Endless Patents (Class 204/202)
  • Patent number: 7033468
    Abstract: For manufacturing printed circuit boards and films 7 with little variations in the layer thickness of the circuit structures without damaging the surfaces of the boards and films, a rotatory element 9, 10, more specifically a contact roll, is used for placing the printed circuit boards and films in electric contact, an elastic, electrically conductive material 2, 5, 6 being at least partially applied on the running tread unreeling on the printed circuit boards and films.
    Type: Grant
    Filed: April 11, 2001
    Date of Patent: April 25, 2006
    Assignee: Atotech Deutschland GmbH
    Inventor: Egon Hubel
  • Patent number: 6991717
    Abstract: The present invention relates to a web handling apparatus and process ideally suited for applications involving wet chemistry. The invention involves the horizontal processing of webs in processing containers. The web is redirected into the processing container by inserting a cassette across the web and into the processing container. The cassette includes at least one functional fluid element that facilitates processing of the web. The web handling practices of the invention improve the quality of the processed web. The invention is preferably used in electrodeposition processes.
    Type: Grant
    Filed: April 5, 2002
    Date of Patent: January 31, 2006
    Assignee: 3M Innovative Properties Company
    Inventors: Gregory F. King, John S. Huizinga, James N. Dobbs, Luther E. Erickson, Daniel H. Carlson, Dale L. Ehnes, Gary A. Shreve
  • Patent number: 6899797
    Abstract: An electrochemical reaction assembly of inducing electrochemical reactions, such as for deposition of materials on semiconductor substrates. The assembly achieves a highly uniform thickness and composition of deposition material or uniform etching or polishing on the semiconductor substrates by retaining the semiconductor substrates on a moving cathode immersed in an appropriate reaction solution wherein a wire mesh anode rotates about the moving cathode during electrochemical reaction.
    Type: Grant
    Filed: February 11, 2003
    Date of Patent: May 31, 2005
    Assignee: Micron Technology, Inc.
    Inventors: Salman Akram, David R. Hembree
  • Publication number: 20040226825
    Abstract: A porous nickel foil for a negative electrode of an alkaline battery formed by an electrolytic deposition method, wherein the porous nickel foil is flexible and has a thickness of 10-35 &mgr;m and a Vickers hardness of 70-130. An electrodeposition drum for producing porous metal foil by an electrolytic deposition method including a drum having a surface onto which metal foil is deposited, a plurality of holes formed in the surface and an insulating resin filled in the holes, wherein the ratio of depth L and diameter D (L/D) of the hole is at least 1 and no clearance, into which deposited metal otherwise cuts in a wedge shape, exists at the boundary between the insulating resin filled in the hole and an opening edge of the hole.
    Type: Application
    Filed: May 13, 2003
    Publication date: November 18, 2004
    Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
    Inventors: Toshiaki Shiota, Ryoichi Noumi, Kunihiro Fukui, Masanari Kimoto
  • Patent number: 6752915
    Abstract: The present invention provides a web conveying apparatus for conveying a web while holding the web and applying tension to the web, wherein the conveying apparatus has a plurality of rollers with which the web contacts to be conveyed, and at least one roller of the plurality of rollers has a mechanism for limiting deformation of the web within Y/E, and a web conveying method using a web conveying apparatus for conveying a web while holding the web and applying tension to the web, wherein the conveying apparatus has a plurality of rollers with which the web contacts to be conveyed, and the web is conveyed while the deformation of the web is limited within Y/E by a mechanism that is provided for at least one roller of the plurality of rollers. The apparatus and the method prevent meandering of the web.
    Type: Grant
    Filed: March 27, 2001
    Date of Patent: June 22, 2004
    Assignee: Canon Kabushiki Kaisha
    Inventors: Kozo Arao, Noboru Toyama, Yuichi Sonoda, Yusuke Miyamoto
  • Patent number: 6746720
    Abstract: A plurality of baths for dipping and the like is arranged in series so that these baths contact one another, and a conveyor 2 is linearly arranged above the dipping bath in one plane. A workpiece 1 is tact-conveyed on the conveyor 2 in a floor conveyor position. The workpiece 1 is stopped at each bath for dipping and the like, wherein when the workpiece 1 is rotated horizontally about 180° to change its position to an overhead conveyor position, it is immersed in the corresponding bath for dipping and the like for dipping treatment.
    Type: Grant
    Filed: January 4, 2001
    Date of Patent: June 8, 2004
    Assignee: Honda Giken Kogyo Kabushiki Kaisha
    Inventors: Hidenobu Nishida, Makoto Sakai
  • Publication number: 20040104112
    Abstract: Disclosed herein is a feed belt for strip-shaped elements. In case of a conventional feed belt configured so that its belt body and fingers are integrally formed, the feed belt has to be wholly replaced even if a part of the fingers is damaged or deformed in use, resulting in uneconomical problems. Further, the fingers must be simultaneously pressed toward each other into horizontal pressing directions for loading/unloading of the strip-shaped element, resulting in a complexity in the structure of associated peripheral devices. Even in case of another conventional feed belt configured so that its fingers are separably coupled to its belt body, the fingers have to be pressed upward in operation, resulting in a complexity of associated devices.
