Particular Shape Patents (Class 174/390)
  • Patent number: 10506732
    Abstract: The disclosure relates to a control device in a motor vehicle. The control device includes a housing cover with a peripheral edge region, and a planar, electrical connecting apparatus with integrated conductor tracks. The housing cover, in the edge region, is cohesively connected at least to the connecting apparatus and forms a cavity with the connecting apparatus. The control device also includes at least one electronic component within the cavity. The connecting apparatus electrically connects the at least one electronic component to electronic components outside the cavity. The housing cover is encapsulated by injection molding in a media-tight manner by a polymer beyond the peripheral edge region.
    Type: Grant
    Filed: March 14, 2018
    Date of Patent: December 10, 2019
    Assignee: VITESCO TECHNOLOGIES GERMANY GMBH
    Inventors: Frieder Wittmann, Karin Beart, Johannes Bock, Thomas Schmidt, Bernhard Schuch
  • Patent number: 10470325
    Abstract: The disclosure relates to a control device in a motor vehicle. The control device includes a housing cover with a peripheral edge region, and a planar, electrical connecting apparatus with integrated conductor tracks. The housing cover, in the edge region, is cohesively connected at least to the connecting apparatus and forms a cavity with the connecting apparatus. The control device also includes at least one electronic component within the cavity. The connecting apparatus electrically connects the at least one electronic component to electronic components outside the cavity. The peripheral edge region is encapsulated by injection molding in a media-tight manner by a polymer at least in the region of the connecting seam between the housing cover and the connecting apparatus.
    Type: Grant
    Filed: March 14, 2018
    Date of Patent: November 5, 2019
    Assignee: CPT ZWEI GMBH
    Inventors: Frieder Wittmann, Karin Beart, Johannes Bock, Thomas Schmidt, Bernhard Schuch
  • Patent number: 10092043
    Abstract: A bra to enable monitoring of a wearer's heart rate. There is provided a bra comprising a left breast cup; a right breast cup; and a center gore attached between the left and right breast cups. Each of the left and right breast cups comprises a lower edge region which is shaped to follow the shape of a wearer's breast and is shaped to be positioned below a wearer's breast to support the breast, and wherein the lower edge region comprises an electrically conductive fabric layer on the inner surface for contact with the user's skin. The center gore comprises an attachment area for attachment of a transmitter and an electrically conductive pathway from the electrically conductive fabric of the lower regions of the breast cups to the attachment area. Bra components for providing electrical pathways are also provided.
    Type: Grant
    Filed: May 21, 2015
    Date of Patent: October 9, 2018
    Assignee: Regina Miracle International (Group) Limited
    Inventor: Wenbo Zhang
  • Patent number: 9704087
    Abstract: An apparatus and method is provided to shield contactless portable electronic consumer devices such as radio frequency identification devices (RFID), tokens, mini-cards, key fobs, cellular phones, smartcards, etc. from wireless interrogation. In one embodiment, a contactless portable consumer device which includes a first antenna is shielded from unauthorized wireless interrogation with a radio frequency (RF) shield. The RF shield includes electrically conductive, non-ferromagnetic material and is configured to prevent unauthorized data transfer between a second antenna external to the portable consumer device and the first antenna.
    Type: Grant
    Filed: December 11, 2008
    Date of Patent: July 11, 2017
    Assignee: Visa USA Inc.
    Inventors: Ayman Hammad, Phil Dixon
  • Patent number: 9682247
    Abstract: The body cavity cancer treatment apparatus generates the magnetic field for use in a combined “low temperature hyperthermia” and ionizing radiation and/or chemotherapy cancer treatment protocol. Unlike other competing systems, the body cavity cancer treatment apparatus does not directly kill or ablate the cancer cells with killing temperatures rather, the body cavity cancer treatment apparatus stresses the cancer and cancer stem cells by keeping them at a nominal 42° C. for some period of time via the heating of nano-particles that have been infused into the bladder, using the generated magnetic field.
