Housing Or Panel Patents (Class 174/377)
  • Patent number: 10319685
    Abstract: An integrated circuit package with a plurality of embedded electromagnetic interference (EMI) shielding and methods of making the same are disclosed. The integrated circuit packages include the use of a pre-assembled circuit module and an interposer. The circuit module has a plurality of spaced electrical component sections separated by a series of contiguous conductive spacers, and a first shielding means comprises the spacers, vias and an embedded conductive plane. In an example, the interposer has a second shielding means comprises conductive cavities, conductive ridges, vias, and a conduction pattern. In another example, the interposer further comprises conductive strips to form the second shielding means. The first shielding means overlaps the second shielding means to form a plurality of EMI shielded enclosures for holding the spaced electrical component sections therein.
    Type: Grant
    Filed: February 15, 2017
    Date of Patent: June 11, 2019
    Assignee: TRANSSIP, INC.
    Inventors: Chih Wei Wong, Henry Lau
  • Patent number: 10244659
    Abstract: A thermal distribution assembly for an electronic device is disclosed. The electronic device includes an enclosure defined by a metal band and a non-metal bottom wall formed by glass, sapphire, or plastic. In this regard, the enclosure may include a relatively low thermal conductivity. However, the thermal distribution assembly provides heat transfer capabilities that offset thermal conductivity losses by using a non-metal bottom wall, and also provides added structural support. The thermal distribution assembly may include a first layer, a second layer, and a third layer. The first and third layers provide structural support, while the second layer provides a relatively high thermally conductive layer.
    Type: Grant
    Filed: September 21, 2017
    Date of Patent: March 26, 2019
    Assignee: Apple Inc.
    Inventors: Daniel W. Jarvis, David A. Pakula, David J. Dunsmoor, Ian A. Spraggs, Lee E. Hooton, Marwan Rammah, Matthew D. Hill, Robert F. Meyer, James A. Bertin, Eric M. Bennett, Simon C. Helmore, Melissa A. Wah, Jon F. Housour, Douglas G. Fournier, Christopher S. Tomasetta
  • Patent number: 10172247
    Abstract: An enclosure for electronic components with a base and a capping forming a room for receiving at least one circuit board at least one circuit board support positioned on the base for the support of the at least one circuit board. At least one fastening element attaches the at least one circuit board to the circuit board support through an engagement with the circuit board support, wherein the capping is formed and/or attached to the base in such a manner that room is formed between the fastening element and the capping in such a manner that a detachment of the fastening element from the circuit board support is prevented.
    Type: Grant
    Filed: December 4, 2017
    Date of Patent: January 1, 2019
    Assignee: HANON SYSTEMS
    Inventors: Mario Lenz, Stephan Werker, Eric Rooks
  • Patent number: 10141272
    Abstract: A semiconductor apparatus including a semiconductor device, an on-semiconductor-device metal pad and a metal interconnect each electrically connected to the semiconductor device, a through electrode and a solder bump each electrically connected to the metal interconnect, a first insulating layer on which the semiconductor device is placed, a second insulating layer formed on the semiconductor device, a third insulating layer formed on the second insulating layer, wherein the metal interconnect is electrically connected to the semiconductor device via the on-semiconductor-device metal pad at an upper surface of the second insulating layer, and the metal interconnect penetrates the second insulating layer from its upper surface and is electrically connected to the through electrode at an lower surface of the second insulating layer. This semiconductor apparatus can be easily placed on a circuit board and stacked, and can reduce its warpage even with dense metal interconnects.
    Type: Grant
    Filed: March 16, 2015
    Date of Patent: November 27, 2018
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Katsuya Takemura, Kyoko Soga, Satoshi Asai, Kazunori Kondo, Michihiro Sugo, Hideto Kato
  • Patent number: 10098268
    Abstract: An electromagnetic wave shielding tape using nanomaterials includes a carrier substrate, a first nanostructure, a second nanostructure, and an insulating enclosing structure for enclosing the carrier substrate, the first nanostructure, and the second nanostructure. The carrier substrate has a first surface and a second surface opposite to the first surface. The first nanostructure is disposed on the first surface of the carrier substrate, and the second nanostructure is disposed on the second surface of the carrier substrate.
    Type: Grant
    Filed: February 14, 2017
    Date of Patent: October 9, 2018
    Assignee: ANDAQ TECHNOLOGY CO., LTD.
    Inventor: Ching-Feng Lin
  • Patent number: 10068856
    Abstract: An integrated circuit apparatus includes a substrate, an IC chip disposed above the substrate, and an electromagnetic shielding layer disposed on a surface of the substrate. The IC chip includes an electromagnetic coupling device. The electromagnetic shielding layer and the electromagnetic coupling device partially overlap in a vertical projection direction of the surface of the substrate.
