With Base Treatment Patents (Class 204/200)
  • Patent number: 10892177
    Abstract: A substrate processing method which processes a substrate having a metal layer on a surface thereof includes a metal oxide layer forming step of forming a metal oxide layer formed of one atomic layer or several atomic layers on a surface layer of the metal layer by supplying an oxidizing fluid to the surface of the substrate, and a metal oxide layer removing step of selectively removing the metal oxide layer from the surface of the substrate by supplying an etchant to the surface of the substrate.
    Type: Grant
    Filed: August 31, 2018
    Date of Patent: January 12, 2021
    Assignee: SCREEN Holdings Co., Ltd.
    Inventors: Akihisa Iwasaki, Yuya Akanishi
  • Patent number: 9352423
    Abstract: A system and method are disclosed for polishing and lubricating an aluminum welding wire. The system and method draw stock aluminum wire from a spool, subject the stock wire to a plurality of drawing and thermal treatment steps to obtain a wire having a final diameter suitable for use in a continuous welding apparatus. Immediately after the final drawing step, the wire is subjected to a polishing and lubricating process in which a cord that is impregnated with a lubricant is passed over the surface of the wire. The cord serves to remove contaminants, such as metal fines, from the surface of the wire, and also to provide a layer of lubricant over the surface of the wire. The resulting wire has an improved appearance, will not clog the automatic welding apparatus, and the lubricant will not contribute adversely to weld porosity in use.
    Type: Grant
    Filed: March 13, 2013
    Date of Patent: May 31, 2016
    Assignee: AlcoTec Wire Corporation
    Inventors: Lance T. Vernam, Timothy M. Cook
  • Patent number: 8997330
    Abstract: An implantable sensor is provide which can be used for determining a concentration of at least one analyte in a medium, in particular a body tissue and/or a body fluid. The implantable sensor has a layered construction with at least one insulating carrier substrate and at least two electrodes which are arranged in at least two different layer planes of the implantable sensor and are electrically isolated from one another by the at least one insulating carrier substrate. The electrodes have electrode areas which face the medium when the sensor has been implanted, and are in contact with the medium over a large area and substantially uniformly, directly or via a generally analyte-permeable membrane layer.
    Type: Grant
    Filed: October 31, 2012
    Date of Patent: April 7, 2015
    Assignee: Roche Diagnostics Operations, Inc.
    Inventors: Holger Kotzan, Gregor Bainczyk
  • Patent number: 8871065
    Abstract: The invention relates to an equipment for the surface treatment of parts (4), that comprises a plurality of treatment vats arranged in series and comprising rotating drums (2) provided with means for temporarily attaching the parts to be processed and having their axes (XX?) rotatingly mounted horizontally so that the major portion of each drum (2) is submerged in the processing liquid contained in the corresponding vat, and a conveyor line (14) for supplying each drum (2) with parts to be processed and for removing from said drum the parts already processed, characterized in that the conveying process is carried out along a general axis (ZZ?), and in that the axes (XX?) of the drums are parallel relative to each other and parallel to the general axis (ZZ?) of the conveyor line.
    Type: Grant
    Filed: September 24, 2007
    Date of Patent: October 28, 2014
    Assignee: Tornos Management Holding SA
    Inventor: Frédéric Vacheron
  • Publication number: 20140102906
    Abstract: This invention relates generally to an apparatus and method for electroplating selected portions of a connector part, such as a pin or a socket. The selective plating apparatus of the present invention is capable of continuously depositing plating solution on precisely the right contact surface of the connector part irrespective of its shape and center of gravity. According to the preferred embodiment of the present invention, the selective plating apparatus is capable of plating either side of the connector part, such as a pin or a socket, allowing plating of different type of metals on each side of the machined or stamped parts. The parts are handled automatically with minimum physical stress resulting in more consistent and reliable plating deposits.
    Type: Application
    Filed: October 12, 2012
    Publication date: April 17, 2014
    Applicant: Galvanotech A/K/A G&S Design and Manufacturing, Inc.