    Type: Grant
    Filed: July 13, 2015
    Date of Patent: June 20, 2017
    Assignee: ENDOMAGNETICS LIMITED
    Inventors: Michael Edward Susedik, Karl Michael Frantz, Daniel Bernard McKenna, Martin Albert Huisjen, Carolyn Perry Adams
  • Patent number: 9541527
    Abstract: A magnetic device with a three-dimensional wave structure is provided, which contains magnetic elements and a signal receiver. The magnetic element is nano/micron structure with magnetic anisotropy. The magnetic element is formed on a substrate with three-dimensional wave structure. When a magnetic substance approaches to the magnetic element, the magnetic substance produces a corresponding magnetoresistance signal for the magnetic element. Through the measurement of the magnetoresistance of the three-dimensional wave structure, and the presence or absence of the magnetic substance can be detected. An external magnetic field is used to change the magnetization configuration of the three-dimensional wave structure to capture the magnetic substance by adsorbing the magnetic substance to a magnetic pole of the three-dimensional wave structure.
    Type: Grant
    Filed: October 27, 2015
    Date of Patent: January 10, 2017
    Assignee: NATIONAL TSING HUA UNIVERSITY
    Inventors: Zung-Hang Wei, Jen-Hwa Hsu, Ching-Ray Chang, Hao-Ting Huang
  • Patent number: 9209587
    Abstract: A method and apparatus for minimizing the degradation of power in a free electron laser (FEL) generating terahertz (THz) radiation. The method includes inserting an absorber ring in the FEL beam path for absorbing any irregular THz radiation and thus minimizes the degradation of downstream optics and the resulting degradation of the FEL output power. The absorber ring includes an upstream side, a downstream side, and a plurality of wedges spaced radially around the absorber ring. The wedges form a scallop-like feature on the innermost edges of the absorber ring that acts as an apodizer, stopping diffractive focusing of the THz radiation that is not intercepted by the absorber. Spacing between the scallop-like features and the shape of the features approximates the Bartlett apodization function. The absorber ring provides a smooth intensity distribution, rather than one that is peaked on-center, thereby eliminating minor distortion downstream of the absorber.
    Type: Grant
    Filed: March 19, 2015
    Date of Patent: December 8, 2015
    Assignee: JEFFERSON SCIENCE ASSOCIATES, LLC
    Inventors: George Herman Biallas, Cornelis Apeldoorn, Gwyn P. Williams, Stephen V. Benson, Michelle D. Shinn, John D. Heckman
  • Patent number: 9042119
    Abstract: A lightweight radio/CD player for vehicular application is virtually “fastenerless” and includes a case and frontal interface formed of polymer based material that is molded to provide details to accept audio devices such as playback mechanisms (if desired) and radio receivers, as well as the circuit boards required for electrical control and display. The case and frontal interface are of composite structure, including an insert molded electrically conductive wire mesh screen that has been pre-formed to contour with the molding operation. The wire mesh provides EMC, RFI, BCI and ESD shielding and grounding of the circuit boards via exposed wire mesh pads and adjacent ground clips. The major components and subassemblies self-interconnect by integral guide and connection features effecting “slide lock” and “snap lock” self-interconnection. The major components and subassemblies self-ground by establishing an interference fit with exposed, resilient, embossed portions of wire mesh.
    Type: Grant
    Filed: December 9, 2013
    Date of Patent: May 26, 2015
    Assignee: Delphi Technologies, Inc.
    Inventor: Edgar Glenn Hassler
  • Patent number: 9035199
    Abstract: A receptacle assembly includes a hollow conductive cage with a front end and an opening to an interior portion of the cage. The opening is configured to receive a module assembly therein. The cage has a bottom with a bottom opening communicating with the interior portion, and the bottom is configured to be joined to a circuit board. A layered EMI shield member is provided between the bottom of the cage and the circuit board and the shield member extends completely around the bottom opening of the cage. The EMI shield member is formed as a flexible, low-cost assembly that utilizes a pair or insulative layers that flank a conductive layer.
