Cylindrical Or Curved Magnetron Target Patents (Class 204/298.21)
  • Patent number: 9748082
    Abstract: A cathode target assembly for use in sputtering target material onto a substrate includes a generally cylindrical target and a magnetic array. The magnetic array is adapted to provide a plasma confinement region adjacent an outer surface of the target. End portions of the magnetic array are adapted to make the shape and strength of the confinement field at the turns of the racetrack closely match the shape and strength of the confinement field along the straight part of the racetrack so as to significantly reduce cross-corner effect.
    Type: Grant
    Filed: March 8, 2013
    Date of Patent: August 29, 2017
    Assignee: Cardinal CG Company
    Inventors: John R. German, Klaus H. W. Hartig
  • Patent number: 9349576
    Abstract: A magnet arrangement which is usable as both a retrofit magnetic arrangement in a rotatable cylindrical magnetron sputtering electrode as well as a drive assembly in communication with the electrode for delivering high current into a target surface without adding highly incremental cost to the overall design of the electrode. The electrode includes a cathode body defining a magnet receiving chamber, a rotatable cylindrical target surrounding the cathode body, wherein the target is rotatable about the cathode body. The cathode body further defines a magnet arrangement received within the magnet receiving chamber, wherein the magnet arrangement comprised of a plurality of magnets wherein at least one of the magnets is a profiled magnet having a contoured top portion.
    Type: Grant
    Filed: March 14, 2007
    Date of Patent: May 24, 2016
    Assignee: Angstrom Sciences, Inc.
    Inventors: Mark A. Bernick, Richard Newcomb
  • Patent number: 9334564
    Abstract: A tube-shaped sputtering target is provided having a carrier tube and an indium-based sputtering material arranged on the carrier tube. The sputtering material has a microstructure having a mean grain size of less than 1 mm, measured as the mean diameter of the grains on the sputtering-roughened surface of the sputtering material.
    Type: Grant
    Filed: February 3, 2012
    Date of Patent: May 10, 2016
    Assignee: Heraeus Deutschland GmbH & Co. KG
    Inventors: Christoph Simons, Martin Schlott, Josef Heindel, Christoph Stahr
  • Patent number: 9028660
    Abstract: A magnetron sputtering apparatus (100) comprising: a magnetic array arranged to create a magnetic field (103) in the vicinity of a tubular target (2) which target at least partially surrounds the magnetic array and acts as a cathode (2a); an anode (2b); the magnetic array being arranged to create an asymmetric plasma distribution with respect to the normal angle of incidence to a substrate (3); and means (1b) for enhancing the magnetic field to produce a relatively low impedance path for electrons flowing from the cathode (2a) to the anode (2b).
    Type: Grant
    Filed: August 14, 2008
    Date of Patent: May 12, 2015
    Assignee: Gencoa Ltd
    Inventor: Victor Bellido-Gonzalez
  • Patent number: 9011652
    Abstract: A rotary sputtering target bonded to a backing tube such that the bonding material is applied only proximate the ends of the rotary sputtering target and is also between the target and the backing tube to form a gap between the rotary sputtering target and the backing tube and a device for bonding a rotary sputtering target to a backing tube.
    Type: Grant
    Filed: July 11, 2011
    Date of Patent: April 21, 2015
    Assignee: Materion Advanced Material Technologies and Services Inc.
    Inventors: George Michael Wityak, Luther Wilburn Cox
  • Patent number: 8951394
    Abstract: A magnetron sputtering electrode for use in a rotatable cylindrical magnetron sputtering device, the electrode including a cathode body defining a magnet receiving chamber and a cylindrical target surrounding the cathode body. The target is rotatable about the cathode body A magnet arrangement is received within the magnet receiving chamber, the magnet arrangement including a plurality of magnets. A shunt is secured to the cathode body and proximate to a side of the magnet arrangement, the shunt extending in a plane substantially parallel to the side of the magnet arrangement. A method of fine-tuning a magnetron sputtering electrode in a rotatable cylindrical magnetron sputtering device is also disclosed.
    Type: Grant
    Filed: September 21, 2010
    Date of Patent: February 10, 2015
    Assignee: Angstrom Sciences, Inc.
    Inventors: Mark A. Bernick, Richard Newcomb
  • Patent number: 8940140
    Abstract: A device and method for coating an inside surface of a vessel is provided. In one embodiment, a coating device comprises a power supply and a diode in electrical communication with the power supply, wherein electrodes comprising the diode reside completely within the vessel. The method comprises reversibly sealing electrodes in a vessel, sputtering elemental metal or metal compound on the surface while maintaining the surface in a controlled atmosphere.