    Type: Application
    Filed: November 25, 2003
    Publication date: June 3, 2004
    Inventor: Kee Yol Choi
  • Publication number: 20040026256
    Abstract: The disclosed embodiments represent a method and apparatus for improving a lead-free electroplating process in the manufacture of semiconductor devices. To prevent the buildup of undesirable copper or bismuth on a conveyor belt and the associated tooling used to transport integrated circuit devices through an electroplating bath, a metal more noble than copper or bismuth, depending on which is used as a plating metal, is plated onto the surface of the conveyor belt and associated tooling.
    Type: Application
    Filed: August 8, 2002
    Publication date: February 12, 2004
    Inventor: Joseph T. Lindgren
  • Patent number: 6514392
    Abstract: A conducting roller is used in an electroplating apparatus, and includes a conductive roller body, which has two diameter-reduced end portions that are journalled within two stationary conductive sleeve units. A conductive liquid is filled within two sealed gaps between the end portions of the roller body and the sleeve units, thereby transmitting cathode current from the conductive sleeve units to the end portions of the roller body.
    Type: Grant
    Filed: July 2, 2001
    Date of Patent: February 4, 2003
    Inventor: Jason Ko
  • Patent number: 6508926
    Abstract: In a device, rod-shaped objects 10 (rods of various length and diameter) are electrochemically partially processed in dip plants (galvanized, pickled). Stationary tubular electrodes 30, into which the rods 10 are centrically entered, are provided in the plating tank of the plant. The surfaces to be plated are each axially limited by an adjustable membrane carrier 26, in which elastic shielding membranes 9 for delimiting the field lines are arranged. The membranes 9 are held by membrane holders 5. The membrane holders 5 are arranged in a cage where they are free to move radially and are provided with inner centering springs 7 and with outer centering springs 19 so that the membrane holder 5 and the membranes 9 are held in such a way as to be self-centering.
    Type: Grant
    Filed: February 21, 2001
    Date of Patent: January 21, 2003
    Assignee: Atotech Deutschland GmbH
    Inventors: Johann Falkner, Rudolf Kauper, Manfred Krepelka, Thomas Lummer
  • Publication number: 20030010626
    Abstract: A wafer plating system horizontally transporting vertically oriented wafers into one or more process cells. The wafer processing system includes a carrier rotatable from a substantially horizontal orientation to a substantially vertical orientation. A cathode assembly secures the wafer onto the carrier and electrically couples the wafer to a power supply.
    Type: Application
    Filed: July 16, 2001
    Publication date: January 16, 2003
    Inventors: Daniel J. Gramarossa, Gary C. Downes
  • Patent number: 6485620
    Abstract: Device (60) having one or more operative units (55) for electroplating a film by chemical reaction with a specially made liquid product (29) and application of direct current, on sheets (50) for printed circuits continuously translating between one or more pairs of opposing oblong chambers (210, 130) respectively supplied with tubular nozzles (231) and with one longitudinal slit nozzle (233) and having internal electrodes (220, 240) electrically connected to the negative pole of a generator of direct current, between one or more pairs of titanium contact rollers (61-62, 130-131), electrically connected to the positive pole of the current, and plastic containment rollers (100-101, 110-111) of the liquid (29) rotating in each pair reciprocally in opposite directions, due to closure of the electric circuit between the liquid product (29), pumped in under pressure by the pump and projected by the nozzles (213, 233) of the chambers (210, 230) against the sheets (50), and said sheets through the contact rollers.
    Type: Grant
    Filed: April 20, 2000
    Date of Patent: November 26, 2002
    Assignee: Occleppo di Francesco Occleppo & C.S.N.C.
    Inventor: Francesco Occleppo
  • Publication number: 20020162749
    Abstract: A continuous electrocoat apparatus is provided for applying a coating onto a substantially flat substrate, e.g., an electroconductive substrate in coil or blank form. In one embodiment, the apparatus includes a first electrocoat tank having a coating region and a non-conductive conveyor extending at least partially into the first electrocoat tank and defining a conveyor path. A plurality of electrically conductive supports are carried on the conveyor. A connecting system is configured to selectively place at least a portion of the supports in electrical contact with an electrical power source when the selected supports are in the coating region of the first electrocoat tank.
