Abstract: An electronic module having at least two electronic components mounted on a substrate. The electronic components are covered by a dielectric material. The dielectric material has a recess between adjacent electronic components. The surface of the recess facing at least one electronic component is coated with a conductive layer while the opposite surface to that coated recess surface is substantially free of a conductive layer. Also disclosed is a process for making the above-specified electronic module.

Abstract: Provided are an electromagnetic-wave absorbing composition that can favorably absorb electromagnetic waves of high frequencies in or above a millimeter-wave band and that can be applied to a desired portion in the form of a paste, and an easily deformable electromagnetic-wave absorber having flexibility. The electromagnetic-wave absorbing composition includes a rubber binder, a filler made of a particulate carbon material, and a magnetic iron oxide that magnetically resonates in a frequency band in or above a millimeter-wave band as an electromagnetic-wave absorbing material. The electromagnetic-wave absorber includes a rubber binder 1b, a filler 1c made of a particulate carbon material, and a magnetic iron oxide that magnetically resonates in a frequency band in or above a millimeter-wave band as an electromagnetic-wave absorbing material 1a, and is a nonresonant-type electromagnetic-wave absorber that is not provided with a reflective layer for reflecting incident electromagnetic waves.

Abstract: An electromagnetic interference shielding composite. The electromagnetic interference shielding composite includes a polymer substrate formed into a shape of a packaging component. The composite further includes an electromagnetic interference layer contacting the polymer substrate and a conductive coating contacting the electromagnetic interference layer. An integrated power electronic module includes packaging including the electromagnetic interference shielding composite. A method of forming the electromagnetic interference shielding composite for an integrated power electronic module includes molding a polymer substrate into a shape of a packaging component, forming an electromagnetic interference layer on the polymer substrate, and forming a conductive coating on the electromagnetic interference layer.

Abstract: A noise reduction structure includes an antenna, a noise source, an electromagnetic conductor, and a grounding member. The antenna has a transmission and reception bandwidth. The noise source radiates an electromagnetic wave. Frequency of the electromagnetic wave falls within the transmission and reception bandwidth. The electromagnetic conductor is closer to the antenna than the noise source. The grounding member is disposed at the noise source in such a manner to face the antenna. The grounding member is electrically isolated from the electromagnetic conductor and forms a good grounding path to the noise source. Furthermore, a transmission dock with the noise reduction structure is provided.

Abstract: A method includes bonding a first and a second package component on a top surface of a third package component, and dispensing a polymer. The polymer includes a first portion in a space between the first and the third package components, a second portion in a space between the second and the third package components, and a third portion in a gap between the first and the second package components. A curing step is then performed on the polymer. After the curing step, the third portion of the polymer is sawed to form a trench between the first and the second package components.

Abstract: The present application relates to an electromagnetic wave shielding film, which can provide an electromagnetic wave shielding film having excellent mechanical strength, flexibility, electrical insulation properties, bonding properties with other constituents, oxidation and high-temperature stability and the like, while having excellent electromagnetic shielding ability.

Abstract: A method of forming an electronics assembly includes providing a substrate, attaching an electronics component to the substrate, disposing one or more dielectric ramps on the substrate along at least a portion of a perimeter of the electronics component, disposing a first ground plane over the substrate and the dielectric ramp(s), disposing a first dielectric over the first ground plane, disposing a stripline over the first dielectric, disposing a second dielectric over the stripline and the first dielectric, and disposing a second ground plane over the second dielectric.

Abstract: A noise reduction structure includes an antenna, a noise source, an electromagnetic conductor, and a grounding member. The antenna has a transmission and reception bandwidth. The noise source radiates an electromagnetic wave. Frequency of the electromagnetic wave falls within the transmission and reception bandwidth. The electromagnetic conductor is closer to the antenna than the noise source. The grounding member is disposed at the noise source in such a manner to face the antenna. The grounding member is electrically isolated from the electromagnetic conductor and forms a good grounding path to the noise source. Furthermore, a transmission dock with the noise reduction structure is provided.