    Type: Grant
    Filed: May 31, 2017
    Date of Patent: September 4, 2018
    Assignee: MEDIATEK INC.
    Inventors: Jui-Chih Kao, Ming-Da Tsai, Yuan-Yu Fu, Chih-Chun Hsu
  • Patent number: 10024782
    Abstract: A smoke detecting enclosure which is impervious to interference from outside light sources includes a smoke detecting housing and an upper cover. The smoke detecting housing has an receiving space with openings on one side, an opposite side defines two opposite installation parts carrying a light emitter and a light receiver. A peripheral surface of the smoke detecting housing is a first terraced wall and the upper cover when coupled with the opening comprises an open-ended cavity and a light barrier. The light barrier is opposite to the opening and is on an open path to the opening. A smoke detector is further disclosed.
    Type: Grant
    Filed: December 15, 2016
    Date of Patent: July 17, 2018
    Assignee: NANNING FUGUI PRECISION INDUSTRIAL CO., LTD.
    Inventor: Wu-Jen Lo
  • Patent number: 10018792
    Abstract: Some embodiments of the present disclosure provide a transceiver extension device. A transceiver extension device is provided for connection with an enclosure including a cage for a circuit board and a transceiver. The transceiver extension device includes an extension cage configured to accommodate the transceiver, an extension connector configured to be inserted into the cage of the enclosure, and an extension circuit board configured to transmit a signal of a second transceiver to the circuit board in the enclosure.
    Type: Grant
    Filed: October 4, 2016
    Date of Patent: July 10, 2018
    Assignee: KMW U.S.A., Inc.
    Inventors: Byung In Kim, Sang Cheon Park
  • Patent number: 10001805
    Abstract: A portable apparatus that improves performance degradation of RF-related parts which may be incurred when a radiant heat sheet is attached to a shielding structure mounted in an RF block is provided. The apparatus blocks a feedback connection path which may be formed between heating parts by removing parts of the shielding structure and the radiant heat sheet which face a connection area between the heating parts.
    Type: Grant
    Filed: May 1, 2015
    Date of Patent: June 19, 2018
    Assignee: Samsung Electronics Co., Ltd.
    Inventor: Se-Yeon Lee
  • Patent number: 9984983
    Abstract: The semiconductor package includes a substrate, a die, a first metal layer, a second metal layer and an optional seed layer. The package body at least partially encapsulates the die on the substrate. The seed layer is disposed on the package body and the first metal layer is disposed on the seed layer. The second metal layer is disposed on the first metal layer and the lateral surface of the substrate. The first metal layer and the second metal layer form an outer metal cap that provides thermal dissipation and electromagnetic interference (EMI) shielding.
    Type: Grant
    Filed: September 21, 2016
    Date of Patent: May 29, 2018
    Assignee: Advanced Semiconductor Engineering, Inc.
    Inventors: Chi-Sheng Chung, Kuo-Hsien Liao, Jin-Feng Yang, Chen-Yin Tai, Yung-I Yeh
  • Patent number: 9922937
    Abstract: A self-shielded die includes a substrate, an electronic device attached to the substrate, one or more electrical pads disposed on a bottom surface of the substrate, and an electromagnetic interference (EMI) shield formed of at least one electrically conductive material and connected to ground. At least one of the one or more electrical pads is electrically connected to the electronic device. The EMI shield includes a top shield layer, disposed directly on and substantially completely covering a top surface of the substrate opposite the bottom surface of the substrate, and side shield layers substantially completely covering all sides of the substrate, extending between the top surface of the substrate and the bottom surface of the substrate.
    Type: Grant
    Filed: July 30, 2016
    Date of Patent: March 20, 2018
    Assignee: Avago Technologies General IP (Singapore) Pte. Ltd.
    Inventor: Mark Kuhlman
  • Patent number: 9914510
    Abstract: The current invention relates to a yacht or other vessel, such as a ship, comprising a hull and a superstructure, wherein at least one of the hull and the superstructure comprises cladding elements thereon or therein, wherein at least a selection of the cladding elements comprise an at least partially transparent cover and at least one light source, wherein the light source is shielded by the cover. Furthermore, the invention relates to a cladding element containing light sources, to be in use arranged on the hull of a yacht, or in swimming pools and in particular side walls and/or bottoms thereof, as well as on surrounding structures, like a pool house or paths or pavements there around, in bridges, for example on bridge decks and/or against uprights and/or stairs and/or walls, or in ornamentation of public spaces and public structures.
    Type: Grant
    Filed: April 17, 2014
    Date of Patent: March 13, 2018
    Assignee: Oceanco Shipbuilders & Partners Ltd.
