Coating Is Dendritic Or Nodular Patents (Class 205/111)
  • Patent number: 10914017
    Abstract: The Sn-plated steel sheet of the disclosure is an Sn-plated steel sheet including: a steel sheet; an Sn plating layer formed on at least one side of the steel sheet and containing, based on % by mass, from 0.1 g/m2 to 15 g/m2 of metal Sn; and a coating layer formed on the surface of the Sn plating layer and containing zirconium oxide and tin oxide; in which the content of the zirconium oxide in the coating layer is from 0.2 mg/m2 to 50 mg/m2 in terms of metal Zr amount, and the peak position of binding energy of Sn3d5/2 according to X-ray photoelectron spectroscopy of the tin oxide in the coating layer is 1.6 eV or higher than the peak position of binding energy of the metal Sn.
    Type: Grant
    Filed: May 24, 2017
    Date of Patent: February 9, 2021
    Assignee: NIPPON STEEL CORPORATION
    Inventors: Shintaro Yamanaka, Shigeru Hirano, Morio Yanagihara, Hirokazu Yokoya
  • Patent number: 10865491
    Abstract: The Sn-based alloy plated steel sheet of this disclosure includes: a steel sheet; a composite plating layer formed on at least one side of the steel sheet and including an Fe—Ni—Sn alloy layer and an island-shaped Sn layer located on the Fe—Ni—Sn alloy layer; and a coating layer formed on the surface of the composite plating layer and containing zirconium oxide and tin oxide, and the composite plating layer contains a predetermined amount of Ni and a predetermined amount of Sn, a content of the zirconium oxide in the coating layer is from 0.2 mg/m2 to 50 mg/m2 in terms of metal Zr amount, and a peak position of binding energy of Sn3d5/2 according to X-ray photoelectron spectroscopy of the tin oxide in the coating layer is 1.6 eV or higher than a peak position of binding energy of the metal Sn.
    Type: Grant
    Filed: May 24, 2017
    Date of Patent: December 15, 2020
    Assignee: NIPPON STEEL CORPORATION
    Inventors: Shintaro Yamanaka, Shigeru Hirano, Morio Yanagihara, Hirokazu Yokoya
  • Patent number: 10826117
    Abstract: The present disclosure relates to an electrolytic copper foil for graphene and a method for producing the copper foil. More particularly, the present disclosure relates to an electrolytic copper foil for graphene and a method for producing the copper foil, which may facilitate formation of graphene by blocking surface deformation during the electrolytic copper foil formation. In accordance with the present disclosure, the Rz roughness of the S-face of the electrolytic copper foil after 1 hour treatment at 200° C. in the synthesis of graphene on the electrolytic copper foil is defined based on the Relationship 1 below. This may also minimize the deformation of the surface of the electrolytic copper foil at high temperatures: 0.05?(Rz roughness of M-face of electrolytic copper foil/Rz roughness of S-face after treatment at 200° C. for 1 hour)/thickness of electrolytic copper foil?0.2.
    Type: Grant
    Filed: March 21, 2017
    Date of Patent: November 3, 2020
    Assignee: ILJIN MATERIALS CO., LTD.
    Inventors: Tae Jin Jo, Sun Hyoung Lee, Seul-Ki Park, Ki Deok Song
  • Patent number: 10820414
    Abstract: Disclosed is a surface treated copper foil, which is capable of favorably reducing the transmission loss even when used in a high frequency circuit substrate, and after laminating with a resin, heating at a predetermined temperature for a predetermined time (at 180° C. for 10 days), the peel strength of the surface treated copper foil and the resin is favorable.
    Type: Grant
    Filed: November 30, 2017
    Date of Patent: October 27, 2020
    Assignee: JX Nippon Mining & Metals Corporation
    Inventors: Hideta Arai, Ryo Fukuchi, Atsushi Miki
  • Patent number: 10644320
    Abstract: An electrolytic copper foil capable of securing a secondary battery having a high capacity retention rate, an electrode including the same, a secondary battery including the same, and a method of manufacturing the same. The electrolytic copper foil, which includes a first surface and a second surface opposite to the first surface, includes a copper layer including a matte surface facing the first surface and a shiny surface facing the second surface, and a first protective layer on the matte surface of the copper layer, wherein the first protective layer includes chromium (Cr) and the first surface of the electrolytic copper foil has an adhesion factor of 1.5 to 16.3.
    Type: Grant
    Filed: July 27, 2017
    Date of Patent: May 5, 2020
    Assignee: KCF TECHNOLOGIES CO., LTD.
    Inventor: Seung Min Kim
  • Patent number: 10294577
    Abstract: Provided is a chemical treatment steel sheet including a steel sheet; a composite coated layer which is formed on at least one surface of the steel sheet, and contains 2 to 200 mg/m2 of Ni in terms of an amount of metal Ni and 0.1 to 10 g/m2 of Sn in terms of an amount of metal Sn, and in which an island-shaped Sn coated layer is formed on an Fe—Ni—Sn alloy layer; and a chemical treatment layer that is formed on the composite coated layer, and contains a 0.01 to 0.1 mg/m2 of Zr compounds in terms of an amount of metal Zr and 0.01 to 5 mg/m2 of phosphate compounds in terms of an amount of P.
