Abstract: The present invention can provide 1 which barrel plating apparatus where a plating barrel has permeable holes and slits in a size of order of micrometers on the wall thereof. The plating barrel is fabricated with porous plastic materials which have permeable holes and slits to the plating liquid and no piece materials to be plated are dropped thereof. Further advantage of the present invention is to provide a drain tool to drain the plating liquid L staying in the plating barrel.
Abstract: A cathode cartridge (N) for an electroplating tester includes a cathode conductor (10) that conducts electricity to a surface (Wa) to be plated of a silicon wafer (W) as an object to be plated, a first insulator (20) that covers a front side of the silicon wafer (W) and holds the cathode conductor (10), and a second insulator (30) that covers a back side of the silicon wafer (W) and holds the silicon wafer (W). Negative portions other than the surface (Wa) to be plated of the silicon wafer (W) are insulated from plating solution with a first O-ring (22) fitted in the first insulator (20) and a second O-ring (32) fitted in the second insulator (30).
Abstract: In a cable system for connecting to an electrical apparatus, an earthing electrode assembly includes an earthing electrode, a mechanism for attaching the electrode to the cable while maintaining electrical insulation from the cable, and an electrical connection of the electrode to the electrical apparatus, the connection being long enough that the electrode is located at a distance from the apparatus such that the apparatus is substantially protected from the electrochemical effects resulting from operation of the electrode. The earthing electrode may include a titanium core which is coated with platinum or a mixed metal oxide of tantalum and iridium. Methods of attachment are also disclosed.
October 29, 2002
June 5, 2003
Ian Gerard Watson, Philip Andrew Norman, David Lancelot Walters, Peter Worthington
Abstract: An anode includes an anode cup, a membrane and ion source material, the anode cup and membrane forming an enclosure in which the ion source material is located. The anode cup includes a base section having a central aperture and the membrane also has a central aperture. A jet is passed through the central apertures of the base section of the anode cup and through the membrane allowing plating solution to be directed at the center of a wafer being electroplated.
May 18, 2000
Date of Patent:
May 27, 2003
Novellus Systems, Inc., International Business Machines, Corp.
Jonathan David Reid, Robert J. Contolini, John Owen Dukovic
Abstract: An electrical contact element for electrically connecting an electric device and providing current transmission in an electric device wherein the electrical contact element comprises a metallic body, and wherein at least one contact surface, present on the body, is completely or partially coated with a friction-reducing layer. The friction-reducing layer comprises a metal salt.