    Type: Application
    Filed: March 2, 2001
    Publication date: November 7, 2002
    Inventors: Donald D. Emmonds, Catharine A. Palmer
  • Patent number: 6432295
    Abstract: In a process for the electrolytic polishing of surgical needles, a plurality of unfinished needles, which are arranged side by side and are secured to at least one web (6, 7) in their end-regions lying opposite the needle tips, are moved with the help of the web (6, 7) through an acid-containing polishing bath (22) which is electrically connected to an electrode. The web (6, 7) is guided above the polishing bath (22). The unfinished needles dip at least with the needle tips into the polishing bath (22). Above the polishing bath (22) and alongside the web (6, 7), a metal ribbon (40) connected as a counter-electrode provides an electrical connection with the unfinished needles.
    Type: Grant
    Filed: November 22, 2000
    Date of Patent: August 13, 2002
    Assignee: Ethicon Limited
    Inventors: Horst Szameitat, Stephan Gelahr
  • Patent number: 6406542
    Abstract: In equipment for powder-coating, workpieces such as escalator steps are subjected to a current treatment in an anodizing unit. A conveying means advancing carriers for the workpieces is lowered over a tank so that the workpieces in transit are immersed in and continue transit within a bath and after a specific dwell time are lifted back out of the bath at the end of the tank. Arranged in the tank region is a current feed, such as a bus bar, which extends parallel to the travel path of the conveying means. Each carrier is provided with a current take-off which connects the carrier with the current feed. The current connection is produced on lowering the carrier into the bath and interrupted on raising the carrier from the bath.
    Type: Grant
    Filed: October 12, 1999
    Date of Patent: June 18, 2002
    Assignee: Inventio AG
    Inventor: Helmut Stepancik
  • Patent number: 6395163
    Abstract: A process for electrolytically processing a flat perforated item, comprising the steps of: moving the item in a transport direction to a treatment station where the item is contacted with an electrolyte, continuously mechanically wiping, in the presence of one of a cathodic item and an anode, and an anodic item and a cathode, a surface of the item using means for reducing the thickness of a diffusion layer depleted in metal ions adjacent the surface of the item, which means include a wiping roller extending perpendicular to the transport direction over the entire width of the item and in contact with the item; and moving the electrolyte in a direction substantially perpendicular to a plane of the item so as to direct the electrolyte only toward the perforations in the item and to convey the electrolyte through the in the item under pressure.
    Type: Grant
    Filed: October 13, 1998
    Date of Patent: May 28, 2002
    Assignee: Atotech Deutschland GmbH
    Inventors: Reinhard Schneider, Rolf Schroeder, Klaus Wolfer, Thomas Kosikowski
  • Publication number: 20010035355
    Abstract: The invention relates to a frame plating method for forming a plating film using a mold formed by patterning a resist, and has an object to provide the frame plating method in which tilting of a resist frame having a high aspect ratio is easily and certainly prevented and a desired plating film can be formed. The constitution includes a developing/washing portion 100 for developing an exposed resist layer formed on a substrate 138 and for washing a developing solution by a washing solution, and a plating portion 50 for immersing a surface of the substrate 138 in a state where the washing solution is not dried after washing but is held, into a plating solution 62 to carry out plating.
    Type: Application
    Filed: March 29, 2001
    Publication date: November 1, 2001
    Applicant: TDK CORPORATION
    Inventor: Akifumi Kamijima
  • Patent number: 6309518
    Abstract: A surface-treatment plant, particularly for galvanic treatments, includes at least one tank (3) for holding a bath (B) for treating pieces (P) to be treated by immersion therein, and a continuous conveyor device (5) having an active pass at least a portion of which is immersed in the tank (3) in order to move the pieces being treated from an end at which the pieces enter the bath to an end at which the pieces leave the bath.
    Type: Grant
    Filed: November 16, 1999
    Date of Patent: October 30, 2001
    Assignee: C.V.G. Centro Veneto Galvanico S.R.L.
    Inventor: Fervino Schievano
  • Patent number: 6294060
    Abstract: A conveyorized electroplating device having an anode positioned proximate to a plurality of absorptive applicator assemblies that apply a plating solution to a substrate and a conveyor device that grips the substrate thereby isolating the electrical contact from the plating solution. The conveyorized electroplating device has a fluid bed assembly with a manifold and an anode, a conveyor device adjacent to the fluid bed assembly, and a plurality of absorptive applicator assemblies, wherein the plurality of absorptive applicator assemblies are adjacent and in close proximity to the anode and in fluid communication with the fluid bed assembly. The conveyor device isolates the electrical contacts from the plating solution and is able to handle various sizes and thicknesses of substrates.
    Type: Grant
    Filed: October 21, 1999
    Date of Patent: September 25, 2001
    Assignee: ATI Properties, Inc.
    Inventors: Joseph M. Webb, Jerome R. Faucher
  • Publication number: 20010015323
    Abstract: A method and an apparatus for manufacturing a wire, particularly a sawtooth wire for all-steel sawtooth wire card clothings, wherein the surface of a wire-shaped intermediate product, such as a wire already provided with sawteeth, is smoothened in an electropolishing process in an electrolyte bath containing an electrolyte. A relative movement is produced between the electrolyte and the intermediate product during the electropolishing process. The apparatus includes a device for producing a relative movement between the electrolyte and the intermediate product contained in the electrolyte bath.