    Type: Grant
    Filed: October 8, 2015
    Date of Patent: May 21, 2019
    Assignee: NIPPON STEEL & SUMITOMO METAL CORPORATION
    Inventors: Yoshiaki Tani, Shigeru Hirano, Akira Tachiki, Morio Yanagihara, Makoto Kawabata, Hirokazu Yokoya
  • Patent number: 10236272
    Abstract: A bonding wire for a semiconductor device includes a Cu alloy core material and a Pd coating layer formed on a surface thereof, and the boding wire contains one or more elements of As, Te, Sn, Sb, Bi and Se in a total amount of 0.1 to 100 ppm by mass. The bonding longevity of a ball bonded part can increase in a high-temperature and high-humidity environment, improving the bonding reliability. When the Cu alloy core material further contains one or more of Ni, Zn, Rh, In, Ir, Pt, Ga and Ge in an amount, for each, of 0.011 to 1.2% by mass, it is able to increase the reliability of a ball bonded part in a high-temperature environment of 170° C. or more. When an alloy skin layer containing Au and Pd is further formed on a surface of the Pd coating layer, wedge bondability improves.
    Type: Grant
    Filed: September 18, 2015
    Date of Patent: March 19, 2019
    Assignees: Nippon Micrometal Corporation, Nippon Steel & Sumikin Materials Co., Ltd.
    Inventors: Takashi Yamada, Daizo Oda, Teruo Haibara, Tomohiro Uno
  • Patent number: 10093800
    Abstract: The present invention relates to a polyphenylene ether resin composition, and a prepreg and a copper dad laminate made therefrom. The polyphenylene ether resin composition comprises: (A) functionalized polyphenylene ether resin, (B) crosslinking agent, and (C) initiator; the component (A) functionalized polyphenylene ether resin is polyphenylene ether resin that has a number average molecular weight of 500-5000 and unsaturated double bonds at the molecule terminal; the component (B) crosslinking agent is olefin resin with a number average molecular weight of 500-10000, of which styrene structure comprises 10-50 wt %, and of which the molecule comprises 1,2-addition butadiene structure. The polyphenylene ether resin composition of the present invention is a composition of functionalized polyphenylene ether resin with a low molecular weight. The prepreg and copper clad laminate made from the polyphenylene ether resin composition have good dielectric properties and heat resistance.
    Type: Grant
    Filed: March 18, 2013
    Date of Patent: October 9, 2018
    Assignee: GUANGDONG SHENGYI SCI. TECH CO., LTD.
    Inventor: Xian-Ping Zeng
  • Patent number: 9728813
    Abstract: A method is provided for fabricating a thin film solid-state Li-ion battery comprising a first electrode layer, a solid electrolyte layer, and a second electrode layer. The method comprises depositing, on a substrate, an initial layer stack comprising a first layer comprising a first electrode material compound, and a second layer comprising an electrolyte material compound; and afterwards performing a lithiation step comprising incorporating Li in the first layer and in the second layer, thereby forming a stack of a first electrode layer and a solid electrolyte layer. The initial layer stack may further comprise a third layer comprising a second electrode material compound. By performing the lithiation step, Li is also incorporated in the third layer, such that a stack of a first electrode layer, a solid electrolyte layer, and a second electrode layer is formed. One or more of the first, second, or third layers may be Li-free.
    Type: Grant
    Filed: May 4, 2016
    Date of Patent: August 8, 2017
    Assignees: IMEC VZW, Katholieke Universiteit Leuven, KU Leuven R&D
    Inventors: Nouha Labyedh, Alfonso Sepulveda Marquez, Philippe Vereecken
  • Patent number: 9578741
    Abstract: Provided is a copper foil for a printed wiring board including a roughened layer on at least one surface thereof. In the roughened layer, the average diameter D1 at the particle bottom being apart from the bottom of each particle by 10% of the particle length is 0.2 to 1.0 ?m, and the ratio L1/D1 of the particle length L1 to the average diameter D1 at the particle bottom is 15 or less. In the copper foil for printed wiring board, when a copper foil for printed wiring having a roughened layer is laminated to a resin and then the copper layer is removed by etching, the sum of areas of holes accounting for the resin roughened surface having unevenness is 20% or more. The present invention involves the development of a copper foil for a semiconductor package substrate that can avoid circuit erosion without causing deterioration in other properties of the copper foil.
    Type: Grant
    Filed: March 26, 2013
    Date of Patent: February 21, 2017
    Assignee: JX Nippon Mining & Metals Corporation
    Inventors: Tomota Nagaura, Michiya Kohiki, Terumasa Moriyama
  • Patent number: 9464356
    Abstract: Among other things, a device for use in electrolyzing water is described. The device comprises an electrolysis unit that includes a chamber, an ion exchange structure in the chamber, a cathode, an anode, a high pressure chamber, and a reservoir. The chamber is separated by the ion exchange structure into a first compartment and a second compartment. The cathode is in the first compartment and the anode in the second compartment. The reservoir is disposed in the high pressure chamber for storing water to be supplied to the chamber of the electrolysis unit. In some implementations, the ion exchange structure is a proton exchange membrane.
