Abstract: A method employed to dry a copper foil having been subjected to various surface treatments, which method comprises irradiating at least one surface-treated side of the copper foil with near infrared rays to dry the copper foil, and an apparatus suitable to the method. The drying of the copper foil having undergone surface treatments can be accomplished by a simple apparatus with low electric power while controlling the heating of the surface of the copper foil so that the drying temperature can be held at 100° C. or higher at which a eutectic alloying of rust preventive metal and copper foil, for example, alloying (brass formation) of zinc and copper on the surface of the copper foil is effected.

Abstract: A one-step, integrated process and apparatus for producing electrolytic copper foil having a dual-layer copper bond-enhancing treatment electrodeposited on the matte side of the foil, which employs two “super anodes” on a rotating drum cathode to deposit the treatment.

Abstract: A method for rendering a surface of a contact rough includes submerging the surface of the contact in an electroplating bath having a dissolved metal salt, and pulsing an electric current through the contact and the bath to form a rough metallic structure on the surface of the contact.

Abstract: Treated copper foil for use in the manufacture of copper-clad laminates for printed circuit boards, wherein a continuous, very thin cobalt barrier layer, which is substantially non-ferromagnetic, is electrodeposited on a copper bonding treatment electrodeposited on a bonding side of a base copper foil; and a process and electrolyte for producing such treated foil, wherein the electrolyte contains a low concentration of cobalt and certain addition agents.

Abstract: This invention provides a composite foil comprising an aluminum carrier layer and an ultra-thin copper foil having a protective layer disposed between them comprising a porous copper layer and an interpenetrating zinc layer. A process for producing such composite foils comprises the steps of preparing the surface of the aluminum carrier, electrodepositing a porous copper layer on the aluminum carrier layer followed by electrodepositing a zinc layer, and then electrodepositing two layers of copper to form the ultra-thin copper foil. The composite foil provides a uniform bond strength between the aluminum carrier and the protective layer which is adequate to prevent separation of the carrier and ultra-thin copper foil during handling and lamination, but which is significantly lower than the peel strength of a copper/substrate bond, so that the carrier can easily be removed after lamination of the composite foil to an insulating substrate.

Abstract: A metallic foil with improved peel strength is disclosed which has on a surface thereof two superimposed electrodeposited layers, the first layer adjacent to said surface comprising a dusty dendritic deposit comprising a major amount of a first metal and the second layer comprising a metal flash uniformly deposited over said first layer comprising a major amount of a second metal other than said first metal. A method for making such foil is disclosed which comprises (A) electrodepositing a first metal on one surface of said foil to produce a dusty dendritic metal deposit and (B) electrodepositing on the dendritic deposit of (A) a uniform metal flash. The improved foil is useful for a wide range of applications that benefit from the improved bonding to substrates, including electronic applications such as laminated electronic devices, such as printed circuit boards, and solid state switches.

Abstract: This invention provides a process for producing an electrolytic copper foil for a printed wiring board by supplying current between a rotary cathode and an electrolytic anode in a copper electrolyte so as to electrodeposit copper on the surface of the rotary cathode, wherein an anode for high electric current is placed opposite to the electrodeposition starting surface of the rotary cathode in such a manner that a part of the anode is projected above a liquid level of the copper electrolyte, and the copper electrolyte existing between the anode for high electric current and the opposed rotary cathode surface is electrolyzed by providing a high electric current with a current density higher than that of the electrolytic anode, and an apparatus for producing an electrolytic copper foil for a printed wiring board having excellent properties.

Abstract: Treated electrolytic copper foil wherein the shiny side of the raw foil is modified and smoothed by an electrodeposited copper gilding layer, a copper-clad laminate produced with such foil, and an electrical circuit produced from such a laminate. The preferred foil has the surface of the shiny side of the raw foil modified by an electrodeposited copper gilding layer, a copper dendritic layer electrodeposited on the gilding layer, and a second copper gilding layer electrodeposited on the first dendritic layer, while a copper dendritic layer is electrodeposited on the surface of the matte side of the foil, and a copper gilding is electrodeposited on the latter dendritic layer.

