Abstract: This invention relates to a system and method for producing a metal powder product using either conventional electrowinning or alternative anode reaction chemistries in a flow-through electrowinning cell. The present invention enables the production of high quality metal powders, including copper powder, from metal-containing solutions using conventional electrowinning processes, direct electrowinning, or alternative anode reaction chemistries.

Abstract: A water treatment device having a tank containing an anode and a cathode. A motor is provided to impart rotational motion to the cathode. A scraping means is fixed to the interior of the tank and extend inward toward the tank so as to define a gap between the scraping means and the cathode. As mineral deposits accumulate on the cathode they are removed by the scraping means and the rotational motion of the cathode.

Abstract: An electroplating system is provided. The electroplating system includes a divided electrode that is arranged to simultaneously provide a plurality of line currents for an electroplating process. The system includes a current control component that is coupled to the divided electrode. The current control component is configured to determine the magnitude of each of the line currents. The current control component is also configured to regulate individual line currents based, at least in part, on the determined magnitude of each of the line currents.

Abstract: The present invention relates to a method and system for electrolytic fabrication of cells. A cell can be formed of a silicon layer (cathode) sandwiched between layers of glass. One or more holes are formed in the silicon layer. An alkali metal enriched glass material is placed in or associated with the one or more holes. Electrolysis is used to make the alkali metal ions in the alkali metal enriched glass material combine with electrons from the silicon cathode to form neutral alkali metal atoms in the one or more holes.

Abstract: A plurality of pixels, each including first and second electrodes and an electrolytic solution, are arranged. When a voltage between the first and the second electrodes increases into a precipitation critical value or more, the precipitation of electroplating starts. When the voltage decreases into a value smaller than the deposition overvoltage value, the precipitation ends. A control unit controlling the voltage between the first and second electrodes repeats a subfield operation including a first operation of selectively supplying any of first, a second voltage and third voltages to the plurality of pixels, and a second operation of collectively supplying the second voltage value to the plurality of pixels after the first operation, at least two times or more, to control the gradation of each pixel based on a timing of supplying the third voltage.

Abstract: A work piece is electroplated or electroplanarized using an azimuthally asymmetric electrode. The azimuthally asymmetric electrode is rotated with respect to the work piece (i.e., either or both of the work piece and the electrode may be rotating). The azimuthal asymmetry provides a time-of-exposure correction to the current distribution reaching the work piece. In some embodiments, the total current is distributed among a plurality of electrodes in a reaction cell in order to tailor the current distribution in the electrolyte over time. Focusing elements may be used to create “virtual electrode” in proximity to the surface of the work piece to further control the current distribution in the electrolyte during plating or planarization.

Abstract: An electrocoagulation device for removal of contaminants from a treatment stream including an elongated fluid treatment path in contact with a plurality of electrode plates, and a power supply electrically connected to the plates, wherein the device is configured so that it can provide a variety of electric field regimes to the treatment stream as it passes along the treatment path, and so that it can provide a variety of flow regimes along the fluid treatment path.

Abstract: A method for configuring a solar hydrogen generation system and the system optimization are disclosed. The system utilizes photovoltaic modules and an electrolyte solution to efficiently split water into hydrogen and oxygen. The efficiency of solar powered electrolysis of water is optimized by matching the most efficient voltage generated by photovoltaic cells to the most efficient input voltage required by the electrolysis cell(s). Optimizing PV-electrolysis systems makes solar powered hydrogen generation cheaper and more practical for use as an environmentally clean alternative fuel.

Abstract: A machining electrode includes: a base substance including an electrolytic portion faced to a workpiece on one end face in an axial direction and having conductivity; an insulating unit provided on a face in a direction generally orthogonal to the axial direction of the base substance and having insulation; and a shielding unit provided on a face opposite to the base substance of the insulating unit.

Abstract: A semiconductor electroplating process deposits copper into the through silicon via hole to completely fill the through silicon via in a substantially void free is disclosed. The through silicon via may be more than about 3 micrometers in diameter and more that about 20 micrometers deep. Low copper concentration and high acidity electroplating solution is used for deposition copper into the through silicon vias.

