Abstract: A method of manufacturing a printed circuit board includes: forming a resist layer; exposing first areas of the resist layer spaced apart from each other; after exposing the first areas, exposing second areas of the resist layer, the second areas being spaces between the first areas; forming first and second openings spaced apart from each other in the first and second areas by developing the resist layer; and forming a plurality of conductor patterns by filling the first and second openings with conductors.

Abstract: Radiation curable compositions for coating optical fibers are disclosed herein. In an embodiment, a radiation curable composition includes a reactive oligomer component, wherein a portion of the polymerizable groups of the reactive oligomer component include methacrylate groups; a reactive diluent monomer component, wherein a portion of the polymerizable groups of the reactive diluent monomer component include acrylate groups, acrylamide groups, or N-vinyl amide groups, or combinations thereof; a photoinitiator component, and an optional additive component. Also described are methods of coating the radiation curable compositions elsewhere described, and the fiber optic coatings and cables resulting therefrom.

Abstract: In an aspect, a method of filling a plurality of cooling holes in an airfoil component, the method comprises injecting a curable composition into a fill channel such that the curable composition flows through the fill channel to the plurality of cooling holes; forming a plurality of beads of the curable composition on a surface of the component over the plurality of cooling holes; directing a radiation to the respective beads in directions parallel to the respective central axes of the cooling holes associated with the respective beads to cure curable composition of the respective beads; and heating the component to cure the curable composition located in the fill channel.

Abstract: The optical device can comprise a substrate having a first face opposite a second face, a thickness between the first face and the second face, the first face and the second face being planar, the first face being parallel the second face, the substrate being transparent to an electromagnetic radiation in a given spectrum; a planar polarization-dichroic focusing lens covering the first face, the lens having a first focusing power for a first polarization of the electromagnetic radiation and a second focusing power for a second polarization of the electromagnetic radiation, the second focusing power being different from the first focusing power; and a planar polarization-dichroic mirror covering the second face, the mirror being reflective to the first polarization and transparent to the second polarization.

Abstract: A tape measure including a reinforced or coated tape measure blade is provided. The coating is thicker than the metal inner layer of the tape blade. The coating provides a reinforced tape blade such that elongate tape blade may have a pinch load threshold of greater than 50 lbs. and/or a pinch height at break of less than 1.5 mm. A hook assembly may also provide for reduced stress at the end of the tape blade.

Abstract: A method for manufacturing a piston ring includes the following steps: (A) a step of supplying an arc current to a cathode formed of a carbon material having a density of 1.70 g/cm3 or more, to ionize the carbon material; and (B) a step of applying a bias voltage in an environment where hydrogen atoms are substantially absent to form a DLC film on a surface of a base material for a piston ring. The step (A) is continuously carried out, subsequently the step (A) is interrupted, and then the step (A) is restarted, which sequence is repeated thereby to form the DLC film having an extinction coefficient of 0.1 to 0.4 as measured using light having a wavelength of 550 nm and a nanoindentation hardness of 16 to 26 GPa.

Abstract: A tape measure including an elongate tape blade is shown. The tape measure includes a relatively short protective polymer film coupled to an end of the tape blade adjacent to the hook end of the tape blade.

Abstract: A tape rule comprises a blade, a reel, a spring, a lock, and a housing. The blade comprises a substrate and a coating. The coating is configured to provide color, environmental protection, and/or abrasion resistance. In some embodiments, (1) the coating is formed from non-polymer materials; (2) the blade comprises reinforcements metallurgically bonded to the blade at or near a free end; (3) measurement indicia comprise laser marked portions of the substrate that create color contrasts with other portions of the substrate; (4) the measurement indicia comprise portions of the substrate visible through gaps in the coating; (5) the measurement indicia comprise voids in the substrate filled with a coating material having a contrasting color; and/or (6) the substrate has a surface texture configured to change an appearance of the coating relative to an appearance of the coating on an as-rolled surface finish of the metal substrate.

Abstract: A conforming coating mask is used with a turbine component having a plurality of cooling holes. The conforming coating mask includes at least two anchors; a plurality of radial mask strips integrally formed with and extending between each of the at least two anchors; and at least one coating mask securing insert. Each at least one coating mask securing insert integrally formed with a respective at least one radial mask strip; wherein the plurality of radial mask strips align with and cover the plurality of cooling holes.

