Abstract: An objective of the present invention is to prevent a prewetting liquid from remaining in an edge portion of a substrate. A plating method for subjecting a substrate to a plating treatment is provided, the substrate including a part to be plated that is exposed to a plating solution and an edge portion that is an outer region of the part to be plated. The plating method includes a first sealing step of bringing a first seal body into contact with the substrate to seal the edge portion of the substrate, a prewetting step of subjecting the sealed substrate to a prewetting treatment, a first seal removing step of removing the first seal body from the prewetted substrate, a substrate holding step of holding the substrate with a substrate holder including a second seal body, and a plating step of applying the plating solution to the substrate held by the substrate holder.

Abstract: A method creating a patterned film with cuprous oxide and light comprising the steps of electrodepositing copper from a solution onto a substrate; illuminating selected areas of said deposited copper with light having photon energies above the band gap energy of 2.0 eV to create selected illuminated sections and non-illuminated sections; and stripping non-illuminated sections leaving said illuminated sections on the substrate. An additional step may include galvanically replacing the copper with one or more noble metals.

Abstract: A method includes electroplate depositing a first metal layer to a first thickness on a metal seed layer, rinsing the first metal layer with deionized water, and after the first rinse process, drying the wafer. The method also includes performing one or more additional electroplating processes that respectively deposit an additional metal layer to a second thickness over the first metal layer, performing an additional rinse process that rinses the additional metal layer with deionized water, and performing an additional drying processes that dries the wafer.

Abstract: A method for removing a coating including a rare earth silicate from a substrate including a ceramic or ceramic matrix composite may include contacting a coating comprising a rare earth silicate with a liquid comprising an active species. The active species may include at least one of a mineral acid or a base. The method also may include working the coating to cause removal of at least a portion of the coating.

Abstract: Safe anode for electrochemical cells, of the type of vertical anodes constituted of a hanging structure based on a first horizontal bar, second vertical distribution bars defined by a copper or aluminum core with a titanium exterior layer, and coated or uncoated titanium anode plates attached to the second distribution bars, on both sides, such that the safe anode incorporates an adapter element that comprises, at least, one current limiter assembly, arranged between, at least, one of the second vertical distribution bars, and, at least, one coated or uncoated titanium anode plate, connecting the vertical distribution bar to the coated or uncoated titanium anode plate.

Abstract: An electrolysis mechanism for deployment in a reservoir of water, the electrolysis system having at least one rotating cathode mounted on an axle and configured to rotate during an electrolysis process, at least one stationary cathode cleaning element deployed so as to contact a face of the rotating cathode such that during the electrolysis process as the rotating cathode, rotates scale buildup on the rotating cathode is removed and at least one stationary anode deployed adjacent to the rotating cathode. A preferred embodiment of which includes a plurality of spaced apart rotating cathodes; a plurality of stationary cathode cleaning elements with one stationary cathode cleaning element deployed in each space between the rotating cathodes so as to contact a face of each of the rotating cathodes it is deployed between; and a plurality of stationary anodes such that at least one of stationary anode is deployed in each of the spaces between the rotating cathodes.

Abstract: A nitrogen blanket system for small fuel tanks is disclosed that includes tank empty-space pressure control for sealed tanks that can hold pressure. The system includes a fuel tank storing some volume of fuel, such as diesel fuel. The remaining empty volume is filled with nitrogen by the disclosed system. The nitrogen blankets the liquid fuel and fills the remaining space in the fuel tank to prevent the accumulation of moisture and thereby prevent corrosion within the fuel tank.

Abstract: Disclosed are pre-wetting apparatus designs and methods. These apparatus designs and methods are used to pre-wet a wafer prior to plating a metal on the surface of the wafer. Disclosed compositions of the pre-wetting fluid prevent corrosion of a seed layer on the wafer and also improve the filling rates of features on the wafer.