    Type: Grant
    Filed: September 20, 2012
    Date of Patent: October 11, 2016
    Assignee: Encite LLC
    Inventors: Stephen Alan Marsh, Donald Merrill Parker
  • Patent number: 9028972
    Abstract: A copper foil for a printed wiring board, the copper foil being characterized by having, on at least one surface thereof, a roughed layer of the copper foil in which an average diameter at a particle root (D1) corresponding to a distance of 10% of a particle length from the root, is 0.2 ?m to 1.0 ?m, and a ratio of the particle length (L1) to the average diameter at the particle root (D1) is 15 or less when L1/D1. A copper foil for a printed wiring board, wherein a sum of area covered by holes on an uneven and roughened surface of a resin is 20% or more at a surface of the resin formed by laminating the resin and a copper foil for a printed wiring having a roughened layer and then removing the copper layer by etching. An object of the present invention is to develop a copper foil for a semiconductor package board in which the aforementioned phenomenon of circuit erosion is avoided without deteriorating other properties of the copper foil.
    Type: Grant
    Filed: September 8, 2011
    Date of Patent: May 12, 2015
    Assignee: JX Nippon Mining & Metals Corporation
    Inventors: Michiya Kohiki, Terumasa Moriyama
  • Publication number: 20140144782
    Abstract: A method to inexpensively and efficiently produce conductive materials on the surface of which a nano-level fine structure is formed includes surface modification including immersing a stable anode electrode and a workpiece as a cathode electrode, the workpiece including a conductive material with a work surface, in an electrolytic solution, then applying a voltage not less than a first voltage and less than a second voltage between the stable anode electrode and the workpiece as the cathode electrode immersed in the electrolytic solution, thereby modifying the work surface, the first voltage being a voltage corresponding to a current value that is ½ of the sum of a first maximum current value appearing first in a positive voltage region and a first minimum current value appearing first in the positive voltage region with respect to voltage-current characteristics of a surface modification treatment system, the second voltage exhibiting a complete-state plasma.
    Type: Application
    Filed: August 26, 2011
    Publication date: May 29, 2014
    Applicant: JFE STEEL CORPORATION
    Inventors: Masayasu Nagoshi, Kaoru Sato, Seiichi Watanabe, Souki Yoshida
  • Patent number: 8609273
    Abstract: An anode for a lithium ion secondary battery includes an anode, and a LiF-based coating layer formed with LiF-based particles on a surface of the anode. The LiF-based coating layer has a thickness of 0.05 to 1 ?m. The anode allows the LiF-based coating layer created by side reaction of LiPF6 during a battery charging/discharging process to be relatively uniformly formed on the anode surface, thereby elongating the life cycle of a lithium ion secondary battery.
    Type: Grant
    Filed: February 24, 2009
    Date of Patent: December 17, 2013
    Assignee: LG Chem, Ltd.
    Inventors: Yoon-Jung Bae, Han-Ho Lee, Jin-Hyuk Min, Eun-Ju Lee, Jong-Seok Jeong
  • Publication number: 20130115453
    Abstract: The present invention is directed to a hybrid nanostructure. The hybrid nanostructure includes at least two pseudocapacitative materials arranged in an elongate core-shell arrangement, wherein the core is an elongate nanostructure comprising or consisting of the first pseudocapacitative material and the shell is a plurality of flake- or sheet-like nanostructures attached to the core structure and comprising or consisting of the second pseudocapacitative material. The present invention also relates to a method for forming the hybrid nanostructure, and an electrode including a plurality of the hybrid nanostructures.
    Type: Application
    Filed: November 1, 2012
    Publication date: May 9, 2013
    Applicant: NANYANG TECHNOLOGICAL UNIVERSITY
    Inventor: Nanyang Technological University
  • Patent number: 8252166
    Abstract: A rolled copper or copper alloy foil having a roughened surface formed of fine copper particles is obtained by subjecting a rolled foil to roughening plating with a plating bath containing copper sulfate (Cu equivalent of 1 to 50 g/L), 1 to 150 g/L of sulfuric acid, and one or more additives selected among sodium octyl sulfate, sodium decyl sulfate, and sodium dodecyl sulfate under the conditions of temperature of 20 to 50° C. and current density of 10 to 100 A/dm2. The foil has reduced craters, which are defects unique to rolled foils having a roughened surface, has high strength, adhesive strength with the resin layer, acid resistance and anti-tin plating solution properties, high peel strength, favorable etching properties and gloss level, and is suitable for producing a flexible printed wiring board capable of bearing a fine wiring pattern. A method of roughening the rolled foil is also provided.
    Type: Grant
    Filed: September 23, 2011
    Date of Patent: August 28, 2012
    Assignee: JX Nippon Mining & Metals Corporation
    Inventors: Yousuke Kobayashi, Atsushi Miki, Keisuke Yamanishi
  • Patent number: 8206569
    Abstract: A method and apparatus for forming a reliable and cost efficient battery or electrochemical capacitor electrode structure that has an improved lifetime, lower production costs, and improved process performance are provided. In one embodiment a method for forming a three dimensional porous electrode for a battery or an electrochemical cell is provided. The method comprises depositing a columnar metal layer over a substrate at a first current density by a diffusion limited deposition process and depositing three dimensional metal porous dendritic structures over the columnar metal layer at a second current density greater than the first current density.
    Type: Grant
    Filed: January 29, 2010
    Date of Patent: June 26, 2012
    Assignee: Applied Materials, Inc.
