Resilient Contacts Patents (Class 174/351)
  • Patent number: 10651598
    Abstract: A heat transfer system between a heat source and a heat sink, wherein the heat transfer contact surfaces comprise a metal which forms numerous voids when placed adjacent one another. A thermal pad comprising a polymer filled with ceramic particles is placed between these heat transfer surfaces to intimately contact each of the metal surfaces without void formation, thereby increasing thermal conductivity. The heat source and heat sink are joined by relative sliding motion. This sliding motion might damage the thermal pad. Thus, a hot swap structure is provided for controlling the movement of the thermal pad into contact with the heat source as the sliding motion is completed.
    Type: Grant
    Filed: August 8, 2018
    Date of Patent: May 12, 2020
    Assignee: QUANTA COMPUTER INC.
    Inventors: Chao-Jung Chen, Yu-Nien Huang, Kuen-Hsien Wu, Kuo-Wei Lee
  • Patent number: 10511114
    Abstract: A contact includes a base portion fixable to a first member, a contact portion configured to make contact with a second member, and a spring portion configured to displaceably support the contact portion. The base portion, the contact portion, and the spring portion are integrally formed with a thin plate made of metal. The contact portion includes a flat plate portion extending in a flat plate shape from one end of a bent portion, and a protrusion protruding toward the second member is provided on the flat plate portion. The protrusion is provided at a location separated from a boundary between the contact portion and the spring portion by greater than or equal to 0.9 mm toward the contact portion.
    Type: Grant
    Filed: June 2, 2017
    Date of Patent: December 17, 2019
    Assignee: KITAGAWA INDUSTRIES CO., LTD.
    Inventors: Tatsuya Nakamura, Ichiro Nakagawa, Kazushige Ueno
  • Patent number: 10498201
    Abstract: An electric compressor includes a housing and a cover. The housing accommodates a compression portion and an electric motor. The cover is attached to an outer surface of the housing and cooperates with the outer surface of the housing to define an accommodation space. An inverter is accommodated in the accommodation space and configured to drive the electric motor. The inverter includes a circuit board, an electrolytic capacitor, and a capacitor cover at least partly covering the electrolytic capacitor. The electrolytic capacitor includes a cylindrical main body having a first end and a second end, a lead extending from the first end of the main body and connected to the circuit board, and a pressure relief vent on the second end of the main body. The capacitor cover is interposed between the circuit board and a peripheral edge of the second end of the electrolytic capacitor.
    Type: Grant
    Filed: December 22, 2017
    Date of Patent: December 3, 2019
    Assignee: KABUSHIKI KAISHA TOYOTA JIDOSHOKKI
    Inventors: Akio Fujii, Kenji Momma
  • Patent number: 10488894
    Abstract: An example embodiment includes an electromagnetic radiation (EMR) shield. The EMR shield is configured to reduce EMR from escaping a host device. The EMR shield includes a structure, two or more module-grounding tabs, and multiple fingers. The structure is configured to substantially surround two or more adjacent transceiver modules positioned in an opening defined in a bezel. The two or more module-grounding tabs extend from the structure. Each of the module-grounding tabs is configured to contact one of the transceiver modules. The fingers extend from the structure and are configured to contact the bezel at multiple contact areas substantially surrounding the opening.
    Type: Grant
    Filed: March 19, 2018
    Date of Patent: November 26, 2019
    Assignee: Finisar Corporation
    Inventors: Tat Ming Teo, Chris Kiyoshi Togami
  • Patent number: 10428574
    Abstract: A door openable in case of structural failure has a front face (2) and a rear face (3), vertical hinge and lock sides (4, 5) with a lock latch (6). The door has a major door portion (8) bearing a lock, and at least one end door portion (9, 30), both being enclosed by said front and rear faces (2, 3), vertical hinge and lock sides (4, 5) and a surface (10) inclined downwardly from the front face (2) to the rear face (3). A plurality of energy absorbers are arranged in correspondence of said inclined surface (10) in order to permit an offset of the end door portions (9, 30) with respect to the major door portion (8). A releasing rod (23) for unlocking the lock latch (6) moves upwards under the action of the springs (27), due to said offset, returns the lock latch (6) into the door lock and retains it in unlocked position.
    Type: Grant
    Filed: March 5, 2015
    Date of Patent: October 1, 2019
    Inventor: Luca Fallaolita
  • Patent number: 10362701
    Abstract: An electrical device includes two or more electrical components that configure an electrical circuit, at least one or more mechanical component that supports the two or more electrical components and is fixed to the two or more electrical components, and a position-adjustment structure that adjusts positions of the two or more electrical components relative to the one or more mechanical component with the at least two or more electrical components being united together, before the one or more mechanical component is fixed to the two or more electrical components.
