Abstract: A fixture for locating a straight edge of a curved surface of a part and holding the part in a fixed position during performance of a machining operation on the straight edge is described. The fixture includes: one or more supports for seating a convex curved surface of the part, one or more detachable end stops arranged to extend in a plane orthogonal to that in which the supports sit and against which, in use, the straight edge can be aligned, and a clamp arranged, in use, to push the convex curved surface against the supports such that the straight edge contacts the supports without obstruction of the straight edge.

Abstract: A multipurpose desk system assembly and an associated method of assembling the desk system are disclosed. The desk system assembly may include a top panel assembly and a base support system configured with clamping devices for convenient assembly. The desk system assembly may comprise multiple top panel assemblies and can be configured to be readily converted or customized to fit the needs of an end user.

Abstract: Embodiments of showerheads having a detachable gas distribution plate are provided herein. In some embodiments, a showerhead for use in a semiconductor processing chamber may include a base having a first side and a second side opposing the first side; a gas distribution plate disposed proximate the second side of the base, wherein the gas distribution plate is formed from a material having an electrical resistivity between about 60 ohm-cm to 90 ohm-cm; a clamp disposed about a peripheral edge of the gas distribution plate to removably couple the gas distribution plate to the base; and a thermal gasket disposed in a gap between the base and gas distribution plate.

Abstract: An electroplating system and components thereof facilitate an efficient electroplating process which in part reduces or eliminates the number of clips used on electroplating racks. Some electroplating racks may use skewers on which multiple plastic pieces are typically mounted. The plastic pieces may also be configured to be joined to form an assembly which is mounted on an electroplating rack. The configurations help reduce the time spent loading and unloading pieces on the racks.

Abstract: A supply of metal parts are electroplated by progressively transferring the parts with a computer controlled robot into a series of open top tanks containing solutions. The tanks have submerged metal fixtures which temporarily support the parts, and each fixture in the electroplating tank is individually connected to a direct current power source through a corresponding timer switch controlled by the computer so that each part is plated for a precise time period independently of the time the part remains in the plating solution. Each fixture is coated with an insulation material and has a base with metal contact with a removable fixture member having limited metal line contact with the supporting part. A plurality of electroplating lines each include the above components, and common tanks in the lines receive an electroplating solution recirculated through a common filter and service tank where the solution is heated and controlled.

Abstract: Embodiments of a closed-contact electroplating cup assembly that may be rapidly cleaned while an electroplating system is on-line are disclosed. One disclosed embodiment comprises a cup assembly and a cone assembly, wherein the cup assembly comprises a cup bottom comprising an opening, a seal surrounding the opening, an electrical contact structure comprising a plurality of electrical contacts disposed around the opening, and an interior cup side that is tapered inwardly in along an axial direction of the cup from a cup top toward the cup bottom.

Abstract: The present invention is to provide a substrate holder which can effect a more complete sealing with a sealing member and makes it possible to take a substrate out of the substrate holder easily and securely, and also a plating apparatus provided with the substrate holder. The substrate holder includes: a fixed holding member and a movable holding member for holding a substrate therebetween; a sealing member mounted to the fixed holding member or the movable holding member; and a suction pad for attracting a back surface of the substrate held between the fixed holding member and the movable holding member.

Abstract: A carrier provides the ability to perform wet chemical processing on substrates using low cost equipment inspired by the electroplating methods typically utilized in leadframe-based semiconductor packaging or printed circuit board industries. Two frame pieces are mated together to form the carrier which enables transport of at least one substrate through wet chemical processing and includes a non-conductive frame with an exposed conductive flange to allow electrical coupling with processing equipment. Electrical contacts within the non-conductive frame make contact with the at least one substrate and are coupled to the conductive flange allowing an electrical potential to develop across the substrate while undergoing processing within the electroplating equipment.

