Shock Absorption Patents (Class 174/544)
  • Patent number: 11737229
    Abstract: Housings for electronic devices are disclosed. According to one aspect, adjoining surfaces of electronic device housings can be mounted or arranged such that adjoining surfaces are flush to a high degree of precision. The electronic devices can be portable and in some cases handheld.
    Type: Grant
    Filed: August 30, 2022
    Date of Patent: August 22, 2023
    Assignee: APPLE INC.
    Inventors: David Pakula, Richard Hung Minh Dinh, Scott Myers, Tang Yew Tan
  • Patent number: 11737230
    Abstract: Housings for electronic devices are disclosed. According to one aspect, adjoining surfaces of electronic device housings can be mounted or arranged such that adjoining surfaces are flush to a high degree of precision. The electronic devices can be portable and in some cases handheld.
    Type: Grant
    Filed: September 12, 2022
    Date of Patent: August 22, 2023
    Assignee: APPLE INC.
    Inventors: David Pakula, Richard Hung Minh Dinh, Scott Myers, Tang Yew Tan
  • Patent number: 11600874
    Abstract: The electrical equipment battery includes: a circuit board mounted with a heat generating element; and an outer case having a heat radiation plate made of metal. A heat transfer space is defined between the circuit board and the heat radiation plate, and then an electrical-insulating and heat-conducting gel is filled in the heat transfer space. Heat energy of the heat generating element is radiated to the outside via the heat radiation plate of the outer case. The heat radiation plate is provided with a flow-out block partition on the outer side of the heat transfer space. The flow-out block partition suppresses the electrical-insulating and heat-conducting gel from flowing out from the heat transfer space.
    Type: Grant
    Filed: November 22, 2017
    Date of Patent: March 7, 2023
    Assignee: SANYO Electric Co., Ltd.
    Inventor: Hiroyuki Takahashi
  • Patent number: 11403503
    Abstract: Example embodiments of systems and methods for preventing chip fraud are provided. A chip fraud prevention system may comprise a device including a chip, wherein the chip is at least partially encompassed in a chip pocket. One or more connections may be communicatively coupled to one or more surfaces of the chip, and a capacitance member may be coupled to a surface of the chip. The capacitance member may comprise a known capacitance value and the chip may comprise a memory containing an applet, wherein the applet is configured to measure the capacitance value of the capacitance member.
    Type: Grant
    Filed: March 5, 2021
    Date of Patent: August 2, 2022
    Assignee: CAPITAL ONE SERVICES, LLC
    Inventors: Daniel Herrington, Stephen Schneider, Tyler Maiman
  • Patent number: 11316325
    Abstract: An apparatus includes a first terminal configured to be coupled to a substation around mat for a substation and a second terminal configured to be coupled to a safety around mat for a piece of electrical equipment powered by the substation. The system further includes at least one voltage-dependent resistance device, such as at least one metal oxide varistor (MOV) configured to be coupled between the first and second terminals. At least one circuit interruption device, such as a fuse and/or a disconnect switch may be coupled in series with the at least one voltage-dependent resistance device.
    Type: Grant
    Filed: January 9, 2020
    Date of Patent: April 26, 2022
    Assignee: Eaton Intelligent Power Limited
    Inventors: Matthew A. Moore, Michael Peters, David Shipp
  • Patent number: 11016289
    Abstract: A micromirror actuator assembly includes a lower printed circuit board (PCB), an upper PCB, and a frame spaced away from the lower PCB and spaced away from the upper PCB between the lower PCB and the upper PCB. A micromirror is rotatably attached to the frame. A plurality of piezoelectric actuators are affixed to the frame and configured to selectively deform the frame to scan the micromirror.
    Type: Grant
    Filed: August 31, 2018
    Date of Patent: May 25, 2021
    Assignee: Microsoft Technology Licensing, LLC
    Inventor: Michael James Nystrom
  • Patent number: 11008153
    Abstract: Provided are multiply-insulated articles, comprising at least first and second containers disposed together such that the interior volume of the first container is sealed against the environment exterior to the article.