    Type: Grant
    Filed: September 24, 2015
    Date of Patent: July 23, 2019
    Assignee: DENSO CORPORATION
    Inventor: Koji Sakai
  • Patent number: 10359818
    Abstract: The description relates to devices, such as computing devices. One example can include a shielded and cooled circuit board assembly including a biasing sub-assembly that can bias a heat generating component and a thermal module together. The biasing sub-assembly can also define a portion of a Faraday cage around the heat generating component.
    Type: Grant
    Filed: August 17, 2015
    Date of Patent: July 23, 2019
    Assignee: Microsoft Technology Licensing, LLC
    Inventors: Taylor Stellman, Bert B. Buxton, Nathan M. Thome
  • Patent number: 10206317
    Abstract: In an embodiment, a modular RF shielding is disclosed. According to an embodiment, a device is disclosed comprising: at least one radio frequency shielding block including: an electrically conductive wall configured to radio frequency shielding; an electrically conductive portion of a ceiling, wherein the portion of the ceiling is connected to the wall; at least one support element, or the shape of the modular block itself, is extending transversely from the wall and configured to uphold the wall, wherein the support element is configured to rest against a portion of a printed circuit board and a length of the support element is shorter than a length of the block; wherein the wall is configured next to an electrical component of the printed circuit board and wherein the electrical component is configured at least partly beneath the portion of the ceiling. Other embodiments relate to a mobile device and a manufacturing method for the modular RF shielding.
    Type: Grant
    Filed: June 29, 2015
    Date of Patent: February 12, 2019
    Assignee: Microsoft Technology Licensing, LLC
    Inventor: Timo Liukkonen
  • Patent number: 10143117
    Abstract: A high power density DC-AC power inverter includes a casing corresponding to a rack. The casing has air inlets and air outlets arranged in a honeycomb shape and a fan unit. The casing is provided with two choke coils and a heat sink therein. The heat sink includes fins facing downward. A plurality of power elements are laterally provided on top of the heat sink. The heat generated from the power elements can be conducted to the fins of the heat sink quickly. The fan unit guides the outside air to the heat sink and the choke coils through the air inlets, and the heat is smoothly expelled out of the casing through the air outlets of the casing. The power inverter in a high density configuration still has a good heat dissipation effect.
    Type: Grant
    Filed: April 6, 2017
    Date of Patent: November 27, 2018
    Assignee: CHYNG HONG ELECTRONIC CO., LTD.
    Inventor: Mu-Chun Lin
  • Patent number: 10141236
    Abstract: A contact spring for placement in a gap between an electrical substrate opposite a lid (electrically conductive heat spreader) of an electronic device comprises a spring that both conducts heat from the substrate to the lid and electrically connects the substrate and lid. The spring comprises a flat single element configured as a plurality of polygons, providing contact points, the spring substantially lying in a plane and extending substantially in a straight line, or a spiral. The spring in an electronic device such as a flip chip ball grid array having this lid and an electrical substrate with EMI emitters: (1) provides low impedance electrical connection between the electronic circuit and lid; (2) grounds the lid to the electronic circuit; (3) minimizes EMI in the electronic circuit; (4) conducts heat from the electronic circuit to the lid; or any one or combination of the foregoing features (1)-(4).
    Type: Grant
    Filed: July 20, 2017
    Date of Patent: November 27, 2018
    Assignee: International Business Machines Corporation
    Inventors: Martin Beaumier, Yves Dallaire, Melania C. Doll, Michael Gaynes, Edward J. Yarmchuk
  • Patent number: 10117324
    Abstract: Described are a shielding case, a Printed Circuit Board (PCB) and a terminal device. The shielding case includes a first shielding case body (1) and a second shielding case body (2) which are interconnected with each other, wherein the second shielding case body (2) at least partially covers an outside of the first shielding case body (1), and a heat storage material (3) is accommodated between the first shielding case body (1) and the second shielding case body (2).
    Type: Grant
    Filed: March 22, 2016
    Date of Patent: October 30, 2018
    Assignee: XIAOMI INC.
    Inventors: Dongliang Wang, Shaojie Wang, Shasha Shi
  • Patent number: 10043725
    Abstract: A contact spring for placement in a gap between an electrical substrate opposite a lid (electrically conductive heat spreader) of an electronic device comprises a spring that both conducts heat from the substrate to the lid and electrically connects the substrate and lid. The spring comprises a flat single element configured as a plurality of polygons, providing contact points, the spring substantially lying in a plane and extending substantially in a straight line, or a spiral. The spring in an electronic device such as a flip chip ball grid array having this lid and an electrical substrate with EMI emitters: (1) provides low impedance electrical connection between the electronic circuit and lid; (2) grounds the lid to the electronic circuit; (3) minimizes EMI in the electronic circuit; (4) conducts heat from the electronic circuit to the lid; or any one or combination of the foregoing features (1)-(4).