Abstract: A process of chemical electro-marking includes the operation of placing the metal surface to be decorated in a position of application in which there is a silk screen, an electrode with a suitable pad soaked with etching solution, interposed between the electrode and the metal surface to be treated with the decoration, drawing or writing; and includes a phase of preliminary application of the negative shape of the decoration, drawing or writing by means of a chemical product of protection of the metal surface being treated, on the metal surface itself and resistant to the action of electrochemical etching of the marking; the action of decoration by chemical electro-marking is performed by applying the silk screen which has no masking and is resistant to the etching action of the chemical solution used, for the specific metal of the treated surface; the motion of the electrode with said pad, driven to slide on the surface of the silk screen, as known in the art, therefore, does not act mechanically on the mask

Abstract: Embodiments of an integrated platform for fabricating n-type metal oxide semiconductor (NMOS) devices are provided herein. In some embodiments, an integrated platform for fabricating n-type metal oxide semiconductor (NMOS) devices may include a first deposition chamber configured to deposit a first layer atop the substrate, the first layer comprising titanium oxide (TiO2) or selenium (Se); a second deposition chamber configured to deposit a second layer atop the first layer, the second layer comprising titanium; a third deposition chamber configured to deposit a third layer atop the second layer, the third layer comprising one of titanium nitride (TiN) or tungsten nitride (WN).

Abstract: Method and apparatus for reducing metal oxide surfaces to modified metal surfaces are disclosed. By exposing a metal oxide surface to a remote plasma, the metal oxide surface on a substrate can be reduced to pure metal and the metal reflowed. A remote plasma apparatus can treat the metal oxide surface as well as cool, load/unload, and move the substrate within a single standalone apparatus. The remote plasma apparatus includes a processing chamber and a controller configured to provide a substrate having a metal seed layer in a processing chamber, form a remote plasma of a reducing gas species where the remote plasma includes radicals, ions, and/or ultraviolet (UV) radiation from the reducing gas species, and expose a metal seed layer of the substrate to the remote plasma to reduce oxide of the metal seed layer to metal and to reflow the metal.

Abstract: A plating pretreatment apparatus for a multi-cylinder block includes a plurality of cylinders that performs a plating pretreatment of a cylinder inner wall surface of each of the cylinders using an electrode disposed so as to oppose to the cylinder inner wall surface by sealing one end of the cylinder inner wall surface and introducing a treatment liquid to the cylinder inner wall surface. In such plating pretreatment apparatus, at least one of a power supply device that supplies electricity to the cylinder block and the electrode and a liquid feed pump that feeds the treatment liquid into a gap between the cylinder inner wall surface and the electrode is provided for each of the cylinders.

Abstract: Methods, apparatus, and systems for depositing copper and other metals are provided. In some implementations, a wafer substrate is provided to an apparatus. The wafer substrate has a surface with field regions and a feature. A copper layer is plated onto the surface of the wafer substrate. The copper layer is annealed to redistribute copper from regions of the wafer substrate to the feature. Implementations of the disclosed methods, apparatus, and systems allow for void-free bottom-up fill of features in a wafer substrate.

Abstract: Methods and apparatuses for electrolysis that does not require the use of a transformer to operate. The apparatus comprises one or more electrolytic cells which comprise the number of intermediate electrodes sufficient to enable the cell or cells to operate at the rectified line voltage without any need for voltage regulation, or near the rectified line voltage with only some voltage regulation, such as less than 20% of the rectified line voltage. Such regulation is achieved by using a buck or boost converter rather than a transformer, and can be varied to accommodate fluctuations in the line voltage and/or conductivity of the electrolyte, or varied to produce different chemistries in the same apparatus.

Abstract: An electroless plating system includes a plating solution, and controlling reducing agents in the plating solution for deposition over outlier features smaller than about five hundred nanometers and isolated by about one thousand nanometers.

Abstract: The present invention relates to a reaction vessel for producing a capacitor element, which is used for forming a semiconductor layer by means of energization on two or more electric conductors each having formed on the surface thereof a dielectric layer simultaneously, by immersing the electric conductors into an electrolyte in the reaction vessel, the vessel comprising two or more negative electrode plates corresponding to the individual electric conductors and two or more constant current sources electrically connected to each of the negative electrode plates; production method for a group of capacitor elements using the reaction vessel and a capacitor using the capacitor element. According to the present invention, a large number of capacitors which each uses a semiconductor layer as one part electrode with a narrow appearance capacitance distribution can be obtained simultaneously.

Abstract: An electrorefiner system according to a non-limiting embodiment of the present invention may include a vessel configured to maintain a molten salt electrolyte and configured to receive a plurality of alternately arranged cathode and anode assemblies. The anode assemblies are configured to hold an impure nuclear feed material. Upon application of the power system, the impure nuclear feed material is anodically dissolved and a purified metal is deposited on the cathode rods of the cathode assemblies. A scraper is configured to dislodge the purified metal deposited on the cathode rods. A conveyor system is disposed at a bottom of the vessel and configured to remove the dislodged purified metal from the vessel.

