Vents Patents (Class 174/383)
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Patent number: 12082379Abstract: An arrangement of ducted exhaust equipment enclosures includes a row of electronic equipment enclosures and a vertical wall rising from, and extending along, the tops of the electronic equipment enclosures. Each enclosure includes a frame structure formed from a plurality of support posts and cross members, and a plurality of panels, including a top panel, at least partially enclosing the frame structure and defining a single compartment for mounting an electronic component. The top panel and upper portions of the frame structure form a top of the electronic equipment enclosure, the electronic equipment enclosure top having a rectangular opening therein and also an outer perimeter. The rectangular opening has a front bound, a rear bound, and two side bounds, and has a side-to-side width that is at least 75% of a side-to-side width of the electronic equipment enclosure top perimeter.Type: GrantFiled: September 29, 2023Date of Patent: September 3, 2024Assignee: Chatsworth Products, Inc.Inventors: Richard Evans Lewis, II, Dennis W. Vanlith
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Patent number: 12004336Abstract: A data processing device includes an internal volume for housing electromagnetic interference emitting devices. The data processing device further includes a first electromagnetic radiation absorbing vent. The data processing device further includes a second electromagnetic radiation absorbing vent. The first electromagnetic radiation absorbing vent and the second electromagnetic radiation absorbing vent delineate a gas flow path through the internal volume.Type: GrantFiled: July 19, 2019Date of Patent: June 4, 2024Assignee: DELL PRODUCTS L.P.Inventors: Steven Embleton, Ben John Sy, Eric Michael Tunks, Rene J. Salas
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Patent number: 11994550Abstract: The temperature test apparatus includes an OTA chamber 50 as an anechoic box, a heat insulating housing that is accommodated in the OTA chamber, a temperature control device that controls a temperature in the heat insulating housing, a ventilation block 210 that is made of metal and provided to block an opening 502 formed in the OTA chamber, and in which a plurality of through-holes 214 are formed, a first cover 220 that is provided on an outer side of the OTA chamber to cover the ventilation block, and form a first space 225 with the ventilation block, and is joined to a pipe for air from the temperature control device, and a second cover 250 that is provided on an inner side of the OTA chamber to cover the ventilation block, and form a second space 255 communicating with the heat insulating housing, together with the ventilation block.Type: GrantFiled: November 23, 2021Date of Patent: May 28, 2024Assignee: ANRITSU CORPORATIONInventor: Tomonori Morita
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Patent number: 11968809Abstract: A system and a method of providing electromagnetic compatibility (EMC) protection. A removable component is inserted into an end product. The removable component includes a retractable EMC protection apparatus. In response to the insertion of the removable component a shape memory alloy on the EMC protection apparatus is heated to a temperature above the activation temperature of the shape memory alloy. The shape memory alloy then changes from a first shape to a second shape in response to the heating. In response to the change in the shape of the shape memory alloy an EMC protection component of the EMC protection apparatus is inserted into an enclosure opening of the removable component.Type: GrantFiled: July 21, 2023Date of Patent: April 23, 2024Assignee: International Business Machines CorporationInventors: John S. Werner, Noah Singer, Samuel R. Connor
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Patent number: 11695240Abstract: A system and method for providing electromagnetic compatibility (EMC) protection for a removable component through a retractable EMC protection apparatus. The EMC protection apparatus includes an actuation pin, a stabilizing bracket, an actuation arm, a spring brace, an arm spring, a second stabilizing bracket, a rounded pin, an angled engagement feature, an enclosure opening, a conductive surface, a protection device spring, and a retractable EMC protection device. The actuation pin is configured to engage upon a surface of an end product upon insertion of the removable component into the end product. The activation arm is configured to simultaneously compress the arm spring against the stop brace and to push on the angled engagement feature. The angled engagement feature is configured to push in a downward direction on the conductive surface to seal an enclosure opening of the removable component with the retractable EMC protection device.Type: GrantFiled: October 22, 2021Date of Patent: July 4, 2023Assignee: International Business Machines CorporationInventors: John S. Werner, Noah Singer, Samuel R. Connor
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Patent number: 11547020Abstract: An electronic equipment enclosure includes a frame structure at least partially enclosed by a plurality of panels defining a compartment in which one or more electronic components are mounted and an exhaust air duct that is adapted to segregate hot air being exhausted from the compartment from cool air entering the compartment, thereby improving thermal management of the enclosure. The exhaust duct includes a lower duct section extending upward from the top panel of the compartment and an upper duct section telescoping upward from an upper end of the lower duct section. Each duct section includes four panels connected together by hinged corner fittings such that the section is collapsible. The upper duct section includes an outwardly flared portion.Type: GrantFiled: February 21, 2022Date of Patent: January 3, 2023Assignee: Chatsworth Products, Inc.Inventors: Richard Evans Lewis, II, Dennis W. Vanlith