    Inventors: Evy De Maeyer, Pieter Van Geest, Tiphaine Treins
  • Patent number: 9899808
    Abstract: A window assembly is for an enclosure. The enclosure has a plurality of walls. The window assembly includes a cover member structured to be coupled to each of the plurality of walls in order to form an enclosed region; a window member coupled to the cover member; a frame member coupled to the cover member; and a number of stud members each secured to the frame member and extending through the cover member. The cover member is located between the frame member and the window member.
    Type: Grant
    Filed: April 22, 2016
    Date of Patent: February 20, 2018
    Assignee: EATON CORPORATION
    Inventors: Warren Clift Sipe, Richard Donald Prohaska, Gilbert Ricky Carson
  • Patent number: 9780010
    Abstract: The present disclosure relates to a hermetic package with improved RF stability and performance. The package includes a carrier, a bottom dielectric ring over the carrier, a bottom metal layer over the bottom dielectric ring, a top dielectric ring over the bottom metal layer, a top metal layer over the top dielectric ring, an exterior plated layer, and multiple top vias. Herein, the bottom metal layer includes signal sections and at least one ground section, which is electrically isolated from the signal sections. The exterior plated layer covers at least a portion of a first exterior sidewall of the bottom ring structure and electrically couples the carrier to the at least one ground section. The multiple top vias extend through the top dielectric ring and electrically couple the top metal layer to the at least one ground section.
    Type: Grant
    Filed: December 14, 2016
    Date of Patent: October 3, 2017
    Assignee: Qorvo US, Inc.
    Inventors: Bo Zhao, Raj Santhakumar, Randy Kinnison
  • Patent number: 9715904
    Abstract: Apparatus for dissipating heat during the operation of a device. In accordance with some embodiments, the apparatus compares spaced-apart first and second heat sources. A thermally conductive plate is disposed between the first and second heat sources. A thermal interface layer is contactingly disposed between the plate and the first heat source, and has a relatively higher thermal conductivity so that heat generated by the first heat source passes through the thermal interface layer and to the plate. A thermal barrier layer is contactingly disposed between the plate and the second heat source to mechanically support the plate relative to the second heat source. The thermal barrier layer has a relatively lower thermal conductivity to thermally isolate the conductive plate from the second heat source.
    Type: Grant
    Filed: February 19, 2016
    Date of Patent: July 25, 2017
    Assignee: Seagate Technology LLC
    Inventor: William L. Rugg
  • Patent number: 9625509
    Abstract: A system for determining structural characteristics of an electromagnetic energy shielding material during a manufacturing process includes a transmitting antenna device mounted for a reciprocal linear movement across a width thereof, the transmitting antenna device being connected to a source of the electromagnetic energy and operable to transmit waves of the electromagnetic energy through the thickness of the electromagnetic energy shielding material during the reciprocal linear movement. A receiving antenna device is also mounted for the reciprocal linear movement in an alignment with the transmitting antenna device and operable to receive, during the reciprocal linear movement, the waves of electromagnetic energy being absorbed and attenuated by the electromagnetic energy shielding material.
    Type: Grant
    Filed: March 6, 2014
    Date of Patent: April 18, 2017
    Assignee: NOKOMIS, INC.
    Inventors: Patrick Joel Fisher, Walter John Keller, III
  • Patent number: 9578767
    Abstract: A cover for an electronic module that has a housing holding a electrical component and a circuit board for operating the electrical component includes a cover plate having an interior surface and an exterior surface. The cover plate has a dielectric body. A majority of at least one of the interior surface and the exterior surface includes a conductive layer to provide electrical shielding for the cover plate. A connector portion is formed integrally with the cover plate defining a unitary structure. The connector portion includes a plurality of contact channels and a shroud extending from the exterior surface that surrounds a receptacle configured to receive a plug connector therein. Contacts are held in corresponding contact channels that have mating ends positioned in the receptacle and mounting ends exposed beyond the interior surface for mounting to the circuit board.
    Type: Grant
    Filed: March 18, 2015
    Date of Patent: February 21, 2017
    Assignee: TYCO ELECTRONICS CORPORATION
    Inventor: Charles Raymond Gingrich, III
  • Patent number: 9554475
    Abstract: A method of manufacturing a flexible electronics module includes mounting at least two functional components onto a flexible substrate, forming stretchable electrical interconnects configured to provide connection between the two functional components, and cutting shapes into the flexible substrate to increase an ability of the flexible substrate to stretch and flex, wherein the electrical interconnects to the functional components are placed to avoid the shapes.
    Type: Grant
    Filed: July 29, 2013
    Date of Patent: January 24, 2017
    Assignee: PALO ALTO RESEARCH CENTER INCORPORATED
    Inventor: Jurgen H. Daniel
  • Patent number: 9553382
    Abstract: A headphone socket assembly for use in electronic equipment, includes: a headphone socket electrically connected to a circuit board in the electronic equipment; and an electromagnetic shielding device disposed at a periphery of the headphone socket.