    Type: Application
    Filed: February 14, 2001
    Publication date: August 23, 2001
    Applicant: Graf + Cie AG
    Inventor: Ralph A. Graf
  • Patent number: 6238529
    Abstract: The apparatus for electrolytically treating printed circuit boards 3, through which apparatus the printed circuit boards are continuously guidable in a plane of conveyance in a substantially horizontal direction of conveyance, has the following features: Counter-electrodes 1,2 are disposed opposite the plane of conveyance and substantially parallel thereto on at least one side, so that electrolytic chambers 4,5 are formed between counter-electrodes, which are situated opposite one another, or between the counter-electrodes and the plane of conveyance, the counter-electrodes forming respective substantially continuous electrode faces. Guide elements 7,8 for the printed circuit boards are disposed in the electrolytic chamber. Contact elements 11 are provided for the electrical contacting of the printed circuit boards. Electrolyte spraying arrangements 13 are also provided for conveying the electrolytic fluid towards the surfaces of the printed circuit boards. Openings are provided in the counter-electrodes.
    Type: Grant
    Filed: November 22, 1999
    Date of Patent: May 29, 2001
    Assignee: Atotech Deutschland GmbH
    Inventors: Jens Geissler, Thomas Rydlewski, Lorenz Kopp, Ralf-Peter Wächter, Reinhard Schneider
  • Patent number: 6132570
    Abstract: An electrochemical reaction assembly and methods of inducing electrochemical reactions, such as for deposition of materials on semiconductor substrates. The assembly and method achieve a highly uniform thickness and composition of deposition material or uniform etching or polishing on the semiconductor substrates by retaining the semiconductor substrates on a moving cathode immersed in an appropriate reaction solution wherein a wire mesh anode rotates about the moving cathode during electrochemical reaction.
    Type: Grant
    Filed: March 31, 1999
    Date of Patent: October 17, 2000
    Assignee: Micron Technology, Inc.
    Inventors: Salman Akram, David R. Hembree
  • Patent number: 6129827
    Abstract: A process for forming a fluorescent layer on an electrode disposed on a substrate for display panel includes the steps of: placing an opening of a housing section for housing a fluorescent paste opposite to the electrode on the substrate; and applying a voltage between the electrode on the substrate and a control electrode disposed inside the housing section in this state, whereby the fluorescent paste inside the housing section is exactly applied onto the electrode via the opening. Also, an apparatus for forming a fluorescent layer on a substrate for display panel using the process is disclosed.
    Type: Grant
    Filed: November 3, 1997
    Date of Patent: October 10, 2000
    Assignee: Fujitsu Limited
    Inventors: Akira Nakazawa, Nobuhiro Iwase, Keiichi Betsui, Akihiro Mochizuki
  • Patent number: 6077411
    Abstract: An apparatus for forming a zinc oxide film on a sheet substrate including a tank containing an aqueous electrolytic solution containing at least nitrate ions and zinc ions, conveyer means for continuously feeding and conveying an elongated electroconductive sheet substrate having two major surfaces in a direction while dipping a lengthwise portion of the sheet substrate in the electrolytic solution, a counter electrode immersed in the electrolytic solution so as to be opposite to the lengthwise portion of the sheet substrate, and a power supply disposed so as to pass a current between the sheet substrate and the counter electrode, wherein the conveyer means include a plurality of rollers and an endless belt wound about the rollers so as to have a conveyer surface contacting and covering one of the major surfaces of the lengthwise portion of the sheet substrate dipped in the electrolytic solution while moving together with the sheet substrate.
    Type: Grant
    Filed: January 16, 1998
    Date of Patent: June 20, 2000
    Assignee: Canon Kabushiki Kaisha
    Inventor: Tetsuro Nakamura
  • Patent number: 5985106
    Abstract: A continuous plating system which is horizontal, allows for submersion of the entire article to be plated, and is useful for alloy plating. The invention provides a link/hinge conveyor system, the conveyor acts as the conductor, numerous processes/baths are possible, and difficult to plate alloys, such as a tin/bismuth plate can be produced. Homogeneous alloys are possible with the present invention. Also disclosed are novel dryer and rinse systems for use with the continuous plating system.
    Type: Grant
    Filed: July 12, 1996
    Date of Patent: November 16, 1999
    Inventor: Geronimo Z. Velasquez
  • Patent number: 5932081
    Abstract: The invention relates to a method and device for electroplating plate-shaped product, particularly printed circuit boards, in horizontal continuous plants with optional sequence of product, revolving contacting means serving for electrical connection of a source of bath current via wiper rails with the product, and the beginning and end of each individual product item at the inlet to the electroplating plant, and the transport speed of the product, being detected with the aid of sensors, said sensors sending sensor signals to a control system which ascertains whether a product item is present at the gripping point of the contacting means or not, the contacting means being connected electrically and in the electroplating sense in a low-resistance manner to the sources of bath current only when product is present in the region of contacts of the contacting means.
