Specific Material Patents (Class 174/565)
  • Publication number: 20100084187
    Abstract: A coupler that aids in the detection of partial discharge events in a vessel. The coupler comprises a housing for a detector which extends through a wall of the vessel. The housing is sealably connectable to a vessel and is at least partially transparent to electromagnetic radiation. The coupler may be used to allow monitoring of partial discharge events in such vessels as gas and oil insulated subsystems, gas and oil insulated transformers, and gas and oil insulated cables and cable terminations.
    Type: Application
    Filed: October 5, 2007
    Publication date: April 8, 2010
    Applicant: Diagnostic Monitoring Systems Limited
    Inventor: John Pearson
  • Publication number: 20090314542
    Abstract: A RFID tag enclosing structure withstands: temperatures ?200° C.?90 minutes; a maximum read operational temperature of 130° C.; water submersions ?2 m?2 hours; contact with alkaline acids with pH of 4-13; contact with solvents; severe vibrations having acceleration ?14.7 g at 40 Hz in three directions ?3 hours; impacts at an acceleration of 6 g for 40 times minimum; a tension of 120 kg minimum; and flexing at 60 kg·cm. The RFID tag enclosing structure includes a main body made of a vulcanized thermoplastic elastomer having an internal housing ending in an open inferior recess having a surrounding wall protecting the open inferior recess; an RFID encapsulator structure completely surrounding a superior portion of the tag. The RFID tag surrounded by the RFID encapsulator structure is inside the main body internal housing. The antenna of the RFID tag faces the open inferior recess and is protected by the surrounding wall.
    Type: Application
    Filed: June 23, 2009
    Publication date: December 24, 2009
    Applicant: RFID MEXICO, S.A. DE C.V.
    Inventors: Victor-Manuel Arocha-Ferriño, Diana-Marisol Vázquez-Espinoza-De-Los-Monteros, Emilio-Cuauhtémoc Ruiz-Esparza-Flores
  • Publication number: 20090308655
    Abstract: A method for forming an electronics enclosure is disclosed. The method comprises extruding a backplane having a first extruded length, the backplane comprising slots on opposing sides of the backplane, wherein the slots extend along the first extruded length. The method further comprises extruding at least one door panel at the first extruded length, wherein the backplane and the door panel each have extruded hinge features for pivotally coupling the door panel to the backplane, and coupling at least two cast metal plates to opposing ends of the backplane, where each of the cast metal plates comprise a gland that aligns with the slots of the backplane to create a continuous channel for inserting a seal.
    Type: Application
    Filed: March 25, 2009
    Publication date: December 17, 2009
    Applicant: ADC TELECOMMUNICATIONS, INC.
    Inventors: Michael J. Nelson, Michael J. Wayman
  • Publication number: 20090277684
    Abstract: An electronic component mounting structure includes a flexible circuit board having terminal connection patterns formed thereon and a light-emitting component provided with electrodes. The light-emitting component is placed on the flexible circuit board, and a synthetic resin casing is injection-molded to cover the light-emitting component and a portion of the flexible circuit board surrounding the light-emitting component placed thereon, whereby the electrodes of the light-emitting component and the terminal connection patterns of the flexible circuit board are connected in abutting contact with each other.
    Type: Application
    Filed: December 19, 2006
    Publication date: November 12, 2009
    Applicant: TEIKOKU TSUSHIN KOGYO CO., LTD.
    Inventors: Shigemasa Takahashi, Takashi Yamada, Shinji Mizuno, Masahiro Kitahara, Daisuke Makino
  • Publication number: 20090224423
    Abstract: A portable junction or outlet box is provided having an elastomeric outer layer to provide impact resistance and abrasion resistance to the electrical box. The outer layer encloses the outer surface of a rigid electrical box and overlies the side walls and end walls of the electrical box. The corners of the outer layer define a thickened portion relative to the side portions of the outer layer to increase the impact resistance.
    Type: Application
    Filed: March 6, 2008
    Publication date: September 10, 2009
    Applicant: HUBBELL INCORPORATED
    Inventors: Thomas J. Vigorito, Thomas L. Scanzillo
  • Publication number: 20090095523
    Abstract: Housings for electrical or electronic components made using braid or woven fabric sheets having multiple sections treated with different materials as well as processes and materials for making such housings are disclosed.
    Type: Application
    Filed: October 16, 2007
    Publication date: April 16, 2009
    Applicant: Honeywell International Inc.
    Inventors: James F. Stevenson, David C. Vacanti, Siu-Ching D. Lui
  • Publication number: 20090050365
    Abstract: A fire and/or water resistant enclosure is provided for housing an operable digital data storage device. The enclosure is a low cost, preferably molded gypsum enclosure having various embodiments for providing resistance to fire occurring outside said enclosure and/or to water. In one embodiment, a fan cooperates with one or more hatchless ventilation passageways to cool the digital data storage device. Passageways in the gypsum walls are sized to be sufficiently small to limit the transfer of heat through those passages sufficiently to prevent damage to the data storage device and to prevent loss of data stored thereon. Another embodiment provides a water resistant pouch surrounding the data storage device which may be made of flexible foil or of finned relatively robust and non-flexible thermal conductor. The enclosure in some embodiments utilizes a fan and in some embodiments operates without a fan.
    Type: Application
    Filed: October 30, 2007
    Publication date: February 26, 2009
    Inventors: Robby Jay Moore, Steven D. Goldsberry, John Arthur Hendricks
  • Patent number: 7352060
    Abstract: A multilayer wiring substrate for providing a capacitor structure inside a multilayer wiring structure is disclosed. The multilayer wiring substrate includes a dielectric layer including a resin material mixed with an inorganic filler, wherein the inorganic filler is fabricated by mixing a paraelectric filler with an inorganic filler having a high dielectric constant.
    Type: Grant
    Filed: May 13, 2005
    Date of Patent: April 1, 2008
    Assignee: Shinko Electric Industries Co., Ltd.
    Inventors: Noriyoshi Shimizu, Tomoo Yamasaki, Akio Rokugawa, Takahiro Iijima
  • Publication number: 20080011513
    Abstract: An injection molded article comprising a polycarbonate composition. The polycarbonate composition is scratch resistant, flame retardant, has a low chlorine and bromine content and is dark colored.
    Type: Application
    Filed: September 25, 2006
    Publication date: January 17, 2008
    Applicant: GENERAL ELECTRIC COMPANY
    Inventors: Jan Henk Kamps, Edward Kung, Jan-Pleun Lens, Michael Teruki Takemori, Hendrik Theodorus van de Grampel
  • Patent number: 7161094
    Abstract: A MEMS device is packaged with a control material that is included in the package to affect an operation of a moveable element of the device. The control material may affect operational characteristics including actuation and release voltages and currents, mechanical affects including damping and stiffness, lifetime of the device, optical properties, thermal affects and corrosion. The control material may be inserted into the package as part of any of several structural components of the package or the MEMS device.
    Type: Grant
    Filed: May 18, 2006
    Date of Patent: January 9, 2007
    Assignee: IDC, LLC
    Inventors: Manish Kothari, Clarence Chui, Lauren Palmateer