Abstract: A package structure and a formation method of a package structure are provided. The package structure includes a circuit substrate and a die package bonded to the circuit substrate through bonding structures. The package structure also includes a reinforcing structure over the circuit substrate. The reinforcing structure partially surrounds a corner of the die package. The package structure further includes an underfill structure surrounding the bonding structure. The underfill structure is in direct contact with the reinforcing structure.

Abstract: A device and a method for determining and/or monitoring at least one process variable of a medium include a sensor unit having a mechanically oscillatable unit, at least a first piezoelectric element, a pressure detection unit for determining and/or monitoring a pressure, and an electronics unit. The device is embodied to excite the mechanically oscillatable unit using an excitation signal such that mechanical oscillations are executed, to receive mechanical oscillations of the oscillatable unit, to convert them into a first received signal, to transmit a transmitted signal and to receive a second received signal. The electronics unit is embodied, based on the first and/or second received signal, to determine the at least one process variable of the medium.

Abstract: The present invention provides a display device. The display device includes a back plate and a bending portion. The display panel includes laminated support components, display modules, and protection components. The support component includes a body and an extension portion. An interval region is defined between the display module and an inner side wall of the bending portion, the protection component includes a first portion corresponding to the interval region and a second portion located at an end portion of the bending portion, and the extension portion supports the first portion.

Abstract: A sensor is provided with a cylindrical-shaped housing which has an opening formed at one end, an electronic component which is housed in the housing, a cylindrical-shaped clamp of which one end is inserted into the housing from the opening, and a sealing resin which seals the gap between the inner wall of the housing and the outer wall of the clamp. On the outer wall, the clamp has a rib which rises towards the inner wall of the housing. The rib includes an apex and a sloped surface which extends from the apex towards another end of the clamp and which intersects the outer wall of the clamp. The sealing resin, which exudes from between the inner wall of the housing and the apex and which is positioned on the sloped surface, has a recess resulting from surface tension.

Abstract: An inductive rotational speed sensor, including: a coil body having a coil and connecting lines which at least partially extend axially or radially with respect to the coil windings; a casing formed from a plastics material and at least partially enclosing the coil body; and a fixing device for facilitating a configuration of the casing, the fixing device including: for radially extending connecting lines, a material core clearance in the casing so as to fix the electrical connecting lines at a mutual spacing when configuring the casing; or an anti-twist safeguard to prevent the coil body rotating relative to a tool used for configuring the casing while the latter is being configured, wherein the anti-twist safeguard partially protrudes from the casing, or extends at least up to an external surface of the casing. Also described is a related method.

Abstract: A new and improved separable loadbreak connector system capable of providing higher switching and fault close ratings by various means of dividing the arc energy within the connector system.

Abstract: Provided is a proximity sensor that can limit degradation in voltage resistance. A proximity sensor includes: a housing; a coil portion that is accommodated in one end of the housing; a clamp portion that is connected to the other end of the housing; a substrate which is accommodated inside the housing and the clamp portion, and on which a circuit electrically connected to the coil portion is mounted; a shield that covers a part of the substrate located on a side of the housing; and a resin portion which is arranged inside the housing and the clamp portion, and covers at least a part of the substrate. The shield has an extension portion which extends to an inside of the clamp portion and covers at least a part of the circuit located inside the clamp portion.

Abstract: A circuit module (101) includes a circuit board (1) having a main surface (1u), an electronic component (3) mounted on the main surface (1u), and a sealing resin (4) covering at least part of the electronic component (3) on the main surface (1u). A recess (7) is formed on at least part of a side surface (11) of the sealing resin (4). At least the recess (7) is covered with an electrically conductive film (6).

Abstract: A process for manufacturing a rubber patch comprising a radiofrequency transponder, the patch having a first layer and a second layer, the method comprising moulding and vulcanizing a first layer, the exterior surface of which comprises a cavity able to receive a radiofrequency transponder, placing a transponder in the cavity, and then placing and vulcanizing a second layer in order to embed the transponder between the two layers.