Abstract: A structured surface coating is electrochemically deposited on an electrically conductive surface of a component. The component to be coated forms the cathode in a galvanic bath. The process current is raised in discrete steps in a nucleation phase during which island formations are deposited on the surface, with brief pauses between each increase of between 0.1 and 30 sec. The process current is then maintained at a constant level, during which the islands grow. The process sequence may be repeated several times.

Abstract: An electrodeposited copper foil for use in the manufacture of a printed wiring board in which the original profile of the matte surface has been completely removed, preferably by buffing, leaving a surface having linear streaks and a roughness 1.5 .mu.m or less. The new surface is then given a nodule forming treatment which produces a surface roughness of 1.5 to 2.0 .mu.m, which may be followed by a corrosion resisting treatment. This invention further provides a method of manufacturing such an electrodeposited copper foil. Such copper foils are especially useful in making fine circuit patterns.

Abstract: A method for rendering a surface of a contact rough includes submerging the surface of the contact in an electroplating bath having a dissolved metal salt, and pulsing an electric current through the contact and the bath to form a rough metallic structure on the surface of the contact.

Abstract: Process suitable for providing a substrate with a protective coating based on chromium, including a chromium matrix in which solid particles are distributed. The process includes a step of electrodeposition of the coating carried out by passing an electric current between a cathode or cathodes of the substrate to be coated and an anode or anodes. The cathode(s) and anode(s) are immersed in an electroplating solution, wherein the electroplating solution is based on an aqueous solution including trivalent chromium obtained from the reduction of chromic acid by a reducing agent, and contains solid particles.

Abstract: An electrodeposited copper foil for use in the manufacture of a printed wiring board in which the original profile of the matte surface has been completely removed, preferably by buffing, leaving a surface having linear streaks and a roughness 1.5 .mu.m or less. The new surface is then given a nodule forming treatment which produces a surface roughness of 1.5 to 2.0 .mu.m, which may be followed by a corrosion resisting treatment. This invention further provides a method of manufacturing such an electrodeposited copper foil. Such copper foils are especially useful in making fine circuit patterns.

Abstract: A method is disclosed for the production of highly diffusive or absorptive metal surfaces. A dendritic crystal structure surface layer of metal is electrodeposited on a substrate, using a bipolar pulse plating technique. This metal surface layer may then be oxidized to provide a highly anti-reflective surface.

Abstract: Methods for forming pastes of dendrites particles coated with an electrically conductive coating are described. A surface is placed in contact with an electrolytic or electroless plating solution. Dendrites are formed on the surface. The dendrites are exposed to another plating solution to plate a coating on the surface of the dendrites. The coated dendrites are removed from the surface to form a powder of coated dendrites. The powder is added to a polymer material to form a paste which is heated to fuse the dendrite surfaces to form a network of interconnected dendrites and further heated to cure the polymer. When the paste is disposed between adjacent electrically conductive surfaces, the coated dendrites fuse to the electrically conductive surface to form electrical interconnections.

Abstract: A method is disclosed for the production of highly diffusive or absorptive metal surfaces. A dendritic crystal structure surface layer of metal is electrodeposited on a substrate, using a bipolar pulse plating technique. This metal surface layer may then be oxidized to provide a highly anti-reflective surface.

Abstract: There it is disclosed a chemical treatment for copper foil which imparts a dark brown to black color to the foil and improves the bond strength of the foil to a dielectric substrate without detrimentally changing the etching characteristics of the foil. The treatment includes depositing a nodular copper/nickel alloy layer on a surface of the foil. These nodules are 55% to 95% by weight copper and are electrolytically deposited using a pulse power controller.

Abstract: Drum or smooth side-treated metal foil can be used either as an intermediate product for use in the manufacture of laminate or as a part of the finished laminate to be used in the manufacture of multi-layer printed circuit board (PCB) packages. By treating the drum or smooth side of metal foil with a bond strength enhancer rather than treating the matte side or rough side, or both sides, several time-consuming and costly steps can be bypassed in the manufacture of multi-layer printed circuit boards (PCB) while the integrity of the metal foil, -laminate and multi-layer PCB are not compromised and are actually enhanced by way of improved impedance control and adhesion characteristics after relamination. This novel foil can be initially bonded to substrate on either side before circuit formation and can be used either as an internal foil layer or as a foil cap. The invention includes methods of manufacture of the metal foil, laminate and multi-layer printed circuit board.

