Abstract: An electrically isolating gasket is disclosed wherein a coating layer is disposed on at least one conductive surface, and in some embodiments, on all surfaces or at least all of the conductive surfaces. The electrically isolating gasket includes a core gasket component, a ring seal component, and a non-conductive inner seal component. The coating layer can be, for example, polyimide, polyamide, ceramic, and aluminum oxide.

Abstract: An electronic device, according to various embodiments of the present invention, may comprise: a housing which comprises a first surface, a second surface facing the opposite direction from the first surface, and a cooling member arranged between the first surface and the second surface; a circuit board which is disposed inside the housing; at least one heating component which is mounted to the circuit board; a shield can which surrounds one portion of the at least one heating component; a conductive member which makes contact with a first surface of the at least one heating component; a first thermal conduction member which diffuses heat from the at least one heating component to a plane direction parallel with the first surface of the heating component; and a second thermal conduction member which makes contact with a first surface of the first thermal conduction member, receives the heat from the first thermal conduction member in a second direction perpendicular to the plane direction, and transfers the h

Abstract: Provided is an inverter-integrated rotating electric machine capable of suppressing an influence of electromagnetic noise between a peripheral device and a control circuit board. An inverter-integrated rotating electric machine (1A) includes: a rotating electric machine main body (2); and an inverter device (3A), which is provided to the rotating electric machine main body (2). The inverter device (3A) includes: a heat sink (32) configured to cool switching elements (31); a control circuit board (33), which is provided so as to be opposed to the heat sink (32), and includes a drive circuit configured to drive the switching elements (31); and a metal shield plate (34), which is provided so as to be opposed to the control circuit board (33) in such a manner that the control circuit board (33) is arranged between the metal shield plate (34) and the heat sink (32), and is electrically connected to the heat sink (32).

Abstract: It is disclosed an electromagnetic shield (1) and a related method for providing electromagnetic shielding wherein the shield comprises a shielding surface provided with a plurality of electrically conductive elements (2), said plurality of electrically conductive elements (2) being electrically connected to a switching assembly (3) configured to switch said electromagnetic shield (1) between an open configuration, wherein said electrically conductive elements (2) are electrically insulated from one another, and a shorted configuration wherein said electrically conductive elements (2) are electrically connected to each other at a common node (C). When the electrically conductive elements (2) of the electromagnetic shield (1) are switched between the open and shorted configurations, a change of the electromagnetic shielding effectiveness (EMSE) occurs.

Abstract: An article of footwear has an upper that includes a knitted component and a sole structure secured to the upper. The knitted component may define a tube formed of unitary knit construction, and a strand may extend through a length of the tube. As another example, the knitted component may have a pair of at least partially coextensive knitted layers formed of unitary knit construction, and a plurality of floating yarns may extend between the knitted layers. In some configurations, the knit type or yarn type may vary in different regions of the knitted component to impart different properties. Additionally, the knitted component may incorporate a thermoplastic yarn that is fused in different regions of the knitted component to impart different properties. A flat knitting process or a variety of other knitting processes may be utilized to form the knitted component.

Abstract: The electronic control unit ECU includes: a base 2 that has a bottom surface portion 7 on which a printed circuit board 3 is mounted and an opening opposed to the bottom surface portion 7; and a cover 1 that covers at least a part of the bottom surface portion 7 and is engaged with the base 2. Here, the cover 1 includes an overlap portion 5 that is spaced apart from and opposed to a side surface 11 of the base 2, and the overlap portion 5 includes a slit 15.

Abstract: A polymer layering process that encapsulates and protects electronics components with complex and imprecise geometries. The protective layering process provides a combination of a flexible mold and/or a rigid mold that apply close-forming, encapsulating the polymer layers to the electronic components and precision assemblies. Polymer layer protective jackets are shaped to as-populated circuit boards and assemblies, providing tightly fit barriers with fine resolution accommodating imprecise geometries. The protective jackets can be formed in rigid, semi-rigid, or highly flexible polymer films, to protect the circuitry from the elements, CTE mismatches, shock and vibration loads and extreme g-forces, and external electromagnetic emissions. By altering the protect layer configuration, the protective layer can accommodate populated circuit board assembly with high heat generation component(s).

Abstract: An electromagnetic seal is provided for preventing the transmission of electromagnetic energy between corresponding walls of adjoining building modules. The seal includes a first support extending inwardly from an end of a first building module, a second support extending inwardly from an end of a second building module, and a gasket assembly compressed between the first support and the second support.

Abstract: A hard disk drive mounting assembly that includes a disk drive assembly having a base structure that includes a screw hole and a damping insert at least partially surrounding the screw hole. The disk drive assembly further includes a threaded insert positioned in the screw hole of the damping insert.

