Abstract: A structure adapted to optical coupled to an optical fiber includes a photoelectric integrated circuit die, an electric integrated circuit die, a waveguide die and an insulating encapsulant. The electric integrated circuit die is over and electrically connected to the photoelectric integrated circuit die. The waveguide die is over and optically coupled to the photoelectric integrated circuit die, wherein the waveguide die includes a plurality of semiconductor pillar portions extending from the optical fiber to the photoelectric integrated circuit die. The insulating encapsulant laterally encapsulates the electric integrated circuit die and the waveguide die.

Abstract: An electronic device disposed in a package that includes: an interposer, fan-out interconnect (FOI), and a lid. The interposer having first size and first surface upon which die terminals (DTs) are disposed and are configured to electrically couple to integrated circuit die (IC), and second surface upon which substrate terminals (STs) are disposed and are configured to electrically couple to substrate. The IC has second size smaller than the first size, and the IC is mounted on the first surface in electrical contact with the DTs, the interposer is mounted on third surface, and the package substrate has third size, larger than the first size. The FOI establishes electrical interconnection between DTs and STs, the DTs have first pitch size and the STs have second pitch size, larger than first pitch size. The lid has first section, configured to abut fourth surface, and second section, mounted on the third surface.

Abstract: Provided is an electrical junction box that can be reduced in size by accommodating a high-voltage bus bar and a low-voltage bus bar in a space-efficient manner. The electrical junction box is an electrical junction box for a vehicle including a housing that accommodates a high-voltage bus bar for high voltages and a low-voltage bus bar for low voltages, in which the low-voltage bus bar is attached to a top plate of the housing, the high-voltage bus bar is attached to a bottom plate facing the top plate, and the high-voltage bus bar and the low-voltage bus bar are disposed overlapping each other with a clearance distance therebetween in an up-down direction.

Abstract: A pressing device for indirectly or directly applying pressure to power-semiconductor components of a power-semiconductor module, having a pressing plate, having a pressing nub element which is formed from an elastic material and which has a pressing nub plate and pressing nubs projecting therefrom, and having a receiving device for receiving the pressing nub element, which receiving device has a base plate provided with recesses, wherein the recesses run through the base plate, wherein the pressing nub plate is arranged on the base plate and the pressing nubs run through the recesses and, on the main side of the base plate facing away from the pressing nub plate, project beyond this main side of the base plate, and wherein the pressing nub plate is arranged between the pressing plate and the base plate.

Abstract: Provided is a power conversion device, including: a casing that has a front surface with an opening; an insertion component including an insertion portion; and a gasket. The casing has an inner wall surface being in contact with the gasket and a casing-side guide surface. The insertion portion has an outer peripheral surface being in contact with the gasket and an insertion component-side guide surface. When a distance in the insertion direction between the front surface and an end of the casing-side guide surface, which is closer to the front surface in the insertion direction, is represented by L1 and a distance between an inner surface of the gasket in the insertion direction and a distal end of the insertion component-side guide surface in the insertion direction is represented by L2, the distance L2 is set larger than the distance L1.

Abstract: A back plate assembly includes a base plate formed with a groove having a bottom wall and a pair of side walls opposite to each other in a first horizontal direction, and an arch plate assembled into the groove and having a pair of opposite ends in the first horizontal direction. A pair of end surfaces of the ends of the arch plate abut against the side walls and a part of a middle portion of the arch plate between the ends is not in contact with the bottom wall of the groove.

Abstract: A switch assembly is configured to be mounted to a lower cover of the junction box assembly. The switch assembly includes a holder, the holder is configured to removably coupled to the lower cover. The holder includes a pocket. The switch assembly further includes a switch. The hook is configured to engage the lower cover and is dimensioned to be seated within the pocket of the holder. The switch includes a hook. The hook is configured to pull the switch towards the lower cover so as to pinch the holder between the lower cover and the switch. Accordingly, the hook presses the switch against a bottom surface of the lower cover so as to eliminate a rattle when the switch is held in suspension beneath the lower cover of the junction box assembly.

