Abstract: A box for connecting an output conductor from a solar panel with a feed cable has a base mountable on the solar panel and formed with a first hole for the panel-output conductor and a second hole for the feed cable, a removable cover fittable with the base in a closed position and forming in the closed position with the base a substantially closed compartment, and at least one component mounted on the cover in the compartment. The component is something that affects transmission of electricity from the solar panel into an electrical network connected to the feed cable or that affects the microclimate inside the connection box.

Abstract: The invention provides an integrated circuit packaging and method of making the same. The integrated circuit packaging includes a substrate, a semiconductor die, a heat-dissipating module, and a protection layer. The substrate has an inner circuit formed on a first surface, and an outer circuit formed on a second surface and electrically connected to the inner circuit. The semiconductor die is mounted on the first surface of the substrate such that the plurality of bond pads contact the inner circuit. The heat-dissipating module includes a heat-conducting device, and the heat-conducting device, via a flat end surface thereof, contacts and bonds with a back surface of the semiconductor die. The protection layer contacts a portion of the first surface of the substrate and a portion of the heat-conducting device, such that the semiconductor die is encapsulated therebetween.

Abstract: Electronic equipment installed outdoors to house an internal unit is provided, meeting the waterproof standard and having an easily replaceable structure of the internal unit. The electronic equipment has an enclosure having a cover and a case with an opening and an air vent, and an internal unit in which an electronic component is mounted. The internal unit has a heat sink and radiation fins for releasing heat generated by the electronic component. The fins are inserted into the opening. The heat sink has a draining portion formed below the fins in a direction perpendicular to an extending direction of the radiation fins, a groove for waterproofing around the fins except an upper portion thereof, and two protrusions for fitting above the fins. The case has a rib for waterproofing around the opening except an upper portion thereof, and two holes for fitting above the opening.

Abstract: A solid state relay having an internal heat sink for dissipating heat produced by a solid state switching device. The relay being enclosed within a nonmetallic housing and mountable on a DIN type rail system.

Abstract: A heat dissipation structure for communication chassis. The heat dissipation structure includes an enclosure. At least one first copper heat absorption component and at least one first heat pipe assembly are disposed in the enclosure. The first heat pipe assembly is connected with the first copper heat absorption component and a section not in contact with the first copper heat absorption component. The first heat pipe assembly serves to quickly transfer heat absorbed by the first copper heat absorption component to the section not in contact with the first copper heat absorption component to dissipate the heat.

Abstract: A semiconductor module with two cooling surfaces and method. One embodiment includes a first carrier with a first cooling surface and a second carrier with a second cooling surface. The first cooling surface is arranged in a first plane, the second cooling surface is arranged in a second plane, at an angle different from 0° relative to the first plane.

Abstract: A thermal module directly press-forged from magnesium alloy is disclosed having a peripheral wall, a recessed chamber surrounded by the peripheral wall. The body is made of magnesium alloy by means of softening magnesium alloy with heat and then press forging softened magnesium alloy into the desired shape.

Abstract: A power supply assembly includes a housing having side walls, end walls, and a bottom wall defining a rectangular box with an interior space and an open top. A first dividing wall and a second dividing wall are positioned in the interior space of the housing which divides the interior space into first, second, and third compartments. A method of manufacturing a power supply with the above power supply assembly includes installing a printed circuit board in the second compartment and positioning the first wire set to terminate in the first compartment and the second wire set to terminate in the third compartment.

Abstract: A hermetically sealed and/or ignition protection housing is provided with heat bridges at discreet points. The heat bridges form mounting faces in the interior space of the housing and also on the outer side. Heat from the interior of the housing generated by an item on the interior mounting faces is dissipated outwardly at the corresponding points by means of the heat bridges.