Abstract: An apparatus for large-scale production of graphene and graphene oxide is provided. The apparatus includes a first electrode, a second electrode, an electrobath, a power supply, and a module for filtering and separating the graphene products. Large amounts of graphene and graphene oxide can be produced rapidly using electrochemical exfoliation. High-quality graphene and graphene oxide can be produced under the room temperature in a simple and cost-effective way.

Abstract: A system including nanostructure arrays for converting carbon dioxide to an organic compound, e.g., methanol, which does so, for example, without any external electric energy. In one embodiment, the system for converting carbon dioxide to an organic compound includes an array of nanotubes, which include nanoparticles of an electron mediator, e.g. palladium, dispersed on a surface of the nanotubes, and an electrically conductive fluid. The array of nanotubes is at least partially immersed in the electrically conductive fluid. The system further includes a light source that irradiates the array of nanotubes, a source of carbon dioxide, and an inlet for delivering the carbon dioxide to the electrically conductive fluid whereat at least a portion of the carbon dioxide is converted to a different organic compound, such as methanol, via contact with an irradiated array of nanotubes. In one example, the array is an ordered array of titania nanotubes.

Abstract: A machining system is provided and includes a machining tool comprising a spindle, one or more electrodes configured to perform the electromachining, and one or more tool holding elements configure to conductively hold the respective one or more electrodes and be assembled onto the spindle of the machining tool. The machining system further comprises one or more adapters and one or more power sources configured to electrically connect to the respective one or more adapters and the workpiece. The one or more adapters are configured to conductively contact the respective one or more tool holding elements. Further, the machining system comprises one or more machining solution sources provided to pass one or more machining solutions between the workpiece and the respective one or more electrodes. A tool adapter assembly is also presented.

Abstract: The invention relates to a method for treating surfaces of hollow parts, this method being a conversion treatment such as an anodizing, and to a method according to which the hollow pieces are completely immersed inside at least one treatment tank containing a liquid, characterized in that each hollow piece is immersed while making it execute at least one rotational movement so that air bubbles likely to be created inside the tank are removed from the inner wall of the hollow part.

Abstract: Methods, apparatus, and systems for depositing copper and other metals are provided. In some implementations, a wafer substrate is provided to an apparatus. The wafer substrate has a surface with field regions and a feature. A copper layer is plated onto the surface of the wafer substrate. The copper layer is annealed to redistribute copper from regions of the wafer substrate to the feature. Implementations of the disclosed methods, apparatus, and systems allow for void-free bottom-up fill of features in a wafer substrate.

Abstract: The subject matter is directed to electrical contacting of band- or plate-shaped materials (1), which are conveyed by transport track through an electroplating system. The cathodically polarized contact means (6) may be located on the underside of the material (1) in the electrolyte (12) circulated in the electroplating system. The material is electrically contacted to transfer current to the material (1). Each tubular contact means (6) is cooled by means of a cooling unit or a cooling medium. No metal is deposited on the cooled surface of the contact means (6) if the temperature difference between the working temperature of the electrolyte (12) and the surface temperature of the contact means (6) is sufficiently large. This property can be supplemented with a surface of the contact means (6) that cannot be cathodically metal-coated in the electrolyte (12) used.

Abstract: A salt water chlorinator (30) for a swimming pool includes an electrolysis cell having two anodes (98) and a cathode (94). Two scrapers (102), each of which is of titanium and includes scraping portions in the form of ribs (106) in contact with the opposite surfaces of the cathode, are reciprocated relative to the cathode (94) to remove scale deposits from the cathode (94). The scrapers (102) are mounted in a frame (110) and their scraping ribs (106) are curved such that the ribs (106) are self-biased against the cathode surfaces. A mechanism for reciprocating the scrapers (102) includes two solenoid coils (116) which act on cores (114) in a stem (112) of the frame (110). A control circuit for the electrolysis cell is contained in a housing (86) which is attached to a housing (82) for the electrolysis cell. The control circuit includes a flow sensor for sensing salt-water flow through the electrolysis cell.

Abstract: The present invention relates to the treatment of wastewater by electrochemical reactions. More particularly, an Electro-Reaction Unit (ERU) is disclosed. The ERU is provided with at least one electrolytic cell comprising a pair of self-cleaned electrodes for purifying wastewater. Along with electro-reactions, electrodes of the ERU are submitted to passivation, i.e. coverage with an oxide layer. The present invention provides a solution for alleviating passivation with a self-cleaning system comprising hard elements, confined in a cage and movable therein, for bombardment of the electrodes and rupture of the oxide layer. The present invention further provides a related process.