Abstract: An electromagnetic wave absorber that improves an electromagnetic wave absorption rate in a specific frequency is provided. The electromagnetic wave absorber includes a dielectric layer; a first metal conductive layer disposed on a first surface of the dielectric layer and having a slot positioned symmetrical about a center of the dielectric layer and a second metal conductive layer disposed on a second surface of the dielectric layer.

Abstract: An article of footwear has an upper that includes a knitted component and a sole structure secured to the upper. The knitted component may define a tube formed of unitary knit construction, and a strand may extend through a length of the tube. As another example, the knitted component may have a pair of at least partially coextensive knitted layers formed of unitary knit construction, and a plurality of floating yarns may extend between the knitted layers. In some configurations, the knit type or yarn type may vary in different regions of the knitted component to impart different properties. Additionally, the knitted component may incorporate a thermoplastic yarn that is fused in different regions of the knitted component to impart different properties. A flat knitting process or a variety of other knitting processes may be utilized to form the knitted component.

Abstract: A gasket may include a tubular section which has a protection layer and a mesh layer. The protection layer may form a first tube, and the mesh layer may form a second tube, which may be enclosed in the first tube. The mesh layer may be formed by a metal wire in a spiral fashion extending along an axial direction of the second tube. The mesh layer may provide an elastic support to the protection layer when the protection layer tube is pressed by an external force.

Abstract: A protective layering process that encapsulates and protects printed circuit board assemblies with complex and imprecise geometries. The protective layering process provides a combination of a flexible mold and/or a rigid mold, which are derived from modified data from a 3 dimensional scan of the printed circuit board assembly, and which applies close-forming, encapsulating polymer layers, electrically non-conductive layers, EMI shielding layers, and/or thermal management layers to the electronic components and circuit board assemblies. Polymer layers and protective jackets are shaped to as-populated circuit boards and assemblies, providing tightly fit barriers with fine resolution accommodating imprecise geometries. The protective jackets/layers can be formed in rigid, semi-rigid, or highly flexible polymer films, to protect the circuitry from the elements, CTE mismatches, shock and vibration loads and extreme g-forces, and from internal and external EMI and to manage thermal dissipation.

Abstract: A radio frequency shield door system is provided. The radio frequency shield door system provides an effective RF and electromagnetic seal between a door and the perimeter of the doorway through a continuous interface of conductive or magnetic material between peripheral sealing surface of the door and a perimeter frame of the doorway. The perimeter frame may provide spring-loaded contact rails electrically or magnetically coupled thereto so that when the door is in a closed configuration a RF seal is formed between the interfacing sealing surface and contract rails, yet the door is still readably between an open configuration and closed configuration.

Abstract: In an electrical shield structure of an electronic device unit and a control panel housing, a metal frame includes a plurality of protrusions having conductivity and having heights to come into contact with the control panel housing. The plurality of protrusions are provided at positions which surround an electronic component. A packing includes a plurality of holes through which the protrusions are inserted at positions corresponding to the positions of the protrusions.

Abstract: A deflectable gasket assembly for EMI shielding and environmental sealing is described. The gasket assembly is formed from an electrically-conductive mesh sheet positioned between adjacent conductive surfaces. A gasket is provided at the outer boundaries of the mesh sheet for environmental protection. The edge of the gasket has a branched sealing element extending above and below the gasket assembly for contacting the adjacent surfaces. The branched sealing element is deformable and can be used on external aircraft electronic components.

Abstract: To reliably prevent entrance of electro-magnetic waves in a door that closes an opening portion formed in an airframe of an aircraft. A gasket seal 20 which is arranged between an opening portion 12 formed in an airframe of an aircraft and a door 13 for closing the opening portion 12, includes: a gasket seal body that is made of a rubber material; and conductive fiber 24 that covers a surface of the gasket seal body. When the door 13 is in a closed state, the gasket seal 20 whose surface is made conductive is abutted against a striker 30 provided on a skin 11 side of the airframe and made of a conductive material. The door 13 and the skin 11 of the airframe are electrically connected together via the conductive fiber 24 and the striker 30, and electro-magnetic waves can be reliably shielded.

Abstract: A magnetic shield for shielding adjacent coils of an ICPT system. One or more conductors are configured to distribute induced eddy currents from the surface of the shield to below the surface and thus reduce heating due to eddy currents. The magnetic shield may be employed to transfer power over rotary couplings, such as the shaft of a wind turbine.

Abstract: A polymer layering process that encapsulates and protects electronics components with complex and imprecise geometries. The protective layering process provides a combination of a flexible mold and/or a rigid mold that apply close-forming, encapsulating the polymer layers to the electronic components and precision assemblies. Polymer layer protective jackets are shaped to as-populated circuit boards and assemblies, providing tightly fit barriers with fine resolution accommodating imprecise geometries. The protective jackets can be formed in rigid, semi-rigid, or highly flexible polymer films, to protect the circuitry from the elements, CTE mismatches, shock and vibration loads and extreme g-forces.