    Inventors: Sergey D. Lopatin, Dmitri A. Brevnov, Robert Z. Bachrach
  • Patent number: 8192605
    Abstract: Embodiments described herein generally relate to methods and apparatus for forming an electrode structure used in an energy storage device. More particularly, embodiments described herein relate to methods and apparatus for characterizing nanomaterials used in forming high capacity electrode structures for energy storage devices. In one embodiment a process for forming an electrode structure for an energy storage device is provided. The process comprises depositing a columnar metal structure over a substrate at a first current density by a diffusion limited deposition process, measuring a capacitance of the columnar metal structure to determine a surface area of the columnar metal structure, and depositing three dimensional porous metal structures over the columnar metal structure at a second current density greater than the first current density.
    Type: Grant
    Filed: February 9, 2009
    Date of Patent: June 5, 2012
    Assignee: Applied Materials, Inc.
    Inventors: Sergey D. Lopatin, Dmitri A. Brevnov, Eric Casavant, Robert Z. Bachrach
  • Patent number: 7976956
    Abstract: A through-hole type laminated circuit board is given with high reliability of electrical connection using copper foil and conductive paste containing low melting point metal without generating harmful void and crack at boundary between the copper foil and conductive paste metal. The laminated circuit board is made by laminating a multiple number of resin boards with roughening treated copper foils at least on their one surface sides with roughening projection deposition of less than 150 mg/dm2 to make surface roughness Rz of 0.3 to 10 ?m and height of the projection to be 0.3 to 10 ?m. Surface roughness of the original foil is 0.1 to 5 ?m and the amount of copper metal atoms of roughening treated layer is set at 4 times or less than the amount of diffusible conductive paste metal atoms containing low melting point metal into the roughening treated layer on the foil surface.
    Type: Grant
    Filed: November 8, 2006
    Date of Patent: July 12, 2011
    Assignees: Furukawa Circuit Foil., Ltd., The Furukawa Electric Co., Ltd.
    Inventors: Yuuji Suzuki, Yuuki Kikuchi, Satoru Zama
  • Publication number: 20110162971
    Abstract: A sputtering target with low generation of particles in which oxides, carbides, nitrides, borides, intermetallic compounds, carbonitrides, and other substances without ductility exist in a matrix phase made of a highly ductile substance at a volume ratio of 1 to 50%, wherein a highly ductile and conductive metal coating layer is formed on an outermost surface of the target.
    Type: Application
    Filed: February 24, 2010
    Publication date: July 7, 2011
    Applicant: JX NIPPON MINING & METALS CORPORATION
    Inventors: Yuichiro Nakamura, Akira Hisano, Junnosuke Sekiguchi
  • Publication number: 20100216026
    Abstract: A method for forming a battery from via thin-film deposition processes is disclosed. A mesoporous carbon material is deposited onto a surface of a conductive substrate that has high surface area, conductive micro-structures formed thereon. A porous, dielectric separator layer is then deposited on the layer of mesoporous carbon material to form a half cell of an energy storage device. The mesoporous carbon material is made up of CVD-deposited carbon fullerene “onions” and carbon nano-tubes, and has a high porosity capable of retaining lithium ions in concentrations useful for storing significant quantities of electrical energy. Embodiments of the invention further provide for the formation of an electrode having a high surface area conductive region that is useful in a battery structure.
    Type: Application
    Filed: June 30, 2009
    Publication date: August 26, 2010
    Applicant: APPLIED MATERIALS, INC.
    Inventors: Sergey D. Lopatin, Dmitri A. Brevnov, Robert Z. Bachrach
  • Publication number: 20100193365
    Abstract: A method and apparatus for forming a reliable and cost efficient battery or electrochemical capacitor electrode structure that has an improved lifetime, lower production costs, and improved process performance are provided. In one embodiment a method for forming a three dimensional porous electrode for a battery or an electrochemical cell is provided. The method comprises depositing a columnar metal layer over a substrate at a first current density by a diffusion limited deposition process and depositing three dimensional metal porous dendritic structures over the columnar metal layer at a second current density greater than the first current density.
    Type: Application
    Filed: January 29, 2010
    Publication date: August 5, 2010
    Applicant: APPLIED MATERIALS, INC.
    Inventors: Sergey D. Lopatin, Dmitri A. Brevnov, Robert Z. Bachrach
  • Patent number: 7749610
    Abstract: The object is to provide copper foil of high adhesion even when the roughness Rz of a nodular surface of the copper foil is low, and a method of manufacturing the copper foil. To achieve this object, there is adopted a copper foil which is characterized in that an area coefficient C(S), which is defined by A(S)/B(S) from a three-dimensional surface area A(S), which is obtained by performing three-dimensional measurement of a surface area of a nodular surface of a copper foil sample S under a laser microscope, and from a measuring region area B(S), which is an area of a measuring region of the three-dimensional surface area A(S), and a roughness Rz(S) of a nodular surface of the copper foil sample S, which is measured by a stylus-type roughness meter, have a relationship of equation (1) below, and in that the roughness Rz(S) is 1.0 ?m to 3.0 ?m, 0.5×Rz(S)+0.5?C(S)??(1) where Rz(S) is a numerical value represented by ?m.
    Type: Grant
    Filed: March 31, 2005
    Date of Patent: July 6, 2010
    Assignee: Mitsui Mining & Smelting Co., Ltd.