Abstract: An apparatus for electroplating a layer of metal on the surface of a wafer includes a second cathode located remotely with respect to the wafer. The remotely positioned second cathode allows modulation of current density at the wafer surface during an entire electroplating process. The second cathode diverts a portion of current flow from the near-edge region of the wafer and improves the uniformity of plated layers. The remote position of second cathode allows the insulating shields disposed in the plating bath to shape the current profile experienced by the wafer, and therefore act as a “virtual second cathode”. The second cathode may be positioned outside of the plating vessel and separated from it by a membrane.

Abstract: An electrolytic processing apparatus, prior to carrying out plating directly on, e.g., a ruthenium film of a substrate using the ruthenium film as a seed layer, can securely remove a passive layer formed on a surface of the ruthenium film even when the substrate is a large-sized high-resistance substrate, such as a 300-mm wafer, thereby reducing the terminal effect during the subsequent plating, improving the quality of a plated film and enabling filling of a void-free plated film into a fine interconnect pattern.

Abstract: The invention relates inter alia to a method for removing a protective coating from a component, especially a turbine blade. According to the invention, the protective coating is removed, using mechanical shock waves having a shock wave repetition rate below 20 kHz.

Abstract: This invention relates to an electrolytic processing apparatus and method useful for processing a conductive material formed in the surface of a substrate, or for removing impurities adhering to the surface of a substrate. An electrolytic processing apparatus, including, a processing electrode that can come close to a workpiece, a feeding electrode for feeding electricity to the workpiece, an ion exchanger disposed in the space between the workpiece and the processing and the feeding electrodes, a fluid supply section for supplying a fluid between the workpiece and the ion exchanger, and a power source. The processing electrode and/or the feeding electrode is electrically divided into a plurality of parts, and the power source applies a voltage to each of the divided electrode parts and can control voltage and/or electric current independently for each of the divided electrode parts.

Abstract: A machine for electrochemically polishing indentations within the wall of an aluminum workpiece, such as a wheel, has a cathode attached to an upper platen. The workpiece is mounted upon a lower platen which acts as an anode. Electrolyte is passed between the cathode and the anode while simultaneously a current is applied which passes through the cathode and the anode. The current is selectively pulsed to maximize polishing but at the same time to permit the flushing away of residual material and to cool the cathode and the workpiece.

Abstract: A compact and portable system adapted for use in decomposing water and separating an oxygen rich gaseous stream and a hydrogen rich gaseous stream which produces a massive output of Hydrogen fuel, (along with the proportional amount of oxygen) capable of operating at varying levels of output, on-demand. This system can interface easily with existing technologies to power standard motor vehicles (gas, diesel, ethanol or hydrogen systems), recreational vehicles, home energy systems and home appliances, commercial/industrial power generators, smelters and much more.

Abstract: Disclosed are an apparatus for generating hydrogen and a fuel cell power generation system that have the same. The apparatus in accordance with an embodiment of the present invention include: an electrolytic bath configured to contain electrolyte solution; an anode placed inside the electrolytic bath and configured to generate an electron; a cathode placed inside the electrolytic bath and configured to generate hydrogen by receiving the electron from the anode; a controller electrically connected to the anode and the cathode, and configured to control flow of electricity between the anode and the cathode; and a hydrogen generating material accepted inside the electrolytic bath and configured to generate hydrogen through the reaction with the electrolyte solution in order to start the controller.

Abstract: A method and an apparatus for electroerosive material machining of a workpiece with an elongated tool electrode are described. The tool electrode is guided in an electrode guide, in which an oval void is embodied. The wire segment located in the void is exposed to a magnetic field, as a result of which the wire segment can be deflected laterally. The lateral deflection is converted into an axial motion of the wire segment located in the region of the workpiece, in order to create an optimal work gap between the workpiece and the free end part of the wire segment.

