Abstract: The disclosure provides a machining program generating device of a wire discharge machine, a machining program generating method, a wire discharge machining system and a machined object manufacturing method. The machining method of the wire discharge machine of the disclosure includes: a processing of forming and machining a claw part on at least one of a machining path of a machining groove and a machining path of a dividing line for dividing a core that forms an inner part of a workpiece separated by the machining groove; and a processing of separating the core from the workpiece by dividing at the dividing line.

Abstract: An electroplating system includes a tank functioning as an anode, wherein the tank is configured in a horizontal orientation having a length greater than its height, a component part disposed within the tank and functioning as a cathode, an electrical connection, coupled to the anode and cathode, for providing an electric current, and a supply line for delivering an electrolytic fluid to within the tank.

Abstract: The invention relates to a carrying device (2) for receiving pipeline elements (4) in a surface coating installation, having a main body (6), an attachment section (28) which is formed on the main body (6) and which serves for the attachment of the carrying device (2) to a ceiling-mounted conveying mechanism, and multiple cantilevers (8) extending laterally from the main body (6). Each cantilever (8) has arranged thereon a receptacle (10) with support feet (12, 12?) arranged in pairwise fashion and spaced apart from one another, wherein the support feet (12, 12?) are configured to come into contact with in each case one outer wall section of a pipeline element (14) in order to hold the pipeline element (14) between the support feet (12, 12?).

Abstract: An electrode holder and a method for producing an electrode for an aluminum electrolytic capacitor are provided that enable prevention of exfoliation of a porous layer during chemical formation even when the porous layer is formed on an aluminum electrode so as to have a thickness of 200 micrometers or greater. When an aluminum electrode 10 having at least one surface 11 on which a porous layer 17 having a thickness of 200 micrometers or greater is formed is subjected to chemical formation in a chemical formation solution, the aluminum electrode 10 is held by an electrode holder 50. The electrode holder 50 includes: an insulating first support plate 51 configured to overlap the one surface 11 of the aluminum electrode 10; an insulating second support plate 52 configured to overlap the other surface 12 of the aluminum electrode 10; and a connecting part 53 configured to connect the first support plate 51 and the second support plate 52 to each other.

Abstract: A electrode frame having the first frame group covered the first conductive frame strip, and the first conductive frame strip has first frame strip conductive component and multiple first substrate conductive components; the second frame group covered the second conductive frame strip, and the second conductive frame strip has second frame strip conductive component and multiple second substrate conductive components; when the first frame group and the second frame group are combined, above mentioned components are all electrically connected; the conductive hanger conducts electricity to the inner frame strips, then conducts electricity to the first and second substrate conductive components, and the substrate conductive components separately electrically connect to lateral side of the substrate for making the electric current conduct uniformly on the both lateral side and the surrounding of the substrate.

Abstract: A simulation apparatus of a wire electric discharge machine that performs machining to cut out a core from a workpiece calculates a position and a length of a welding part used to weld the core to the workpiece, calculates an evaluation value of the position and the length, and performs machine learning of the adjustment of the position and the length. In the machine learning, the position and the length of the welding part and the evaluation value are acquired as state data, a reward is calculated based on the state data and calculated reward conditions, and the machine learning of the adjustment of the position and the length of the welding part is performed using the calculated reward.

Abstract: A device is for treating and packaging implants. The device includes a container including a chamber therein. The chamber is closed by a removable seal. The device also includes a carrier sized and shaped to be inserted into the chamber. The carrier includes a carrying structure configured to connect an implant thereto. A portion of the carrier may be formed of an electrically conductive material.

Abstract: An anode unit capable of forming a metal film having a uniform thickness on a substrate is disclosed. The anode unit includes an anode, a first feeding portion connected to a central portion of the anode, a second feeding portion located on a central axis of the anode and located away from the anode, and arms extending radially from the second feeding portion. The arms are connected to a periphery of the anode.

Abstract: One embodiment relates to a substrate carrier for use in electroplating a plurality of substrates. The substrate carrier comprises a non-conductive carrier body on which the substrates are to be held. Electrically-conductive lines are embedded within the carrier body, and a plurality of contact clips are coupled to the electrically-conductive lines embedded within the carrier body. The contact clips hold the substrates in place and electrically couple the substrates to the electrically-conductive lines. The non-conductive carrier body is continuous so as to be impermeable to flow of electroplating solution through the non-conductive carrier body. Other embodiments, aspects and features are also disclosed.