    Type: Grant
    Filed: September 5, 2007
    Date of Patent: January 27, 2015
    Assignee: Uchicago Argonne, LLC
    Inventors: Dean R. Walters, Grantley O. Este
  • Patent number: 8900428
    Abstract: In one embodiment, a magnetron assembly comprises a plurality of magnets and a yoke configured to hold the plurality of magnets in at least four independent linear arrays. The plurality of magnets is arranged in the yoke so as to form a pattern comprising an outer portion and an inner portion. The outer portion substantially surrounds the perimeter of the inner portion. The magnets used to form the outer portion have a first polarity and the magnets used to form the inner portion having a second polarity. The outer portion of the pattern comprises a pair of elongated sections that are substantially parallel to one another. The outer portion of the pattern comprises a pair of turnaround sections, wherein each turnaround section substantially spans respective ends of the pair of elongated sections and wherein each turnaround section comprises a plurality of magnets having the first polarity. Other embodiments are described.
    Type: Grant
    Filed: January 6, 2012
    Date of Patent: December 2, 2014
    Assignee: Sputtering Components, Inc.
    Inventors: Daniel Theodore Crowley, William A. Meredith, Jr.
  • Patent number: 8882976
    Abstract: A magnetron unit moving apparatus for preventing magnetization and magnetron sputtering equipment having the same. The magnetron unit moving apparatus includes a magnetron unit disposed adjacent to a target, to generate a specific magnetic field, and a movement unit to space the magnetron unit and the target apart such that a strength of a magnetic field generated over the target is within a predetermined reference strength range. It is possible to space the target and the magnetron unit apart so as to prevent the target from being magnetized when a process is not performed.
    Type: Grant
    Filed: June 9, 2009
    Date of Patent: November 11, 2014
    Assignee: Samsung Display Co., Ltd.
    Inventors: Yun-Mo Chung, Min-Jae Jeong, Jong-Won Hong, Eu-Gene Kang, Heung-Yeol Na, Ki-Yong Lee
  • Patent number: 8845868
    Abstract: A seal and fixation assembly includes a cylindrical target having an inside surface with a shoulder that forms a stop within the target. A target retaining ring is disposed about the target. A seal plate is disposed within the target and engages the stop and the inside surface of the target. An end cap is disposed on the end of the target and includes a portion with a beveled surface within the target. A sealing element is disposed between the inside surface of the target, the seal plate, and the beveled surface of the end cap. A clamp is disposed over the end cap and the target retaining ring. Engagement of the end cap and the target retaining ring with the clamp causes the end cap to move within the target toward the stop to compress the sealing element between the target, the seal plate, and the beveled surface.
    Type: Grant
    Filed: December 2, 2011
    Date of Patent: September 30, 2014
    Assignee: Angstrom Sciences, Inc.
    Inventor: Richard Newcomb
  • Patent number: 8828199
    Abstract: A support device for a magnetron arrangement with a rotating target includes a housing with a drive shaft mounted to rotate in the housing. An end of the drive shaft accessible from outside of the housing connects to the rotating target and another end lies within the housing for introduction of a torque. An electric motor with a stator and a rotor is arranged within the housing to generate a torque.
    Type: Grant
    Filed: November 30, 2010
    Date of Patent: September 9, 2014
    Assignee: VON ARDENNE Anlagentechnik GmbH
    Inventors: Goetz Teschner, Hans-Jürgen Heinrich, Harald Grune, Sven Haehne
  • Patent number: 8828198
    Abstract: To provide a cylindrical sputtering target, whereby cracking during sputtering can be remarkably reduced. A cylindrical sputtering target, wherein a cylindrical target material made of ITO or AZO has a relative density of at least 90%; the angle between the grinding direction on its outer circumferential surface and a straight line parallel with its cylindrical axis (out of such angles, ? represents an angle between 0° and 90°) satisfies 45°<??90° or tan ?>?R/L (where R is an outside diameter of the cylindrical target material, and L is the length of the cylindrical target material); and the surface roughness Ra of the outer circumferential surface of the cylindrical target material is at most 3 ?m.
    Type: Grant
    Filed: July 1, 2008
    Date of Patent: September 9, 2014
    Assignee: Tosoh Corporation
    Inventors: Shigehisa Todoko, Kenichi Itoh, Tetsuo Shibutami
  • Patent number: 8747631
    Abstract: The present disclosure relates to an apparatus and method utilizing double glow discharge for sputter cleaning of a selected surface. The surface may include the inner surface of a hollow substrate such as a tube which inner surface may then be coated via magnetron sputter deposition.