    Type: Grant
    Filed: December 30, 2014
    Date of Patent: January 24, 2017
    Assignee: Xiaomi Inc.
    Inventors: Wei Sun, Feng Guo, Zhenfei Lei
  • Patent number: 9538693
    Abstract: A shield made from aluminum (AL) or an aluminum-based alloy coated with a solderable plating such as nickel or tin provides thermal improvement over existing shielding materials. The shield for circuitry on a circuit board comprising an aluminum material plated with a solderable material, the shield providing electromagnetic interference and radio frequency interference shielding and heat transfer when positioned over a circuit.
    Type: Grant
    Filed: March 14, 2014
    Date of Patent: January 3, 2017
    Assignee: A.K. Stamping Company, Inc.
    Inventors: Arthur Kurz, Michael Schneider, Bret Barry
  • Patent number: 9485038
    Abstract: A system and method for enabling automated testing of wireless data packet signal transceiver devices under test (DUTs). One or more DUTs are enclosed inside respective chambers within a shielded enclosure providing electromagnetic shielding for its interior region. Each DUT is powered by an internal power source and its radio frequency (RF) signal port is connected to an external RF signal interface at an outer wall of the shielded enclosure. An anchor at an outer wall of the shielded enclosure enables mechanical engagement with and physical displacement of the shielded enclosure, thereby allowing DUTs to be manipulated using pick and place automation devices for engagement with and connection to automated test equipment. Such test equipment can be assembled into vertically stacked RF signal test stations with which shielded DUT enclosures are engaged by physically mating their respective power and RF signal ports using the pick and place automation device.
    Type: Grant
    Filed: March 6, 2014
    Date of Patent: November 1, 2016
    Assignee: LitePoint Corporation
    Inventor: Christian Volf Olgaard
  • Patent number: 9484680
    Abstract: An apparatus is described herein. The apparatus includes a receptacle to receive a plug to couple a peripheral device to a computing device. The apparatus includes a ground contact of a printed circuit board of the computing device. The apparatus includes a shield communicatively coupled to the ground contact, wherein the shield is to reduce radio frequency interference (RFI) from an interface between the plug and the receptacle.
    Type: Grant
    Filed: June 12, 2013
    Date of Patent: November 1, 2016
    Assignee: Intel Corporation
    Inventors: Pujitha Davuluri, Chung-Hao J. Chen, Kuan-Yu Chen
  • Patent number: 9439333
    Abstract: A heat-dissipating EMI/RFI shield (100) has a shield base (110), a shield cap (130), and a heat sink (150). The shield base has at least one sidewall (112) which defines an open area (113). At least one mounting leg (114) extends from the sidewall and is affixed to a printed circuit board (200). The shield cap has a collar (136) which defines an opening in the shield cap. The shield cap is configured to be mated to the shield base. The heat sink has a boss (156) extending therefrom. The heat sink is configured to be mated to the shield cap. The boss is configured to protrude at least partially into the opening in the shield cap and to make thermal contact with a selected heat generating component (210) on the printed circuit board.
    Type: Grant
    Filed: January 10, 2014
    Date of Patent: September 6, 2016
    Assignee: Genesis Technology USA, Inc.
    Inventors: Earl Anthony Daughtry, Jr., Ronald L. Hodge
  • Patent number: 9408291
    Abstract: A control module includes a circuit board having conductor paths arranged on at least one plane and having at least one rigid, inflexible conductor path section. The control module also includes an electronic control circuit which electrically contacts the conductor paths and has electrical components. The control module also includes a pan-shaped cover part protecting the control circuit. The cover part is arranged over a part of the electronic control circuit and contacts a side of the circuit board in a sealing manner with a flat contact region aligned parallel to the side. At least part of the electronic control circuit is protectively arranged in a housing inner chamber between the cover part and the circuit board, and electrical contacts of the circuit board are provided outside of the housing inner chamber, which is covered by the cover part, to contact electrical components of the control module.
    Type: Grant
    Filed: October 20, 2011
    Date of Patent: August 2, 2016
    Assignee: Robert Bosch GmbH
    Inventor: Harald Ott
  • Patent number: 9370104
    Abstract: To provide a lid body portion with an improved mounting ratio of an electronic device component, an electronic device package and an electronic device including the same. There is provided a lid body portion including a concave portion in which a space portion is formed by a bottom portion and a side plate portion and a flange portion extending from an outer edge portion in an opening portion of the concave portion to the outside, in which a side-plate inner surface as a surface facing the space portion of the concave portion in the side plate portion inclines to the outside of the space portion.