Abstract: A cylinder block plating apparatus preplates or plates a cylinder bore of each cylinder in a cylinder block of a multi-cylinder engine using a process liquid introduced into the cylinder bore in a condition of sealing an end of the cylinder bore when a communication hole is formed at the end of the cylinder bore, the cylinder block plating apparatus includes a sealing jig including a sealing unit including a cylinder bore seal for sealing the end of an inner peripheral surface of the cylinder bore and a communication hole seal for sealing a portion, near a communication hole, opposite to the cylinder inner peripheral surface, and a clamping unit disposed in the sealing unit to be pushed open and adapted to cause the communication hole seal to seal the portion located on the opposite side of the cylinder bore near the communication hole.

Abstract: The present invention is to provide a substrate holder which can effect a more complete sealing with a sealing member and makes it possible to take a substrate out of the substrate holder easily and securely, and also a plating apparatus provided with the substrate holder. The substrate holder includes: a fixed holding member and a movable holding member for holding a substrate therebetween; a sealing member mounted to the fixed holding member or the movable holding member; and a suction pad for attracting a back surface of the substrate held between the fixed holding member and the movable holding member.

Abstract: A rack apparatus (100) includes a frame (10), a plurality of supporting members (106), and a plurality of retaining members (12). The supporting members are arranged/mounted on/to the frame. The retaining members are mounted on the supporting members. Each retaining member includes a fixing piece (120) and two supporting pieces (122, 124). The fixing piece has a notched mounting portion. The two supporting pieces are respectively positioned at an opposite side of the fixing piece. Each supporting piece forms a retaining portion (i.e., a through hole therein). The notched mounting portion and the retaining portions together help retain a workpiece within a given retaining member.

Abstract: A substrate holding and transporting assembly is disclosed. The substrate holding and transporting assembly includes a base plate and a pair of clamps connected to the base plate in a spaced apart orientation, the spaced apart orientation of the pair of clamps enable support of a substrate with at least two independent points. The substrate holding and transporting assembly also includes an electrode assembly connected to the base plate at a location that is substantially between the pair of clamps. The electrode assembly defined to impart an electrical contact to the substrate when present and held by the pair of clamps.

Abstract: A method and apparatus for retaining a workpiece against a workpiece holder are described. A flexible member can be used to provide a substantially uniform force to securely retain the workpiece, which can allow the workpiece to be consistently positioned in a process module. In one detailed embodiment, a barrier to fluid entry is formed between the workpiece and a ring for retaining the workpiece against a workpiece holder. This provides a reliable seal during fluid processing to prevent fluid from reaching the underside of a workpiece. In various embodiments, the workpiece holder can be used to align a workpiece in a process module or to hold one or more workpieces in a configuration that allows for higher throughput.

Abstract: The invention provides an improved contact ring and an improved workpiece support, each of which is useful alone or jointly with the other in a workpiece holder for electrochemically treating microelectronic workpieces. Several embodiments of the invention provide a composite contact ring having a dielectric base carrying a conductor which delivers electric power to a microelectronic workpiece. The dielectric base may be rigid and define a plurality of rigid fingers, each of which carries a separate electrical contact of the conductor. Such a contact ring is expected to have a long service life and enhance uniformity of electrochemical treatment. Several embodiments of the invention provide a workpiece support which induces a control the flexure of a microelectronic workpiece without damaging the workpiece. This controlled flexure can ensure more uniform contact between the workpiece and a contact assembly despite variations in the workpiece and/or the contact assembly.

Abstract: The present invention is to provide a substrate holder which can effect a more complete sealing with a sealing member and makes it possible to take a substrate out of the substrate holder easily and securely, and also a plating apparatus provided with the substrate holder. The substrate holder includes: a fixed holding member and a movable holding member for holding a substrate therebetween; a sealing member mounted to the fixed holding member or the movable holding member; and a suction pad for attracting a back surface of the substrate held between the fixed holding member and the movable holding member.