    Type: Grant
    Filed: March 15, 2010
    Date of Patent: June 10, 2014
    Assignee: Southwest Research Institute
    Inventors: Ronghua Wei, Edward Langa, Sabrina L. Lee
  • Patent number: 8741115
    Abstract: The invention provides devices and methods for depositing uniform coatings using cylindrical magnetron sputtering. The devices and methods of the invention are useful in depositing coatings on non-cylindrical workpiece surfaces. An assembly of electromagnets located within the bore of a hollow cylindrical emitter is used to form a magnetic field exterior to and near the exterior surface of the emitter. The magnet assembly configuration is selected to provide a magnetic field configuration compatible with the workpiece surface contour. The electromagnet assembly may be a plurality of magnet units, each unit having at least one electromagnet. The magnetic field strength from each magnet unit is separately and electrically adjustable. Each electromagnet in the assembly has a coil of electrically conducting material surrounding a specially shaped core of magnetic material.
    Type: Grant
    Filed: February 12, 2009
    Date of Patent: June 3, 2014
    Assignee: BH5773 Ltd
    Inventors: Gennady Yumshtyk, Dmitri Ivanov
  • Patent number: 8696879
    Abstract: The invention provides methods and equipment for depositing a low-maintenance coating.
    Type: Grant
    Filed: September 3, 2010
    Date of Patent: April 15, 2014
    Assignee: Cardinal CG Company
    Inventors: Kari B. Myli, Annette J. Krisko, John R. German, Klaus Hartig
  • Patent number: 8663438
    Abstract: The invention relates to a target arrangement comprising a tubular-shaped carrier element and a hollow-cylindrical target having at least one target material, said target comprising at least one one-piece tube segment which at least partially surrounds the carrier element. Said carrier element and the tube segment are partially interconnected in a material fit by at least two plastically deformable compensating means. The invention also relates to a method for producing said type of target arrangement and a tubular segment.
    Type: Grant
    Filed: February 14, 2007
    Date of Patent: March 4, 2014
    Assignee: GFE Fremat GmbH
    Inventors: Grit Hüttl, Folke Steinert, Joachim Wagner
  • Patent number: 8652310
    Abstract: A cylindrical magnetron sputtering apparatus includes a rotating cylindrical sputtering target, a non-rotating magnet structure within the cylindrical sputtering target and at least one non-rotating trim magnet adjacent an end of the magnet structure. The trim magnets are manipulated during operation of the apparatus to alter a magnetic field produced by the magnet structure within the cylindrical sputtering cathode. As a result the shape of a racetrack discharge plasma formed at an end of the sputtering target is altered such that the formation of an erosion groove is avoided.
    Type: Grant
    Filed: July 24, 2008
    Date of Patent: February 18, 2014
    Assignee: Seagate Technology LLC
    Inventor: Paul Stephen McLeod
  • Patent number: 8647486
    Abstract: An apparatus and method for controlling local deposition rate in a physical vapor deposition process is provided. A magnet bar assembly is disposed inside a sputtering target. The magnet bar assembly comprises a magnet bar, a support member aligned with the magnet bar, and one or more sliding brackets that couple the support member to the magnet bar. Each sliding bracket compresses the magnet bar to the support member, allowing the use of spacers between the support member and the magnet bar to adjust local proximity of the magnet bar to the plasma bombarding the target.
    Type: Grant
    Filed: January 5, 2010
    Date of Patent: February 11, 2014
    Assignee: Applied Materials, Inc.
    Inventors: Leszek Malaszewski, James G. Rietzel
  • Patent number: 8585873
    Abstract: A method of sputtering with sputtering apparatus is for depositing a layer upon a substrate. The apparatus includes a sputter target with a face exposed to the substrate and a magnetron providing a magnetic field that moves relative to the target face. The speed of movement of the field is controlled such that the uniformity of the deposition on the substrate is enhanced. A particular method includes monitoring uniformity verses speed, selecting the speed that gives the preferred uniformity and controlling the field to the selected speed. The selected speed may vary over the life of the target, with increased speeds becoming desirable as the target thins.
    Type: Grant
    Filed: October 12, 2005
    Date of Patent: November 19, 2013
    Assignee: Aviza Technology Limited
    Inventors: Mark Ashley Ford, Rajkumar Jakkaraju
  • Patent number: 8568577
    Abstract: Provided is a magnetron sputtering apparatus that increases an instantaneous plasma density on a target to improve a film forming rate. The magnetron sputtering apparatus includes a substrate to be processed, a target installed to face the substrate and a rotary magnet installed at a side opposite to the substrate across the target. In the magnetron sputtering apparatus, plasma loops are formed on a target surface. The plasma loops are generated, move and disappear in an axis direction of the rotary magnet according to a rotation of the rotary magnet.