    Type: Grant
    Filed: July 15, 2014
    Date of Patent: June 14, 2016
    Assignees: SEIKO INSTRUMENTS INC., KAGA, INC.
    Inventors: Masayuki Satoh, Kenji Takano, Mitsuo Akiba, Hitoshi Takeuchi, Shuhei Kaneko
  • Patent number: 9357677
    Abstract: An electronic device includes a metallic body, a circuit substrate having electronic components and wiring conductors, a heat conduction member that absorbs a heat generated by the electronic components, and a heat radiation member provided between the metallic body and the heat conduction member. The heat radiation member includes a heat introduction portion surface-contacted with the heat conduction member, a heat discharge portion surface-contacted with the metallic body, and a heat conduction portion that conducts the heat from the heat introduction portion to the heat discharge portion. The heat conduction portion is provided to be separated from the wiring conductors so as not to electromagnetically couple to the wiring conductors.
    Type: Grant
    Filed: September 20, 2013
    Date of Patent: May 31, 2016
    Assignee: Panasonic Intellectual Property Management Co., Ltd.
    Inventors: Ryo Matsubara, Hiroyoshi Umeda, Atsushi Sakae
  • Patent number: 9357683
    Abstract: According to various aspects, exemplary embodiments are disclosed of shielding apparatus or assemblies including electrically-conductive foam frames and covers or lids attachable to the frames. Also disclosed are exemplary embodiments of electrically-conductive foam frames for shielding apparatus or assemblies. Further, exemplary embodiments are disclosed of methods relating to making shielding apparatus or assemblies including electrically-conductive foam frames. Additionally, exemplary embodiments are disclosed of methods relating to providing shielding for one or more components on a substrate.
    Type: Grant
    Filed: October 14, 2014
    Date of Patent: May 31, 2016
    Assignee: Laird Technologies, Inc.
    Inventors: Ming Yueh Liu, Yi-Shen Lin, Jui-Iung Tsao, Ping-Feng Hsu
  • Patent number: 9240610
    Abstract: In use in a battery, a first spiral-wound battery element and associated wiring generates a first magnetic field and a second spiral-wound battery element and associated wiring generates a second magnetic field. The first element, the second element and the wiring may be arranged within a casing so that the first magnetic field is proximate to the second magnetic field and oriented in an opposite polarity. Conveniently, it may be shown that the total magnetic field generated by the battery has significantly lower magnitude than the total magnetic field generated by a conventional battery for the same current drain and same wiring structure.
    Type: Grant
    Filed: November 23, 2009
    Date of Patent: January 19, 2016
    Assignee: BlackBerry Limited
    Inventors: Jens Kristian Poulsen, Larry Edward Hawker, George Soliman Mankaruse
  • Patent number: 9190837
    Abstract: An EMP/HEMP protection device for protecting equipment from electromagnetic pulses. The protection device includes a housing defining a cavity therein and separated into two chambers, a dirty chamber for propagation of signals before filtering of electromagnetic interference, and a clean chamber, isolated from the dirty chamber, for propagation of signals after filtering. A rigid-flex printed circuit board (PCB) is disposed in the cavity for facilitating electrical connections between the chambers. Surface mount electrical components for EMP/HEMP protection are coupled with the rigid-flex PCB. Power and/or data signals are transferred from the dirty chamber to the clean chamber though a wave guide below cutoff (WBC). The WBC is formed from opposing electrical ground planes within a center PCB of the rigid-flex PCB. An electrically conductive and weather sealing gasket is disposed in the cavity of the housing for further EMI isolation.
    Type: Grant
    Filed: May 3, 2013
    Date of Patent: November 17, 2015
    Assignee: Transtector Systems, Inc.
    Inventors: Trevor O. Tollefsbol, Eric Nguyen
  • Patent number: 9144185
    Abstract: A panel for an electromagnetic shield includes a light-weight, porous, electrically-conductive core layer of metallic foam having generally parallel opposed surfaces and a face sheet having rigidity properties superior to the rigidity properties of the core layer laminated to a surface of the core layer. Alternatively, a panel for a broadband electromagnetic shield includes a composite fiber-reinforced core having opposed surfaces and a layered electrically-conductive composite cover disposed on a surface of the core. The cover includes a first stratum of porous metal exhibiting pronounced low-frequency electromagnetic shielding properties and a second stratum of electrically-conductive elements exhibiting pronounced high-frequency electromagnetic shielding properties secured in an overlapping electrically-continuous relationship to the first stratum, the first stratum being a metallic lattice, and the electrically-conductive elements being a non-woven veil of electrically-nonconductive metal-coated fibers.
    Type: Grant
    Filed: November 18, 2010
    Date of Patent: September 22, 2015
    Assignee: Conductive Composites Company, L.L.C.
