Abstract: A coating device for coating components, in particular for nickel-plating spark plug housings. The coating device includes: a housing having an outer anode that is designed to receive the component, an inner anode that can be introduced into a through-opening of the component, and a voltage-generating device, the voltage-generating device being designed to generate a first voltage between the outer anode and the component, as well as a second voltage between the inner anode and the component. The housing has an inlet and an outlet for introducing and discharging a process medium into or out of the housing.

Abstract: A system, comprising: a chlorine source in form of an electrolysis unit to generate an in-situ generated active chlorine; wherein a concentration of perchlorate is not more than half of a concentration of chlorate; and pH of a fluid containing in-situ generated active chlorine is more than 7.4; a buffer tank to store a concentrate of in-situ generated active chlorine as a free available chlorine (FAC); a fluid distribution system to supply FAC in form of an in-use fluid to the cabinet; wherein the system is configured to clean and disinfect an article with the fluid while complying with national and international standards for food safety, operator's safety and regulatory requirements regarding the use of biocides.

Abstract: A power control device supplies electrolysis voltage and electrolysis current, based on input direct-current power, to an electrolytic cell for manufacturing electrolysis water by electrolysis on a raw material solution by means of electric current applied between an anode and a cathode.

Abstract: The present disclosure relates to a sterilized water creating cartridge having an inlet and an outlet in one direction for producing sterilized water by underwater-discharging water supplied from an inlet and discharging the sterilizes water to an outlet, the cartridge including a sterilized water producing unit including a negative electrode plate having an electrode connector for underwater-discharging the water, and a positive electrode plate, and a case accommodating the sterilized water producing unit thereinside, formed with an electrode connector through hole passing the electrode connector, and having an inlet and an outlet on a surface of one direction toward both sides of the sterilized water producing unit.

Abstract: Prior to electrodeposition, a semiconductor wafer having one or more recessed features, such as through silicon vias (TSVs), is pretreated by contacting the wafer with a pre-wetting liquid comprising a buffer (such as a borate buffer) and having a pH of between about 7 and about 13. This pre-treatment is particularly useful for wafers having acid-sensitive nickel-containing seed layers, such as NiB and NiP. The pre-wetting liquid is preferably degassed prior to contact with the wafer substrate. The pretreatment is preferably performed under subatmospheric pressure to prevent bubble formation within the recessed features. After the wafer is pretreated, a metal, such as copper, is electrodeposited from an acidic electroplating solution to fill the recessed features on the wafer. The described pretreatment minimizes corrosion of seed layer during electroplating and reduces plating defects.

Abstract: An electrolytic cell includes at least one free-standing diamond electrode and a second electrode, which may also be a free-standing diamond, separated by a membrane. The electrolytic cell is capable of conducting sustained current flows at current densities of at least about 1 ampere per square centimeter. A method of operating an electrolytic cell having two diamond electrodes includes alternately reversing the polarity of the voltage across the electrodes.

Abstract: An electrolytic treatment method and electrolytic treatment device are provided for electrolytic treatment of an aluminum web W by applying an alternating current to an upstream electrode and a downstream electrode disposed along a conveying direction a. At least one of a conveying velocity v of the aluminum web W, a frequency f of alternating current applied at the upstream electrode and the downstream electrode, and/or a web conveying direction separation distance d2 between the upstream electrode and the downstream electrode are set such that the alternating current and voltage waveform applied to the aluminum web W at the far end of the upstream electrode and the alternating current and voltage waveform applied to the aluminum web W at the near end of the downstream electrode do not reinforce each other.

Abstract: The embodiments herein relate to methods and apparatus for filling features with copper by a bottom-up fill mechanism without the use of organic plating additives. In some cases, filling occurs directly on a semi-noble metal layer, without the deposition of a copper seed layer. In other cases, the filling occurs on a copper seed layer. Factors such as the polarization of electrolyte, the use of a complexing agent, electrolyte pH, electrolyte temperature, and the waveform used to deposit material may contribute to promoting the bottom-up fill.

