Abstract: An integrated device package is disclosed. The integrated device package can include a package substrate having a plurality of contact pads on a first side of the package substrate, the plurality of contact pads configured to electrically connect to a sensor assembly. The package can include a radiation shield attached to a second side of the package substrate by way of a first adhesive, the first side opposite the second side. The package can include an integrated device die attached to the radiation shield by way of a second adhesive. The integrated device die can comprise sensitive active electronic circuitry in a sensitive active region of the integrated device die. A molding compound can be disposed over the integrated device die and the radiation shield.

Abstract: A RF (“Radio Frequency”) shielding container with an associated garment such as a jacket is described. The RF shielding container may be a pouch that holds and encapsulates an electronic mobile device such as a cell phone. The pouch is made of multiple layers of fabric including metalized layers that effectively block the reception and/or transmission of RF signals to and from the cell phone. A sealing mechanism formed on the pouch ensures the blockage of RF signals while offering ease of use while in combat. A garment such as a jacket or pants is designed to have internal pockets or cavities which can hold the RF shielding container. The RF shielding container may remain in the jacket during use, as well as when the mobile device is placed into or retrieved from the container.

Abstract: Electromagnetic wave shielding material including a conductive fiber web with multiple pores and a heat dissipation unit provided in at least some pores that is so excellent in flexibility, elasticity, and creasing/recovery that it can be changed in shape freely and brought in complete contact with a surface where the material is to be disposed even if the surface has a curved shape, uneven portions, or stepped portions, thus exhibiting excellent electromagnetic wave shielding performance and prevent deterioration thereof despite various shape changes. Since heat dissipation performance is excellent, heat generated in an electromagnetic wave source can be rapidly conducted and released. Even if parts are provided in a narrow area at high density, the material can be brought in close contact with mounted parts by overcoming a tight space between the parts and a stepped portion. The invention is employed for light, thin, short, and small or flexible devices.

Abstract: Various embodiments of the present invention relate to an electronic device comprising a shielding structure which is arranged on the periphery of an electronic component, and which has an improved heat-radiating performance. The electronic device comprises: a circuit board; a non-elastic shielding member arranged on one surface of the circuit board, the non-elastic shielding member having a concave portion and an opening formed on a part of the concave portion; a processor contained in the concave portion and arranged on the one surface so as to correspond to the opening; a first heat transfer member arranged to contact the outer surface of the processor in at least a partial area of the opening; an elastic shielding member arranged on the periphery of the opening; and a second heat transfer member arranged to contact the first heat transfer member and the elastic shielding member.

Abstract: Provided are an Electromagnetic Interference (EMI) shielding film, a circuit board including the EMI shielding film, and a preparation method for the EMI shielding film. The EMI shielding film includes a shielding layer and an adhesive film layer, wherein the shielding layer includes a first surface and a second surface opposite to each other; the second surface is a rolling uneven surface; convex conductor particles are also formed on the rolling uneven surface; and the second surface of the shielding layer is provided with the adhesive film layer, so the adhesive film layer of the EMI shielding film will extrude adhesive materials into recesses of the second surface in a lamination process, the adhesive holding capacity is increased, and delamination and blister of board is unlikely to occur.

Abstract: An assembly comprises a flexible circuit board (FCB) having a substrate with a top side, and a circuit pattern layer on the top side of the substrate. The circuit pattern layer has a connection region for facilitating electrical interconnection to the FCB, and one or more cavities extending through both the substrate and the circuit pattern layer. A first conductive layer for electro-magnetic interference (EMI) shielding is positioned on a top side of the FCB, and a second conductive layer for EMI shielding is positioned on a back side of the FCB. Electrically conductive adhesive extends through the one or more cavities for electrically connecting the first conductive layer and the second conductive layer. The electrically conductive adhesive further extends from the first conductive layer to the connection region for facilitating electrical interconnection of the first conductive layer and the second conductive layer.