Abstract: A porous nickel electrode substrate having a central high conductivity core sandwiched between two layers of porous conductive material such as nickel foam or nickel felt. The porous conductive material is plated with nickel and then sintered. By selectively controlling the plating of nickel on the porous material, variable conductivities may be designed into the substrate.

Abstract: Uniform zinc pellets are formed for use in batteries having a stationary or moving slurry zinc particle electrode. The process involves the cathodic deposition of zinc in a finely divided morphology from battery reaction product onto a non-adhering electrode substrate. The mossy zinc is removed from the electrode substrate by the action of gravity, entrainment in a flowing electrolyte, or by mechanical action. The finely divided zinc particles are collected and pressed into pellets by a mechanical device such as an extruder, a roller and chopper, or a punch and die. The pure zinc pellets are returned to the zinc battery in a pumped slurry and have uniform size, density and reactivity. Applications include zinc-air fuel batteries, zinc-ferricyanide storage batteries, and zinc-nickel-oxide secondary batteries.

Abstract: A printed circuit inner-layer copper foil having inverted tear drop-shaped fine nodules formed on both surfaces of a copper foil each having surface roughness Rz=1 to 3 .mu.m, the nodules having a length of 0.6 to 1.0 .mu.m and a maximum diameter of 0.2 to 0.8 .mu.m, and a process for producing said inner-layer copper foil.

Abstract: A process for electrochemically depositing a structured surface layer on a component, such as a machine component, particularly a steel water cylinder of a printing press, is disclosed. The process comprises the steps of defining an electrical parameter, such as a potential and/or an electrical current, effecting an electro-chemical layer deposition; and depositing a surface layer on the component with a structured outer surface topography. The depositing step is performed by providing an initial pulse of the electrical parameter and forming a plurality of island formations of deposition material on a surface of the component to be electro-chemically coated, and subsequently providing a follow-up pulse of the electrical parameter and causing a growth of the deposition material on the plurality of islands for causing the structured outer surface topography.

Abstract: A method is disclosed for parting an electrodeposited article comprised of a first surface region and a second surface region from a mandrel, wherein the method comprises: (a) positioning the article and the mandrel in a metal deposition solution; (b) forming a plurality of metal dendrites on the second surface region wherein the first surface region is free of metal dendrites; and (c) separating the article and the mandrel.

Abstract: Disclosed is a multi-compartment electroplating tank and a process for using the tank to simultaneously plate dissimilar materials onto a substrate.

Abstract: A copper foil for printed circuits has a roughened layer formed on the side of the foil to be bonded to a base, the roughened layer consisting of a number of protuberant copper electrodeposits containing chromium tungsten or both. It may also have a copper plating layer covering the roughened layer and a treatment layer covering the copper plating layer and formed of either a metal selected from the group consisting of copper, chromium, nickel, iron, cobalt, and zinc, or an alloy of two or more such metals. When necessary, the copper foil may contain an anticorrosive layer including various chromate treated layers further formed on the treatment layer. The copper foil is produced by electrolyzing a raw foil as a cathode in an acidic copper electrolytic bath at a current density close to the critical density, thereby forming the roughened layer, the electrolytic bath containing 0.001-5 g/l of chromium ion tungsten ion or both.

Abstract: A method is disclosed for the production of highly diffusive or absorptive metal surfaces. A dendritic crystal structure surface layer of metal is electrodeposited on a substrate, using a bipolar pulse plating technique. This metal surface layer may then be oxidized to provide a highly anti-reflective surface.

Abstract: A separable and reconnectable connection for electrical equipment is provided that is suitable for miniaturization in which vertical interdigitating members integrally attached and protruding from a planar portion are accommodated in control of damage in lateral displacement that occurs on mating with an opposite similar contact. Displacement damage is averted through accommodating lateral stresses by providing one or more of a conformal opposing contact, by strengthening through coating and base reinforcement and a deformable coating. The contacts are fabricated by physical and chemical processes including sputtering, normal and pulse electroplating and chemical vapor deposition. Pulse electroplating of palladium provides a dendritic deposit of uniform height, uniform rounded points and less branching. The contacts on completion are provided with a surrounding immobilizing material that enhances rigidity.