    Type: Grant
    Filed: November 14, 2017
    Date of Patent: May 18, 2021
    Assignee: Concept Group LLP
    Inventor: Aarne H. Reid
  • Patent number: 10981782
    Abstract: A process for fabricating a device for detecting electromagnetic radiation, including an encapsulation structure including an encapsulation layer on which a relief rests, and a sealing layer, which has a local breakage in continuity at the relief.
    Type: Grant
    Filed: October 10, 2019
    Date of Patent: April 20, 2021
    Assignee: Commissariat A L'Energie Atomique et aux Energies Alternatives
    Inventors: Jean-Jacques Yon, Geoffroy Dumont
  • Patent number: 10983085
    Abstract: Disclosed is a gas sensor for detecting a measurement target gas in a measurement gas atmosphere, including: a first sensor element; a first installation part defining a first inner space in which the first sensor element is installed; and a casing accommodating therein the first installation part. The casing has an opening formed to introduce the measurement target gas into an inside of the casing. The first installation part has: a first gas introduction hole formed to provide communication between the first inner space and the inside of the casing; and a membrane member arranged to cover the first gas introduction hole and having permeability to water vapor and substantially no permeability to the measurement target gas. At least a portion of the first installation part in contact with the membrane member is made of insulating ceramic material or resin material.
    Type: Grant
    Filed: July 31, 2018
    Date of Patent: April 20, 2021
    Assignee: NGK SPARK PLUG CO., LTD.
    Inventors: Yusuke Matsukura, Shoji Kitanoya, Masaya Watanabe, Daisuke Ichikawa, Masahiro Yamashita
  • Patent number: 10842035
    Abstract: This application relates to an enclosure for a portable electronic device. The enclosure includes a titanium substrate having interstitial nitrogen atoms, where the titanium substrate is characterized as having an a* value that is less than 1, a b* value that is less than 5, and an L* value that is more than 70.
    Type: Grant
    Filed: September 5, 2019
    Date of Patent: November 17, 2020
    Assignee: APPLE INC.
    Inventors: James A. Curran, Zechariah D. Feinberg, Todd S. Mintz
  • Patent number: 10736233
    Abstract: A cooling device for an electromagnetic interference filter is disclosed. The cooling device includes a housing. The housing includes a main body having a cavity shaped to receive the electromagnetic interference filter and one or more cooling channels surrounding at least a portion of the cavity in the main body of the housing. The one or more cooling channels define one or more flow paths that are contained completely within the housing. The housing also includes an inlet port and an outlet port. The one or more cooling channels fluidly connect the inlet port to the outlet port, and a cooling medium is configured to flow into the inlet port, through the one or more cooling channels, and exit the housing through the outlet port.
    Type: Grant
    Filed: April 25, 2019
    Date of Patent: August 4, 2020
    Assignee: The Boeing Company
    Inventors: Timothy D. Messer, John Dalton Williams
  • Patent number: 10664026
    Abstract: A portable electronic device including a shell, a cover plate, a battery module, a heat generating element and a heat pipe. The cover plate and the shell jointly define an accommodating space. The battery module includes an extending portion protruding from a surface of the battery module for jointly defining a stepped groove with the surface. The heat generating element is disposed in the accommodating space. The heat pipe is disposed in the stepped groove and thermally coupled to the heat generating element.
    Type: Grant
    Filed: August 29, 2018
    Date of Patent: May 26, 2020
    Assignee: HTC Corporation
    Inventors: Yung-Hsiang Wang, Li-Hsun Chang, Ting-An Kuo, Cheng-Te Chen
  • Patent number: 10459266
    Abstract: The present application discloses a display module including a display substrate having a display area and a peripheral area surrounding the display area; a packaging cover facing the display substrate; and a mold frame having a frame shape and configured to receive the display substrate and the packaging cover. In the present display module, the mold frame includes a main body and a protrusion protruding away from an inner surface of the mold frame, the protrusion is between the display substrate and the packaging cover; the packaging cover has a recess in an area corresponding to the protrusion for receiving the protrusion; the recess and the protrusion complementarily match each other; and the protrusion has a first surface abutting the peripheral area of the display substrate and a second surface opposite to the first surface, the second surface abutting a surface of the recess.