Abstract: A water electrolysis system includes a high-pressure hydrogen production unit for electrolyzing water to generate oxygen and high-pressure hydrogen (the pressure of the high-pressure hydrogen being higher than that of the oxygen), and a gas-liquid separation unit for removing water contained in the high-pressure hydrogen. The gas-liquid separation unit is placed on a hydrogen pipe for discharging the high-pressure hydrogen from the high-pressure hydrogen production unit. In addition, the water electrolysis system includes a high-pressure hydrogen supply pipe for transferring dewatered high-pressure hydrogen from the gas-liquid separation unit, a cooling unit, which is placed on the high-pressure hydrogen supply pipe and is capable of variably controlling the temperature of the high-pressure hydrogen to adjust the humidity of the high-pressure hydrogen, and a control unit.

Abstract: Disclosed is a device designed for a continuous production of graphene flakes by an electrochemical method. The device consists of an electrochemical unit for generating graphene flakes by an electrochemical exfoliation; a filtration unit for separating the graphene flakes from an electrolyte solution; a guiding path connected to the electrochemical unit and transports the graphene flakes and the electrolyte solution into the filtration unit; a grading collection unit for accepting the separated graphene flakes from the filtration unit and separating the graphene flakes by size. The device can achieve the effect of producing high-quality graphene flakes in mass production electrochemically, continuously and quickly.

Abstract: There are provided an apparatus for water treatment using capacitive deionization and a method for controlling the same. The apparatus for water treatment using capacitive deionization includes a first filter unit and a second filter unit allowing dissolved solids included in an introduced fluid to be adsorbed on electrodes to generate purified water when a water purification voltage is applied to the electrodes, and allowing the dissolved solids adsorbed on the electrodes to be desorbed to generate regenerated water when a regeneration voltage is applied to the electrodes, respectively, and a controller iteratively alternatively applying the water purification voltage and the regeneration voltage to the first filter unit and the second filter unit to generate purified water having a pre-set target total dissolved solids (TDS) value.

Abstract: An Apparatus that generates onsite three antimicrobial solutions by electrolyzing a dilute brine solution. At least one of the generated solutions can be used to dissolve protein, emulsify oils and fats making it an effective general purpose cleaner. A second solution can be used as a non-corrosive, fast active general purpose sanitizer and a third solution can be used as a high level disinfectant, capable of killing all microorganism, including MRSA (methicillin resistant staphylococcus aureaus), C. diff (clostridium difficle), VRE (vancomycin resistant enterococci) and acinetobactor baumannii. The onsite generated antimicrobial solutions reduce the occurrence of infectious diseases in hospitals, other human or animal health care settings, cruise-ships, hotels and other facilities whereas there is a higher risk of spreading infectious diseases.

Abstract: Provided are electrochemical devices that are rechargeable, where the regeneration techniques are based on a batchwise application of current or current density to the cells, where there are a service mode where no current or current density is applied and a recharge mode where a current or current density is applied. Electrochemical and EDI systems according to the embodiments herein are suitable for deionization and/or purification of typical municipal tap quality water in applications where demand for purified, low-TDS water is intermittent. Such operations avoid the use of chemical additions for regeneration purposes. In addition the cells provided herein are amenable to small footprints for consumer and commercial applications such as: dishwashers, washing machines, coffee and espresso makers, ice makers, steam tables, car wash water sources, and steamers.

Abstract: Methods and apparatus are provided for planar metal plating on a workpiece having a surface with recessed regions and exposed surface regions; comprising the steps of: causing a plating accelerator to become attached to said surface including the recessed and exposed surface regions; selectively removing the plating accelerator from the exposed surface regions without performing substantial metal plating on the surface; and after removal of plating accelerator is at least partially complete, plating metal onto the surface, whereby the plating accelerator remaining attached to the surface increases the rate of metal plating in the recessed regions relative to the rate of metal plating in the exposed surface regions.