Abstract: A method of fabricating a printed wiring board (PWB) includes etching traces to carry direct current (DC) on a first surface of a first epoxy-based layer. The first epoxy-based layer includes radio frequency (RF) absorber material. The method also includes arranging a second epoxy-based layer. The second epoxy-based layer includes the RF absorber material and includes a first surface in contact with the first surface of the first epoxy-based layer such that the traces are sandwiched between the first epoxy-based layer and the second epoxy-based layer.

Abstract: A noise suppression sheet comprises a non-magnetic metal layer, a plurality of metal magnetic layers, and a plurality of insulating layers, and the metal magnetic layer and the insulating layer are alternately laminated on the non-magnetic metal layer. The noise suppression sheet can absorb and suppress noise generated from a circuit or the like in an electronic component by being mounted on the electronic component or the like. In the noise suppression sheet, noise is absorbed by each of the metal magnetic layers. Noise that is transmitted without being absorbed by the metal magnetic layer can be reflected by the non-magnetic metal layer and can be absorbed again by the metal magnetic layer, and hence the noise suppression sheet can suppress noise effectively.

Abstract: A system-in-package apparatus includes a semiconductive bridge that uses bare-die pillars to couple with a semiconductive device such as a processor die. The apparatus achieves a thin form factor.

Abstract: An electromagnetic wave absorption material comprises: fibrous carbon nanostructures; and an insulating material, wherein a content C of the fibrous carbon nanostructures when a content of the insulating material is 100 parts by mass is 5 parts by mass or more and 15 parts by mass or less, or, in the case where the fibrous carbon nanostructures are fibrous carbon nanostructures that exhibit a convex upward shape in a t-plot obtained from an adsorption isotherm, the content C is 0.3 parts by mass or more and 0.8 parts by mass or less, and the electromagnetic wave absorption material absorbs an electromagnetic wave in a frequency domain of more than 20 GHz.

Abstract: An opto-coupler includes a housing having end walls configured to have high-voltage (HV) input and output conductors protruding therethrough. The opto-coupler also includes at least one light emitting diode (LED) mounted to the housing and configured to activate the HV diode to pass electrical current by emitting light toward the HV diode. At least one press-fit end cap is configured to provide a press-fit seal either between the HV input conductor and the input end wall or between the HV output conductor and the output end wall. The press-fit end cap is configured to protect the LED from damage by shaping an electric field between the HV input or output conductor and the LED. Embodiments enable compact opto-coupler sizes with high-voltage ratings, such as 8 kV or 15 kV. Electrical current transfer ratios may be much higher than in existing opto-couplers.

Abstract: The present disclosure relates to a magnetic shielding sheet and a method of preparation thereof. The magnetic shielding sheet includes a magnetic layer, and a protective layer disposed on at least one surface of the magnetic layer. The magnetic layer includes a metal-ceramic composite that is metal powder, on which a ceramic coating layer is formed.

Abstract: The present invention relates to a method, and system for performing such method, for producing a press hardened part (2?) of heat treatable material having zones of different structure by partially heating a blank (2) before the blank is processed. The method (100) comprises the steps of arranging (104) the blank in a furnace (10) for heating the blank to a temperature equal to or above the austenitization temperature of the material of the blank to get the blank into an austenitic phase, in a IR heating station (10) partially heating (106), by means of IR radiation (24), at least one first zone (2a) of the blank thereby keeping the at least one first zone of the blank in the austenitic phase, and arranging (108) the blank in a processing unit (30) for forming and quenching the blank to a press hardened part.

Abstract: In one embodiment, a magneto-resistive chip package includes a circuit board; a shielding body including a shielding base part positioned on the circuit board and a shielding intermediate part extending from one side of the shielding base part; a magneto-resistive chip positioned on the shielding base part and including a magneto-resistive cell array; an internal connection part electrically connecting the magneto-resistive chip to the circuit board; an encapsulation part encapsulating the magneto-resistive chip on the circuit board, and having an upper surface that is higher than an upper surface of the magneto-resistive chip; and a shielding cover positioned on the shielding intermediate part, and on the encapsulation part.

