Abstract: A ceramic electronic device includes an element body and an external electrode. The element body is formed by laminating a ceramic layer and an internal electrode layer. The external electrode is electrically connected to at least one end of the internal electrode layer. At least a part of a joint boundary between the electrode layer and the ceramic layer includes an interface protrusion on the external electrode side. The interface protrusion is made of an oxide.

Abstract: An electronic component including a component body, and an external electrode on a surface of the component body. The external electrode includes a layer having an alloy of at least one first metal and at least one second metal, the at least one first metal is selected from the group consisting of metals of Group 9 to Group 11 of the Periodic Table, the at least one second metal has a melting point higher than that of the at least one first metal. In the layer having the alloy, a concentration of the at least one second metal continuously changes in a thickness direction of the external electrode, at least one first portion has the concentration of the at least one second metal increasing in the thickness direction, and at least one second portion has the concentration of the at least one second metal decreasing in the thickness direction.

Abstract: An electronic package is provided and includes an electronic element, an intermediary structure disposed on the electronic element, and a heat dissipation element bonded to the electronic element through the intermediary structure. The intermediary structure has a flow guide portion and a permanent fluid combined with the flow guide portion so as to be in contact with the electronic element, thereby achieving a preferred heat dissipation effect and preventing excessive warping of the electronic element or the heat dissipation element due to stress concentration.

Abstract: An electronic component according to the present invention is an electronic component including: a ceramic element body including an internal electrode; and an external electrode formed on an outer surface of the ceramic element body. The external electrode includes: a first electrode layer electrically connected to at least a part of the internal electrode; and a second electrode layer formed on an outside of the first electrode layer. The first electrode layer has a first conductor region containing copper, and the second electrode layer has a second conductor region including a matrix phase containing silver and palladium and copper particles dispersed in the matrix phase.

Abstract: A chip package structure and a chip package method, the chip package structure including a die and a package substrate disposed around the die. A solder joint is disposed on a first surface of the die. Remaining surfaces of the die other than a second surface are wrapped by an injection molding material. At least one pair of opposite sides of the package substrate is embedded in the injection molding material. A contact area between the pair of opposite sides and the injection molding material accounts for more than half of a surface area of the pair of opposite sides. The second surface is a surface that is of the die and that is opposite to the first surface.

Abstract: An article includes: a transparent substrate having a primary surface; and a protective film disposed on the primary surface, such that each of the substrate and the protective film have an optical transmittance of 20% or more in the visible spectrum, and such that the protective film includes at least one of: (1) a hardness of greater than 13 GPa, as measured by a Berkovich nanoindenter, or (2) an effective fracture toughness (Kc) of greater than 2.5 MPa·m1/2, as measured by indentation fracture at a depth of greater than 1 ?m.

Abstract: Oxide coatings deposited by plasma spray-physical vapor deposition (PS-PVD) can be processed to be mechanically tough (erosion resistant) and electrically conductive at room temperature. The electrically conductive phase contained within the oxide (MO2) coatings is a metastable suboxide (MO) that has not been formed in significant volume under any other known methods. Content of the electrically conductive phase can be varied in addition to the microstructure, which can be columnar, planar, or a combination of the two depending on the processing conditions. Upon exposing the material to moderate temperatures (>300° C.), the metastable phase is further oxidized (to MO2), and the material becomes insulating, but retains its high toughness and microstructure.

Abstract: A multilayer ceramic capacitor includes a multilayer body including dielectric layers and inner electrode layers, and a pair of outer electrodes on end surfaces of the multilayer body and electrically connected to the inner electrode layers. The outer electrodes each include a base electrode layer, a resin electrode layer on a surface of the base electrode layer and including a thermosetting resin and a metal component, a resin layer not containing an electrically conductive component, and a plating layer on the resin electrode layer. The resin layers cover the base electrode layers in regions located on the second main surface side of the multilayer body, and the resin electrode layers cover the base electrode layers in portions where the resin layers are not located and cover the resin layers.

Abstract: Thin walled products having good scratch resistance are disclosed, as are processes for making such products (e.g. films, sheets, and thin walled articles). The product includes a thin layer formed from (A) a cross-linkable polycarbonate resin having endcaps derived from a monohydroxybenzophenone; and (B) if desired, a base polymeric resin. When exposed to ultraviolet light, crosslinking will occur in the layer with the cross-linkable polycarbonate resin, enhancing the scratch resistance properties of the thin layer and the overall product.