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Patent number: 11490548Abstract: A frame includes a plurality of walls each having a first end and a second end facing away from each other along a first direction, and a plurality of spring fingers on the second end of one or more walls of the plurality of walls and extending along the first direction. First ends of the plurality of walls define an open bottom, and second ends of the plurality of walls define an open top.Type: GrantFiled: September 10, 2020Date of Patent: November 1, 2022Assignee: TECVOX, LLCInventors: John T. Cody, Steven F. Selby, Scott M. Gelber
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Patent number: 11483946Abstract: Disclosed is an integrated data center that provides for efficient cooling as well as efficient wire routing. The data center houses electronic equipment stored in clusters of cabinets. The space inside the data center is shared, such as on a leased basis, between multiple different entities who operate their own electronic equipment. To achieve privacy, security, and cooling air flow, one or more layers of a security paneling surround one or more clusters of cabinets to create a secure interior space. This allows access to only authorized personal, prevents people from viewing into the secure interior space, and allows cooling air flow to pass into the secure interior space to cool the electronic equipment. The security paneling comprises sheets of metal with small apertures. Two or more security panels may be arranged with offset apertures to further prevent viewing of the electronic equipment in the secure interior space.Type: GrantFiled: December 19, 2018Date of Patent: October 25, 2022Assignee: Switch, Ltd.Inventor: Rob Roy
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Patent number: 11297728Abstract: A chassis housing one or more Information Handling Systems (IHSs) includes a bay for coupling hardware components to the chassis, such as rear-facing bay that extends from the chassis midplane to an externally accessible opening. A first hardware component is fastened to a removeable carrier and the carrier is inserted in the bay, with the first hardware component coupling to the midplane. The carrier includes arms that extend to the externally accessible opening. Each arm includes a retractable handle that is used, when in an extended position, to extract the carrier from the bay. A second, removeable hardware component is inserted in the bay, with the second hardware components nested between the arms of the carrier. The carrier handles rotate to a concealed position when the second hardware component is nested in the carrier and the handles rotate to the extended position when the second hardware component is removed.Type: GrantFiled: October 12, 2020Date of Patent: April 5, 2022Assignee: Dell Products, L.P.Inventors: Zhao Wei Shang, Aiqin Liu, Qingqiang Guo, Zhao Chen
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Patent number: 11150700Abstract: A thermal management device with electromagnetic (EM) shielding includes a fin pack with a plurality of channels. The fin pack has an upper and lower surface. The fin pack has a pack length, pack height, and pack width. The fin pack has fins are oriented connecting the upper surface to the lower surface. The plurality of channels extends from a first end toward a second end. A first channel of the plurality of channels is adjacent the upper surface, and a second channel of the plurality of channels is adjacent the lower surface.Type: GrantFiled: November 2, 2018Date of Patent: October 19, 2021Assignee: Microsoft Technology Licensing, LLCInventors: Bo Dan, Robert Ullman Myers, Aaron Ray Paff, Raghavendra S Kanivihalli, Eugene Lee
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Patent number: 11134580Abstract: A protective cover is provided to protect a portable electronic device, including a display surface that includes a display screen. The protective cover may include a computing accessory such as a keyboard. One or more magnets in the protective cover may be configured to align with magnets located in the portable electronic device. Upon placing the protective cover over the display surface, an attraction force between magnets can secure the protective cover, including the computing accessory, over the display surface. The magnets may be located proximate edges of the protective cover a portable electronic device, and the attraction force may be the primary or only mechanism for securing the protective cover in place. Optionally, the attractive forces pass through the display surface without also passing through a side or peripheral surface of the portable electronic device.Type: GrantFiled: June 18, 2013Date of Patent: September 28, 2021Assignee: ZAGG IncInventor: David Gengler
