Abstract: An electronic device, including a circuit board module, a first shielding plate and multiple first shielding plugs, are provided. The circuit board module includes a first surface, a second surface opposite to the first surface, a first electromagnetic wave source and multiple first clamp bases. The first electromagnetic wave source and the first clamp bases are located on the first surface. The first electromagnetic wave source is surrounded by the first clamp bases. The first shielding plugs are respectively inserted into the first clamp bases. The first shielding plate is disposed at a side of the first surface of the circuit board module and connected to the first shielding plugs. The first shielding plate and the first shielding plugs jointly cover the first electromagnetic wave source.

Abstract: An electronic device module includes a substrate, a first component disposed on a first surface of the substrate, a sealing portion disposed on the first surface of the substrate, a second component disposed on the first surface of the substrate and embedded in the sealing portion, and a shielding wall at least partially disposed between the first component and the second component and including a portion having a height, with respect to the first surface of the substrate, that is lower than a height of the sealing portion.

Abstract: An example control component for controlling an engine component includes a housing. The housing defines a cavity configured to receive control circuitry configured to control the engine. The housing includes an exterior layer defining an exterior surface of the housing and an interior polymeric layer defining an interior surface of the housing. The interior polymeric layer is adjacent to and substantially coextensive with the exterior layer. The interior polymeric layer includes an electrically and thermally conductive material. An example technique includes forming the exterior layer and forming the interior polymeric layer.

Abstract: The present disclosure disclosed a link loopback device comprising a substrate and a flexible circuit board. The substrate comprises an interface connecting end, a transmitting end, and a receiving end. The interface connecting end is electrically connected to the transmitting end and the receiving end. The flexible circuit board comprises a first electrical connecting end and a second electrical connecting end. The first electrical connecting end of the flexible circuit board is electrically connected to the transmitting end of the substrate, and the second electrical connecting end of the flexible circuit board is electrically connected to the receiving end of the substrate, forming a link between the flexible circuit board and the substrate. Just like testing with a direct attach cable (DAC), the link loopback device of the present disclosure can simulate a complete actual link to improve the accuracy of the test effectively.

Abstract: A modular computing system for a data center includes one or more data center modules including rack computer systems. An electrical module is coupled to the data center modules and provides electrical power to computer systems in the data center modules. The data center modules do not include any internal active cooling systems and cannot be coupled with any external active cooling systems. A data center module directs ambient air to flow into intake air plenums extending along intake sides of the rows of racks, through the rows of racks into exhaust plenums extending along exhaust sides of the rows of racks, and out into the ambient environment to cool computer systems in the racks. Directed airflow can be lateral, vertical, at least partially driven by air buoyancy gradients, at least partially induced by air moving devices internal to computer systems in the rows of racks, thereof, etc.

Abstract: An electronic device includes: a heat generating component; a board disposed in a vertical direction, the heat generating component mounted on a first surface of the board; a first thermally conductive member superposed on a second surface of the board opposite the first surface of the board; a plurality of second thermally conductive members extending in a horizontal direction from a first surface of the first thermally conductive member; a third thermally conductive member facing the first surface of the board, the third thermally conductive member secured to the distal end portions of the plurality of second thermally conductive members; a housing including a first wall portion superposed on a second surface of the first thermally conductive member, and a second wall portion opposite the first wall portion; and a heat sink provided on an outer surface of the second wall portion.

Abstract: A semiconductor structure includes a first substrate; a second substrate, disposed over the first substrate; a die, disposed over the second substrate; a via, extending through the second substrate and electrically connecting to the die; a redistribution layer (RDL) disposed between the first substrate and the second substrate, including a dielectric layer, a first conductive structure electrically connecting to the via, and a second conductive structure surrounding the first conductive structure, wherein the second conductive structure extends along an edge of the dielectric layer and penetrates through the dielectric layer; and a first underfill material, disposed between the first substrate and the RDL, wherein one end of the second conductive structure exposed through the dielectric layer is entirely in contact with the first underfill material.