Abstract: A multilayer ceramic capacitor includes an external electrode on an end surface of a ceramic body to be connected to internal electrodes including a base layer including a sintered metal containing Cu and glass and a Cu plated layer on the base layer. The external electrode includes a principal surface portion disposed on a principal surface of the ceramic body. The Cu metal of the Cu plated layer is present in the base layer to a position of about ? or more of the thickness of the base layer from a surface layer of the external electrode. The metal thickness of the external electrode is about 8.7 ?m or more and about 13.9 ?m or less.

Abstract: The present disclosure describes a connection insert, in particular a threaded insert, which is embeddable into a formed plastic component. This connection insert comprises a cylindrical main body having a radially outer side, a radially inner side as well as a first and a second axial end, at least one circumferential collar arranged at the radially outer side of the main body which has the largest outer diameter compared to the remaining main body and which is arranged spaced with respect to the first and the second axial end of the main body, and a radially protruding structure arranged at the radially outer side of the main body.

Abstract: An LC module for installation in a housing of a motor vehicle control device, a method for producing an LC module and a corresponding motor vehicle control device having an LC module. The LC module has a support plate, at least one electrolytic capacitor and a coil. The electrolytic capacitor and the coil are disposed in chambers of the LC module and are at least partially surrounded by casting compound. Furthermore, the support plate has a connecting part between the two chambers, the support plate being form-fittingly or frictionally connectable to the housing of the control device at least in the region of the connecting part.

Abstract: An integrated circuit package includes a first dielectric layer comprising a dielectric film having a first side and a second side. The package also includes a die having an active surface affixed to a contact location of the first side of the dielectric film. A die stud is affixed to the active surface of the die and extends through the dielectric film to an interconnect location of the second side of the dielectric film.

Abstract: A housing includes a substrate made of aluminum or aluminum alloy, an anodic oxide film disposed on the substrate, and an abrasion resisting layer disposed on the anodic oxide film. The abrasion resisting layer is an alkylate silicon dioxide layer containing nano aluminum oxide powder. An electronic device using the housing is also described.

Abstract: An electronic device that has components is provided with a housing that defines an exterior and an interior of the electronic device. The housing includes a vapor port that prevents ingress of liquid through the vapor port from the exterior of the electronic device to the interior of the electronic device. The vapor port also permits egress of vapor through the vapor port from the interior of the electronic device to the exterior of the electronic device. The vapor port may include a breathable, but water-resistant or waterproof barrier to prevent water from entering through barrier while enabling water vapor to exit through the barrier and, thus, the vapor port.

Abstract: An electrically conductive composition capable of making specific volume resistivity control easier, is a carbonaceous material produced by burning plant material including soybean hulls, rapeseed meal, sesame meal, cotton seed meal, cotton hulls, rice hulls, rice bran, soybean chaffs, rice straws, cereal hulls or the like by adjusting any of the carbon content, burning temperature and median diameter. The burned and carbonized plant material is ground and sieved to give a median diameter of approx. 80 ?m or below. The burned plant material is obtained by burning at a temperature of 700° C. or higher.

Abstract: A scratch-resistant glass substrate is prepared by forming a phase-transformable, scratch-resistant layer over a major surface of the substrate. The phase-transformable layer can comprise the metastable, tetragonal polymorph of zirconium oxide. Under the application of an applied scratch, such as during a scratch event, the tetragonal phase can undergo a phase-transformation and concomitant volume expansion to the monoclinic phase. The volume expansion can reduce and soften the physical dimensions of the scratch, which can make the scratch less visible.

Abstract: Systems and methods for protecting a flight recorder are provided. In certain embodiments, a crash survivable memory unit, comprises a memory device that records flight data; a flexible insulation layer that inhibits thermal energy from conducting from an external side of the flexible insulation layer to an internal side of the flexible insulation layer, wherein the internal side faces the memory device; a microlattice layer abutting the internal side and enclosing the memory device, the microlattice layer configured to distribute thermal energy that passes through the flexible insulation layer substantially throughout the microlattice layer; and a heat absorbing material that impregnates the microlattice layer, the heat absorbing material configured to absorb the thermal energy in the microlattice layer; and an impact resistant layer encircling the flexible insulation layer, wherein the impact resistant layer absorbs shocks that result from other objects contacting the impact resistant layer.