Abstract: A system and method increase yield from semiconductor wafer electroplating. The aspects include a semiconductor wafer, the semiconductor wafer comprising a plurality of die areas. A plating ring for holding the semiconductor wafer in position during electroplating is also included, the plating ring substantially surrounding a circumference of the semiconductor wafer and having a width that varies in order to avoid overlap near edge die areas of the semiconductor wafer.

Abstract: A frame for holding sheet material taut comprises a support as well as two legs which extend essentially parallel to one another transversely from the support, on which legs fixing elements are provided for fixing, in each case, one of the opposing edges of a piece of sheet material thereto. At least one of the legs can be moved along the support towards and away from the other leg. Furthermore compensation elements are provided for compensating for stretch and/or shrinkage of the piece of sheet material fixed between the legs.

Abstract: A system for use in manufacturing semiconductor devices, is provided. The system includes an electrochemical processing tool and an image sensor. The electrochemical processing tool includes an electrode located at a central region of a platen. The electrode is adapted for contacting a wafer workpiece during certain processing of the wafer workpiece using the tool. At least part of the electrode is viewable from above the platen when the electrochemical processing tool is operably assembled. The image sensor is capable of capturing an image of the viewable part of the electrode. The image sensor is positioned above the platen. The image sensor is adapted to be aimed at the electrode when an image of the electrode is to be taken with the image sensor.

Abstract: Contact assemblies for electrochemical processing of microelectronic workpieces. The contact assembly (400) can comprise a support member (410) that includes an inner wall (412) which defines an opening (414) configured to receive the workpiece and a plurality of contacts (420). The individual contacts (420) include a conductor (440) and a cover (430). The conductor (440) can comprise a proximal section (435) projecting inwardly into the opening (414) relative to the support member (410), a distal section (436) extending from the proximal section (435), and an inert exterior (444) at least at the distal section (436). The cover (430) comprises a dielectric element that covers at least the proximal section of the conductor, but does not cover at least a portion of the distal section of the core. The exposed portion of the distal section of the core, accordingly, defines a conductive contact site for contacting a conductive layer (e.g., a seed layer) on the workpiece.

Abstract: A contact ring for an electrochemical plating system is provided. The contact ring includes an annular substrate supporting member, a plurality of radially positioned conductive substrate contact pins extending from the substrate supporting member, an annular conductive thief element attached to the substrate supporting member, and at least one source of electrical power in electrical communication with the contact pins and the conductive thief element.

Abstract: On a fixture for electro-chemical machining for the production of long, curved cavities (11) in a component (12), the working electrode (3) of the electro-chemical machining tool (1) is connected to a guide body (1a) which moveably rests against the inner walls of the respective cavity by means of power-actuated guide elements (2), with the guide body being connected to a flexurally soft and torsionally stiff guide linkage (5) coupled to a feed and rotary drive. Control of the movement of the guide body is accomplished in dependence of at least one wall thickness measured with a measuring device (13, 14) during feed movement.

Abstract: The present invention provides improvements in methods for the manufacture of stents. Specifically, the invention provides methods wherein stents are placed on jigs of various designs which facilitate manufacture, stents carried by the jigs are immersed in liquid baths which contain an electrolyte, the stents are urged into contact with their associated electrodes while current is applied to those electrodes, and wherein the positions of contact between the stents and their respective electrodes are altered during processing without removing the stents from the jig. The method is applicable for electropolishing and electro-plating.

Abstract: A carrier for use in processing of a plurality of wafers or other substrates includes a support frame on which the wafers are mounted and in one embodiment at least one auxiliary frame for holding the substrates on the support frame. A plurality of clips extend from the auxiliary frame and engage the substrates in pressure engagement, and fasteners retain the auxiliary frame in position with respect to the support frame. In one embodiment two auxiliary frames can be employed for holding wafers on opposing surfaces of the support frame. The support frame has electrically non-conducting surfaces whereby the processing does not affect the support frame, and the auxiliary frame is made of electrically non-conductive material. The clips are electrically conductive and bridge current from the support frame to the wafers during plating operations. In another embodiment, auxiliary frame are not used and the wafer retention clips are mounted on the support frame.