Abstract: Electronic devices may be provided with conductive structures such as displays and conductive housing walls. Conductive gaskets may be used to form electrical paths between opposing conductive structures in an electronic device. The conductive gaskets may be formed from conductive sheets of material such as conductive fabric sheets. The conductive fabric or other conductive sheets may form conductive gasket wall structures that extend around air-filled cavities in the conductive gaskets. A conductive gasket may have an elongated shape such as a tubular shape that is characterized by a longitudinal axis. The longitudinal axis may follow a straight path or a curved path. To facilitate bending of a hollow conductive gasket to follow a curved path, the wall structures of the gasket may be provided with openings. Cables may be held in place using flaps of gasket wall material and may run through interior portions of a hollow gasket.

Abstract: Apparatus, systems and methods for electronic device protection are provided. A particular apparatus includes a non-conductive substrate and a plurality of cells including conductive members coupled to the non-conductive substrate. The conductive members are arranged to form a first discontinuous mesh. Regions between the conductive members of the first discontinuous mesh include a phase change material. The phase change material undergoes a phase transition from substantially non-conductive to substantially conductive responsive to a change of energy.

Abstract: Thin indium-less “optically porous” layers adapted to replace traditional ITO layers are provided herein. A thin metalized film adapted to carry an electrical charge can include a dense pattern of small openings to allow the transmission of light to or from an underlying semiconductor material. The pattern of openings can create a regular or irregular grid pattern of low aspect ratio fine-line metal conductors. Creation of this optically porous metalized film can include the printing of a catalytic precursor material, such as palladium in solution in a pattern on a substrate, drying or curing the catalytic precursor, and the deposition of a thin layer of metal, such as copper on the dried precursor to form the final conductive and optically porous film.

Abstract: Compact, high-speed data cable structures that include shielding to protect from electro-magnetic interference (EMI) are disclosed. The cable structures can include the conductors necessary to communicate signals that comply with the HDMI™ standard. The cable structures are formed for use with portable electronic devices and may include specific connectors, such as the 30 pin connector found on many products, such as the iPhone™ from Apple Inc. The cable structures include a micro crimp that enables the cable to be smaller than traditional high-speed data cables. The cable structures also include a shield body housing formed from a pair of virtually identical halves that are mated together to form the housing.

Abstract: A ground apparatus for connecting components for a portable terminal suppresses the occurrence of noise by grounding a connector. The ground apparatus includes a connector engaging portion at one side of a main board. A connector that includes a grounding portion is inserted into the connector engaging portion. A shield can is disposed to cover at least at part of the main board. The shield can includes a ground structure formed at the connector engaging portion area to enclose the connector and electrically couple the ground structure with the ground portion of the connector.

Abstract: Compact, high-speed data cable structures that include shielding to protect from electro-magnetic interference (EMI) are disclosed. The cable structures can include the conductors necessary to communicate signals that comply with the HDMI™ standard. The cable structures are formed for use with portable electronic devices and may include specific connectors, such as the 30 pin connector found on many products, such as the iPhone™ from Apple Inc. The cable structures include a micro crimp that enables the cable to be smaller and more than traditional high-speed data cables. The cable structures also include a shield body housing formed from a pair of virtually identical halves that are mated together to form the housing.

Abstract: Apparatus, systems and methods for electronic device protection are provided. A particular apparatus includes a non-conductive substrate and a plurality of cells including conductive members coupled to the non-conductive substrate. The conductive members are arranged to form a first discontinuous mesh, where each conductive member of a cell is separated from conductive members of adjacent cells by a gap and a cavity is defined in the non-conductive substrate at a location of each gap.

Abstract: A mirror image shielding structure is provided, which includes an electronic element and a ground shielding plane below the electronic element. The shape of the ground shielding plane is identical to the projection shape of the electronic element, and the horizontal size of the ground shielding plane is greater than or equal to that of the electronic element. Thus, the parasitic effect between the electronic element and the ground shielding plane is effectively reduced, and the vertical coupling effect between electronic elements is also reduced. Furthermore, the vertical impact on the signal integrity of the embedded elements caused by the layout of the transmission lines is prevented.

Abstract: An RF screen for microwave powered UV lamp systems is provided. The RF screen is formed of a single sheet of conductive material in which a mesh pattern has been formed. The screen includes a non-traditional mesh pattern including individual openings with 3 or more nodes. The RF screen is generally configured to optimize the balance between light transmission and RF energy leakage desired for the particular application. Generally, it is desired that the RF screen has an open area percentage greater than about 80% while limiting RF energy leakage from the microwave powered lamp system to acceptable levels.