Abstract: A MEMS device and a MEMS device manufacturing method are provided for suppressing damage to device parts. An exemplary method of manufacturing a resonance device includes radiating laser light from a bottom surface side of a second substrate to form modified regions inside the second substrate along dividing lines of a first substrate, which has device parts formed on a top surface thereof, and the second substrate, the top surface of which is bonded to the bottom surface of the first substrate via bonding portions. The method further includes dividing the first and second substrates along the dividing lines by applying stress to the modified regions. The bonding portions are formed along the dividing lines and block the laser light.

Abstract: Lighting fixtures that include fixture housings and light-emitting diode (LED) modules configured for tool-less attachment and detachment to the fixture housings are disclosed. Certain LED modules include LED emitters, corresponding electronics for operating the LED emitters, and at least one shaped protrusion. Certain LED modules include safety tethers that are configured to provide mechanical support during the tool-less attachment and detachment. Lighting fixtures include a lens and removable endcaps that secure the lens to the fixture housing. Certain lighting fixtures include a backup battery and a button provided in one of the endcaps for testing the backup battery. Certain lighting fixtures include a cut-out portion in the fixture housing corresponding to the shaped protrusion of the LED module for providing identification of replacement LED modules that may be attached to fixture housings.

Abstract: A substrate has a first surface and a second surface opposite to the first surface. The substrate has at least one first recess on the first surface and a second recess on the second surface. The substrate includes electrode pads. The electrode pads are in the at least one first recess. The substrate has the at least one first recess located separate from the second recess in a plan view.

Abstract: A light board mounting system includes a fixture frame having a planar surface and a plurality of alternating bosses disposed along a length of the fixture frame. The system also includes a light board having a first side and a second side, a plurality of lights disposed along a length of the light board on the first side, and a pair of electrical contacts coupled to the plurality of lights and mounted to the second side of the light board and extending away from the second side. In addition, the light board mounting system includes a first edge and opposing second edge of the light board secured to the planar surface of the fixture frame between the plurality of alternating bosses, the second side of the light board being adjacent to the planar surface of the fixture frame and the pair of electrical contacts extending through the planar surface.

Abstract: Various circuit boards and methods of fabricating and using the same are disclosed. In one aspect, a system is provided that has a circuit board with a pocket and a conductor layer. A chiplet is positioned in the pocket. The chiplet has plural bottom side interconnects electrically connected to the conductor layer and plural top side interconnects adapted to interconnect with two or more semiconductor chips.

Abstract: The invention describes a method of manufacturing an LED carrier assembly, which method comprises the steps of providing a carrier comprising a mounting surface with mounting pads arranged to receive a number of LED dies; embedding an alignment magnet in the carrier; providing a number of LED dies, wherein an LED die comprises a number of magnetic die pads; and aligning the magnetic die pads to the mounting pads by arranging the LED dies over the mounting surface of the carrier within magnetic range of the alignment magnet. The invention also describes an LED carrier assembly.

Abstract: According to one embodiment, a semiconductor device includes a first substrate. A first semiconductor chip having a first surface facing the first substrate and a second surface opposite the first surface. The first semiconductor chip has electrodes on the first surface and is coupled to the first substrate. A first resin layer is provided at least between the first substrate and the first semiconductor chip, and covers the second surface. The first resin layer has an upper surface substantially flatter than the second surface.

Abstract: A connector assembly of the present invention includes a first connector having a first electrical-connection member arranged on a base member, and a second connector having a second electrical-connection member arranged on a base member at a position opposite that of the first electrical-connection member. The first connector and the second connector further include engagement members at positions opposite each other. The first electrical-connection member includes an elastic protrusion and a first electrode arranged at a tip of the protrusion. The second electric-connection member includes a recess and a second electrode arranged at a bottom of the recess. At least one of the base member of the first connector and the base member of the second connector has flexibility. When the engagement members engage, the first electrode and the second electrode are brought into contact, and the protrusion and the recess are brought into contact.

