Abstract: A portable electronic apparatus comprises a housing, a circuit board, a heat-conduction structure and a heat-dissipation structure. The circuit board is disposed in the housing and comprises a substrate and a first electronic device, wherein the first electronic device is disposed on the substrate. The heat-conduction structure is disposed on the circuit board, and dissipates heat from the first electronic device. The heat-dissipation structure is disposed on the housing and connected to the heat-conduction structure, wherein the heat passes the heat-conduction structure and the heat-dissipation structure, and is dissipated out of the housing.

Abstract: An electromagnetic shielding device for an MRI apparatus having a fastener for fastening the shielding device to a shielding element in the apparatus so as to surround said opening of a cavity and which shielding device is electrically connected to ground, wherein the fastener electrically connects the shielding device to the shielding element at the cavity opening; wherein the shielding device is flexible and is cylindrical and/or in a truncated cone shape, and has at least a passage opening for the body part; the shielding device is adapted to be fastened or compressed at said opening to the body part with a predetermined force in such a way as to close said opening and generate a low-impedance electrical contact between the body part and said shielding device to prevent or reduce the infiltration of electromagnetic noise from outside to inside said detection cavity; the shielding device is made of a first inner conductive material layer and an outer insulating fabric layer; and further includes at least on

Abstract: An electromagnetic noise suppression sheet obtained by using combination of a conductive carbon and spinel ferrite particles having a cumulative 50% volume particle diameter of 1 to 10 ?m, can exhibit an excellent transmission attenuation power ratio and a reduced return loss in a near electromagnetic field, and is suitable for high-density mounting. The electromagnetic noise suppression sheet of the present invention can be produced by the process of the present invention which includes the steps of applying a coating material in which the conductive carbon and the spinel ferrite particles having a cumulative 50% volume particle diameter of 1 to 10 ?m are dispersed, to form a coating film having a thickness of 10 to 100 ?m after dried, and subjecting the resulting coating film to thermoforming under pressure.

Abstract: An electronic fabric for an electronic device, the electronic device comprising a plurality of surfaces, the electronic fabric includes a conductive layer, an adhesive layer and a protective layer. The conductive layer is configured for absorbing electromagnetic interference (EMI) and conduct static electricity from the electronic device when the conductive layer is electrically grounded. The adhesive layer is positioned on the conductive layer, and is configured for adhering the conductive layer to the electronic device. The protective layer is mounted on the adhesive layer, and is configured for protecting the adhesive character of the adhesive layer. The protective layer is separated into many parts corresponding to the plurality of surfaces of the electronic device, and each part can be peeled off separately from the adhesive layer, as the electronic fabric is wrapped on the plurality of surfaces of the electronic device.

Abstract: The invention includes a shielding film, which does not have breakage of a metal layer, and has excellent abrasion resistance and blocking resistance, and does not crack. The cover film 7 is provided on one surface of a separation film 6a, and an adhesive layer 8a is formed on the surface of the cover film 7 opposite to the separation film 6a via the metal layer. The cover film 7 has at least one hard layer 7a and at least one soft layer 7b, and the surface of the cover film 7 facing the separation film 6a is composed of the hard layer 7a.

Abstract: Cabling is provided including a jacket surrounding a core, and a separator positioned in the core. The separator has at least one shield segment defining walls separating the core into a plurality of chambers each configured to receive a plurality of twisted wire pairs. Each shield segment includes a metallic layer and a laminate layer, wherein the laminate layer defines an exposed surface of the wall of the corresponding chamber.

Abstract: A flexible wiring board includes a first flexible base material with a conductor pattern formed thereon, a second flexible base material disposed adjacent to the first flexible base material and an insulating layer covering the first flexible base material and the second flexible base material. The insulating layer exposes at least one portion of the first flexible base material. A conductor pattern is formed on the insulating layer, and a plating layer is provided connecting the conductor pattern of the first flexible base material and the conductor pattern on the insulating layer.

Abstract: A disposable cover for electromagnetic treatment applicators prevents undesired exposure to potentially harmful radiation. The cover is a pouch-like structure having a back surface constructed from RF shielding material, such as metallized polyethylene, which back surface faces opposite, or away from, the treatment area. A portion of the cover which faces the treatment area is constructed from material transmissive to RF radiation from the applicator. Securing means, such as adhesive strips, or interlocking edges close an open end to secure the applicator inside the cover and to prevent RF radiation through the closed end. In use, an applicator is inserted within the cover and positioned over the area to be treated with the RF transmissive material overlying the treatment area.

