Abstract: The present invention provides a single-piece printed circuit board heat sink and encapsulation device configured to efficiently dissipate heat away from the printed circuit board, along with associated methodology for dispersing heat from a printed circuit board.

Abstract: A card edge contact pair for electrically coupling printed circuit board assemblies is provided. The card edge contact pair includes a first contact body and a second contact body. The first contact body includes a first solder joint end and a first deflection end. The second contact body includes a second solder joint end and a second deflection end. The card edge contact pair further includes an integral carrier component. The integral carrier component is detachably coupled to the first contact body and the second contact body.

Abstract: A system for transferring heat by free convective flows of coolant inside a flexible container is disclosed. The flexible container is able to fully conform with the surface of base and heat sources, and the coolant filled inside the flexible container can easily create free convective flows in a narrow gap for continuously and efficiently remove the heat from the heat sources. A method for forming a heat transfer module is disclosed. The flexible container can be placed on the heat sources and then being inflated by the coolant to fully conform with the surface of base and heat sources. Alternatively, the inflated flexible container is being pressed to fully conform with the surface of base and heat sources during assembly of the heat transfer module.

Abstract: One or more light emitting diode diodes (LEDs) are attached to a printed circuit board. The attached LEDs are connectable with a power source via circuitry of the printed circuit board. An overmolding material is insert molded an over at least portions of the printed circuit board proximate to the LEDs to form a free standing high thermal conductivity material overmolding that covers at least portions of the printed circuit board proximate to the LEDs. The free standing high thermal conductivity material has a melting temperature greater than about 100° C. and has a thermal conductivity greater than or about 1 W/m·K. In some embodiments, the free standing high thermal conductivity material is a thermoplastic material.

Abstract: A method for manufacturing a printed wiring board includes forming a removable layer over first pads in central portion of an interlayer insulation layer to mount IC chip, forming on the interlayer and removable layers a resin insulation layer having openings exposing second pads in peripheral portion of the interlayer layer to connect second substrate, forming a seed layer on the resin layer, in the openings and on the second pads, forming on the seed layer a plating resist having resist openings exposing the openings of the resin layer with diameters greater than the openings, filling the resist openings with electrolytic plating such that metal posts are formed in the resist openings, removing the resist, removing the seed layer exposed on the resin layer, and removing the removable layer and the resin layer on the removable layer such that cavity exposing the first pads is formed in the resin layer.

Abstract: A transistor package includes a lead frame and a gallium nitride (GaN) transistor attached to the lead frame. The lead frame and the GaN transistor are surrounded by an over-mold with a glass transition temperature greater than about 135° C. and a flexural modulus less than about 20 GPa. Using an over-mold with a glass transition temperature greater than about 135° C. and a flexural modulus less than about 20 GPa allows the over-mold to handle the heat produced by the GaN transistor while preventing damage to the GaN transistor due to thermal expansion and/or contraction of the over-mold.

Abstract: An apparatus includes a base plate including a plurality of depressions, and a power electronics printed circuit board including a plurality traces and a plurality of high voltage components. The plurality of high voltage components is located at a plurality of locations corresponding to the plurality of depressions in the base plate. A plurality of fasteners secures the printed circuit board to the base plate with the plurality of high voltage components received at the corresponding plurality of depressions. A thermally conductive and electrically isolating interface between the base plate and the printed circuit board is made of a gap filler material conforming to the base plate and to the plurality of depressions in the base plate, and conforming to the printed circuit board and to the plurality of high voltage components.

Abstract: A heat transfer system includes an electrical distribution cabinet extending about at least one current-carrying conductor. The heat transfer system also includes at least one electrically-insulating and thermally-conducting device coupled to the at least one current-carrying conductor. The heat transfer system further includes at least one heat pipe coupled to the at least one electrically-insulating and thermally-conducting device. The heat pipe is also thermally coupled to at least a portion of the electrical distribution cabinet.