Abstract: A transformer comprises at least two windings and each of the at least two windings includes at least one lead-out wire, and a silicone rubber heat-shrinkable sleeve is wrapped around the outer surface of the lead-out wire. The at least two windings and a portion of the silicone rubber heat-shrinkable sleeve are encapsulated in a potting box with a first potting sealant, and another portion of the silicone rubber heat-shrinkable sleeve is exposed outside of the potting box.

Abstract: A transformer comprises at least two windings and each of the at least two windings includes at least one lead-out wire, and a silicone rubber heat-shrinkable sleeve is wrapped around the outer surface of the lead-out wire. The at least two windings and a portion of the silicone rubber heat-shrinkable sleeve are encapsulated in a potting box with a first potting sealant, and another portion of the silicone rubber heat-shrinkable sleeve is exposed outside of the potting box.

Abstract: An acoustic wave device includes a silicon support substrate that includes first and second main surfaces opposing each other, a piezoelectric structure provided on the first main surface and including the piezoelectric layer, an IDT electrode provided on the piezoelectric layer, a support layer provided on the first main surface of the silicon support substrate and surrounding the piezoelectric layer, a cover layer provided on the support layer, a through-via electrode that extending through the silicon support substrate and the piezoelectric structure, and a first wiring electrode connected to the through-via electrode and electrically connected to the IDT electrode. The piezoelectric structure includes at least one layer having an insulating property, the at least one layer including the piezoelectric layer. The first wiring electrode is provided on the layer having an insulating property in the piezoelectric structure.

Abstract: A semiconductor package structure includes a carrier, an electronic device, a spacer, a transparent panel, and a conductive wire. The electronic device has a first surface and an optical structure on the first surface. The spacer is disposed on the first surface to enclose the optical structure of the electronic device. The transparent panel is disposed on the spacer. The conductive wire electrically connects the electronic device to the carrier and is exposed to air.

Abstract: A power module package structure includes, from top to bottom, a layer of power chips, an upper bonding layer, a thermally-conductive and electrically-insulating composite layer, and a heat dissipation layer. The thermally-conductive and electrically-insulating composite layer contains an insulating layer and an upper copper layer that is formed on the insulating layer. One or more layers of upper packaging materials are covered over the layer of power chips and the upper bonding layer and are in contact with an upper surface of the upper copper layer. One or more layers of lower packaging materials are in contact with the insulating layer and are in contact with sidewalls of the upper copper layer. The lower packaging material has a higher rigidity than the upper packaging material.

Abstract: A semiconductor package structure includes a carrier, an electronic device, a spacer, a transparent panel, and a conductive wire. The electronic device has a first surface and an optical structure on the first surface. The spacer is disposed on the first surface to enclose the optical structure of the electronic device. The transparent panel is disposed on the spacer. The conductive wire electrically connects the electronic device to the carrier and is exposed to air.

Abstract: An electronic device and a method of manufacturing an electronic device. As non-limiting examples, various aspects of this disclosure provide various methods of manufacturing electronic devices, and electronic devices manufactured thereby, that comprise utilizing metal studs to further set a semiconductor die into the encapsulant.

Abstract: A multi-memory SD card includes an enclosure having the outer dimensions of a standard SD card. Two separate SiP SD packages are provided along with two separate sets of electrical contacts each according to the SD standard to provide, in a single SD card bundle, the functions and performance of two SD cards. The SiP packages may both be full size SD format, or one may be a micro- or nano- SD card. The first and second SiP SD packages has the same or different capacity and/or speed, and the micro- or nano- SiP package is permanent or removable. An onboard battery and/or PCB may also be housed in the enclosure for configuring WiFi/redundant array of independent disks (RAID) or backup.

Abstract: A method of embedding opto-electronic components in a layer, wherein the components are disposed beside one another to be spaced apart on a carrier, including providing a molding tool having a bearing plate, wherein the bearing plate on a lower side includes resilient bearing regions, bringing the bearing plate by way of the resilient bearing regions to bear on upper sides of the components, filling an intermediate space between the components, the carrier, and the bearing plate with a molding material, curing the molding material to form the layer, and removing the molding tool from the layer and the embedded components.