    Inventors: Gennady Volkov, David Olshanetskiy
  • Publication number: 20130126335
    Abstract: The invention relates to a device and a method of applying a coating on a workpiece by electrodeposition. A vessel is provided that is suitable for filling with a bath of electrolyte, anode-forming conductor means being placed in the vessel and connected to a current generator, a cathode-forming workpiece mounted on the mandrel of a lathe, and guidance and movement means for guiding and moving the vessel relative to the lathe, the guidance and movement means enabling the workpiece to be immersed in full or in part in the bath of electrolyte.
    Type: Application
    Filed: January 11, 2013
    Publication date: May 23, 2013
    Inventors: Jean-Louis Thomas, Alain Le Cleac'h
  • Patent number: 8431007
    Abstract: An electro-thinning apparatus for removing excess metal from the surface metal layer of the substrate is provided. The apparatus includes an electrolysis bath, a transportation system, an anode roller, a cathode roller, and at least one shielding plate. The electrolysis bath contains an electrolysis liquid. The transportation system is disposed in the electrolysis bath for moving a substrate from an upstream end to a downstream end. The anode roller is disposed relative to the electrolysis bath and located upstream to the transportation system. The cathode roller is located above the transportation system and located downstream to the anode roller. The at least one shielding plate is located downstream to the cathode roller. During electrolysis, the anode roller contacts a surface metal layer of the substrate while the cathode roller is partly immersed in the electrolysis liquid and away from the surface metal layer of the substrate during electrolysis.
    Type: Grant
    Filed: November 25, 2009
    Date of Patent: April 30, 2013
    Assignee: Advanced Semiconductor Engineering Inc.
    Inventors: Shin-Luh Tarng, Chao-Fu Weng
  • Publication number: 20120037494
    Abstract: The invention relates to a machine for the surface processing of metal parts by immersion into at least one processing liquid contained in a processing tank comprising a plurality of tanks arranged in series and to a device for transferring the parts between the tanks, said tanks each including a rotary structure mounted on a rotation axis for receiving said parts submerged by a rotation movement of the rotary structures such that the air bubbles generated by the immersion of the parts are chased from the surfaces thereof, machine in which said rotation axis are rotatingly rigidly connected and driven by a common driving device. The tanks arranged in series may be contiguous and the rotation axes of the rotary structures may be aligned and assembled so as to form a common rotation axis extending through the entire machine.
    Type: Application
    Filed: April 27, 2010
    Publication date: February 16, 2012
    Applicant: Tomos Management Holding SA
    Inventor: Frederic Vacheron
  • Publication number: 20110042201
    Abstract: The disclosed subject matter provides systems and methods for etching and/or metal plating of substrate materials. An exemplary method in accordance with the disclosed subject matter for metal-plating or etching a substrate includes submerging portions of the substrate in a first bath of chemical solution, performing in-situ laser ablation of the substrate to achieve an immersion plated pattern with a first cation, plating-up the immersion plated pattern with the first cation in the first bath, and plating-up the immersion plated pattern with a second cation in a second bath. The same or another exemplary method can utilize a reel-to-reel system. The plating-up can begin after patterning by immersion plating is complete. Further, a single plating pattern can be used to define a pattern and the same bath can be used to plate the immersion pattern, thereby achieving a uniform thickness of the pattern.
    Type: Application
    Filed: October 4, 2010
    Publication date: February 24, 2011
    Applicant: The Trustees Of Columbia University In The City Of New York
    Inventors: Robert J. Von Gutfeld, Alan C. West
  • Patent number: 7882611
    Abstract: A thin film sensor, such as a glucose sensor, is provided for transcutaneous placement at a selected site within the body of a patient. The sensor includes several sensor layers that include conductive layers and includes a proximal segment defining conductive contacts adapted for electrical connection to a suitable monitor, and a distal segment with sensor electrodes for transcutaneous placement. The sensor electrode layers are disposed generally above each other, for example with the reference electrode above the working electrode and the working electrode above the counter electrode. The electrode layers are separated by dielectric layer.
    Type: Grant
    Filed: August 20, 2008
    Date of Patent: February 8, 2011
    Assignee: Medtronic Minimed, Inc.