Abstract: An electroplating system and components thereof facilitate an efficient electroplating process which in part reduces or eliminates the number of clips used on electroplating racks. Some electroplating racks may use skewers on which multiple plastic pieces are typically mounted. The plastic pieces may also be configured to be joined to form an assembly which is mounted on an electroplating rack. The configurations help reduce the time spent loading and unloading pieces on the racks.

Abstract: An apparatus for anodizing substrates immersed in an electrolyte solution. A substrate holder mounted in a storage tank includes a first support unit having first support elements for supporting, in a liquid-tight condition, only lower circumferential portions of the substrates, and a second support unit attachable to and detachable from the first support unit and having second support elements for supporting, in a liquid-tight condition, remaining circumferential portions of the substrates. A drive mechanism separates the first support unit and the second support unit when loading and unloading the substrates, and for connecting the first support unit and the second support unit after the substrates are placed in the substrate holder.

Abstract: Disclosed is a segmented contact bar for use boarding an electrolytic cell. The segmented contact bar has contact pieces made of electrically conductive material and being in spaced apart relation along the capping board, each of the contact pieces defining a segment for supporting and electrically connecting an anode and a cathode in the electrolytic cell. The segmented contact bar also has connection members including an insulating material and provided in between pairs of adjacent segments for providing insulating interconnection of the segments. There is also an electrolytic refining apparatus including adjacent electrolytic cells; a capping board positioned on the adjacent electrolytic cells; anodes and cathodes extending in spaced apart alternate positions into the each of the adjacent electrolytic cells along the capping boards; and a segmented contact bar.

Abstract: A semiconductor wafer holder includes first and second holding members between which a semiconductor wafer is held. The second holding member includes a second conductive element placed in contact with a first conductive element of the first holding member and the semiconductor wafer. A ring clamp is used to press the second holding member against the first holding member for holding of the semiconductor wafer.

Abstract: Some embodiments relate to a rack for coating components. The rack includes a horizontal top bar and a horizontal bottom bar. A first side bar electrically connects the horizontal top bar with the horizontal bottom bar and a second side bar electrically connects the horizontal top bar with the horizontal bottom bar. The horizontal bottom bar and the horizontal top bar are configured to be connected to the components, and the horizontal bottom bar is configured to be electrically connected to the components.

Abstract: A production line includes a number of production units, production equipments and a sliding bracket. The sliding bracket slides between the production units. Each production unit includes at least one base unit which is made in series. The at least one base unit has an enclosure. The sliding bracket and the production equipment are received in the enclosure. The production units are arranged in a configuration such as straight line, U-shaped or rectangular.

Abstract: A support mechanism used in an electro plasma polishing process includes a support beam, a first electrically conducting assembly, and a second electrically conducting assembly. The first electrically conducting assembly and the second electrically conducting assembly are mounted on the support beam. The first electrically conducting assembly is electrically insulated from the second electrically conducting assembly.

Abstract: A device and a method for chemically or electrolytically treating work pieces (1) are proposed in an effort to avoid irregular contours of finest conductive structures, pads and lands as well as bridges (shorts) on the one side or breaks on printed circuit boards on the other side. The device comprises processing tanks (2) for the treating of work pieces and a conveyor system for the transport thereof. The conveyor system comprises at least one transport carriage (18), at least one holding element (14, 25) and at least one connection means (12, 13, 35) between the transport carriage(s) and the holding element(s). The processing tanks adjoined with a clean room zone (3). The work pieces are conveyed through the clean room zone using the conveyor system.

Abstract: One embodiment relates to a substrate carrier for use in electroplating a plurality of substrates. The substrate carrier comprises a non-conductive carrier body on which the substrates are to be held. Electrically-conductive lines are embedded within the carrier body, and a plurality of contact clips are coupled to the electrically-conductive lines embedded within the carrier body. The contact clips hold the substrates in place and electrically couple the substrates to the electrically-conductive lines. The non-conductive carrier body is continuous so as to be impermeable to flow of electroplating solution through the non-conductive carrier body. Other embodiments, aspects and features are also disclosed.

