With Current, Voltage, Or Power Control Means Patents (Class 204/230.2)
  • Patent number: 6337002
    Abstract: In the present invention, by making an alkaline ionic water conditioner in which an electrolysis current detection device has a plurality of output means different in conversion level, and conversion levels are switched in accordance with the level of a current flowing in an electrolyte, and which has an optimum pH control function by performing duty control, in case of electrifying certain raw water, or in case of adding brine for strongly accelerating generation, when a current flowing between electrode plates is high, the conversion level of the electrolysis current detection device is lowered to generate electrolyte water of pH 10 or more. When the current is low, an electrolysis current detection range with a high resolution can be obtained by raising the conversion level, proper pH control can be performed in accordance with change in electrolysis current in the quality of raw water and adding brine.
    Type: Grant
    Filed: April 28, 2000
    Date of Patent: January 8, 2002
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventor: Masahiko Kashimoto
  • Publication number: 20020000380
    Abstract: The present invention is directed to an improved electroplating method, chemistry, and production worthy apparatus for depositing noble metals (e.g., platinum) and their alloys onto the surface of the workpiece, such as a semiconductor wafer, pursuant to manufacturing a microelectronic device, circuit, and/or component. The reliability of the noble metal material deposited using the disclosed method, chemistry, and/or apparatus is significantly better than the reliability of noble metal structures deposited using the teachings of the prior art. This is largely attributable to the low stress of films that are deposited using the teachings disclosed herein. The metals, which can be deposited, include gold, silver, platinum, palladium, ruthenium, iridium, rhodium, osmium and alloys containing these metals.
    Type: Application
    Filed: October 28, 1999
    Publication date: January 3, 2002
    Inventors: LYNDON W. GRAHAM, CURT W. JACOBSON, THOMAS L. RITZDORF
  • Patent number: 6325913
    Abstract: This invention relates to an improved apparatus and method for electrolytic descaling of steel strips. The apparatus comprises electrodes integrated with nozzles having jet openings for dispensing electrolyte onto the surface of the steel strips. By jetting the electrolyte to the steel strip in the air and applying a voltage to the electrode, the scale on the surface of the steel strip is removed. This jetting of electrolyte reduces the size requirement of the electrolyte tank storing the electrolyte because the required quantity of electrolyte decreases. The present invention does not require immersion of the electrodes in the electrolyte and thus avoids the problem of short-circuiting that occurs with submerged electrodes. This results in a significant improvement in electric power efficiency.
    Type: Grant
    Filed: August 23, 1999
    Date of Patent: December 4, 2001
    Assignee: Hitachi, Ltd.
    Inventors: Katsumi Mabuchi, Tomoko Kikuchi, Yasunobu Kani, Tsuneo Nakamura, Shinichi Yokosuka
  • Patent number: 6315886
    Abstract: Electropurification of contaminated aqueous media, such as ground water and wastewater from industrial manufacturing facilities like paper mills, food processing plants and textile mills, is readily purified, decolorized and sterilized by improved, more economic open configuration electrolysis cell designs, which may be divided or undivided, allowing connection as monopolar or bipolar cells. When coupled with very narrow capillary gap electrodes more economic operation particular when treating solutions of relatively low conductivity is assured. The novel cell design is also useful in the electrosynthesis of chemicals, such as hypochlorite bleaches and other oxygenated species.
    Type: Grant
    Filed: December 7, 1998
    Date of Patent: November 13, 2001
    Assignee: The Electrosynthesis Company, Inc.