Abstract: Various embodiments provide a process for producing an optoelectronic component. The process includes forming a first electrode and at least one contact section atop a carrier, forming an optically functional layer structure atop the first electrode, forming a second electrode atop the optically functional layer structure, the first electrode or the second electrode being electrically connected to the contact section, applying a protective layer to at least a subregion of the contact section, the protective layer being formed by a material which is repellent to a substance for production of an encapsulation layer, and forming the encapsulation layer atop the second electrode and atop the contact section, the subregion remaining free of the encapsulation layer because of the protective layer.

Abstract: For a pressure-sensor assembly, including a carrier substrate having conductor tracks disposed on a first side of the carrier substrate, a pressure-sensor element that is mounted on the first side of the carrier substrate and is electrically contacted via a bonding-wire connection to a conductor track located on the first side of the carrier substrate, as well as a frame part having a full-perimeter frame wall, the frame part being positioned on the first side of the carrier substrate around the pressure-sensor element, and the frame part being filled with a gel covering the pressure-sensor element, it is provided that in addition to the full-perimeter frame wall, the frame part has a base which is positioned on at least one conductor track disposed on the first side of the carrier substrate.

Abstract: The invention relates to an electronic unit (100, 100?) comprising at least one printed circuit board (10, 10?, 20) which is populated with a plurality of electric and/or electronic components (50, 50.1, 50.2) on one side or on both sides and which is incorporated into at least one protective housing (90) made of a solidified potting compound (80?). In the process, the electronic unit overall forms a volume body (200) in which the solidified potting compound takes up a filling volume (70). In order to minimize the filling volume, the electronic unit additionally comprises a separate insert molding part (60) which is arranged at least adjacently to a populated side of the at least one printed circuit board and which takes up a spatially closed displacement volume in the volume body with respect to a flowable potting compound for forming the protective housing in a solidified state (80?).

Abstract: Provided is an electronic control device that can be reduced in size and weight and can maintain high reliability even under a severe environment. The electronic control device includes: a control substrate; a connector having one end connected to the control substrate and the other end connected to an external terminal; and a housing that covers at least the control substrate and a connecting portion on the connector with the control substrate, in which the housing includes a resin and a metal plate, the metal plate includes a bend part at its outer peripheral portion, and the bend part is covered with the resin.

Abstract: A ball grid array (BGA) assembly can include a component substrate having at least one underfill channel defined therethrough providing fluidic communication between a first side of the component substrate and a second side of the component substrate, a plurality of pads or leads exposed on the second side and configured to be soldered to a mating PCB, a cover mounted to the component substrate defining a reservoir cavity between the first side and the cover, and an underfill material disposed within the reservoir cavity such that the underfill material can flow through the at least one underfill channel to a gap defined between the second side and the mating PCB when the component substrate is being soldered to the mating PCB.

Abstract: Provided are a touch sensitive element and a display device including the same. According to the exemplary embodiment of the present disclosure, a touch sensitive element, includes: an electroactive layer which is formed of electroactive polymer (EAP); an electrode which is disposed on at least one surface of the electroactive layer; and a hard coating layer which is disposed on the electroactive layer and the electrode and has a negative coefficient of thermal expansion (CTE). Therefore, vibration effect in a vertical direction is maximized and impact resistance may be improved.

Abstract: A printed circuit board assembly (1) is provided that comprises a stacked or folded printed circuit board populated by components (2, 3), wherein printed circuit board regions (10, 11, 12) lying opposite one another are electrically connected to one another at least one edge, and wherein the printed circuit board and the components (2, 3) are encased in an encapsulation (4), and wherein at least one separating element (5) is located inside the encapsulation and between each pair of opposing and electrically connected printed circuit board regions (10, 11, 12).

Abstract: A control unit for an apparatus, the control unit comprising: a component-carrying member provided with at least one electronic component configured to provide a function of the apparatus; wherein the component-carrying member is formed of a material that is pliable at least during assembly of the control unit; and a laminate encapsulation layer encapsulating at least a part of the or each electronic component. Optionally, the control unit comprises a second member which defines a user-interaction surface.

Abstract: An optoelectronic component includes a carrier with at least two radiation sources that generate electromagnetic radiation, including a housing consisting of a material non-transmissive to the electromagnetic radiation from the radiation sources, wherein at least two openings are provided in the housing, each opening is closed with a plate, the plate consists of a material transmissive to the electromagnetic radiation from the respective radiation source, and a radiation source is respectively assigned to an opening.