Abstract: An electrical assembly comprises a substrate having a dielectric layer and one or more electrically conductive traces overlying the dielectric layer. An electrical component is mounted on a first side of the substrate. The electrical component is capable of generating heat. A plurality of conductive through holes in the substrate are located around a perimeter of the electrical component. The conductive through holes are connected to a conductive trace for heat dissipation. A cooling cavity has bores that face a second side of the substrate opposite the first side. A plurality of respective compliant pins are inserted into corresponding conductive through holes and the bores, wherein a generally exposed portion of the compliant pin is exposed to air or a coolant liquid within the cooling cavity.

Abstract: A power semiconductor system and method for producing a power semiconductor system. In one embodiment, the application relates to a power semiconductor system, comprising a line system for a fluid working medium; wall element having an outer side and an inner side; and a power semiconductor circuit arranged at the outer side of the wall element, wherein the inner side of the wall element forms a fluid-tight wall of the line system.

Abstract: The present invention discloses a compact server power supply having high power density has a casing, a main printed circuit board, a sub-printed circuit board, a power supplying circuit, a power output terminal set and a fan. The power supplying circuit has a primary side circuit unit, a transformer and a secondary side circuit unit. Electric elements of the primary and secondary side circuit units and the transformer are soldered on the main printed circuit board except parts of the electric elements of the secondary side circuit unit are soldered on the sub-printed circuit board. The sub-printed circuit board is vertically mounted and soldered on the main printed circuit board, so the length of the main printed circuit board is shortened to implement the server power supply having a compact size and high power density.

Abstract: A cooling box for electric or electronic components, consisting of a material, wherein the cooling box is non-electrically conductive or practically non-electrically conductive, is configured in one piece or multiple pieces and has a cavity that is enclosed by the material, wherein cavity being closed or provided with at least one opening.

Abstract: Disclosed herein are a heat-radiating substrate and a method of manufacturing the same. The heat-radiating substrate includes: a base substrate with a heat sink, having a groove; an insulating layer formed on the base substrate by performing anodization thereon; and a circuit layer formed on the insulating layer, whereby the heat-radiating substrate with the heat-sink, made of metal material, is manufactured, thereby making it possible to protect devices weak against heat and thus solve the problem in view of reduced life span and degraded reliability.

Abstract: Distribution and coupling of waste heat from planar non-concentration photovoltaic cells and semiconductor electrical devices is enhanced by forming dielectric relief structures and thermal conductive and emissive coatings on the cover and/or backing plate. The composite relief structures of layers, voids, and fins on the back surface mitigate the differential thermal expansion of dissimilar material and optimize convective heat transfer and radiant heat transfer with respect to costs. This leads to higher performance of the photovoltaic and semiconductor cells, a stronger and lighter backing plate components, and lower cost per watt for mounted devices.

Abstract: A power semiconductor module includes a module housing with a sealing ring on its top side. The sealing ring, in co-operation with the module housing and a printed circuit board attached to the power semiconductor module, hermetically seals feed-through locations at the top side of the module housing for feeding through electric terminals of the power semiconductor module. On the bottom side of the module housing a sealing ring hermetically seals the bottom side of the module housing.

Abstract: An electronic apparatus partially overmolded with a overmold sealing material that seals the circuit board, protects the electrical components on the circuit board and provides seals between the circuit board and mating devices is disclosed. The electronic apparatus may be an engine controller. The electrical components may be an electrical edge connector, a sensor, and a heat sink. The sensor may be a pressure sensor. The controller may be connected to a throttle body such that the overmold sealing material provides a first seal between the controller and the throttle body allowing the pressure sensor to be in fluid communication with the interior of the throttle body. A wire harness may be connected to the controller such that the overmold sealing material provides a second seal between the wire harness and the controller protecting the electrical connection. The overmold sealing material may also be translucent.

Abstract: A secure control unit is provided with a completely sealed casing (22) of which at least one wall (24) forms a heat sink. The circuit board provided in the casing (22) is designed such that all of the heat generating components (16-20) which require cooling are located on the lower side of the circuit board (10) and in thermal connection with the heat sink wall (24). Components which do not generate excessive heat are located on the upper side of the circuit board (10). Raised conductive blocks (32-36) couple thermally the components (16-20) to the wall (24). With this arrangement it is not necessary to provide cooling internally of the casing (22) and it is possible nevertheless to use high powered components of the type which are found in modern computers. The casing remains secure and thus suitable for high security applications.