Abstract: A method of treating a copper containing structure on a substrate is disclosed. The method includes electrodepositing the copper containing structure on a substrate, annealing the copper containing structure, and forming an interface between a pad of the copper containing structure and a solder structure after anneal. The interface can have improved resistance to interfacial voiding. The copper containing structure is configured to deliver current between one or more ports and one or more solder structures in the integrated circuit package. Annealing the copper containing structure can move impurities and vacancies to the surface of the copper containing structure for subsequent removal.

Abstract: Disclosed is a device designed for a continuous production of graphene flakes by an electrochemical method. The device consists of an electrochemical unit for generating graphene flakes by an electrochemical exfoliation; a filtration unit for separating the graphene flakes from an electrolyte solution; a guiding path connected to the electrochemical unit and transports the graphene flakes and the electrolyte solution into the filtration unit; a grading collection unit for accepting the separated graphene flakes from the filtration unit and separating the graphene flakes by size. The device can achieve the effect of producing high-quality graphene flakes in mass production electrochemically, continuously and quickly.

Abstract: An apparatus for electroplating a layer of metal onto the surface of a wafer includes an auxiliary electrode that is configured to function both as an auxiliary cathode and an auxiliary anode during the course of electroplating. The apparatus further includes an ionic current collimator (e.g., a focus ring) configured to direct ionic current from the main anode to central portions of the wafer. The provided configuration effectively redistributes ionic current in the plating system allowing plating of uniform metal layers and mitigating the terminal effect. In one example, the auxiliary electrode functions as an auxiliary cathode in the beginning of electroplating when the terminal effect is pronounced, and subsequently is anodically biased.

Abstract: Methods and apparatus for processing a substrate in a process chamber, include receiving process control parameters for one or more devices from a process controller to perform a first chamber process, determining a time to send each of the process control parameters to the one or more devices, for each of the one or more devices, adjusting the determined time to send each of the process control parameters using specific signal process delays associated with each of the one or more devices, and sending the process control parameters to each of the one or more devices at the adjusted times to perform the first chamber process, wherein the synchronization controller includes one or more output channels, each channel directly coupled to one of the one or more devices.

Abstract: A continuous or semi-continuous process for fabricating nanowires or microwires makes use of the substantially planar template that may be moved through electrochemical solution to grow nanowires or microwires on exposed conductive edges on the surface of that template. The planar template allows fabrication of the template using standard equipment and techniques. Adhesive transfer may be used to remove the wires from the template and in one embodiment to draw a continuous wire from the template to be wound around the drum.

Abstract: Disclosed herein are electroplating apparatuses for electroplating metal onto a semiconductor wafer which may include an electroplating cell, an electrolyte circulation system connected to the cell for circulating electrolyte to and from the cell, first and second sampling ports for taking first and second sample of electrolyte at first and second locations in the apparatus, and one or more liquid particle counter modules, connected to the first and second sampling ports, for measuring particle concentration in the electrolyte. Also disclosed herein are methods for reducing particle concentration in an electrolyte present in an electroplating apparatus which may include determining an approximate particle concentration using a liquid particle counter module and modifying the operation of the electroplating apparatus to reduce particle concentration in the electrolyte.

Abstract: This is a process to generate alternating current without an external source for cell-houses in electrowinning or electrorefining of copper or other products in which the electric source consists of a conventional rectifier-transformer group that supplies continuous electrical current to the cell-house, which is connected in parallel to a device characterized by having the capacity to extract an electrical current from the cell-house for a period of time and then return it in another period of time, whether periodically or semiperiodically and without changing the average value of the electrical current, supplied to the cell-house by the rectifier-transformer. This results in a electrical current in the cell-house that is the superimposition of a continuous and alternating current. This process is designed to overcome the barrier of electric potential produced by the presence of the pure continuous electric field in cell-houses through the electric agitation of an ion-rich electrolyte.

Abstract: A system for electroplating a substrate includes one or more controllers, with each controller having an FPGA with one or more output channels. A bulk power supply is connected to each controller. One or more transistors are associated with each output channel. An electroplating chamber has one or more electrodes, with each electrode connected to at least one output channel. The system may include a waveform capture and viewing circuit providing built-in process verification and diagnostic tools. The system may also have a throttle back mode which attempts to maintain proper anode current ratios by reducing setpoints of all anodes by the same percentage, if a fault condition causes a reduction in current to one of the anodes. Blackbox logging may also optionally be used for recording selected data values into a circular buffer having a selected amount of memory.