Abstract: An electronics enclosure is provided. The electronics enclosure includes a heat dissipating body comprising: a heat conducting surface, a first flange adjacent to the heat conducting surface, and a first part of a latch mechanism adjacent to the heat conducting surface. The first part of the latch mechanism is adjacent an edge of the heat conducting surface opposite to the first flange, such that a portion of the heat conducting surface is between the first flange and the first part of the latch mechanism. The electronics enclosure also includes a plurality of electronic modules configured to mount to the heat dissipating body.

Abstract: A housing for an outside plant telecommunication equipment (OSP) which uses modular heat sink assemblies. OSP housings contain electronic circuit boards on which are mounted electrical components that generate heat. Thermal conductors or mesas contact the electrical components to conduct heat from the components to the environment. Rather than create single purpose housings with cast thermal conductors, the improved housing uses heat sink plates which can easily be swapped out to accommodate a variety of electronic circuit boards that might be needed within a general purpose housing. Together with faster turnaround time to create a new design for a housing, lower manufacturing and inventory costs result.

Abstract: A sealable module, cooled electronic system and method are described relating to cooling a heat generating electronic device. The sealable module is adapted to be filled with a first cooling liquid and a heat transfer device having a conduction surface defines a channel for receiving a second cooling liquid. In one embodiment, at least a portion of the conduction surface or housing is shaped in conformity with the shape of the electronic component. Control of the second cooling liquid is also described. Transferring heat between the second cooling liquid and a third cooling liquid features in embodiments. A method of filling a container with a cooling liquid is further detailed.

Abstract: An apparatus for heatsink attachment and a method for forming the apparatus. The apparatus includes a substrate, a semiconductor chip on top of and physically attached to the substrate, and a lid on top of the substrate. The lid includes a first thermally conductive material. The apparatus further includes a heatsink on top of the lid. The heatsink includes a second thermally conductive material. The semiconductor chip and the substrate share a common interface surface that defines a reference direction perpendicular to the common interface surface and pointing from the substrate towards the semiconductor chip. The lid is disposed between the substrate and the heatsink. The lid includes a first protruding member. The first protruding member of the lid is farther away from the substrate than a portion of the heatsink in the reference direction.

Abstract: A junction box for a photovoltaic system includes a housing having a base and a cover removably attached thereto, and a plurality of guide channels extending from an exterior surface of the housing to an interior portion thereof. The guide channels are sized and shaped to receive a plurality of conductive foil strips from a solar panel array. When the strips are fed into the guide channels, they are guided to and properly positioned within corresponding receptacles. Each receptacle is sized and shaped to receive a buss bar, and each strip is connected to a corresponding buss bar by a low insertion connector. When the cover is fully engaged with the base, bosses extending from the cover press against the connectors, creating a spring tension and pinch and retain the associated strip. As a result, a reliable physical and electrical connection between the strips and the buss bars is achieved. A heat sink having a plurality of fins protrude outwardly from the housing to dissipate heat externally.

Abstract: Including a storage box for accommodating a printed circuit board having a heat sink, an aluminum plate for closing an opening part of the storage box, and a rubber bush for supporting the printed circuit board from an opposite side of the opening part, the heat sink and the aluminum plate are brought to contact with each other by way of the insulating sheet, so that the heat of the heat sink may be transmitted to the aluminum plate, and released.

Abstract: Electronics mounted on a printed circuit board are housed within a high conductivity case with connecting pins extending therethrough. The case is filled with thermally conductive potting material to provide thermal conduction from the printed circuit board to the case. The case may be a conduit having open ends through which the printed circuit board is inserted or it may comprise a cover mounted to a base plate.

Abstract: An electronic system comprises an enclosure, a printed circuit board in the enclosure, and a heat sink assembly comprising a holding member. The enclosure comprises a first panel and a second panel perpendicularly connecting with the first panel. The printed circuit board is mounted on the first panel of the enclosure. The heat sink assembly has a first end mounted on the printed circuit board for contacting a heat-generating electronic device on the printed circuit board, and a second end opposite to the first end. The holding member connects the second panel of the enclosure with the second end of the heat sink assembly.