Abstract: An electronic control unit includes a circuit board, multiple circuit patterns, multiple semiconductor devices, multiple leads, and at least one thermal-conduction limiting portion. Each of the semiconductor devices is installed to the corresponding circuit pattern formed on the circuit board. Each of the leads electrically and mechanically connects each of the semiconductor devices to the corresponding circuit pattern. The thermal-conduction limiting portion, which can limit conduction of heat generated from the semiconductor devices, is placed between corresponding two of the circuit patterns.

Abstract: An embodiment of an electronic component includes a circuit element disposed within a package, which includes a surface and at least one standoff protruding from the surface. For example, where the circuit element is an inductor in a power supply, the standoff may allow one to mount the inductor component over another component, such as a transistor component. Therefore, the layout area of such a power supply may be smaller than the layout area of a power supply in which the inductor and transistor components are mounted side by side.

Abstract: Embodiments of the present invention describe a device and method of mitigating radio frequency interference (REI) in an electronic device. The electronic device comprises a housing, and a thermal energy storage material is formed in the housing. By increasing the loss tangent parameter of the thermal energy storage material, the REI of the electronic device is reduced.

Abstract: A metal wiring plate includes a soldering portion to which an electronic device is soldered and a wiring portion extending from the soldering portion and configured to electrically connect the electronic device to other device. The wiring portion includes a narrow portion located adjacent to the soldering portion. The width of the narrow portion is less than the width of the soldering portion so that the narrow portion helps prevent melted solder applied to the soldering portion from spreading to areas outside the soldering portion. The narrow portion allows the electronic apparatus to be surely soldered to the soldering portion without using solder resist.

Abstract: In an electronic control device that includes two or more kinds of lead-insertion-type parts, including at least a coil and a capacitor, the parts are installed on a support that has a wiring, a terminal structure and mechanically fixing portions; the leads of the above parts are respectively inserted in and electrically connected to holes formed in the wiring portion of the support; the parts and the support are fixed to each other with an adhesion material for fixation; the upper surfaces of the parts are attached to a metallic chasis with a thermally conductive material of a low elasticity modulus interposed in between; the mechanically fixing portions of the support are fixed to the metallic chasis; and the terminal structure of the support is electrically connected to a circuit board that mounts at least a controlling element.

Abstract: A hermetically sealed housing having a base deck, a cover member and a seal assembly constructed of a liquid crystal material (LCM), the base deck and cover member forming an enclosure containing an inert gas atmosphere. Various embodiments have the LCM seal bonded to one or both of the base deck and cover member and bonded to seal the enclosure by molding, compression, adhesive bonding, thermoplastic welding or soldering, or a combination of such.

Abstract: A solid state relay having an internal heat sink for dissipating heat produced by a solid state switching device. The relay being enclosed within a nonmetallic housing and mountable on a DIN type rail system.

Abstract: The main objective of the present invention is a modular outdoor LED power supply disposed inside or outside of an outdoor LED light or an LED device so as to decrease the distance between the power supply and a LED light base for preventing an output power drop from an output of the power supply to the LED light base. One or more than one power supply can be disposed in a groove of a main heat-dissipating outer cover of the power supply according to the actual requirements, so that the production and installation thereof become more convenient. The power supply is characterized by being water-resistant, moisture-proof, dust-proof, antirust and direct heat-dissipating, wherein the water-resistant effect is above the IP 65 standard, and thus the reliability and the lifetime of the power supply are increased.

Abstract: Methods and associated structures of forming a discontinuous sealant on a substrate, wherein an opening is formed at an integrated heat spreader gap region, wherein the substrate comprises a portion of a multi chip microelectronic package. A thermal interface material is placed on a top surface of a high power die disposed on the substrate, and then an integrated heat spreader lid is placed on top of the sealant and on top of the thermal interface material. A molding compound is flowed within an integrated heat spreader cavity through the opening directly on a top surface of a low power die disposed on the substrate.