Abstract: A low-cost, multi-function adhesive wireless communications and transducer platform with a form factor that unobtrusively integrates one or more transducers and one or more wireless communication devices in an adhesive product system. In an aspect, the adhesive product system integrates transducer and wireless communication components within a flexible adhesive structure in a way that not only provides a cost-effective platform for interconnecting, optimizing, and protecting the constituent components but also maintains the flexibility needed to function as an adhesive product that can be deployed seamlessly and unobtrusively into various applications and workflows, including sensing, notification, security, and object tracking applications, and asset management workflows such as manufacturing, storage, shipping, delivery, and other logistics associated with moving products and other physical objects.

Abstract: An electromagnetic interference suppressor is disposed so as to be effective for noise in a wide frequency band including a high frequency band. Provided is an electronic device including an electromagnetic interference suppressor; an interfering object configured to generate an electromagnetic wave; an interfered object to be affected by the electromagnetic wave; a substrate configured to mount thereon the interfering object and the interfered object; and the electromagnetic interference suppressor disposed in parallel to the substrate, and is disposed along only one of the interfering object and the interfered object. When an end portion of the interfering object opposed to the interfered object is defined as a first end portion, and an end portion of the interfered object opposed to the interfering object is defined as a second end portion, one end portion of the electromagnetic interference suppressor is disposed between the first end portion and the second end portion.

Abstract: A display device includes: a display panel; a shielding layer positioned under the display panel, the shielding layer including a first antenna pattern; a pressure sensor electrode positioned under the shielding layer; an elastic layer positioned under the pressure sensor electrode, the elastic layer including a piezoelectric effect material; and a ground layer positioned under the elastic layer, wherein the pressure sensor electrode, the elastic layer, and the ground layer are configured to operate as a pressure sensor.

Abstract: A multilayer board level shield includes an electrically-conductive shielding layer disposed between inner and outer dielectric layers. The multilayer board level shield may have an overall thickness of about 25 microns or less. The multilayer board level shield may have sufficient flexibility to be reconfigurable generally over one or more components on a substrate to thereby provide board level shielding for the one or more components. One or more dielectric joints may be defined between the printed circuit board and the outer dielectric layer that attach the multilayer board level shield to the printed circuit board.

Abstract: A wireless power receiver is disclosed. The wireless power receiver includes a reception coil for wirelessly receiving AC power, a plurality of shielding members disposed on the reception coil for blocking magnetism, and an adhesive member for adhering the shielding members and the reception coil to each other, wherein the shielding members are made of different materials.

Abstract: According to an embodiment, provided is an electromagnetic wave shielding structure comprising: a shielding structure encompassing an electromagnetic wave generation source, and having a surface roughness on a surface thereof; and an electromagnetic wave shielding metal layer arranged on the surface of the shielding structure so as to encompass the shielding structure, wherein the upper side and the lateral side of the shielding structure have different surface roughness.

Abstract: A laminated fabric article includes a first layer of shock absorbing visco-elastic fabric; a second layer of electromagnetic barrier metallized fabric; and a third layer of moisture barrier hydrophobic coated fabric. The fabric article also may include a fourth layer of shape-memory fabric. The article may be formed as a container or as a garment or a portion of a garment.

Abstract: A disclosed collision detection system for a vehicle includes a radar sensor mounted to the vehicle proximate that is capable of detecting objects in proximity to the vehicle, and at least one component at least partially defining a cavity. The cavity is at least partially filled by a material that modifies a portion of radar energy emitted from the radar sensor and transmitted back to the radar sensor.

Abstract: Provided is an electromagnetic wave shielding sheet including: a substrate that is formed in a nano-web form by spinning a polymer material into fiber strands by a spinning method; a conductive metal layer that is formed on one surface of the substrate for shielding electromagnetic waves; and an adhesive layer formed on the other surface of the substrate, to thereby make a thickness of the electromagnetic wave shielding sheet thin, and improve electromagnetic wave shielding performance.

Abstract: An electromagnetic shielding tube has a resin inner layer as the innermost layer, a resin outer layer as the outermost layer, and a metal metal-layer between the inner layer and the outer layer. The bonding strength between the outer layer and the metal layer is made weaker with respect to the bonding strength between the inner layer and the metal layer. For example, while an adhesive layer is provided between the inner layer and the metal layer, the outer layer can be directly extrusion coated onto the metal layer without providing an adhesive layer or the like between the outer layer and the metal layer.