    Type: Grant
    Filed: August 4, 2016
    Date of Patent: October 29, 2019
    Assignee: BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Zifeng Wang, Yan Ren, Lei Cao, Nannan Hu, She Lin
  • Patent number: 10408657
    Abstract: A spacer for keeping a distance between a bar-shaped inner conductor and an outer conductor of a filling level measuring probe. The spacer includes a ring and at least three supports, which respectively extend out of an inner surface of the ring in a radial direction. Each of the three supports has a curved front surface on an end, which is located away from the inner surface. The end, which is located away from the inner surface is engageable with an opening of the bar-shaped inner conductor.
    Type: Grant
    Filed: June 13, 2017
    Date of Patent: September 10, 2019
    Assignee: VEGA GRIESHABER KG
    Inventor: Juergen Dietmeier
  • Patent number: 10405441
    Abstract: An electronic device having a buffering positioning mechanism includes a casing, an internal module and at least one buffer member. The casing includes two shells. Internal components of the electronic device are all provided on a carrier and are assembled to form the internal module. The internal module is accommodated in the casing, and is fixed to the casing without using any fixing elements. The buffer member fills and supports between an inner wall of the casing and an outer wall of the internal module, wherein the inner wall and the outer wall are opposite each other. Thus, collision resistance and fall resistance as well as an effect of fixing the internal module in the casing without using any fixing elements are achieved.
    Type: Grant
    Filed: October 23, 2018
    Date of Patent: September 3, 2019
    Assignee: GETAC TECHNOLOGY CORPORATION
    Inventor: Chi-Chen Lo
  • Patent number: 10345873
    Abstract: An information handling system (IHS) includes user selectable compute components including a storage drive. A chassis includes a base panel having an upper chassis surface. At least one resilient component is coupled to the upper chassis surface. An upwardly presented adhesive surface on one or more of the at least one resilient component can fixedly engage and provide vibration damping for a vibration-susceptible compute component that is inserted during provisioning or later modification or repair of the IHS.
    Type: Grant
    Filed: March 30, 2015
    Date of Patent: July 9, 2019
    Assignee: Dell Products, L.P.
    Inventors: Daniel Alvarado, Edmond I. Bailey
  • Patent number: 10095284
    Abstract: A portable electronic device including a shell, a cover plate, a battery module, a heat generating element and a heat pipe. The shell includes an arc-shaped surface. The cover plate and the shell jointly define an accommodating space. The battery module is disposed in the accommodating space, and the battery module and the arc-shaped surface have a gap therebetween. The heat generating element is disposed in the accommodating space. The heat pipe is disposed in the gap and thermally coupled to the heat generating element. Moreover, the battery module also includes a stepped groove, and the heat pipe is disposed in the stepped groove.
    Type: Grant
    Filed: January 29, 2016
    Date of Patent: October 9, 2018
    Assignee: HTC Corporation
    Inventors: Yung-Hsiang Wang, Li-Hsun Chang, Ting-An Kuo, Cheng-Te Chen
  • Patent number: 10034412
    Abstract: A subsea electronic device includes a housing, a chassis within the housing to which one or more electronic cards are mounted and heat transfer sections in thermal contact with the electronic cards. The heat transfer sections are in interference fit with an inner surface of the housing thereby to transfer, in use, heat from the electronic cards through the heat transfer sections to the housing. There is also a subsea electronic device housing and a method of assembling a subsea electronic device.
    Type: Grant
    Filed: October 6, 2015
    Date of Patent: July 24, 2018
    Assignee: AKER SOLUTIONS LIMITED
    Inventors: Stuart Reid, Daniel Ahrens, Kenneth Hood
  • Patent number: 10028409
    Abstract: An immersion cooling arrangement includes a housing containing a liquid coolant. An electrical device is submerged within the liquid coolant. A printed wiring board is seated on the housing and separates the coolant from the environment external to the housing to provide penetration-free electrical communication between a power source and the electrical device.
    Type: Grant
    Filed: January 6, 2017
    Date of Patent: July 17, 2018
    Assignee: Hamilton Sundstrand Corporation
    Inventors: Mark W. Metzler, John Huss, Ernest Thompson
  • Patent number: 9976404
    Abstract: A downhole tool includes a tool body having an inner surface portion and an outer surface portion. The outer surface portion includes a recess having a peripheral wall and an inner surface. A multi-chip module (MCM) housing is defined in the recess. The MCM housing includes one or more fortifying members that support axial and radial loading of the downhole tool and include one or more electronics receiving zones.
