Abstract: A substrate processing method which processes a substrate having a metal layer on a surface thereof includes a metal oxide layer forming step of forming a metal oxide layer formed of one atomic layer or several atomic layers on a surface layer of the metal layer by supplying an oxidizing fluid to the surface of the substrate, and a metal oxide layer removing step of selectively removing the metal oxide layer from the surface of the substrate by supplying an etchant to the surface of the substrate.

Abstract: A system and method are disclosed for polishing and lubricating an aluminum welding wire. The system and method draw stock aluminum wire from a spool, subject the stock wire to a plurality of drawing and thermal treatment steps to obtain a wire having a final diameter suitable for use in a continuous welding apparatus. Immediately after the final drawing step, the wire is subjected to a polishing and lubricating process in which a cord that is impregnated with a lubricant is passed over the surface of the wire. The cord serves to remove contaminants, such as metal fines, from the surface of the wire, and also to provide a layer of lubricant over the surface of the wire. The resulting wire has an improved appearance, will not clog the automatic welding apparatus, and the lubricant will not contribute adversely to weld porosity in use.

Abstract: An implantable sensor is provide which can be used for determining a concentration of at least one analyte in a medium, in particular a body tissue and/or a body fluid. The implantable sensor has a layered construction with at least one insulating carrier substrate and at least two electrodes which are arranged in at least two different layer planes of the implantable sensor and are electrically isolated from one another by the at least one insulating carrier substrate. The electrodes have electrode areas which face the medium when the sensor has been implanted, and are in contact with the medium over a large area and substantially uniformly, directly or via a generally analyte-permeable membrane layer.

Abstract: The invention relates to an equipment for the surface treatment of parts (4), that comprises a plurality of treatment vats arranged in series and comprising rotating drums (2) provided with means for temporarily attaching the parts to be processed and having their axes (XX?) rotatingly mounted horizontally so that the major portion of each drum (2) is submerged in the processing liquid contained in the corresponding vat, and a conveyor line (14) for supplying each drum (2) with parts to be processed and for removing from said drum the parts already processed, characterized in that the conveying process is carried out along a general axis (ZZ?), and in that the axes (XX?) of the drums are parallel relative to each other and parallel to the general axis (ZZ?) of the conveyor line.

Abstract: This invention relates generally to an apparatus and method for electroplating selected portions of a connector part, such as a pin or a socket. The selective plating apparatus of the present invention is capable of continuously depositing plating solution on precisely the right contact surface of the connector part irrespective of its shape and center of gravity. According to the preferred embodiment of the present invention, the selective plating apparatus is capable of plating either side of the connector part, such as a pin or a socket, allowing plating of different type of metals on each side of the machined or stamped parts. The parts are handled automatically with minimum physical stress resulting in more consistent and reliable plating deposits.

Abstract: The invention relates to a device and a method of applying a coating on a workpiece by electrodeposition. A vessel is provided that is suitable for filling with a bath of electrolyte, anode-forming conductor means being placed in the vessel and connected to a current generator, a cathode-forming workpiece mounted on the mandrel of a lathe, and guidance and movement means for guiding and moving the vessel relative to the lathe, the guidance and movement means enabling the workpiece to be immersed in full or in part in the bath of electrolyte.

Abstract: An electro-thinning apparatus for removing excess metal from the surface metal layer of the substrate is provided. The apparatus includes an electrolysis bath, a transportation system, an anode roller, a cathode roller, and at least one shielding plate. The electrolysis bath contains an electrolysis liquid. The transportation system is disposed in the electrolysis bath for moving a substrate from an upstream end to a downstream end. The anode roller is disposed relative to the electrolysis bath and located upstream to the transportation system. The cathode roller is located above the transportation system and located downstream to the anode roller. The at least one shielding plate is located downstream to the cathode roller. During electrolysis, the anode roller contacts a surface metal layer of the substrate while the cathode roller is partly immersed in the electrolysis liquid and away from the surface metal layer of the substrate during electrolysis.

Abstract: The invention relates to a machine for the surface processing of metal parts by immersion into at least one processing liquid contained in a processing tank comprising a plurality of tanks arranged in series and to a device for transferring the parts between the tanks, said tanks each including a rotary structure mounted on a rotation axis for receiving said parts submerged by a rotation movement of the rotary structures such that the air bubbles generated by the immersion of the parts are chased from the surfaces thereof, machine in which said rotation axis are rotatingly rigidly connected and driven by a common driving device. The tanks arranged in series may be contiguous and the rotation axes of the rotary structures may be aligned and assembled so as to form a common rotation axis extending through the entire machine.