    Type: Grant
    Filed: May 19, 2011
    Date of Patent: May 19, 2015
    Assignee: Molex Incorporated
    Inventors: Kenneth F. Janota, Eran J. Jones, Marlon C. Daniels, Michael Alan Johnston
  • Publication number: 20150116178
    Abstract: A combined RFID and wireless charging electromagnetic wave absorber, a combined RFID and wireless charging wireless antenna including same, and a method for manufacturing same. The electromagnetic wave absorber not only performs separate functions of RFID and wireless charging and provides stable operating characteristics, but also has a structure in which an electromagnetic wave absorber and a wireless antenna are integrally coupled so as to maximize the respective performance thereof. Despite a structure in which the two functions of RFID and wireless charging are combined, the thickness of the antenna can be reduced, such that it can be very useful when adopted in and applied to a mobile device, thereby contributing greatly to reducing the thickness of a smartphone.
    Type: Application
    Filed: December 20, 2012
    Publication date: April 30, 2015
    Inventors: Ki Hun Kim, Yong Bok Park
  • Patent number: 8969737
    Abstract: Electrical components such as integrated circuits may be mounted on a printed circuit board. To prevent the electrical components from being subjected to electromagnetic interference, a radio-frequency shielding structure may be mounted over the electrical components. The radio-frequency shielding structure may be formed from a printed circuit that includes a ground plane such as a flex circuit or rigid printed circuit board that includes at least one blanket layer of metal. The printed circuit board to which the electrical components are mounted may include a recess in which the electrical components are mounted. Additional components may be mounted to the interior and exterior surface of the radio-frequency shielding structure. The radio-frequency shielding structure may be formed from a flex circuit that has slits at its corners to accommodate folding.
    Type: Grant
    Filed: October 1, 2012
    Date of Patent: March 3, 2015
    Assignee: Apple Inc.
    Inventors: Andrew B. Just, Trent Weber, Shigefumi Honjo
  • Patent number: 8933346
    Abstract: The present invention is directed to an electromagnetic interference (EMI) shielding device. The EMI shielding device may be formed of a material (ex.—Beryllium Copper) having a thickness which allows the shielding device to provide a desired range of compression. Further, the EMI shielding device may be constructed for accommodating tolerances and compression forces which may be encountered in various implementation environments. Further, the EMI shielding device may be sized and shaped for promoting compatibility of the EMI shielding device with Surface Mount Technology (SMT) processes.
    Type: Grant
    Filed: September 28, 2010
    Date of Patent: January 13, 2015
    Assignee: Rockwell Collins, Inc.
    Inventors: John F. Kramer, Joseph M. Strenecky, Nathaniel T. Gould
  • Publication number: 20140360772
    Abstract: A deflectable gasket assembly for EMI shielding and environmental sealing is described. The gasket assembly is formed from an electrically-conductive mesh sheet positioned between adjacent conductive surfaces. A gasket is provided at the outer boundaries of the mesh sheet for environmental protection. The edge of the gasket has a branched sealing element extending above and below the gasket assembly for contacting the adjacent surfaces. The branched sealing element is deformable and can be used on external aircraft electronic components.
    Type: Application
    Filed: March 12, 2013
    Publication date: December 11, 2014
    Applicant: Parker-Hannifin Corporation
    Inventors: Stephen J. Coppola, Michael H. Bunyan, George R. Watchko
  • Patent number: 8681507
    Abstract: A lightweight radio/CD player for vehicular application is virtually “fastenerless” and includes a case and frontal interface formed of polymer based material that is molded to provide details to accept audio devices such as playback mechanisms (if desired) and radio receivers, as well as the circuit boards required for electrical control and display. The case and frontal interface are of composite structure, including an insert molded electrically conductive wire mesh screen that has been pre-formed to contour with the molding operation. The wire mesh provides EMC, RFI, BCI and ESD shielding and grounding of the circuit boards via exposed wire mesh pads and adjacent ground clips. The major components and subassemblies self-interconnect by integral guide and connection features effecting “slide lock” and “snap lock” self-interconnection. The major components and subassemblies self-ground by establishing an interference fit with exposed, resilient, embossed portions of wire mesh.