Abstract: A processing rack, such as for electroplating, which minimizes shelf areas of an article during processing of the article and during removal of the article from a processing bath and which allows easy mounting of articles on the rack and demounting of articles from the rack includes a frame and a plurality of article mounting fixtures that are each pivotally mounted on the frame and independently pivotable from a first orientation that facilitates mounting and/or demounting of articles, to a second orientation that is most conducive to producing high quality, substantially defect-free plating.

Abstract: An apparatus for securing a substrate in an electrochemical deposition system is provided. The apparatus generally includes a substrate support member adapted to receive the substrate and a thrust plate assembly adapted to exert a downward force on the substrate. For some embodiments, a first sealing member adapted to engage a plating surface of the substrate may be attached to the substrate support member. The apparatus may also include a second sealing member adapted to engage a non-plating surface of the substrate or a surface of the substrate support member to prevent the flow of plating fluid to a non-plating surface of the substrate. The apparatus may also include electrical contacts to electrically contact the plating or non-plating surface of the substrate.

Abstract: Contact assemblies for electrochemical processing of microelectronic workpieces. The contact assemblies can comprise a support member that includes an inner wall which defines an opening configured to receive the workpiece and a plurality of contacts. The individual contacts include a conductor and a cover. The conductor can comprise a proximal section projecting inwardly into the opening relative to the support member, a distal section extending from the proximal section, and an inert exterior at least at the distal section. The cover comprises a dielectric element that covers at least the proximal section of the conductor, but does not cover at least a portion of the distal section of the core. The exposed portion of the distal section of the core, accordingly, defines a conductive contact site for contacting a conductive layer (e.g., a seed layer) on the workpiece.

Abstract: Contact assemblies, electroplating machines with contact assemblies, and methods for making contact assemblies that are used in the fabrication of microelectronic workpieces. The contact assemblies can be wet-contact assemblies or dry-contact assemblies. A contact assembly for use in an electroplating system can comprise a support member and a contact system coupled to the support member. The support member, for example, can be a ring or another structure that has an inner wall defining an opening configured to allow the workpiece to move through the support member along an access path. In one embodiment, the support member is a conductive ring having a plurality of posts depending from the ring that are spaced apart from one another by gaps. The contact system can be coupled to the posts of the support member. The contact system can have a plurality of contact members projecting inwardly into the opening relative to the support member and transversely with respect to the access path.

Abstract: Contact assemblies, electroplating machines with contact assemblies, and methods for making contact assemblies that are used in the fabrication of microelectronic workpieces. The contact assemblies can be wet-contact assemblies or dry-contact assemblies. A contact assembly for use in an electroplating system can comprise a support member and a contact system coupled to the support member. The support member, for example, can be a ring or another structure that has an inner wall defining an opening configured to allow the workpiece to move through the support member along an access path. In one embodiment, the support member is a conductive ring having a plurality of posts depending from the ring that are spaced apart from one another by gaps. The contact system can be coupled to the posts of the support member. The contact system can have a plurality of contact members projecting inwardly into the opening relative to the support member and transversely with respect to the access path.

Abstract: The invention relates to a transverse conveyor for electrodes used in the production of metals. This transverse conveyor consists of a transfer device, located below the electrodes to be transferred and which device moves back and forth on a horizontal plane, as well as of lifters used for lifting the electrodes. The transfer device consists of a frame, on which there is a moving transfer bar, which is designed to cover the frame at all stages of its movement.

Abstract: The invention relates to a device for at least partly removing a deposit created in the electrolytic refining or electrowinning of metal from the surface of the mother plate used as an electrode in the refining or electrowinning process, said device comprising at least one member for removing the deposit and at least one member for controlling the removal member with respect to the deposit to be removed. According to the invention, the device comprises at least one gripping element that is used for creating a mechanical contact between the deposit and the removal member, said gripping element being connected to a control member, to which there are coupled both the shaft part of the gripping element and the deposit removal member.