    Type: Grant
    Filed: May 19, 1997
    Date of Patent: August 3, 1999
    Assignee: Atotech Deutschland GmbH
    Inventors: Lorenz Kopp, Helmut Scharrer
  • Patent number: 5914016
    Abstract: In order in a continuous electroplating plant to avoid the problem of undesired metal application or metallization on contact faces (25), which e.g. occur in the case of rolling contacting of the article (13) to be plated, e.g. a printed circuit board, on contact rollers or disks (15) are provided individual contact sectors (24), which are alternately anodically and cathodically supplied with power via a commutator (27) located outside the treatment chamber (11). The contact sectors (24) are mutually overlapping and are staggered e.g. in sloping, arrow-like or step-like manner, so that a continuous contacting with respect to the article (13) is possible.Contacting takes place in a lateral portion (45) of the treatment chamber (11), which is admittedly filled with treatment fluid (40), but is largely shielded with respect thereto, so that the metal application tendency is reduced.
    Type: Grant
    Filed: July 15, 1997
    Date of Patent: June 22, 1999
    Assignee: Gebr. Schmid GmbH & Co.
    Inventor: Dieter C. Schmid
  • Patent number: 5901997
    Abstract: A transport device for conveying vertically oriented plate-like articles for chemical or electrolytic surface treatment, the device having clamping elements maintained in the manner of tongs, which can be actuated by means of a sliding body and a linkage mechanism for grasping a plate-like article. The linkage mechanism consists of two crank arms which are associated with each other and guided in such a way that the course of their movement consists of two sections, namely a spreading or clamping movement extending essentially horizontally for grasping and releasing the plate-like article to be held, and an essentially vertically extending lifting and lowering movement for dipping and removing the transport device in the respective treatment liquid for the plate-like article.
    Type: Grant
    Filed: June 26, 1997
    Date of Patent: May 11, 1999
    Assignee: Lea Ronal GmbH
    Inventor: Reinhold Bayer
  • Patent number: 5893966
    Abstract: An electrochemical reaction assembly and methods of inducing electrochemical reactions, such as for deposition of materials on semiconductor substrates. The assembly and method achieve a highly uniform thickness and composition of deposition material or uniform etching or polishing on the semiconductor substrates by retaining the semiconductor substrates on a moving cathode immersed in an appropriate reaction solution wherein a wire mesh anode rotates about the moving cathode during electrochemical reaction.
    Type: Grant
    Filed: July 24, 1997
    Date of Patent: April 13, 1999
    Assignee: Micron Technology, Inc.
    Inventors: Salman Akram, David R. Hembree
  • Patent number: 5833816
    Abstract: The printed circuit boards (LP) are conducted through treatment baths (BB1 through BB3) in vertical attitude on at least two horizontal conveying paths (TW1 through TW4) proceeding next to one another, these treatment baths being accommodated in treatment cells (BZ10 through BZ13, BZ20 through BZ23, BZ30 through BZ33) that are arranged successively and next to one another. The end walls of the treatment cells are provided with vertical slots (S) and allocated seals (D) for the passage of the printed circuit boards. The bath liquid emerging from treatment cells arranged next to one another is collected in common collecting tanks (AW1 through AW3) and is returned into the treatment cells with the assistance of pumps (P). A common treatment cell for treatment zones lying next to one another can also be provided in a common collecting tank. The conveying of the printed circuit boards on the conveying paths lying next to one another preferably ensues with a common conveyor device.
    Type: Grant
    Filed: November 12, 1996
    Date of Patent: November 10, 1998
    Assignee: Siemens S.A.
    Inventors: Marcel Heermann, Daniel Hosten
  • Patent number: 5762767
    Abstract: An automatic transferring and processing apparatus of a cathode and method thereof. A cathode having an electro-deposited metal is taken out of an electrolytic cell, rotated by a stock cathode pivot, transferred through a stock moving carriage and stock conveyor to a processor for processing an electro-deposited metal disposed on the cathode, transferred through an alignment conveyor and an alignment moving carriage to an alignment cathode pivot, rotated by the alignment cathode pivot, and inserted into a predetermined electrolytic cell.
    Type: Grant
    Filed: January 8, 1997
    Date of Patent: June 9, 1998
    Assignees: Akita Zinc Co., Ltd., Dowa Mining Co., Ltd.