Abstract: The present disclosure provides a wafer level packaging method and a package structure. The wafer level packaging method includes: forming a bonding structure including a device wafer and a plurality of first chips bonded to the device wafer; conformally covering the plurality of first chips and the device wafer exposed by the plurality of first chips with an insulating layer; conformally covering the insulating layer with a shielding layer; and forming an encapsulation layer on the shielding layer. The wafer level package structure includes: a device wafer; a plurality of first chips bonded to the device wafer; an insulating layer conformally covering the plurality of first chips and the device wafer exposed by the plurality of first chips; a shielding layer conformally covering the insulating layer; and an encapsulation layer formed on the shielding layer. The wafer level package structure provides a reduced volume and a reduced thickness.

Abstract: A shield connection structure that includes a tube made of metal; a flexible shield made of metal; and a ring that includes an inner ring externally fitted onto the tube and an outer ring, the ring being made of a same type of metal as the flexible shield, wherein the flexible shield is electrically connected to the tube via the ring when sandwiched between the inner ring and the outer ring.

Abstract: A haptic actuator may include a housing that includes a ferromagnetic material having a first heat conductance, and a coil carried by the housing in a medial portion thereof and generating waste heat when electrically powered. The haptic actuator may also include a field member movable within the housing responsive to the coil. The field member may include at least one permanent magnet establishing a magnetic path with the housing. A heat spreading layer may be thermally coupled to the housing adjacent the coil. The heat spreading layer may have a second heat conductance greater than the first heat conductance to spread the waste heat from the coil to adjacent portions of the housing.

Abstract: An electromagnetic interference (EMI) shield is disclosed. The EMI shield includes an electrically conductive sleeve configured to surround a connector. The electrically conductive sleeve includes a restriction configured to contact a metal perimeter of the connector and includes a connection member configured to be electrically coupled to a circuit board.

Abstract: A method of forming stacked semiconductor device structure includes providing a first semiconductor device and a second semiconductor device. The first semiconductor device includes a recessed region bounded by sidewall portions and a conductive layer disposed adjoining at least portions of the recessed region. The method includes electrically connecting the second semiconductor device to the conductive layer within the recessed region such that at least a portion of the second semiconductor device is disposed within the recessed region.

Abstract: A display device includes a display pane, a frame, a first protruding structure, and an adhesive structure. The display panel has a display surface. The frame surrounds the display panel and has an opening. The first protruding structure is connected to and protrudes from the frame, in which the first protruding structure and the display surface are located at the same side of the frame and the display panel. The adhesive structure adheres to the display surface of the display panel, a top surface of the first protruding structure opposite to the frame, and the frame.

Abstract: Medical procedure related objects (e.g., instruments, supplies) tagged with transponders (e.g., RFID transponders, dumb transponders) are accounted for in a medical or clinical environment via an accounting system using a number of antennas and interrogators/readers. A first set of antennas and RFID interrogator(s) interrogate portions of the environment for RFID tagged objects, for example proximate a start and an end of a procedure. Shielded packaging and/or shielded receptacles shield tagged objects, preventing interrogation except for those objects in unshielded portions of the environment. A shielded receptacle may include an antenna to interrogate the contents thereof in a relatively noise-free environment. A data store may maintain information including a current status or count of each instrument or supply, for instance as checked in or checked out. A handheld antenna and/or second set of antennas interrogates a body of a patient for retained instruments or supplies tagged with dumb transponders.

Abstract: A door assembly for a microwave oven includes a door covering an opening of an oven housing. The door includes a bezel forming an outer frame to conceal internal door components and an inner door portion within the bezel made of a transparent material. An electromagnetic interference (EMI) attenuation device positioned around outer edges of the door includes folded transformer sections with dimensions based on an operative wavelength of electromagnetic energy generated by the oven. The EMI attenuation device attenuates EMI waves escaping the oven through a gap between the housing and the door. The transformer sections are positioned at an incline angle from a horizontal plane in which the transformer sections extend a greater distance in the horizontal plane than in a vertical plane to allow for a reduced bezel size and an increased area of the inner door portion.