Abstract: A holder is devised for holding a workpiece to be electroplated. The holder includes a shell, a cover and a conducting element. The shell includes pins and least one holding region. The pins extend from the shell. The holding region includes upper and lower abutting elements for abutting upper and lower edges of the workpiece when the holding region receives the workpiece. The cover includes pin-receiving apertures and at least one pair of branch-receiving apertures. The pin-receiving apertures receive the pins to align the cover with the shell. The conducting element includes a stem and at least one pair of branches extending from the stem. The stem is attached to the cover. The pair of branches contacts the workpiece through the pair of branch-receiving apertures.

Abstract: An electroplating system and components thereof facilitate an efficient electroplating process which in part reduces or eliminates the number of clips used on electroplating racks. Some electroplating racks may use skewers on which multiple plastic pieces are typically mounted. The plastic pieces may also be configured to be joined to form an assembly which is mounted on an electroplating rack. The configurations help reduce the time spent loading and unloading pieces on the racks.

Abstract: Embodiments of a closed-contact electroplating cup assembly that may be rapidly cleaned while an electroplating system is on-line are disclosed. One disclosed embodiment comprises a cup assembly and a cone assembly, wherein the cup assembly comprises a cup bottom comprising an opening, a seal surrounding the opening, an electrical contact structure comprising a plurality of electrical contacts disposed around the opening, and an interior cup side that is tapered inwardly in along an axial direction of the cup from a cup top toward the cup bottom.

Abstract: A coupling which is rotatable about a vertical axis of rotation and intended for the mounting of a workpiece support which can be loaded, for example, with incorrectly coated or worn workpieces is arranged in a removable holder above a tank filled with an electrolyte. Said workpiece support is connected via the coupling to a current supply device, to the opposite pole of which an opposite electrode is connected. A heating and cooling device and an ultrasound generator are also arranged in the tank. By current supply and simultaneous rotation, the coating is removed from the workpiece support and/or from the workpieces. After incorrect coating, the workpieces together with the workpiece support and in certain circumstances with the holder can be taken over directly from a coating installation and, after coating removal, transferred to such a coating installation for recoating.

Abstract: A surface treatment system includes a surface treatment tank, a first guide rail and a second guide rail that extend at a position offset from a position over the upper opening of the surface treatment tank, and a plurality of transfer jigs that respectively hold a workpiece and are supported by the first guide rail and the second guide rail. The transfer jig includes a horizontal arm section, a first guide target section that is guided by the first guide rail, a second guide target section that is guided by the second guide rail, and a vertical arm section that is suspended from the horizontal arm section at a position between the first guide target section and the second guide target section, and holds the workpiece.

Abstract: The present invention is to provide a substrate holder which can effect a more complete sealing with a sealing member and makes it possible to take a substrate out of the substrate holder easily and securely, and also a plating apparatus provided with the substrate holder. The substrate holder includes: a fixed holding member and a movable holding member for holding a substrate therebetween; a sealing member mounted to the fixed holding member or the movable holding member; and a suction pad for attracting a back surface of the substrate held between the fixed holding member and the movable holding member.

Abstract: One embodiment relates to a substrate carrier for use in electroplating a plurality of substrates. The substrate carrier comprises a non-conductive carrier body on which the substrates are to be held. Electrically-conductive lines are embedded within the carrier body, and a plurality of contact clips are coupled to the electrically-conductive lines embedded within the carrier body. The contact clips hold the substrates in place and electrically couple the substrates to the electrically-conductive lines. The non-conductive carrier body is continuous so as to be impermeable to flow of electroplating solution through the non-conductive carrier body. Other embodiments, aspects and features are also disclosed.