Abstract: The present invention relates to a manufacturing method of medical sterilized normal saline, more specifically, to such a method for manufacturing sterilized normal saline for medical purpose with effective sterilizing efficacy comprising: a step of disposing at least one electrode set immersed in saline solution of pH 4.0 to pH 7.5 including a pair of electrodes with flat surface separated from each other by an interval between 1 mm and 3 mm, the flat surfaces of the electrodes facing each other; and a step of supplying 30 mA to 200 mA direct current to the electrodes by applying 2.4V to 3.3V DC power to the electrodes; wherein free chlorine is reliably and stably generated as having concentration range between 0.17 ppm and 6 ppm from electrolysis between electrodes.

Abstract: Grid energy storage is very challenging due to its large scale, required quick response, versatility, round trip efficiency, and new system infrastructure. However, the benefit is also huge because it would enable utilisation of intermittent renewable energy, leverage load, and allow energy management in hours/diurnal to seconds/minutes. A new invention is described to store up to 4-6% the entire grid energy by aluminum production, while returning its baseload back to the grid by idling aluminum smelter cells. The round trip efficiency will be close to 100%; switching between storage and load release can be instantaneous.

Abstract: Apparatus for sanitizing a water stream comprises a first electrolysis cell which produces ions with algaecidal and bactericidal properties and a second electrolysis cell which oxidizes water to produce hydrogen peroxide. The first cell has copper electrodes and the second cell has titanium electrodes and the polarity of the electrodes is periodically reversed at a frequency of from three to nine minutes. Air is introduced into the stream prior to entering the cells.

Abstract: An electrolysis installation for decomposing water into hydrogen and oxygen comprises: an electrolysis stack; a water recirculation system supplying water to the stack and comprising a circuit and a recirculation pump, first and second separators for separating from water hydrogen and oxygen respectively produced in the stack; a hydraulic supply means supplying the recirculation circuit with deionised water to compensate for water consumed by production of gaseous hydrogen and oxygen, and an extinguishing means for inertising the first and second separators when the installation is shut down, wherein the extinguishing means comprises first and second relief valves provided on the first and second separators, respectively, wherein the valves relieve pressure in the two separators simultaneously while keeping the water level inside the two separators substantially constant, and the extinguishing means controls the supply means to completely fill the two separators with water once the two separators are relieved

Abstract: A system includes a photoelectrolysis system having a solar collector configured to collect and concentrate solar radiation to heat water, generate electricity, or both. The system also includes an electrolysis unit configured to electrolyze the heated water using at least the generated electricity to produce a first gas mixture and a second gas mixture. The first gas mixture includes oxygen and steam and the second gas mixture includes hydrogen and steam. The system further includes a first device configured to receive and use the first gas mixture as well as a hydrogen membrane configured to receive and separate the hydrogen and steam mixture into a hydrogen component and a steam component.

Abstract: An electrolyzer apparatus for the electrolytic manufacture of elemental F2 from an electrolyte/HF-solution, e.g., KF×1.8 HF, comprising at least one electrolytic cell which contains at least two anodes, often 20 to 30 anodes, a metallic cathodic vessel, and at least two rectifiers such that each anode is allocated to one rectifier. In this manner, each anode can be controlled and regulated individually. Failure of each individual anode, e.g., anode break, causes the production of undesired side products, e.g., of CF4. Any faulty anode can be detected easily, and each anode can be shut off individually, if needed, and repaired.

Abstract: When forming metallic components, in particular three-dimensionally curved blades, which constitute a single piece with the blading of turbomachine rotor wheels, the linear oscillation of the electrode acting as a tool is superimposed by a circular oscillation, enabling the electrode to turn into the workpiece conformally with its shape. Further forming is performed by circular oscillation with circular feed in the one and/or the other direction. An embodiment of the corresponding apparatus comprises an electrode holder (9) with linear feed (Zvor) and linear oscillation (Zosz) and a workpiece holder (5) with circular oscillation (Cosz) and circular feed (Cvor).