    Type: Grant
    Filed: July 20, 2017
    Date of Patent: August 7, 2018
    Assignee: International Business Machines Corporation
    Inventors: Martin Beaumier, Yves Dallaire, Melania C. Doll, Michael Gaynes, Edward J. Yarmchuk
  • Patent number: 10034407
    Abstract: Examples may include a sled for a rack of a data center including physical storage resources. The sled comprises mounting flanges to enable robotic insertion and removal from a rack and storage device mounting slots to enable robotic insertion and removal of storage devices into the sled. The storage devices are coupled to an optical fabric through storage resource controllers and a dual-mode optical network interface.
    Type: Grant
    Filed: December 29, 2016
    Date of Patent: July 24, 2018
    Assignee: Intel Corporation
    Inventors: Steven C. Miller, Michael Crocker, Aaron Gorius, Paul Dormitzer
  • Patent number: 9999122
    Abstract: In exemplary embodiments, a circuit assembly may be provided on and/or supported by an electrically conductive structure, such as a board level shield, a midplate, a bracket, a precision metal part, etc. For example, a circuit assembly may be provided on and/or supported by an outer top surface of a board level shield. In an exemplary embodiment, an assembly generally includes an electrically conductive structure configured for a first functionality in the electronic device. An electrically nonconductive layer is on at least part of the electrically conductive structure. First electrical component(s) are at least partly on the electrically nonconductive layer and configured to define at least a portion of a circuit assembly for electrical connection with one or more second electrical components of the electronic device. The electrically conductive structure may thus be configured for a second functionality in the electronic device.
    Type: Grant
    Filed: October 13, 2017
    Date of Patent: June 12, 2018
    Assignee: Laird Technologies, Inc.
    Inventors: John Song, George William Rhyne
  • Patent number: 9986635
    Abstract: An assembly includes a carrier and an electrically conductive mesh, wherein the carrier includes a side surface with an edge, the electrically conductive mesh is attached to the side surface and extends over the edge of the side surface, and the edge has a radius at least as big as a minimal bending radius of electric lines of the electrically conductive mesh.
    Type: Grant
    Filed: December 15, 2016
    Date of Patent: May 29, 2018
    Assignee: Fujitsu Technology Solutions Intellectual Property GmbH
    Inventor: Wilhelm Neukam
  • Patent number: 9941809
    Abstract: An inverter device includes an inverter device body portion and a protective cover that covers the inverter device body portion, and the protective cover integrally includes a front surface portion that covers the front surface of the inverter device body portion, a top surface portion that covers the top surface of the inverter device body portion, a first side surface portion that covers a first side surface of the inverter device body portion, and a second side surface portion that covers a second side surface of the inverter device body portion.
    Type: Grant
    Filed: August 24, 2016
    Date of Patent: April 10, 2018
    Assignee: FUJI ELECTRIC CO., LTD.
    Inventor: Kotaro Yamazawa
  • Patent number: 9872420
    Abstract: A shielding box for providing high frequency electromagnetic shielding where a first housing part and a second housing part are connected to each other by a hinge so as to be displaceable between an open position and a closed position. Further, a lifting mechanism is used which has at least one lifting stud and at least one guide, the guide being mounted to one of the housing parts and the lifting stud being mounted to the guide so as to be displaceable between an extended position and a retracted position in a direction which is generally perpendicular to a plane along which the first and second housing parts abut at each other in the closed position. The lifting stud is adapted for displacing the other one of the housing parts.
    Type: Grant
    Filed: August 15, 2016
    Date of Patent: January 16, 2018
    Assignee: ROHDE & SCHWARZ GMBH & CO. KG
    Inventor: Ludwig Sperl
  • Patent number: 9864029
    Abstract: An MRI device that reduces radio-frequency (RF) interference and the effect of the MRI's magnet, within an active RF-magnetic environment. The device relies on a shield. The device includes a uniform non-fringing magnetic field resonance device (UNF-MRD), an RF shielding means either embedded within or in connection with the UNF-MRD for providing the UNF-MRD a radio interference immunity (RII) from RF-electromagnetic environment surrounding the same.
    Type: Grant
    Filed: January 14, 2015
    Date of Patent: January 9, 2018
    Assignee: ASPECT IMAGING LTD.
    Inventor: Uri Rapoport
  • Patent number: 9864030
    Abstract: An MRI device and method that reduce radio-frequency (RF) interference and the effect of the MRI's magnet, within an active RF-magnetic environment. The device includes a non-fringing magnetic field resonance MRI device having RF shielding means. The method includes: obtaining a UNF-MRD, and embedding or otherwise connecting an RF shielding means within or to the UNF-MRD to provide the same with a radio interference immunity (RII) from its RF-electromagnetic environment.