Abstract: A flexible wiring circuit board includes a first insulating layer, a wire disposed at one side in a thickness direction of the first insulating layer, a second insulating layer disposed at one side in the thickness direction of the wire, a shield layer disposed at one side in the thickness direction of the second insulating layer, and a third insulating layer disposed at one side in the thickness direction of the shield layer. The shield layer includes an electrically conductive layer and two barrier layers sandwiching the electrically conductive layer therebetween in the thickness direction. The electrically conductive layer is selected from a metal belonging to a group 11, and the fourth period and the fifth period in the periodic table, and the barrier layer is selected from a metal belonging to groups 4 to 10, and the fourth to the sixth periods in the periodic table.

Abstract: A module improves a heat-releasing effect and that can be stably mounted on a mother substrate or the like. The module includes: a first component mounted on one main surface of a wiring substrate and generates heat; second components mounted on the one main surface of the wiring substrate; a sealing resin layer that seals the first component and the second components so as not to cover a top surface of the first component; and heat-dissipating parts arranged on the top surface of the first component. The height of the highest positions of the heat-dissipating parts relative to the one main surface is less than or equal to the position of a highest surface out of a surface of the sealing resin layer that is on the opposite side from the surface of the sealing resin layer that faces the one main surface.

Abstract: An enclosure includes a power flow control device to attach to a high voltage transmission line, a plurality of panels formed of metal, a shorting connection provided between each pair of panels, an electrical connection from at least one panel of the plurality of panels to the high voltage transmission line, a receiving region provided on each panel for each shorting connection, and an equipotential surface for reducing electromagnetic interference from the high voltage transmission line to internal components of the power flow control device, and from the internal components of the power flow control device to the high voltage transmission line.

Abstract: A multi-conductor interconnect for a microelectronic device incorporates multiple conductors and integrated shielding for the conductors. The multi-conductor interconnect includes first and second groups of conductors interleaved with one another within a dielectric structure. One of the groups of conductors may be coupled to a reference voltage node to provide shielding for the other group of conductors. The multi-conductor interconnect may further include a shield layer extending over some portion, or all, of the conductors of the first and second groups.

Abstract: A detection device for measuring an antenna is disclosed, wherein the detection device is provided with a probe seat made of a reflected wave absorbent material; a front end of the probe seat is provided with an extending front arm for connecting to a probe; and a rear end of the probe seat is provided with a connector, of which one end is for connecting to a detection instrument and the other end is electrically connected to the probe through the front arm, thereby when measuring an antenna, the probe seat can absorb reflected waves from the antenna to measure the quality of the antenna pattern.

Abstract: The invention relates to an additive manufacturing process (3D printing) using particles having a meltable polymer. The meltable polymer comprises a thermoplastic polyurethane polymer which has a flowing temperature (intersection of E? and E? in the DMA) of ?80° C. to <180° C. and a Shore A hardness according to DIN ISO 7619-1 of ?50 Shore A and <85 Shore A and which, at a temperature T, has a melt volume rate (melt volume rate (MVR)) according to ISO 1133 of ?5 to <15 cm3/10 min. The invention also relates to an item which can be obtained by means of the method.

Abstract: The invention relates to an additive manufacturing process (3D printing) using particles having a meltable polymer. The meltable polymer comprises a thermoplastic polyurethane polymer which has a melting range (DSC, Differential Scanning calorimetry; second heating at heating rate 5 K/min) of 160 to 270° C. and a Shore D hardness according to DIN ISO 7619-1 of 50 or more and which, at a temperature T, has a melt volume rate (melt volume rate (MVR)) according to ISO 1133 of 5 to 15 cm/10 min and a change of the MVR, when this temperature T increases by 20° C., of greater than or equal to 90 cm3/10 min. The invention also relates to an item which can be obtained by means of the method.