    Inventors: Rajiv Shah, Rebecca K. Gottlieb
  • Patent number: 7850830
    Abstract: A process employing a rack having an article carrier that is movably supported on a frame and mechanically coupled for translating movement from a motor to the article carrier to effect movement of an article during processing to provide more uniform surface treatment, reducing or eliminating the need for shielding.
    Type: Grant
    Filed: May 11, 2007
    Date of Patent: December 14, 2010
    Assignee: Lacks Enterprises, Inc.
    Inventors: Trevor W. Richardson, John A. Piselli
  • Publication number: 20100224504
    Abstract: An electro-thinning apparatus for removing excess metal from the surface metal layer of the substrate is provided. The apparatus includes an electrolysis bath, a transportation system, an anode roller, a cathode roller, and at least one shielding plate. The electrolysis bath contains an electrolysis liquid. The transportation system is disposed in the electrolysis bath for moving a substrate from an upstream end to a downstream end. The anode roller is disposed relative to the electrolysis bath and located upstream to the transportation system. The cathode roller is located above the transportation system and located downstream to the anode roller. The at least one shielding plate is located downstream to the cathode roller. During electrolysis, the anode roller contacts a surface metal layer of the substrate while the cathode roller is partly immersed in the electrolysis liquid and away from the surface metal layer of the substrate during electrolysis.
    Type: Application
    Filed: November 25, 2009
    Publication date: September 9, 2010
    Inventors: Shin-Luh Trang, Chao-Fu Weng
  • Patent number: 7211174
    Abstract: Systems and methods to provide electrical contacts to a workpiece to facilitate electrotreating processes, including electroplating and electroetching processes are presented.
    Type: Grant
    Filed: October 28, 2002
    Date of Patent: May 1, 2007
    Assignee: Novellus Systems, Inc.
    Inventors: Bulent M Basol, Homayoun Talieh, Boguslaw A. Nagorski, Cyprian E. Uzoh, Jeffrey A. Bogart
  • Patent number: 6926812
    Abstract: To avoid the formation of undesirable plating on electric supply rollers, there is provided a continuous plating apparatus in which a planar article to be plated is vertically clamped on both sides by electric supply rollers and the article to be plated is moved horizontally in a plating bath by the rotation of the electric supply rollers to plate both surfaces of the article to be plated. The apparatus is characterized in that the electric supply rollers are divided into conductive segments and non-conductive segments in the circumferential direction, with only the conductive segment which is in contact with the article to be plated being negatively charged, and other conductive segments which are at a distance from the article being positively charged.
    Type: Grant
    Filed: August 21, 2002
    Date of Patent: August 9, 2005
    Inventor: Kazuo Ohba
  • Publication number: 20030209425
    Abstract: Substantially uniform deposition of conductive material on a surface of a substrate, which substrate includes a semiconductor wafer, from an electrolyte containing the conductive material can be provided by way of a particular device which includes first and second conductive elements. The first conductive element can have multiple electrical contacts, of identical or different configurations, or may be in the form of a conductive pad, and can contact or otherwise electrically interconnect with the substrate surface over substantially all of the substrate surface. Upon application of a potential between the first and second conductive elements while the electrolyte makes physical contact with the substrate surface and the second conductive element, the conductive material is deposited on the substrate surface. It is possible to reverse the polarity of the voltage applied between the anode and the cathode so that electro-etching of deposited conductive material can be performed.
    Type: Application
    Filed: June 10, 2003
    Publication date: November 13, 2003
    Inventors: Homayoun Talieh, Cyprian Uzoh, Bulent M. Basol
  • Publication number: 20030102209
    Abstract: An object of the present invention is to provide an apparatus for electrolytically manufacturing a metal foil which can precisely control the uniformity of the foil thickness in a transverse direction of the metal foil, when the metal foil is continuously manufactured through the electroprecipitation by the use of a drum-like rotating cathode.