    Type: Grant
    Filed: January 14, 2015
    Date of Patent: January 9, 2018
    Assignee: ASPECT IMAGING LTD.
    Inventor: Uri Rapoport
  • Patent number: 9807899
    Abstract: According to one embodiment, a storage device includes an enclosure, and a circuit board assembly in the enclosure. The circuit board assembly includes a first circuit board on which a heat-producing component is mounted, a second circuit board, a third circuit board, a first connector connecting the first and second circuit boards, a second connector connecting the second and third circuit boards, a first spacer sandwiched between the first and second circuit boards, and a second spacer sandwiched between the second and third circuit boards. The first spacer includes a spacer frame, a partition member opposed to the heat-producing component with a gap between, and a thermal transfer member attached to the partition member and in contact with the first circuit board.
    Type: Grant
    Filed: February 22, 2016
    Date of Patent: October 31, 2017
    Assignee: KABUSHIKI KAISHA TOSHIBA
    Inventors: Yoshiharu Matsuda, Akitoshi Suzuki
  • Patent number: 9768537
    Abstract: A connecting terminal device may include: a bottom plate; a movable part provided on a rear surface of the bottom plate that is configured to be electrically connected to an external object as the movable part is pressed or raised; one or more protective walls provided on side surfaces of the bottom plate; pressing preventing parts provided at ends of the protective walls and provided between the bottom plate and the movable plate to restrict a pressing movement of the movable part; and rising preventing parts provided on side surfaces of the protective walls to restrict a rising movement of the movable part.
    Type: Grant
    Filed: March 30, 2016
    Date of Patent: September 19, 2017
    Assignees: Samsung Electronics Co., Ltd., Hyupjinconnector Co., Ltd.
    Inventors: Kyung-Jong Kim, Seung-Kyo Hong, Yang-Jean Park, Jin-Woo Park
  • Patent number: 9739402
    Abstract: An annular seal for use in a fluid conveyance system that is subject to a high voltage event includes a center core having a generally tubular shape, the core having a circumferentially projected cross-section that is defined by inner and outer core radial surfaces, and core axial surfaces that are opposite one another. The sidewalls each have a generally tubular shape and a circumferentially projected cross-section that is defined by inner and outer sidewall radial surfaces, and first and second sidewall axial surfaces that are opposite one another. The first sidewall is attached along one of its axial surfaces to one of the core axial surfaces, and the second sidewall is attached along one of its axial surfaces to the other of the core axial surfaces. The center core has an electrical resistance that is less than an electrical resistance of each of the first and second sidewalls.
    Type: Grant
    Filed: March 4, 2013
    Date of Patent: August 22, 2017
    Assignee: Eaton Corporation
    Inventors: William T. Flynn, Daniel Gates
  • Patent number: 9704791
    Abstract: This wiring board is provided with: an insulating base that has a lateral surface having an incision part; an electrode that is provided on the inner surface of the incision part; and a wiring conductor that is provided within the insulating base or on the surface of the insulating base and is electrically connected to the electrode via a connection conductor. The width of the incision part is larger than the depth thereof, and the connection conductor is connected to the electrode at an end of the incision part in the width direction. An electronic device according to the present invention is provided with this wiring board and an electronic component that is mounted to the upper surface of this wiring board.
    Type: Grant
    Filed: October 23, 2014
    Date of Patent: July 11, 2017
    Assignee: KYOCERA CORPORATION
    Inventor: Kensaku Murakami
  • Patent number: 9706071
    Abstract: An image reading device includes: first and second conductive members provided so as to be opposed to each other at a predetermined position at pivot end side in cover portion in state where the cover portion is in first attitude, the first conductive member being provided in image reading portion and electrically conducted to first housing, the second conductive member being provided in the cover portion and electrically conducted to second housing; magnetic force generating portion and first magnetic force control portion configured to bias the second conductive member in a direction toward a predetermined reference position at which upper surface of the image reading portion and a cover surface are in contact with each other when the document cover is in the first attitude; and a holding portion configured to hold the second conductive member when the document cover is brought from the first attitude into a second attitude.
    Type: Grant
    Filed: November 23, 2015
    Date of Patent: July 11, 2017
    Assignee: KYOCERA Document Solutions Inc.
    Inventor: Tomoyuki Kikuta
  • Patent number: 9666515
    Abstract: This wiring board is provided with: an insulating base that has a lateral surface having an incision part; an electrode that is provided on the inner surface of the incision part; and a wiring conductor that is provided within the insulating base or on the surface of the insulating base and is electrically connected to the electrode via a connection conductor. The width of the incision part is larger than the depth thereof, and the connection conductor is connected to the electrode at an end of the incision part in the width direction. An electronic device according to the present invention is provided with this wiring board and an electronic component that is mounted to the upper surface of this wiring board.