    Type: Grant
    Filed: January 6, 2012
    Date of Patent: March 25, 2014
    Assignee: Delphi Technologies, Inc.
    Inventor: Edgar Glenn Hassler
  • Patent number: 8563875
    Abstract: An electromagnetic shielding layer comprising at least one conductive layer and a carbon nanotube film structure, the conductive layer being disposed on the carbon nanotube film structure, and comes in contact with the carbon nanotube film structure electrically. A method for making the electromagnetic shielding layer includes the steps of: (a) providing an electronic element, the electronic element having a surface; (b) fabricating at least one carbon nanotube film; (c) forming a carbon nanotube film structure on the surface of the electronic element; and (d) forming a conductive layer on the carbon nanotube film structure, then obtaining an electromagnetic shielding layer on the surface of the electronic element.
    Type: Grant
    Filed: September 25, 2008
    Date of Patent: October 22, 2013
    Assignees: Tsinghua University, Hon Hai Precision Industry Co., Ltd.
    Inventors: Feng-Yuen Dai, Chi-Chuang Ho, Ji-Hong Pan, Yong Zheng, Kai-Li Jiang, Liang Liu
  • Publication number: 20130233611
    Abstract: One embodiment of a molded shield can include a cavity to conform to and receive an electrical component, a slit to conform to and receive a metal frame and a metal layer coupled to the top and lateral sides of the molded shield. In one embodiment, the molded shield can be formed from silicon and can include material to enhance electrical conductivity. The molded shield can couple to the metal frame which in turn can be coupled to ground with the resulting configuration acting to reduce electrical emissions. The molded shield can transfer heat away from the electrical component through conduction.
    Type: Application
    Filed: September 28, 2012
    Publication date: September 12, 2013
    Applicant: APPLE INC.
    Inventors: Shayan Malek, Scott A. Myers, Michael B. Wittenberg
  • Patent number: 8481867
    Abstract: Compressible grounding pads with two conductor layers separated by a compressible foam layer comprise: (A) A first conductor layer, e.g., copper foil; (B) A first adhesive layer in direct contact with a part of the first conductor layer, the first conductor layer extending beyond the first adhesive layer; (C) A foam layer in direct contact with one facial side of the first adhesive layer; (D) A second adhesive layer in direct contact with the opposite facial side of foam layer; (E) A second conductor layer, e.g., copper foil, in direct contact with the second adhesive layer, the second conductor layer extending beyond the second adhesive layer such that the second conductor layer joins with the first conductor layer; (F) An electrically conductive third adhesive layer in direct contact with the facial surface opposite the facial surface that is in direct contact with the second conductor layer; and (G) An optional release liner in direct contact with the third adhesive layer.
    Type: Grant
    Filed: July 20, 2011
    Date of Patent: July 9, 2013
    Assignee: Brady Converting AB
    Inventor: Alf Martin Book
  • Patent number: 8461667
    Abstract: A semiconductor device includes a semiconductor chip, and a guard ring made of an electrically conductive material and arranged between electrodes on the semiconductor chip and side edges of the semiconductor chip, the guard ring being divided by isolating sections on the semiconductor chip.
    Type: Grant
    Filed: January 21, 2010
    Date of Patent: June 11, 2013
    Assignee: Sumitomo Electric Device Innovations, Inc.
    Inventors: Takeshi Hishida, Tsutomu Igarashi
  • Publication number: 20130075151
    Abstract: An electro-magnetic wave filtering and impeding board is made of metal and includes a first side and a second side. The first side has multiple linear slots and the second side includes multiple concaved geometric holes which communicate with the linear slots. The electro-magnetic waves are impeded by the metallic material and weakened when passing through the linear slots and the geometric holes so as to impede the electro-magnetic waves.
