Abstract: A wafer chuck for holding a wafer during electropolishing and/or electroplating of the wafer includes a top section, a bottom section, and a spring member. In accordance with one aspect of the present invention, the top section and the bottom section are configured to receive the wafer for processing. The spring member is disposed on the bottom section and configured to apply an electric charge to the wafer. In accordance with another aspect of the present invention, the spring member contacts a portion of the outer perimeter of the wafer. In one alternative configuration of the present invention, the wafer chuck further includes a seal member to seal the spring member from the electrolyte solution used in the electropolishing and/or electroplating process.

Abstract: Methods and apparatus are provided in which a clamping device for holding a work-piece comprises at least two clamping arms and at least one of the arms has a pin including a conical or pointed tip that at least partially penetrates a surface of the work-piece while in a clamped configuration.

Abstract: A cathode cartridge (N) for an electroplating tester includes a cathode conductor (10) that conducts electricity to a surface (Wa) to be plated of a silicon wafer (W) as an object to be plated, a first insulator (20) that covers a front side of the silicon wafer (W) and holds the cathode conductor (10), and a second insulator (30) that covers a back side of the silicon wafer (W) and holds the silicon wafer (W). Negative portions other than the surface (Wa) to be plated of the silicon wafer (W) are insulated from plating solution with a first O-ring (22) fitted in the first insulator (20) and a second O-ring (32) fitted in the second insulator (30).

Abstract: Method and device for manufacturing of expandable cylindrical metal meshes for use in expandable stents and in particular for customized manufacturing. The method includes determining the type and size of the stent to be implanted, electrochemically forming the stent with desired pattern of meshes and implanting the stent into patient. The method comprises using a cathode with desired pattern of meshes and a tubular blank, from which the stent is formed. Between the cathode and the blank is delivered an electrolyte and the cathode and the blank are simultaneously rotated during electrochemical forming process.

Abstract: A system for depositing materials on a surface of a wafer or removing materials from the surface of a wafer includes an electrode, a shaping plate, a liquid solution contained between the electrode and the wafer surface, and electrical contact members contacting selected locations on the wafer surface. The shaping plate is supported between the electrode and the wafer surface such that an upper surface of the shaping plate faces the wafer surface. The shaping plate can have a plurality of channels where each puts the wafer surface in a fluid communication with the electrode. The electrical contact members contact the selected locations on the wafer surface through a recessed edge of the shaping plate such that when the wafer is rotated, the selected contact locations move over the shaping plate and are plated under an applied potential. Advantages of the invention include substantially full surface treatment of the wafer.

Abstract: A wafer chuck for holding a wafer during electropolishing and/or electroplating of the wafer includes a top section, a bottom section, and a spring member. In accordance with one aspect of the present invention, the top section and the bottom section are configured to receive the wafer for processing. The spring member is disposed on the bottom section and configured to apply an electric charge to the wafer. In accordance with another aspect of the present invention, the spring member contacts a portion of the outer perimeter of the wafer. In one alternative configuration of the present invention, the wafer chuck further includes a seal member to seal the spring member from the electrolyte solution used in the electropolishing and/or electroplating process.

Abstract: An apparatus for electroplating a wafer surface includes a cup having a central aperture defined by an inner perimeter, a compliant seal adjacent the inner perimeter, contacts adjacent the compliant seal and a cone attached to a rotatable spindle. The compliant seal forms a seal with the perimeter region of the wafer surface preventing plating solution from contaminating the wafer edge, wafer backside and the contacts. As a further measure to prevent contamination, the region behind the compliant seal is pressurized. By rotating the wafer during electroplating, bubble entrapment on the wafer surface is prevented. Further, the contacts can be arranged into banks of contacts and the resistivity between banks can be tested to detect poor electrical connections between the contacts and the wafer surface.