    Inventors: Guillermo Daniel Zappi, Norman L. Weinberg
  • Patent number: 6300141
    Abstract: A diagnostic card device for use in detecting or quantitating an analyte present in a liquid sample, comprising a card substrate having a sample introduction region, a biosensor, and a sample-flow pathway communicating between the sample-introduction region and the biosensor, circuitry for generating an analyte-dependent electrical signal from the biosensor; and a signal-responsive element for recording such signal. In one embodiment, the biosensor includes a detection surface with surface-bound molecules of a first charged, coil-forming peptide capable of interacting with a second, oppositely charged coil-forming peptide to form a stable &agr;-helical coiled-coil heterodimer, where the binding of the second peptide to the first peptide, to form such heterodimer, is effective to measurably alter a signal generated by the biosensor. The sample-flow pathway contains diffusibly bound conjugate of the second coil-forming peptide and the analyte (or an analyte analog) and immobilized analyte-binding agent.
    Type: Grant
    Filed: March 2, 2000
    Date of Patent: October 9, 2001
    Assignee: Helix BioPharma Corporation
    Inventors: Donald Segal, Heman Chao, Wah Y. Wong, Jerry McElroy
  • Patent number: 6299741
    Abstract: In advanced electrolytic polish (AEP) method, a metal wafer (10) acts as an anodic electrodes and another metal plate (65) is used as a cathodic electrode. A voltage differential is applied to the anode and cathode under a predetermined anodic dissolution current density. This causes a reaction that provides a planarized surface on the metal wafers. Additives are included in the electrolyte solution (55) which adsorb onto the wafer surface urging a higher removal rate at higher spots and a lower removal rate at lower spots. Also, in another embodiment of the present invention is a pulsed-electrolytic process (260) in which positive and negative potentials are applied to the anodic and cathodic electrodes alternately, further encouraging surface planarization.
    Type: Grant
    Filed: November 29, 1999
    Date of Patent: October 9, 2001
    Assignee: Applied Materials, Inc.
    Inventors: Lizhong Sun, Stan Tsai, Fritz Redeker
  • Publication number: 20010017259
    Abstract: There is provided an electrolysis gas converter, which prevents excessive gas generation and can maintain a constant amount of gas conversion even if outside air conditions such as humidity changes. The converter, which provides DC current to a jointed electrochemical device 8 comprising a solid polymer electrolytic film 3 between an anode 1 and a cathode 2 having a catalytic layer on a base substrate of conductive porous material, comprises means 11 and 17 which provide a fixed current to the jointed electrochemical device 8.
    Type: Application
    Filed: February 23, 2001
    Publication date: August 30, 2001
    Applicant: MITSUBISHI DENKI KABUSHIKI KAISHA
    Inventors: Akira Ikeda, Akihiko Iwata, Shigeo Ueguri, Yoshikazu Tsunoda
  • Patent number: 6274009
    Abstract: A vacuum operated electrolytic generator producing a solution of chlorine dioxide from a buffered aqueous alkali metal chlorite solution in one pass through the cell is disclosed. The cell contains a high surface area anode, a corrosion-resistant highly conductive cathode, and a cation ion exchange membrane between the anode and cathode. An eductor is used on the anolyte effluent line to create a vacuum and draw the anolyte through the cell. Preferably, an eductor is used n the catholyte effluent line. Ascending anolyte effluent line with a non-corrosive check valve leads from the cell to the anode eductor. Sensors are used to monitor the composition of the anolyte effluent and/or the anolyte feed.
    Type: Grant
    Filed: September 3, 1999
    Date of Patent: August 14, 2001
    Assignee: International Dioxide Inc.
    Inventors: Brian D. Krafton, John C. Smedley
  • Patent number: 6267864
    Abstract: Methods and devices for transforming less desirable chemical species into more desirable or useful chemical forms are disclosed. The specifications can be used to treat pollutants into more benign compositions and to produce useful chemicals from raw materials and wastes. The methods and devices disclosed utilize continuous or temporary pulse of electrical current induced by electromagnetic field and high surface area formulations. The invention can also be applied to improve the performance of existing catalysts and to prepare novel devices.
