lighting circuit is placed; a wiring member electrically interconnecting the semiconductor light emitting element and the lighting circuit; and an interconnection member to which the first heat dissipation plate and the second heat dissipation plate are attached. The interconnection member is lower in thermal conductivity than the first heat dissipation plate and the second heat dissipation plate.
    Type: Grant
    Filed: July 5, 2016
    Date of Patent: August 7, 2018
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Masatoshi Ueno, Masahiro Nishikawa, Hiro Aoki
  • Patent number: 10015875
    Abstract: The current embodiments provide an assembly for cooling a printed circuit board with at least one electronic component disposed on a first surface of the printed circuit board. The assembly may have a housing with first and second elastic elements and a cooling element configured to cool the at least one electronic component. The printed circuit board may be held between the first and second elastic elements in the housing. The assembly may further have at least one cooling surface region protruding from the cooling element and facing toward a second surface facing opposite the first surface of the printed circuit board in a region opposite of the electronic component.
    Type: Grant
    Filed: January 15, 2016
    Date of Patent: July 3, 2018
    Assignee: ZF Friedrichshafen AG
    Inventors: Karl-Heinz Müller, Matthias Heid, Horst Hübner
  • Patent number: 10014123
    Abstract: In one embodiment of the invention, a method of forming an energy storage device is described in which a porous structure of an electrically conductive substrate is measured in-situ while being electrochemically etched in an electrochemical etching bath until a predetermined value is obtained, at which point the electrically conductive substrate may be removed from the electrochemical etching bath. In another embodiment, a method of forming an energy storage device is described in which an electrically conductive porous structure is measured to determine the energy storage capacity of the electrically conductive porous structure. The energy storage capacity of the electrically conductive porous structure is then reduced until a predetermined energy storage capacity value is obtained.
    Type: Grant
    Filed: March 9, 2016
    Date of Patent: July 3, 2018
    Assignee: INTEL CORPORATION
    Inventors: Eric C. Hannah, Cary L. Pint, Charles W. Holzwarth, John L. Gustafson
  • Patent number: 9978723
    Abstract: A semiconductor device includes a first semiconductor substrate, a second semiconductor substrate, a bonding electrode, and a dummy electrode. The first semiconductor substrate has a first surface and a first wiring, and contains a first semiconductor material. The second semiconductor substrate has a second surface and a second wiring, and contains a second semiconductor material, and the first surface and the second surface face each other. The bonding electrode is arranged between the first surface and the second surface, and is electrically connected to the first wiring and the second wiring. The dummy electrode is arranged between the first surface and the second surface, and is electrically insulated from at least one of the first wiring and the second wiring. The bonding electrode has a bonding bump and a first bonding pad. The dummy electrode has a dummy bump and a first dummy pad.
    Type: Grant
    Filed: July 7, 2017
    Date of Patent: May 22, 2018
    Assignee: OLYMPUS CORPORATION
    Inventors: Naohiro Takazawa, Yoshitaka Tadaki
  • Patent number: 9974180
    Abstract: An electronic device may have a printed circuit to which electrical components are mounted. The electrical components may include a thermal sensor and a pressure sensor. A through hole in the printed circuit may receive the shaft of a standoff. The standoff may be soldered to plated metal on the sides of the through hole. A screw or other fastener may secure the printed circuit to a housing for the electronic device. A ring-shaped metal member may be soldered to the printed circuit. The ring-shaped metal member may form a bumper that surrounds the screw or other fastener and the thermal sensor. The pressure sensor may have a port through which ambient pressure measurements are made. A dust protection cover such as a fabric or other porous layer may cover the port.
    Type: Grant
    Filed: July 16, 2015
    Date of Patent: May 15, 2018
    Assignee: Apple Inc.