    Type: Grant
    Filed: April 4, 2008
    Date of Patent: October 29, 2013
    Assignees: National University Corporation Tohoku University, Tokyo Electron Limited
    Inventors: Tadahiro Ohmi, Tetsuya Goto, Takaaki Matsuoka
  • Patent number: 8562798
    Abstract: A physical vapor deposition reactor includes a metal sputter target, a D.C. sputter power source coupled to the metal sputter target and a wafer support pedestal facing the metal sputter target. A movable magnet array is adjacent a side of the metal sputter target opposite the wafer support pedestal. A solid metal RF feed rod engages the metal sputter target and extends from a surface of the target on a side opposite the wafer support pedestal. A VHF impedance match circuit is coupled to an end of the RF feed rod opposite the metal sputter target and a VHF RF power generator coupled to said VHF impedance match circuit. Preferably, the reactor of further includes a center axle about which the movable magnet array is rotatable, the center axle having an axially extending hollow passageway, the RF feed rod extending through the passageway.
    Type: Grant
    Filed: September 7, 2005
    Date of Patent: October 22, 2013
    Assignee: Applied Materials, Inc.
    Inventors: Karl M. Brown, John Pipitone, Vineet Mehta
  • Patent number: 8562799
    Abstract: An end-block for use in a tubular magnetron sputtering apparatus is disclosed. Such an end-block rotatably transfers movement, coolant 5 and electrical current to the target while maintaining vacuum integrity and a closed coolant circuit. It hence comprises a drive means, a rotary electrical contact means, a bearing means, a number of rotary coolant seal means and a number of vacuum seal means. The inventive end-block occupies a minimal axial length along the target thus allowing 10 space savings in existing equipment such as e.g. display coaters. The axial length is reduced by mounting at least two of the means radial to one another.
    Type: Grant
    Filed: October 11, 2005
    Date of Patent: October 22, 2013
    Assignee: Soleras Advanced Coatings BVBA
    Inventors: Krist Dellaert, Wilmert De Bosscher, Joannes De Boever, Gregory Lapeire
  • Patent number: 8551307
    Abstract: A sputtering target apparatus is provided. The sputtering target apparatus includes a first target assembly including a first target array having a first target, a second target disposed adjacent to the first target, and a first target dividing region disposed between the first and second targets, the first target assembly extending along a first direction, wherein the first target dividing region has a longitudinal cross-section that is oblique with respect to the first direction.
    Type: Grant
    Filed: May 13, 2010
    Date of Patent: October 8, 2013
    Assignee: Samsung Display Co., Ltd.
    Inventors: Do-Hyun Kim, Dong-Hoon Lee, Chang-Oh Jeong
  • Patent number: 8535490
    Abstract: A new and useful rotatable sputter magnetron assembly is provided, that addresses the issue of uneven wear of the target electrode tube. According to the principles of the present invention, a rotatable sputter magnetron assembly for use in magnetron sputtering target material onto a substrate comprises a. a longitudinally extending tubular shaped target electrode tube having a longitudinal central axis, b. the target electrode tube extending about a magnet bar that is configured to generate a plasma confining magnetic field adjacent the target electrode tube, c. the magnet bar being held substantially stationary within the target electrode tube, and d. the target electrode tube supported for rotation about its longitudinal central axis and for axial movement along its longitudinal central axis, so that wear of the target electrode tube can be controlled by moving the target electrode tube axially during magnetron sputtering of the target material.
    Type: Grant
    Filed: June 6, 2008
    Date of Patent: September 17, 2013
    Assignee: General Plasma, Inc.
    Inventors: John Madocks, Patrick Lawrence Morse
  • Patent number: 8512526
    Abstract: A plasma-enhanced physical vapor deposition method in which VHF power is applied to the sputter target in addition to a D.C. voltage that is also applied to the target, the VHF power level being 3.5 kW or greater, so that the D.C. target power may be reduced to less than 500 W while still attaining a very high ion fraction (in excess of 50%), permitting a very small workpiece-to-target spacing not exceeding a fraction (7/30) of the workpiece diameter to enhance the ionization fraction throughout the process region.
    Type: Grant
    Filed: September 7, 2005
    Date of Patent: August 20, 2013
    Assignee: Applied Materials, Inc.
    Inventors: Karl M. Brown, John Pipitone, Vineet Mehta
  • Patent number: 8506773
    Abstract: A drive end block for a magnetron arrangement with a rotating target, comprises an end block housing having a rotatably mounted drive shaft. The drive shaft is arranged in the end block housing, accessible at an end from outside of the end block housing for connection to the rotating target, and adapted at its end inside the end block housing for introduction of a torque. An electric motor with a stator and a rotor for creating the torque is arranged inside the end block housing.