    Type: Grant
    Filed: April 6, 1999
    Date of Patent: July 31, 2001
    Assignee: Nanomaterials Research Corporation
    Inventors: Tapesh K. Yadav, Bijan K. Meramadi
  • Patent number: 6267860
    Abstract: Electrolytic plating of a workpiece is enhanced by providing a resistor between the workpiece and electrically conductive support member.
    Type: Grant
    Filed: July 27, 1999
    Date of Patent: July 31, 2001
    Assignee: International Business Machines Corporation
    Inventor: William Louis Brodsky
  • Patent number: 6261433
    Abstract: The invention provides an apparatus and a method for achieving reliable, consistent metal electroplating or electrochemical deposition onto semiconductor substrates. More particularly, the invention provides uniform and void-free deposition of metal onto metal seeded semiconductor substrates having sub-micron, high aspect ratio features. The invention provides an electrochemical deposition cell comprising a substrate holder, a cathode electrically contacting a substrate plating surface, an electrolyte container having an electrolyte inlet, an electrolyte outlet and an opening adapted to receive a substrate plating surface and an anode electrically connect to an electrolyte. Preferably, a vibrator is attached to the substrate holder to vibrate the substrate in at least one direction, and an auxiliary electrode is disposed adjacent the electrolyte outlet to provide uniform deposition across the substrate surface.
    Type: Grant
    Filed: April 21, 1999
    Date of Patent: July 17, 2001
    Assignee: Applied Materials, Inc.
    Inventor: Uziel Landau
  • Publication number: 20010004962
    Abstract: The present invention is directed to a new water treatment device comprising an electrolytic tank to put water in, an electrode provided in the electrolytic tank, a water treating path for pouring water in a pool and returning to the pool the water in the electrolytic tank, a residual chlorine sensor for measuring the residual chlorine concentration of water, and control means for controlling the energization of the electrode on the basis of the measured value by the residual chlorine sensor, and capable of simply and efficiently sterilizing water stored in pools of various sizes from a swimming pool to a home bathtub.
    Type: Application
    Filed: December 12, 2000
    Publication date: June 28, 2001
    Inventors: Tatsuya Hirota, Yoshihiro Inamoto, Kiyokazu Fujikawa, Yozo Kawamura, Minoru Nakanishi, Minoru Kishi, Takaaki Yonezawa, Tamotsu Kawamura, Kazuhiro Yamamoto, Yasuhiko Shimizu, Yasuhito Kondo
  • Patent number: 6251250
    Abstract: A novel method and apparatus of wet processing workpieces, such as electroplating semiconductor wafers and the like, that incorporates reciprocating processing fluid agitation to control fluid flow at the workpiece, and where electric fields are involved as in such electroplating, controlling the electric field distribution.
    Type: Grant
    Filed: September 3, 1999
    Date of Patent: June 26, 2001
    Inventor: Arthur Keigler
  • Publication number: 20010002001
    Abstract: A machining solution for removal-machining an object to be machined 103 is introduced to an inside of a machining solution container 101, and a predetermined voltage is applied to between the machining electrode 104 and the object to be machined 103 to cause electrochemical reaction thereby fabricating a part cast mold. Then the machining solution is changed to a machining solution for metal layer formation to effect additional machining on a surface of the cast mold, forming a metal layer. Then the machining solution is changed to a machining solution for part formation to effect additional machining inside the cast mold, forming a part. Finally the machining solution is changed to a machining solution for dissolving metal layer to dissolve the metal layer to taking out the inside part, fabricating a part.
    Type: Application
    Filed: January 19, 2001
    Publication date: May 31, 2001
    Inventors: Reiko Irie, Masayuki Suda, Toshihiko Sakuhara, Tstsuaki Ataka
  • Publication number: 20010001192
    Abstract: A transport system for the implementation of electrolytic deposition, coating or etching; and more particularly, an apparatus for selective electrolytic metallization and deposition utilizing a fluid head arrangement. A method is provided for making and maintaining an electrical contact with a product being processed in a transport system employed for selective electrolytic metallization and deposition, coating or etching. The method of making and maintaining an electrical contact with a product being processed may be utilizing a fluid head arrangement.