Abstract: A circuit board manufacturing method which includes inserting either a first claw or a second claw through a notch formed by notching an edge of a hole of a wiring board. The first claw and the second claw project outward from a wall portion of a cover member. The cover member is held on the wiring board, by sliding the cover member relative to the wiring board to position the edge of the hole between the first claw and the second claw provided on a surface of the wall portion identical to a surface on which the first claw is provided. The cover member is detached from the wiring board, by sliding the cover member relative to the wiring board to shift the first claw from the component mounting surface side to a soldering surface side with the first claw passing through the notch.

Abstract: A motor vehicle headlight module has a semiconductor light source and a projection lens, which generates a light distribution in which an edge of the semiconductor light source is projected as a light/dark boundary, wherein the projection lens has a first subsection that generates a first subsidiary light distribution, and a second subsection that generates a second subsidiary light distribution, which is superimposed on the first subsidiary light distribution. The projection lens has a third subsection, which generates a third subsidiary light distribution, which is delimited by the light/dark boundary, and which overlaps the first subsidiary light distribution and the second subsidiary light distribution, wherein the first subsidiary light distribution and the second subsidiary light distribution lie below the light/dark boundary generated by the third subsection.

Abstract: A housing of a field device of measuring- and automation technology, comprising a housing body, which has at least two housing chambers, wherein the housing chambers are connected together by an opening. The opening is adapted to accommodate a circuit board which is held by at least one holder, wherein the circuit board is adapted to be populated with electronic components or assemblies. The opening is Ex-d sealed with a potting compound.

Abstract: In order to minimize a force transfer at electronic components (1), in particular sensors (1) whose electronic circuit in an interior of a housing (2) is encased by an initially liquid or highly viscous hardening encasement compound (20) at an increasing temperature from the hardened encasement compound to the electronic components (4, 24) it is proposed according to the invention to perform the encasement so that in the cured condition all required portions and components (4, 24) are covered by the encasement compound (20) but sufficient cavities (21.1, 22.2) remain in the interior spaces (14.1, 14.2) of the housing (2) so that the hardened encasement compound (20) can expand into the cavities.

Abstract: A chip packaging structure and a manufacturing method for the same are provided. The chip packaging structure includes a first chip, a second chip and a transfer component. The first chip has a plurality of first bonding pads formed on the top surface of the first chip. The second chip has a plurality of second bonding pads formed on the top surface of the second chip. The first chip and the second chip are arranged abreast and electrically connected to each other. The transfer component is disposed on the top surface of the first chip and electrically connected with the first chip. Via these arrangements, the chip packaging structure can have smaller dimensions.

Abstract: The present disclosure relates to encapsulant compositions for use with hard disk drive devices.

Abstract: Disclosed is an organic light-emitting display device, in which a compensation pattern is selectively provided between two dam patterns depending on the arrangement density of a lower structure thereof, thereby making the width of a seal pattern uniform for each area. As a result, the reliability of the device is greatly improved.

Abstract: An electronic package includes a carrier and a semiconductor chip. In a first aspect, a lid is attached to the chip and subsequently the gap between the lid and the carrier is filled by a seal band that includes seal band material and a plurality of shim members. In another aspect, an interleaved seal band includes a pattern of a first type of seal band material and a second type of seal band material. In another aspect, the lid includes a plurality of surfaces at different topographies to reduce the thickness of the seal band between the topographic lid and the carrier. In yet another aspect the electronic package further includes a frame concentric with the chip. The lid is attached to the frame with a solder, epoxy or elastomer and placed on the chip with a thermal interface material. The seal band material is dispensed on the chip carrier and the frame is then moved towards the chip carrier allowing a minimum seal band thickness.

Abstract: A device for preventing unwanted opening of a locked enclosure includes a lock bolt moveable between a locked position and an unlocked position. A face gear is meshable with and rotatable by the worm gear between locking and unlocking positions when the worm gear is driven in the first and second directions, respectively. A blocker member is rotatable between first and second positions. A biasing member is operatively coupled to the face gear and the blocker member to bias the blocker member in a biasing direction. A sliding member selectively disengages the blocker member to allow the blocker member to rotate in the biasing direction. A lever arm is operatively coupled to the sliding member such that the lever arm is in the disengaged and engageable positions when the sliding member engages the blocker member in the first and second positions, respectively.