    Inventors: Kenichiro Iwakiri, Seiji Nagatani
  • Publication number: 20100126870
    Abstract: Deposition of nanoparticles onto carbon surfaces is described. Metal and/or metal oxide ions are deposited on a carbon surface by electrodeposition, such as by immersing a carbon and an anode in a salt bath, and applying a number of electrical pulses having a defined pulse width. The size, coverage density, and metallic composition of the nanoparticles may be affected by the pulse width of the electrical pulses, the number of electrical pulses, and the chemical composition of the salt bath, respectively. The carbon may be anodized before electrodeposition. If the carbon is a carbon precursor, after electrodeposition, the carbon precursor is carbonized to form a carbon. After electrodeposition, the carbon may be activated to form an activated carbon. The nanoparticles may serve as catalysts for activation rugosity of mesoporous carbons. The catalytically activated carbon materials may be used in all manner of devices that contain carbon materials.
    Type: Application
    Filed: May 9, 2008
    Publication date: May 27, 2010
    Inventors: Rudyard Lyle Istvan, Stephen M. Lipka
  • Patent number: 7335289
    Abstract: A method of producing high purity electrolytic copper through halide-bath electrowinning is provided. The method includes the steps of: growing copper in dendritic form to be deposited on a cathode; and recovering growth ends of 3.0 mm or shorter from the dendrites.
    Type: Grant
    Filed: August 11, 2004
    Date of Patent: February 26, 2008
    Assignees: Nippon Mining & Metals Co., Ltd., Mitsui Mining and Smelting Co., Ltd.
    Inventors: Kenji Haiki, Kazuhiko Motoba, Hiroshi Oda
  • Patent number: 7166203
    Abstract: A system for maintaining a concentration range of an electroreducible metal species undergoing electrolysis within a predetermined concentration range comprises a first container containing a body of an electrolyte solution in which a metal is partially dissolved, a second container in fluid communication with the first container, the second container containing a second body of the solution, and a means for exchanging solution between the containers. The second container is configured with a means for electrolyzing, and a means for sensing the concentration of, the dissolved metal in the second body. During electrolysis, if the sensed concentration is within a predetermined range, the second body is circulated through the electrolyzing means; if the sensed concentration is outside or nearly outside the range, the solution is exchanged to maintain the concentration within the range.
    Type: Grant
    Filed: September 10, 2003
    Date of Patent: January 23, 2007
    Assignee: Teck Cominco Metals Ltd.
    Inventors: Stephen R. Des Jardins, Stuart I. Smedley
  • Patent number: 6875330
    Abstract: A process is provided for coating metallic workpieces with a bearing material, wherein the workpiece first receives a hard chromium plating having a pearl or columnar structure type surface. A predominantly silver layer is then galvanically deposited, which fills in and smooths the pearl or columnar structure type surface of the hard chromium plating. Optionally, additional hard chromium platings and predominantly silver-containing layers may be applied, preferably galvanically. The predominantly silver layer may advantageously contain a graphite component.
    Type: Grant
    Filed: May 2, 2002
    Date of Patent: April 5, 2005
    Assignee: Duralloy AG
    Inventor: Marco Santini
  • Patent number: 6869515
    Abstract: Embodiments of the present invention provide methods for enhancing void-free metallic filling of narrow openings by electrochemical deposition (ECD). The methods provide enhanced replenishment of plating inhibitor at the field, while depleting the inhibitor inside narrow openings. The resulting inhibitor gradients facilitate void-free ECD filling of narrow openings with large aspect ratios. The inventive methods utilize vigorous electrolyte agitation at the field and top corners of the openings, while maintaining a relatively stagnant electrolyte inside the openings. Vigorous agitation is produced, for example, by high pressure jets flow and/or by mechanical means, such as brush (or pad, or wiper blade) wiping, or by a combination of jets and wiping brushes.
    Type: Grant
    Filed: March 29, 2002
    Date of Patent: March 22, 2005
    Inventor: Uri Cohen
  • Publication number: 20040195105
    Abstract: Disclosed herein are a biaxially textured pure metal or alloy layer deposited by electroplating process on the surface of a single-crystalline or quasi-single-crystalline metal substrate, and a method for manufacturing the biaxially textured pure metal or alloy layer. Specifically, the biaxially textured pure metal or alloy layer is deposited by electroplating process on the surface of a pure metal or alloy substrate having single-crystalline or quasi-single-crystalline orientation. The biaxially textured pure metal or alloy layer has a misorientation on the c-axis of 4° or less and a misorientation on the plane formed by the a-axis and b-axis of 5.2° or less in which the misorientation on the c-axis is determined by a Full Width at Half Maximum of peaks on the &thgr;-rocking curve and the misorientation on the plane formed by the a-axis and b-axis is determined by a Full Width at Half Maximum of peaks on the &PHgr;-scan.
    Type: Application
    Filed: June 27, 2003
    Publication date: October 7, 2004
    Applicant: Korea Institute of Machinery and Materials
    Inventors: Jai-Moo Yoo, Young-Kuk Kim, Jae-Woong Ko, Kyu-Hwan Lee, Do-Yon Chang
  • Publication number: 20040188263
    Abstract: The object is to provide carrier foil-incorporated copper foil which permits drilling by a carbon dioxide laser when on the surface of outer-layer copper foil of a copper-clad laminate there is no nickel assist metal layer or an organic material film to increase the absorption of laser light. For this purpose, there is used, for example, carrier foil-incorporated copper foil in which copper foil for printed wiring board manufacturing having a nodular-treated surface on the side of one surface of a bulk copper layer and carrier foil are laminated via an adhesive interface layer on a side opposite to the nodular-treated surface of the bulk copper layer, the bulk copper layer being formed from a high-carbon copper with a carbon content of 0.03 wt % to 0.40 wt %.