Abstract: An electromagnetic shielding film for a cable, which relates to the field of wire manufacturing, for use in resolving the problem of easiness of break of the existing electromagnetic shielding film and the great consumption of time and power in the preparation process. The electromagnetic shielding film comprises a first metal layer (11,21,31,41), a conductive layer (12,22,32,42), and a protective film (13,23,33,43). The first metal layer covers the outer part of a conductor of a cable, and is used for shielding electromagnetic interference and is used as a medium. The conductive layer is disposed on the first metal layer, and is used for shielding electromagnetic interference, and the conductive layer comprises a curing agent, metal particles and polyurethane for carrying the metal particles. The protective film is disposed on the conductive layer and protects the electromagnetic shielding film.

Abstract: Provided are a flexible electromagnetic shielding sheet and an electronic device having the same. The flexible electromagnetic shielding sheet includes: a pressure-sensitive adhesive tape having an electrically conductive adhesive layer on one surface thereof; a fiber web adhered to the electroconductive adhesive layer and formed by accumulating fibers; a metal layer formed on at least one surface of the fiber web to shield electromagnetic waves; and an insulating film bonded to the fiber web on which the metal layer is formed. Further, the pressure-sensitive adhesive tape includes: a fiber-accumulating type substrate formed by accumulating a plurality of fibers and having a plurality of pores; and an electrically conductive adhesive layer formed on either surface of the fiber-accumulating type substrate, and made of an electrically conductive adhesive material filled in the plurality of pores and electrically connected to the fiber-accumulating type substrate by an applied pressure.

Abstract: A leaf spring is disposed between a circuit board and a upper shield. The leaf spring biases a heat sink toward the circuit board through a connecting member. The leaf spring is not electrically connected to the upper shield. According to this structure, an integrated circuit and the heat sink can be contacted with each other with certainty. Further, generation of unnecessary radiation can be suppressed effectively.

Abstract: A thin micro-multilayer electrical insulator having a plurality of layers of polymeric materials is high performance and lightweight. The insulator provides a structured material with improved dielectric strength and partial corona discharge resistance that can be used in high voltage and high temperature applications. The durable insulator is well suited for use in insulating high voltage aircraft wiring and power transmission composites in hybrid and all electric airplanes. The insulator can have multiple layers of different polymeric materials such as fluorine-containing polymers and polyimides.

Abstract: A medical electrical lead having a conductor assembly covered by an insulating layer, and a shield covering positioned adjacent or proximate to at least a portion of the insulating layer in order to shield the conductor assembly from one or more electromagnetic fields. The shield covering is formed of a material that is electrically conductive, where the material is in a wrapped or woven form. The material is selected so as to have an effective combination of small size and high conductive surface area, e.g., as opposed to metal wire or coatings thinner than metal wire. As such, the shield covering exhibits sufficient conductivity in the presence of one or more high frequency electromagnetic fields so that interference to the operation of the conductor assembly is minimized. The material can have a coating formed of one or more metals. The material can include carbon. In turn, the carbon can be formed of one or more of carbon fiber, carbon nanofiber, and single or multi-walled carbon nanotube.

Abstract: The present disclosure provides an electromagnetic shielding sheet characterized in that the sheet includes, electrically conductive carbon, a soft magnetic powder, and a base material made from a resin in which a filler including the conductive carbon and the soft magnetic powder has been mixed.

Abstract: System is configured to present a health-monitoring window in an operator display. The health-monitoring window includes a set of graph regions. Each of the graph regions of the set has a background and a signal line of a patient parameter. For at least one of the graph regions of the set, the processor is also configured to determine that the patient parameter for a designated time is significant based upon a predetermined standard. The processor is also configured to provide a reference color to the background for the designated time. The reference color includes at least one of a plurality of potential reference colors. The background for the designated time has a fixed position with respect to the parameter signal line such that an area of the background having the reference color appears to move along the horizontal axis with the parameter signal line as time progresses.