Abstract: A humidifier including a storage chamber configured to store water, an electrolytic unit configured to electrolyze water, a first and second pipe to which the electrolyzed water is introduced, a first and second valve configured to open/close a fluid path of the first pipe and second pipe, a filter unit disposed at the first pipe and configured to filter the electrolyzed water, a humidification chamber configured to be supplied with water from one of the first or the second pipe, and a control unit configured to supply the filtered water to the humidification chamber at a humidification mode by controlling the first valve and supply the electrolyzed water to the humidification chamber at a sterilization mode by controlling the second valve, the humidifier further including a drainage hole and a drainage valve to open/close the drainage hole, and a tray to store the water being discharged through the drainage hole.

Abstract: The present disclosure relates to a surface structure control and preparation process for a metal nanocatalyst involving a metal nanocatalyst. The present disclosure provides a surface structure control and continuous preparation system for a metal nanocatalyst, a metal nanocatalyst having an open surface structure and high surface energy, and a surface structure control and a preparation process thereof. The system is provided with a nucleation electrolytic cell, a distribution valve, at least two growth electrolytic cells, with two ends of the distribution valve being connected to an output port of the nucleation electrolytic cell and to input port of all the growth electrolytic cells, respectively. The metal nanocatalyst having an open surface structure is a single metal nanoscale crystal and has a high density of terrace atoms or active sites on the surface thereof.

Abstract: An electrochemical method and system for removing nitrate and ammonia in effluents, using an undivided flow-through electrolyzer, said electrolyzer comprising at least one cell, each cell comprising at least one anode and one cathode, the cathode being in a copper/nickel based alloy of a high corrosion resistance and a high electroactivity for nitrate reduction to ammonia and the anode being a DSA electrode of a high corrosion resistance and a high electroactivity for ammonia oxidation to nitrogen in presence of chloride.

Abstract: An apparatus for electroplating a layer of metal onto the surface of a wafer includes an ionically resistive ionically permeable element located in close proximity of the wafer and an auxiliary cathode located between the anode and the ionically resistive ionically permeable element. The ionically resistive ionically permeable element serves to modulate ionic current at the wafer surface. The auxiliary cathode is configured to shape the current distribution from the anode. The provided configuration effectively redistributes ionic current in the plating system allowing plating of uniform metal layers and mitigating the terminal effect.

Abstract: An apparatus for electroplating a layer of metal onto the surface of a wafer includes an ionically resistive ionically permeable element located in close proximity of the wafer and an auxiliary cathode located between the anode and the ionically resistive ionically permeable element. The ionically resistive ionically permeable element serves to modulate ionic current at the wafer surface. The auxiliary cathode is configured to shape the current distribution from the anode. The provided configuration effectively redistributes ionic current in the plating system allowing plating of uniform metal layers and mitigating the terminal effect.

Abstract: Methods, systems, and apparatus for plating a metal onto a work piece are described. In one aspect, an apparatus includes a plating chamber, a substrate holder, an anode chamber housing an anode, an ionically resistive ionically permeable element positioned between a substrate and the anode chamber during electroplating, an auxiliary cathode located between the anode and the ionically resistive ionically permeable element, and an insulating shield with an opening in its central region. The insulating shield may be movable with respect to the ionically resistive ionically permeable element to vary a distance between the shield and the ionically resistive ionically permeable element during electroplating.

Abstract: Methods, systems, and apparatus for plating a metal onto a work piece are described. In one aspect, an apparatus includes a plating chamber, a substrate holder, an anode chamber housing an anode, and an ionically resistive ionically permeable element positioned between a substrate and the anode chamber during electroplating. The anode chamber may be movable with respect to the ionically resistive ionically permeable element to vary a distance between the anode chamber and the ionically resistive ionically permeable element during electroplating. The anode chamber may include an insulating shield oriented between the anode and the ionically resistive ionically permeable element, with opening in a central region of the insulating shield.