Abstract: A disposable cover for electromagnetic treatment applicators prevents undesired exposure to potentially harmful radiation. The cover is a pouch-like structure having a back surface constructed from shielding material, such as metallized polyethylene, which back surface faces opposite, or away from, the treatment area. At least a portion of the cover which faces the treatment area is constructed solely from RF non-shielding material. Securing means, such as adhesive strips, or interlocking edges, secure the applicator inside the cover and close off any leaks. The electromagnetic properties of the cover are integrated into the circuitry for the treatment applicator, such that the applicator is not functional in the absence of the cover. In use, an electromagnetic treatment applicator is inserted into the cover and positioned over the area to be treated with the non-shielding portion or window of the cover overlying the treatment area.

Abstract: A flexible multilayer printed circuit assembly with shield fences. The flexible multilayer printed circuit assembly with multiple conductive layers includes logic ground vias that connect logic ground plane layers together, and shield vias that connect a top and a bottom shield plane layer together. Each of the shield fences is formed between the shield vias on an outside perimeter of each of the conductive layers. Each of the shield fences contains the logic ground vias inside, and also contains each corresponding conductive layer in the horizontal direction to which each layer extends.

Abstract: An electromagnetically shielded cable includes a shell having an end portion and a shield embedded in the end portion of the shell. A method of forming the electromagnetically shielded cable is also provided. The method includes the steps of inserting the end portion of the shield into a mold, and embedding the end portion of the shield in the shell. In one embodiment, the shell includes a connector extending from the shell and through an opening defined by the shield for embedding the shield in the shell. In another embodiment, the shield is embedded directly in the end portion of the shell.

Abstract: An IC die and a flexible circuit structure are integrated into a lower stack element that can be stacked with either further integrated lower stack element iterations or with pre-packaged ICs in any of a variety of package types. The present invention may be employed to stack similar or dissimilar integrated circuits and may be used to create modularized systems. In a preferred embodiment, a die is positioned above the surface of portions of a pair of flex circuits. Connection is made between the die and the flex circuitry. A protective layer such as a molded plastic, for example, is formed to protect the flex-connected die and its connection to the flex. Connective elements are placed along the flex circuitry to create an array of module contacts along the second side of the flex circuitry. The flex circuitry is positioned above the body-protected die to create an integrated lower stack element.

Abstract: An apparatus and method is provided to shield contactless portable electronic consumer devices such as radio frequency identification devices (RFID), tokens, mini-cards, key fobs, cellular phones, smartcards, etc. from wireless interrogation. In one embodiment, a contactless portable consumer device which includes a first antenna is shielded from unauthorized wireless interrogation with a radio frequency (RF) shield. The RF shield includes electrically conductive, non-ferromagnetic material and is configured to prevent unauthorized data transfer between a second antenna external to the portable consumer device and the first antenna.

Abstract: Embodiments of electromagnetic interference (EMI) shielding containers are disclosed according to the present invention. The EMI shielding containers are especially useful for protecting sources of electronic evidence from EMI contamination prior to data extraction. However, the embodiments of EMI shielding containers of the present invention may be used in any context where a wireless device is to be shielded from transmitting or receiving electromagnetic signals. Embodiments of methods of using EMI shielding containers to extract data from electronic devices are also disclosed.

Abstract: An EMI shield for personal computers, cellular telephones, and other electronic devices is constructed from thermoformable polymeric material which is then metallized on all surfaces by vacuum metallization techniques to provide an inexpensive, lightweight, yet effective EMI shield.

Abstract: A receptacle assembly is provided having a gasket interposed between a heat sink and the receptacle, in order to provide EMI shielding and limit leakage from an opening in the receptacle that allows the heat sink to engage an electronic module inserted in the receptacle cavity. The heat sink may have a groove in which the gasket is mounted and upon mounting the heat sink to the receptacle, the gasket surrounds the opening in the receptacle and provides a resilient shield to maintain a seal during movement of the heat sink due to insertion of the electronic module within the receptacle.