Abstract: An apparatus and method are disclosed for providing monolithic optical packages. An embodiment optical package includes a base made of aluminum-nitride (AlN) that is configured to support an optical component, a plurality of sidewalls made of AlN that are coupled to the base, the sidewalls are configured to surround the optical component, and a feed-through made of AlN that is coupled to one of the sidewalls, wherein the feed-through is configured to feed a plurality of leads through the one sidewall to provide an electrical connection to the optical component, wherein the base, the sidewalls, and the feed-through have a same coefficient of thermal expansion (CTE) for AlN. An embodiment method includes punching and printing AlN tapes to build a base, a plurality of sidewalls joined to the base, and a feed-through coupled to the sidewalls, and attaching a plurality of electrical leads into the feed-through.

Abstract: The following detailed description is directed to intumescent swell devices. According to various embodiments, the swell devices disclosed herein can be used alone or in combination with one another to provide heat and/or fire protection for electrical systems, devices, and/or assemblies. According to exemplary embodiments, intumescent electrical devices, intumescent firewall insert boxes, intumescent flanges, and/or intumescent electrical boxes are disclosed herein for use individually and/or in combination with one another. Additionally, the disclosed intumescent electrical components disclosed herein can be used in combination with intumescent electrical device cover plates, intumescent screws, and intumescent gaskets, if desired. Methods for building electrical assemblies and for retrofitting electrical assemblies to provide fire protection also are provided.

Abstract: An electronic device housing internally defines a receiving space for accommodating a circuit board and electronic elements mounted on the circuit board, and has a thermal insulation layer provided on an inner surface thereof at a position corresponding to the circuit board. The thermal insulation layer provided on the inner surface of the electronic device housing not only suppresses and prevents flames produced by, for example, the spontaneous combustion of the electronic elements in the housing from spreading to and endangering the environment surrounding the electronic device, but also enables reduced product weight and manufacturing cost of the electronic device.

Abstract: There is provided an electric storage device having a novel fastening structure of a plastic member which can reduce cost with a simple configuration. An electric storage device according to this invention includes an electrode assembly, a case housing the electrode assembly, a plastic member arranged at an outer surface of the case, the plastic member having a joining surface facing the outer surface of the case, and an external terminal supported by the plastic member and electrically connected to the electrode assembly. The plastic member is a synthetic resin containing an inorganic fiber and is bonded to the outer surface of the case with the inorganic fiber exposed at the joining surface.

Abstract: A terminal (20) formed of an electrically conductive plate member is accommodated into a box (11). The terminal (20) includes a cable connecting portion (26) to be connected to a cable (80) and a cell-side connecting portion (27) located at an extending leading end portion (32) extending from the cable connecting portion (26), located outside the box (11) and insertable into a housing (91) through an opening (98) formed in the housing (91) to be connected to an electrode of solar cells (95) in the housing (91).

Abstract: An electronic component element housing package is produced by firing a ceramic substrate for housing an electronic component element and a metal layer for bonding to the ceramic substrate to form an electrical path, simultaneously in a reducing atmosphere. The ceramic substrate comprises alumina (Al2O3), a partially stabilized zirconia by forming solid solution with yttria (Y2O3) and a sintering agent. The sintering agent comprises magnesia (MgO), and at least 1 type selected from silica (SiO2), calcia (CaO), or manganese oxides (MnO, MnO2, Mn2O3, Mn3O4).

Abstract: A method and apparatus for protecting a heat sensitive component from high temperature, mechanical shock and moisture are provided. An enclosure includes an outer housing surrounding an inner cavity configured to receive a heat sensitive component therein, a cover configured to matingly engage the outer housing such that the inner cavity is sealed from an environment external to the enclosure, wherein at least one of the outer housing and the cover are formed from a ceramic material.

Abstract: A crystal and an ultrasonic welding method for a crystal. The crystal is used to close a top of a case of a portable object, the crystal being made of a transparent plastic material and being secured to the case of the portable object by ultrasonic welding. The crystal includes a top surface and a bottom surface that carry one or more conductive paths made of a transparent conductive material, and a peripheral rim that extends along at least one portion of the perimeter of the crystal. The peripheral rim provides at least one surface for the ultrasonic welding of the crystal to the case of the portable object.