    Type: Grant
    Filed: May 20, 2014
    Date of Patent: May 22, 2018
    Assignee: BAKER HUGHES, A GE COMPANY, LLC
    Inventors: Stephan Mueller, Hans Robert Oppelaar, Robert Buda, Henning Rahn, Carsten Haubold, Ingo Roders, Detlev Benedict
  • Patent number: 9899282
    Abstract: A semiconductor package includes a suspended substrate having one or more semiconductor devices thereon, a metallic case covering the suspended substrate, the suspended substrate being supported by a plurality of mechanical leads on opposing sides of the semiconductor package, at least one of the plurality of mechanical leads having a coefficient of thermal expansion (CTE) that substantially matches a CTE of the suspended substrate, where at least one of the plurality of mechanical leads is electrically connected to the suspended substrate, and where the plurality of mechanical leads absorb mechanical shocks so as to prevent damage to the semiconductor package. The semiconductor package also includes a thermal gel between the suspended substrate and the metallic case. The suspended substrate can be a printed circuit board. The metallic case includes mounting ears for transferring heat away from the semiconductor package.
    Type: Grant
    Filed: May 6, 2016
    Date of Patent: February 20, 2018
    Assignee: Infineon Technologies Americas Corp.
    Inventor: Wayne Partington
  • Patent number: 9896331
    Abstract: Method for encapsulating a microelectronic device, comprising the following steps: producing a sacrificial portion covering the device; producing a cover covering the sacrificial portion, comprising two superimposed layers of separate materials and having different residual stresses and/or coefficients of thermal expansion; etching, through the cover, of a trench of which the pattern comprises a curve and/or two straight non-parallel segments; etching of the sacrificial portion through the trench; depositing a sealing material on the trench; in which, during the etching of the sacrificial portion, a portion of the cover defined by the trench deforms under the effect of a mechanical stress generated by the residual stresses and/or a thermal expansion of the layers of the cover and increases the dimensions of the trench, this stress being eliminated before the sealing of the trench.
    Type: Grant
    Filed: November 21, 2016
    Date of Patent: February 20, 2018
    Assignee: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
    Inventors: Jean-Louis Pornin, Xavier Baillin
  • Patent number: 9858522
    Abstract: A security document (1, 1?), comprising: a base layer (10, 10?) having a through hole (15, 15?) extending from a first side of the base layer (10, 10?) to a second side of the base layer (10, 10?); a first cover layer (11, 11?) attached on the first side of the base layer (10, 10?); a second cover layer (12, 12?) attached on the second side of the base layer (10, 10?); and an electronic module (4, 4?) arranged in said through hole (15, 15?). The security document (1, 1?) further comprises a first patch (21, 21?) attached to the security document (1, 1?) by hot stamping and located between the base layer (10, 10?) and the first cover layer (11, 11?), the first patch (21, 21?) surrounding the through hole (15, 15?) and covering a perimeter area around the through hole (15, 15?) on the first side of the base layer (10, 10?), thereby preventing attachment of the base layer (10, 10?) to the first cover layer (11, 11?) in the region of the perimeter area.
    Type: Grant
    Filed: November 29, 2011
    Date of Patent: January 2, 2018
    Assignee: GEMALTO SA
    Inventors: Mikko Lankinen, Taru Syrjanen
  • Patent number: 9500452
    Abstract: An electronic apparatus is configured for inclusion in an arrow when shot from a bow. In some embodiments, the electronic apparatus includes a drawn tubular body and a circuit board located at least partly within the drawn tubular body.
    Type: Grant
    Filed: February 2, 2013
    Date of Patent: November 22, 2016
    Assignee: Full Flight Technology, LLC
    Inventors: Robert V. Donahoe, Paul Chandler Sabin, Jason Evan Avis
  • Patent number: 9405322
    Abstract: An example computer device includes a keyboard body further including a keyboard deck and a keyboard. In addition, the computer device includes a display body further including a display, the display body being coupled to the keyboard body such that the computer device is foldable to a closed position. Further, the computer device includes a display protector attached to the keyboard body and disposed at the keyboard deck to protect the display by contact therewith. The display protector includes a plurality of separate, discrete portions, the plurality of portions extends along each side of the keyboard, and each of the plurality of portions contacts both the keyboard deck and the display when the computer device is in the closed position and a compressible load is applied to the computer device.