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Patent number: 11019757Abstract: A back cover module adapted to be disposed on a casing having a back opening is provided. The back cover module includes a fixing bracket, a sliding bracket and a rotating mask. The sliding bracket is slidably disposed on the fixing bracket along a first direction. The rotating mask is pivoted to the sliding bracket. When the fixing bracket is fixed to a position of the casing adjacent to the back opening, the fixing bracket and the sliding bracket are adapted to be inside the casing and a portion of the rotating mask is exposed from the casing. The rotating mask is adapted to follow the sliding bracket and move relative to the fixing bracket toward the first direction to a position out of the casing, and is adopted to rotate relative to the sliding bracket and shield the back opening after being moved out of the casing.Type: GrantFiled: March 28, 2018Date of Patent: May 25, 2021Assignee: Wistron CorporationInventor: Ray Ho
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Patent number: 10888008Abstract: An insulation cover fixing structure and a protection device include a first insulation, a first metal shielding cover and an engaging unit. The first insulation cover includes a first bottom plate and a first side plate. The first metal shielding cover is disposed at an outer side of the first insulation cover. The first metal shielding cover includes a second bottom plate and a second side plate. The engaging unit is disposed on at least one of the first insulation cover and the first metal shielding cover. The first metal shielding cover and the first insulation cover are fixed by the engaging unit. The engaging unit includes a first tongue extended with bend from one of the first side plate and the second side plate toward the other and a second tongue extended from the first tongue. The second tongue is pressed against the other of the first side plate and the second side plate.Type: GrantFiled: March 23, 2020Date of Patent: January 5, 2021Assignee: CHICONY POWER TECHNOLOGY CO., LTD.Inventor: Po-Sheng Lee
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Patent number: 10759283Abstract: Disclosed is a battery pack, which includes a battery module having at least one battery cell, a pack case made of a metal material and configured to package the battery module, and a fire extinguishing liquid guide cover configured to cover one side of the pack case, the fire extinguishing liquid guide cover being melted over a predetermined temperature to form an opening so that a fire extinguishing liquid is guided into the pack case, the fire extinguishing liquid guide cover having a noise shielding member for shielding an electromagnetic noise not to enter the pack case.Type: GrantFiled: December 9, 2016Date of Patent: September 1, 2020Assignee: LG CHEM, LTD.Inventors: Kang-Gu Lee, Sung-Dae Kim, Young-Hoo Oh, Jae-Hun Yang
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Patent number: 10674600Abstract: A backlight bar includes a flexible circuit board and backlight lamp, the flexible circuit board includes a circuit board base and an electrostatic shielding structure, the electrostatic shielding structure is disposed on a first surface of the circuit board base and located in a non-marginal region, and the backlight lamp disposed on a second surface of the circuit board base, the first surface disposed opposite to the second surface. A backlight module and a display device are also provided.Type: GrantFiled: February 11, 2018Date of Patent: June 2, 2020Assignees: BOE TECHNOLOGY GROUP CO., LTD., BEIJING BOE OPTOELECTRONICS TECHNOLOGY GROUP CO., LTD.Inventors: Dong Liu, Gang Liu, Fuan Zhu, Zhengxuan Lv, Chao Yu, Yanming Wang, Rui Liu, Zongli Gao, Jian Ren
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Patent number: 10635145Abstract: Thermal energy exposed at the outer surface of an information handling system housing is managed by spreading the thermal energy across the housing X and Y axes while restricting heat transfer from the housing at the Z axis. For example, a graphene outer surface couples to an aerogel substrate strengthened by a carbon fiber laminate. The graphene spreads thermal energy that escapes through the housing across the housing outer surface to limit the impact of thermal energy at any particular location, such as proximate to the location of a processor.Type: GrantFiled: February 27, 2019Date of Patent: April 28, 2020Assignee: Dell Products L.P.Inventors: Andrew T. Sultenfuss, Travis C. North, Deeder M. Aurongzeb
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Patent number: 10630032Abstract: A coaxial connector with an F female end shield is configured to restrict RF ingress.Type: GrantFiled: April 12, 2018Date of Patent: April 21, 2020Assignee: HOLLAND ELECTRONICS, LLCInventors: Michael Holland, George Goebel, Reed Gibson
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Patent number: 10356964Abstract: Examples described herein include an electromagnetic interference shield. In some examples, the electromagnetic interference shield includes a wall comprised of a conductive material. The wall may have a first surface, a second surface, and a thickness between the first surface and the second surface. The shield may include a rounded opening in the wall that creates an air passageway through the thickness of the wall. The shield may also include a first obstruction in the opening and a second obstruction in the opening. The first obstruction may span across the opening. The second obstruction may span across the opening and intersect the first obstruction. The first obstruction and the second obstruction may be waveguide structures.Type: GrantFiled: July 21, 2016Date of Patent: July 16, 2019Assignee: Hewlett Packard Enterprise Development LPInventors: Elene Chobanyan, Karl J. Bois, Dave Mayer, Arlen L. Roesner