Abstract: A connected light node (CLN) induction light ballast module for powering an induction lamp includes a printed circuit board having components mounted thereon and an earth ground region electrically isolated from a PCB ground region. A heat sink is disposed on a lower layer of the printed circuit board and electrically connected to the earth ground region, wherein a parasitic capacitance occurs between the printed circuit board ground region and the heat sink. A capacitive shield sandwiched by a lower insulating pad and an upper insulating pad is electrically isolated from the heat sink supporting the shield. A damping network electrically connects the capacitive shield to the PCB ground region. Switch-mode power converters are mounted above the upper insulating pad and the shield. The damping network suppresses noise by a parasitic capacitance between the PCB ground region and the heat sink during high frequency power converter operation.

Abstract: Protective coatings are disclosed that are configured to cover electronic components within an electronic device, while enabling electrical connections to be established with electrical contacts that are covered by the protective coatings. Such a protective coating may comprise a parylene, or a poly(p-xylylene), protective coating that has a thickness of at least 0.1 ?m and at most about 2 ?m. Electronic devices that include such a protective coating are also disclosed.

Abstract: A chip electronic component includes a body, in which a distance from a first surface to a second surface opposing with respect to the first surface is equal to or less than a distance from a third surface to a fourth surface opposing with respect to the third surface, a first internal electrode, and a second internal electrode exposed to the second surface of the body, and spaced apart from the third surface and the fourth surface of the body by a predetermined distance. A first corner protection portion is disposed on portions of surfaces adjacent to a first corner, where the first corner is a corner formed by the first surface, the third surface and the fifth surface of the body.

Abstract: A packaged device has a die of semiconductor material bonded to a support. An electromagnetic shielding structure surrounds the die and is formed by a grid structure of conductive material extending into the support and an electromagnetic shield, coupled together. A packaging mass embeds both the die and the electromagnetic shield. The electromagnetic shield is formed by a plurality of metal ribbon sections overlying the die and embedded in the packaging mass. Each metal ribbon section has a thickness-to-width ratio between approximately 1:2 and approximately 1:50.

Abstract: A magnetic field shielding sheet includes: a magnetic field shielding main sheet disposed on the back of the digitizer to thus prevent affecting the digitizer; and a magnetic field shielding sub-sheet laminated in a dual on at least one of four side edges of the magnetic field shielding main sheet, and to prevent affecting the digitizer by the magnesium frame inside the portable terminal, wherein the magnetic field shielding main sheet includes a shielding layer made of a plurality of pieces, a cover layer adhered to one surface of the shielding layer, and a double-sided tape adhered to the other surface of the shielding layer. A magnetic field arising from various components incorporated in a portable terminal device is shielded by the magnetic field shielding main sheet while the magnetic field shielding sub-sheet prevents a digitizer from being affected by a magnesium frame, thereby enhancing performance of the digitizer.

Abstract: There is provided an electronic device. The electronic device includes: a wiring board; a first electronic component mounted on the wiring board and configured to emit an electromagnetic wave having a first frequency band; a second electronic component mounted on the wiring board and configured to emit an electromagnetic wave having a second frequency band; a first magnetic thin film covering the wiring board, the first electronic component and the second electronic component, wherein the first magnetic thin film has a composition corresponding to the first frequency band; and a second magnetic thin film covering the first magnetic thin film, wherein the second magnetic thin film has a composition corresponding to the second frequency band.

Abstract: The present invention provides a highly dielectric elastomer molded body which is inexpensive and excellent in its dielectric property, shock resistance, flexibility, and processability and can be used at a UHF band having 800 to 960 MHz and an electronic component material for a high frequency use. The highly dielectric elastomer molded body is formed by molding a highly dielectric elastomer composition comprising an elastomer and dielectric ceramic powder added thereto. The molded body has a tensile elongation not less than 250% and a hardness not more than 70. In measurement at a frequency of 950 MHz, a dielectric constant of the highly dielectric elastomer molded body is 4 to 10, and a dielectric dissipation factor thereof is not more than 0.02. An electronic component material for a high frequency use is made of the highly dielectric elastomer molded body.