Abstract: An electronic device unit includes a circuit board having: a sealing resin portion in which a region in which an electronic component is mounted is sealed by a sealing resin; and a board end portion exposed from a side of the sealing resin portion. A plurality of connection terminals are provided on the board end portion so as to be aligned in a direction of the side of the sealing resin portion, and a resin portion thicker than the board end portion and having a wall-like projection shape is provided at at least one of side surfaces of the board end portion in the direction of the side. The resin portion is integrally molded with the sealing resin portion of the circuit board and a side surface of the resin portion is press-fitted into an insertion chamber of a connector.

Abstract: A radiation detector to be irradiated with nuclear particles, includes an electrical connection system including an anode and a cathode; a metal housing, inside of which at least one portion of the electrical connection system is positioned; a semi-conductor sensor including a first electrical circuit, the sensor being encapsulated in the housing; and an attachment system for attaching the sensor to the housing, the attachment system including an electrically conductive material, at least one portion of the attachment system being connected to the anode of the electrical connection system and being removably linked to the sensor, at least one second portion of the attachment system being linked to the cathode of the electrical connection system and being removably linked to the sensor.

Abstract: An electronics thermal conduction package is provided. The package may include a housing and an interior space, or envelope, configured to receive a printed circuit board assembly (“PCBA”) with one or more microprocessors or other heat generating elements. The package can be elastically deformed to open a dimension of the envelope, or receiving cavity, such that a complete PCBA can be inserted inside the interior space of the package. Once inserted, the package may be returned to its undeformed, or substantially undeformed, state such that surfaces in the interior space of the package contact one or more of the heat generating elements on the PCBA creating a conductive thermal path from the heat generating elements to the housing of the package.

Abstract: A semiconductor die that includes a first die located on a first side of an interposer and a second die located on a second side of the interposer. Active sides of the first and second dies may each face the interposer. A bond wire may electrically connect the first die to the second side of the interposer and a bond wire may electrically connect the second die to the first side of the interposer. The bond wires may extend through a plurality of windows in the interposer. First and second dies may be attached to a first side of an interposer and may be electrically connected to a second side of the interposer through windows and third and fourth dies may be attached to a second side of the interposer and may be electrically connected to the first side of the interposer through windows.

Abstract: The embodiments of the present disclosure relate to a power package module of multiple power chips and a method of manufacturing a power chip unit. The power package module of multiple power chips includes: a power chip unit including at least two power chips placed in parallel and a bonding part bonding the two power chips; a substrate supporting the power chip unit and including a metal layer electronically connecting with the power chip unit; and a sealing layer isolating the power chip unit on the substrate from surroundings to seal the power chip unit; the bonding part and the sealing layer are made from different insulated material, the distance of a gap between the two power chips placed in parallel is smaller than or equal to a preset width, and the bonding part is filled in the gap, insulatedly bonding the two power chips placed in parallel.

Abstract: The disclosure relates to a mechatronic assembly. The assembly includes a supporting circuit board with at least one populated flat side. A multiplicity of electronic components are arranged on the at least one populated flat side. In addition, at least one mechanical insert part for the mechanical fixing of at least one electronic component is also arranged on the at least one populated flat side. An encapsulation of one-piece design is provided which, in form-fitting and cohesive fashion, surrounds all of the components arranged on the at least one populated flat side of the supporting circuit board. The disclosure also relates to a method for producing the mechatronic assembly.

Abstract: An organic EL display device (electroluminescence device) including a TFT substrate (substrate), an organic EL element (electroluminescence element) disposed on the TFT substrate, a first inorganic film covering the organic EL element, at least one protruding body having a frame shape, the at least one protruding body being configured by an organic film and surrounding the electroluminescence element on the first inorganic film, a second inorganic film covering the first inorganic film and the at least one protruding body, and a leveled film configured by an organic film and provided on the second inorganic film.