Abstract: Described herein are a method and an apparatus for removing metal oxides from a substrate surface within a target area. In one particular embodiment, the method and apparatus has an energizing electrode which has an array of protruding conductive tips that are electrically connected by a conductive wire and separated into a first electrically connected group and a second electrically connected group wherein at least a portion of the conductive tips are activated by a DC voltage source that is negatively biased to generate electrons within the target area that attach to at least a portion of a reducing gas that is present in the target area to form a negatively charged reducing gas that contacts the treating surface to reduce the metal oxides on the treating surface of the substrate.

Abstract: The present invention relates to a device for supplying current to at least one silicon rod (3) during precipitation of silicon with the Siemens process, wherein the device has at least one input (E) suitable and configured for connecting the device to an electric power grid (N) for supplying electric energy, at least one output (A) to which the at least one silicon rod (3) can be connected, at least one AC current regulator (1) which is suitable and configured to supply the at least one silicon rod (3) connected to the at least one output (A) with electric current from the electric power grid (N), wherein the device further includes at least one frequency converter (2) which is suitable and configured to supply the at least one silicon rod (3) connected to the at least one output (A) with electric current from the electric power grid (N), wherein the electric current has a higher frequency than the current provided by the AC current regulator (1).

Abstract: Disclosed are methods for controlling molecular interactions where at least one member of a pair of chemical entities having a pH-dependent affinity is immobilized on the surface of an electrode. By changing the potential difference between the electrode and a counter electrode, the affinity of the pair of chemical entities is changed, changing the tendency of the pair to bind or to dissociate. Disclosed are also devices useful for implementing the methods of the present invention.

Abstract: In an anodic oxidation apparatus and an anodic oxidation method and a panel for a display device manufactured by them, a large target substrate is treated by a smaller component.

Abstract: A system, device, and method include a cell-powered first electronic device powered using electrical potential imposed across an electrolytic cell. The potential is voltage-boosted to accomplish this task. If the electrical potential imposed the cell is insufficient, the device can also be battery-powered. In any event, this device is in communication with one or more sensors in the electrolytic cell, as well as a second electronic device, and the first and second electronic devices wirelessly communicate. More specifically, the first electronic device wireless transmits data signals to the second electronic device, which receives the same. The first and second electronic devices are physically remote from one another, and they communicating over a private or public network, preferably using spread spectrum technology.

Abstract: In various embodiments, the present invention provides an electrolytic cell contact bar having a first pole and a pair of second poles. The second poles are opposite in charge to the first pole and each of the pair of second poles are adjacent to and parallel to the first pole. In various embodiments, the contact bar may include an electrode holder capable of holding at least one electrode.

Abstract: A continuous plating apparatus, when the number of the workpieces simultaneously transferred in the plating tank in a completely immersed state is N, (N+1) cathode relay members that extend in a workpiece transfer direction and (N+1) power supply units being provided outside the plating tank, anode terminals of the power supply units being connected to opposed anodes that are provided in the plating tank, cathode terminals of the power supply units being respectively connected to the cathode relay members so that power is supplied to each of the workpieces transferred in the plating tank from a corresponding power supply unit among the power supply units through a corresponding cathode relay member among the cathode relay members, and each of the power supply units being able to be controlled by constant current control when being transferred in the plating tank in a completely immersed state, by current gradual increase control when being carried into the plating tank in a partially immersed state, and by cu

Abstract: An improved method and apparatus is disclosed for producing a stable, non-toxic, antimicrobial electrolyzed saline solution with a broad range of anti-infective and therapeutic applications. The resulting solution is balanced to normal and hypertonic saline and has been shown to exhibit remarkable antimicrobial, antiviral and therapeutic characteristics. The nature of this solution makes it suitable for applications in food safety, animal health, agriculture and sterilization. The solution also exhibits a marked lack of toxicity upon intravenous, aspired, oral or topical application in mammals. The therapeutic applications represent a broad platform, possibly covering a variety of potential areas of use, including topical disinfection, antimicrobial application, wound treatment, oxidative stress reduction and enhancement of immune function to better detect malfunctioning cells.