Abstract: The disclosed subject matter provides systems and methods for etching and/or metal plating of substrate materials. An exemplary method in accordance with the disclosed subject matter for metal-plating or etching a substrate includes submerging portions of the substrate in a first bath of chemical solution, performing in-situ laser ablation of the substrate to achieve an immersion plated pattern with a first cation, plating-up the immersion plated pattern with the first cation in the first bath, and plating-up the immersion plated pattern with a second cation in a second bath. The same or another exemplary method can utilize a reel-to-reel system. The plating-up can begin after patterning by immersion plating is complete. Further, a single plating pattern can be used to define a pattern and the same bath can be used to plate the immersion pattern, thereby achieving a uniform thickness of the pattern.

Abstract: A thin film sensor, such as a glucose sensor, is provided for transcutaneous placement at a selected site within the body of a patient. The sensor includes several sensor layers that include conductive layers and includes a proximal segment defining conductive contacts adapted for electrical connection to a suitable monitor, and a distal segment with sensor electrodes for transcutaneous placement. The sensor electrode layers are disposed generally above each other, for example with the reference electrode above the working electrode and the working electrode above the counter electrode. The electrode layers are separated by dielectric layer.

Abstract: A process employing a rack having an article carrier that is movably supported on a frame and mechanically coupled for translating movement from a motor to the article carrier to effect movement of an article during processing to provide more uniform surface treatment, reducing or eliminating the need for shielding.

Abstract: An electro-thinning apparatus for removing excess metal from the surface metal layer of the substrate is provided. The apparatus includes an electrolysis bath, a transportation system, an anode roller, a cathode roller, and at least one shielding plate. The electrolysis bath contains an electrolysis liquid. The transportation system is disposed in the electrolysis bath for moving a substrate from an upstream end to a downstream end. The anode roller is disposed relative to the electrolysis bath and located upstream to the transportation system. The cathode roller is located above the transportation system and located downstream to the anode roller. The at least one shielding plate is located downstream to the cathode roller. During electrolysis, the anode roller contacts a surface metal layer of the substrate while the cathode roller is partly immersed in the electrolysis liquid and away from the surface metal layer of the substrate during electrolysis.

Abstract: Systems and methods to provide electrical contacts to a workpiece to facilitate electrotreating processes, including electroplating and electroetching processes are presented.

Abstract: To avoid the formation of undesirable plating on electric supply rollers, there is provided a continuous plating apparatus in which a planar article to be plated is vertically clamped on both sides by electric supply rollers and the article to be plated is moved horizontally in a plating bath by the rotation of the electric supply rollers to plate both surfaces of the article to be plated. The apparatus is characterized in that the electric supply rollers are divided into conductive segments and non-conductive segments in the circumferential direction, with only the conductive segment which is in contact with the article to be plated being negatively charged, and other conductive segments which are at a distance from the article being positively charged.

Abstract: Substantially uniform deposition of conductive material on a surface of a substrate, which substrate includes a semiconductor wafer, from an electrolyte containing the conductive material can be provided by way of a particular device which includes first and second conductive elements. The first conductive element can have multiple electrical contacts, of identical or different configurations, or may be in the form of a conductive pad, and can contact or otherwise electrically interconnect with the substrate surface over substantially all of the substrate surface. Upon application of a potential between the first and second conductive elements while the electrolyte makes physical contact with the substrate surface and the second conductive element, the conductive material is deposited on the substrate surface. It is possible to reverse the polarity of the voltage applied between the anode and the cathode so that electro-etching of deposited conductive material can be performed.

Abstract: An object of the present invention is to provide an apparatus for electrolytically manufacturing a metal foil which can precisely control the uniformity of the foil thickness in a transverse direction of the metal foil, when the metal foil is continuously manufactured through the electroprecipitation by the use of a drum-like rotating cathode.

Abstract: (a) supplying a capacitor element manufacturing apparatus, in which the capacitor element manufacturing apparatus includes a polymerization tank, a polymerization solution contained in the polymerization tank, and a negative electrode put in the polymerization solution in the polymerization tank, (b) supplying a core material having a plurality of capacitor elements, in which each capacitor element of the plurality of capacitor elements has an anode lead-out portion and a cathode lead-out portion, (c) forming a formation film on the surface of the core material, (d) installing a conductive substance on the formation film, (e) adhering each anode lead-out portion of the plurality of capacitor elements having the conductive substance to a conductive tape, (f) immersing the core material having the anode lead-out portion adhered to the adhesive tape in the polymerization solution, and (g) forming a polymerization film on the cathode lead-out portion of the capacitor element by applying a voltage to the conductiv

Abstract: An electrochemical deposition apparatus and method for depositing a material onto a surface of a workpiece and for polishing the material are disclosed. The apparatus includes a platen and a polishing surface, including a conductive material and conductors embedded therein, disposed proximate the platen. During material deposition, a bias is applied across the conductor and the platen to cause deposition of material onto the workpiece surface.