Abstract: A cathode assembly for semiconductor wafer plating employs a polymer coating on a metal structural ring to provide a low-profile seal to the perimeter of the wafer surface to be plated. The polymer coating also electrically insulates the metal so that it can be used in contact with the plating solution and still be part of the electrical contact system, eliminating the need for a protective plastic housing. This invention permits the dimensions of the cathode assembly to be minimized. A compact cathode assembly with minimum protrusion above the wafer plated surface enables modifications to the plating cell and agitation system providing more uniform copper deposits across the wafer surface and facilitating automation of the wafer plating process.

Abstract: An electrode assembly for electroplating conducting portions of nonconductors comprises an insulating frame having a first projection opposite a second projection. Preferably the insulating frame comprises a resin selected from the group consisting of acrylic resins, polyvinyl chloride resins and polycarbonate resins. A metal filament, for connection to the negative pole of a source of electrical energy, extends from the first projection to the second projection. Adjacent to the metal filament a first conductive plate is attached to the insulating frame at a first distance from the metal filament. A second conductive plate attaches to the insulating frame at a second distance from the metal filament. The first plate and the second plate are adapted for connection to the positive pole of a source of electrical energy.

Abstract: The invention relates to a substrate carrier for holding substrates, especially semiconductor wafers. Good sealing of the wafer surface and electrical contact are made possible in that the substrate carrier has a first and a second part having a central opening matching the form of the substrate, wherein the substrate is received between the first and the second part and a peripheral seal having at least one undercut is provided in the inner periphery of the second part.

Abstract: An electrical contact element for electrically connecting an electric device and providing current transmission in an electric device wherein the electrical contact element comprises a metallic body, and wherein at least one contact surface, present on the body, is completely or partially coated with a friction-reducing layer. The friction-reducing layer comprises a metal salt.

Abstract: Controlled-potential electroplating provides an effective method of electroplating metals onto the surfaces of high aspect ratio recessed features of integrated circuit devices. Methods are provided to mitigate corrosion of a metal seed layer on recessed features due to contact of the seed layer with an electrolyte solution. The potential can also be controlled to provide conformal plating over the seed layer and bottom-up filling of the recessed features. For each of these processes, a constant cathodic voltage, pulsed cathodic voltage, or ramped cathodic voltage can be used. An apparatus for controlled-potential electroplating includes a reference electrode placed near the surface to be plated and at least one cathode sense lead to measure the potential at points on the circumference of the integrated circuit structure.

Abstract: A method and apparatus for fluid sealing the underside of a workpiece, such as a semiconductor wafer and the like, during wet-processing such as electrodeposition and the like, employing an elastomeric encased ring of flexible fingers against which the periphery of the workpiece underside is forced to deflect the fingers downwardly and engage a peripheral sealing bead against the underside periphery of the workpiece; and where electrical contact with the workpiece is desired, resiliently engaging electrical contact tips protruding through peripheral openings in the elastomeric covering within the sealing ring, with the underside periphery of the workpiece.

Abstract: An apparatus for electroplating a workpiece is disclosed in which the apparatus includes a workpiece holding structure. The workpiece holding structure includes a workpiece support having at least one surface that is disposed to engage a front side of the workpiece and at least one electrical contact disposed for contact with at least one corresponding electrical contact on a back-side of the workpiece. The workpiece includes one or more electrically conductive paths between the at least one corresponding electrical contact and a front-side of the workpiece to facilitate electroplating of the front-side surface.

Abstract: A plating clamp assembly for use with a plating system including a plating bath and an article transport assembly to selectively engage an article to be plated as the article is moved through the plating bath by the article transport assembly to coat at least a selected portion of the surface of the article with material without creating faults on the selected portion of the surface of the article.

Abstract: A fastening apparatus is provided, in particular, for work-pieces in the form of plates for use in electrochemical baths. The fastening apparatus ensures that the contact quality is achieved irrespective of the thickness of the work-piece. The fastening apparatus has limbs that are connected to one another via a multi-jointed connection, and that contact surfaces of contacts are aligned parallel to one another in every opening position of the limbs.