Abstract: An electrolytic polishing method of a substrate having a barrier film and an interconnect metal layer on a surface to be processed under the presence of an electrolytic solution, including a barrier film electrolytic polishing process which removes the barrier film by applying a voltage between a cathode and an anode, with the surface to be processed serving as the cathode, and causing relative motion between the surface to be processed and a polishing pad which faces and makes contact with the surface to be processed.

Abstract: Although there are several inventions disclosed herein, the present application is directed to a reactor for electrochemically processing a microelectronic workpiece. The reactor comprises a movable electrode assembly that is disposed for movement along a motion path. The motion path includes at least a portion thereof over which the electrode assembly is positioned for processing at least one surface of the microelectronic workpiece. A cleaning electrode is located along the motion path of the movable electrode assembly. In one embodiment, a programmable controller is connected to direct the movable electrode assembly to move to the cleaning electrode during a cleaning cycle. At that time, the programmable controller connects the movable electrode assembly as an anode and the cleaning electrode as a cathode for cleaning of the movable electrode assembly.

Abstract: A flow-type laboratory scale ozonolysis apparatus (100) according to the invention comprises a reservoir (104), a n feed pump (102), a mixing element (120) with two inlets and an outlet, a reactor unit (110) and a pressure-adjusting means (160), all connected into a flow path. The ozonolysis apparatus (100) further comprises an ozone source (110), as well as a dispensing valve (112) transmitting a gas stream only in a single direction and installed between the ozone source (110) and one of the inlets of the mixing element (120). The feed pump (102) of the ozonolysis apparatus (100) according to the invention is a liquid pump generating a constant volume rate, the reservoir (104) contains at least the substance, as a solute, to be subjected to the ozonolysis reaction and the reactor unit consists of first and second reactor zones differing in function from one another. In the flow path, the outlet of the first reactor zone is connected to the inlet of the second reactor zone.

Abstract: A hydrogen generating apparatus according to an embodiment of the invention may include an electrolyte bath, which contains an electrolyte solution, and in an inside surface of which a first groove and a second groove are formed; a first electrode, which is coupled to the first groove with a predetermined distance from either end of the surface of the electrolyte bath, and which is configured to generate electrons; and a second electrode, which is coupled to the second groove with a predetermined distance from either end of the surface of the electrolyte bath, and which is configured to generate hydrogen using the electrons and the electrolyte solution. By using this hydrogen generating apparatus, the volume for holding the fuel can be increased, the gaps between electrodes can be reduced, and the circulation of water can be facilitated to increase the duration of the reactions.

Abstract: A fluid treatment device is disclosed. The fluid treatment device includes at least a first electrode and a second electrode in direct contact with the fluid. The fluid treatment device may include a control device which adjusts a parameter of an alternating potential difference provided between the first electrode and the second electrode based on the indication of the conductivity between the first electrode and the second electrode.

Abstract: Particles are trapped away from a wafer transport zone in a chamber. A first electrode is on one side of the zone. A second electrode is on an opposite side of the zone. A power supply connected across the electrodes establishes an electrostatic field between the electrodes. The field traps particles at the electrodes, away from the zone. For transporting the wafer from the chamber, the second electrode mounts the wafer for processing, and the first electrode is opposite to the second electrode defining a process space. The zone is in the space with a separate part of the space separating the zone from each electrode. Particles are urged away from the wafer by simultaneously terminating plasma processing of the wafer, connecting the second electrode to ground, applying a positive DC potential to the first electrode, and de-chucking the wafer from the second electrode into the zone.

Abstract: A hydrogen generating apparatus is disclosed, which can provide a constant amount of hydrogen regardless of its orientation. The hydrogen generating apparatus can include an electrolyte bath, which contains an electrolyte solution; a free-moving first electrode, which is positioned inside the electrolyte bath, and which generates electrons; a free-moving second electrode, which is positioned inside the electrolyte bath, and which receives the electrons to generate hydrogen; a spacer positioned between the first electrode and the second electrode; and a control unit, which is connected with the first electrode and the second electrode, to control an amount of electrons traveling from the first electrode to the second electrode.