Abstract: An apparatus for use in the electro-production of metals, comprising a plurality of anodes and a plurality of cathodes in an interleaved configuration, wherein each anode and cathode pair forms a cell; a plurality of power supplies, each cell associated with one or more respective power supplies; and the power supplies are arranged to control a direct current in the one or more cells to a predetermined value.

Abstract: An electro-catalytic membrane system for preparing fuel gas from water operates at normal levels of pressure and temperature. The system includes a high frequency power source, a power supply system, a programmable control unit, an electro-catalytic membrane module, and a module for processing the fuel gas. The electro-catalytic membrane module includes metallic electrodes in a concentric arrangement. The space between the concentric electrodes includes granular carbon and metallic particles. A fixed membrane is arranged at a lower end of the space while a mobile membrane is arranged at an upper end of the space. The electro-catalytic membrane module is further provided with sensors for measuring process parameters, conduits, and valves for supplying and removing liquids. A system for cooling the metallic electrodes is also provided.

Abstract: A metal ion eluting unit according to the present invention includes: a plurality of electrodes 102 and 103; a drive circuit (not shown) that applies a voltage between the electrodes; and a control circuit (not shown) that controls the drive circuit so that the drive circuit periodically reverses the polarity of the voltage applied between the electrodes, operates, from every time the polarity of the voltage applied between the electrodes is reversed until a predetermined period elapses, in a first current mode in which the value of a current flowing between the electrodes equals a first value, and operates, thereafter, in a second current mode in which the value of the current flowing between the electrodes equals a second current value different from the first current value. According to this configuration, metal ions can be efficiently and stably eluted for a prolonged period of time.

Abstract: The invention relates to an electrode for electrochemical generation of hypochlorite. The electrode comprises a valve metal substrate coated with a catalytic system consisting of two super-imposed layers of distinct composition and having a different activity towards hypochlorite anodic generation from chloride solutions. The electrode has a high duration in cathodic operation conditions, imparting self-cleaning characteristics thereto when used in combination with an equivalent one with periodic polarity reversal. Moreover, the deactivation of the electrode at the end of its life cycle occurs in two subsequent steps, allowing to schedule the substitution thereof with a significant notice period.

Abstract: A system for electroplating a substrate includes one or more controllers, with each controller having an FPGA with one or more output channels. A bulk power supply is connected to each controller. One or more transistors are associated with each output channel. An electroplating chamber has one or more electrodes, with each electrode connected to at least one output channel. The system may include a waveform capture and viewing circuit providing built-in process verification and diagnostic tools. The system may also have a throttle back mode which attempts to maintain proper anode current ratios by reducing setpoints of all anodes by the same percentage, if a fault condition causes a reduction in current to one of the anodes. Blackbox logging may also optionally be used for recording selected data values into a circular buffer having a selected amount of memory.

Abstract: Apparatus for purifying a fluid through a through-flow condenser, which comprises a tank of solubilising product and means for inserting it into a momentarily interrupted supply conduit. After having inserted a measured dose of solubilising product received from a tank into the same supply conduit, a logic control unit controls its forward motion in the condenser through the passage of a fluid transportation flow rate measured to transport the dose of solubilising product up to the electrodes of the condenser.

Abstract: A system for producing electric power from hydrogen and hydrogen from electric power, comprising: a reversible electric power-hydrogen conversion stage comprising a fuel cell stack to produce electric power from stored hydrogen and an electrolytic cell stack to produce hydrogen from electric power; a hydrogen pressure modification stage to modify the pressure of hydrogen supplied to or produced from the reversible electric power-hydrogen conversion stage; an electric power management and conditioning stage to condition electric power from/to the reversible electric power-hydrogen conversion stage; and a management stage to differentially manage the operation of the reversible electric power-hydrogen conversion stage, the hydrogen pressure modification stage and the electric power management and conditioning stage according to whether the system produces electric power from hydrogen or hydrogen from electric power and on a user-settable operation management strategy.