Abstract: An electromagnetic wave shielding material is provided that is configured to prevent a usage environment from being limited. The electromagnetic wave shielding material shields an electromagnetic wave having a frequency, and includes a substrate and a plurality of resonance loops disposed on the substrate. Moreover, the plurality of resonance loops are positioned on the substrate to be magnetically coupled to each other. Each of the resonance loops forms an LC parallel resonance circuit that resonates at the frequency of the electromagnetic wave.

Abstract: A semiconductor package and a method of fabricating the same, the method including mounting semiconductor chips on a substrate; forming a mold layer that covers the semiconductor chips on the substrate; forming external terminals on a bottom surface of the substrate; forming a separation layer on the external terminals and the bottom surface of the substrate; cutting the substrate and the mold layer to separate the semiconductor chips from each other; and forming a shield surrounding the mold layer and a side surface of the substrate.

Abstract: Discussed generally herein are methods and devices including or providing an electromagnetic interference (EMI) shielding. A device can include a substrate including electrical connection circuitry therein, grounding circuitry on, or at least partially in the substrate, the grounding circuitry at least partially exposed from a surface of the substrate, a die electrically connected to the connection circuitry and the grounding circuitry, the die on the substrate, and a conductive foil or conductive film surrounding the die, the conductive foil or conductive film electrically connected to the grounding circuitry.

Abstract: Embodiments of the present disclosure are directed towards electro-magnetic interference (EMI) shielding techniques and configurations. In one embodiment, an apparatus includes a first substrate, a die having interconnect structures coupled with the first substrate to route input/output (I/O) signals between the die and the first substrate and a second substrate coupled with the first substrate, wherein the die is disposed between the first substrate and the second substrate and at least one of the first substrate and the second substrate include traces configured to provide electro-magnetic interference (EMI) shielding for the die. Other embodiments may be described and/or claimed.

Abstract: The present disclosure improves the adhesive strength of a shield film in a high-frequency module that includes a shield film that shields components from unwanted electromagnetic waves from the outside. A high-frequency module is provided with: a sealing body that includes a multilayer wiring substrate, components that are mounted on an upper surface of the multilayer wiring substrate, and a sealing resin layer that is stacked on the upper surface of the multilayer wiring substrate and covers the components; and a shield film that covers a surface of the sealing resin layer. A side surface of the sealing body has curved surface portions formed so as to have a curved surface shape, and the curved surface portions are roughened with a plurality of grooves.

Abstract: An electronic apparatus includes a liquid immersion tank that stores a refrigerant and has a plurality of slots therein, an electronic device stored in one slot of the plurality of slots and a dummy device stored in another slot of the plurality of slots, formed in a hollow shape, the dummy device having a ceiling portion and a bottom portion, the ceiling portion having a first hole and an opening and closing portion to open and close the first hole, and the bottom portion being open, and a fixing portion that fixes the dummy device to the liquid immersion tank.

Abstract: A lighting driving device is to be installed on a part of a structure. The lighting driving device includes: a metallic casing including a slit through which radio waves pass; a communication circuit which is housed in the metallic casing and performs wireless communication; a driving circuit which is housed in the metallic casing and supplies power to a light emitter; and an insulator which is disposed on the metallic casing and spaces apart the slit from the part of the structure.

Abstract: A portable computing system includes a transit case for providing structure for the mobile computing system, and has a power supply for providing power to the portable computing system. The portable computing system further includes a slidably removable sled disposed inside the transit case, configured to hold a plurality of computing components and to enable access to the plurality of computing components. The slidable removable sled includes a top chamber configured to hold a first type of computing device; a bottom chamber configured to hold a second type of computing device; and a floor disposed between the top chamber and a bottom chamber. The portable computing system further includes a switch, disposed in the bottom chamber, to provide computer networking and communications functions.

Abstract: A packaged device has a die of semiconductor material bonded to a support. An electromagnetic shielding structure surrounds the die and is formed by a grid structure of conductive material extending into the support and an electromagnetic shield, coupled together. A packaging mass embeds both the die and the electromagnetic shield. The electromagnetic shield is formed by a plurality of metal ribbon sections overlying the die and embedded in the packaging mass. Each metal ribbon section has a thickness-to-width ratio between approximately 1:2 and approximately 1:50.