Abstract: Electronic equipment installed outdoors to house an internal unit is provided, meeting the waterproof standard and having an easily replaceable structure of the internal unit. The electronic equipment has an enclosure having a cover and a case with an opening and an air vent, and an internal unit in which an electronic component is mounted. The internal unit has a heat sink and radiation fins for releasing heat generated by the electronic component. The fins are inserted into the opening. The heat sink has a draining portion formed below the fins in a direction perpendicular to an extending direction of the radiation fins, a groove for waterproofing around the fins except an upper portion thereof, and two protrusions for fitting above the fins. The case has a rib for waterproofing around the opening except an upper portion thereof, and two holes for fitting above the opening.

Abstract: An interconnect structure for operable placement between a first body and a second body, wherein the interconnect structure includes a first surface for operable juxtaposition with the first body, a second surface for operable juxtaposition with the second body, and a thickness dimension defined between the first and second surfaces. The interconnect structure includes a first thermally conductive material and a second electrically conductive material, wherein the second electrically conductive material is formed in one or more distinct structures, with the structures forming at least one substantially continuous pathway of the second material through the thickness dimension. The interconnect structure exhibits a compressive modulus along a thickness axis of less than about 100 psi.

Abstract: An apparatus and method are provided for limiting failure noise and smoke emissions produced as a result of electrical failure conditions and/or failed electronic devices or assemblies of electronic equipment, such as IT and telecommunications equipment. In one aspect, the apparatus includes a conformable pad, a gasket and a clip that are disposed along one or more surfaces or planes of one or more electronic devices or assemblies such that the apparatus helps to form a substantially air tight seal around the one or more devices or assemblies. The air tight seal the apparatus defines minimizes or eliminates failure noise and smoke emissions generated as a result of failure conditions or catastrophic failure of the one or more devices or assemblies. The apparatus thereby provides a non-electronic solution to limiting failure noise and smoke that is relatively inexpensive to manufacture and implement, and enables in-field servicing of its components and the devices or assemblies to which it is applied.

Abstract: According to one embodiment, a cooling device includes a heat diffusion plate, a heat receiving portion, a heat sink and a heat pipe. The heat receiving portion is provided on the heat diffusion plate and thermally connected to an object to be cooled. The heat sink is provided on the heat diffusion plate, and it releases the heat of the heat receiving portion to outside. The heat pipe has a first end portion to be connected to the heat receiving portion and a second end portion located on an opposite side to the first end portion and to be connected to the heat sink.

Abstract: A box for connecting an output conductor from a solar panel to a feed cable. The box has a cover, a base securable to a solar panel, closable by the cover, and formed with a first opening for the output conductor and at least one second opening for a feed cable, and means in the base for securing the conductor directly in electrical conduct to the cable.

Abstract: An engine control device, especially an engine control device having an internal by-pass, is disclosed. The universally applicable engine control device includes an integrated by-pass function. For this purpose, a housing includes chambers that are electrically insulated from one another and that are configured both to receive a respective power subunit, and, alternatively, to receive a continuous current-bearing element.

Abstract: An electronic component storing package which generates a large quantity of heat during operation and an electronic apparatus storing such an electronic component are provided. In the electronic component storing package and the electronic apparatus, a heat dissipating member (1) is used which comprising at least five layers including first metal layers (11) having good thermal conductivity and second metal layers (12) having a smaller coefficient of thermal expansion and less thickness compared with the first metal layers (11), the first metal layers (11) and second metal layers (12) being alternately stacked, the first metal layers uppermost and lowermost layers of the layers, a thickness of at least one internally-arranged first metal layer (11a) being thicker than that of the lowermost and uppermost layers.