Abstract: A method for reducing a volume of air within an electrical distribution system. The method includes providing at least one cable, surrounding the at least one cable with an isolating unit, placing a first shielding body on a top surface of the isolating unit, placing a second shielding body on a bottom surface of the isolating unit, wherein placing the first shielding body and the second shielding body creates a gap X1 between the first shielding body or the second shielding body and the isolating unit, and crimping the first shielding body to the second shielding body to create a shield housing, so that a gap X2 is created between the first shielding body or the second shielding body and the isolating unit, wherein X2 is less than X1. The at least a portion of the first shielding body may overlap with the second shielding body, and the first shielding body or the second shielding body may include at least one flared portion.

Abstract: An information processing device includes: a memory; and a processor coupled to the memory and configured to: acquire information on production of substrates and equipment information on a mounting line in which a component is mounted on the substrates; and optimize, based on the information on the production of the substrates and the equipment information on the mounting line, a plurality of factors that affect a time to complete the production of the substrates.

Abstract: A microwave module includes an RF device and a multilayer resin substrate. The device includes a metal cover covering at least an internal circuit. The substrate includes a first end face on a side of the device, a second end face on a side opposite to the first end face, a signal through-holes surrounding the circuit and connected to the circuit, ground through-holes surrounding the signal through-holes and connected to the cover, a first surface ground provided on the first end face and connected to the cover, an inner layer surface ground connected to ground through-holes, and an RF transmission line surrounded by the ground through-holes, the first surface ground, and the inner layer surface ground, and connected to the signal through-hole.

Abstract: An automatic transfer switch assembly includes a first phase switch component, a second phase switch component and a third phase switch component arranged in order of the first phase switch component, the second phase switch component, and the third phase switch component in a line. The assembly further includes a first shield disposed between the first phase switch component and the second phase switch component, and a second shield disposed between the second phase switch component and the third phase switch component. Each of the first shield and the second shield includes a plurality of laminations of electrical steel.

Abstract: A charging connector for charging a battery installed in a vehicle includes a housing (51) with at least one accommodating chamber (64a) for at least partly accommodating at least one terminal fitting (10), and at least one sensor (S) mounted to at least one terminal fitting (10) by a shrinking tube (20). A corresponding method and a corresponding terminal fitting (10) also are provided.

Abstract: A dual stripline assembly includes a first stripline, a second stripline, and an intermediate member. The first stripline includes a first center conductor, first outer ground plane, and first inner ground plane. The first center conductor is spaced apart from and interposed between the first outer ground plane and the first inner ground plane. The first stripline extends along a length of the assembly. The second stripline includes a second center conductor, second outer ground plane, and second inner ground plane. The second center conductor is spaced apart from and interposed between the second outer ground plane and the second inner ground plane. The second stripline extends along the length of the assembly. The intermediate member extends along the length of the assembly, and includes the first inner ground plane and the second inner ground plane.

Abstract: A semiconductor laser device includes a base; a heat sink protruding upward from the base and including an upper surface and a lateral surface extending from the base to the upper surface; a plurality of lead electrodes separated from the heat sink; a submount including: a first main surface fixed to the lateral surface of the heat sink, and a second main surface including a first fixing part, an upper second fixing part, and a lower second fixing part; a protective element fixed to the upper second fixing part; and a wire connecting the protective element and one of the plurality of lead electrodes.

Abstract: Provided is a semiconductor module in which a case and a base plate joined together with a simple structure, the semiconductor module having high insulation strength. The semiconductor module includes the following: a base plate; at least one semiconductor chip disposed inside the base plate other than the outer periphery of the base plate and above the base plate; and a case joined to the outer periphery of the base plate with an adhesive, and containing the at least one semiconductor chip. The upper surface of the base plate is provided with a recess or a protrusion between an inner wall of the case and the at least one semiconductor chip in a plan view.

Abstract: An inductance element includes a housing, a core, and a coil. The core is assembled in the housing. The coil includes a wire and two plate-shaped pins. The wire surrounds the core. The two plate-shaped pins are respectively assembled to two ends of the wire. The thickness of each of the plate-shaped pins is less than the diameter of the wire, and the two plate-shaped pins are exposed from the housing through two grooves of the housing, respectively.