Abstract: In order to ensure waterproofing between a resin enclosure case and a heat sink, a canopy structure is provided in a portion, in which water is likely to penetrate, so as to prevent the water from entering the portion, thereby directing the water flow to the outside of the enclosure. This makes it easy to install and remove an electronic unit, so that an electronic component integrally formed with the heat sink can be easily replaced.

Abstract: Electronics mounted on a printed circuit board are housed within a high conductivity case with connecting pins extending therethrough. The case is filled with thermally conductive potting material to provide thermal conduction from the printed circuit board to the case. The case may be a conduit having open ends through which the printed circuit board is inserted or it may comprise a cover mounted to a base plate.

Abstract: A casing includes a first casing member and a second casing member. The first casing member is provided on a side with a fuse module mounting section having a side opening. The second casing member is provided on the same side as the first casing member with a relay module mounting section having a side opening and extending downward. An ECU mounting frame extends from a bottom wall of the second casing member. An ECU is disposed on a second side of a bottom wall of the second casing member and in parallel with the relay module mounting section. A fuse module is attached to the fuse module mounting section to receive fuses. A relay module is attached to the relay module mounting section to receive relays. The fuse module and relay module that generate heat are disposed on a side of the casing in a vertical direction.

Abstract: An electrical enclosure system for transferring heat from a closed environment, includes an electrical device having a heat-generating part, and a polymer-based ventless housing for protecting the electrical device from environmental contaminants. The ventless housing fully encloses the electrical device and includes a base layer forming an impact-resistant portion of the ventless housing. The base layer includes one or more open areas in close proximity to the heat-generating part. The ventless housing further includes an integrated thermally conductive layer that forms a heat-flow path for conducting heat away from the heat-generating part towards an exterior environment. The integrated thermally conductive layer is molded around the base layer such that portions of the integrated thermally conductive layer cover the open areas of the base layer.

Abstract: Disclosed herein are a disc varistor having a capability to absorb a double amount of surge and a method of manufacturing the varistor. The varistor includes a disc-shaped first ceramic body having first and second electrodes on opposite surfaces thereof, and a disc-shaped second ceramic body having third and fourth electrodes on opposite surfaces thereof. A first lead wire is in interposed between the second and third electrodes and electrically connected to the second and third electrodes. The varistor also includes a second lead wire. The second lead wire has a body portion electrically connected to the first electrode of the first ceramic body, a first extension extending from the body portion to the second ceramic body, and a second extension extending from the first extension to the fourth electrode.

Abstract: A power converter including a printed circuit board (PCB) having a plurality of heat conductive layers configured to sink heat generated by the power converter electronics. Each of these heat conductive layers are comprised of thermally conductive material configured as planar sheets, each of these heat conductive layers being coupled to at least one wire to sink heat therefrom, such as via a wire of an input cable and/or output cable. Advantageously, a more compact power converter is realized having improved power output while operating within safety guidelines.

Abstract: An electronic circuit apparatus has a casing, a circuit board at which electronic members and power transistors are mounted, and a connector for connecting the circuit board with an external electrical circuit. The casing is insertion-molded by a resin, with the circuit board where the electronic members, the power transistors and the connector have been mounted being held at a predetermined position in a die for molding the casing through the resin. Thus, in the electronic circuit apparatus, damage to circuit components and noise due to a vibration excitation can be restricted, without increasing the number of construction members of the electronic circuit apparatus.

Abstract: An electronic package having enhanced heat dissipation is provided exhibiting dual conductive heat paths in opposing directions. The package includes a substrate having electrical conductors thereon and a flip chip mounted to the substrate. The flip chip has a first surface, solder bumps on the first surface, and a second surface oppositely disposed from the first surface. The flip chip is mounted to the substrate such that the solder bumps are registered with the conductors on the substrate. The package further includes a stamped metal heat sink in heat transfer relationship with the second surface of the flip chip. The heat sink includes a cavity formed adjacent to the flip chip containing a thermally conductive material.