    Type: Application
    Filed: December 11, 2003
    Publication date: September 30, 2004
    Inventors: Akiko Sugimoto, Junshi Yoshioka, Makoto Dobashi, Kenjirou Izutani, Youzo Itagaki, Osamu Nakano
  • Publication number: 20040161593
    Abstract: The present invention relates to a double-sided copper-clad laminate for forming a capacitor layer, formed by adhering electrodeposited copper foils on the both sides of a dielectric layer of a thickness of 10 &mgr;m or less, and the object of the present invention is to secure good voltage resistant proprieties.
    Type: Application
    Filed: February 17, 2004
    Publication date: August 19, 2004
    Inventors: Kazuhiro Yamazaki, Takashi Syoujiguchi
  • Publication number: 20040016646
    Abstract: An electrochemical method for generating both mesoporous metal and metal oxide films from dilute surfactant solutions by utilizing self assembly of surfactant-inorganic aggregates in the electric field of the solid-liquid interface at an electrode to specifically direct the morphology of the film. The surface of the working electrode serves as a solid-liquid interface in a plating solution containing surfactant and inorganic ions and salts.
    Type: Application
    Filed: July 29, 2002
    Publication date: January 29, 2004
    Inventors: Galen D. Stucky, Kyoung-Shin Choi, Eric W. McFarland
  • Publication number: 20030217928
    Abstract: A method for producing an array of oriented nanofibers that involves forming a solution that includes at least one electroactive species. An electrode substrate is brought into contact with the solution. A current density is applied to the electrode substrate that includes at least a first step of applying a first substantially constant current density for a first time period and a second step of applying a second substantially constant current density for a second time period. The first and second time periods are of sufficient duration to electrically deposit on the electrode substrate an array of oriented nanofibers produced from the electroactive species. Also disclosed are films that include arrays or networks of oriented nanofibers and a method for amperometrically detecting or measuring at least one analyte in a sample.
    Type: Application
    Filed: May 23, 2002
    Publication date: November 27, 2003
    Applicant: Battelle Memorial Institute
    Inventors: Yuehe Lin, Liang Liang, Jun Liu
  • Patent number: 6632341
    Abstract: Described is a process for producing a self-supporting metal foil (40), in particular copper foil, which by virtue of its constitution has a low shearing strength and which can be structured in a sharp-edged configuration. In this case a base layer of the metal foil (40) is galvanically deposited on a roller cathode (22). A cauliflower structure (60) comprising the metal is deposited in firmly adhering relationship on the metal base layer (58) by means of an additional anode (32) provided between the roller cathode (22) and the anode cage (24). The metal foil (40) comprising the metal base layer (58) and the cauliflower structure (60) is detached from the roller cathode (22), rinsed and dried. The dried foil (40) comprising the metal base layer (58) provided with the cauliflower structure (60) is moved through a black oxide bath (46). There then follows a rinsing operation and a drying operation.
    Type: Grant
    Filed: February 27, 2002
    Date of Patent: October 14, 2003
    Assignee: Bolta-Werke GmbH
    Inventors: Axel Schäfer, Oswald Beetz, Jürgen Hackeŕt
  • Patent number: 6610417
    Abstract: The invention relates to the manufacture of metal foil electrodes useful in the manufacture of printed circuit boards having passive circuit components such as capacitors, resistors or inductors configured in a planar orientation. A copper foil is coated on each opposite side with a thin layer of nickel, which increases the range of functionality of the foil.
    Type: Grant
    Filed: October 4, 2001
    Date of Patent: August 26, 2003
    Assignee: Oak-Mitsui, Inc.
    Inventors: John A. Andresakis, Edward Skorupski, Wendy Herrick, Michael D. Woodry
  • Patent number: 6605369
    Abstract: The present invention is directed to provision of a surface-treated copper foil exhibiting a maximum effect of a silane coupling agent which is adsorbed onto the copper foil and is employed in order to enhance adhesion between the copper foil and a substrate during manufacture of printed wiring boards. The invention is also directed to provision of a method for producing such a copper foil. To attain these goals, a surface-treated copper foil for producing printed wiring boards is provided, wherein an anti-corrosion treatment comprises forming a zinc layer or a zinc alloy layer on a surface of the copper foil and forming an electrodeposited chromate layer on the zinc or zinc alloy layer; forming a silane-coupling-agent-adsorbed layer on the electrodeposited chromate layer without causing the electrodeposited chromate layer of the nodular-treated surface to dry; and drying.
    Type: Grant
    Filed: August 14, 2001
    Date of Patent: August 12, 2003
    Assignee: Mitsui Mining & Smelting Co., Ltd.
    Inventors: Naotomi Takahashi, Yutaka Hirasawa
  • Publication number: 20030111351
    Abstract: Disclosed is a surface treatment method for increasing adhesion of a surface of copper foil to an insulating epoxy-impregnated substrate used in printed circuit boards, which includes the steps of nodularizing a surface of an electrolytic copper foil, surface-treating the surface of the nodularized electrolytic copper foil by Zn—As alloy electrodeposition to form a Zn—As composite layer thereon and then coating the surface of the surface-treated electrolytic copper foil with a silane coupling agent mixture, whose compounding ratio of 3-aminopropyltriethoxysilane with respect to vinyltriethoxysilane is between 6:4 and 9:1. This method is very effective to prevent discoloration of copper foil caused by oxidation and the like.