Abstract: A bandoleer of article carriers includes a carrier band, and a plurality of carrier racks connected with a bottom edge of the carrier band each by means of a connecting plate and arranged at regular intervals. Each carrier rack shows a substantially inverted-V shape and has a pair of elastic arms extending downward from two ends of a bottom edge of the connecting plate and gradually inclined away from each other. Two distal ends of the elastic arms protrude oppositely to each other to form a pair of hook portions. Upper portions of two opposite side edges of the connecting plate oppositely protrude sideward to form two blocking portions. Lower portions of the two opposite side edges of the connecting plate oppositely protrude sideward and then are bent towards two opposite directions perpendicular to the plane of the connecting plate to form two lying-L shaped resisting portions.

Abstract: A conductive contact ring for an electroplating or electrodeposition process on a cylindrical surface includes a frame defining an opening through which the object can be passed and an array of electrically conductive fibers spanning the opening. The frame is electrically conductive and is connected to a DC power source in the process. Two or more contact rings can be used in a process to provide consistent electrical contact with the surface sliding therethrough. A single contact ring can have first and second groups of filaments spaced from each other along the axial length of the surface.

Abstract: A workpiece holder for fluid processing a workpiece including a transportable frame, a flexible member connected to the frame and defining at least one retaining feature, and a ring comprising at least one engagement feature engageable with the at least one retaining feature of the flexible member, wherein the flexible member is flexed to provide a force to the at least one engagement feature to cause the ring to form a barrier to fluid entry with the workpiece.

Abstract: An electroplating apparatus includes an electroplating tank, a first supporting bar, a first holding element, two second supporting bars, a number of spaced crossbars, a number of second holding elements, and a power supply. The first holding element is suspended in the tank from the first supporting bar, and the first holding element is configured for holding a plate-shaped workpiece in a manner that the workpiece is oriented along the first supporting bar. The second holding elements are suspended from the corresponding crossbars, each of the second holding elements arranged between the first and one of the second supporting bars and configured for holding a metal block. The power supply includes a cathode for electrical connection to the workpiece through the first supporting bar and the first holding element and an anode for electrically connection to the metal blocks through the second supporting bars and the second holding elements.

Abstract: A carrier provides the ability to perform wet chemical processing on substrates using low cost equipment inspired by the electroplating methods typically utilized in leadframe-based semiconductor packaging or printed circuit board industries. Two frame pieces are mated together to form the carrier which enables transport of at least one substrate through wet chemical processing and includes a non-conductive frame with an exposed conductive flange to allow electrical coupling with processing equipment. Electrical contacts within the non-conductive frame make contact with the at least one substrate and are coupled to the conductive flange allowing an electrical potential to develop across the substrate while undergoing processing within the electroplating equipment.

Abstract: Methods, apparatuses, and various apparatus components, such as base plates, lipseals, and contact ring assemblies are provided for reducing contamination of the contact area in the apparatuses. Contamination may happen during removal of semiconductor wafers from apparatuses after the electroplating process. In certain embodiments, a base plate with a hydrophobic coating, such as polyamide-imide (PAI) and sometimes polytetrafluoroethylene (PTFE), are used. Further, contact tips of the contact ring assembly may be positioned further away from the sealing lip of the lipseal. In certain embodiments, a portion of the contact ring assembly and/or the lipseal also include hydrophobic coatings.

Abstract: One embodiment relates to a substrate carrier for use in electroplating a plurality of substrates. The substrate carrier includes a non-conductive carrier body on which the substrates are held, and conductive lines are embedded within the carrier body. A conductive bus bar is embedded into a top side of the carrier body and is conductively coupled to the conductive lines. A thermoplastic overmold covers a portion of the bus bar, and there is a plastic-to-plastic bond between the thermoplastic overmold and the non-conductive carrier body. Other embodiments, aspects and features are also disclosed.

Abstract: One embodiment relates to a substrate carrier for use in electroplating a plurality of substrates. The carrier includes a non-conductive carrier body on which the substrates are placed and conductive lines embedded within the carrier body. A plurality of conductive clip attachment parts are attached in a permanent manner to the conductive lines embedded within the carrier body. A plurality of contact clips are attached in a removable manner to the clip attachment parts. The contact clips hold the substrates in place and conductively connecting the substrates with the conductive lines. Other embodiments, aspects and features are also disclosed.

Abstract: A method of fluid sealing a workpiece is provided. The method includes providing a force to cause a ring to form a barrier to fluid entry with the workpiece and preventing fluid from crossing the barrier to fluid entry by forming a pressure differential across the barrier.