    Type: Application
    Filed: November 13, 2002
    Publication date: June 5, 2003
    Inventors: Fumiaki Hosokoshi, Naomitsu Inoue, Satoru Fujita, Tatsuyoshi Sakada
  • Patent number: 6544301
    Abstract: (a) supplying a capacitor element manufacturing apparatus, in which the capacitor element manufacturing apparatus includes a polymerization tank, a polymerization solution contained in the polymerization tank, and a negative electrode put in the polymerization solution in the polymerization tank, (b) supplying a core material having a plurality of capacitor elements, in which each capacitor element of the plurality of capacitor elements has an anode lead-out portion and a cathode lead-out portion, (c) forming a formation film on the surface of the core material, (d) installing a conductive substance on the formation film, (e) adhering each anode lead-out portion of the plurality of capacitor elements having the conductive substance to a conductive tape, (f) immersing the core material having the anode lead-out portion adhered to the adhesive tape in the polymerization solution, and (g) forming a polymerization film on the cathode lead-out portion of the capacitor element by applying a voltage to the conductiv
    Type: Grant
    Filed: May 21, 2001
    Date of Patent: April 8, 2003
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Yasuhiro Kobatake, Yukari Shimamoto, Mitsuo Tadokoro, Isao Kaneko
  • Publication number: 20020148732
    Abstract: An electrochemical deposition apparatus and method for depositing a material onto a surface of a workpiece and for polishing the material are disclosed. The apparatus includes a platen and a polishing surface, including a conductive material and conductors embedded therein, disposed proximate the platen. During material deposition, a bias is applied across the conductor and the platen to cause deposition of material onto the workpiece surface.
    Type: Application
    Filed: April 11, 2001
    Publication date: October 17, 2002
    Inventors: Ismail Emesh, Saket Chadda, Nikolay Korovin, Brian Mueller
  • Patent number: 6143156
    Abstract: The present invention provides an improved method for electroplating metallic ions onto a conductive substrate. In one embodiment, the method comprises at least partially covering a selected surface of the conductive substrate with an electrode wrap that includes a pad having an abrasive surface.The metallic ions are electrically depositing onto the selected surface through the electrode wrap while the conductive substrate is moved (e.g., rotated) relative to the electrode wrap. A substantially constant frictional force is controllably applied from the abrasive surface onto the selected surface while the metallic ions are being deposited. In this manner, a substantially constant abrasive force is applied to the selected surface as the thickness of the deposited metallic coating increases to create a relatively smooth, uniform, thick deposition that is substantially free of defects.
    Type: Grant
    Filed: July 24, 1998
    Date of Patent: November 7, 2000
    Assignee: CAE Vanguard, Inc.
    Inventor: Ming Jason Zhang
  • Patent number: 5610366
    Abstract: Transition metals (T) of Group VIII (Co, Rh and Ir) have been prepared as semiconductor alloys with Sb having the general formula TSb.sub.3. The skutterudite-type crystal lattice structure of these semiconductor alloys and their enhanced thermoelectric properties results in semiconductor materials which may be used in the fabrication of thermoelectric elements to substantially improve the efficiency of the resulting thermoelectric device. Semiconductor alloys having the desired skutterudite-type crystal lattice structure may be prepared in accordance with the present invention by using vertical gradient freeze techniques, liquid-solid phase sintering techniques, low temperature powder sintering and/or hot-pressing. Measurements of electrical and thermal transport properties of selected semiconductor materials prepared in accordance with the present invention, demonstrated high Hall mobilities (up to 8000 cm.sup.2.V.sup.-1.s.sup.-1), good Seebeck coefficients (up to 400 .mu.VK.sup.-1 between 300.degree. C.
    Type: Grant
    Filed: January 28, 1994
    Date of Patent: March 11, 1997
    Assignee: California Institute of Technology
    Inventors: Jean-Pierre Fleurial, Thierry F. Caillat, Alexander Borshchevsky
  • Patent number: 5092975
    Abstract: In arrangement of high speed plating system, a number of sequential treatment bath units are arranged side by side along an arcuate path at equal intervals, a rotatable transfer unit of workpieces is arranged at the center of the arcuate path to concurrently allocate different workpieces to different treatment bath units for different but concurrent treatments and loading and unloading units are annexed to the transfer unit as interfaces to adjacent systems in a continuous line of production. Arcuate arrangement of the treatment bath units well minimized space demand in a mill and use of the loading and unloading units assure easy and smooth combination of the plating system with adjacent systems.