    Type: Grant
    Filed: July 17, 2009
    Date of Patent: August 13, 2013
    Assignee: VON ARDENNE Anlagentechnik GmbH
    Inventors: Hans-Juergen Heinrich, Sven Haehne
  • Patent number: 8500976
    Abstract: A sputtering magnetron (300) insertable in a rotatable target is described. The magnetron is designed around a single piece, multiwalled tube (102, 202) with compartments (316, 316?, 318, 318?) extending over the length of the tube. The multiwalled tube gives a much stiffer magnetron carrier structure compared to prior art magnetrons. As a result, the magnetic field generator can be mounted inside a compartment and the distance between magnets and target surface is easily adjustable as the tube is much stiffer than the generator. Additionally, the coolant channels can be incorporated inside the tube and close to the outer wall of the tube so that coolant can be supplied in the vicinity of the magnetic field generator. The increased stiffness of the magnetron allows the target tube to be carried by the magnetron—not the other way around—at least during part of the useful life of the target.
    Type: Grant
    Filed: May 6, 2009
    Date of Patent: August 6, 2013
    Assignee: Soleras Advanced Coatings BVBA
    Inventors: Parsifal Goderis, Ivan Van De Putte
  • Publication number: 20130168242
    Abstract: A magnetic core for cylindrical magnetron sputtering target includes a housing and a magnet array. The housing includes a mounting plate and a base. The magnet array is mounted in the mounting plate and is enclosed in the housing. The magnet array includes a plurality of magnet segments stacked end to end.
    Type: Application
    Filed: June 27, 2012
    Publication date: July 4, 2013
    Applicants: HON HAI PRECISION INDUSTRY CO. LTD., HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD.
    Inventors: TENG-TSUNG HUANG, HUA-YONG XU, ZHEN-ZHANG LIU
  • Patent number: 8398834
    Abstract: Rotatable magnetron sputtering apparatuses are described for depositing material from a target while reducing premature burn through issues. The rotatable magnetron sputtering apparatus includes electric coils wound on pole pieces to modulate the magnetic fields at the ends of the magnetron magnetic assembly. Changing the direction of electric current moves the sputtering region alternately around its normal central position to decrease the rate of erosion depth at the ends of the target material.
    Type: Grant
    Filed: April 2, 2010
    Date of Patent: March 19, 2013
    Assignee: Nuvosun, Inc.
    Inventor: Dennis R. Hollars
  • Patent number: 8388753
    Abstract: A coating apparatus includes a deposition case, a reaction assembly, two precursors, a target, and a driving assembly. The deposition case includes a housing defining a cavity for receiving workpieces. The reaction assembly receives in the cavity and includes an outer barrel, an inner barrel, a plurality of nozzles, and a plurality of pipes. The outer barrel includes a main body and two protruding bodies. The main body and the inner barrel cooperatively define a first room therebetween. Each protruding body defines a second room communicating with the first room. The inner barrel defines a third room. The nozzles extend from the main body and communicate with the first room. The pipes extend from the inner barrel and communicate with the third room. The precursors receive in the second rooms. The target receives in the third room. The driving assembly drives the housing to rotate relative to the reaction assembly.
    Type: Grant
    Filed: May 31, 2010
    Date of Patent: March 5, 2013
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventor: Shao-Kai Pei
  • Publication number: 20130043121
    Abstract: A plasma lens for enhancing the quality and rate of sputter deposition onto a substrate is described herein. The plasma lens serves to focus positively charged ions onto the substrate while deflecting negatively charged ions, while at the same time due to the line of sight positioning of the lens, allowing for free passage of neutrals from the target to the substrate. The lens itself is formed of a wound coil of multiple turns, inside of which are deposed spaced lens electrodes which are electrically paired to impress an E field overtop the B field generated by the coil, the potential applied to the electrodes increasing from end to end towards the center of the lens, where the applied voltage is set to a high potential at the center electrodes as to produce a potential minimum on the axis of the lens.
    Type: Application
    Filed: October 5, 2012
    Publication date: February 21, 2013
    Applicant: The Regents of the University of California
    Inventor: The Regents of the University of California
  • Patent number: 8357272
    Abstract: A quantum dot manipulating method and a generation/manipulation apparatus are provided which can control the size of a large number of generated quantum dots on or below the order of percent which is required for optical applications of the dots. Quantum dots are generated by shining a dot production laser (4a) onto a solid object (3) in a quantum dot production/manipulation apparatus (1) containing superfluid helium (7) therein. A dot manipulation laser (5a) is shone onto the generated quantum dots to manipulate the quantum dots.