Abstract: Systems, electronic devices, and methods are directed to a self-adjustable heat spreader. A spring system may include one or more spring members and a contact surface adapted to contact a circuit board component. Each spring member may include a thermally conductive material. A thermal spreader plate may be coupled to the one or more spring members. The spring system and the thermal spreader plate may be configured to allow movement, with respect to the thermal spreader plate along multiple axes, of one or more portions of the one or more spring members proximate to the thermal spreader plate when the contact surface is pressed against the circuit board component and the spring system transitions from a first state to a compressed state. The contact surface and the spring system may be configured to transfer heat between the circuit board component and the thermal spreader plate.

Abstract: A system includes a magnetostrictive sensor. The magnetostrictive sensor includes a driving coil configured to receive a first driving current and to emit a first magnetic flux portion through a target and a second magnetic flux portion. The magnetostrictive sensor also includes a first sensing coil configured to receive the first magnetic flux portion and to transmit a signal based at least in part on the received first magnetic flux portion. The received first magnetic flux portion is based at least in part on a force on the target. The magnetostrictive sensor includes a magnetic shield disposed between the driving coil and the first sensing coil. The magnetic shield is configured to reduce the second magnetic flux portion received by the first sensing coil. The magnetic shield includes a composite with a conductive material and an insulating material, a metamaterial, or a mesh structure, or any combination thereof.

Abstract: Provided are: a shield film having excellent shield characteristics in the high frequency region of the shield film; and a shield printed wiring board. A shield film (1) is provided on a flexible printed wiring board (8), which has a base film (5) having a signal circuit (6a) formed thereon, and an insulating film (7) that is provided on the whole upper surface of the base film (5) such that the insulating film covers the signal circuit (6a). The shield film 1 has an electroconductive adhesive layer 15 provided throughout a surface of the insulating film 7, and a metal layer 11 provided throughout a surface of the electroconductive adhesive layer 15.

Abstract: A structure and a device may include an electromagnetic wave generator configured to generate electromagnetic waves; a shielding structure configured to surround at least a portion of the electromagnetic wave generator; and a metal layer provided on inner surfaces of upper and side portions of the shielding structure, wherein the metal layer having a predetermined surface roughness.

Abstract: A radio wave absorber provided with a radio wave absorbing film formed on a substrate, the radio wave absorber being capable of absorbing radio waves over a broad frequency band and exhibiting superior radio wave absorbing properties even with a radio wave absorbing film thinner than 1 mm. A film forming paste suitable for forming a radio wave absorbing film that is provided in the radio wave absorber. In a radio wave absorber provided with a radio wave absorbing film formed on a substrate, a particular epsilon-type iron oxide is employed in the radio wave absorbing film and relative permittivity of the radio wave absorbing film is set to 6.5 to 65.

Abstract: A timer including a sensor and a radiation source is used to prevent counterfeiting of integrated circuits. The timer confirms the date code of the integrated circuit resulting in a more secure supply chain.

Abstract: A porous aluminum body having high porosity and a manufacturing method therefor are provided, wherein the porous aluminum body can be manufactured by continuous manufacturing steps. In the present invention, this porous aluminum body includes a plurality of aluminum fibers connected to each other. The aluminum fibers each have a plurality of columnar protrusions formed at intervals on an outer peripheral surface of the aluminum fibers, the columnar protrusions protruding outward from the outer peripheral surface. Adjacent aluminum fibers are integrated with the aluminum fibers and the columnar protrusions.

Abstract: An electronic device includes a cover for one or more heat generating components, with the cover providing at least a combined conductive, convective, and radiant cooling for the heat generating components while maintaining the device within a prescribed temperature range. Conductive cooling is realized by providing thermal coupling between each of two or more depression regions in the cover and one or more heat generating components. Appropriate placement of air inlets and outlets through the cover provides convective cooling of the heat generating components and the thermally coupled depression regions. Heat from the heat generating components thermally coupled to one depression region is effectively isolated from heat generated by other heat generating components thermally coupled to another adjacent depression region at least in part via the air outlets through an interior region between the two adjacent depression regions.