Abstract: A circuit board assembly includes an electrical component mounted on or in the assembly; a conductive layer, which is electrically connected to the electrical component; a high-temperature dissipation resin, which is of insulating material and is arranged so as to dissipate heat generated in the assembly; and a molding resin surrounding the electrical component. Heat, generated at electrical components in a circuit board assembly, is transferred and dispersed through the high-temperature dissipation material all over the assembly. Further, since the high-temperature dissipation resin is of an insulating material, it is unnecessary to consider a short-circuit problem in the assembly.

Abstract: A low profile mount for a disc varistor. A thermally sensitive switch is provided both for single and multiple electrode embodiments. The switch may be placed in a shorting circuit and include a spring biased conductor prevented from closure by a heat sensitive element which softens in responsive to excessive heat. The varistor may be fused to prevent excessive current from a short circuited but not open circuited varistor. Methods are also provided.

Abstract: A device including a flexible circuit disposed within a conductive tube. The circuit may include a flexible substrate and one or more circuit elements. The circuit may have circuit elements on one or both sides, and the substrate may be multi-layered. The tube may have any one of many cross-sectional shapes, including circular, oval, square, and rectangular.

Abstract: A nonreciprocal circuit device wherein upper and lower yokes can easily be fitted together, thereby preventing the deviation between the upper and lower yokes to obtain excellent electric characteristics. The upper yoke is bent in a box shape, and provided with an upper wall and two pairs of side walls of approximately rectangular shape, a lower yoke is bent in a U-shape, and provided with a bottom wall and a pair of side walls opposite to each other. A chamfer and a taper continuous to the chamfer are executed on each end face of a lapped part of the side wall on side walls of the upper yoke. Moreover, a perpendicular part parallel to the upper yoke side wall is formed on a lapped part on the upper yoke side wall.

Abstract: A structure for a passive microwave device. The structure includes a housing having circumferential side portions and selectively located openings in the side portions. In addition, electrical conductors for the passive device extend from the openings. The structure further includes substantially rigid supports which provide structural support for the conductors. The conductors are positioned above the supports and are electrically connected to contacts which are secured in apertures formed in the supports. A dielectric material is disposed on a perimeter of each of the contacts which serves to isolate each of the contacts from the support when the contact is positioned within the aperture.

Abstract: A thermistor for surface mounting includes a first conductive terminal member, a case having a top opening, a planar thermistor element having electrodes on mutually opposite main surfaces thereof, and a second conductive terminal member having at one end thereof a planar cover part which is attached to the top part of the case. One end of the first terminal member is positioned inside the case and above its bottom member. The other ends of the first and second terminal members are positioned on the bottom surface of the case.

Abstract: A positive thermistor device includes a positive thermistor element having a pair of opposed electrodes, each of which receives compressive force elastically applied from a corresponding one of spring contact members to hold the thermistor element at a predefined position in the device. When the thermistor device is destroyed, the element breaks into fragments, some of which remain in contact with the spring contact members. The remaining fragments deviate in position to ensure that they do not conduct electricity, resulting in an open state, wherein any current flow is inhibited through such fragments. More specifically, a positive thermistor disk is held within the device so that it is interposed between conductive spring contact pieces and insulative position-alignment projections, which are cross-diagonally situated with respect to each other.

Abstract: The invention consists of a one-piece plastic molded box having an open face member, an open back, flanges coplanar with and extending from the face member, and four wings extending from the inward side of the face member. The extender can be inserted slidably into an existing electrical box with the four wings flexing toward each other to accommodate the box with flanges flush with the surface of newly installed sheet rock to form a box extender or with flanges flush with the existing electrical box to form a device insulator.

Abstract: A semiconductor package is described which is constructed from a rectangular tape film, a wiring pattern formed on the tape film constituted by wiring composed of a conductive material, a semiconductor chip electrically connected to one end of the wiring pattern, and holes formed on the other end of the wiring pattern for connection by insertion of lead-pins. A method is then described for stacking and mounting a plurality of semiconductor packages on a wiring substrate by first vertically positioning lead-pins on a wiring substrate and then passing these lead-pins through the holes in the semiconductor packages.