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Patent number: 10317943Abstract: Examples are disclosed that relate to aligning a pressure sensitive adhesive to a body of a display device for attachment of a display module to the display device. One example provides an electronic display device comprising a body, the body comprising a wall and a deck extending inwardly from the wall. The deck comprises a first reference feature configured to interface with a first index feature on a pressure sensitive adhesive application fixture, and a second reference feature configured to interface with a second index feature on the pressure sensitive adhesive application fixture. The electronic display device further comprises a display module supported by the deck, and a pressure sensitive adhesive adhering the display module to the deck.Type: GrantFiled: May 5, 2016Date of Patent: June 11, 2019Assignee: MICROSOFT TECHNOLOGY LICENSING, LLCInventors: Jason Fergus Lee, Kenneth Charles Boman, James Michael Bonicatto
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Patent number: 10172263Abstract: Electronic assembly includes a printed circuit having a plurality of thru-holes. The electronic assembly also includes a conductive shield having a plurality of sidewalls. The sidewalls define a cavity. Edges of at least some of the sidewalls interface with the printed circuit along a perimeter line. The perimeter line intersects the thru-holes or extends immediately adjacent to the thru-holes. The electronic assembly also includes a plurality of grounding contacts that are each discrete with respect to the conductive shield. Each of the grounding contacts of said plurality includes a pin segment and a wall-engaging segment. The pin segments include compliant pins that are insertable into the thru-holes. The wall-engaging segments are connected to respective sidewalls. The grounding contacts are distributed along the perimeter line and electrically couple the conductive shield to the ground conductor of the printed circuit.Type: GrantFiled: February 26, 2018Date of Patent: January 1, 2019Assignee: TE CONNECTIVITY CORPORATIONInventor: Galen M. Martin
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Patent number: 10154612Abstract: An electronic device having active heat dissipation includes a wiring board, a semiconductor package unit, a surrounding unit, a fan module and a tube member. The semiconductor package unit is soldered to the wiring board through three-dimensional contacts. The surrounding unit is connected to the wiring board and the semiconductor package unit, and surrounds the three-dimensional contacts, such that a heat exchange space is collectively defined by the surrounding unit, the wiring board and the semiconductor package unit. The surrounding unit is provided with two openings which are in communication with the heat exchange space. The fan module is located outside the heat exchange space, and is connected to one of the openings.Type: GrantFiled: May 1, 2018Date of Patent: December 11, 2018Assignees: GLOBAL UNICHIP CORPORATION, TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Yu-Min Sun, Chih-Feng Cheng, Chih-Chieh Liao
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Patent number: 10052790Abstract: A microwave drying method of a honeycomb formed body includes: an introduction step of disposing the honeycomb formed body while keeping an axis direction of cells of the honeycomb formed body vertically and introducing the honeycomb formed body into a drying furnace capable of irradiating with microwaves; a reflector placing step of placing a microwave reflector above the honeycomb formed body, the microwave reflector including a reflecting face having a coverage factor to an area of an end face of the honeycomb formed body that is 15% to 30%; and a microwave drying step of irradiating the honeycomb formed body with the microwaves of 915 MHz in frequency from above to dry the honeycomb formed body.Type: GrantFiled: March 22, 2016Date of Patent: August 21, 2018Assignee: NGK Insulators, Ltd.Inventors: Norihiro Asakura, Kensuke Okumura, Seiichiro Hayashi
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Patent number: 10004163Abstract: Embodiments include systems and methods for integrated control of environmental conditions in an equipment enclosure. For example, a novel airflow inlet structure can be installed into a primary airflow path of the equipment enclosure. The airflow inlet structure can include an integrated electrostatic filter sub-structure and an integrated electromagnetic radiation (EMR) control sub-structure. During operation of equipment within the enclosure, air drawn through the equipment enclosure can flow through the primary airflow path in such a way as to flow through the electrostatic filter sub-structure; and the EMR control sub-structure can control EMR emitted by the equipment, such that EMR leaving the enclosure is attenuated to below a threshold level.Type: GrantFiled: May 27, 2016Date of Patent: June 19, 2018Assignee: ORACLE AMERICA, INC.Inventor: Frank Smith
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Patent number: 9832918Abstract: In one aspect, a vent for use in an electronic device for absorbing electromagnetic radiation is disclosed, which includes a body comprising at least one thermoplastic polymer and a radiation-absorbing filler distributed within said thermoplastic polymer for absorbing electromagnetic radiation, said body further comprising a plurality of openings. The body is adapted for coupling to a frame of an electronic device to absorb electromagnetic radiation and to allow heat transfer via air flow through said openings between an interior of the frame and an external environment.Type: GrantFiled: August 17, 2015Date of Patent: November 28, 2017Assignee: Arc Technologies, Inc.Inventors: Todd Durant, Noel Bolduc