    Inventors: Tomizo Yamada, Rintaro Togashi, Nobumi Ueno, Sukehiro Sutou, Kiyoshi Yamada, Tatsumi Inamura
  • Patent number: 5755935
    Abstract: A processing system to produce printed circuits or other finished materials on a continous strip of substrate comprising a processing cabinet having an entry opening and an exit opening formed on opposite ends thereof, a supply station and a take-up station disposed adjacent the entry opening and the exit opening respectively, a transport mechanism to transport the continuous strip of substrate from the supply station through the entry opening, the processing cabinet and the exit opening to the take-up station and a system control to selectively control the tension and speed of the continuous strip of substrate traveling from the supply station to the take-up station.
    Type: Grant
    Filed: March 7, 1996
    Date of Patent: May 26, 1998
    Inventors: Dale Jackson, Rick Hoving, Vladimir Velitschkouski, Renn Grear, Dan Kostecke
  • Patent number: 5705043
    Abstract: There is disclosed apparatus for selectively electrolytically treating defined regions of a continuously moving conductive workpiece. The apparatus comprises means for conveying the workpiece through an electrolytic treatment zone of the apparatus where it is contacted with a treatment electrolyte; the conveying means affording masking means to mask the workpiece so that electrolyte contacts only the defined regions; the conveying means comprising an endless chain affording indexing means by which the workpiece is located in register with the masking means; means for supplying electrolyte to the masked workpiece; and means for passing a current between the workpiece as one electrode and another electrode; the means for conveying the workpiece comprising two endless chain conveyors made of articulated links of electrically non-conductive material between which the workpiece is held whilst it is passed through the treatment zone.
    Type: Grant
    Filed: June 26, 1996
    Date of Patent: January 6, 1998
    Assignee: Suntec Trading AG
    Inventors: Eric Zwerner, Mariano Aparicio
  • Patent number: 5417828
    Abstract: An electroplating plant for the electrolyte deposition of metals on flat components such as printed circuit boards and the like, oriented parallel to the direction of feed and continuously supplied via a system for the transmission and supply of cathode current to the boards. The apparatus has at least one pair of electrolytic cells. Each of the cells is provided with a feed aperture and the aperture for the outflow of the electrolytic solution supplied continuously by a pump drawing the same from a recovery tank. Each cell is provided with anodes and a passage for regulating the flow the electrolytic solution. Each cell has its outflow aperture located opposite that of another cell in order to provide an empty space through which the board passes; the board to be thus placed in contact with the electrolytic solution.
    Type: Grant
    Filed: November 22, 1993
    Date of Patent: May 23, 1995
    Inventor: Sala Sergio
  • Patent number: 5395508
    Abstract: Apparatus and method for the electrolytic deposition of a metal on a weakly conductive, flexible substrate such as a textile or a paper sheet for the manufacture of flexible heating elements such as heated gloves, heated car seats, panels used in construction for the heating of rooms, etc. Metallic circuits of varying shapes can be formed on the weakly conductive, flexible substrate.
    Type: Grant
    Filed: October 1, 1993
    Date of Patent: March 7, 1995
    Assignee: Commissariat A l'Energie Atomique
    Inventors: Renaud Jolly, Jacques Legrand, Cornelia Petrescu
  • Patent number: 5393395
    Abstract: An apparatus and a method of surface-treating a half sliding bearing, the method comprising the steps of: preparing a tank which accommodates a surface-treatment solution and an anode of an alloy to be applied to the bearings as a surface treatment; successively and one by one introducing the bearings into the surface-treatment solution; performing the surface treatment in such a manner that the surface layer of the alloy is applied to the surface of the bearings by feeding an electricity between a cathode served by the bearing and the anode via the surface-treatment solution while moving, in the surface-treatment solution, the bearings being introduced into the surface-treatment solution in a state in which the bearings is brought into contact with one another; and successively and one by one drawing out the bearings, which have been applied with the surface treatment, from the tank.
    Type: Grant
    Filed: March 24, 1994
    Date of Patent: February 28, 1995
    Assignee: Daido Metal Company, Ltd.
    Inventors: Tadashi Tanaka, Masaaki Sakamoto, Motomu Wada, Takayoshi Sasaki, Masaki Tanimoto
  • Patent number: 5372683
    Abstract: For the electrolytic extraction of metal from a solution containing metal ions and situated in a first cell, metal is cathodically deposited by means of an anode on an electrically conductive endless band immersed partially into the solution, and is redissolved anodically in the electrolyte of an adjacent second cell by partial immersion of the circulating endless band; the metal dissolved in the second cell is again deposited in high purity on a cathode.
    Type: Grant
    Filed: November 25, 1991
    Date of Patent: December 13, 1994
    Assignee: W. C. Heraeus GmbH
    Inventors: Jochen-Werner Kuhn-von Burgsdorff, Ulrich Stroder
  • Patent number: 5223116
    Abstract: For the electrophoretic application of a lacquer onto plate-shaped work pieces, the work pieces are conveyed on a horizontal throughput path through a cell wherein a lacquer deposition bath and at least one electrode are situated. The anodic or cathodic contacting of the traversing work pieces occurs via an endlessly circulating contacting drive preferably formed by a metal band and via a contact element arranged outside the cell for the feed of the anode current or cathode current to the contacting drive. The lacquer deposited on the contacting drive in the cell is in turn removed via a cleaning arrangement outside the cell and, thus, a reliable contacting of the work pieces is guaranteed. The apparatus is particularly suitable for the electrophoretic application of etching resists, plating resists and solder resists onto printed circuit boards.