Abstract: One embodiment relates to a substrate carrier for use in electroplating a plurality of substrates. The carrier includes a non-conductive carrier body on which the substrates are placed and conductive lines embedded within the carrier body. A plurality of conductive clip attachment parts are attached in a permanent manner to the conductive lines embedded within the carrier body. A plurality of contact clips are attached in a removable manner to the clip attachment parts. The contact clips hold the substrates in place and conductively connecting the substrates with the conductive lines. Other embodiments, aspects and features are also disclosed.

Abstract: A system to monitor, control and management of a plant where hydrometallurgical processes of electrowinning or electrorefining of non ferrous metals which enables measuring the process variables which comprises: at least one group of electrolytic cells, said cells having means for the collection and transmission of the variables of the process; a plurality of electrodes (5) installed in the interior of each electrolytic cell, making up, alternately, anodes and cathodes of basic cells; a plurality of electrode (5) hanger bars forming, alternately, hanger bars for electrical contact of anodes (20) and hanger bar for electrical contact of cathodes (18); a plurality of support electrical insulators (15) which are positioned in the upper portion of the lateral walls between two adjacent cells; a plurality of electrical bus bars (6) which are fitted on top of each support electrical insulator (15) and underneath the plurality of electrodes (5); a plurality of electrical spacer insulators (16) each spacer insulator

Abstract: Disclosed is a contact bar for use on a capping board of a given length in order to electrically connect a plurality of anodes and cathodes extending in spaced apart, alternate positions in adjacent electrolytic cells all along the capping board. The contact bar extends over the length of the capping board and is of a given average cross-section. This contact bar comprises a central core that is made of an insulating material and extends all over its length. This contact bar also comprises a plurality of contact pieces that are made of an electrically conductive material and are positioned in spaced apart positions all along the core, each of the pieces defining a segment on which only a short number of the anodes and cathodes are connected.

Abstract: A tending module for a series of electrolysis cells designed for the manufacture of aluminum by igneous electrolysis, each cell including a series of anodes provided with a metal rod designed to fix and electrically connect the anodes to a metal anode frame. The tending module includes a frame to be fixed to a mobile component, and at least one anode handling unit connected to the frame. The module also includes, integral with the anode handling unit, an activator that can exert at least one force or impulse on the anode rod, with a force such that, although the stem is firmly maintained in contact against the anode frame, the contact surfaces are moved in relation to each other by an amount sufficient for electrical contact to be improved. Advantageously, the activator is a jack or an impulse generator integral with the anode clamp.

Abstract: A method of fluid sealing a workpiece is provided. The method includes placing a workpiece on a ring, engaging at least one engagement feature of the ring with at least one retaining feature defined by the member and flexing the member to provide a force to the at least one engagement feature to cause the ring to form a barrier to fluid entry with the workpiece.

Abstract: A method and apparatus for manufacturing a magnetic recording medium uses a small-diameter insulating substrate. The apparatus includes a carrier for a special size of 3.5 inches for receiving a plurality of small-diameter insulating substrates. Seed layers are deposited on the substrates, then each substrate is rotated to shift the position of the substrate so that the movable claw contacts the deposited seed layer. A bias voltage is applied via the movable claw for subsequent deposition layers.

Abstract: A centrifugal workpiece processor for processing semiconductor wafers and similar workpieces includes a head which holds and spins the workpiece. The head includes a rotor having a gas system. Gas is sprayed or jetted from inlets in the rotor to create a rotational gas flow. The rotational gas flow causes pressure conditions which hold the edges of a first side of the workpiece against contact pins or surfaces on the rotor. The rotor and the workpiece rotate together. Guide pins adjacent to a perimeter may help to align the workpiece with the rotor. An angled surface helps to deflect spent process liquid away from the workpiece. The head is moveable into multiple different engagement positions with a bowl. Spray nozzles in the bowl spray a process liquid onto the second side of the workpiece, as the workpiece is spinning, to process the workpiece. A moving end point detector may be used to detect an end point of processing.