Abstract: A method and apparatus for cleaning a wafer with a metal exposed through an insulator, through the use of a wet cleaning tank in concert with a feedback system on the potential difference between two leads of the wet cleaning tank. The cleaning tank has a bath in which the wafer and the two leads are immersed. The potential difference between the two leads is regulated when the feedback system detects a change in the potential across the two leads.

Abstract: To avoid voids in the metal layer in holes of printed circuit boards, a conveyorized plating line and a method for electrolytically metal plated printed circuit boards are proposed which provide measures for reducing an electric voltage that builds up between adjacent printed circuit boards being conveyed through the line.

Abstract: The system consists of two electrodes (1, 4), at least of dielectric layers (2, 3) in one of which (3) is crystallizing material or materials with a possible dielectric solvent, melt or combinations thereof, a voltage supply (5) and a closed circuit. In the invention it is used a dielectric polarization with a new method and an apparatus for the control of the crystallising of materials.

Abstract: An apparatus and method for electrochemical processing of microelectronic workpieces in a reaction vessel.

Abstract: A method for separating a metal-resin joint including the steps of: (1) immersing an article including a metal-resin joint with a counter electrode in an alkaline solution; and (2) applying a voltage over a certain time period between the metal portion of the joint and the counter electrode such that the potential of the metal portion is lower than that of a standard hydrogen electrode.

Abstract: An apparatus for electropolishing a conductive layer on a wafer using a solution is disclosed. The apparatus comprises an electrode assembly immersed in the solution configured proximate to the conductive layer having a longitudinal dimension extending to at least a periphery of the wafer, the electrode assembly including an elongated contact electrode configured to receive a potential difference, an isolator adjacent the elongated contact electrode, and an elongated process electrode adjacent the isolator configured to receive the potential difference, a voltage supply is configured to supply the potential difference between the contact electrode and the process electrode to electropolish the conductive layer on the wafer.

Abstract: A machine for electrochemically polishing indentations within the wall of an aluminum workpiece, such as a wheel, has a cathode attached to an upper platen. The workpiece is mounted upon a lower platen which acts as an anode. Electrolyte is passed between the cathode and the anode while simultaneously a current is applied which passes through the cathode and the anode. The current is selectively pulsed to maximize polishing but at the same time to permit the flushing away of residual material and to cool the cathode and the workpiece.

Abstract: Hydrogen generating apparatus and fuel cell power generation system. Hydrogen generating apparatus includes an electrolyzer, which is filled with an aqueous electrolyte solution, a first electrode, which is accommodated in the electrolyzer, submerged in the aqueous electrolyte solution, and generates electrons, a second electrode, which is accommodated in the electrolyzer, submerged in the aqueous electrolyte solution, receives the electrons to generate hydrogen, and a controller, which is located between the first electrode and the second electrode, and controls an amount of electrons flowing from the first electrode to the second electrode for a period of time. Different from the conventional method of generating hydrogen by a certain quantity, the quantity of generated hydrogen can be controlled by controlling the amount of current flowing between electrodes according to a user or a fuel cell.

Abstract: An apparatus providing programmable illumination pattern generation for the manipulation of colloidal particulates and biomolecules in suspension between electrodes, is disclosed. The apparatus implements LEAPS (Light-controlled electrokinetic assembly of particles near surfaces), which relies on: AC electric field-induced assembly of particles: the patterning of the electrolyte/silicon oxide/silicon interface to exert spatial control over the assembly process; and the real-time control of the assembly process via external illumination. The apparatus generates patterns of illumination and projects them onto planar surfaces. i.e., a LEAPS electrode.

Abstract: Systems and methods for plating and/or etching of hard-to-plate metals are provided. The systems and methods are designed to overcome the deleterious effect of superficial coating or oxide layers that interfere with the plating or etching of certain metal substrates. The systems and methods involve in situ removal of coating materials from the surfaces of the metal substrates while the substrates are either submerged in plating or etching solutions, or are positioned in a proximate enclosure just prior to submersion in the plating or etching solutions. Further, the substrates can be in contact with a suitable patterning mask to obtain patterned oxide-free regions for plating or etching. This in situ removal of coating layers may be achieved by pulse heating or photoablation of the substrate and the inhibiting coating layers. Electrical energy or laser light energy may be used for this purpose. Additionally or alternatively, the coating materials may be removed by mechanical means.