Abstract: In an embodiment, a method of integrating capacitors in semiconductor devices includes: providing a lead-frame for a semiconductor device, the lead-frame including one or more electrically conductive areas, forming a dielectric layer over the electrically conductive area or areas, forming an electrically conductive layer over the dielectric layer thus forming one or more capacitors including the dielectric layer sandwiched between an electrically conductive area and the electrically conductive layer, and arranging a semiconductor die onto the lead-frame by providing electrical contact between the semiconductor die and the electrically conductive layer.

Abstract: Provided is a liquid crystal display device, including: a liquid crystal display panel; a memory for storing driving information and image data modulation information, and supplying the stored driving information and image data modulation information to a timing controller; a memory protection circuit for enhancing a write protection function of the memory, the memory protection circuit including a pull-up resistor for pulling up a write protection terminal of the memory to a power voltage, and a pad connected to the write protecting terminal and applying a low voltage to the write protection terminal; and a timing controller for reading the data stored in the memory to output various control signals for driving the liquid crystal display panel.

Abstract: There is provided a MEMS device including: a substrate having a resin portion that protrudes from one surface thereof and is made of a resin, in which the first wiring extends along a first direction on the one surface from a position overlapping the resin portion to a position deviating from the resin portion, and in which a width of the resin portion is equal to or larger than a width of the first wiring covering the resin portion in a second direction intersecting the first direction.

Abstract: Loadcenters with an enclosure having an interior compartment and a back wall that includes at least one lance, typically a plurality of longitudinally spaced apart lances that project inwardly toward a front of the enclosure. Each lance comprises an aperture. The loadcenters also include a back pan assembly in the interior compartment. The back pan assembly has at least one latch, typically plurality of longitudinally spaced apart latches, each latch with a leg that extend through the aperture of the aligned lance to attach the back pan assembly to the backwall.

Abstract: Described herein is a system and method for securing a printed circuit board without the use of screws in a housing assembly comprising a bottom housing made of plastic and a top housing made of metal. The top housing comprises a plurality of ribs. The bottom housing comprises a plurality of flexible snap arms each having a head portion, which includes an angled lower face, a horizontal crush rib, and a vertical crush rib. Upon coupling of the assembly, the ribs exert a horizontal force on the flexible snap arms resulting in climbing of the angled lower face further onto the printed circuit board. The horizontal force may also crush the horizontal crush ribs allowing for increased flexibility between the components to adjust for interference, preventing potential damage to the printed circuit board. Vertical forces may also crush the vertical crush ribs allowing for increased flexibility between the components.

Abstract: A semiconductor laser device includes a base; a heat sink protruding upward from the base and including an upper surface and a lateral surface extending from the base to the upper surface; a plurality of lead electrodes separated from the heat sink; a submount including: a first main surface fixed to the lateral surface of the heat sink, and a second main surface including a first fixing part, an upper second fixing part, and a lower second fixing part; a protective element fixed to the upper second fixing part; and a wire connecting the protective element and one of the plurality of lead electrodes.

Abstract: An acoustic wave device of the present invention has a piezoelectric substrate, an excitation electrode arranged on the piezoelectric substrate, an electrode pad arranged on the piezoelectric substrate and electrically connected to the excitation electrode, and a cover arranged on the piezoelectric substrate so that a oscillation space is arranged between the cover and the excitation electrode. The cover has inside it a via conductor electrically connected to the electrode pad and is curved so that its surface facing the piezoelectric substrate approaches the excitation electrode side with respect to an upper surface of the piezoelectric substrate from a position of contact with the via conductor.

Abstract: The protective housing can cover at least one component on the circuit board; the interior of the cover has several protrusions that are built, so that at least one part is displaced by raising the protective housing on at least one component, so that it is in contact with the exterior contour of the component and fastens it. Moreover, a circuit board is provided with at least one protective housing.

Abstract: Provided is a charging connector (11) including a terminal (15), a housing (13) which is formed with a lance (33) which prevents the terminal (15) in a terminal receiving chamber 29 from slipping, a front holder (21) which abuts on the lance (33) which prevents slipping of the terminal (15) so as to regulate an engagement release of the lance (33), and a thermistor element (17) which is pressed and biased by the front holder (21) to be brought into close contact with the terminal (15) directly or through a molding resin material.