    Type: Grant
    Filed: March 28, 2014
    Date of Patent: August 2, 2016
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Britt C. Ashcraft, Eric Chen, Sandie Ning Ning Cheng
  • Patent number: 9004191
    Abstract: The invention relates to a power tool, such as an impact drilling machine, impact screwdriver, saber saws, grinders, or the like, comprising a housing. In the housing, an electric motor and an electric or electronic module that is attached to holders in the housing, for example, an electric switch or electronics, are provided. Between the holders in the housing and the electrical or electronic modules, a vibration decoupling element is disposed.
    Type: Grant
    Filed: July 9, 2010
    Date of Patent: April 14, 2015
    Assignee: Marquardt GmbH
    Inventors: Jens Müller, Stephan Gasser
  • Patent number: 8922986
    Abstract: An electronic data recorder including an electronic data storage device disposed within an enclosure having a main housing and a cover adapted to engage a base region of the housing. The main housing forms a cavity housing the electronic data storage device. A mounting wall extending from the main housing and including an attachment foot for attachment to a vehicle wherein an impact during a vehicle crash preferentially fractures one or both the mounting wall and attachment foot as opposed to the main housing.
    Type: Grant
    Filed: May 31, 2011
    Date of Patent: December 30, 2014
    Assignee: Honda Motor Co., Ltd.
    Inventor: Darin S. Garrett
  • Patent number: 8634191
    Abstract: An exemplary portable electronic device includes a bottom cover, a top cover, an electronic module, and elastic washers. The top cover engages with the bottom cover to define a space therebetween. The electronic module is received in the space. Poles protrude up from the bottom cover. The elastic washers are fixed on the electronic module. A through hole is defined in each of the washers. The poles respectively extend through the through holes of the washers, and opposite ends of each of the washers respectively elastically abut the top cover and the bottom cover.
    Type: Grant
    Filed: September 23, 2011
    Date of Patent: January 21, 2014
    Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventors: Xue-Dong Tang, Ke-Hui Peng, Ren-Wen Wang, Chin-Sung Yang
  • Patent number: 8520390
    Abstract: An electro-magnetic device assembly constituted of an electro-magnetic device; a chassis arranged to sink heat; at least one thermally conductive material in thermal communication with the electro-magnetic device and with the chassis; and at least one mechanically isolating material in contact with the thermally conductive material and with the chassis, the at least one mechanically isolating material arranged to dampen the transmission of vibrations experienced by the chassis, in the direction of the magnetic field of the electro-magnetic device, to the electro-magnetic device.
    Type: Grant
    Filed: March 29, 2011
    Date of Patent: August 27, 2013
    Assignee: Microsemi Corporation
    Inventors: Douglas Seiji Okamoto, Timothy J Dasilva, Louis Ray Pledger, Jr.
  • Patent number: 8420930
    Abstract: The purpose of the disclosure is to provide an insulation structure for efficiently controlling a thermal flow and protecting objects that is easy to implement, has a low cost and is compliant with strict standards in terms of fire resistance while offering protection against crushing and immersion. Accordingly the disclosure relates to a method for protecting at least one object previously encapsulated in a sealed pocket, that comprises imbedding the objects without trapping any air in a body of a high thermal-resistance insulator containing gypsum crystals, said insulator body being cast in a structure having a high mechanical resistance to crushing, and said structure consisting of an intermediate mould or directly defining a housing. A casing obtained by said method comprises the body block of a high thermal-resistance insulator and the housing having a high mechanical resistance to crushing.
    Type: Grant
    Filed: January 8, 2009
    Date of Patent: April 16, 2013
    Assignee: Faiveley Transport Tours
    Inventors: Arnaud Martin, Frédéric Chatelain
  • Patent number: 8415569
    Abstract: A flat panel display module having anti-shock screw-tightening structure is provided. The flat panel display module includes a display panel, a flexible printed circuit, a printed circuit board, a back plate, a fastening element, and a flexible separator. The display panel has a signal connecting end. One end of the flexible printed circuit is electrically connected to the signal connecting end while the other end is electrically connected to the printed circuit board. The printed circuit board has a through hole. The back plate accommodates the display panel. The flexible printed circuit is disposed across the back plate so that the printed circuit board is parallel to the back plate. The fastening element which has a length greater than the thickness of the printed circuit board passes through the through hole and is secured to the surface of the back plate.