    Type: Application
    Filed: September 23, 2011
    Publication date: March 28, 2013
    Inventors: Po-Ming CHEN, Shih-Ming Lu
  • Publication number: 20130008708
    Abstract: A conductive multi-fiber of aluminum/aluminum alloy monofilaments each of which has been completely and substantially uniformly coated with at least one layer of corrosion-resistant metal or metal alloy materials. The monofilaments are less than 150 microns in diameter that have been drawn separately, then bundled together and lightly twisted, for transport through a low tension electroplating process. The multi-fiber creates an RFI/EMI shielding material with low DC resistance and low weight. The metallization process includes a zincating process that prepares the monofilaments for electroplating and an electroplating process that incrementally builds up the metallized layers.
    Type: Application
    Filed: July 3, 2012
    Publication date: January 10, 2013
    Inventor: Thomas F. Burke
  • Patent number: 8179686
    Abstract: Including a wiring board having an electronic component mounted at least on a first surface, a resin applied at least between the electronic component and the wiring board, and a through-hole provided in a region corresponding to the mounting position of the electronic component in the wiring board, a protrusion is formed on the wiring board so as to overlap at least with the electronic component, around a region corresponding to the mounting position of the electronic component.
    Type: Grant
    Filed: October 28, 2008
    Date of Patent: May 15, 2012
    Assignee: Panasonic Corporation
    Inventors: Shigeaki Sakatani, Atsushi Yamaguchi, Koso Matsuno, Hidenori Miyakawa
  • Publication number: 20120080209
    Abstract: A shielding for a cable component that comprises a base material that is non-conductive and a plurality of conductive particles suspended in or disposed on an outer surface of the base material. The conductive particles are at least one of substantially the same size, the same shape, the same conductive material, different sizes, different shapes, and different conductive materials, such that selection of the conductive particles tunes the frequency bandwidth for effective shielding.
    Type: Application
    Filed: September 27, 2011
    Publication date: April 5, 2012
    Applicant: GENERAL CABLE TECHNOLOGIES CORPORATION
    Inventors: Matthew S. MCLINN, Jared D. WEITZEL, David P. CAMP, II, Scott M. BROWN
  • Publication number: 20120031663
    Abstract: A helical fine structure of the present invention is characterized by including: a phytoplankton having a helical shape and selected from a group of cyanobacteria called Spirulina; and a surface modification layer formed on the phytoplankton. The surface modification layer includes at least one metal plating layer. Thereby, the helical fine structure can be utilized as an electric-wave shield or an absorber. Moreover, a method for producing the helical fine structure is characterized in that a prestep of a step of forming the surface modification layer on the phytoplankton having a helical shape includes a washing step with an organic solvent to remove an outer membrane from a surface of the phytoplankton.
    Type: Application
    Filed: April 19, 2010
    Publication date: February 9, 2012
    Inventors: Tomokazu Iyoda, Kaori Ito, Atsushi Yamada
  • Publication number: 20120020039
    Abstract: A surface-mounted shielded multicomponent assembly, comprising a wafer on which several electronic components are assembled; an insulating layer conformally deposited on the structure with a thickness smaller than the height of the electronic components, comprising at least one opening emerging on a contact of said wafer; a conductive shielding layer covering the insulating layer and said at least one opening; and a resin layer covering the conductive layer.
    Type: Application
    Filed: June 17, 2011
    Publication date: January 26, 2012
    Applicant: STMICROELECTRONICS (GRENOBLE) SAS
    Inventors: Romain Coffy, Jean-François Sauty
  • Patent number: 8027168
    Abstract: An electrical assembly comprises a mounting bracket lift assembly and an electrical center. The electrical center is attached to the mounting bracket lift assembly for plugging wiring harness end connectors into the electrical center. The electrical center comprises a lower housing, a circuit board sub-assembly, an upper housing, electrical components such as fuses and relays that plug into the upper housing and a cover. The circuit board sub-assembly includes a power bus bar that provides a power path for the various electrical circuits of the vehicle via the circuit components carried on the circuit board. Three power bus bars that are configured, oriented and located to reduce the foot print of the electrical center and/or to improve the dissipation of heat generated by the electrical center are disclosed.
    Type: Grant
    Filed: August 13, 2008
    Date of Patent: September 27, 2011
    Assignee: Delphi Technologies, Inc.