Abstract: This porous aluminum sintered compact is a porous aluminum sintered compact in which a plurality of aluminum base materials are sintered together, and a Ti—Al-based compound is present in bonding portions at which the aluminum base materials are bonded together. It is preferable that a plurality of columnar protrusions protruding outwards are formed on an outer surface of the aluminum base material and the bonding portions are present at the columnar protrusions.

Abstract: The invention provides an electronic control device having a high-grade heat sink that: does not require tight control at the time of manufacturing; does not restrict the range of electronic components that can be used; is structurally simple; can be produced at a higher production rate; and is cost-effective. In this device, when a circuit board 14 having an electronic component 13 thereon is placed in a non-metal (resin) housing having: a housing base 11 integrally comprising via a partition wall 11a a connector inserting section 18 used for electrical connection with an external mating connector (not illustrated); and a housing cover 12 attached to the housing base 11, part of the board 14 is inserted into an insertion hole provided in the partition wall 11a so that it is exposed inside the connector inserting section 16.

Abstract: To recharge an implanted medical device, an external device, typically in the form of an inductive charger, is placed over the implant to provide for transcutaneous energy transfer. The external charging device can be powered by a rechargeable battery. Since the battery is in close proximity to the charge coil, the large magnetic field produced by the charge coil induces eddy currents that flow on the battery's metallic case, often resulting in undesirable heating of the battery and reduced efficiency of the charger. This disclosure provides a means of shielding the battery from the magnetic field to reduce eddy current heating, thereby increasing efficiency. In one embodiment, the magnetic shield consists of one or more thin ferrite plates. The use of a ferrite shield allows the battery to be placed directly over the charge coil as opposed to outside the extent of the charge coil.

Abstract: A method for growing a graphene layer on a metal foil includes placing a vessel into a chemical vapor deposition chamber, the vessel having a metal foil positioned therein. The method includes evacuating the chemical vapor deposition chamber, introducing hydrogen gas into the chamber to achieve a first pressure less than atmospheric pressure, heating the atmosphere in the chamber to anneal the metal foil, introducing methane and hydrogen into the chamber to achieve a second pressure less than atmospheric pressure.

Abstract: A metal foil for electromagnetic shielding, comprising: a metal foil base, an Sn—Ni alloy layer formed on one or both surfaces of the base, and an oxide layer formed on a surface of the Sn—Ni alloy layer, wherein the Sn—Ni alloy layer includes 20 to 80% by mass of Sn and has a thickness of 30 to 500 nm, and wherein when an analysis in a depth direction is carried out by an XPS being the depth from an outermost surface as X nm, and an atomic percentage (%) of Sn is represented by ASn (X), an atomic percentage (%) of Ni is represented by ANi (X), an atomic percentage (%) of oxygen is represented by AO(X), and X is defined to be XO when AO(X)=0, 30 nm=>XO=>0.5 nm, and 0.4=>?ANi(X)dx/?ASn(X)dx=>0.05 in a section [0, X0] is satisfied.

Abstract: The present invention relates systems and methods of electromagnetic protection for integrated video and electromagnetic detector security system equipment. A security system configured to be protected from electromagnetic events or attacks includes a quantity of video cameras and a quantity of electromagnetic event detectors disposed at a facility. The system also includes an electromagnetically-shielded cabinet containing computing equipment and a storage media. The electromagnetically-shielded cabinet is configured to receive data from each of the quantity of video cameras and electromagnetic detectors and store the data on the storage media, whereby, in the event of an electromagnetic event, information at the time of the event can be preserved on the storage media.

Abstract: An electrical chassis for use in high temperature environments is disclosed. The electrical chassis may be employed, for example, in close proximity to the combustion chamber of a jet engine. The electrical chassis is constructed with a substrate formed from a material with low thermal conductivity and low electrical conductivity, such as polyetheretherketone. A reflective surface may be disposed on a housing containing the substrate to reduce the absorption of radiation. A heat sink and fluid inlet and outlet may also be arranged to remove heat generated by the electrical components.