    Type: Grant
    Filed: November 3, 2010
    Date of Patent: April 9, 2013
    Assignee: AU Optronics Corporation
    Inventors: Hsun-Tung Chan, Chia-Ying Chao
  • Patent number: 8344270
    Abstract: A combination of a main carrier and a printed circuit board. Light and heavy electrical and/or electronic components are fixed on the printed circuit board, wherein at least one heavy component is mechanically fixedly connected to the main carrier and electrically conductively connected to conductor tracks of a first section of the printed circuit board. The first section of the printed circuit board is electrically conductively connected to a second section of the printed circuit board and decoupled from the second section of the printed circuit board with regard to mechanical vibrations by means of a decoupling device. The decoupling device may be, for example, a flexible section or a recess formed in said printed circuit board.
    Type: Grant
    Filed: May 15, 2009
    Date of Patent: January 1, 2013
    Assignee: Semikron Elektronik GmbH & Co., KG
    Inventor: Klaus Backhaus
  • Patent number: 8283578
    Abstract: Disclosed herein is a device for reducing noise generated by an electrical component, the device including a stiffening component secured to an electrical component, wherein the stiffening component provides rigidity to the electrical component, thereby reducing the mechanical resonance of the electrical component during operation. The electrical component has at least one end face and a flange portion that includes a flange face that extends about a perimeter of the end face. The flange face is substantially parallel to the end face, wherein the stiffening component is secured to the flange face of the electrical component such that it does not extend into a plane of the end face. Further, the stiffening component can include a stiffening portion and a securing portion, wherein the stiffening portion is secured to the flange face of the electrical component by the securing portion. Further, the electrical component can be a power semiconductor device.
    Type: Grant
    Filed: December 17, 2008
    Date of Patent: October 9, 2012
    Assignee: Rockwell Automation Technologies, Inc.
    Inventors: Peter Janes, Riazuddin R. Shaikh
  • Publication number: 20120160557
    Abstract: A structure including: a first part including an electrode pad in a predetermined area on a surface; a second part that is bonded to the first part using an adhesive; and a board, including a terminal pad, to which the second part is fixed, wherein the electrode pad and the terminal pad are ultrasonic-bonded, and the second part includes bosses on an area that overlaps the predetermined area in a bonding surface between the second part and the first part.
    Type: Application
    Filed: December 21, 2011
    Publication date: June 28, 2012
    Applicant: MITSUMI ELECTRIC CO., LTD.
    Inventors: Tsukasa YAMADA, Takahiko NISHIYAMA, Toyoki TANAKA
  • Patent number: 8183474
    Abstract: It consists of a microcomponent comprising a cavity (13) delimited by a cap (12) enclosing an active part (10) supported by a substrate (11). The cap (12) comprises a top wall (12a) comprising stiffening means with at least one projecting stiffening member (12b), said stiffening member (12b) being located between two recessed areas (12c) of the top wall (12a) and having one end (14) at a distance from the recessed areas (12c) without coming into contact with the substrate (11).
    Type: Grant
    Filed: May 21, 2007
    Date of Patent: May 22, 2012
    Assignee: Commissariat a l'Energie Atomique
    Inventors: Charlotte Gillot, Jean-Louis Pornin, Emmanuelle Lagoutte, Fabrice Jacquet, Sebastien Hentz
  • Patent number: 8124890
    Abstract: An electronic device includes: a housing; an electronic component provided inside the housing; and a holding member provided between an inner wall of the housing and the electronic component and configured to hold the electronic component. The holding member is configured to hold a first region of a major surface of the electronic component located on a first end surface side, and the holding member is configured not to hold a second region of the major surface of the electronic component located on a second end surface side opposed to the first end surface side.
