Abstract: This invention prevents leakage of an internal liquid and breakage of a reference electrode resulting from volume expansion of the internal liquid due to the congelation of the internal liquid, and comprises a vessel that forms a sealed space, an internal liquid that is contained in the vessel, an internal electrode that is immersed in the internal liquid, an ion conduction part that is arranged on a wall of the vessel and that electrically connects the internal liquid and a measurement sample, and a volume expansion absorption mechanism 6 at least a part of which is immersed in the internal liquid and that absorbs volume expansion of the internal liquid due to congelation of the internal liquid.

Abstract: In an electroplating processor having at least one anode and one thief electrode, reference electrodes are used to measure a voltage gradient in the electrolyte near the edge of the wafer. The voltage gradient is used to calculate the current at the wafer surface using a control volume/current balance technique. The fraction of the total wafer current flowing to the edge region of the wafer is determined and compared to a target value. The processor controller changes at least one of the anode and thief currents to bring the actual edge region current toward the target current.

Abstract: Methods and devices for improving measurements of test meter, and in particular for detecting a presence of an electrochemical sensor or strip in the test meter and a start time of an electrochemical reaction, are provided. In one exemplary embodiment of an electrochemical system includes an electrochemical sensor , a test meter, and a circuit. The circuit is configured to form an electrical connection with the electrochemical sensor such that the circuit can detect three distinct voltage ranges. The voltage ranges can be indicative of an absence of the electrochemical sensor, a presence of the sensor that is devoid of a sample, and a presence of the sensor with a sample. Test meters, methods for detecting when a sample starts to fill an electrochemical sensor for establishing when a reaction starts, and circuits for use with electrochemical strips, are also provided.

Abstract: The present invention provides a microchip for performing electrophoresis with pulsed amperometric detection (PAD) for the separation and detection of underivatized carbohydrates, amino acids, sulfur-containing antibiotics, etc. PAD allows for the direct detection of amines, thiols, alcohols and carbohydrates and therefore is a useful technique for the development of electrochemical detection for microchip electrophoresis.

Abstract: An electroplating apparatus including a reference electrode to control the potential during an electro-deposition process. The electroplating apparatus may include a bath containing a plating electrolyte and an anode present in a first portion of the bath containing the plating electrolyte. A cathode is present in a second portion of the bath containing the plating electrolyte. A reference electrode is present at a perimeter of the cathode. The electroplating apparatus also includes a control system to bias the cathode and the anode to provide a potential. A measuring system is provided in electrical communication with the reference electrode to measure the potential of the cathode. Methods of using the above described electroplating apparatus are also provided. Structures and method for electroless deposition are also provided.

Abstract: The present invention provides a microchip for performing electrophoresis with pulsed amperometric detection (PAD) for the separation and detection of underivatized carbohydrates, amino acids, sulfur-containing antibiotics, etc. PAD allows for the direct detection of amines, thiols, alcohols and carbohydrates and therefore is a useful technique for the development of electrochemical detection for microchip electrophoresis.

Abstract: A method for measuring an iodine adsorption number of carbon black includes: (a) electrochemically reducing an unknown amount of iodine adsorbed by a predetermined amount of a carbon black sample; (b) measuring the electrical charge used for reducing the unknown amount of the iodine adsorbed by the carbon black sample; and (c) obtaining the iodine adsorption number from the measured electrical charge. An electrolytic cell and a kit for measuring an iodine adsorption number of carbon black are also disclosed.

Abstract: An anodizing or plating system is provided that has a bath with an electrolytic solution into which a production part is at least partially disposed. For the anodizing process, an anodizing monitoring device is present and has a control panel at least partially disposed within the electrolytic solution. A power source for forming an electrical circuit between the power source, the bath, the production part, and the anodizing monitoring device is present. The production part and the anodizing monitoring device are arranged in parallel relationship to one another in the electrical circuit.

Abstract: Electrode configurations for electric-field enhanced performance in catalysis and solid-state devices involving gases are provided. According to an embodiment, electric-field electrodes can be incorporated in devices such as gas sensors and fuel cells to shape an electric field provided with respect to sensing electrodes for the gas sensors and surfaces of the fuel cells. The shaped electric fields can alter surface dynamics, system thermodynamics, reaction kinetics, and adsorption/desorption processes. In one embodiment, ring-shaped electric-field electrodes can be provided around sensing electrodes of a planar gas sensor.

Abstract: Embodiments described herein generally relate to methods and apparatus for forming an electrode structure used in an energy storage device. More particularly, embodiments described herein relate to methods and apparatus for characterizing nanomaterials used in forming high capacity electrode structures for energy storage devices. In one embodiment a process for forming an electrode structure for an energy storage device is provided. The process comprises depositing a columnar metal structure over a substrate at a first current density by a diffusion limited deposition process, measuring a capacitance of the columnar metal structure to determine a surface area of the columnar metal structure, and depositing three dimensional porous metal structures over the columnar metal structure at a second current density greater than the first current density.