Abstract: This invention provides an electrical junction box that can restrain a temperature from increasing in a casing. An electrical junction box 10 comprises a casing 11 made of a synthetic resin material, a circuit board 12 contained in the casing 11, semiconductor relays 32 mounted on the circuit board 12, a first bud bar 34, and a second bus bar 38. Both bud bars 34, 38 are insert-molded in the casing 11. The respective bus bars 34 and 38 include embedment sections 35A and 35B embedded in the casing 11, connecting sections 36A and 36B exposed from the casing 11 and thermally connected to the semiconductor relays 32.

Abstract: A box for connecting an output conductor from a solar panel with a feed cable has a base mountable on the solar panel and formed with a first hole for the panel-output conductor and a second hole for the feed cable, a removable cover fittable with the base in a closed position and forming in the closed position with the base a substantially closed compartment, and at least one component mounted on the cover in the compartment. The component is something that affects transmission of electricity from the solar panel into an electrical network connected to the feed cable or that affects the microclimate inside the connection box.

Abstract: A casing of an electronic device has a base member, a cover, a bracket and a fastener. The base member made of a bent metal plate has a base and at least three base side walls extending upward from sides of the base. The cover is made of a bent metal plate that is thinner than that of the base member and has a top and at least three cover side walls extending downward from sides of the top. Lower parts of two opposed cover side walls and two opposed base side walls are overlapped with each other thereby to form overlapped portions. The bracket is fixed by the fastener to the base side wall and the cover side wall at the overlapped portion. At least one end portion of the base side wall to which the bracket is fixed and one end portion of the adjacent base side wall are overlapped and connected with each other thereby to form an overlapped end portion.

Abstract: An apparatus and a method for adding capacitance while conserving circuit board surface area. An apparatus for adding capacitance while conserving circuit board surface area includes a flex capacitor circuit with an upper surface and a lower surface and a plurality of conductive layers and an integrated-circuit (IC) device mounted on to the upper surface of the flex capacitor circuit and electrically connected to the flex capacitor circuit. The flex capacitor circuit is configured to provide bypass capacitance and, therefore, adds capacitance to the IC device when the IC device is mounted on the flex capacitor circuit.

Abstract: A power converter including a printed circuit board (PCB) having a plurality of heat conductive layers configured to sink heat generated by the power converter electronics. Each of these heat conductive layers are comprised of thermally conductive material configured as planar sheets, each of these heat conductive layers being coupled to at least one wire to sink heat therefrom, such as via a wire of an input cable and/or output cable. Advantageously, a more compact power converter is realized having improved power output while operating within safety guidelines.

Abstract: An apparatus for heatsink attachment. The apparatus includes a substrate, a semiconductor chip on top of and physically attached to the substrate, and a lid on top of the substrate. The lid includes a first thermally conductive material. The apparatus further includes a heatsink on top of the lid. The heatsink includes a second thermally conductive material. The semiconductor chip and the substrate share a common interface surface that defines a reference direction perpendicular to the common interface surface and pointing from the substrate towards the semiconductor chip. The lid is disposed between the substrate and the heatsink. The lid includes a first protruding member. The first protruding member of the lid is farther away from the substrate than a portion of the heatsink in the reference direction.

Abstract: A mounting device for mounting a capacitor on a connector element includes a hollow body defining a continuous through-hole that axially penetrates the body for receiving and mounting the capacitor. The body has a lower region defining a lower through-hole portion with a dimension. The body further has a middle region defining a middle through-hole portion with a dimension that is smaller than the first through-hole dimension. Therefore, the middle region and the lower region define a first inner shoulder between them. The body further has an upper region defining an upper through-hole portion with a dimension that is smaller than the second through-hole dimension. The upper region and the middle region define a second inner between them.

Abstract: The invention discloses an extension box of storage media, which mainly utilized a plurality of heat dissipation fins protruding from a bottom surface of a bottom shell of the extension box. The heat dissipation fins efficaciously dissipate heat from the storage media, so it improves the dissipation heat efficiency and reduces breakdown for the storage media. The extension box of storage media of the present invention is electrically connected with an external electronic apparatus by a universal series bus (USB) or an IEEE 1394 interface connector for transmitting a data.