    Type: Grant
    Filed: January 29, 2009
    Date of Patent: February 28, 2012
    Assignee: Kabushiki Kaisha Toshiba
    Inventor: Jun Morimoto
  • Patent number: 8121752
    Abstract: A flight recorder includes an information input device, heat sensitive memory device electrically connected to the information input device, and housing enclosing the heat sensitive memory device. The housing is made with a first material and having a plurality of openings made through the housing. A sacrificial material is disposed between the housing and heat sensitive memory device. The sacrificial material having a lower melting temperature than the first material such that the sacrificial material changes state and egresses through the openings in the housing when exposed to heat to create an air gap between the housing and heat sensitive memory device. The first material includes nickel and the sacrificial material includes aluminum. A heat insulating layer is disposed between the sacrificial material and heat sensitive memory device. A second sacrificial material is disposed between the heat insulating layer and heat sensitive memory device.
    Type: Grant
    Filed: May 8, 2008
    Date of Patent: February 21, 2012
    Assignee: L-3 Communications Coporation
    Inventors: Michael Winterhalter, Endre Berecz
  • Patent number: 8039764
    Abstract: A cushioning member for use in a circuit board includes an elastic main body and a fixing element. The fixing element is coupled with the elastic main body and aligned with a perforation of the circuit board. The fixing element includes an extension part and a fastening part. The extension part is arranged between the elastic main body and the fastening part. The fastening part is arranged on an end of the fixing element. The fastening part is sustained against a first surface of the circuit board and the extension part is received in the perforation after the fixing element is penetrated through the perforation, so that the cushioning member is combined with the circuit board and the elastic main body is attached on a second surface of the circuit board, wherein a cushioning efficacy is provided when the electronic device is suffered from an external force.
    Type: Grant
    Filed: March 27, 2009
    Date of Patent: October 18, 2011
    Assignee: Delta Electronics, Inc.
    Inventor: Ming-Tang Yang
  • Publication number: 20100101856
    Abstract: An organic light emitting diode (OLED) display is disclosed. One aspect includes a display panel assembly, a support member supporting edges of the display panel assembly and including an opening exposing a rear surface of the display panel assembly, and a buffer member attached to the rear surface of the display panel assembly exposed through the opening of the support member.
    Type: Application
    Filed: October 26, 2009
    Publication date: April 29, 2010
    Applicant: Samsung Mobile Display Co., Ltd.
    Inventors: Dong-Su YEE, Dai-Han Cho, Jung-Ho Hwang, Chan-Kyoung Moon, Hyun-Hee Lee, Min-Su Kim, Chan-Hee Wang
  • Patent number: 7614148
    Abstract: Cable connection unions are rapidly replaced in a universal seismic data acquisition-module without opening a main electronic circuitry protective chamber. Different connector types required for the many data transmission cable designs needed to service a wide range of survey conditions are more easily accommodated without exposing primary circuitry to the elements.
    Type: Grant
    Filed: June 5, 2006
    Date of Patent: November 10, 2009
    Assignee: Geo-X Systems, Ltd
    Inventor: Donald G. Chamberlain
  • Patent number: 7611192
    Abstract: A cover is provided between a front hood and a vehicle component. The cover includes a cover main portion, a lid, a supporting portion, a supported portion, and a contacting portion. An opening is formed on the cover main portion. The supporting portion is integrally provided on the cover main portion and around the opening. The supported portion is integrally provided on a circumferential edge of the lid and engaged with the supporting portion. The contacting portion is provided on the lid and receives a downward load from the front hood. One or both of the supporting portion and the supported portion deforms elastically in case where a load has been applied to the contacting portion and thereby the lid drops off within the opening. According to the cover, a deformable amount of the cover can be increased and maintenance costs can be reduced.
    Type: Grant
    Filed: September 24, 2008
    Date of Patent: November 3, 2009
    Assignee: Nihon Plast Co., Ltd
    Inventor: Daisuke Takei
  • Publication number: 20090255726
    Abstract: A cushioning member for use in a circuit board includes an elastic main body and a fixing element. The fixing element is coupled with the elastic main body and aligned with a perforation of the circuit board. The fixing element includes an extension part and a fastening part. The extension part is arranged between the elastic main body and the fastening part. The fastening part is arranged on an end of the fixing element. The fastening part is sustained against a first surface of the circuit board and the extension part is received in the perforation after the fixing element is penetrated through the perforation, so that the cushioning member is combined with the circuit board and the elastic main body is attached on a second surface of the circuit board, wherein a cushioning efficacy is provided when the electronic device is suffered from an external force.