    Inventors: George Clayton Hansen, Nathan D. Hansen
  • Patent number: 9042119
    Abstract: A lightweight radio/CD player for vehicular application is virtually “fastenerless” and includes a case and frontal interface formed of polymer based material that is molded to provide details to accept audio devices such as playback mechanisms (if desired) and radio receivers, as well as the circuit boards required for electrical control and display. The case and frontal interface are of composite structure, including an insert molded electrically conductive wire mesh screen that has been pre-formed to contour with the molding operation. The wire mesh provides EMC, RFI, BCI and ESD shielding and grounding of the circuit boards via exposed wire mesh pads and adjacent ground clips. The major components and subassemblies self-interconnect by integral guide and connection features effecting “slide lock” and “snap lock” self-interconnection. The major components and subassemblies self-ground by establishing an interference fit with exposed, resilient, embossed portions of wire mesh.
    Type: Grant
    Filed: December 9, 2013
    Date of Patent: May 26, 2015
    Assignee: Delphi Technologies, Inc.
    Inventor: Edgar Glenn Hassler
  • Patent number: 9035189
    Abstract: A circuit board comprising a circuit carrier, a cover layer composed of a nonconductive material, comprising an organic substance, arranged on the circuit carrier, a first metallization layer at least partly arranged on the cover layer, wherein the first metallization layer has a flexible region.
    Type: Grant
    Filed: June 8, 2009
    Date of Patent: May 19, 2015
    Assignee: EPCOS AC
    Inventors: Wolfgang Pahl, Hans Krueger, Peter Demmer
  • Patent number: 9029714
    Abstract: An electromagnetically shielded enclosure that is portable and lightweight with a double perimeter entry seal. The electromagnetically shielded enclosure can be used for applications such as testing and security and can be scaled from a bench top unit to a large field deployed enclosure. The electromagnetically shielded enclosure has a novel entry seal that eliminates the electromagnetic leakage that is common around the entry areas of such enclosures. The entry seal of the electromagnetically shielded enclosure is made up of a door having a first perimeter closure material and a second perimeter closure material and an enclosure opening having a first perimeter closure and a second perimeter closure where the first perimeter closure material aligns with the first perimeter closure and the second perimeter closure material aligns with the second perimeter closure. This double perimeter entry seal provides for electromagnetic isolation within the electromagnetically shielded enclosure.
    Type: Grant
    Filed: December 12, 2012
    Date of Patent: May 12, 2015
    Assignee: Select Fabricators, Inc.
    Inventors: Gary William Winch, Brian Donald Smith
  • Patent number: 9019700
    Abstract: Methods are provided for creating and operating data centers. A data center may include an information technology (IT) load and a fuel cell generator configured to provide power to the IT load.
    Type: Grant
    Filed: June 26, 2012
    Date of Patent: April 28, 2015
    Assignee: Bloom Energy Corporation
    Inventors: Arne Ballantine, KR Sridhar, Jon Christopher Motta, Peter Light, Carl Cottuli, Jessica Mahler
  • Patent number: 9007776
    Abstract: An electronic module includes a first circuit board having a first surface, a second circuit board having a second surface, first electronic components on the first surface, second electronic components on the second surface, a first conductive fence, and a second conductive fence. The first conductive fence encloses the first electronic components and has a first opening exposing the first electronic components. The second conductive fence encloses the second electronic components and has a second opening exposing the second electronic components. The first opening of the first conductive fence joints the second opening of the second conductive fence, such that the first electronic components and the second electronic components are surrounded by the first circuit board, the second circuit board, the first conductive fence, and the second conductive fence. At least one of the first electronic components is higher than the first conductive fence.
    Type: Grant
    Filed: December 14, 2012
    Date of Patent: April 14, 2015
    Assignee: HTC Corporation
    Inventors: I-Cheng Chuang, Chien-Hung Chen, Chih-Hung Li, Cheng-Te Chen
  • Patent number: 9002288
    Abstract: An enclosure that has an interior space sized to receive a portable electronic device. The enclosure has a shielding layer that can shield and prevent communications between the interior space and the outside world in a first configuration. In a second configuration, communication is allowed. A signal transfer element is attached to the enclosure housing that can be moved between an isolation configuration and a communication configuration.
    Type: Grant
    Filed: January 25, 2013
    Date of Patent: April 7, 2015
    Inventor: James Patrick Reible
  • Publication number: 20150084825
    Abstract: Provided is an electromagnetic wave shielding sheet including: a substrate that is formed in a nano-web form by spinning a polymer material into fiber strands by a spinning method; a conductive metal layer that is formed on one surface of the substrate for shielding electromagnetic waves; and an adhesive layer formed on the other surface of the substrate, to thereby make a thickness of the electromagnetic wave shielding sheet thin, and improve electromagnetic wave shielding performance.