    Type: Grant
    Filed: June 15, 1989
    Date of Patent: March 3, 1992
    Assignee: Yamaha Corporation
    Inventors: Takayoshi Yamamura, Yoshihisa Endo, Akira Shinmura
  • Patent number: 4409082
    Abstract: Apparatus for the electrolytic deposition of metal onto metallic or appropriately pre-treated non-metallic objects and cleaning these objects of adhering surface treatment agents after further treatment as well as recovery of these treatment agents, with treatment station, drum installation, anodes, work container, supply bin, rotating arrangement, dosing and measuring arrangements, electrical attachments as well as connected conduit tubes, thereby characterized in that in the work container with overflow arrangement, two anodes are semicircularly arranged around the drum aggregate, whereby the work container is connected across an opening with fractionating arrangement, to a supply container with vacuum space for the surface treatment agent, which can be adjusted to a reduced pressure by means of a vacuum arrangement, and whereby the supply container is connected across a recirculation conduit to the work container, as well as a method using this apparatus. With current density up to 20.0 A/dm.sup.
    Type: Grant
    Filed: March 12, 1982
    Date of Patent: October 11, 1983
    Assignee: Schering AG
    Inventor: Helmut Goldmann
  • Patent number: 4399018
    Abstract: A device for electrodepositing aluminum from an aprotic oxygen-free and water-free aluminum-organic electrolyte which comprises an annular electroplating tank which is subdivided into concentric sub-cells with each cell having electrolyte and anode plates. To charge and discharge workpiece holders into and out of the device includes a charging lock and also a separate discharging lock.
    Type: Grant
    Filed: June 28, 1982
    Date of Patent: August 16, 1983
    Assignee: Siemens Aktiengesellschaft
    Inventors: Siegfried Birkle, Johann Gehring, Klaus Stoeger
  • Patent number: 4363712
    Abstract: An improved galvanizing device for the galvanic precipitation of aluminum from an anhydrous, aprotic, and oxygen-free aluminum-organic electrolyte is provided. The original device having an annularly shaped galvanizing trough, which is sealed from the atmosphere, and which utilizes a centrally located and rotatable contacting and holding mechanism for guiding the goods carriers around and through the electrolyte is herein provided with separate charging and discharging locks attached to the galvanizing trough. Each of the locks is provided with a U-shaped fluid lock to maintain the gaseous seal and an endless chain conveyor to transport the goods carrier to and from the galvanizing trough.
    Type: Grant
    Filed: November 6, 1981
    Date of Patent: December 14, 1982
    Assignee: Siemens Aktiengesellschaft
    Inventors: Siegfried Birkle, Johann Gehring, Klaus Stoeger
  • Patent number: 4257853
    Abstract: A metal plating process and apparatus is disclosed and includes a plurality of pre-plating stations comprising tanks or reservoirs containing various cleaning and rinsing solutions. A pulse plating or gold flash station including a plating tank is provided after the pre-plating stations, and a plurality of post-plating stations or tanks are provided after the pulse-plating station. Rotatable barrels for containing work loads are carried along a path of travel from station to station along the process. Differential speed mechanisms are provided along the process so that the work load containers rotate at a slower rate of rotation while traveling through air than while the containers are disposed within the various tanks or stations along the process.
    Type: Grant
    Filed: October 6, 1978
    Date of Patent: March 24, 1981
    Assignee: Bunker Ramo Corporation
    Inventors: Carrol D. Quinton, Raphael Guio
  • Patent number: 4176034
    Abstract: Above the electroplating trough, a lock chamber is arranged which can be flooded with protective gas and is subdivided by means of an intermediate door into an outer chamber and a main chamber. The outer chamber has an outer lock door while the main chamber is connected to the electroplating trough by an inner lock opening. In addition, a work piece transfer device is provided which can be moved between the outer chamber and the main chamber and can be operated from the outside.
    Type: Grant
    Filed: April 14, 1978
    Date of Patent: November 27, 1979
    Assignee: Siemens Aktiengesellschaft
    Inventors: Klaus Stoger, Richard Dotzer, Josef Stadter, Johann Gehring