Abstract: A plating apparatus and method for plating a surface of a substrate are described. Generally, the apparatus includes a double wall plating vessel having an inner cup and an outer cup peripherally surrounding and spaced apart from the inner cup. The inner cup has an inlet for receiving a plating solution and an outlet from which the plating solution overflows into a plenum defined between the inner and outer cups.

Abstract: Apparatus for dissociating water into hydrogen and oxygen, comprising a tank and the quantity of water contained in said tank is dissolved. A quantity of a conductivity promoting material suspended or dissolved in said water to form an electrically conductive fluid and a plurality of plates suspended in said electrically conductive fluid and a reactive agent selected from the group consisting of derivatives of vegetable materials, derivatives of highly resinous vegetable materials, derivatives of vegetable materials taken from pinyon pine, derivatives of vegetable materials taken from dragon blood tree, water soluble derivatives of partially oxidized vegetable materials, water soluble derivatives of partially oxidized highly resinous vegetable materials, water soluble derivatives of partially oxidized vegetable materials taken from pinyon pine, and water soluble derivatives of partially oxidized vegetable materials taken from dragon blood tree.

Abstract: A method and device for charging a metal hydride hydrogen store (13) is described. It comprises generating gaseous hydrogen in an electrolyser (1), transporting the gaseous hydrogen to the metal hydride store and feeding the metal hydride store with the hydrogen. For having the hydrogen free of water contamination, the gaseous hydrogen is first transported under a first pressure of at least 1 MPa which pressure is then reduced by a pressure adjusting means (11) to a second, designated pressure lower to the first pressure, the second pressure being the feeding pressure to the metal hydride store. FIG. 1.

Abstract: The invention relates to an amalgam decomposer for mercury cathode chlor-alkali cells. The amalgam decomposer of the invention contains a filling of carbon steel rings whose external surface is provided with a catalytic coating for amalgam decomposition consisting of one or more electrically conductive metals carbides. The internal surface of the rings is free of catalytic coating and wettable by the amalgam, while the external carbide catalytic coating is not wettable by the amalgam thereby favoring hydrogen evolution.

Abstract: A method of cleaning one or more electrodes (30) of an electrolytic chlorinator (10). The electrodes are immersed in water within a chamber (120). The method includes the steps of substantially stopping water flow through the chamber; supplying a volume of cleaning agent into the chamber; and agitating the water and the cleaning agent within the chamber to form a cleaning agent water mixture and to bring the cleaning agent water mixture into intimate contact with the one or more electrodes thereby cleaning the electrodes. According to preferred forms of the method, the agitation step includes activating the electrodes to liberate hydrogen and oxygen bubbles.

Abstract: An electrolytic treatment apparatus according to one aspect of the subject matter includes: a transportation device configured to transport a metal plate; an electrolytic bath configured to store an acidic electrolytic solution, wherein the metal plate is transported inside the electrolytic bath; a current supplying device configured to supply an alternating waveform current to continuously subject a surface of the metal plate to an alternating current electrolytic treatment with the alternating waveform current; and a hydroxide ion-adding device installed in an inlet of the electrolytic bath through which the metal plate is introduced into the electrolytic bath, the hydroxide ion-adding device configured to add hydroxide ions (OH?) on a surface of the metal plate before the surface of the metal plate is subjected to the alternating current electrolytic treatment.

Abstract: A method is disclosed which includes applying a surface treatment to a substrate to form a patterned area having at least some electrical conductivity; electroplating onto the patterned area with a tool having a first electrode and a source for in situ supply of electrolyte, by providing an anode current to the first electrode, causing the patterned area at least in the vicinity of the tool to function as a cathode, and passing electrolyte between the patterned area and the first electrode, thereby to deposit conductive material onto the patterned area.

Abstract: A galvanization system comprising an alkaline galvanization bath, a positive electrode, and a negative electrode is provided. The alkaline galvanization bath comprises galvanizing solution including about 7 to about 60 g/l of Zn, about 70 to about 200 g/l of alkali hydroxide and about 0.01 to about 5 g/l of additives. The positive electrode is insoluble in the galvanizing solution, having an opposed surface to an object which is supposed to be set in the alkaline galvanization bath and galvanized. The opposed surface of the positive electrode is formed in a rectangular pattern having a side equal to or less than 30 mm or in a circular pattern having a diameter equal to or less than 30 mm. The galvanization system can produce a galvanization membrane of excellent appearance.