Abstract: The present invention provides an improved method for electroplating metallic ions onto a conductive substrate. In one embodiment, the method comprises at least partially covering a selected surface of the conductive substrate with an electrode wrap that includes a pad having an abrasive surface.The metallic ions are electrically depositing onto the selected surface through the electrode wrap while the conductive substrate is moved (e.g., rotated) relative to the electrode wrap. A substantially constant frictional force is controllably applied from the abrasive surface onto the selected surface while the metallic ions are being deposited. In this manner, a substantially constant abrasive force is applied to the selected surface as the thickness of the deposited metallic coating increases to create a relatively smooth, uniform, thick deposition that is substantially free of defects.

Abstract: Transition metals (T) of Group VIII (Co, Rh and Ir) have been prepared as semiconductor alloys with Sb having the general formula TSb.sub.3. The skutterudite-type crystal lattice structure of these semiconductor alloys and their enhanced thermoelectric properties results in semiconductor materials which may be used in the fabrication of thermoelectric elements to substantially improve the efficiency of the resulting thermoelectric device. Semiconductor alloys having the desired skutterudite-type crystal lattice structure may be prepared in accordance with the present invention by using vertical gradient freeze techniques, liquid-solid phase sintering techniques, low temperature powder sintering and/or hot-pressing. Measurements of electrical and thermal transport properties of selected semiconductor materials prepared in accordance with the present invention, demonstrated high Hall mobilities (up to 8000 cm.sup.2.V.sup.-1.s.sup.-1), good Seebeck coefficients (up to 400 .mu.VK.sup.-1 between 300.degree. C.

Abstract: In arrangement of high speed plating system, a number of sequential treatment bath units are arranged side by side along an arcuate path at equal intervals, a rotatable transfer unit of workpieces is arranged at the center of the arcuate path to concurrently allocate different workpieces to different treatment bath units for different but concurrent treatments and loading and unloading units are annexed to the transfer unit as interfaces to adjacent systems in a continuous line of production. Arcuate arrangement of the treatment bath units well minimized space demand in a mill and use of the loading and unloading units assure easy and smooth combination of the plating system with adjacent systems.

Abstract: Apparatus for the electrolytic deposition of metal onto metallic or appropriately pre-treated non-metallic objects and cleaning these objects of adhering surface treatment agents after further treatment as well as recovery of these treatment agents, with treatment station, drum installation, anodes, work container, supply bin, rotating arrangement, dosing and measuring arrangements, electrical attachments as well as connected conduit tubes, thereby characterized in that in the work container with overflow arrangement, two anodes are semicircularly arranged around the drum aggregate, whereby the work container is connected across an opening with fractionating arrangement, to a supply container with vacuum space for the surface treatment agent, which can be adjusted to a reduced pressure by means of a vacuum arrangement, and whereby the supply container is connected across a recirculation conduit to the work container, as well as a method using this apparatus. With current density up to 20.0 A/dm.sup.

Abstract: A device for electrodepositing aluminum from an aprotic oxygen-free and water-free aluminum-organic electrolyte which comprises an annular electroplating tank which is subdivided into concentric sub-cells with each cell having electrolyte and anode plates. To charge and discharge workpiece holders into and out of the device includes a charging lock and also a separate discharging lock.

Abstract: An improved galvanizing device for the galvanic precipitation of aluminum from an anhydrous, aprotic, and oxygen-free aluminum-organic electrolyte is provided. The original device having an annularly shaped galvanizing trough, which is sealed from the atmosphere, and which utilizes a centrally located and rotatable contacting and holding mechanism for guiding the goods carriers around and through the electrolyte is herein provided with separate charging and discharging locks attached to the galvanizing trough. Each of the locks is provided with a U-shaped fluid lock to maintain the gaseous seal and an endless chain conveyor to transport the goods carrier to and from the galvanizing trough.

Abstract: A metal plating process and apparatus is disclosed and includes a plurality of pre-plating stations comprising tanks or reservoirs containing various cleaning and rinsing solutions. A pulse plating or gold flash station including a plating tank is provided after the pre-plating stations, and a plurality of post-plating stations or tanks are provided after the pulse-plating station. Rotatable barrels for containing work loads are carried along a path of travel from station to station along the process. Differential speed mechanisms are provided along the process so that the work load containers rotate at a slower rate of rotation while traveling through air than while the containers are disposed within the various tanks or stations along the process.

Abstract: Above the electroplating trough, a lock chamber is arranged which can be flooded with protective gas and is subdivided by means of an intermediate door into an outer chamber and a main chamber. The outer chamber has an outer lock door while the main chamber is connected to the electroplating trough by an inner lock opening. In addition, a work piece transfer device is provided which can be moved between the outer chamber and the main chamber and can be operated from the outside.