Abstract: A plating apparatus for plating a substrate comprises a power supply for generating a voltage between a pair of terminals; an anode connected to one terminal of the power supply; a main cathode connected to the other terminal of the power supply while in contact with the substrate; an auxiliary cathode connected to the other terminal of the power supply while out of contact with the substrate; a main resistance R1 connected in series between the other terminal of the power supply and the main cathode; and an auxiliary resistance R2 connected in series between the other terminal of the power supply and the auxiliary cathode.

Abstract: Carbon nanoparticles including both nanofilaments and nanotubes produced by an electrochemical deposition method from organic solutions at room temperature, in which the formation and growth of carbon nanoparticles are stimulated by the catalyst, such as iron and nickel. It has been found that the electrochemical deposition conditions have a strong influence on the growth phenomenon of the carbon nanotubes. Scanning electron microscope (SEM) and transmitting electron microscope (TEM) characterizations show that the diameter of nanotubes is of the order of approximately 100 nm, and the length of filaments can be up to approximately 50 ?m, depending on the size of catalyst particles.

Abstract: Controlled-potential electroplating provides an effective method of electroplating metals onto the surfaces of high aspect ratio recessed features of integrated circuit devices. Methods are provided to mitigate corrosion of a metal seed layer on recessed features due to contact of the seed layer with an electrolyte solution. The potential can also be controlled to provide conformal plating over the seed layer and bottom-up filling of the recessed features. For each of these processes, a constant cathodic voltage, pulsed cathodic voltage, or ramped cathodic voltage can be used. An apparatus for controlled-potential electroplating includes a reference electrode placed near the surface to be plated and at least one cathode sense lead to measure the potential at points on the circumference of the integrated circuit structure.

Abstract: A higher applied potential may be provided to a consumable anode to reduce sludge formation during electroplating. For example, a higher applied potential may be provided to a consumable anode by decreasing the exposed surface area of the anode to the electrolyte solution in the electroplating cell. The consumable anode may comprise a single anode or an array of anodes coupled to the positive pole of the power source in which the exposed surface area of the anode is less than an exposed surface area of the cathode to the electrolyte solution. In another example, a higher applied potential may be provided to a consumable anode by increasing the potential of the electroplating cell.

Abstract: An electrochemical deposition and testing system consisting of individually addressable electrode arrays, a fully automated deposition head, and a parallel screening apparatus is described. The system is capable of synthesizing and screening millions of new compositions at an unprecedented rate.

Abstract: A fuel cell includes an anode electrode, a cathode electrode, and a third electrode interposed between the anode and the cathode electrodes. The third electrode preferably includes an electrically conductive component. The third electrode preferably includes a metallic and a polymer grid and/or a conducting polymer. The third electrode may be used to control processes of the anode and/or the cathode electrodes. The third electrode may also be used to monitor the health of any component of the fuel cell.

Abstract: A value of a current flowing through a plating solution to a first working electrode whose base is exposed in a first opening is measured, and a value of a current flowing through the plating solution to a second working electrode whose base is exposed in a second opening having an opening area larger than that of the first opening is measured.

Abstract: The present invention generally relates to an apparatus and method of evaluating electroplating solutions and conditions. In one embodiment, the method of evaluating electroplating solutions comprises utilizing an electrochemical measuring cell having a working electrode having a lid with at least one hole, a counter electrode, and a reference electrode. The working electrode, the counter electrode, and the reference electrode are immersed in at least one sample of at least one electroplating solution. The lid is disposed over the working electrode forming a chamber between the working electrode and the lid. The lid further has a hole to allow an electroplating solution to flow into the chamber and reach the working electrode. The potential of the working electrode in the sample of the electroplating solution is measured over time with a constant current supplied to the working electrode.

Abstract: A method and assembly for recovering a metal from by-products produced from etching a metal (e.g., platinum, iridium, aluminum, etc.) in a plasma processing chamber. The method includes recovering from the plasma processing chamber a deposit of the by-products containing the metal. The deposit is dissolved in an acid, and the metal is recovered from the acid by inserting a working electrode, a reference electrode, and a counter electrode into the acid and applying a difference in potential between the working and reference electrodes to cause current to flow through the working and counter electrodes and the metal to be removed from the liquid and deposit on the working electrode. The metal is removed from the working electrode to recover the metal.

Abstract: Recovery of silver from a photographic fixer solution in an electrolytic cell is controlled so as to maintain a high current efficiency whilst minimizing unwanted side effects. The difference between plating voltages when operating at two different current levels is monitored, and the plating current adjusted in response to detection of a maximum of said differences. Such control allows the cell to be operated continually at high current efficiency in response to changing chemical conditions within the cell.

Abstract: An electrochemical etching step in a semiconductor device fabrication process increases the radius of curvature of edges of metal lines deposited on the semiconductor device. The metal lines are fabricated by forming a mask, electrodepositing the metal, and removing the mask, and the electro-chemical etching step in performed subsequently. The increased radius of curvature of the metal lines simplifies subsequent planarization and decreases line-to-line capacitance, thereby enhancing device performance. In an apparatus for performing the fabrication process, wires sown into a gasket which secures the semiconductor wafer and prevents electrolyte leakage, allows the gasket to function also as a component of the cathode. A more uniform metal deposition is created by a virtual anode, i.e., a metal plate having an aperture and being located between the anode and the cathode.