Abstract: The disclosed subject matter provides systems and methods for etching and/or metal plating of substrate materials. An exemplary method in accordance with the disclosed subject matter for metal-plating or etching a substrate includes submerging portions of the substrate in a first bath of chemical solution, performing in-situ laser ablation of the substrate to achieve an immersion plated pattern with a first cation, plating-up the immersion plated pattern with the first cation in the first bath, and plating-up the immersion plated pattern with a second cation in a second bath. The same or another exemplary method can utilize a reel-to-reel system. The plating-up can begin after patterning by immersion plating is complete. Further, a single plating pattern can be used to define a pattern and the same bath can be used to plate the immersion pattern, thereby achieving a uniform thickness of the pattern.

Abstract: A method and apparatus measures the presence of total residual oxidant species in aqueous environments. More specifically, the apparatus is operable to measure hypohalites (e.g., hypochlorite and hypobromite) in water containing halide salts using electrochemistry. The apparatus can be a sensor having four electrodes—a reference electrode, a working electrode, and two auxiliary electrodes. The fourth electrode, i.e., the second auxiliary electrode, can be used to generate ionized water near and in contact with the working electrode. The ionized water can clean the working electrode to minimize effects due to scaling or biofilm formation. As such, the working electrode does not need the capability to clean itself. Thus, other elements, originally believed to be unsuitable for use in saline aqueous environments, can be used for the electrodes, for example, gold.

Abstract: Electrochemical plating (ECP) apparatuses with auxiliary cathodes to create uniform electric flux density. An ECP apparatus for electrochemical deposition includes an electrochemical cell with an electrolyte bath for electrochemically depositing a metal on a substrate. A main cathode and an anode are disposed in the electrolyte bath to provide a main electrical field. A substrate holder assembly holds a semiconductor wafer connecting the cathode. An auxiliary cathode is disposed outside the electrochemical cell to provide an auxiliary electrical field such that a flux line density at the center region of the substrate holder assembly substantially equals that at the circumference of the substrate holder assembly.

Abstract: An immersion treatment method with which a vehicle body horizontally immersed in liquid is taken out in a tilted position. The vehicle body is taken out of the liquid at high speed in a tilted position. Foreign matter is separated from the vehicle body and removed together with the liquid.

Abstract: An apparatus for the electrolytic treatment of the product L using a treatment agent is used to make the treatment of a plate-shaped product more uniform. This apparatus includes: devices for retaining 40, 42 the product L in the apparatus, one or a plurality of flow devices 10, which each include at least one nozzle 15 and are disposed situated opposite the product L, one or a plurality of counter electrodes 30, which are inert relative to the treatment agent and are disposed parallel to at least one treatment surface, means for generating a relative movement 44 between the product L, on the side, and the flow devices 10 and/or the counter electrodes 30, on the other side, in at least one direction parallel to a treatment surface. The product L can be immersed into the treatment agent during the treatment.

Abstract: A method for producing a laminated ceramic capacitor allows a surface of at least a portion of a ceramic element body chip to be brought into contact with a plated layer formed in advance in a mold member, and performs heat processing on the ceramic element body chip in that contact state, thereby to form an external conductor layer made of the plated layer on the surface of at least the portion of the ceramic element body chip. Thus, a method and an apparatus for producing a ceramic electronic component accurately and precisely controls the thickness of the external conductor layer to be small, and easily controls the length of the external conductor layer.

Abstract: This invention relates generally to a method and apparatus for electroplating selected portions of elongate and generally cylindrical metallic articles pre assembled and held in spaced-apart fashion into a nonconductive support member encircled by a metallic tube like member one portion of article extending from one side of support member with the opposing portion of article extending from the opposing end of support member including a locating device to receive the articles so the portion of the articles to be electroplated extends downwardly. At least one plating cell is provided adjacent the lower region for contacting the downwardly extending portion of the articles with plating liquid whereas the plating liquid is ejected towards the articles including at least one conducting device for electric current is provided adjacent to the upper region for engaging with the portion of article extending upwardly whereas the electric current is being distributed to articles evenly and complete.

Abstract: An electrolytic cell comprising an electrolysis vessel for receiving a liquid electrolyte that fills the vessel to a predetermined level, electrodes for passing an electric current through the electrolyte, a vent for allowing gases produced by the electrolytic process to leave the vessel and an air inlet means located substantially adjacent to the predetermined level for directing air into the vessel at a predetermined rate.