    Inventors: Shayan Malek, David A. Pakula, Gregory N. Stephens, Sawyer I. Cohen, Scott A. Myers, Tyler B. Cater, Eric W. Bates
  • Patent number: 9958406
    Abstract: Methods and systems for measuring and/or estimating a coefficient of thermal expansion (CTE) of a component of a fuel cell system. A CTE measurement technique includes securing a measurement member over a surface of the component via a seal having a melting point, heating the seal above its melting point of the seal, cooling the component, measurement member and seal to a second temperature below the melting point of the seal, and determining the CTE of the component based on the change in the span of the measurement member after cooling. A fuel cell component characterization technique includes measuring an electrical resistivity (ER), conductivity (EC), resistance or conductance of the component, measuring at least one additional property of the component which, together with ER, EC, resistance or conductance, correlates to the CTE of the component, and sorting the component based on the measurements.
    Type: Grant
    Filed: December 3, 2014
    Date of Patent: May 1, 2018
    Assignee: BLOOM ENERGY CORPORATION
    Inventors: Cheng-Yu Lin, Daniel Darga, Michael Groesch, Harald Herchen, Vijay Srivatsan
  • Patent number: 9953893
    Abstract: A method of producing a power electronic assembly and a power electronic assembly including a power electronic module incorporating multiple of semiconductor power electronic switch components, the power electronic module including a base plate with a bottom surface, the power electronic assembly includes further a cooling arrangement for cooling the power electronic module, the cooling arrangement including a cooling surface adapted to be attached against the bottom surface of the base plate of the power electronic module, wherein the power electronic assembly includes further a thermal interface material arranged between the bottom surface of the base plate of the power electronic module and the cooling surface of the cooling arrangement to transfer heat from the power electronic module to the cooling arrangement, the thermal interface material includes a metal foil and a solid lubricant coating.
    Type: Grant
    Filed: November 2, 2016
    Date of Patent: April 24, 2018
    Assignee: ABB Technology Oy
    Inventors: Jorma Manninen, Pirkka Myllykoski
  • Patent number: 9943001
    Abstract: Provided is a switch box comprising: a first circuit board; a pair of bus bars provided to the first circuit board; and a first switch portion that is provided to the first circuit board and that opens and closes a circuit between the bus bars. A second circuit board can be attached to and detached from the first circuit board, and the second circuit board comprises: one bus bar; and a second switch portion that opens and closes a circuit between the one bus bar and the bus bar of the first circuit board.
    Type: Grant
    Filed: December 23, 2016
    Date of Patent: April 10, 2018
    Assignee: Yazaki Corporation
    Inventors: Hideo Takahashi, Koji Ikegaya, Takuya Nakagawa, Masahide Tsuru
  • Patent number: 9941292
    Abstract: A semiconductor memory device includes a plurality of first electrode layers stacked in a first direction; a semiconductor layer extending in the first direction in the plurality of first electrode layers; a first insulating layer extending in the first direction along the semiconductor layer between the semiconductor layer and each of the plurality of first electrode layers; a second insulating layer covering the periphery of the plurality of first electrode layers; a resistive body provided on the second insulating layer; and a third insulating layer provided between the resistive body and the second insulating layer, the third insulating layer including the same material as the material of the first insulating layer.
    Type: Grant
    Filed: September 16, 2016
    Date of Patent: April 10, 2018
    Assignee: TOSHIBA MEMORY CORPORATION
    Inventor: Hiroki Yamashita
  • Patent number: 9921622
    Abstract: A stand-alone immersion tank datacenter (SITDC) includes: a multi-phase heat transfer immersion cooling tank having external walls surrounding a tank volume within which a dielectric liquid is maintained and heated to a boiling point temperature; a plurality of servers having one or more processing and memory components submerged within the dielectric liquid for cooling of the one or more components via heat dissipation from the one or more components into the dielectric liquid when the one or more components are connected to an electric power supply; and a condenser located vertically above the plurality of servers and in a direct path of rising dielectric vapor created when the dielectric liquid absorbs sufficient heat from the one or more components to reach a boiling point temperature of the liquid. The condenser can be a passive heat exchanger, created by providing a heat conductive material as a top lid of the tank.
    Type: Grant
    Filed: February 1, 2013
    Date of Patent: March 20, 2018
    Assignee: Dell Products, L.P.