    Type: Grant
    Filed: February 25, 2009
    Date of Patent: January 22, 2013
    Assignee: Japan Science and Technology Agency
    Inventors: Tadashi Itoh, Masaaki Ashida, Hajime Ishihara, Takuya Iida
  • Patent number: 8349156
    Abstract: Disclosed invention uses a coaxial microwave antenna to enhance ionization in PVD or IPVD. The coaxial microwave antenna increases plasma density homogeneously adjacent to a sputtering cathode or target that is subjected to a power supply. The coaxial microwave source generates electromagnetic waves in a transverse electromagnetic (TEM) mode. The invention also uses a magnetron proximate the sputtering cathode or target to further enhance the sputtering. Furthermore, for high utilization of expensive target materials, a target can rotate to improve the utilization efficiency. The target comprises dielectric materials, metals, or semiconductors. The target also has a cross section being substantially symmetric about a central axis that the target rotates around. The target may have a substantially circular or annular a cross section.
    Type: Grant
    Filed: May 14, 2008
    Date of Patent: January 8, 2013
    Assignee: Applied Materials, Inc.
    Inventors: Michael W. Stowell, Richard Newcomb
  • Patent number: 8337681
    Abstract: To achieve an improved end block, in which heating by induction eddy currents, which may occur during AC sputtering, for example, is significantly reduced relative to known end blocks, an end block for a magnetron configuration having a rotating target comprises an end block housing having an attachment surface for attaching the end block on a support apparatus, a pivot bearing for rotatable mounting of the rotating target, and at least one current conduction apparatus which conducts current through the end block housing in operation of the end block. The end block housing is implemented so that each current path in the end block housing which encloses the current conduction apparatus has an interruption at least one point.
    Type: Grant
    Filed: November 18, 2009
    Date of Patent: December 25, 2012
    Assignee: Von Ardenne Anlagentechnik GMGH
    Inventors: Hans-Juergen Heinrich, Ulf Seyfert, Goetz Teschner
  • Patent number: 8277617
    Abstract: An apparatus and method for magnetron sputter coating of an interior surface of a hollow substrate defining at least one irregular contour. The apparatus may contain a vacuum chamber and a target containing one or more metals having an exterior surface defining at least one irregular contour. The exterior surface of the target may be configured to conform to at least a portion of an irregular contour of the interior surface of the hollow substrate to be coated. A magnet assembly may be supplied which may include a plurality of magnets where the magnets are positioned substantially within a metallic target alloy.
    Type: Grant
    Filed: August 14, 2007
    Date of Patent: October 2, 2012
    Assignee: Southwest Research Institute
    Inventors: Kuang-Tsan Kenneth Chiang, Ronghua Wei
  • Patent number: 8273222
    Abstract: The present disclosure relates to an apparatus and method for depositing coatings on the surface of a workpiece with sputtering material in an ion plasma environment. The apparatus may include a magnetron including a core cooling system surrounded by a magnet assembly and target material having a surface capable of providing a source of sputtering material. An RF plasma generation assembly is also provided in the apparatus including an RF antenna capable of providing an RF plasma and drawing ions to one or both of the workpiece surface and target material surface.
    Type: Grant
    Filed: May 16, 2007
    Date of Patent: September 25, 2012
    Assignee: Southwest Research Institute
    Inventors: Ronghua Wei, Sabrina L. Lee
  • Patent number: 8192597
    Abstract: A coating apparatus (100) for batch coating of substrates is presented. In the batch coater layers of a stack can be deposited by means of physical vapor deposition, by means of chemical vapor deposition or by a mixture of both processes. When compared to previous apparatus, the mixed mode process is particularly stable. This is achieved by using a rotatable magnetron (112) rather than the prior-art planar magnetrons. The apparatus is further equipped with a rotatable shutter that allows for concurrent or alternating process steps.
    Type: Grant
    Filed: March 14, 2007
    Date of Patent: June 5, 2012
    Assignee: NV Bekaert SA
    Inventors: Erik Dekempeneer, Wilmert De Bosscher, Pascal Verheyen
  • Patent number: 8192598
    Abstract: An end block for a magnetron device having a rotatable target comprises an end block housing having a pivot bearing. The end block housing is adapted on its outer side for attachment on a support unit, and the pivot bearing is adapted on an end that is accessible from outside the end block housing, for connection to the rotatable target. The end block housing is movably attached on the support unit. A vacuum coating apparatus has a vacuum chamber, a magnetron device situated in the vacuum chamber, and a rotatable target rotatably mounted on at least one such end block.
    Type: Grant
    Filed: July 17, 2009
    Date of Patent: June 5, 2012
    Assignee: VON ARDENNE Anlagentechnik GmbH
    Inventors: Hans-Juergen Heinrich, Goetz Grosser, Sven Haehne, Ulf Seyfert
  • Patent number: 8152975
    Abstract: A target assembly for material deposition includes a first target piece having a first sputtering surface and comprising a first target material that is to be sputtered off the first sputtering surface and to deposit on a substrate. The target assembly also includes a second target piece juxtaposed to the first target piece. The second target piece comprises a second sputtering surface and a second target material that can be sputtered off the second sputtering surface and to deposit on the substrate. The first target piece and the second target piece are configured to be switched in positions and/or orientations after a period of sputtering operations.