    Type: Grant
    Filed: October 23, 2014
    Date of Patent: May 30, 2017
    Assignee: KYOCERA CORPORATION
    Inventor: Kensaku Murakami
  • Patent number: 9642242
    Abstract: An AC/DC converter of a power conversion apparatus includes filters, a PFC circuit, a first full bridge circuit, a first transformer, and a first rectifier circuit and converts an AC voltage supplied from the outside to a DC voltage. A DC/DC converter includes filters, a second full bridge circuit, a second transformer, and a second rectifier circuit and lowers a DC voltage output from the AC/DC converter. Constituent circuits of the AC/DC converter located on the primary side of the first transformer are mounted on the upper face of a cooling chassis which cools both the converters. Constituent circuits of the AC/DC converter located on the secondary side of the first transformer and constituent circuits of the DC/DC converter are mounted on the lower face of the cooling chassis.
    Type: Grant
    Filed: December 3, 2015
    Date of Patent: May 2, 2017
    Assignee: OMRON AUTOMOTIVE ELECTRONICS CO., LTD.
    Inventors: Yusaku Ido, Takashi Yamada, Akihiro Fujiwara
  • Patent number: 9603230
    Abstract: Systems and methods for measuring current with shielded conductors are provided. One system includes a first wire within shielding, wherein the first wire is connected between a high voltage source and a filament of an x-ray system. The system also includes a second wire within shielding, wherein the second wire is connected between the high voltage source and the x-ray system and the shielding of the first and second wires is at a high voltage potential of the x-ray system. The system further includes a measurement resistor at a high voltage potential, wherein the measurement resistor is connected between the shielding and one of the first or second wires.
    Type: Grant
    Filed: December 3, 2013
    Date of Patent: March 21, 2017
    Assignee: General Electric
    Inventors: Uwe Wiedmann, George William Baptiste
  • Patent number: 9596793
    Abstract: A radio frequency (RF) shield includes a shield enclosure formed of conductive material that defines and partially encloses an interior cavity. The shield enclosure is configured to receive, within the interior cavity, a shielding partition securable in a fixed position that defines one end of a first chamber within a narrow portion of the shield enclosure. The first chamber provides RF isolation of an RF conductor that is enclosed within the first chamber.
    Type: Grant
    Filed: April 17, 2013
    Date of Patent: March 14, 2017
    Assignee: ARRIS Enterprises, Inc.
    Inventors: Thomas A. Jung, Shr-Min Chen, Yung Chun Lu, Wayne C. Weeks
  • Patent number: 9480181
    Abstract: In a housing 1 for receiving an electric circuit board 50 it is proposed to provide in a first housing half 2 of the housing 1 a plurality of bearing pads 20, 21 located at various levels. These bearing pads 20, 21 receive, together with counter bearing pads 30, 31 provided in a second housing half 30, the electric circuit board 50. A plurality of support points 55, 56 is provided on the electric circuit board 50, each of which support points 55, 56 is respectively associated with the bearing pads 20, 21 and counter bearing pads 30, 31. By removing individual support points 55, 56, the bearing pads 20, 21 and counter bearing pads 30, 31 are selected, on which the circuit board 50 is supposed to rest. By selecting the bearing pads 20, 21 and counter bearing pads 30, 31 lying at different levels, the level of the electric circuit board 50 in the housing 1 is determined.
    Type: Grant
    Filed: March 14, 2013
    Date of Patent: October 25, 2016
    Assignee: HARTING ELECTRONICS GMBH
    Inventors: Marc Lindkamp, Rainer Bussmann
  • Patent number: 9270058
    Abstract: A cable connector assembly for being mounted on an external device for docking a mating connector, the cable connector assembly including a shield shell having a plurality of metal shrapnel, an insulative housing received in the shield shell, a plurality of connectors received in the insulative housing, and a cable connecting with the connector. The connector has a metal shell. The metal shrapnel is movable by the external device to be elastically pressed between the connector metal shell and the external device.
    Type: Grant
    Filed: September 17, 2014
    Date of Patent: February 23, 2016
    Assignee: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: Jerry Wu, Jun Chen, Fan-Bo Meng
  • Patent number: 9053838
    Abstract: A conductive rubber component (10) of the present invention includes a metal coating (2) formed on at least one surface located perpendicular to a compression direction of a conductive rubber single body (1) by atomic and/or molecular deposition, and can be surface mounted and soldered. In a method for mounting a conductive rubber component (10) of the present invention, the conductive rubber component (10) is surface mounted on a wiring layer (8) on a printed wiring board (9) and is fixed by a solder layer (7) thereto and thereby is incorporated to electrically connect the printed circuit board (9) and an electronic component (11) to each other.