    Type: Application
    Filed: October 23, 2002
    Publication date: June 19, 2003
    Inventors: Sang-Kyum Kim, Chang-Hee Choi, Byoung-Un Kang
  • Patent number: 6569543
    Abstract: A composite material includes a structural carrier layer and a relatively thin metal foil layer separated by a release layer. The release layer, that may be an admixture of a metal such as nickel or chromium and a non-metal such as chromium oxide, nickel oxide, chromium phosphate or nickel phosphate, provides a release force for the metal foil layer from the carrier strip that is typically on the order of 0.1 pound per inch to 2 pounds per inch. This provides sufficient adhesion to prevent premature separation of the metal foil layer from the carrier layer, but easy removal of the carrier layer when desired. The metal foil layer may be electrolytically formed copper having a low height profile, on the order of 0.5 micron to 2.7 microns, bond strength enhancing agent coating a side of the metal foil layer. The enhanced surface is subsequently bonded to a dielectric and the carrier layer then removed.
    Type: Grant
    Filed: February 15, 2001
    Date of Patent: May 27, 2003
    Assignee: Olin Corporation
    Inventors: William R. Brenneman, Szuchain F. Chen, Derek E. Tyler
  • Patent number: 6497806
    Abstract: A method of producing a roughening-treated copper foil, comprising (A) a copper foil, (B) a composite metal layer, which is formed on a bonding surface of the copper foil and comprises (I) copper, (II) at least one metal selected from the group consisting of tungsten and molybdenum and (III) at least one metal selected from the group consisting of nickel, cobalt, iron and zinc, and (C) a roughened layer comprising copper, which is formed on the composite metal layer.
    Type: Grant
    Filed: April 20, 2001
    Date of Patent: December 24, 2002
    Assignee: Nippon Denkai, Ltd.
    Inventor: Yasuhiro Endo
  • Patent number: 6495021
    Abstract: A dendritic sponge which is directionally-grown on a substrate material has a high surface to volume ratio and is suitable for forming anodes for highly efficient capacitors. A dielectric film is formed on the sponge surface by oxidizing the surface. In a preferred embodiment, the dielectric is grown on titanium sponge and is doped with oxides of Ca, Mg, Sr, Be, or Ba to improve the film's dielectric constant or with higher valent cations, such as Cr6+, V5+, Ta5+, Mo6+, Nb5+, W6+, and P5+, to reduce the oxygen vacancy concentration and leakage current of the dielectric film. A capacitor formed from the sponge includes a cathode electrolyte which serves as an electrical conductor and to repair the dielectric film by re-oxidizing the anode surface at areas of local breakdown. Sponges of titanium, tantalum, and aluminum form efficient dielectric films.
    Type: Grant
    Filed: March 16, 2001
    Date of Patent: December 17, 2002
    Assignee: Case Western Reserve University
    Inventors: Gerhard Welsch, Donald McGervey
  • Patent number: 6495022
    Abstract: A copper foil for fine wiring is produced by forming on a bonding surface of a copper foil a composite metal layer comprising (I) copper, (II) at least one of tungsten and molybdenum and (III) at least one of nickel, cobalt, iron and zinc by carrying out electrolysis in a plating bath (A) containing ions of these metals and chloronium ions, and then forming a roughened layer comprising copper on the composite metal layer by carrying out electrolysis in a plating bath (B) containing copper ions at a current density not lower than a limiting current density of the plating bath to form a dendritic copper electrodeposition layer and then carrying out subsequent electrolysis at a current density lower than the limiting current density of plating bath to form nodular copper.
    Type: Grant
    Filed: September 18, 2001
    Date of Patent: December 17, 2002
    Assignee: Nippon Denkai, Ltd.
    Inventors: Yasuhiro Endo, Hiroki Hara, Nobuchika Yagihashi
  • Publication number: 20020182433
    Abstract: A roughening-treated copper foil, comprising (A) a copper foil, (B) a composite metal layer, which is formed on a bonding surface of the copper foil and comprises (I) copper, (II) at least one metal selected from the group consisting of tungsten and molybdenum and (III) at least one metal selected from the group consisting of nickel, cobalt, iron and zinc, and (C) a roughened layer comprising copper, which is formed on the composite metal layer.
    Type: Application
    Filed: April 20, 2001
    Publication date: December 5, 2002
    Inventor: Yasuhiro Endo
  • Patent number: 6447929
    Abstract: A component for use in forming a printed circuit board comprised of a copper foil, a layer of chromium chemically deposited thereon, the layer of chromium having a thickness of less than about 0.10 &mgr;m; and a layer of electrodeposited copper on the layer of chromium, the layer of electrodeposited copper having a thickness of less than 35 &mgr;m. A nodular treatment layer is provided on the copper foil and the layer of electrodeposited copper.
    Type: Grant
    Filed: August 29, 2000
    Date of Patent: September 10, 2002
    Assignee: Gould Electronics Inc.