Abstract: An electroplating apparatus for wheel disk comprises an electrolytic cell containing electrolytic bath, a cathode plate, an auxiliary anode, at least one anode plate and a driving mechanism. Part of the auxiliary anode is provided with an insulating shielding, one end of the insulating shielding passes through the center hole of the disk wheel. Part of the auxiliary anode is exposed on both sides of the wheel disk. Therefore, the auxiliary anode forms a dual anodes scheme with the anode plate to provide complete and smooth plating. The wheel disk is rotated by the driving mechanism to prevent tip-discharging.

Abstract: The invention relates to a substrate carrier for holding substrates, especially semiconductor wafers. Good sealing of the wafer surface and electrical contact are made possible in that the substrate carrier has a first and a second part having a central opening matching the form of the substrate, wherein the substrate is received between the first and the second part and a peripheral seal having at least one undercut is provided in the inner periphery of the second part.

Abstract: A method for multilayered coating, whereby hurdles for the item that is to be treated are guided for galvanic dip coating (2) through in a separate circuit. Downstream from the tank, the hurdles are changed over (12) and the item that is to be treated is guided in another hurdle for electrophoretic coating through a tank (4) in another separate circuit.

Abstract: An electrical contact element for electrically connecting an electric device and providing current transmission in an electric device wherein the electrical contact element comprises a metallic body, and wherein at least one contact surface, present on the body, is completely or partially coated with a friction-reducing layer. The friction-reducing layer comprises a metal salt.

Abstract: A plating clamp assembly for use with a plating system including a plating bath and an article transport assembly to selectively engage an article to be plated as the article is moved through the plating bath by the article transport assembly to coat at least a selected portion of the surface of the article with material without creating faults on the selected portion of the surface of the article.

Abstract: A workholder for an ECM process comprises a set of jaws which define an interior workpiece holding region are mounted on the surface of a diaphragm which is movable under air pressure from a flat to a more generally spheroid shape with the injection of pressurized air between the diaphragm and a backing plate. As the air is injected, and the diaphragm becomes more spheroid, the jaws are moved a substantially equal distance away from the center axis of the workholding region. The workpiece, which typically incorporates or is mounted on a circular shaft, is placed in the center of the workholding region, and the air pressure is removed, causing the diaphragm to return to its original flat shape and the jaws to snap back to their original positions resting against the shaft.

Abstract: A lift and rotate assembly for use in a workpiece processing station. The lift and rotate assembly includes a body having a slim profile and pins located on opposite sides for mounting the assembly onto a tool frame. The lift and rotating assembly further includes a rotating mechanism coupling a processing head to the body, and for rotating the process head with respect to the body. The rotating mechanism includes a motor, wherein the motor is located within the processing head and the shaft of the motor is coupled to and rotationally fixed with respect to the body. The lift and rotate assembly further includes a lift mechanism for lifting the process head with respect to the body. A cable assembly within the lift and rotate assembly includes a common cable loop for feeding additional length of cable along both the lift direction and the rotational direction of movement.

Abstract: The invention concerns a motorized device for adjusting the interelectrodic gap in mercury cathode electrolysis cells, mainly consisting of a frame, to which a number of anodes are suspended, movable in the vertical direction by means of a single jackscrew driven by a gear motor acting on double levers. The jackscrew with the motor and the lever system are fixed to a main frame, supported on the cell bottom by means of supports positioned on adjustable columns, while the above mentioned movable frame (also called sub-frame) carrying the anodes, is connected to the lever arms by means of four hinged supports.

Abstract: A holding clamp device, for releasably holding a thick planar article over ground, comprising: an elongated main arm member, defining first and second opposite end portions; a pair of first and second tubular bar members, each defining an outer end portion and an opposite inner end portion; a rail member, integral to an intermediate section of the main arm member and slidably engaged by the second bar member inner end portion, wherein the second bar member is maintained by the rail member parallel to the first bar and wherein the second bar member is movable relative to the first bar member while continuously remaining parallel thereto; a first biasing member, continuously biasing the first and second bar members toward one another; and a second biasing member, for discretely biasing the second bar member away from the first bar member, against the continuous bias of the first biasing member.