    Type: Grant
    Filed: March 30, 2007
    Date of Patent: April 10, 2012
    Assignee: Ascentool International
    Inventors: George X. Guo, Kai-an Wang
  • Patent number: 8137510
    Abstract: This invention relates to a coater for the coating, in particular, of large-area substrates by means of cathode sputtering, the coater having a coating chamber and, provided therein, a cathode assembly (2) where the material to be sputtered is located on a target (4) with a curved surface, the material to be sputtered being located, in particular, on the lateral surface of a cylinder, there being in a single coating chamber for a coherent coating zone at least three, preferably more, cathode assemblies (2) with rotatable, curved targets (4) positioned one beside the other.
    Type: Grant
    Filed: May 4, 2005
    Date of Patent: March 20, 2012
    Assignee: Applied Materials GmbH & Co. KG
    Inventors: Stefan Bangert, Frank Fuchs, Ralph Lindenberg, Andreas Lopp, Uwe Schüssler, Tobias Stolley
  • Patent number: 8137517
    Abstract: A sputtering system includes a first sputtering assembly configured to sputter material onto a first disk and a second sputtering assembly configured to sputter material onto a second disk, the second sputtering assembly positioned proximate the first sputtering assembly. The first sputtering assembly includes a first magnetic ring, and the second sputtering assembly includes a second magnetic ring. The first magnetic ring includes a first region of lower relative magnetic strength positioned near the second magnetic ring, and the second magnetic ring includes a second region of lower relative magnetic strength positioned near the first magnetic ring.
    Type: Grant
    Filed: February 10, 2009
    Date of Patent: March 20, 2012
    Assignee: WD Media, Inc.
    Inventor: Allen Bourez
  • Patent number: 8123919
    Abstract: Certain example embodiments of this invention relate to a rotatable magnetron sputtering target(s) for use in sputtering material(s) onto a substrate. In certain example embodiments, the target includes a cathode tube with a target material applied thereto via plasma spraying or the like. A bonding layer is provided on the tube, between the cathode tube and the target material. The bonding layer is thicker proximate at least one end portion of the target than at a central portion of the target in order to reduce the likelihood of burn-through to or of the cathode tube during sputtering.
    Type: Grant
    Filed: September 20, 2005
    Date of Patent: February 28, 2012
    Assignee: Guardian Industries Corp.
    Inventors: Raymond M. Mayer, Yiwei Lu
  • Patent number: 8092657
    Abstract: A module to carry targets in a sputter deposition installation for coating two-sided substrates is described. The module is mountable to the installation through an interface flange that carries at least two targets with their associated magnet systems. When the module is mounted, the targets take positions at opposite sides of the two-sided substrate, while the magnet systems orient the sputter deposition towards the substrate. The module enables coating of both sides of the substrate in one single pass. Different configurations are described with gas distribution systems and additional substrate supports. An enclosure with adjustable blinds in order to reduce gas spreading is also included.
    Type: Grant
    Filed: June 14, 2006
    Date of Patent: January 10, 2012
    Assignee: Bekaert Advanced Coatings
    Inventors: Wilmert De Bosscher, Ivan Van De Putte, Koen Staelens
  • Patent number: 8057649
    Abstract: Disclosed is an invention that uses a coaxial microwave antenna as a primary plasma source in PVD. The coaxial microwave antenna is positioned inside a sputtering target. Instead of using a cathode assist in sputtering, microwaves generated from the coaxial microwave antenna may leak through the sputtering target that comprises a dielectric material to form microwave plasma outside the sputtering target. To further enhance plasma density, a magnetron or a plurality of magnetrons may be added inside the target to help confine secondary electrons. An electric potential may be formed between adjacent magnetrons and may further enhance ionization. To achieve directional control of the generated microwaves, a shield that comprises a dielectric material or dielectric material coated metal may be added proximate the coaxial microwave antenna. Furthermore, for high utilization of expensive target materials, a target can rotate to improve the utilization efficiency.
    Type: Grant
    Filed: May 6, 2008
    Date of Patent: November 15, 2011
    Assignee: Applied Materials, Inc.