    Type: Application
    Filed: March 27, 2009
    Publication date: October 15, 2009
    Inventor: Ming-Tang Yang
  • Patent number: 7333343
    Abstract: A high strength, light weight crash survivable memory unit (CSMU). The CSMU includes memory storage devices surrounded by a heat resistive material. A housing surrounds the heat resistive material. The housing includes a plurality of panels that include Titanium. Two or more of the panels are fusion welded together. The welding is performed at tapered outer edges of one or more of the panels.
    Type: Grant
    Filed: February 4, 2005
    Date of Patent: February 19, 2008
    Assignee: Honeywell International, Inc.
    Inventor: Richard A. Olzak
  • Patent number: 7315447
    Abstract: A system for mounting a hard disk drive inside an electronic apparatus in such a way that the hard disk drive is isolated from vibration and noise and heat generated by the hard disk dive is radiated to a cover of the electronic apparatus to prevent overheating. A foam heat transmission sheet is placed between the hard disk drive cover and an outer casing that is mounted to the electronic apparatus and far-infrared ray transmitting and receiving sheets are attached to the outside of the outer casing and to the inside of the cover of the electronic apparatus to transmit heat from the hard disk drive to the exterior of the apparatus.
    Type: Grant
    Filed: January 18, 2005
    Date of Patent: January 1, 2008
    Assignee: Sony Corporation
    Inventors: Kenichi Inoue, Hitoshi Suzuki, Kohtaroh Higuchi
  • Patent number: 7232960
    Abstract: According to one embodiment of the invention, an electronic device comprises a main body and a protective panel. The main body features a periphery formed by a plurality of sidewalls. The protective panel is placed over a top surface of the main body and extending outwardly beyond the periphery of the main body.
    Type: Grant
    Filed: December 21, 2004
    Date of Patent: June 19, 2007
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Yasuo Matsumoto, Kenji Shimano, Masakazu Okumura, Jim Fullalove, Martin Riddiford, Patrick Hunt
  • Patent number: 7208685
    Abstract: A hardened voyage data recorder includes two subsystems: a removable non-volatile memory and a base containing electronics and firmware for communicating with data sensing systems and for accessing the memory. According to the invention, the memory is protected in a “boiler” and the electronics includes an ETHERNET interface for connecting to shipboard data acquisition devices. The firmware is preferably configured via web pages. A communications protocol for communicating with the recorder is also disclosed.
    Type: Grant
    Filed: September 24, 2003
    Date of Patent: April 24, 2007
    Assignee: L-3 Communications Corporation
    Inventors: Margaret Browning, Gregory W. Purdom, Andrew Zarling
  • Patent number: 7167360
    Abstract: In a hard disk drive (HDD) or an electronic apparatus in which the HDD is wrapped with a foam resin sheet with a noise absorption effect and a metal outer casing to thereby damp noise, a sub-assembly wrapping body incorporating therein the HDD wrapped with a wrapping body composed of a slippery film sheet with foam resin sheets attached thereto is mounted into the metal outer casing through the slippery surface of the slippery film sheet. In order to insulate a noise generated from a recording and reproducing drive apparatus such as the HDD, the system for use with the HDD and the electronic apparatus can simplify the assembly process required when the HDD is loaded into the outer casing serving as a noise insulation box through a noise absorption member.
    Type: Grant
    Filed: January 19, 2005
    Date of Patent: January 23, 2007
    Assignee: Sony Corporation
    Inventors: Kenichi Inoue, Hitoshi Suzuki, Kohtaroh Higuchi
  • Patent number: 7158384
    Abstract: A vibration reducing structure of an electronic device includes first and second housings, a printed circuit board, a first post and a second post. The first and second housings define a closed space therebetween. The printed circuit board is disposed within the space and having a heavy component mounted on a first surface thereof. The first post is arranged on the first housing and under the heavy component. The second post is arranged on the second housing and above the heavy component.
    Type: Grant
    Filed: May 9, 2005
    Date of Patent: January 2, 2007
    Assignees: Delta Electronics, Inc., Delta Electronics (Thailand) Public Company, Limited
    Inventor: Jui Ching Huang