    Inventors: Jiangtao Wang, Dan Lillie, Sidney J. Clouser
  • Publication number: 20020098374
    Abstract: This invention provides a copper foil for a printed wiring board, which comprises a copper foil, an alloy layer (A) comprising copper, zinc, tin and nickel which is formed on a surface of the copper foil, said surface to be brought into contact with a substrate for a printed wiring board, and a chromate layer which is formed on a surface of the alloy layer (A,. The copper foil for a printed wiring board has the following features: even if a printed wiring board is produced using a long-term stored copper foil, the interface between the copper foil and the substrate is only slightly corroded with chemicals; even if the copper foil contacts a varnish containing an organic acid, e.g., a varnish for an acrylic resin, in the formation of a copper-clad laminate, the bond strength is sufficient. Even if a printed circuit board made by using the copper foil is placed in a high temperature environment, e.g.
    Type: Application
    Filed: October 26, 2001
    Publication date: July 25, 2002
    Inventors: Kazuhisa Fujiwara, Hiroshi Tan, Mitsuo Fujii, Masanobu Tsushima
  • Publication number: 20020053517
    Abstract: A copper foil for fine wiring is produced by forming on a bonding surface of a copper foil a composite metal layer comprising (I) copper, (II) at least one of tungsten and molybdenum and (III) at least one of nickel, cobalt, iron and zinc by carrying out electrolysis in a plating bath (A) containing ions of these metals and chloronium ions, and then forming a roughened layer comprising copper on the composite metal layer by carrying out electrolysis in a plating bath (B) containing copper ions at a current density not lower than a limiting current density of the plating bath to form a dendritic copper electrodeposition layer and then carrying out subsequent electrolysis at a current density lower than the limiting current density of plating bath to form nodular copper.
    Type: Application
    Filed: September 18, 2001
    Publication date: May 9, 2002
    Inventors: Yasuhiro Endo, Hiroki Hara, Nobuchika Yagihashi
  • Patent number: 6372113
    Abstract: Treated copper foil produced by electrodepositing on a matte surface of a base copper foil a “corrective” copper layer having a surface roughness different from the surface roughness of the matte surface of the base foil and which has a peak count greater than the peak count of the matte surface of the base foil. In the electrodeposition there are used a unique electrolyte composition and plating conditions effective to control the micro-throwing process of the plating process so that the surface roughness of the corrective is substantially constant from one batch of base foil to another.
    Type: Grant
    Filed: September 13, 1999
    Date of Patent: April 16, 2002
    Assignee: Yates Foil USA, Inc.
    Inventors: Charles B. Yates, George Gaskill, Chinsai T. Cheng, Ajesh Shah, Adam M. Wolski, Paul DuFresne
  • Patent number: 6342308
    Abstract: A treated electrodeposited copper foil having a bond-enhancing copper layer, preferably a plurality of layers, electrodeposited on a bonding side of a base copper foil, a layer of co-deposited copper and arsenic electrodeposited on the bond-enhancing layer, and a zinc or zinc alloy layer electrodeposited on the copper/arsenic layer. A process for making such foil, and a copper-clad laminate wherein such foil is bonded to a polymeric substrate.
    Type: Grant
    Filed: September 29, 1999
    Date of Patent: January 29, 2002
    Assignee: Yates Foil USA, Inc.
    Inventors: Charles B. Yates, George Gaskill, Chinsai T. Cheng, Ajesh Shah
  • Publication number: 20010051282
    Abstract: Treated copper foil produced by electrodepositing on a matte surface of a base copper foil a “corrective” copper layer having a surface roughness different from the surface roughness of the matte surface of the base foil and which has a peak count greater than the peak count of the matte surface of the base foil. In the electrodeposition there are used a unique electrolyte composition and plating conditions effective to control the micro-throwing process of the plating process so that the surface roughness of the corrective is substantially constant from one batch of base foil to another.
    Type: Application
    Filed: September 13, 1999
    Publication date: December 13, 2001
    Applicant: Yates Foil USA, Inc.
    Inventors: CHARLES B. YATES, GEORGE GASKILL, CHINSAI T. CHENG, AJESH SHAH, ADAM M. WOLSKI, PAUL DUFRESNE
  • Patent number: 6319385
    Abstract: A structured surface coating is electrochemically deposited on an (electrically conductive) surface of a component. The component to be coated forms the cathode in a galvanic bath. The process current is raised in discrete steps in a nucleation phase during which island formations are deposited on the surface, with brief pauses between each increase of between 0.1 and 30 sec. The process current is then maintained at a constant level, during which the islands grow. The process sequence may be repeated several times.
    Type: Grant
    Filed: September 21, 1999
    Date of Patent: November 20, 2001
    Assignee: Heidelberger Druckmaschinen AG
    Inventor: Karl Müll
  • Patent number: 6269551
    Abstract: A method employed to dry a copper foil having been subjected to various surface treatments, which method comprises irradiating at least one surface-treated side of the copper foil with near infrared rays to dry the copper foil, and an apparatus suitable to the method. The drying of the copper foil having undergone surface treatments can be accomplished by a simple apparatus with low electric power while controlling the heating of the surface of the copper foil so that the drying temperature can be held at 100° C. or higher at which a eutectic alloying of rust preventive metal and copper foil, for example, alloying (brass formation) of zinc and copper on the surface of the copper foil is effected.
    Type: Grant
    Filed: July 16, 1999
    Date of Patent: August 7, 2001
    Assignee: Mitsui Mining & Smelting Co., Ltd.
    Inventors: Nobuyuki Imada, Kazuhide Oshima