Abstract: An electrical control module provides a plastic insert fitting inside a housing and compressed by assembly of the housing lid and base to be held securely therein. Elastic components on the plastic insert are compressed during the assembly provide a secure retention in the face of normal manufacturing tolerances. The plastic insert includes features for attaching electrical components such as electrical contactors, motor starters, disconnect switches, circuit breakers, and overload switches without conventional screw fasteners or the like through channels and elastic detents.

Abstract: An electronic device includes a housing. The housing includes a transparent substrate, a transparent texture layer, and a colored texture layer. The transparent texture layer is printed on the inner surface of the transparent substrate and has an uneven surface. The colored texture layer is printed on the uneven surface of the transparent texture layer. A three-dimensional effect printing method is also provided.

Abstract: A RFID tag enclosing structure withstands temperatures ?200° C. ?90 minutes; a maximum read operational temperature of 130° C.; water submersions ?2 m ?2 hours; contact with alkaline acids with pH of 4-13; contact with solvents; severe vibrations having acceleration ?14.7 g at 40 Hz in three directions ?3 hours; impacts at an acceleration of 6 g for 40 times minimum; a tension of 120 kg minimum; and flexing at 60 kg·cm. The RFID tag enclosing structure includes a main body made of a vulcanized thermoplastic elastomer having an internal housing ending in an open inferior recess having a surrounding wall protecting the open inferior recess. An RFID encapsulator structure completely surrounding a superior portion of the tag. The RFID tag surrounded by the RFID encapsulator structure is inside the main body internal housing.

Abstract: A design cover attachment structure is provided configured to facilitate an attachment/removal of a design cover composed of a plurality of decorative plates. At least a top surface and each of side surfaces of a casing of an electronic apparatus are covered with a design cover composed of a top surface decorative plate, and left and right side surface decorative plates. The left and right side surface decorative plates are provided with second engagement portions configured to be engaged with first engagement portions provided to a bottom surface decorative plate mounted on the casing or a bottom surface of the casing, so that the left and right side surface decorative plates are mounted on the casing. Third engagement portions configured to be engaged with fourth engagement portions provided to the top surface decorative plate, so that the top surface decorative plate is mounted on the left and right side surface decorative plates.

Abstract: Housings for electrical or electronic components made using braid or woven fabric sheets having multiple sections treated with different materials as well as processes and materials for making such housings are disclosed.

Abstract: An electronic component provided with a device and a package storing the device. The package includes a ceramic base, a lid, and a connecting member connecting the ceramic base and the lid. A portion of the lid that joins with the connecting member is made of a metal. The connecting member is made of a metal mainly containing aluminum, and is directly joined to the ceramic base. The device is fixed to one of the ceramic base and the lid.

Abstract: The present invention relates to a device adapted in order to decrease stress on connection points between a heat generating source and a substrate. The device 13 comprises a larger heat-dissipating part 7, and at least one smaller heat-dissipating part 6. The larger part 7 is arranged with at least one cavity 8 for housing the at least one smaller part 6. The at least one smaller part 6 is adapted to be attached to at least one heat-generating source 2, and at the same time more mobile in the cavity 8 and/or less affected by changes in temperature than the larger part.

Abstract: An electrical structure having a foam housing is set forth. The foam housing includes an interior surface forming a conductive cavity adapted to carry energized waveforms therethrough. An electrical component of the electrical structure is integrally formed with the interior surface as the foam housing of the structure is assembled.

Abstract: A plate member for a housing has a wood part including a plurality of wood plates that are stacked, and a resin part adhered on the wood part and including a plurality of resin sheets that are stacked. Each of the plurality of resin sheets includes a plurality of pores.

Abstract: A method for forming an electronics enclosure is disclosed. The method comprises extruding a backplane having a first extruded length, the backplane comprising slots on opposing sides of the backplane, wherein the slots extend along the first extruded length. The method further comprises extruding at least one door panel at the first extruded length, wherein the backplane and the door panel each have extruded hinge features for pivotally coupling the door panel to the backplane, and coupling at least two cast metal plates to opposing ends of the backplane, where each of the cast metal plates comprise a gland that aligns with the slots of the backplane to create a continuous channel for inserting a seal.

Abstract: A portable junction or outlet box is provided having an elastomeric outer layer to provide impact resistance and abrasion resistance to the electrical box. The outer layer encloses the outer surface of a rigid electrical box and overlies the side walls and end walls of the electrical box. The corners of the outer layer define a thickened portion relative to the side portions of the outer layer to increase the impact resistance.