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Patent number: 9711919Abstract: A coaxial connector with an F female end shield is configured to restrict RF ingress.Type: GrantFiled: December 2, 2015Date of Patent: July 18, 2017Assignee: Holland Electronics, LLCInventors: Michael Holland, George Goebel, Reed Gibson
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Patent number: 9659877Abstract: One aspect of the invention relates to a shielding device for shielding from electromagnetic radiation, including a shielding base element, a shielding cover element and a shielding lateral element for electrically connecting the base element to the cover element in such that a circuit part to be shielded is arranged within the shielding elements. Since at least one partial section of the shielding elements includes a semiconductor material, a shielding device can be realized completely and cost-effectively in an integrated circuit.Type: GrantFiled: August 15, 2013Date of Patent: May 23, 2017Assignee: Infineon Technologies AGInventors: Winfried Bakalski, Bernd Eisener, Uwe Seidel, Markus Zannoth
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Patent number: 9547189Abstract: A liquid crystal display device includes a liquid crystal module; a printed circuit board providing driving signals to the liquid crystal module; and an installation unit including first, second and third parts, wherein the first part is attached to the liquid crystal module, the second part faces the first part and is attached to the printed circuit board, and the third part connects the first and second parts.Type: GrantFiled: December 30, 2013Date of Patent: January 17, 2017Assignee: LG DISPLAY CO., LTDInventors: Jung-Hoon Shin, Chan-Heon Lee, Min-Ji Kim
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Patent number: 9497882Abstract: A server includes a frame body, a fixed member and a circuit board. The fixed member is fixed on the side of the frame body, and includes a main structure, a stopper, a secure structure and an elastic secure-and-release structure. The main structure is bored with a hole. The stopper is disposed on the side of the main structure. The elastic secure-and-release structure is extended from the main structure to the hole and formed with a protrusion. The circuit board is formed with a notch, a key-shaped hole and a positioning hole. When the circuit board is assembled to the circuit board fixture, the notch is secured by the stopper, the key-shaped hole is provided for the secure structure being inserted therein, and the positioning hole is provided for the protrusion being inserted therein, so as to make the circuit board be fixed.Type: GrantFiled: March 31, 2015Date of Patent: November 15, 2016Assignees: INVENTEC (PUDONG) TECHNOLOGY CORPORATION, INVENTEC CORPORATIONInventor: Chia-Liang Hsiao
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Patent number: 9411385Abstract: An assembly (1000) includes a substrate (1002) and a heat emissive electrical component (1001) disposed on the substrate. A shield (1003) is disposed on the substrate, thereby enclosing the heat emissive electrical component. A display assembly (101) is disposed above the shield. A compressible pad (1004) is disposed between the shield and the display assembly. The compressible pad defines an aperture (1005) above the heat emissive electrical component. The aperture can have dimensions that are a function of a shield area and a heat emissive electrical component area.Type: GrantFiled: May 13, 2013Date of Patent: August 9, 2016Assignee: Google Technology Holdings LLCInventors: Amber M. Pierce, Morris B. Bowers, Adam R. Cole, Srikanth V. Thiruppukuzhi
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Patent number: 9395749Abstract: A display apparatus is provided. A frame is fixed and supported at the rear of a front panel forming the front portion of the display apparatus, and a separate bracket member is not mounted on the edges of the front panel. Thus, the front exterior of the display apparatus is neatly finished, and the display screen looks bigger than it actually is.Type: GrantFiled: October 27, 2010Date of Patent: July 19, 2016Assignee: LG Electronics Inc.Inventor: Man Yong Choi
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Patent number: 9345182Abstract: An electromagnetic interference (EMI) shielded vent panel for disposition over an opening of an electronics enclosure is provided. The panel includes an electrically-conductive medium having an outer periphery supported within an electrically-conductive frame. The frame is configured as having a generally C-shaped or U-shaped cross-sectional profile, and includes an elongate end wall, and a pair of opposed side walls extending inwardly from the end wall to contact and secure the medium. Preferably, the medium includes individual cells forming a honeycomb structure. The frame is provided with a series of vertical posts extending between the opposed side walls of the frame to reduce the formation of foreign object debris caused by holes drilled in the frame to receive screws or bolts for mounting the vent panel to the opening of an electronics enclosure. The posts also provide additional structural integrity and rigidity for the frame member.Type: GrantFiled: July 15, 2014Date of Patent: May 17, 2016Assignee: Parker-Hannifin CorporationInventor: Kevin W. Finneran