    Type: Grant
    Filed: May 11, 1992
    Date of Patent: June 29, 1993
    Assignee: Siemens Aktiengesellschaft
    Inventor: Daniel Hosten
  • Patent number: 5131996
    Abstract: An apparatus is provided for surface treating agitable material that includes a conveyor trough for transporting the agitatable material. The trough is at least partially submerged in a treatment bath and it includes at least a first and second shaking chute each having a length along which the material is conveyed. The first and second chutes are disposed at angles from the horizontal such that the conveying direction of the first chute is substantially opposite to the conveying direction of the second chute.
    Type: Grant
    Filed: December 6, 1990
    Date of Patent: July 21, 1992
    Assignee: Siemens Aktiengesellschaft
    Inventors: Siegfried Birkle, Johann Gehring
  • Patent number: 4976840
    Abstract: An electroplating apparatus for plate-shaped workpieces, particularly printed circuit boards which are guided through an electrolytic solution in a horizontal path for the application of metal has a conveying arrangement comprising laterally arranged upper band drives and laterally arranged lower band drives whereby the workpieces are entrained in a friction-actuated fashion between a lower run of the upper band drive and an upper run of the lower band drive. In addition, a sealing wall is arranged between the upper and lower runs of each of the band drives to produce a sealing arrangement for a laterally exposed edge of the workpiece, which is engaged by a contacting mechanism for the cathodic contacting of the workpiece projecting through the band drives.
    Type: Grant
    Filed: August 16, 1989
    Date of Patent: December 11, 1990
    Assignee: Siemens Aktiengesellschaft
    Inventor: Daniel Hosten
  • Patent number: 4911818
    Abstract: The present invention is for an apparatus and method of batch type surface treatment on a car body. The car body is rolled in the bath about the horizontal and longitudinal axis of the car body.
    Type: Grant
    Filed: February 26, 1988
    Date of Patent: March 27, 1990
    Assignee: Honda Giken Kogyo Kabushiki Kaisha
    Inventors: Uhee Kikuchi, Tadashi Takeo, Kiyohiro Ichinose, Goro Uchida, Hirofumi Hara, Hiroshi Arai
  • Patent number: 4906345
    Abstract: Improved apparatus for carrying encapsulated electronic components, having a conveyor belt defined by a horizontal web with a pluraity of identical, flexible tines depending from both sides of the edge of the web. The web is formed into a continuous, endless loop adapted to be carried on a pair of vertical pulleys rotatable on horizontal shafts. Projecting cams, on the face of the web of the belt remote from the dependent tines, engage mating indentations in the periphery of the two pulleys guiding and imparting movement to the belt. The opposing groups of tines are urged apart, by spreader cams, at the beginning and end of the passage of the belt between the lower faces of the two pulleys. Parts to be plated are brought into the space between the tines which, upon exiting from the cams as the conveyor moves entrap the part between them and causing them to move through the plating tanks and treatment stations positioned along the path of the conveyor.
    Type: Grant
    Filed: December 19, 1988
    Date of Patent: March 6, 1990
    Assignee: Future Automation, Inc.
    Inventors: Daniel J. Gramarossa, Frank J. Johnson, Heinz Wo W. Schlenker
  • Patent number: 4904363
    Abstract: A selective electroplating apparatus includes a flexible conveyor belt for receiving contact pins, one portion of each contact pin extending from one side of the conveyor belt and a second portion extending from the opposite side of the conveyor belt. A reel constrains the travel of the conveyor belt into a loop which is defined by a substantially vertical plane, the web of the conveyor belt being oriented in a substantially horizontal alignment and the loop having upper and lower elongated regions. By this structure, the reel causes one portion of the contact pins to be oriented downwardly from the belt in the upper elongated region and another portion of the contact pins to be oriented downwardly from the belt in the lower elongated region.
    Type: Grant
    Filed: April 25, 1989
    Date of Patent: February 27, 1990
    Assignee: Burndy Corporation
    Inventor: Richard J. Comp
  • Patent number: 4898657
    Abstract: An electroplating apparatus, which has the workpieces, such as printed circuit boards, being conducted through an electrolyte solution in a horizontal path, has cathodic contacting by contact clamps, which move with the workpiece through the device. In order to guarantee a reliable supply of cathode current with a low thermal heating and a low wear of the contacts, which are also simultaneously resistant to the corrosion of the conducting parts, a live rail is provided that comprises a core composed of a material of high electrical conductivity, such as copper, and is covered by an envelope composed of a material having a high resistance to corrosion, such as titanium. Contact springs, preferably composed of titanium, are connected to the live rail in a mechanical and electrical conductive fashion, such as by spot welding, and engage each of the contact clamps as they move along the path.