Abstract: A wafer chuck for holding a wafer during electropolishing and/or electroplating of the wafer includes a top section, a bottom section, and a spring member. In accordance with one aspect of the present invention, the top section and the bottom section are configured to receive the wafer for processing. The spring member is disposed on the bottom section and configured to apply an electric charge to the wafer. In accordance with another aspect of the present invention, the spring member contacts a portion of the outer perimeter of the wafer. In one alternative configuration of the present invention, the wafer chuck further includes a seal member to seal the spring member from the electrolyte solution used in the electropolishing and/or electroplating process.

Abstract: An apparatus and associated method that removes electrolyte solution from a substrate, the apparatus comprises a thrust plate and a substrate extension unit. The thrust plate at least partially defines a spin recess. The substrate extension unit can be displaced between a retracted position and an extended position relative to the spin recess. The substrate extension unit is disposed within the spin recess when positioned in the retracted position. The substrate extension unit at least partially extends from within the spin recess when positioned in the extended position. The substrate is processed by immersing at least a portion of the substrate in a wet solution. The substrate is removed from the wet solution. The substrate extension unit extends into its extended position, and the substrate is spun. Extending the substrate extension unit limits the formation of fluid traps within the substrate holder assembly or between the substrate and the substrate holder assembly.

Abstract: Plating rack for releasably holding parts in a plating process, as well as processes for fabricating and using such a rack, including spring members mounted to a frame which releasably hold plate-shaped parts from the opposite side edges of the parts in a manner permitting the part to move sufficiently, without disengagement, when immersed in an agitated plating fluid such that plating occurs on all the exterior surface regions of the plate and scarring is avoided.

Abstract: Apparatus for metal plating an article comprising a frame having a plurality of sealing members positioned thereon, the frame being capable of conducting an electrical current between sealing members, each sealing member being adapted to be in close contact with part of an article to be located thereon, and to thereby substantially prevent fluid from touching that part of the article or entering into a bore or recess of the article, each sealing member further being adapted to conduct current between the frame and the article.

Abstract: This device for lifting the anode frame of an electrolysis cell for the production of aluminium comprises:

Abstract: The present invention is to provide a wafer plating jig for a plating apparatus having a simple construction and capable of sealing conducting pins from the plating solution completely. The wafer plating jig for gripping a wafer, comprises a main jig body (11) having a plurality of gripping mechanisms (13) and a plurality of conducting pins disposed thereon. A seal packing (20) is provided to surround each of the conducting pins. When the wafer is gripped by the gripping mechanisms (13), each end of the conducting pins individually contacts conductive film formed on the wafer and being sealed by the seal packing (20).

Abstract: An electroplating rack includes a cathode flight bar from which depends an insulated rack bar over an acid bath. A clamp is fixed to the rack bar, and has a bridge electrically connected to the flight bar through a conducting core inside the insulated rack bar. The clamp has a main body made of plastic, which includes a slot in which protrudes the bridge. An electrically conducting spring clip is installed in the slot, and is formed of two arms continuously biased into a spreaded, opened condition in the slot. A screw carried by the main body, when rotated in a first direction, can force the spring clip into a closed condition, in which it can hold an article to be electroplated between its two arms, and in which one of the spring clip arms is forced against the bridge member. Thus, electrical current can pass through the rack flight bar and conducting core, then through the bridge member, the spring clip and finally into the article to be electroplated.