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Patent number: 9042119Abstract: A lightweight radio/CD player for vehicular application is virtually “fastenerless” and includes a case and frontal interface formed of polymer based material that is molded to provide details to accept audio devices such as playback mechanisms (if desired) and radio receivers, as well as the circuit boards required for electrical control and display. The case and frontal interface are of composite structure, including an insert molded electrically conductive wire mesh screen that has been pre-formed to contour with the molding operation. The wire mesh provides EMC, RFI, BCI and ESD shielding and grounding of the circuit boards via exposed wire mesh pads and adjacent ground clips. The major components and subassemblies self-interconnect by integral guide and connection features effecting “slide lock” and “snap lock” self-interconnection. The major components and subassemblies self-ground by establishing an interference fit with exposed, resilient, embossed portions of wire mesh.Type: GrantFiled: December 9, 2013Date of Patent: May 26, 2015Assignee: Delphi Technologies, Inc.Inventor: Edgar Glenn Hassler
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Patent number: 9002288Abstract: An enclosure that has an interior space sized to receive a portable electronic device. The enclosure has a shielding layer that can shield and prevent communications between the interior space and the outside world in a first configuration. In a second configuration, communication is allowed. A signal transfer element is attached to the enclosure housing that can be moved between an isolation configuration and a communication configuration.Type: GrantFiled: January 25, 2013Date of Patent: April 7, 2015Inventor: James Patrick Reible
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Patent number: 8987610Abstract: A vent structure for electromagnetic shielding includes: a conductive shielding case having a vent formed therein: a conductive shielding duct installed on the shielding case so as to cover the vent, including a space formed perpendicular to the direction of motion of air discharged from the vent to vent the air and a discharge port connected from the space to the outside to discharge the air introduced into the space to the outside, and shielding electromagnetic waves; and an EMI (Electro Magnetic Interference) gasket installed at a bonding surface between the shielding case and the shielding duct, and electrically connecting the shielding case and the shielding duct.Type: GrantFiled: May 8, 2012Date of Patent: March 24, 2015Assignee: Electronics and Telecommunications Research InstituteInventors: Ui-Jung Kim, Kwang-Uk Chu, Jong-Kyu Kim, Dae-Heon Lee
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Publication number: 20150060131Abstract: A homogeneous EMI shielded vent panel is provided. The vent panel has an interior porous section and an exterior frame for attachment to an opening of an electronic enclosure. The vent panel can be fabricated using selective laser sintering technology to avoid the use of multiple parts and components which can generate harmful foreign object debris during fabrication and mounting of the vent panel.Type: ApplicationFiled: July 15, 2014Publication date: March 5, 2015Inventor: Stephen J. Coppola
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Publication number: 20150060130Abstract: An electromagnetic interference (EMI) shielded vent panel for disposition over an opening of an electronics enclosure is provided. The panel includes an electrically-conductive medium having an outer periphery supported within an electrically-conductive frame. The frame is configured as having a generally C-shaped or U-shaped cross-sectional profile, and includes an elongate end wall, and a pair of opposed side walls extending inwardly from the end wall to contact and secure the medium. Preferably, the medium includes individual cells forming a honeycomb structure. The frame is provided with a series of vertical posts extending between the opposed side walls of the frame to reduce the formation of foreign object debris caused by holes drilled in the frame to receive screws or bolts for mounting the vent panel to the opening of an electronics enclosure. The posts also provide additional structural integrity and rigidity for the frame member.Type: ApplicationFiled: July 15, 2014Publication date: March 5, 2015Inventor: Kevin W. Finneran
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Patent number: 8963021Abstract: An electromagnetic interference shield includes a shell body and a magnetic material layer formed on the shell body. A number of holes are defined in the shell body. A number of through holes are defined in the magnetic material layer aligned with the holes. An electronic device having the electromagnetic interference shield is also provided.Type: GrantFiled: May 21, 2013Date of Patent: February 24, 2015Assignee: Hon Hai Precision Industry Co., Ltd.Inventor: Chih-Hao Lin
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Patent number: 8964385Abstract: An apparatus is provided in one example embodiment and includes a faceplate having a plurality of slots arranged on a front portion of the faceplate, a top plate attached to a top portion of the faceplate, and a screen attached to the faceplate and the top plate. A channel may be disposed behind the faceplate and between a bottom surface of the top portion of the faceplate, a bottom surface of the top plate and a top surface of the screen. The screen may include a plurality of openings. In a specific embodiment, the apparatus may be removably attached to a removable line card of a switch. In a specific embodiment, air may be guided through the slots, by a fan operating behind the apparatus, along the channel and through the plurality of openings to one or more heat generating components on the line card.Type: GrantFiled: October 5, 2012Date of Patent: February 24, 2015Assignee: Cisco Technology, Inc.Inventors: Mandy Hin Lam, Phillip S. Ting, Susheela Nanjunda Rao Narasimhan