Abstract: In one embodiment, a substrate holder comprises a base supporting a substrate that includes a surface having a peripheral region. A cover may be assembled with the base and includes at least one opening exposing only a portion of the surface therethrough. A seal assembly substantially seals a region between the cover and base and further adjacent to the peripheral region of the substrate. An electrode includes at least one contact portion positioned within the region and extending over at least a portion of the peripheral region of the substrate. A compliant member comprises a polymeric material and may be positioned within the region between the at least one contact portion and either the peripheral region of the substrate or the cover. In other embodiments, an electroplating system is disclosed that may employ such a substrate holder.

Abstract: The present invention is to provide a substrate holder which can effect a more complete sealing with a sealing member and makes it possible to take a substrate out of the substrate holder easily and securely, and also a plating apparatus provided with the substrate holder. The substrate holder includes: a fixed holding member and a movable holding member for holding a substrate therebetween; a sealing member mounted to the fixed holding member or the movable holding member; and a suction pad for attracting a back surface of the substrate held between the fixed holding member and the movable holding member.

Abstract: A plating apparatus can form a plated film having a uniform thickness over the entire surface of a substrate without a change of members. The plating apparatus includes a substrate holder, a cathode contact for contacting a conductive film formed on the substrate so that the conductive film serves as a cathode, a ring-shaped seal member for covering the cathode contact and bringing its inner circumferential portion into contact with the peripheral portion of the substrate to seal the peripheral portion of the substrate, an anode disposed so as to face the conductive film formed on the substrate, and an auxiliary cathode disposed with respect to the seal member such that at least part of the auxiliary cathode is exposed on a surface of the seal member. Plating is carried out by bringing the conductive film, the anode and the auxiliary cathode into contact with a plating solution.

Abstract: A process employing a rack having an article carrier that is movably supported on a frame and mechanically coupled for translating movement from a motor to the article carrier to effect movement of an article during processing to provide more uniform surface treatment, reducing or eliminating the need for shielding.

Abstract: Method and device for supplying electrical power to a wafer that is at least partially submerged in a liquid. The device comprises: —a container filled with the liquid; —a transportation device comprising a wafer carrier device for transporting the wafer at least partially submerged through the liquid; —a power supply device for supplying electrical power to the wafer.

Abstract: A rack apparatus (100) includes a frame (10), a plurality of supporting members (106), and a plurality of retaining members (12). The supporting members are arranged/mounted on/to the frame. The retaining members are mounted on the supporting members. Each retaining member includes a fixing piece (120) and two supporting pieces (122, 124). The fixing piece has a notched mounting portion. The two supporting pieces are respectively positioned at an opposite side of the fixing piece. Each supporting piece forms a retaining portion (i.e., a through hole therein). The notched mounting portion and the retaining portions together help retain a workpiece within a given retaining member.

Abstract: A substrate holding and transporting assembly is disclosed. The substrate holding and transporting assembly includes a base plate and a pair of clamps connected to the base plate in a spaced apart orientation, the spaced apart orientation of the pair of clamps enable support of a substrate with at least two independent points. The substrate holding and transporting assembly also includes an electrode assembly connected to the base plate at a location that is substantially between the pair of clamps. The electrode assembly defined to impart an electrical contact to the substrate when present and held by the pair of clamps.

Abstract: A method and apparatus for fluid sealing a workpiece retained by a workpiece holder are described. A pressure differential can be formed across a fluid seal to counteract fluid attempting to penetrate the fluid seal, which can contaminate the underside of the workpiece. The apparatus can include a ring forming a barrier to fluid entry with the workpiece and a source providing pressure to form the pressure differential. The pressure or the pressure differential can counteract hydroscopic fluid pressure or hydrostatic fluid pressure that is acting to force fluid through the barrier between the ring and the workpiece.

Abstract: One embodiment relates to a substrate carrier for use in electroplating a plurality of substrates. The carrier includes a non-conductive carrier body on which the substrates are placed and conductive lines embedded within the carrier body. A plurality of conductive clip attachment parts are attached in a permanent manner to the conductive lines embedded within the carrier body. A plurality of contact clips are attached in a removable manner to the clip attachment parts. The contact clips hold the substrates in place and conductively connecting the substrates with the conductive lines. Other embodiments, aspects and features are also disclosed.