    Inventors: Austin Michael Shelnutt, James D. Curlee, Jimmy Pike
  • Patent number: 9917040
    Abstract: A package is formed by a thermal base and a leadframe assembly. The thermal base includes a body of thermally conductive material having a top surface, wherein the top surface of the body includes a pedestal. An integrated circuit chip is mounted to the pedestal, the integrated circuit chip including bonding pads. The leadframe assembly includes leads and an encapsulant ring that partially embeds the leads. The leadframe assembly is mounted to the top surface of said body surrounding the pedestal. The pedestal is configured with a thickness that positions the bonding pad at a height substantially coplanar with the leads. Bonding wires extend from the bonding pads to the leads with a shortened length so as to provide for improved electrical characteristics of frequency response, impedance and inductance.
    Type: Grant
    Filed: December 12, 2016
    Date of Patent: March 13, 2018
    Assignee: STMicroelectronics, Inc.
    Inventor: Craig J. Rotay
  • Patent number: 9917224
    Abstract: A concentrated photovoltaic receiver and backplane assembly is described herein. A thermally conductive heat spreader is configured between the receiver and the backplane for dissipating at least a portion of the thermal energy in a direction including a horizontal component towards a portion of the heat spreader which is not directly in contact with a receiver portion. In some embodiments, the heat spreader is electrically conductive and is adapted for conducting current from the receiver to the backplane. In some embodiments, a surface area of a receiver substrate is less than 5 times larger than a surface area of a solar cell that is mounted onto the receiver substrate. In some embodiments, the receiver substrate comprises vias for conducting current from a top face to a bottom face of the receiver.
    Type: Grant
    Filed: May 29, 2013
    Date of Patent: March 13, 2018
    Assignee: Essence Solar Solutions Ltd.
    Inventors: Slava Hasin, Ron Helfan
  • Patent number: 9911717
    Abstract: A microelectronic assembly includes a first microelectronic package having a substrate with first and second opposed surfaces and substrate contacts thereon. The first package further includes first and second microelectronic elements, each having element contacts electrically connected with the substrate contacts and being spaced apart from one another on the first surface so as to provide an interconnect area of the first surface between the first and second microelectronic elements. A plurality of package terminals at the second surface are electrically interconnected with the substrate contacts for connecting the package with a component external thereto. A plurality of stack terminals are exposed at the first surface in the interconnect area for connecting the package with a component overlying the first surface of the substrate.
    Type: Grant
    Filed: March 16, 2015
    Date of Patent: March 6, 2018
    Assignee: Invensas Corporation
    Inventors: Belgacem Haba, Kyong-Mo Bang
  • Patent number: 9907208
    Abstract: At least one implementation provides a hold down for an electronic device. The electronic device includes a support frame, a circuit board coupled to the support frame and having at least one component, a thermal pad thermally coupled to the component, and a heat sink associated with the thermal pad. The hold down includes a generally planar portion adapted to be positioned over a surface of the heat sink. The hold down also includes a plurality of connecting structures extending angularly from the generally planar portion. The connecting structures and configured to engage the support frame to cause the hold down to apply the biasing force to retain the thermal pad against at least one of the heat sink or the component when the heat sink and the thermal pad are positioned between the hold down and the support frame. A method is also provided for attaching the hold down.
    Type: Grant
    Filed: November 21, 2012
    Date of Patent: February 27, 2018
    Assignee: THOMSON LICENSING
    Inventors: William Hofmann Bose, Mickey Jay Hunt
  • Patent number: 9907209
    Abstract: A retaining clip is provided for use with a heat sink. The heat sink has a flat bottom surface in heat conducting engagement with an electronic device and fins extending from a top surface of the heat sink, the fins defining a channel. The retainer clip includes a middle section and a first end section and a second end section on either side of the middle section. The middle section fits within the channel and engages the heat sink to hold the bottom surface against the electronic device. The middle section further includes a portion extending above the top surface, within the channel, to limit rotation of the heat sink. Each of the first and second end sections include a pivot end adjacent to the middle section, a distal end to engage an anchor, a first leg adjacent to the distal end, a second leg adjacent to a pivot end, and a bend between the first leg and the second leg, the bend located to form a moment arm from the pivot end.
    Type: Grant
    Filed: August 22, 2016
    Date of Patent: February 27, 2018
    Assignee: Verizon Patent and Licensing Inc.
    Inventors: Gregory A. James, Steve S. Chen