    Inventors: Joseph Matthew Senk, Joseph Howard Gladd, Gino M. Roncone, John B. Kirk
  • Patent number: 7909902
    Abstract: Described herein are various embodiments of a modified hexagonal perforated pattern and objects within which the pattern is formed. For example, according to one representative embodiment, an apparatus includes an object and a perforated pattern formed in the object. The perforated pattern includes a plurality of perforations through which matter is flowable. Each of the perforations includes a modified hexagonal shape including a hexagon having six rounded corners.
    Type: Grant
    Filed: June 12, 2008
    Date of Patent: March 22, 2011
    Assignee: International Business Machines Corporation
    Inventors: Eric A. Eckberg, James D. Gerken, Maurice F. Holahan, Gerard F. Muenkel, Joseph D. Rico, H. Burt Stone
  • Publication number: 20100212952
    Abstract: An electromagnetic protection sheath made of textile (10) is formed by conductive filaments extending in a first direction (X) and non-conductive filaments interlaced with the conductive filaments. Use in particular for shielding cables in aeronautical applications.
    Type: Application
    Filed: May 7, 2008
    Publication date: August 26, 2010
    Applicant: FEDERAL MOGUL SYSTEMS PROTECTION
    Inventors: Rafik Abdelmoula, Patrick Thomas, Lucia Della Putta, Thierry Rodrigues, Amelie Simoens
  • Patent number: 7626128
    Abstract: A conductive film has transparency and a high level of electrical conductivity, which is used for an electromagnetic interference film hardly causing a moiré phenomenon, and the like. To achieve the above-mentioned aim, the following disclosure is disclosed. A conductive film in which a conductive portion of a random network structure is present on at least one surface of a base film, a line width of the conductive portion composing the network structure is 30 ?m or less, an area of portions where the conductive portion is not present is 50% or more with respect to an area of the conductive film, and an average of ratios of a major axis length to a minor axis length of an area surrounded by the network of the conductive portion, in which the base film is exposed, is larger than 1 and is equal to or less than 3.5.
    Type: Grant
    Filed: October 6, 2005
    Date of Patent: December 1, 2009
    Assignee: Toray Industries, Inc.
    Inventors: Yasushi Takada, Shotaro Tanaka, Junpei Ohashi
  • Publication number: 20080308289
    Abstract: A cable for high speed data communications and method of manufacturing the cable, the cable including a first inner conductor enclosed by a first dielectric layer and a second inner conductor enclosed by a second dielectric layer, the inner conductors and the dielectric layers twisted in a rotational direction at a periodic rate along and about a longitudinal axis and conductive shield material wrapped in the rotational direction at the periodic rate along and about the longitudinal axis around the inner conductors and the dielectric layers, including overlapped wraps at the periodic rate along and about the longitudinal axis.
    Type: Application
    Filed: June 12, 2007
    Publication date: December 18, 2008
    Inventors: Bruce R. Archambeault, Samuel R. Connor, Daniel N. de Araujo, Joseph C. Diepenbrock, Bhyrav M. Mutnury
  • Publication number: 20080257599
    Abstract: A conductive pattern basically has a substantially polygonal outline shape which is a polygon and can have a high peak value of the electromagnetic wave absorption amount as compared to a case when the conductive pattern has a circular outline shape. Thus, the conductive pattern is basically a polygon and at least one corner portion is shaped in curve. This reduces or even minimizes the shift of the frequency at which the absorption amount becomes a peak value by the polarization direction of the electromagnetic wave. Accordingly, in at least one embodiment, it is possible to realize an electromagnetic absorber having an excellent electromagnetic wave absorption characteristic exhibiting a high peak value of the absorption amount of the electromagnetic wave and a small shift of frequency at which the absorption amount becomes a peak value by the polarization direction of the electromagnetic wave.
    Type: Application
    Filed: September 29, 2005
    Publication date: October 23, 2008
    Applicant: NITTA CORPORATION
    Inventors: Masato Matsushita, Takahiro Yoshida, Haruhide Go, Yoshiharu Kiyohara, Makoto Maezawa, Shinichi Sato
  • Patent number: 7358447
    Abstract: An EMI shield for personal computers, cellular telephones, and other electronic devices is constructed from thermoformable polymeric material which is then metallized on all surfaces by vacuum metallization techniques to provide an inexpensive, lightweight, yet effective EMI shield.