Abstract: An apparatus for electroplating a workpiece is disclosed in which the apparatus includes a workpiece holding structure. The workpiece holding structure includes a workpiece support having at least one surface that is disposed to engage a front side of the workpiece and at least one electrical contact disposed for contact with at least one corresponding electrical contact on a back-side of the workpiece. The workpiece includes one or more electrically conductive paths between the at least one corresponding electrical contact and a front-side of the workpiece to facilitate electroplating of the front-side surface.

Abstract: A lift and rotate assembly for use in a workpiece processing station. The lift and rotate assembly includes a body having a slim profile and pins located on opposite sides for mounting the assembly onto a tool frame. The lift and rotating assembly further includes a rotating mechanism coupling a processing head to the body, and for rotating the process head with respect to the body. The rotating mechanism includes a motor, wherein the motor is located within the processing head and the shaft of the motor is coupled to and rotationally fixed with respect to the body. The lift and rotate assembly further includes a lift mechanism for lifting the process head with respect to the body. A cable assembly within the lift and rotate assembly includes a common cable loop for feeding additional length of cable along both the lift direction and the rotational direction of movement.

Abstract: A rack suitable for holding a flexible substrate panel, the rack having a plurality of clamps for providing current to a panel clamped to the rack, the clamps being positioned to uniformly distribute current to the substrate. Seven clamps are used to hold a flexible substrate panel bearing a copper seed or other conductive layer in place on the rack wherein one tautens the substrate while attaching the clamps so as to clamp the substrate in a “wrinkle free” manner. The seven clamps are arranged with 3 clamps on each of the left and right sides and one clamp on the bottom, the clamps making electrical contact with conductive layers of both the front and back surfaces of the substrate panel. The arrangement of the clamps provides adequate support to the substrate, provides for a good and uniform current distribution on the substrate, and allows a relatively large amount of current to flow through the panel without burning off the conductive/seed layers.

Abstract: A lift and rotate assembly for use in a workpiece processing station. The lift and rotate assembly includes a body having a slim profile and pins located on opposite sides for mounting the assembly onto a tool frame. The lift and rotate assembly is removably and pivotally mounted to an exposed outer surface of the frame. The lift and rotate assembly has a body, a process head movably connected to the body, and control components mounted within the body and configured to move the process head relative to the body. The lift and rotate assembly in one embodiment is positionable in a forward, operating position with the body adjacent to the frame, and in a tilted, service position with the body tilted away from the frame.

Abstract: A holding clamp device, for releasably holding a thick planar article over ground, comprising: an elongated main arm member, defining first and second opposite end portions; a pair of first and second tubular bar members, each defining an outer end portion and an opposite inner end portion; a rail member, integral to an intermediate section of the main arm member and slidably engaged by the second bar member inner end portion, wherein the second bar member is maintained by the rail member parallel to the first bar and wherein the second bar member is movable relative to the first bar member while continuously remaining parallel thereto; a first biasing member, continuously biasing the first and second bar members toward one another; and a second biasing member, for discretely biasing the second bar member away from the first bar member, against the continuous bias of the first biasing member.

Abstract: The invention relates to a holder to be used during the stripping of a metal deposit produced on the surface of a mother plate in electrolytic refining, which mother plate has a supporting bar (12) fixed at one edge of the plate for supporting the mother plate during the stripping (16), and an edge strip (10) at least on the edge opposite to where the supporting bar (12) is fixed. According to the invention the holder (1) has at least one pressing member (4), so that during the stripping (16) the metal deposit (15) is pressed by the pressing member (4) in order to make a contact between the deposit (15) and the pressing member (4) close to the edge strip (10) installed on the edge opposite to where the supporting bar (12) is fixed.