Abstract: A method for making the electromagnetic shielding layer is provided. An electronic element has a surface is provided. At least one carbon nanotube film is fabricated. A carbon nanotube film structure is formed on the surface of the electronic element. A conductive layer is formed on the carbon nanotube film structure to obtain the electromagnetic shielding layer on the surface of the electronic element.

Abstract: A shielding article includes a polymeric conductive layer and a protective layer disposed adjacent the polymeric conductive layer. The polymeric conductive layer provides electromagnetic shielding characteristics so as to prevent receipt of data from a radio frequency information component by an external device when the component is located between the external device on one side and the polymeric conductive and protective layers on the other side. The shielding article may be shaped to substantially surround the radio frequency information component.

Abstract: A mobile terminal includes a terminal body; and a printed circuit board (PCB) assembly mounted to the terminal body. The PCB assembly includes a first PCB, a first electronic device mounted on the first PCB, a second PCB spaced from the first PCB in a first direction, a second electronic device mounted on the second PCB. The first electronic device is disposed to overlap the second electronic device in the first direction. A first shield can may be mounted on the first PCB so as to cover the first electronic device, and configured to shield Electro Magnetic Interference (EMI) between the first electronic device and the outside. A shield block may be disposed at a space between the first and second PCBs, accommodating therein the first and second electronic devices, and shielding EMI between the first electronic device and the outside, and between the second electronic device and the outside.

Abstract: A panel for an electromagnetic shield includes a light-weight, porous, electrically-conductive, fluid-permeable planar core layer defined between generally parallel first and second surfaces and a first face sheet laminated to the first surface of the core layer with rigidity properties superior to the rigidity properties of the core layer. The thickness of the first face sheet is substantially less than the thickness of the core layer. The core layer is made of metallic foam or a metal coating on an electrically-nonconductive, porous, nonmetallic substrate chosen from among nonwoven fibrous matting, paper, and open-cell nonmetallic foam. Also, the core layer may also may be made up of liberated branching metal nanostrands or a plurality of electrically-coupled, electrically-conductive particles, each taking the from of an electrically-nonconductive, nonmetallic substrate with a metal coating.

Abstract: A composite dual blackened copper foil includes a copper foil and two blackened layers. The copper foil has a shiny side and a matte side. The blackened layers are formed on the shiny and matte sides respectively. The blackened layers are formed alloy by electroplating in a plating bath consisting essentially of copper, cobalt, nickel, manganese, magnesium and sodium ions. A rough layer is selectively formed between the blackened layer and the shiny side as well as the matte side. Both side of the copper foil is spotless, powder free, and good in etching quality. The copper foil is effective at blocking electromagnetic wave, near infrared, undesired light and the like. The copper foil exhibits strong light absorption and is applicable to direct gas laser drilling. A method of manufacturing the composite dual blackened copper foil is also provided.

Abstract: A first substantially annular conductive material has a first central opening, the first central opening is sufficient to substantially surround a fastener and maintain an electrical connection between the printed circuit board and the chassis. A second substantially annular conductive material is concentric with the first conductive material and the second conductive material hays a second central opening which is sufficient to substantially surround the fastener and maintain the electric connection between the printed circuit board and the chassis. A substantially annular impedance material is between and adjacent to the first conductive material and the second conductive material, the impedance material is sufficient to attenuate the electromagnetic interference from the system.

Abstract: A electromagnetic shielding film includes a conductive supporting substrate which includes a cured material of a thermosetting resin including a conductive filler; a metal thin film layer which covers one surface of the conductive supporting substrate; a thermosetting adhesive layer which covers a surface of the metal thin film layer; and a peeling substrate which covers the other surface of the conductive supporting substrate.

Abstract: An electromagnetic interference shield assembly is provided with a first housing formed of a first conductive polymer. The first housing has a cavity sized to receive an electronic sub-assembly therein. A second housing is formed of a second conductive polymer. The second housing has a cavity sized to receive the first housing therein.

Abstract: A semiconductor device, a semiconductor package, and an electronic device are provided. The electronic device includes a first semiconductor package disposed on a circuit substrate. A second semiconductor package is provided on the circuit substrate and spaced apart from the first semiconductor package. An insulating electromagnetic shielding structure is provided on the top and the lateral surfaces of the first semiconductor package. A conductive electromagnetic shielding structure is provided on the circuit substrate to cover the first and second semiconductor packages and the insulating electromagnetic shielding structure.