Abstract: A high-frequency signal double-layer flat cable adapter card that is capable of eliminating transmission disorder of a double-layer cable caused by paralleling and overlap of high-frequency signals and a direct current power supply loop. The high-frequency double-layer flat cable adapter card comprises a first connecting end, a second connecting end and a flat cable group formed by at least two strips of flat cables. The first connecting end includes a first substrate and a connector. The second connecting end includes a second substrate. The flat cable group is in an upper-lower dual-layer structure and is connected between the first connecting end and the second connecting end. A conductive metal foil sheet is arranged between upper and lower dual layers of flat cables of the flat cable group.

Abstract: The present invention relates to a shielding system for conductor cables as well as to a method for producing said shielding system. The system is characterized in that it comprises a corrugated tube (20) coated with one or more thin films of high electrical conductivity material (30) which are reversibly adhered to the surface of said corrugated tube (20) so that said coating can be uncoupled from the corrugated tube due to high bending values of the tube itself. The shielding system according to the present invention therefore combines the excellent shielding efficacy values of a system having thin metal films with the excellent flexibility properties of a corrugated plastic tube.

Abstract: An object to be achieved by the present invention is to provide a conductive pattern having such a level of adhesion that a conductive layer containing a conductive substance such as silver does not separate from a primer layer with time. The present invention relates to a conductive pattern including a conductive layer (A) containing a compound (a1) having a basic nitrogen atom-containing group and a conductive substance (a2); a primer layer (B) containing a compound (b1) having a functional group [X]; and a substrate layer (C), the conductive layer (A), the primer layer (B), and the substrate layer (C) being stacked, in which a bond is formed by reacting the basic nitrogen atom-containing group of the compound (a1) contained in the conductive layer (A) with the functional group [X] of the compound (b1) contained in the primer layer (B).

Abstract: Electrical components such as integrated circuits may be mounted on a printed circuit board. To prevent the electrical components from being subjected to electromagnetic interference, a radio-frequency shielding structure may be mounted over the electrical components. The radio-frequency shielding structure may be formed from a printed circuit that includes a ground plane such as a flex circuit or rigid printed circuit board that includes at least one blanket layer of metal. The printed circuit board to which the electrical components are mounted may include a recess in which the electrical components are mounted. Additional components may be mounted to the interior and exterior surface of the radio-frequency shielding structure. The radio-frequency shielding structure may be formed from a flex circuit that has slits at its corners to accommodate folding.

Abstract: Disclosed is a light-transmitting electromagnetic-shielding laminate, which is characterized in that two or more layers including an electromagnetic-shielding layer are arranged in layers using a (meth)acrylate adhesive composition which contains a (meth)acrylate monomer, a (meth)acrylate oligomer and at least one member selected from the group consisting of acrylic amide derivatives, silane compounds and organophosphorus compounds. Also disclosed is a light-transmitting radio wave absorber which is characterized in that a resistive layer, a dielectric spacer and a reflective layer are arranged in layers using a (meth)acrylate adhesive composition which contains a (meth)acrylate monomer, a (meth)acrylate oligomer and at least one member selected from the group consisting of acrylic amide derivatives, silane compounds and organophosphorus compounds.

Abstract: The invention discloses an insulating body (1) which is provided for receiving and/or electrically contacting at least one conductor of a cable to be connected or for fitting onto a printed circuit board, the insulating body (1) being adapted to be introduced into a dedicated chamber of a plug connector housing and having at least one recess (11) for at least one contact element (13) which can be connected to the individual conductor of the cable to be connected or to a conductor track of the printed circuit board, and including a shielding element (20) by which the contact element is electromagnetically shielded, the insulating body (1) being formed of at least one first component (2) and one second component (10), the first component (2) containing a doping so that the surface of the first component (2) can be provided with a conducting coating (6) by an electroplating process, the shielding element (20) being formed from the conducting coating of the first component (2).