    Inventors: Michael W. Stowell, Nety Krishna
  • Patent number: 8043488
    Abstract: The invention relates to a rotatable sputter target and to a method to manufacture such a sputter target. The sputter target comprises a target material and a magnet array located at the interior of the target material. The magnet array defines a central zone extending along the major part of the length of the target material and defines an end zone at each end of the central zone. The target material comprises a first material and a second material. The target material comprises the first material at least on the central zone and comprises the second material at least on the end zones. The second material has a lower sputter deposition rate than the first material. The second material is preferably applied by thermal spraying. The first material comprises a first element and the second material comprises a compound of the first element of the first material.
    Type: Grant
    Filed: May 31, 2007
    Date of Patent: October 25, 2011
    Assignee: Bekaert Advanced Coatings
    Inventor: Wilmert De Bosscher
  • Patent number: 8038858
    Abstract: An apparatus for deposition of plasma reaction films includes a substrate for the deposition of either thin or thick films. The substrate also allows for a film deposition which adheres to the substrate, and also films which may be removed after deposition. The cathode may be fabricated from individual wires, or it may be fabricated from a single conductor. A macro-particle filter which preferentially traps larger particles may be introduced between a porous cathode and the deposition surface. The macro-particle filter may also carry electrical current as is useful for generating a magnetic field such that a Lorentz force acts preferentially on ionized particles, allowing them to pass through the filter while trapping macroparticles that are not influenced by the magnetic field.
    Type: Grant
    Filed: November 7, 2005
    Date of Patent: October 18, 2011
    Assignee: Alameda Applied Sciences Corp
    Inventors: Brian L. Bures, Jason D. Wright, Michael Y. Au, Andrew N. Gerhan, Mahadevan Krishnan
  • Patent number: 7993496
    Abstract: In some embodiments, the invention includes a cylindrical cathode target assembly for use in sputtering target material onto a substrate that comprises a generally cylindrical target, means for rotating the target about its axis during a sputtering operation, an elongated magnet carried within the target for generation of a plasma-containing magnetic field exterior to but adjacent the target, a framework for supporting the magnet against rotation within the target, and a power train for causing the magnet to oscillate within and axially of the target in a substantially asynchronous manner to promote generally uniform target utilization along its length, as well as its method of use. In some embodiments, the magnet is oscillated in response to rotation of the target.
    Type: Grant
    Filed: June 30, 2005
    Date of Patent: August 9, 2011
    Assignees: Cardinal CG Company, General Plasma, Inc.
    Inventors: Klaus Hartig, Steve E. Smith, John E. Madocks
  • Patent number: 7972486
    Abstract: A machine for coating a transparent substrate for the production of display screens comprises a coating chamber that has a modular design. Each of the modules 1 features a chamber section 2, a first support 3 that is arranged removably in or at the chamber section 2, and a second support 4 that is arranged removably at the first support 3. Whereas the first support 3 bears the cathodes, the second support 4 is formed as a cover at which are arranged the pumps for producing a vacuum in the coating chamber. Carriers 3 and 4 can be removed laterally from the chamber section 2 to such an extent that areas 11a, 11b accessible to persons can be formed between the module components. In this way, the components of the machine are readily accessible, for example for maintenance purposes. Work can be done simultaneously on the cathodes and in the chamber interior.
    Type: Grant
    Filed: April 7, 2006
    Date of Patent: July 5, 2011
    Assignee: Applied Materials GmbH & Co. KG
    Inventors: Hans Buchberger, Andreas Geiss, Jörg Krempel-Hesse, Dieter Haas
  • Publication number: 20110108416
    Abstract: A magnetron sputter comprises a carrier, a magnet assembly, at least a middle magnetic ring, a target and at least a conducting magnetic ring. The magnet assembly is disposed on a carrying surface of the carrier comprising a permanent magnet and an external magnetic ring. The middle magnetic ring is disposed between the permanent magnet and the external magnetic ring of the magnet assembly. The target is disposed above the magnet assembly having a first surface which faces the carrying surface. The conducting magnetic ring is disposed on the first surface.
    Type: Application
    Filed: November 10, 2009
    Publication date: May 12, 2011
    Inventors: Cheng-Tsung LIU, Ming-Chih Lai
  • Patent number: 7938943
    Abstract: A supply end block to supply a sputter cathode with a coolant and electrical voltage, includes a housing with a coolant connection and a current connection as well as a support shaft mounted to rotate, on which a target tube is fastened. The coolant connection and current connection are brought together directly at a feed site so that the coolant is brought to the potential of the applied electric voltage on entering the housing of the end block. Optimal cooling of the current feed is achieved, and optimal potential equalization of the coolant simultaneously occurs.
    Type: Grant
    Filed: October 17, 2007
    Date of Patent: May 10, 2011
    Assignee: Von Ardenne Anlagentechnic GmbH
    Inventors: Hans-Juergen Heinrich, Goetz Teschner, Thorsten Sander, Cornell Weidelt, Joern Brueckner