Abstract: Loadcenters with an enclosure having an interior compartment and a back wall that include at least one lance, typically a plurality of longitudinally spaced apart lances that project inwardly toward a front of the enclosure. Each lance comprises an aperture. The loadcenters also include a back pan assembly in the interior compartment. The back pan assembly has at least one latch, typically plurality of longitudinally spaced apart latches, each latch with a legs that extend through the aperture of the aligned lance to attach the back pan assembly to the backwall.

Abstract: A computing device computes a quantile value. A maximum value and a minimum value are computed for unsorted variable values. An upper bin value and a lower bin value are computed for each bin of a plurality of bins using the maximum and minimum values. A frequency counter is computed for each bin by reading the unsorted variable values a second time. Each frequency counter is a count of the variable values within a respective bin. A bin number and a cumulative rank value are computed for a quantile. The bin number identifies a specific within which a quantile value associated with the quantile is located. The cumulative rank value identifies a cumulative rank for the quantile value associated with the quantile. Frequency data is computed using the frequency counters. The quantile value is computed using the frequency data and the cumulative rank value for the quantile and output.

Abstract: A vehicle-mounted circuit board holder structure includes: a circuit board configured to process a signal from an antenna element; a holding member configured to hold the circuit board so as to sandwich the circuit board from both sides of a mount surface; and a mold member covering the circuit board and at least part of the holding member.

Abstract: A semiconductor module includes a base substrate, a semiconductor element provided on the front surface side of the base substrate, and a resin case bonded to the front surface of the base substrate and enclosing a region in which the semiconductor element is provided, wherein the resin case has a depressed portion formed in a height direction away from the base substrate in a bottom surface bonded to the base substrate, and a connection hole that connects the depressed portion and the exterior of the resin case.

Abstract: An electronic component unit includes a housing that accommodates electronic components therein and that is provided with connecting units connected to electric wires on a vertical-direction lower surface. The housing has protruding ribs protruding downward in a vertical direction from the vertical-direction lower surface, positioned between the connecting units and respective side wall surfaces of the housing provided to sides of the vertical-direction lower surface, and extending from one end to the other end of the vertical-direction lower surface along the side wall surfaces. The electronic component unit having this configuration can prevent adhesion of water to the connecting units.

Abstract: A system (100) includes a threaded boss (101) defining a central axis (104), a metal panel (102), and a fastener (103) to couple the metal panel to the threaded boss. The fastener includes a threaded shaft (105) terminating at a paddle (106), which can be oblong. The metal panel can define an oblong aperture (112), where the paddle is to pass through the oblong aperture when rotated (115) to a first rotational alignment (113) about the central axis. The metal panel can also include one or more retention contours (116,117) disposed adjacent to the oblong aperture. Each retention contour can include a ramp (118,120) defined by a curved central axis (305) and a retention bridge (119,121) defining a recess (122,123) to receive the oblong paddle when rotated to a second rotational alignment (114) about the central axis.

Abstract: A flexible printed circuit board of a light guide module and a cut-out structure thereof. The flexible printed circuit board is made by cutting an FPC material and is formed after folding and unfolding. The flexible printed circuit board includes two light emitting plates and an extension strip. The two light emitting plates each has a connection portion. The extension strip is integrally connected between the two connection portions. Two ends of the two light emitting plates and the extension strip have two fold lines respectively, so that the extension strip is disposed between the two light emitting plates along an extension direction to separate the two light emitting plates away from each other.

Abstract: An arrangement (20) for covering connecting points of electrical lines (2a-2c) in a moisture tight manner is indicated. The electrical conductors (3a-3d) of at least one first electrical line (1) are connected to the electrical conductors (4a-4f) with at least two further electrical lines (2a-2c). The connecting point is surrounded by a prefabricated housing (10) consisting of a mechanically stable synthetic material. The interior of the housing (10) is completely enclosed by a sealing material produced by injection molding which extends to both sides of the housing (10) up to the lines protruding beyond the housing (1, 2a-2c).