Abstract: A printed circuit board has a cavity formed in at least one side thereof and an electronic component disposed at least partially within that cavity. Electromagnetic interference (EMI)-shielding material is disposed between the electronic component and at least one of the side walls and bottom of this cavity. So configured, the overall height of the combined structure is reduced as compared to a surface-mounted component.

Abstract: A noise dampening tape and gasket material for reducing or preventing unwanted electromagnetic interference from escaping or entering an enclosure. The noise dampening gasket includes an inner core section, a carbon material layer surrounding the inner core section, an insulating layer surrounding the carbon material layer, and a metal shield layer surrounding the insulating layer. The noise dampening tape includes a metal shield layer, an insulating layer adjacent to and in contact with the metal shield layer, a carbon material layer adjacent to and in contact with the insulating layer, and an adhesive layer disposed on a surface of the carbon material layer. A second adhesive layer can be disposed on a surface of the metal shield layer. The carbon fibers can be coated with silicone or polytetrafluoroethylene to enhance mechanical and electrical properties of the carbon material layer.

Abstract: A thermoplastic resin composition that can have excellent EMI shielding and injection-molding processability includes (A) a thermoplastic resin, (B) carbon fibers, and (C) filler comprising nano metal particles surface coated with graphite crystalline nano carbon particles, composite fillers which are carbon nanotubes coated with nano metal particles, composite fillers which are carbon nanotubes supporting nano metal particles, and combinations thereof.

Abstract: The present invention relates to a passive layer including graphene for the attenuation of near-field electromagnetic waves and heat dissipation. The passive layer blocks electromagnetic waves radiated from an external electronic device or prevents electromagnetic waves generated in an electronic device from emitting to the outside. The passive layer is designed to reduce interference between transmission circuits of a device in the near-field region or influence such as malfunction caused by external electromagnetic waves. The present invention also relates to an electromagnetic device and a circuit board, each including the passive layer.

Abstract: According to various aspects, exemplary embodiments are disclosed of shielding structures including one or more frequency selective surfaces, which may be used for attenuating, reflecting, and/or redirecting electromagnetic signals through open structures. Also disclosed are methods of using one or more frequency selective surfaces for attenuating, reflecting, and/or redirecting electromagnetic signals through open structures.

Abstract: According to various aspects, exemplary embodiments include one or more frequency selective surfaces, which may be used for attenuating, reflecting, and/or redirecting electromagnetic signals. Also disclosed are methods of using one or more frequency selective surfaces for attenuating, reflecting, and/or redirecting electromagnetic signals.

Abstract: Carbon nanostructures can convey enhanced electrical conductivity to various substrates, while maintaining a high surface area and low density per unit area. Such substrates can provide good shielding against electromagnetic radiation over a wide range of frequencies. Electrically conductive structures can include a support layer containing a plurality of fibers having apertures defined between the fibers, and a plurality of carbon nanostructures at least partially conformally coating the fibers and bridging across the apertures defined between adjacent fibers to form a continuous carbon nanostructure layer. Each carbon nanostructure can include a plurality of carbon nanotubes that are branched, crosslinked, and share common walls with one another.

Abstract: A hybrid sheet material includes an EMI absorption layer bonded to a thermal absorption layer. The EMI absorption layer may include a homogeneous mixture of a binder, silicon, and at least one metal. The thermal absorption layer may include a homogeneous mixture of a graphite material and a binder. According to a further aspect, a mobile device that includes a hybrid sheet material is provided. Other aspects include methods for producing the hybrid sheet material.

Abstract: Disclosed herein are a printed circuit board and a method of manufacturing the same. The printed circuit board includes: a core layer having a first circuit wiring layer formed on one surface or both surfaces thereof; an insulating layer laminated, as at least one layer, on one surface or both surfaces of the core layer; and a second circuit wiring layer formed on one surface of the insulating layer, wherein a conductive core is included in upper and lower insulating layers contacting the second circuit wiring layer requiring an electromagnetic wave shielding, or the conductive core is included in the insulating layer or the core layer contacting the first circuit wiring layer requiring the electromagnetic wave shielding.