Abstract: The present invention is directed to an improved electroplating method, chemistry, and apparatus for selectively depositing tin/lead solder bumps and other structures at a high deposition rate pursuant to manufacturing a microelectronic device from a workpiece, such as a semiconductor wafer. An apparatus for plating solder on a microelectronic workpiece in accordance with one aspect of the present invention comprises a reactor chamber containing an electroplating solution having free ions of tin and lead for plating onto the workpiece. A chemical delivery system is used to deliver the electroplating solution to the reactor chamber at a high flow rate. A workpiece support is used that includes a contact assembly for providing electroplating power to a surface at a side of the workpiece that is to be plated. The contact contacts the workpiece at a large plurality of discrete contact points that isolated from exposure to the electroplating solution.

Abstract: A holding clamp device, for releasably holding a thick planar article over ground, comprising: an elongated main arm member, defining first and second opposite end portions; a pair of first and second tubular bar members, each defining an outer end portion and an opposite inner end portion; a rail member, integral to an intermediate section of the main arm member and slidably engaged by the second bar member inner end portion, wherein the second bar member is maintained by the rail member parallel to the first bar and wherein the second bar member is movable relative to the first bar member while continuously remaining parallel thereto; a first biasing member, continuously biasing the first and second bar members toward one another; and a second biasing member, for discretely biasing the second bar member away from the first bar member, against the continuous bias of the first biasing member.

Abstract: An apparatus for electroplating a workpiece is disclosed in which the apparatus includes a workpiece holding structure. The workpiece holding structure includes a workpiece support having at least one surface that is disposed to engage a front side of the workpiece and at least one electrical contact disposed for contact with at least one corresponding electrical contact on a back-side of the workpiece. The workpiece includes one or more electrically conductive paths between the at least one corresponding electrical contact and a front-side of the workpiece to facilitate electroplating of the front-side surface.

Abstract: A reactor for plating a metal onto a surface of a workpiece is set forth. The reactor comprises a reactor bowl including an electroplating solution disposed therein and an anode disposed in the reactor bowl in contact with the electroplating solution. A contact assembly is spaced from the anode within the reactor bowl. The contact assembly includes a plurality of contacts disposed to contact a peripheral edge of the surface of the workpiece to provide electroplating power to the surface of the workpiece. The contacts execute a wiping action against the surface of the workpiece as the workpiece is brought into engagement therewith. The contact assembly also including a barrier disposed interior of the plurality of contacts. The barrier includes a member disposed to engage the surface of the workpiece to assist in isolating the plurality of contacts from the electroplating solution.

Abstract: A semiconductor workpiece holder for use in processing a semiconductor workpiece includes a workpiece support operatively mounted to support a workpiece in position for processing. A finger assembly is operatively mounted upon the workpiece support and includes a finger tip. The finger assembly is movable between an engaged position in which the finger tip is engaged against the workpiece, and a disengaged position in which the finger tip is moved away from the workpiece. Preferably, at least one electrode forms part of the finger assembly and includes an electrode contact for contacting a surface of said workpiece. At least one protective sheath covers at least some of the electrode contact. According to one aspect of the invention, a sheathed electrode having a sheathed electrode tip is positioned against a semiconductor workpiece surface in a manner engaging the workpiece surface with said sheathed electrode tip and forming a seal.

Abstract: Electrolytic plating of a workpiece is enhanced by providing a resistor between the workpiece and electrically conductive support member.

Abstract: A holding clamp device, for releasably holding a thick planar article over ground, comprising: an elongated main arm member, defining first and second opposite end portions; a pair of first and second tubular bar members, each defining an outer end portion and an opposite inner end portion; a rail member, integral to an intermediate section of the main arm member and slidably engaged by the second bar member inner end portion, wherein the second bar member is maintained by the rail member parallel to the first bar and wherein the second bar member is movable relative to the first bar member while continuously remaining parallel thereto; a first biasing member, continuously biasing the first and second bar members toward one another; and a second biasing member, for discretely biasing the second bar member away from the first bar member, against the continuous bias of the first biasing member.