    Type: Application
    Filed: December 4, 2014
    Publication date: March 26, 2015
    Inventors: Seung Hoon LEE, Yong Sik JUNG, Yun Mi SO
  • Publication number: 20150077932
    Abstract: A shielding assembly is used to shield electronic element positioned on a motherboard of an electronic device. The shielding assembly includes a shielding frame fixed to a first surface of the motherboard, a heat dissipating module, and a shielding plate. The heat dissipating module is detachably assembled to the shielding frame. When the heat dissipating module is assembled to the shielding frame, the heat dissipating module and the shielding frame form a shielding space to receive the electronic element. The shielding plate is fixed to a second surface of the motherboard opposite to the shielding frame to completely shield the electronic element.
    Type: Application
    Filed: January 8, 2014
    Publication date: March 19, 2015
    Applicants: HON HAI PRECISION INDUSTRY CO., LTD., HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD
    Inventor: QIANG CHAI
  • Publication number: 20150068797
    Abstract: An electromagnetic frequency and non-ionizing radiation harmonizer that may be a film, a sheet or a textile that harmonizes or mitigates electromagnetic frequency radiation from non-ionizing EMF emitting devices while allowing an integration of vibrations or frequency mediums. The harmonizer includes a method of utilizing an electromagnetic frequency radiation and non-ionizing radiation harmonizer that includes the steps of obtaining a film, a sheet or a textile that harmonizes or mitigates electromagnetic frequency radiation from one or more non-ionizing EMF emitting devices and disposing the film, sheet or textile in direct contact or within dose proximity of one or more non-ionizing EMF emitting devices.
    Type: Application
    Filed: September 12, 2013
    Publication date: March 12, 2015
    Inventor: Rhoda Alale
  • Patent number: 8976539
    Abstract: An optical transceiver that reduces the EMI noise leaked therefrom is disclosed. The optical transceiver provides a metal housing, an optical subassembly, and an electronic circuit. The metal housing includes a first space to install the electronic circuit, and a second space to install the optical subassembly. At least the first space has inner surfaces having a corrugated shape to reduce the resonance of the electromagnetic waves.
    Type: Grant
    Filed: March 22, 2012
    Date of Patent: March 10, 2015
    Assignee: Sumitomo Electric Industries, Ltd.
    Inventors: Phillip J. Edwards, Jignesh H. Shah, Lance R. Thompson, Nhan Huynh
  • Patent number: 8964385
    Abstract: An apparatus is provided in one example embodiment and includes a faceplate having a plurality of slots arranged on a front portion of the faceplate, a top plate attached to a top portion of the faceplate, and a screen attached to the faceplate and the top plate. A channel may be disposed behind the faceplate and between a bottom surface of the top portion of the faceplate, a bottom surface of the top plate and a top surface of the screen. The screen may include a plurality of openings. In a specific embodiment, the apparatus may be removably attached to a removable line card of a switch. In a specific embodiment, air may be guided through the slots, by a fan operating behind the apparatus, along the channel and through the plurality of openings to one or more heat generating components on the line card.
    Type: Grant
    Filed: October 5, 2012
    Date of Patent: February 24, 2015
    Assignee: Cisco Technology, Inc.
    Inventors: Mandy Hin Lam, Phillip S. Ting, Susheela Nanjunda Rao Narasimhan
  • Patent number: 8964408
    Abstract: An electromagnetic interference (EMI) absorber includes an EMI conductive sheet having first and second portions, the first portion absorbing EMI from an EMI absorption target and the second portion for conducting EMI to an EMI discharge target, and an elastic member covered by the first portion.
    Type: Grant
    Filed: October 8, 2008
    Date of Patent: February 24, 2015
    Assignee: Samsung Display Co., Ltd.
    Inventors: Sung-Kyu Lee, Ju-Geun Kim
  • Publication number: 20150047894
    Abstract: A shell of an electronic device includes a resin base formed by injecting molten resin into an injection mold, and a film layer including a base layer attached to the resin base and an electro magnetic interference shielding layer attached to the base layer and opposite to the resin base.
    Type: Application
    Filed: December 31, 2013
    Publication date: February 19, 2015
    Applicants: HON HAI PRECISION INDUSTRY CO., LTD., HONG FU JIN PRECISION INDUSTRY (WUHAN) CO., LTD.
    Inventors: CHING-JOU CHEN, WEN-CHIEH WANG, WEN-CHIN LIN
  • Publication number: 20150048752
    Abstract: An electrical component with conductive material(s) that is suitable for use within the electromagnetic field path of a wireless power transfer system. The electronic component includes conductive materials that are sufficiently thin to absorb no more than an acceptable amount of the electromagnetic field, yet thick enough to remain sufficiently conductive to perform the desired electrical function. In embodiments in which the wireless power supply delivers up to 20 watts of power, the conductive materials are not substantially thicker than about 1/10 the skin depth of the material at the anticipated wireless power frequency. The electrical component may be disposed at any location between the wireless power supply transmitter and the remote device receiver. The present invention permits the use of a wide rang of electrical components in the field path, such as a display, a sensor or a component capable of selectively operating as both.