Abstract: An apparatus for the light-supported precipitation of an electrolyte on a semiconductor component comprises a plating bath with an electrolyte, a first electrode arranged in the plating bath and a second electrode arranged outside the plating bath, a holding device for the semiconductor component and an irradiation device for irradiating the semiconductor component with electromagnetic radiation, the irradiation device being arranged outside the plating bath.

Abstract: A plating pretreatment apparatus for a multi-cylinder block includes a plurality of cylinders that performs a plating pretreatment of a cylinder inner wall surface of each of the cylinders using an electrode disposed so as to oppose to the cylinder inner wall surface by sealing one end of the cylinder inner wall surface and introducing a treatment liquid to the cylinder inner wall surface. In such plating pretreatment apparatus, at least one of a power supply device that supplies electricity to the cylinder block and the electrode and a liquid feed pump that feeds the treatment liquid into a gap between the cylinder inner wall surface and the electrode is provided for each of the cylinders.

Abstract: The present electrolytic system for decontaminating a contaminant disposed on a substrate includes means for providing a brine solution; means for providing a pair of electrodes interposed by a permeable membrane to create a first channel and a second channel; means for flowing the brine solution through the first and second channel; means for applying a potential to the pair of electrodes to produce a first ionized decontamination solution in the first channel and a second ionized decontamination solution in the second channel; means for applying one of the first ionized decontamination solution and the second decontamination solution to the contaminant; and means for recovering the at least one of the first ionized decontamination solution and the second ionized decontamination solution and the contaminant from the substrate.

Abstract: The invention relates to a device and a method of applying a coating on a workpiece by electrodeposition. A vessel is provided that is suitable for filling with a bath of electrolyte, anode-forming conductor means being placed in the vessel and connected to a current generator, a cathode-forming workpiece mounted on the mandrel of a lathe, and guidance and movement means for guiding and moving the vessel relative to the lathe, the guidance and movement means enabling the workpiece to be immersed in full or in part in the bath of electrolyte.

Abstract: An electrolytic processing apparatus which, while eliminating a CMP processing entirely or reducing a load on a CMP processing to the least possible extent, can process and flatten a conductive material formed in the surface of a substrate, or can remove (clean) extraneous matter adhering to the surface of a workpiece such as a substrate. The present invention includes an electrode section including a plurality of electrode members disposed in parallel, each electrode member including an electrode and an ion exchanger covering the surface of the electrode, a holder for holding a workpiece, which is capable of bringing the workpiece close to or into contact with the ion exchanger of the electrode member, and a power source to be connected to the electrode of each electrode member of the electrode section. The ion exchanger of the electrode member includes an ion exchanger having an excellent surface smoothness and an ion exchanger having a large ion exchange capacity.

Abstract: A method and apparatus are provided for performing electrolysis with an electrolysis cell. The cell includes an anode electrode and a cathode electrode. At least one of the anode electrode or the cathode electrode is at least partially formed of conductive polymer.

Abstract: A method and apparatus for a copper electroplating procedure, wherein a first additive is preferentially adsorbed onto the field region of a substrate and a second additive is preferentially adsorbed onto the surfaces of at least one recessed region of the substrate, is provided. The first additive is more resistive to the electrodeposition relative to the second additive such that the recessed regions are filled at a faster rate than a layer is deposited on the field region.

Abstract: The invention relates to an amalgam decomposer for mercury cathode chlor-alkali cells. The amalgam decomposer of the invention contains a filling of carbon steel rings whose external surface is provided with a catalytic coating for amalgam decomposition consisting of one or more electrically conductive metals carbides. The internal surface of the rings is free of catalytic coating and wettable by the amalgam, while the external carbide catalytic coating is not wettable by the amalgam thereby favouring hydrogen evolution.

Abstract: A plating assembly for use in plating metallic materials onto a surface of a substrate is provided. The plating assembly comprising a delivery unit having a fluid chamber, a metallic source, and a porous insert. The plating assembly also comprising a receiving unit having a fluid chamber and a metallic receiver. The receiving unit also has a porous insert. The porous insert of the delivery unit being substantially aligned with, and spaced apart from, the porous insert of the receiving unit. The metallic receiver being substantially aligned with the porous insert of the delivery unit and a path being defined between the delivery unit and the receiving unit. Wherein a plating meniscus is capable of being defined in the path between the porous inserts of the delivery unit and the receiving unit and a substrate is capable of being moved through the plating meniscus to enable the plating of metallic materials onto the surface of the substrate. Examples for de-plating are also provided.