    Type: Grant
    Filed: May 18, 2011
    Date of Patent: June 9, 2015
    Assignee: Fuji Polymer Industries Co., Ltd.
    Inventors: Toshiki Ogawa, Masakazu Koizumi
  • Patent number: 9017110
    Abstract: The cable junction includes at least two electrical cables extending side by side, each including its own independent shield and a front end section where its independent shield is stripped off, a common shield surrounding the front end sections and the independent shields of the cables, and a clamping device for clamping the common shield on the independent shields. The clamping device includes internal clamping means for clamping the common shield on flanks of the independent shield sheaths.
    Type: Grant
    Filed: December 21, 2010
    Date of Patent: April 28, 2015
    Assignee: Delphi International Operations Luxembourg S.A.R.L.
    Inventors: Erwan Guillanton, Gilles Schmitt
  • Publication number: 20150096799
    Abstract: A first planar prong adjacent to and parallel with, an exterior of the side of the enclosure. A second planar prong parallel to and spaced from an interior of the side of the enclosure and compress a first compressible gasket against the side of the enclosure. Furthermore, the second planar prong forms a first compartment between a first side of the second planar prong and the interior of the side of the enclosure, parallel to and spaced from an interior of the side of the enclosure. A planar base of the first planar prong and the second planar prong, adjacent to a cover of the enclosure. A first planar member having one end coupled perpendicular to a second side of the second planar prong and support a second compressible gasket in a second compartment formed between the planar member and the cover.
    Type: Application
    Filed: October 3, 2013
    Publication date: April 9, 2015
    Applicant: International Business Machines Corporation
    Inventors: Andrew J. Frana, Edward C. Gillard, Don A. Gilliland
  • Patent number: 8854835
    Abstract: An electromagnetic shield comprises a single sheet of metal having outer and inner peripheries. The outer periphery forms a plurality of outer deflectable fingers extending outward from a bent edge of the outer periphery for contacting a surface of a faceplate. The plurality of outer deflectable fingers is deflectable to allow for installation and removal of the faceplate. The inner periphery has an opening for receiving an HDMI connector and forming a plurality of inner deflectable fingers extending inwardly from a bent edge of the inner periphery. The plurality of inner deflectable fingers is deflectable to allow for insertion and removal of the HDMI connector.
    Type: Grant
    Filed: November 2, 2011
    Date of Patent: October 7, 2014
    Assignee: Crestron Electronics Inc.
    Inventors: Wendy Feldstein, Gregory Sorrentino, Esteban Dragonanovic
  • Publication number: 20140238735
    Abstract: Edge portions are formed on a shell fixing portion, disposed in upper and lower positions on the shell fixing portion and formed extending horizontally. Crimp pieces are continuously formed on the edge portions, and the crimp pieces are folded back at the edge portions therealong so as to extend towards a distal end of a cylindrical shell portion. The crimp pieces each have a rectangular flat plate-like shape and disposed facing oppositely corresponding external flat surface portions of the cylindrical shell portion with a predetermined space defined therebetween. The crimp pieces are formed as a crimping applied portion and the cylindrical shell portion is formed as a crimping bearing portion.
    Type: Application
    Filed: April 16, 2014
    Publication date: August 28, 2014
    Applicant: YAZAKI CORPORATION
    Inventors: Hideomi Adachi, Yoshiaki Ozaki
  • Publication number: 20140216806
    Abstract: According to various aspects, exemplary embodiments are disclosed of EMI shields, such as EMI gaskets. In an exemplary embodiment, the gasket includes a body of indefinite length. The gasket also includes a base with a generally flat outer surface, an upright portion extending generally upwardly away from the base, and a tail portion extending laterally away from the base. The base and the upright portion may intersect the tail portion at a fold line. One or more perforations and/or a crease may be along the fold line.
    Type: Application
    Filed: February 7, 2013
    Publication date: August 7, 2014
    Applicant: Laird Technologies, Inc
    Inventors: Michael Poulsen, Sri Talpallikar
  • Patent number: 8779301
    Abstract: A housing for use in a monitoring system having at least one monitoring module includes a shell defining an interior cavity. At least one opening is defined in the shell, and the at least one opening is in flow communication with the interior cavity. The housing includes at least one gasket coupled to the shell about an outer perimeter of the at least one opening. The at least one gasket facilitates insulating the interior cavity from electromagnetic radiation when the at least one monitoring module is positioned within the housing.