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Patent number: 8809697Abstract: An electronics enclosure is disclosed that provides passive cooling of electronic components while reducing electromagnetic interference (EMI) emissions. The electronics enclosure includes an electronics assembly with at least one electronic component and a heat sink coupled to the electronics assembly. The heat sink has a base portion configured to thermally couple to the at least one electronic component when the heat sink is coupled to the electronic assembly. The electronics enclosure also includes a conductive enclosure forming an enclosed volume around the electronics assembly. The enclosure has a first opening configured to fit around the heat sink and at least one second opening. All non-conductive passages from the volume to the external environment have at least one cross-sectional opening having a continuous conductive perimeter with a maximum linear length within the opening of less than one quarter wavelength of a determined maximum shielding frequency.Type: GrantFiled: May 5, 2011Date of Patent: August 19, 2014Assignee: CareFusion 303, Inc.Inventors: David H. Nicol, Michael Dugan Joyce, Brendan Burgess
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Patent number: 8779301Abstract: A housing for use in a monitoring system having at least one monitoring module includes a shell defining an interior cavity. At least one opening is defined in the shell, and the at least one opening is in flow communication with the interior cavity. The housing includes at least one gasket coupled to the shell about an outer perimeter of the at least one opening. The at least one gasket facilitates insulating the interior cavity from electromagnetic radiation when the at least one monitoring module is positioned within the housing.Type: GrantFiled: September 3, 2010Date of Patent: July 15, 2014Assignee: General Electric CompanyInventors: Bryan Shadel, Michael Alan Tart, Sean Kelly Summers, Lysle Rollan Turnbeaugh, Han Tran, Mitchell Dean Cohen, Steven Thomas Clemens
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Patent number: 8759693Abstract: An enclosure includes a sidewall defining a number of first vents and a shield apparatus installed to the sidewall. The shield apparatus includes a shield plate spaced from the sidewall. A distance between the sidewall and the shield plate is greater than a size of the first vent. The shield plate defines a number of second vents respectively aligning with the first vents.Type: GrantFiled: September 4, 2012Date of Patent: June 24, 2014Assignee: Hon Hai Precision Industry Co., Ltd.Inventors: Cheng-Hsiu Yang, Po-Chuan Hsieh
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Patent number: 8760859Abstract: Electromagnetically shielded portable storage devices are disclosed. One such device includes an electromagnetically shielded enclosure having an interior volume, the electromagnetically shielded enclosure including a plurality of shielded walls and sized to be manually carried by a person. The interior volume of the enclosure is isolated from high-frequency electromagnetic energy generated external to the enclosure. The device includes at least one storage device positioned within the interior volume, and at least one communicative connection extending from the at least one storage device to a communicative socket accessible external to the electromagnetically shielded enclosure. The at least one communicative connection is configured to allow access to the storage device by a computing system external to the electromagnetically shielded enclosure.Type: GrantFiled: May 3, 2011Date of Patent: June 24, 2014Assignee: Emprimus, LLCInventors: Greg Fuchs, Gale Nordling, George Anderson, David Blake Jackson
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Patent number: 8742267Abstract: An electromagnetic interference shielding assembly for use in an electronic device is disclosed. The electronic device includes a circuit board and an alternating current cable including one end connected to the circuit. The electromagnetic interference assembly includes an electromagnetic interference shielding plate. The circuit board is mounted on the electromagnetic interference shielding plate. The alternating current cable includes a segmental portion arranged adjacent to the electromagnetic interference shielding plate. The segmental portion extends substantially parallel to the electromagnetic interference shielding plate. The electromagnetic interference shielding plate defines a plurality of slots each extending in a direction perpendicular to an extending direction of the segmental portion of the alternating current cable. The parallel slots, as a whole, extend along the extending direction of the segmental portion and spatially corresponding to the segmental portion.Type: GrantFiled: August 28, 2012Date of Patent: June 3, 2014Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.Inventor: Hong Li
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Patent number: 8681507Abstract: A lightweight radio/CD player for vehicular application is virtually “fastenerless” and includes a case and frontal interface formed of polymer based material that is molded to provide details to accept audio devices such as playback mechanisms (if desired) and radio receivers, as well as the circuit boards required for electrical control and display. The case and frontal interface are of composite structure, including an insert molded electrically conductive wire mesh screen that has been pre-formed to contour with the molding operation. The wire mesh provides EMC, RFI, BCI and ESD shielding and grounding of the circuit boards via exposed wire mesh pads and adjacent ground clips. The major components and subassemblies self-interconnect by integral guide and connection features effecting “slide lock” and “snap lock” self-interconnection. The major components and subassemblies self-ground by establishing an interference fit with exposed, resilient, embossed portions of wire mesh.Type: GrantFiled: January 6, 2012Date of Patent: March 25, 2014Assignee: Delphi Technologies, Inc.Inventor: Edgar Glenn Hassler