Abstract: The invention relates to a radiofrequency power semiconductor module having a cavity housing constructed from three modules, a 1st module, which has an upwardly and downwardly open housing frame with horizontally arranged flat conductors, a 2nd module, which has the chip island as a heat sink with at least one radiofrequency semiconductor component, the 2nd module forming the bottom of the cavity housing, and a 3rd module, which has the housing cover.

Abstract: A module includes a circuit board, a first terminal on a lower surface of the circuit board, a first electronic component on an upper surface of the circuit board, a first cover made of metal covering the first electronic component, a second electronic component on the lower surface of the circuit board, a terminal board provided under the lower surface of the circuit board, a second terminal on an upper surface of the terminal board, a third terminal provided on the lower surface of the terminal board, and a second cover made of metal covering the second electronic component. The second terminal faces the first terminal and is connected to the first terminal. The third terminal is connected to the second terminal. The terminal board has an opening therein surrounding the second electronic component. The second cover includes a top plate portion located under the second electronic component, and a side plate portion extending from the top plate portion toward the lower surface of the circuit board.

Abstract: A heat sink and module cage assembly for receiving a pluggable electronics component, such as an opto-electronic transceiver module. The heat sink is attached to the module cage and includes a bottom surface forming one of four sidewalls of a chamber that receives the electronics component. The attachment of the heat sink in this manner enables the heat sink and module cage to be assembled during fabrication and prior to the assembly being shipped to a third party who may use the assembly on a printed circuit board. The top surface of the heat sink defines a plane that enables the assembly to be press fitted onto the printed circuit board using a flat rock tool. The sidewall of the cage assembly opposite the bottom surface of the heat sink includes leaf springs that bias the electronics module against the heat sink, thereby facilitating heat transfer to the heat sink.

Abstract: A circuit board assembly having a laminate construction of multiple layers, such as a LTCC ceramic substrate, with conductor lines between adjacent pairs of layers. A heat sink is bonded to a first surface of the substrate, and a cavity is defined by and between the heat sink and the substrate such that a base wall of the cavity is defined by one of the layers with conductor lines thereof being present on the base wall. A surface-mount circuit device is received within the cavity, mounted to the base wall, and electrically connected to the conductor lines on the base wall. The device is received within the cavity such that a surface of the device contacts a surface region of the heat sink. The surface of the device is bonded to the surface region of the heat sink to provide a substantially direct thermal path from the device to the heat sink.

Abstract: Apparatus and method include using a bare die microelectronic device; a heat sink assembly; a heat sink mounting assembly for mounting the heat sink assembly independently of the bare die microelectronic device; and, a force applying mechanism that compression loads, under controlled forces, a surface of the bare die into a direct heat transfer relationship at a thermal interface with a heat sink assembly.

Abstract: A back plate assembly (100) for a board (200) comprises a back plate (110) abutting against a side of the board and a plurality of posts (120). Each post comprises at least one latching portion (1206) formed thereon. After the latching portions have passed through the back plate and the board, the latching portions are blocked by one of the board and the back plate to secure the back plate to the board. Screws (330) are used to extend through a heat sink (300) to threadedly engage with the posts thereby mounting the heat sink to the board. Thus, the heat sink can have an intimate contact with an electronic component (210) mounted on the board.

Abstract: To improve EMC shielding for an electronic unit containing at least one electronic power device operated at high frequency and a metal housing thermally coupled to the device to provide heat dissipation, the power device with a device terminal is thermally and electrically coupled to a first metal plate. The first metal plate is coupled in turn to a second metal plate in a particular manner via a first insulating layer. A metal housing with a heat sink through which a cooling fluid can flow is disposed, on another side of a second insulating layer. The improvement in EMC is based on an internal short-circuiting of an interference current produced by the power device over a very short loop.