Abstract: A yarn or multi-fiber formed of a plurality of micron diameter stainless steel monofilaments which have been rendered more conductive by one or more coatings of electrolytically-deposited metal or metal alloy materials. The metallized yarn provided by the invention has a very low electrical resistance, with consequent benefit in electrical performance, and is particularly useful as an RFI/EMI shielding material.

Abstract: A noise dampening tape and gasket material for reducing or preventing unwanted electromagnetic interference from escaping or entering an enclosure. The noise dampening gasket includes an inner core section, a carbon material layer surrounding the inner core section, an insulating layer surrounding the carbon material layer, and a metal shield layer surrounding the insulating layer. The noise dampening tape includes a metal shield layer, an insulating layer adjacent to and in contact with the metal shield layer, a carbon material layer adjacent to and in contact with the insulating layer, and an adhesive layer disposed on a surface of the carbon material layer. A second adhesive layer can be disposed on a surface of the metal shield layer.

Abstract: Methods of building Z-graded radiation shielding and covers. In one aspect, the method includes: providing a substrate surface having about medium Z-grade; plasma spraying a first metal having higher Z-grade than the substrate surface; and infusing a polymer layer to form a laminate. In another aspect, the method includes electro/electroless plating a first metal having higher Z-grade than the substrate surface. In other aspects, the methods include improving an existing electronics enclosure to build a Z-graded radiation shield by applying a temperature controller to at least part of the enclosure and affixing at least one layer of a first metal having higher Z-grade from the enclosure.

Abstract: Electrical components such as integrated circuits may be mounted on a printed circuit board. To prevent the electrical components from being subjected to electromagnetic interference, radio-frequency shielding structures may be formed over the components. The radio-frequency shielding structures may be formed from a layer of metallic paint. Components may be covered by a layer of dielectric. Channels may be formed in the dielectric between blocks of circuitry. The metallic paint may be used to coat the surfaces of the dielectric and to fill the channels. Openings may be formed in the surface of the metallic paint to separate radio-frequency shields from each other. Conductive traces on the surface of the printed circuit board may be used in connecting the metallic paint layer to internal printed circuit board traces.

Abstract: A composite material for electromagnetic interference shielding is provided. The composite material comprises a stack including at least two electrically conductive nanoscale fiber films, which are spaced apart from one another by at least one insulating gap positioned between the at least two nanoscale fiber films. The stack is effective to provide a substantial multiple internal reflection effect.

Abstract: Electromagnetic interference shielding structures and methods of shielding an object form electromagnetic radiation at frequencies greater than a megahertz generally include providing highly doped graphene sheets about the object to be shielded. The highly doped graphene sheets may have a dopant concentration greater than >1e1013 cm?2, which is effective to reflect the electromagnetic radiation or a dopant concentration of 1e1013 cm?2>n>0 cm?2, which is effective to absorb the electromagnetic radiation.

Abstract: A semiconductor device is made by mounting a plurality of semiconductor die to a substrate, depositing an encapsulant over the substrate and semiconductor die, forming a shielding layer over the semiconductor die, creating a channel in a peripheral region around the semiconductor die through the shielding layer, encapsulant and substrate at least to a ground plane within the substrate, depositing a conductive material in the channel, and removing a portion of the conductive material in the channel to create conductive vias in the channel which provide electrical connection between the shielding layer and ground plane. An interconnect structure is formed on the substrate and are electrically connected to the ground plane. Solder bumps are formed on a backside of the substrate opposite the semiconductor die. The shielding layer is connected to a ground point through the conductive via, ground plane, interconnect structure, and solder bumps of the substrate.

Abstract: Disclosed is an electromagnetic wave shielding sheet for use in wireless power transmission which suppresses electromagnetic wave leakage in a broad range and which is easily adaptable to various types of wireless power transmitters. The disclosed electromagnetic wave shielding sheet is used in a wireless transmitter and has a multilayer structure including at least one metal layer and at least one magnetic material layer.