    Type: Grant
    Filed: September 10, 2003
    Date of Patent: April 15, 2008
    Assignee: WaveZero, Inc.
    Inventor: John F. Gabower
  • Publication number: 20080053695
    Abstract: Disclosed is an electromagnetic wave absorber, which is obtained by attaching a three-dimensional open-cell type metal porous body to an electromagnetic wave-reflecting surface and filling the pores of the three-dimensional open-cell type metal porous body with an electromagnetic wave-absorbing material.
    Type: Application
    Filed: August 23, 2007
    Publication date: March 6, 2008
    Inventor: Jae-Chul Choi
  • Patent number: 7242590
    Abstract: An electronic instrument system uses a “DualPlay” concept comprising first and second mutually-exclusive modes of operation. The system includes an instrument module having first and second communications channels, each for linking the instrument module to one or more processors. The first communications channel comprises a first connector attached to the instrument module for mating to a backplane connector electrically connected to traces. The system operates in the first mode when the instrument module communicates through the first communications channel. Additionally, the system operates in the second mode when the instrument module communicates through the second communications channel, the first connector is disengaged from the backplane connector and the electronic instrument is not communicating through the first communications channel.
    Type: Grant
    Filed: March 15, 2006
    Date of Patent: July 10, 2007
    Assignee: Agilent Technologies, Inc.
    Inventors: Boon Leong Yeap, Shiew Foe Foo, Cheo Bong Lim, Eng Su Tay
  • Patent number: 7214889
    Abstract: An electrically continuous conformal EMI protective shield for adhering directly to and conforming with surfaces of a printed circuit board is disclosed. The conformal EMI shield includes a thermally conductive dielectric coating adhering directly to surfaces of the printed circuit board to provide an electrically nonconductive, thermally conductive, contiguous coating that covers all such printed circuit board surfaces. The conformal EMI shield also includes a conductive coating adhering directly to surfaces of the dielectric coating to provide an electrically conductive layer that prevents electromagnetic emissions from passing through the conformal EMI protective shield.
    Type: Grant
    Filed: July 28, 2003
    Date of Patent: May 8, 2007
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventor: Paul H. Mazurkiewicz
  • Patent number: 7186928
    Abstract: In a shielding configuration of a chip part, a shielding effect and a cooling effect are sufficiently obtained at the same time. In an electronic device including a chip part to be disclosed, a shielding conductor includes a ceiling plate section covering the chip part and side plate sections which are formed to be united with the ceiling plate section and to be at a position lower than the ceiling plate section and which are arranged on both sides in a horizontal direction of the chip part, and openings are formed in both side ends in a front-rear direction of the shielding conductor to open both sides in a front-rear direction of the chip part, and the side plate sections of the shielding conductor are electrically connected via a plurality of shielding bumps in the front-rear direction to a ground layer pattern of a mounting substrate.
    Type: Grant
    Filed: August 1, 2003
    Date of Patent: March 6, 2007
    Assignee: NEC Corporation
    Inventors: Hideo Kikuchi, Junichi Sasaki
  • Patent number: 7183500
    Abstract: The application describes embodiments of an apparatus including a plurality of first channels, each having an inlet, an outlet, and a first path length between the inlet and the outlet, and a plurality of second channels, each having an inlet, an outlet, and a second path length between the inlet and the outlet. The second path length is different from the first path length, and each second channel is adjacent to at least one first channel. The application also describes embodiments of a process including suppressing electromagnetic radiation using a filter comprising a plurality channels, and simultaneously passively canceling noise at the outlets of the plurality of channels. Other embodiments are also described and claimed.
    Type: Grant
    Filed: June 30, 2004
    Date of Patent: February 27, 2007
    Assignee: Intel Corporation
    Inventors: Edoardo Campini, Andy Saffarian, Jerome A. Saint Cyr