Abstract: In an electronic component, an electronic circuit board having an electronic element mounted on the major surface is mounted on a metal frame. The electronic circuit board is covered with a metal lid fitted on the metal frame and contained in a metal package constituted by the metal frame and the metal lid. At least at one notched portion is formed at least at one end of the electronic circuit board. A positioning projection formed on the metal frame engages with the notched portion. The mechanical precision and electrical characteristics are improved, so that an electronic component particularly excellent in high-frequency characteristics, which can be manufactured in simple manufacturing process, can be obtained.

Abstract: The internal space of the case is divided into first housing portions and a second housing portion separated from the first housing portions by a partitioning wall. A positive characteristic thermistor element is housed in the second housing portion. At least two terminal members are provided, each with a contact terminal portion, a conductive portion and a lead-out terminal portion. The contact terminal portions are positioned in the second housing portion each in contact with one of the electrodes of the positive characteristic thermistor element. The conductive portions are electrically continuous to the contact terminal portions and are led to the first housing portions through the partitioning wall. The lead-out terminal portions positioned in the first housing portions, are electrically connected to the conductive portions and led out to the outside at the first housing portions.

Abstract: A diode laser collimatting device comprising a laser collimatting socket mounted on a socket holder through plug-in connection with a plastic lens retained therebetween in position, a laser diode inserted in said socket holder, an exciter circuit board inserted in said socket holder and connected to said laser diode, and a contact spring inserted in said socket holder and connected to said exciter circuit board, and wherein inserting said laser diode into said socket holder causes said socket holder, said laser diode, said exciter circuit board, said contact spring and said power supply to form into a circuit permitting said laser diode to be excited by said exciter circuit board to emit light through said plastic lens and said laser collimatting socket; a grid is fastened in said center hole to filtrate the light beam produced from said laser diode.

Abstract: The trend toward higher integration degrees has caused the semiconductor pellets to have large sizes. In the resin molded semiconductor devices, in particular, cracks develop on the pellet due to contraction upon cooling that stems from the difference of coefficient of thermal expansion between the molding resin and the pellet. Cracks develop conspicuously under the ball of the wire that is bonded onto the bonding pad on the pellet. The area that receives the shearing stress increases with the increase in the ball portion, and the cracks develop easily.To decrease the shearing stress and to prevent the crack from developing according to the present invention, the breaking strength of the bonding portion is set to be greater than the bending moment that is received depending upon the shape of the ball. That is, the ratio d/l of the thickness d of the ball portion and the width l of the alloy layer formed by the pad and the wire at the time of bonding is selected to be smaller than 0.2.

Abstract: An apparatus for forming leads of semiconductor devices includes a tie-bar cutting device for cutting tie-bars connecting adjacent leads in a lead frame on which semiconductor chips are mounted and which has unwanted resin burrs as a result of resin-sealing, a resin-burr removing device for removing resin burrs from the lead frame whose tie-bars have been cut, and a bending device for bending the leads of the lead frame whose resin burrs have been removed. After tie-bars are cut from a lead frame on which semiconductor chips are mounted, resin burrs are removed from the lead frame and the leads of the lead frame are bent.

Abstract: According to the present invention, a tape carrier is prepared which comprises a power trunk line including an electric connection as a branch of a power lead for each tape carrier unit and a ground trunk line having an electric connection as a branch of a ground lead for each tape carrier unit, the power and trunk lines being continuously formed along the longitudinal direction of the tape carrier, and a lead for a control signal for establishing an electric conduction along the longitudinal direction of the tape carrier via an aging wiring for semiconductor pellets to conduct a simultaneous multipoint (gang) bonding on the tape carrier. By mounting the semiconductor pellets having the aging wiring on the tape carrier, it is enabled to apply the power voltage and to supply the control signal to each of the plurality of the semiconductor pellets, and hence the operation test can be simultaneously conducted for the semiconductor pellets mounted on the tape carrier having an arbitrary length.