Abstract: A space vehicle may have a modular board configuration that commonly uses some or all components and a common operating system for at least some of the boards. Each modular board may have its own dedicated processing, and processing loads may be distributed. The space vehicle may be reprogrammable, and may be launched without code that enables all functionality and/or components. Code errors may be detected and the space vehicle may be reset to a working code version to prevent system failure.

Abstract: A personal communication device (“PCD”) holder includes: (i) a male housing component including a capped end and a first tubular wall extending from the capped end to a male mating end, the male housing component data signal blocking; (ii) a female housing component including a capped end and a second tubular wall extending from the capped end to a female mating end, the female housing component data signal blocking; (iii) a first liner material conforming to an inner surface of the male housing component; (iv) a second liner material conforming to an inner surface of the female housing component; and (v) a data signal blocking gasket positioned to reside between an exposed outer surface of the data signal blocking material of the male mating end and the exposed inner surface of the data signal blocking material of the female mating end.

Abstract: A semiconductor device package includes a substrate, a component on a surface of the substrate, a package body encapsulating the component, and an electromagnetic interference (EMI) shield conformally formed on the package body, where the EMI shield has a side portion defining an opening.

Abstract: Disclosed herein is an electronic circuit package that includes a substrate having a power supply pattern, an electronic component mounted on a surface of the substrate; and a molding member having conductivity that covers the surface of the substrate so as to embed the electronic component therein. The power supply pattern includes a first power supply pattern exposed to the surface of the substrate, and the molding member contacts the first power supply pattern.

Abstract: In implementations of device component exposure protection, a computing device includes device components enclosed within a housing. The device components are assembled within the housing and enclosed within the housing upon completion of assembly of the computing device. The computing device further includes a protective material contained within the housing, which fills void spaces around the device components. The protective material prevents exposure of the device components to external matter that the computing device is exposed to upon completion of the assembly.

Abstract: A bezel comprises a base, a cover and at least one insertable component. The base comprises a plurality of openings. The cover is configured for mounting to a front of the base, and the cover comprises at least a first aperture. When the cover is mounted to the base, the first aperture aligns with at least a first one of the plurality of openings in the base. The at least one insertable component is configured for mounting to the base in the first opening through the first aperture of the cover. The bezel is configured for attachment to a front portion of an electronic equipment chassis.

Abstract: It will be understood by those skilled in the art that there is disclosed in the present application a biometric sensor that may comprise a plurality of a first type of signal traces formed on a first surface of a first layer of a multi-layer laminate package; at least one trace of a second type, formed on a second surface of the first layer or on a first surface of a second layer of the multi-layer laminate package; and connection vias in at least the first layer electrically connecting the signal traces of the first type or the signal traces of the second type to respective circuitry of the respective first or second type contained in an integrated circuit physically and electrically connected to one of the first layer, the second layer or a third layer of the multi-layer laminate package.

Abstract: An integrated circuit package with a plurality of embedded electromagnetic interference (EMI) shielding and methods of making the same are disclosed. The integrated circuit packages include the use of a pre-assembled circuit module and an interposer. The circuit module has a plurality of spaced electrical component sections separated by a series of contiguous conductive spacers, and a first shielding means comprises the spacers, vias and an embedded conductive plane. In an example, the interposer has a second shielding means comprises conductive cavities, conductive ridges, vias, and a conduction pattern. In another example, the interposer further comprises conductive strips to form the second shielding means. The first shielding means overlaps the second shielding means to form a plurality of EMI shielded enclosures for holding the spaced electrical component sections therein.

Abstract: A thermal distribution assembly for an electronic device is disclosed. The electronic device includes an enclosure defined by a metal band and a non-metal bottom wall formed by glass, sapphire, or plastic. In this regard, the enclosure may include a relatively low thermal conductivity. However, the thermal distribution assembly provides heat transfer capabilities that offset thermal conductivity losses by using a non-metal bottom wall, and also provides added structural support. The thermal distribution assembly may include a first layer, a second layer, and a third layer. The first and third layers provide structural support, while the second layer provides a relatively high thermally conductive layer.