Abstract: A vehicle chassis sensor assembly comprising a housing member defining a sensor cartridge slot, a rotatable shaft with a magnet and retained in a sleeve, and a rotatable arm coupled to the shaft. A sensor cartridge is mounted in the slot through the interior of a connector socket and an opening between the slot and the connector socket. A plate on the sensor cartridge covers the opening. The sensor cartridge includes a terminal header and a separate board mounted to the terminal header. The board includes the sensor. Deformable posts on the terminal header and the sensor assembly extend through respective apertures in the board and the terminal header for securing the board and the sensor cartridge to the terminal header and the sensor assembly respectively.

Abstract: A LED flip-chip package substrate includes a ceramic base (e.g., aluminum nitride base), a conductive wire layer disposed on the ceramic base and having pads in pairs, an insulating protective layer (e.g., low-temperature glass glaze layer) disposed on a same side of the ceramic base as the conductive wire layer and exposing the pads, and a metallic reflective layer (e.g., aluminum layer) disposed on a side of the insulating protective layer facing away from the ceramic base and exposing the pads. Moreover, a LED package structure adopting the LED flip-chip package substrate and other LED package structures with similar material layers such as a chip-level packaged LED package structure are provided. By comprehensively utilizing advantages of various materials, the LED flip-chip package substrate with high heat conductivity, high reflectivity, high stability and superior insulation and the LED package structure with high reliability and even high light extraction efficiency are obtained.

Abstract: In some embodiments, the present disclosure relates to a package for holding a plurality of integrated circuits. The package includes a first conductive pad over a first chip and a second conductive pad over a second chip. A molding structure surrounds the first chip and the second chip. A first passivation layer is over the first chip and the second chip, and a conductive structure is over the first passivation layer. The conductive structure is coupled to the first conductive pad. A second passivation layer is over the conductive structure. The first passivation layer and the second passivation layer have sidewalls defining an aperture that is directly over an optical element within the second chip and that extends through the first passivation layer and the second passivation layer.

Abstract: An electronic component includes an electronic component element including first and second main surfaces, a heat-dissipation accelerating member on the first main surface, a sealing resin layer sealing the electronic component element, and a shielding member provided on the sealing resin layer and electrically connected to the heat-dissipation accelerating member. The heat-dissipation accelerating member includes fourth and fifth main surfaces. The electronic component includes a connecting member disposed on the fifth main surface of the heat-dissipation accelerating member and electrically connecting at least one portion of the heat-dissipation accelerating member and the shielding member. The connecting member has a higher thermal conductivity than the sealing resin layer. The contact area between the heat-dissipation accelerating member and the connecting member is smaller than the area of the fifth main surface.

Abstract: An apparatus is described having a build-up layer. The build-up layer has a pad side of multiple die pressed into a bottom side of the build-up layer. The multiple die have wide pads to facilitate on wafer testing of the multiple die. The wide pads are spaced a minimum distance permitted by a manufacturing process used to manufacture their respective die. The build-up layer above the wide pads is removed. The apparatus also includes metallization on a top side of the build-up layer that substantially fills regions above the wide pads. The metallization includes lands above the wide pads and multiple wires between the wide pads.

Abstract: A wafer-level semiconductor die attachment method includes placing a semiconductor die of a plurality of semiconductor dies at an initial placement position to overlap a sub-mount pad on a sub-mount of a pre-singulated wafer. A die pad of the semiconductor die comes in contact with a solder layer deposited over the sub-mount pad. The semiconductor die and the sub-mount include a plurality of die and sub-mount mating features, respectively. The solder layer is heated locally to temporarily hold the semiconductor die at the initial placement position. The pre-singulated wafer is reflowed, when each semiconductor die is temporarily held at the corresponding initial placement position. During reflow, each semiconductor die slides from the initial placement position and a contact is established between the corresponding plurality of die and sub-mount mating features. Thereby, each semiconductor die is permanently attached to the corresponding sub-mount.

Abstract: A packaged semiconductor device is made by forming a conductive pad on an external surface of an integrated circuit device, forming a passivation layer over the conductive pad, removing a portion of the passivation layer over a bond area on the conductive pad, forming a sacrificial anode around a majority of a periphery surrounding the bond area, forming a conductive bond in the bond area, and forming an encapsulating material around the conductive bond and an exposed portion of the sacrificial anode.