Abstract: A water fueled engine, which purifies, heats and cracks water into its constituent elements in gaseous form, stores the hydrogen and oxygen separately under pressure, feeds the hydrogen to a combustion engine where it is reacted in the presence of atmospheric air, transferring the heat generated from the reaction to a water heater and torque energy to a drive shaft; an after burner that further reacts the exhaust process of the combustion engine in the presence of more atmospheric air and oxygen from the cracking process, and a turbine that drives a battery connected alternator for powering a control unit for the system, which controls all system components to ensure on demand operation.

Abstract: An electrochemical gas generator is provided with an electrolysis cell (1) with a housing, which is closed by a gas-permeable membrane (2) for the escape of the test or calibrating gas. A cathode (5) is provided formed of a noble metal, a mixture of noble metals or a material containing carbon. The cathode is in direct contact with an electrolyte (7) disposed in the housing. An anode (4) is provided formed of a noble metal, a mixture of noble metals or a material containing carbon. The anode is in direct contact with an electrolyte (7). The electrolyte (7) contains a carboxylic acid salt. A control unit (6) is provided that acts as a current source and which is connected to the electrodes (4, 5).

Abstract: The object of the present invention is to provide a nano-scale molecular assembly such as a conductive nano-wire. Specifically, there is provided an electrolytic apparatus for forming a molecular assembly, including two electrodes and an electrolytic cell holding an electrolyte and the two electrodes, wherein the gap between the two electrodes is from 1 nm to 100 ?m, by allowing the electrolytic cell to hold an electrolyte containing molecules that is to constitute the molecular assembly, and applying a voltage across the two electrodes in the state wherein the electrolyte and the two electrodes are in contact.

Abstract: There are provided a water treating method and water treating apparatus which can significantly improve an effect of eliminating microorganisms contained in water intended for drinking and cooking or waster water and a hydroponics system using the apparatus.

Abstract: An electrochemical gas generator is provided including an electrolysis cell (1) with a gas-impermeable housing, which is closed by a gas-permeable membrane (2) for the discharge of the test gas or calibrating gas CO. A chemically inert cathode (5) formed of a noble metal, a mixture of noble metals or a material containing carbon, is in direct contact with an electrolyte (7). An anode (4) formed of a noble metal, a mixture of noble metals or a material containing carbon, is in direct contact with a mesoxalic acid salt, the mesoxalic acid salt being in direct contact with the electrolyte (7). A control unit (6) is provided that also acts as a power source and is connected to the electrodes (4, 5).

Abstract: A method for forming alignment films in LCDs includes forming a conductive film on an LCD substrate, forming an inorganic alignment film on the conductive film, and etching the alignment film with an etching apparatus that includes a nozzle that sprays a plasma at atmospheric pressure onto a surface of the alignment film without using a mask pattern so as to form an etched region in the alignment film that exposes a portion of the underlying conductive film therethrough. The novel method enables LCD alignment films having sharp thickness profiles to be patterned easily and accurately, reduces the time required to manufacture LCDs, and minimizes the number of devices required to manufacture the LCDs.

Abstract: The invention provides an apparatus and a method for achieving reliable, consistent metal electroplating or electrochemical deposition onto semiconductor substrates. More particularly, the invention provides uniform and void-free deposition of metal onto metal seeded semiconductor substrates having sub-micron, high aspect ratio features. The invention provides an electrochemical deposition cell comprising a substrate holder, a cathode electrically contacting a substrate plating surface, an electrolyte container having an electrolyte inlet, an electrolyte outlet and an opening adapted to receive a substrate plating surface and an anode electrically connect to an electrolyte. Preferably, a vibrator is attached to the substrate holder to vibrate the substrate in at least one direction, and an auxiliary electrode is disposed adjacent the electrolyte outlet to provide uniform deposition across the substrate surface.