Abstract: An enclosure for electronic components with a base and a capping forming a room for receiving at least one circuit board at least one circuit board support positioned on the base for the support of the at least one circuit board. At least one fastening element attaches the at least one circuit board to the circuit board support through an engagement with the circuit board support, wherein the capping is formed and/or attached to the base in such a manner that room is formed between the fastening element and the capping in such a manner that a detachment of the fastening element from the circuit board support is prevented.

Abstract: A semiconductor apparatus including a semiconductor device, an on-semiconductor-device metal pad and a metal interconnect each electrically connected to the semiconductor device, a through electrode and a solder bump each electrically connected to the metal interconnect, a first insulating layer on which the semiconductor device is placed, a second insulating layer formed on the semiconductor device, a third insulating layer formed on the second insulating layer, wherein the metal interconnect is electrically connected to the semiconductor device via the on-semiconductor-device metal pad at an upper surface of the second insulating layer, and the metal interconnect penetrates the second insulating layer from its upper surface and is electrically connected to the through electrode at an lower surface of the second insulating layer. This semiconductor apparatus can be easily placed on a circuit board and stacked, and can reduce its warpage even with dense metal interconnects.

Abstract: An electromagnetic wave shielding tape using nanomaterials includes a carrier substrate, a first nanostructure, a second nanostructure, and an insulating enclosing structure for enclosing the carrier substrate, the first nanostructure, and the second nanostructure. The carrier substrate has a first surface and a second surface opposite to the first surface. The first nanostructure is disposed on the first surface of the carrier substrate, and the second nanostructure is disposed on the second surface of the carrier substrate.

Abstract: An integrated circuit apparatus includes a substrate, an IC chip disposed above the substrate, and an electromagnetic shielding layer disposed on a surface of the substrate. The IC chip includes an electromagnetic coupling device. The electromagnetic shielding layer and the electromagnetic coupling device partially overlap in a vertical projection direction of the surface of the substrate.

Abstract: A smoke detecting enclosure which is impervious to interference from outside light sources includes a smoke detecting housing and an upper cover. The smoke detecting housing has an receiving space with openings on one side, an opposite side defines two opposite installation parts carrying a light emitter and a light receiver. A peripheral surface of the smoke detecting housing is a first terraced wall and the upper cover when coupled with the opening comprises an open-ended cavity and a light barrier. The light barrier is opposite to the opening and is on an open path to the opening. A smoke detector is further disclosed.

Abstract: Some embodiments of the present disclosure provide a transceiver extension device. A transceiver extension device is provided for connection with an enclosure including a cage for a circuit board and a transceiver. The transceiver extension device includes an extension cage configured to accommodate the transceiver, an extension connector configured to be inserted into the cage of the enclosure, and an extension circuit board configured to transmit a signal of a second transceiver to the circuit board in the enclosure.

Abstract: A portable apparatus that improves performance degradation of RF-related parts which may be incurred when a radiant heat sheet is attached to a shielding structure mounted in an RF block is provided. The apparatus blocks a feedback connection path which may be formed between heating parts by removing parts of the shielding structure and the radiant heat sheet which face a connection area between the heating parts.

Abstract: The semiconductor package includes a substrate, a die, a first metal layer, a second metal layer and an optional seed layer. The package body at least partially encapsulates the die on the substrate. The seed layer is disposed on the package body and the first metal layer is disposed on the seed layer. The second metal layer is disposed on the first metal layer and the lateral surface of the substrate. The first metal layer and the second metal layer form an outer metal cap that provides thermal dissipation and electromagnetic interference (EMI) shielding.

Abstract: A self-shielded die includes a substrate, an electronic device attached to the substrate, one or more electrical pads disposed on a bottom surface of the substrate, and an electromagnetic interference (EMI) shield formed of at least one electrically conductive material and connected to ground. At least one of the one or more electrical pads is electrically connected to the electronic device. The EMI shield includes a top shield layer, disposed directly on and substantially completely covering a top surface of the substrate opposite the bottom surface of the substrate, and side shield layers substantially completely covering all sides of the substrate, extending between the top surface of the substrate and the bottom surface of the substrate.