Abstract: An automated self-propelled pool cleaner having a housing, a water pump for moving water through the housing, drive means for moving the pool cleaner over the surface of the salt water pool to be cleaned, and an integral electrochemical chlorine generator mounted in the housing, includes a processor/controller that is programmed to activate the chlorine generator, the pump and drive means in predetermined operational sequences that minimize wear and tear on the water pump and drive means, while at the same time distribute and maintain a safe level of sanitizing chlorine in the pool, to thereby obviate the need for an in-line chlorinator or other chemical additive treatments; an optional automated sensor device can be provided to activate a secondary maintenance program which enables the pool cleaner to operate over prolonged periods of time as the sole means for filtering and sanitizing the pool water.

Abstract: Methods, apparatus, and systems for depositing copper and other metals are provided. In some implementations, a wafer substrate is provided to an apparatus. The wafer substrate has a surface with field regions and a feature. A copper layer is plated onto the surface of the wafer substrate. The copper layer is annealed to redistribute copper from regions of the wafer substrate to the feature. Implementations of the disclosed methods, apparatus, and systems allow for void-free bottom-up fill of features in a wafer substrate.

Abstract: A method for electrochemical plating includes providing a wafer for an electrochemical plating (ECP) process, determining a wafer electrical property affecting the ECP process, adjusting a plating current or voltage applied in the ECP process based on the determined wafer electrical property, and electroplating the wafer with the adjusted plating current or voltage. A controller for controlling a power supply, and a system for electrochemical plating are also disclosed.

Abstract: Electrodes, components, apparatuses, and methods for electrochemical machining (ECM) are disclosed. ECM may be employed to provide burr-free or substantially burr-free ECM of electrically-conductive workpieces (e.g. shrouds). As one non-limiting example, the electrically-conductive workpiece may be a shroud that is used as an electrical component in electronics boards. While the ECM components, apparatuses, and methods disclosed herein reduce burrs, ECM can provide imprecise machining and cause stray erosions to occur in the machined electrically-conductive workpiece. In this regard, the electrodes, components, apparatuses, and methods for ECM disclosed herein provide features that allow for precise machining of the machined electrically-conductive workpiece and also allow avoidance of stray erosions in the machined electrically-conductive workpiece.

Abstract: Electrolysis cell (10) comprises a DC voltage source (12) with positive and negative terminals (14, 16) to alternating electrodes (18) and (20) respectively. The source (12) produces a voltage that cycles between a minimum voltage Vmin and a maximum voltage Vmax where Vmin?0 volts, and Vmax=Vmin+?, where ?>0 volts. Thus, the voltage provided by the DC source (12) is in the form of a periodic wave having a period T, and frequency f. As the voltage source (12) cycles its voltage from Vmin to Vmax, there is an intermediate peak VP1 between Vmin and Vmax. When the voltage reaches VP1, it decreases for a period of time TP1, before again ramping up to voltage Vmax. The voltage then decreases relatively rapidly to Vmin, completing one cycle of period T.

Abstract: A pulse generator includes a wave generator connected to a power source, the wave generator having an output signal; a de-multiplexer having a single input for receiving the output signal of the wave generator and splitting the signal into a plurality of channels carrying corresponding DeMux output signals; and a multiplexer electrically connected to each of the DeMux output signals and including means for alternately advancing or retarding the time interval between pulses of each the DeMux output signals and for combining at least two of the advanced or retarded output signals together and outputting the at least two advanced or retarded output signals as a single circuit output signal having a diverse pulse train. Pulse control means for controlling at least one of the pulse width and pulse amplitude of the circuit output signal is also provided.

Abstract: Methods, systems, and apparatus for plating a metal onto a work piece with a plating solution having a low oxygen concentration are described. In one aspect, a method includes reducing an oxygen concentration of a plating solution. The plating solution includes about 100 parts per million or less of an accelerator. After reducing the oxygen concentration of the plating solution, a wafer substrate is contacted with the plating solution in a plating cell. The oxygen concentration of the plating solution in the plating cell is about 1 part per million or less. A metal is electroplated with the plating solution onto the wafer substrate in the plating cell. After electroplating the metal onto the wafer substrate, an oxidizing strength of the plating solution is increased.