    Type: Application
    Filed: January 5, 2001
    Publication date: May 17, 2001
    Inventors: Michael Acciai, Steven L. Tisdale
  • Patent number: 6221234
    Abstract: A method for pickling products in a metal alloy containing iron, and products in titanium and alloys thereof, in the absence of nitric acid as an oxidizing agent, and for the recovery of the exhausted solutions, characterized in that the recovery of the exhausted solutions deriving from pickling comprises the following steps: sending of the pickling solution, both as catholyte and as anolyte, in an electro-chemical cell optionally of the membrane type to separate the Fe2+ (or Ti2+) ions to be disposed of, from the Fe3+ (or of the Ti3+ and Ti4+) ions to be recovered, obtained by reduction at the cathode of the Fe3+ ions which are in the catholyte to Fe2+ (or of the Ti3+ and Ti4+ ions to Ti2+) and of oxidation at the anode Fe2+ (or Ti2+) ions which are in the anolyte to Fe3+ (to Ti3+ and Ti4+); treating the catholytic solution coming out of the cell and enriched in Fe2+ (or Ti2+) ions as to allow the separation in two phases, a
    Type: Grant
    Filed: November 30, 1999
    Date of Patent: April 24, 2001
    Assignee: Acciai Speciali Terni S.p.A.
    Inventors: Franco Mancia, Sandro Fortunati
  • Patent number: 6207037
    Abstract: Recovery of silver from a photographic fixer solution in an electrolytic cell is controlled so as to maintain a high current efficiency whilst minimizing unwanted side effects. The difference between plating voltages when operating at two different current levels is monitored, and the plating current adjusted in response to detection of a maximum of said differences. Such control allows the cell to be operated continually at high current efficiency in response to changing chemical conditions within the cell.
    Type: Grant
    Filed: July 12, 1999
    Date of Patent: March 27, 2001
    Assignee: Eastman Kodak Company
    Inventors: Nicholas J. Dartnell, Christopher B. Rider
  • Patent number: 6200434
    Abstract: An apparatus for producing an electrolytic water including an electrolyzing vessel which is partitioned into an anode chamber and a cathode chamber by a partition membrane, electric current being supplied to electrodes set in the anode and cathode chambers and water to be electrolyzed being delivered into the anode and cathode chambers to produce anodic water in the anode chamber and cathodic water in the cathode chamber, electrolytic water thus produced being discharged through discharge ports disposed on the anode and cathode chambers, wherein the anode chamber is connected with anode side treating water supply means which is capable of supplying, as treating water, sodium chloride solution or potassium chloride solution to the anode chamber and which is capable of adjusting quantities of supply thereof, and the cathode chamber is connected with cathode side treating water supply means which is capable of supplying, as treating water, hydrochloride solution or dilute hydrochloride solution to the cathode c
    Type: Grant
    Filed: February 25, 1999
    Date of Patent: March 13, 2001
    Assignee: Amano Corporation
    Inventors: Takao Shinjo, Hiroyuki Tsuchiya
  • Patent number: 6197178
    Abstract: A process and apparatus for forming oxide coatings on bodies of aluminum and aluminum alloys are described. The process includes forming an electrolyte bath in an inert container. At least two reactive metal bodies are suspended in the bath. The bodies are connected to electrodes which, in turn, are connected to a multiphase AC circuit. A multiphase power (preferably three-phase between three bodies) potential is imposed between each of the bodies. The bodies are moved in the electrolyte bath relative to each other until micro-arcs occur on the surfaces of the bodies, whereby to commence oxidation of the bodies. The imposition of the potential between each of the bodies is continued until the desired thickness of oxide is formed on the bodies.