Abstract: The current invention relates to a yacht or other vessel, such as a ship, comprising a hull and a superstructure, wherein at least one of the hull and the superstructure comprises cladding elements thereon or therein, wherein at least a selection of the cladding elements comprise an at least partially transparent cover and at least one light source, wherein the light source is shielded by the cover. Furthermore, the invention relates to a cladding element containing light sources, to be in use arranged on the hull of a yacht, or in swimming pools and in particular side walls and/or bottoms thereof, as well as on surrounding structures, like a pool house or paths or pavements there around, in bridges, for example on bridge decks and/or against uprights and/or stairs and/or walls, or in ornamentation of public spaces and public structures.

Abstract: A window assembly is for an enclosure. The enclosure has a plurality of walls. The window assembly includes a cover member structured to be coupled to each of the plurality of walls in order to form an enclosed region; a window member coupled to the cover member; a frame member coupled to the cover member; and a number of stud members each secured to the frame member and extending through the cover member. The cover member is located between the frame member and the window member.

Abstract: The present disclosure relates to a hermetic package with improved RF stability and performance. The package includes a carrier, a bottom dielectric ring over the carrier, a bottom metal layer over the bottom dielectric ring, a top dielectric ring over the bottom metal layer, a top metal layer over the top dielectric ring, an exterior plated layer, and multiple top vias. Herein, the bottom metal layer includes signal sections and at least one ground section, which is electrically isolated from the signal sections. The exterior plated layer covers at least a portion of a first exterior sidewall of the bottom ring structure and electrically couples the carrier to the at least one ground section. The multiple top vias extend through the top dielectric ring and electrically couple the top metal layer to the at least one ground section.

Abstract: Apparatus for dissipating heat during the operation of a device. In accordance with some embodiments, the apparatus compares spaced-apart first and second heat sources. A thermally conductive plate is disposed between the first and second heat sources. A thermal interface layer is contactingly disposed between the plate and the first heat source, and has a relatively higher thermal conductivity so that heat generated by the first heat source passes through the thermal interface layer and to the plate. A thermal barrier layer is contactingly disposed between the plate and the second heat source to mechanically support the plate relative to the second heat source. The thermal barrier layer has a relatively lower thermal conductivity to thermally isolate the conductive plate from the second heat source.

Abstract: A system for determining structural characteristics of an electromagnetic energy shielding material during a manufacturing process includes a transmitting antenna device mounted for a reciprocal linear movement across a width thereof, the transmitting antenna device being connected to a source of the electromagnetic energy and operable to transmit waves of the electromagnetic energy through the thickness of the electromagnetic energy shielding material during the reciprocal linear movement. A receiving antenna device is also mounted for the reciprocal linear movement in an alignment with the transmitting antenna device and operable to receive, during the reciprocal linear movement, the waves of electromagnetic energy being absorbed and attenuated by the electromagnetic energy shielding material.

Abstract: A cover for an electronic module that has a housing holding a electrical component and a circuit board for operating the electrical component includes a cover plate having an interior surface and an exterior surface. The cover plate has a dielectric body. A majority of at least one of the interior surface and the exterior surface includes a conductive layer to provide electrical shielding for the cover plate. A connector portion is formed integrally with the cover plate defining a unitary structure. The connector portion includes a plurality of contact channels and a shroud extending from the exterior surface that surrounds a receptacle configured to receive a plug connector therein. Contacts are held in corresponding contact channels that have mating ends positioned in the receptacle and mounting ends exposed beyond the interior surface for mounting to the circuit board.

Abstract: A method of manufacturing a flexible electronics module includes mounting at least two functional components onto a flexible substrate, forming stretchable electrical interconnects configured to provide connection between the two functional components, and cutting shapes into the flexible substrate to increase an ability of the flexible substrate to stretch and flex, wherein the electrical interconnects to the functional components are placed to avoid the shapes.

Abstract: A headphone socket assembly for use in electronic equipment, includes: a headphone socket electrically connected to a circuit board in the electronic equipment; and an electromagnetic shielding device disposed at a periphery of the headphone socket.