Abstract: A housing is for an electronic device. The housing includes a main body made of thermoplastic, and a transparent layer formed on the main body. The transparent layer is made of transparent thermosetting plastic.

Abstract: A method of fabricating an interconnection between a region of copper material and a conducting region is disclosed. The method includes a step of forming a region of tin material and a step of forming a region of nickel material. The method also includes a step of melting the tin material to induce formation of a nickel/tin/copper intermetallic composition at an interface between the region of copper material and the conducting region. The region of tin material and the region of nickel material define the interface between the region of copper material and the conducting region.

Abstract: A mesh sheet of the present invention is a mesh sheet in which a metal mesh comprising fine bands is laminated on a surface of a base substrate, the mesh sheet being used and adhered along a surface of an arbitrary member having a curved surface portion. The metal mesh has a part in which the fine band positioned between connection points of the fine bands which are adjacent to each other is a curved line so as to absorb stress relative to deformation to be placed along the curved surface portion with a large curvature without destructing the metal mesh.

Abstract: A junction box for use in establishing electric connection between an electric cable and output terminals of a solar panel is provided. The junction box includes an elongate plastic housing and a metal frame. The elongate plastic housing is disposed along and sandwiches an edge of the solar panel, from which the output terminals of a solar panel extend out. The elongate plastic housing defines a passage, inside which the electric cable is connected with the output terminals of the solar panel. The metal frame fully encloses the elongate plastic housing.

Abstract: A casing for an electronic device is produced from a heat-resistant, flame-retardant thermoplastic by an injection-molding process. This thermoplastic is a polyimide-based plastic with halogen-free flame retardancy.

Abstract: An enclosure is provided for a vehicle. The enclosure comprises (a) a housing and (b) a cover for the housing. At least one of the housing and the cover includes a mounting portion for attaching the at least one of the housing and the cover to a vehicle and a compliant portion connected to the mounting portion. The compliant portion is plastically deformable.

Abstract: The invention relates to a housing for an electrically-operated device, said housing being located in an environment subject to the risk of explosion. The housing is made from a material which is gas-permeable and non-flammable. Metal foam is an example of a suitable material.

Abstract: A mesh sheet of the present invention is a mesh sheet in which a metal mesh comprising fine bands is laminated on a surface of a base substrate, the mesh sheet being used and adhered along a surface of an arbitrary member having a curved surface portion. The metal mesh has a part in which the fine band positioned between connection points of the fine bands which are adjacent to each other is a curved line so as to absorb stress relative to deformation to be placed along the curved surface portion with a large curvature without destructing the metal mesh.

Abstract: A housing can accommodate an electronic component. An outer wall of the housing forms a flat contact wall in which contact areas for connecting the housing to an interconnect device are arranged.

Abstract: An embodiment of this document provides an organic electroluminescent display device, comprising a panel, a polarization plate disposed over the panel, a cover window disposed on the polarization plate, and a support member configured to form an air layer between the panel and the polarization plate.

Abstract: A ceramic header configured to form a portion of an electronic device package includes a mounting portion configured to provide a mounting surface for an electronic device. In addition, the ceramic header includes one or more conductive input-output connectors operable to provide electrical connections from a first surface of the ceramic header to a second surface of the ceramic header. The ceramic header also includes one or more thermally polished surfaces.

Abstract: A thermally insulated electronic component package and an instrument suitable for process conditions in a high temperature environment are disclosed. The component package includes a thin electronic component, a thermally insulating outer enclosure, and an insert made of a thermally insulating material that is sized and shaped to fit within the outer enclosure. The insert includes an inner cavity sized and shaped to receive the thin electronic component. In the instrument, the outer enclosure can be configured to mount to a substrate.

Abstract: This invention is directed to a support plate for reinforcing a portion of a circuit board. The support plate may be coupled to a portion of the circuit board that is subject to forces (e.g., portions of the circuit board having switches) to prevent flexing of the board. The support plate may be coupled to the circuit board. This invention is also directed to a switch constructed from a button, a label plate, and a backer plate. The label plate and the backer plate may include apertures operative to receive a protrusion extending from the button, where the protrusion is welded to the backer plate. Labels may be printed or attached to the bottom surface of the label plate to protect the labels. In some embodiments, the protrusion may be welded to the backer plate. The protrusion may be operative to engage an electrical switch of an electronic device in which the switch is placed.