Abstract: The invention relates to a holder to be used during the stripping of a metal deposit produced on the surface of a mother plate in electrolytic refining, which mother plate has a supporting bar (12) fixed at one edge of the plate for supporting the mother plate during the stripping (16), and an edge strip (10) at least on the edge opposite to where the supporting bar (12) is fixed. According to the invention the holder (1) has at least one pressing member (4), so that during the stripping (16) the metal deposit (15) is pressed by the pressing member (4) in order to make a contact between the deposit (15) and the pressing member (4) close to the edge strip (10) installed on the edge opposite to where the supporting bar (12) is fixed.

Abstract: A wafer chuck for holding a wafer during electropolishing and/or electroplating of the wafer includes a top section, a bottom section, and a spring member. In accordance with one aspect of the present invention, the top section and the bottom section are configured to receive the wafer for processing. The spring member is disposed on the bottom section and configured to apply an electric charge to the wafer. In accordance with another aspect of the present invention, the spring member contacts a portion of the outer perimeter of the wafer. In one alternative configuration of the present invention, the wafer chuck further includes a seal member to seal the spring member from the electrolyte solution used in the electropolishing and/or electroplating process.

Abstract: A fixture for supporting a workpiece during electroplating of a metal upon the workpiece in a conductive electroplating bath includes a non-conductive frame member for receiving the workpiece therein. The fixture further includes a current distribution means having a plurality of contacts. The plurality of contacts are disposed inwardly for providing an equally distributed electrical contact with an outer perimeter region of the workpiece. The workpiece is supported between the frame member and the current distribution means. Lastly, a thief electrode is perimetrically disposed about the workpiece and spaced a prescribed distance from the workpiece by a gap region. During plating of a metal upon the workpiece, the gap region between the thief and the workpiece is filled with the conductive electroplating bath. An electroplating apparatus having a fixture for supporting a workpiece during an electroplating process and a method of supporting the workpiece to be electroplated are also disclosed.

Abstract: A method, system and structure for a pin grid or pad grid array structure includes a plurality of pins connected to an electronic structure, a power plane within the electronic structure electrically connected to power pins, a ground plane within the electronic structure, and fuse portions electrically connecting the ground plane to ground pins and signal pins. The power plane and the ground plane create a charge in the pins during electroplating of the pins. The fuse portions disconnecting the signal pins from the ground plane after the electroplating.

Abstract: A method and apparatus for measuring the quality, e.g., thickness, porosity, or corrosion rate, of a coating inside a hollow body having an opening. The method comprises attaching a probe from a coating measuring device to one end of an extender arm having a flexible portion therein, placing the probe inside the hollow body through the opening, and making the desired measurements of the coating. The apparatus includes a flexible extender arm for use with a coating measuring device.

Abstract: An apparatus and process for electroplating a pin grid array device having a plurality of pins, the pins having a side surface and an extremity. The apparatus comprises a contact plate defining a plane and having a plurality of electrically conductive flexible contact fingers extending from the contact plate away from the plane, the contact fingers adapted to flex when contacted by the pins. The process comprises contacting each of the plurality of pins with a flexible contact finger extending from a single electrically conductive plate, the conductive plate defining a plane, wherein the flexible contact fingers extend away from the plane.

Abstract: A product conveying mechanism is provided for an electroplating device which electroplates a thin-wall ribbonlike product such as a printed wiring board given to be plated. It suspends the product from the upper part thereof nipped with a jig supported laterally movably by a cathode bar and conveys the product laterally in an electrolyte solution held in a tank meanwhile feeding an electric current from the cathode bar via the jig to the product through the upper part thereof. The product conveying mechanism is particularly furnished with a jig of striking originality combining the function of nipping a product and the function of feeding an electric current to the product.

Abstract: An electroplating apparatus provides high current electrical connections in a small area to a workpiece. The contact area may use a dendrite surface to improve the connection. An insulative gasket prevents electroplating fluids from entering the region about the contact area. A heavy core laminated within a supporting structure provides uniform current distribution of high electrical currents to the dendrite covered contact areas.