    Type: Grant
    Filed: September 3, 2010
    Date of Patent: July 15, 2014
    Assignee: General Electric Company
    Inventors: Bryan Shadel, Michael Alan Tart, Sean Kelly Summers, Lysle Rollan Turnbeaugh, Han Tran, Mitchell Dean Cohen, Steven Thomas Clemens
  • Patent number: 8717778
    Abstract: An electronic device including: a circuit board on which an electronic component is mounted; a plate material which is used as a ground, the plate material being extended in parallel with the circuit board; and a ground connection member which includes a fixed section and multiple elastic leg sections, the fixed section being tightened to the circuit board and connected to a ground on the circuit board, the elastic leg sections being extended from the fixed section toward different directions along the circuit board, each of the elastic leg sections being extended onto the plate material side to elastically press the plate material.
    Type: Grant
    Filed: May 1, 2012
    Date of Patent: May 6, 2014
    Assignee: Fujitsu Limited
    Inventors: Tadanori Tachikawa, Masuo Ohnishi
  • Publication number: 20140054082
    Abstract: A method and structures are provided for implementing press-lock electromagnetic compatibility (EMC) gaskets. A gasket includes a plurality of fasteners received through a plurality of corresponding mounting apertures in a perforated support surface for precise placement, and retention without adhesives. The corresponding mounting apertures have a diameter smaller than 1/20th of a wavelength of the highest frequency to be suppressed to remain independent of the shielding required. The gasket defines a cavity receiving compliant foam, and includes an absorber.
    Type: Application
    Filed: August 23, 2012
    Publication date: February 27, 2014
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Don A. Gilliland, Rebeccah J. Vossberg
  • Patent number: 8654545
    Abstract: The invention relates to an arrangement for holding a plurality of electric capacitor assemblies, particularly assemblies having live housings. The arrangement has a carrier having a through-passage for introducing one of the assemblies and further has at least one bearing ring for mounting an assembly. The bearing ring is matched to the dimensions of the through-passage and the assembly such that the assembly when extending through the through-passage, is in contact with the inner edge of the through-passage via the bearing ring, but not in direct contact with the inner edge of the through-passage.
    Type: Grant
    Filed: September 17, 2009
    Date of Patent: February 18, 2014
    Assignee: Bombardier Transportation GmbH
    Inventors: Manfred Zengerle, Tobias Leininger
  • Publication number: 20130335285
    Abstract: Electronic devices may be provided with conductive structures such as displays and conductive housing walls. Conductive gaskets may be used to form electrical paths between opposing conductive structures in an electronic device. During device assembly, a conductive gasket may be compressed between opposing conductive structures. The conductive gasket may be formed from a conductive gasket wall structure. The conductive gasket wall structure may surround and at least partly enclose an air-filled cavity. Conductive gasket wall structures may be formed from conductive fabric, dielectric sheets coated with metal, or other conductive wall materials. The interior of a conductive gasket may be hollow and completely devoid of supporting structures or may contain internal structures for biasing the conductive gasket wall outwards. Planar gaskets and gaskets with other cross sections may be provided.
    Type: Application
    Filed: June 19, 2012
    Publication date: December 19, 2013
    Applicant: Apple Inc.
    Inventors: David P. Tarkington, Michelle Rae Goldberg, Nicholas A. Rundle, Peter N. Jeziorek, Jonathan M. Haylock, Jerzy Guterman
  • Patent number: 8558121
    Abstract: An electronic device includes an upper shield arranged on a front side of a circuit board, and a lower shield arranged on a back side thereof. The lower shield includes a contact portion at an edge thereof. The contact portion is in contact with a lower surface of the circuit board. A plate spring portion is formed in the contact portion. An end portion of the plate spring portion abuts on the upper shield.
    Type: Grant
    Filed: March 15, 2011
    Date of Patent: October 15, 2013
    Assignees: Sony Corporation, Sony Computer Entertainment, Inc.
    Inventors: Yuta Tamaki, Hiroaki Tsurumi, Keiichi Aoki
  • Patent number: 8537568
    Abstract: An electronic device includes a housing, a fixed frame, a plurality of conductive foam pieces, and a display panel. The fixed frame is assembled and received within the housing. The fixed frame defines a plurality of fixing grooves adjacent to a periphery of the fixed frame. The conductive foam pieces are assembled within the fixing grooves of the fixed frame, respectively, and are coplanar with the fixed frame. The display panel is flatly mounted on the fixed frame and received within the housing together with the fixed frame. The periphery of the display panel tightly contacts with the conductive foam pieces.