Abstract: The present invention provides a process for preparing a light transmissive electromagnetic wave shielding material having an excellent light transmissive property, an excellent electromagnetic wave shielding property, an excellent appearance property and an excellent legibility by a simple method. A process for the preparation of a light transmissive electromagnetic wave shielding material comprising; (A1) printing a pretreatment agent for electroless plating comprising a noble metal compound and a mixture of silane coupling agent and azole compound or a reaction product thereof in a mesh pattern on a transparent substrate 11 to form a mesh-patterned pretreatment layer 12, and (A2) subjecting the pretreatment layer 12 to electroless plating to form a mesh-patterned metal conductive layer 13 on the pretreatment layer 12.

Abstract: According to various aspects, exemplary embodiments are provided of fabric-over-foam EMI gaskets. In one exemplary embodiment, a fabric-over-foam EMI gasket generally includes a resiliently compressible foam core and an outer electrically-conductive fabric layer. At least one slit extends generally transversely across an upper surface portion of a longitudinally extending region of the gasket.

Abstract: An electrically conductive gasket for paint masking. In one embodiment of the present invention, the gasket includes a core, an electrically conductive cover that is applied to the core with adhesive. A film of material is attached to the outer surface of the electrically conductive cover which functions as a removable mask. The various embodiments of the gasket may be fabricated from materials capable of withstanding relatively high temperatures and may be provided in a variety of different shapes.

Abstract: A package including a package substrate, a die-substrate assembly including a substrate including a plurality of layers including a layer having a mesh to stiffen the substrate adapted to mount one or more dice, one or more dice mounted on the substrate and a molding compound to attach the substrate to the package substrate. Various embodiments include a method comprising providing a substrate including a layer having an outer surface, depositing a metal layer on the outer surface, and etching the metal layer to form an opening, the opening enclosing an area on the outer surface to mount one or more dice.

Abstract: Housing for shielding from electromagnetic interference, comprising a first housing component with a first VELCRO-type fastening element and a second housing component with a second VELCRO-type fastening element each made of conductive material, wherein an aperture between the first housing component and the second housing component is closed in an electromagnetically-sealing manner by a third VELCRO-type fastening element made of conductive material.

Abstract: Disclosed is an electric conductive gasket including: an electric conductive sheet having a natural pulp base, a soft aluminum foil adhered to a surface of the natural pulp base with an adhesive being interposed therebetween, and a hot melt layer formed on the other surface of the natural pulp base; and a nonconductive elastic member overlapped to be continuously encompassed by the electric conductive sheet, to be adhered by the hot melt layer.

Abstract: It is an object of the invention to provide an electromagnetic wave shield for attenuating a electric far field while suppressing the attenuation of the vicinal magnetic flux of an electromagnetic wave discharged from a high frequency electromagnetic wave generator. An electromagnetic wave shield according to the invention comprises a plurality of electric conductors, a ground contact for carrying out a connection to a ground, and a lead wire for connecting the electric conductors to the ground contact, the electric conductors being electrically connected to the ground contact through the lead wire, wherein the electric conductors are provided in such a manner that a path reaching the ground contact through the lead wire from an optional point of each of the electric conductors is uniquely determined.

Abstract: A wear resistant EMI shield includes a metallic film or multiple metallic films, and a carbon-nanotube coating (14) formed on the metallic film or multiple metallic films. The metallic films may include nickel film (12), copper film (13) and NixCu1?x (x=0.62˜0.99) (15) alloy film. In a preferred embodiment, the structure of the wear resistant EMI shield is CNT/Ni/Cu/Ni/. The thickness of metallic film is in the range from 20 to 100 nm and the thickness of carbon-nanotube coating is in the range from 10 to 200 nm. The wear resistant EMI shield may apply to various substrate surfaces (10) of electronic equipment, such as the shell of computer, play-station, wireless equipment, mobile phones, automobiles, airplanes, commercial appliance and consumer products, etc. The wear resistant EMI shield has good wear resistance, EMI shield effect, thin thickness and lightweight.

Abstract: A vent grid has parallel first electrically-conductive members and parallel second electrically-conductive members intersecting with the first electrically-conductive members. The intersection between the first and second electrically-conductive members is forced to have a larger cross-sectional area. The characteristic impedance thus increases. The electric current flowing through the first and second electrically-conductive members turns over at the boundary between the intersection and the first and second electrically-conductive members. The flow of the electric current is in this manner interrupted. Accordingly, the vent grid fails to induce electromagnetic wave. Moreover, the electrically-conductive piece is merely located at a corner of the opening. Decrease in the percentage of the opening is thus suppressed to the utmost per a unit area. A sufficient airflow can be established through the vent grid. Decrease in the cooling efficiency and performance can be suppressed.