    Type: Grant
    Filed: June 26, 1989
    Date of Patent: February 6, 1990
    Assignee: Siemens Aktiengesellschaft
    Inventor: Daniel Hosten
  • Patent number: 4859298
    Abstract: A process and apparatus is provided to remove protective layers, such as various chromate coatings from metal sheets such as printed circuit boards, copper foils and the like, in a continuous manner while the articles are being conveyed along a predetermined path, by subjecting the same to an electric current, to electrolytically remove the layers.
    Type: Grant
    Filed: December 7, 1988
    Date of Patent: August 22, 1989
    Assignee: Chemcut Corporation
    Inventors: F. Gerhard Senge, Angus A. Watson, Kenneth E. Sanner, Terry R. Corbin
  • Patent number: 4817650
    Abstract: A workpiece carrier for holding workpieces through a plurality of liquid immersion stations including, a framework structure defining an interior space, a self-contained tiltable basket module having article compartments defined therein disposed within the interior space of the frame, a pivot member connecting the basket to the frame at a point offset from the central depth of the basket to cause the basket to normally tilt towards its front, a buoyant tank connected to the basket on the side remote from the a pivot member to tilt the basket towards its rear when the workpiece carrier is immersed in a liquid solution, effectively dissipating any air or gas pockets which might have formed in the hollow areas of the workpiece being treated.
    Type: Grant
    Filed: January 4, 1988
    Date of Patent: April 4, 1989
    Inventor: Herbert Tilton
  • Patent number: 4776939
    Abstract: A device for electroplating electric circuit boards includes an electroplating bath and a plurality of transporting organs which hold objects to be treated when they path the electroplating bath. The transporting organs are pairs of clamping yokes arranged on a common endless rotating belt and positionable from a clamping position in which they engage the object being treated and a release position in which they release said object.
    Type: Grant
    Filed: July 20, 1987
    Date of Patent: October 11, 1988
    Assignee: Schering Aktiengesellschaft
    Inventors: Horst Blasing, Thomas Kosikowski, Ludwig Mankut, Walter Meyer
  • Patent number: 4775046
    Abstract: An improved transport belt is provided for gripping and carrying parts such as thin and fragile electronic components through production processes including, for example, electroplating steps and the like. The transport belt comprises an elongated upright web carrying a succession of depending gripper units, each including first and second fingers for gripping and carrying the production parts. The first finger is formed generally coplanar with the belt web, whereas the second finger has a generally U-shaped configuration with depending legs on the leading and trailing sides, respectively, of the first finger. The legs are deformed laterally from the plane of the belt web and interconnected at their lower ends by a cross bar which is urged by the legs into spring-loaded contact with the lower end or tip of the first finger.
    Type: Grant
    Filed: January 17, 1986
    Date of Patent: October 4, 1988
    Assignee: Future Automation, Inc.
    Inventors: Daniel J. Gramarossa, Earl G. Baer
  • Patent number: 4755271
    Abstract: An apparatus for electroplating plate-shaped workpieces, such as a printed circuit board, having a cell, an arrangement for conducting the workpiece through the cell, and anodes arranged in the cell in contact with the electrolyte solution characterized by an arrangement to cathodically connect the workpiece including at least one tong-shaped contact clamp for gripping the workpiece and arrangement for moving the clamp along with the workpiece, as is conveyed through the cell. Preferably, the arrangement for moving is an endless drive of a continuous member, such as a chain or a plurality of belts, and a plurality of contact clamps are spaced along this member to grip the edge portion of the workpieces.
    Type: Grant
    Filed: June 1, 1987
    Date of Patent: July 5, 1988
    Assignee: Siemens Aktiengesellschaft
    Inventor: Daniel Hosten
  • Patent number: 4752172
    Abstract: The apparatus of the invention provides a coat of lacquer or varnish on a tear-off cover, which is formed from a thin ferromagnetic metal, has a circumferential supporting lip and is equipped with a tear-off opening made by scoring and/or punching in or out the cover surface. To provide the coat of lacquer or varnish the cover is moved through an electric coating tank, a washing tank and drying zone with the plane of the cover oriented substantially vertically while being supported exclusively on the surface of the inner wall of the supporting lip. The entire surface of the cover is completely covered by the lacquer or varnish coating except for a small portion on the inner wall of the supporting lip which is positioned inside the closed container in a folded seam and/or covered by a sealing material.
    Type: Grant
    Filed: August 14, 1987
    Date of Patent: June 21, 1988
    Assignee: Schmalbach-Lubeca AG
    Inventor: Georg Bolte