    Type: Application
    Filed: January 7, 2013
    Publication date: February 19, 2015
    Inventors: Joseph C. Van Den Brink, Hai D. Nguyen, Benjamin C. Moes, Neil W. Kuyvenhoven
  • Publication number: 20150043162
    Abstract: An electromagnetic interference (EMI) shield for reducing the electromagnetic interference and substantially uniformly distribute heat is disclosed. The EMI shield comprises a first layer configured to shield EMI and a second layer configured to dissipate heat. The EMI shield further comprises an interface. Some embodiments also provide methods for shielding EMI and uniformly dissipate heat of an electronic component.
    Type: Application
    Filed: August 12, 2013
    Publication date: February 12, 2015
    Inventors: Ko-Chun CHEN, Wen-Hsiung HUANG, Pei-Min YANG, Chun-Chang LIANG
  • Publication number: 20150014049
    Abstract: A shielding apparatus is provided. The apparatus includes a printed circuit board including a plurality of catching parts, a shield member configured to cover the printed circuit board, and at least one shield fastening part provided in the shield member and configured to be one of fastened to and separated from the plurality of catching parts by a resilient force while not protruding.
    Type: Application
    Filed: June 17, 2014
    Publication date: January 15, 2015
    Inventors: Souk-Su JANG, Hyun-Suk CHOI
  • Patent number: 8929087
    Abstract: An electromagnetic shield for a storage device comprising a printed circuit board (PCBA) defining a plated through hole defining a generally cylindrical plated surface. The electromagnetic shield may comprise a top surface and sides oriented generally perpendicular to the top surface. One or more of the sides comprise a press-fit connector configured for removable insertion in the plated through hole. The press-fit connector may comprise at least one resilient member defining a longitudinal axis and configured to resiliently bow out in a direction generally perpendicular to the longitudinal axis during insertion and press against the plated surface of the through hole to displace plating material formed thereon to form a gas-tight seal between the at least one resilient member and the plated surface.
    Type: Grant
    Filed: May 23, 2012
    Date of Patent: January 6, 2015
    Assignee: Western Digital Technologies, Inc.
    Inventor: Bruce A. Cariker
  • Publication number: 20140367160
    Abstract: A package includes a device die, a molding material molding the device die therein, and a through-via penetrating through the molding material. A redistribution line is on a side of the molding material. The redistribution line is electrically coupled to the through-via. A metal ring is close to edges of the package, wherein the metal ring is coplanar with the redistribution line.
    Type: Application
    Filed: August 29, 2014
    Publication date: December 18, 2014
    Inventors: Chen-Hua Yu, Shin-Puu Jeng, Der-Chyang Yeh, Hsien-Wei Chen, Jie Chen
  • Publication number: 20140367157
    Abstract: The present invention concerns a shield shell (70) to be connected to a case made of metal and including a shell main body (71) with a case connecting portion (74) to be connected to the case, a single collective shield connecting portion (72) provided on the shell main body (71) and formed into an elliptical tubular shape, and a plurality of individual-core shield connecting portions (77) provided on the shell main body (71) and formed into a cylindrical shape. The present invention may also concern a shield connector (10) including the shield shell (70), a housing (40) to be held onto the shield shell (70), wires with terminal fittings (20) inserted through the interior of the housing (40), and a single braided wire (90) connected to the single collective shield connecting portion (72) of the shield shell (70).
    Type: Application
    Filed: March 1, 2012
    Publication date: December 18, 2014
    Inventor: Masayuki Kawamura
  • Patent number: 8913395
    Abstract: This is directed to connecting two or more elements using an intermediate element constructed from a material that changes between states. An electronic device can include one or more components constructed by connecting several elements. To provide a connection having a reduced or small size or cross-section and construct a component having high tolerances, a material can be provided in a first state in which it flows between the elements before changing to a second state in which it adheres to the elements and provides a structurally sound connection. For example, a plastic can be molded between the elements. As another example, a composite material can be brazed between the elements. In some cases, internal surfaces of the elements can include one or more features for enhancing a bond between the elements and the material providing the interface between the elements.
    Type: Grant
    Filed: June 4, 2010
    Date of Patent: December 16, 2014
    Assignee: Apple Inc.
    Inventors: Scott Myers, Mattia Pascolini, Richard Dinh, Trent Weber, Robert Schlub, Josh Nickel, Robert Hill, Nanbo Jin, Tang Tan