    Type: Grant
    Filed: April 2, 1999
    Date of Patent: March 6, 2001
    Assignee: Microplasmic Corporation
    Inventors: Jerry L. Patel, Nannaji Saka
  • Patent number: 6193860
    Abstract: An apparatus for optimizing electrical currents to improve copper plating uniformity on a semiconductor wafer is disclosed. The use of multiple anodes of the embodiment provides for variable electrical currents to the semiconductor wafer, the variable feature of the variable electrical currents compensating for non-uniform electroplating characteristics.
    Type: Grant
    Filed: April 23, 1999
    Date of Patent: February 27, 2001
    Assignee: VLSI Technolgy, Inc.
    Inventor: Milind Weling
  • Patent number: 6187153
    Abstract: A method and circuit (14) for monitoring an electroplating operation of an electroplating machine (10) of the type having a first electroplating cell (18) for depositing nickel onto an integrated circuit leadframe (12) and a second electroplating cell (19) for subsequently depositing palladium onto the leadframe (12). A first current (30) is applied in the first electroplating cell (18) to form a nickel deposit on the leadframe (12) and a second current (31) is applied in the second electroplating cell (19) to from a palladium deposit on the nickel deposit. The second current (31) is greater than the first current (30) if the electroplating machine (10) is operating normally. The first current (30) and second current (31) are compared in a comparator (44) during the electroplating operation, and if the second current (31) is less than the first current (30), an error signal is generated on an output line (50). If desired, the electroplating machine (10) may be stopped in response to the error signal.
    Type: Grant
    Filed: June 24, 1999
    Date of Patent: February 13, 2001
    Assignee: Texas Instruments Incorporated
    Inventors: David M. Drew, Paul R. Moehle
  • Patent number: 6187167
    Abstract: Recovery of silver from a photographic fixer solution in an electrolytic cell is controlled so as to maintain a high current efficiency whilst minimizing unwanted side effects. The rate of change of plating voltage at constant current through the cell is monitored, and in response to detection of a maximum value thereof the current is reduced to a new constant level. Such control allows the cell to be operated continually at high current efficiency in response to changing chemical conditions within the cell.
    Type: Grant
    Filed: July 2, 1999
    Date of Patent: February 13, 2001
    Assignee: Eastman Kodak Company
    Inventors: Nicholas J. Dartnell, Christopher B. Rider, Bruce S. Gowans
  • Patent number: 6179983
    Abstract: An apparatus for depositing an electrical conductive layer on the surface of a wafer includes a virtual anode located between the actual anode and the wafer. The virtual anode modifies the electric current flux and plating solution flow between the actual anode and the wafer to thereby modify the thickness profile of the deposited electrically conductive layer on the wafer. The virtual anode can have openings through which the electrical current flux passes. By selectively varying the radius, length, or both, of the openings, any desired thickness profile of the deposited electrically conductive layer on the wafer can be readily obtained.
    Type: Grant
    Filed: November 13, 1997
    Date of Patent: January 30, 2001
    Assignee: Novellus Systems, Inc.
    Inventors: Jonathan David Reid, Steve Taatjes
  • Patent number: 6168692
    Abstract: An apparatus for generating alkali ion water includes an electrolytic cell. At least two electrodes are disposed in the electrolytic cell. A diaphragm disposed in the electrolytic cell extends between the electrodes. A dc voltage is supplied to the electrodes. A mean value of the dc voltage is varied at a given inclination. A first detecting device operates to detect an ac current and generate a signal representative thereof. The dc voltage is derived from the ac current. A second detecting device operates to detect the mean value of the dc voltage in response to the signal generated by the first detecting device. A third detecting device operates to detect an inclination in a variation in the mean value of the dc voltage in response to the mean value of the dc voltage which is detected by the second detecting device. The mean value of the dc voltage is controlled in response to the inclination detected by the third detecting device.
    Type: Grant
    Filed: June 1, 1994
    Date of Patent: January 2, 2001
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Toshisuke Sakai, Narumi Nagase