    Type: Grant
    Filed: October 26, 2011
    Date of Patent: September 17, 2013
    Assignees: Fu Tai Hua Industry (Shenzhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventor: Zi-Ming Tang
  • Publication number: 20130220692
    Abstract: An electromagnetic gasket comprises a substantially rectangular sheet having a plurality of resilient fingers on an outer peripheral. The fingers are bent outward and at least four resilient prongs are bent inward to form a passageway that is sized and dimensioned to receive an HDMI connector. When the HDMI connector is inserted through the passageway, the resilient prongs are adapted to urge against top, bottom, and two side surfaces of the shell of the HDMI connector in such a manner to prevent the gasket from disengaging from the HDMI connector. The plurality of resilient fingers extend outward and beyond the top, bottom, and two side surfaces of the shell of the HDMI connector and are adapted to urge against a surface of a faceplate. The plurality of fingers and prongs of the gasket provide a direct grounding path between surfaces of the shell of the HDMI connector and surface of the faceplate.
    Type: Application
    Filed: June 8, 2012
    Publication date: August 29, 2013
    Inventors: Wendy Feldstein, Gregory Sorrentino, Krunoslav Dragonanovic
  • Patent number: 8363424
    Abstract: A grounding mechanism includes a grounding end, and a clip device connected to the grounding end for electrically connecting an electronic device to the grounding end. The clip device includes a first clip for contacting against a lateral side of the electronic device in a first direction so as to ground the electronic device in the first direction, and a second clip for contacting against another side of the electronic device in a second direction different from the first direction so as to ground the electronic device in the second direction.
    Type: Grant
    Filed: February 10, 2010
    Date of Patent: January 29, 2013
    Assignee: Wistron Corporation
    Inventor: Kun-Hui Lai
  • Patent number: 8339800
    Abstract: A circuit module includes a substrate, a component land provided on the substrate, an electronic component bonded to the component land, a case land provided on the substrate, and a case bonded to the case land so as to cover the electronic component. The case includes a top plate, and a leg that extends from a peripheral edge of the top plate in a direction substantially perpendicular to the top plate and that includes a groove in an end surface thereof that is bonded to the case land.
    Type: Grant
    Filed: February 10, 2011
    Date of Patent: December 25, 2012
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Yoshihiro Yamaguchi, Tomonori Ito
  • Publication number: 20120257369
    Abstract: An EMI shield includes a first contacting member and a second contacting member connected to the first contacting member. The first contacting member includes a first bent portion and a second bent portion extending from the first bent portion. An opening is defined in the first bent portion. The second bent portion comprises a main body connected to and slanted to the first bent portion, a tongue-like sheet extending from the main body, towards and corresponding to the opening of the first bent portion, and one or more hooks formed on the sides of the main body. The tongue-like sheet includes a latching portion. An electronic device using the EMI shield is also provided.
    Type: Application
    Filed: September 29, 2011
    Publication date: October 11, 2012
    Applicants: HON HAI PRECISION INDUSTRY CO., LTD., HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD
    Inventors: GUAN-DONG ZHAO, XUE-FENG WAN, ZHAO-YONG LI
  • Patent number: 8283576
    Abstract: A control box arrangement including at least one control box, the inside of which is sub-divided, or can be sub-divided, into a plurality of compartments which are arranged one above the other and can be closed in a sealing manner by associated doors with a peripheral sealing arrangement acting on the inside of the doors. The doors are connected, by one of the vertical sides thereof, to a frame of the control box in question by hinges in an articulated manner, and can be closed by a closing mechanism on the opposite vertical side. A first hinge section is fixed to a vertical section of the frame by a fixing section, and the door is mounted on an articulated section of the first hinge section in an articulated manner by a second hinge section applied thereto.
    Type: Grant
    Filed: November 29, 2007
    Date of Patent: October 9, 2012
    Assignee: Rittal GmbH & Co. KG
    Inventors: Michael Schell, Tobias Becker, Igor Harry Schaaf
  • Patent number: 8199528
    Abstract: An electronic device including: a circuit board on which an electronic component is mounted; a plate material which is used as a ground, the plate material being extended in parallel with the circuit board; and a ground connection member which includes a fixed section and multiple elastic leg sections, the fixed section being tightened to the circuit board and connected to a ground on the circuit board, the elastic leg sections being extended from the fixed section toward different directions along the circuit board, each of the elastic leg sections being extended onto the plate material side to elastically press the plate material.
    Type: Grant
    Filed: January 27, 2009
    Date of Patent: June 12, 2012
    Assignee: Fujitsu Limited
    Inventors: Tadanori Tachikawa, Masuo Ohnishi
  • Patent number: 8025752
    Abstract: A method of fabricating a conductive composite wherein at least one predetermined electrical access area of a conductive material is coated with a maskant. The conductive material is included in a composite ply lay-up which is cured and then the maskant is removed from the conductive material.
    Type: Grant
    Filed: February 18, 2009
    Date of Patent: September 27, 2011
    Assignee: Raytheon Company
    Inventors: William H. Fossey, Jr., Laura A. Cuthbert, Joseph A. Sarcione