Abstract: A method for producing a semiconductor light-emitting device having a substrate, an element and an encapsulating material as constituent members, includes: a first step of providing the substrate with the element; a second step of potting an uncured encapsulating material onto the substrate to cover the element; and a third step of curing the potted encapsulating material in such a manner that all of the following formulae (1), (2) and (3) are satisfied when the absorbances which a cured encapsulating material having a thickness of t [nm] has at wavelengths of 380 nm, 316 nm and 260 nm are represented by AbsA(t), AbsB(t) and AbsC(t), respectively, and the light transmittance thereof at 380 nm is represented by T(t): (1) T(1.7)?90%; (2) AbsB(t)?AbsA(t)<0.011t; and (3) AbsC(t)?AbsA(t)<0.125t.

Abstract: An engine control unit (ECU) includes a housing, a cover sealingly engaged with the housing, a circuit board disposed in the housing and support structure disposed in the housing and associated with an inner surface of the cover. At least one fastener couples both the support structure and the circuit board to the housing. An adhesive bonds at least portions of the support structure to portions of the inner surface of the cover. The support structure is constructed and arranged to limit deflection of the cover when internal pressure increase in the ECU.

Abstract: A memory cartridge for use during assembly of a storage drive apparatus. The memory cartridge includes a first memory printed circuit board (PCB). The memory cartridge also includes a second memory PCB, where the second memory PCB is operatively coupled to the first memory PCB by a first flexible connection. The memory cartridge also includes a chassis configured to fasten to the first memory PCB and to the second memory PCB such that the first and second memory PCBs have a spaced relationship to each other, and where the spaced relationship defines a gap.

Abstract: An apparatus includes a printed circuit board (PCB) including a surface that has a layer of circuitry. The apparatus also includes a heat sink configured to receive heat from the PCB. The apparatus further includes a thermally-conductive post configured to remove the heat from the PCB to the heat sink via thermal conduction through a thermal path. The thermal path is substantially orthogonal to the surface of the PCB. The post includes an end configured to physically couple to the layer of circuitry.

Abstract: A smart power storage and distribution system for buildings includes an energy storage device included in an uninterruptible power system (UPS). A system controller controls charging of the energy storage system via one or both of conventional grid power and/or the alternative power. The system controller also operates a plurality of electrical switches to switch the building's power source between power from the utility grid and/or from the energy storage system. The controller also communicates with smart outlets within the building to selectively turn the power on/off to each smart outlet according to programmed logic or remote commands from a user. Various types of data can be monitored throughout the house/building and transmitted to the cloud. The source of electrical power to the building, or to charge the UPS, can be selectively switched to correspond to the most advantageous electrical grid monetary rates.

Abstract: According to one embodiment, a circuit board attachment structure comprise a housing to which a circuit board is attached, a mount provided on the housing and provided outside a portion of the housing where the circuit board is attached, holding piece detachably attached to the mount and pressing the circuit board against the housing with a predetermined force, and fixing unit for detachably fixing the holding piece to the mount.

Abstract: A sheet metal housing for an electronic controlling unit of a car is fixable in a holding element of the car. The housing has a first housing edge and a second housing edge arranged at opposite sides of the housing. First and second mounting elements are arranged at the first and second housing edges, respectively. The first and second mounting elements each comprise a first, a second and a third contact face for contacting the holding element to fix the housing in the holding element. The first contact face being arranged at a lower side, the second contact face being arranged at an outer side, and the third contact face being arranged at an upper side.

Abstract: A wiring substrate 11A includes a high heat radiation substrate 21 which has a high thermal conductive layer in which at least one of a front surface and a rear surface thereof is a mounting surface 21a for a variety of components; a connection terminal 31 which is extended from the high heat radiation substrate 21 and bent in a direction perpendicular to a surface of the high heat radiation substrate 21; and a heat radiation piece section 35 which is integrally installed to the connection terminal 31.

Abstract: Rattling of a vehicle-mounted equipment supported by a bracket is restricted.