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Patent number: 8507808Abstract: A shielding assembly includes a frame including a main body, the main body defining at least one retaining hole; and a cover including a main board, the main panel including retaining elements and rims. The number of the retaining elements is the same as the number of the retaining holes, each rim protruding outwardly from a distal end of one of retaining elements. Each retaining element passes through one of the retaining holes, and each rim is latched with the portions of the frame surrounding the retaining holes.Type: GrantFiled: March 1, 2011Date of Patent: August 13, 2013Assignees: Shenzhen Futaihong Precision Industry Co., Ltd., FIH (Hong Kong) LimitedInventors: Li-Zhi Xiong, Liang Su, Wen-Jun Liu, Cheng-Rui Liu, Jun-Sheng Qiao, Pei-Chin Kuo
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Patent number: 8502087Abstract: A filler panel for an electronics shelf is provided. The electronics shelf includes a plurality of slots each configured to receive an electronic device. The filler panel includes a non-conductive main body that includes a front wall, a back wall, a top wall, a bottom wall and a single side wall. The front wall, back wall, top wall and bottom wall are configured to fill a width of a slot of the electronics shelf. The side wall is configured to extend into a depth of the slot, The filler panel also includes an electromagnetic shielding portion comprising a conductive material that is coupled to the main body. The main body further includes one or more vents positioned in each of the top wall and the bottom wall, the vents configured to allow air flow though the main body.Type: GrantFiled: September 2, 2010Date of Patent: August 6, 2013Assignee: Fujitsu LimitedInventors: Roberto Medrano, Mahesh Mistry, Albert Pedoeem, Larry Fox, Paul V. Shannon, Jimmy O. Goodwin
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Publication number: 20130175082Abstract: A vent structure for electromagnetic shielding includes: a conductive shielding case having a vent formed therein: a conductive shielding duct installed on the shielding case so as to cover the vent, including a space formed perpendicular to the direction of motion of air discharged from the vent to vent the air and a discharge port connected from the space to the outside to discharge the air introduced into the space to the outside, and shielding electromagnetic waves; and an EMI (Electro Magnetic Interference) gasket installed at a bonding surface between the shielding case and the shielding duct, and electrically connecting the shielding case and the shielding duct.Type: ApplicationFiled: May 8, 2012Publication date: July 11, 2013Applicant: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTEInventors: Ui-Jung KIM, Kwang-Uk CHU, Jong-Kyu KIM, Dae-Heon LEE
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Patent number: 8466376Abstract: An enclosure of an electronic device includes a ventilation plate. The ventilation plate is a grid including a number of crisscrossed connection bars and a number of through holes defined by the connection bars. A tab is formed at each of the connection bars bounding each of the through holes. The tabs are substantially angled from a plane of the grid to elongate a path electromagnetic signals must travel to pass through the ventilation plate. The enclosure with the shields can shield the electronic device from EMI.Type: GrantFiled: August 25, 2010Date of Patent: June 18, 2013Assignee: Hon Hai Precision Industry Co., Ltd.Inventors: Po-Chuan Hsieh, Yu-Chang Pai, Chien-Hung Liu
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Patent number: 8404982Abstract: An electronic apparatus includes: a housing 100 formed of a conductive material; and a digital processing circuit 102 which is disposed in the housing 100 and which radiates an electromagnetic wave. The housing 100 includes a ventilation part 101 through which air is ventilated into and out of the housing 100. The ventilation part 101 is divided into a plurality of holes by a conductive member. When a maximum length in one of the vertical direction and the horizontal direction of one of the plurality of holes that has the largest opening area is R m, and when the frequency of the electromagnetic wave radiated from the digital processing circuit 102 is A Hz, a relationship expressed as 3.0×108/A×½>R is satisfied.Type: GrantFiled: October 14, 2010Date of Patent: March 26, 2013Assignee: Panasonic CorporationInventor: Terutoshi Tsunematsu
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Patent number: 8389873Abstract: An enclosure of an electronic device includes a plate. The plate defines a number of through holes. A number of shields extend from the plate corresponding to the through holes. Each shield extends outwards from the outer surface of the plate, surrounding and partly covering a corresponding through hole. The enclosure with the shields can shield the electronic device from EMI.Type: GrantFiled: July 21, 2010Date of Patent: March 5, 2013Assignee: Hon Hai Precision Industry Co., Ltd.Inventors: Po-Chuan Hsieh, Yu-Chang Pai, Chien-Hung Liu, Shou-Kuo Hsu