Abstract: A final injection molded assembly and process for making same that eliminates paint and reduces areas of wasted chrome material. The final injection molded assembly has at least one first injection molded part of a non-plateable first material, at least one overmolded part of plateable second material, at least one pathway through the assembly and integrated features operable for selectively applying an electric current. The pathway creates a predetermined surface path arrangement for applying chrome to desired predetermined plateable areas. A shot of each material is delivered to an injection molding rotary device to produce the injection molded assembly which is then affixed to a chroming process line where electric current is applied. As the electric current is applied and chrome is delivered only the plateable second material will accept the chrome.

Abstract: A method for printing a three-dimensional part with an additive manufacturing system, the method comprising generating and printing a planarizing part having a substantially-planar top surface relative to a build plane, and a bottom surface that substantially mirrors a topography of a platen surface, and printing the three-dimensional part over the substantially-planar top surface of the printed planarizing part.

Abstract: The present invention discloses a heavy-duty drive axle comprising a reduction gearbox and a drive motor; a differential case is provided within the reduction gearbox; a motor output shaft of the drive motor is linked with a first output shaft and a second output shaft via the differential case; the differential case consists of a differential holder, a connecting pole, a linkage gear and four bevel gears; each bevel gear is meshed with two bevel gears; the bevel gears comprise a first bevel gear, a second bevel gear, a third bevel gear and a fourth bevel gear, the first bevel gear and the second bevel gear are arranged oppositely, and the third bevel gear and the fourth bevel gear are arranged oppositely and sheathed on the connecting pole; the connecting pole is fixed with the differential holder; a cavity is formed within the differential holder; a through hole for fitting with the connecting pole is formed on each of an upper side and a lower side of the differential holder, and a third shaft hole and an

Abstract: Disclosed is an optoacoustic probe with a coated transducer assembly. The probe includes a transducer assembly with a multi-layer coating on the active end thereof. The multi-layer coating includes a layer of parylene and at least two layers of metal. In an embodiment, the multi-layer coating includes a layer of nickel, at least one layer of parylene, and a layer of gold.

Abstract: A coating forming device for forming a metal coating on a surface of a substrate includes: an anode; a power supply; and a solid electrolyte membrane disposed between the anode and the substrate and contains metal ions. The solid electrolyte membrane includes: a contact surface that is a region contacting a coating-forming region where the metal coating is formed; and a concave portion recessed relative to the contact surface such that, when the contact surface contacts the coating-forming region, the solid electrolyte membrane is not in contact with a portion of the surface of the substrate excluding the coating-forming region. The metal ions are reduced to form the metal coating on the coating-forming region by the power supply applying a voltage between the anode and the substrate.

Abstract: The present invention provides a color filter film manufacturing method and a color filer film. The color filter film manufacturing method of the present invention includes forming transparent photoresist layers in blue sub-pixel zones and forming first and second recesses respectively in red and green sub-pixel zones and subjecting bottoms thereof to a treatment for hydrophilicity/hydrophobicity. The difference of hydrophilicity/hydrophobicity between the bottoms of the first and second recesses and a surface of the photoresist layer, in combination with altitude differences, makes the red and green quantum dot materials to respectively form red and green quantum dot layers in the first and second recesses through autonomous flowing.

Abstract: Disclosed are embodiments of a substrate for an integrated circuit (IC) device. The substrate includes a core comprised of two or more discrete glass layers that have been bonded together. A separate bonding layer may be disposed between adjacent glass layers to couple these layers together. The substrate may also include build-up structures on opposing sides of the multi-layer glass core, or perhaps on one side of the core. Electrically conductive terminals may be formed on both sides of the substrate, and an IC die may be coupled with the terminals on one side of the substrate. The terminals on the opposing side may be coupled with a next-level component, such as a circuit board. One or more conductors extend through the multi-layer glass core, and one or more of the conductors may be electrically coupled with the build-up structures disposed over the core. Other embodiments are described and claimed.

Abstract: A method for filling cooling holes in a component of a gas turbine engine is disclosed. The component may include a plurality of first cooling holes penetrating the wall of the component. The method may comprise the steps of exposing the outer surface of the component, filling the plurality of first cooling holes of the component with a filling agent, curing the filling agent to block the passage of air through the cooling holes, and applying a thermal barrier coating over the surface of the component. The method may further include installing a second plurality of cooling holes, the second plurality of cooling holes penetrating the thermal barrier coating and the wall of the component and allow air to pass therethrough.

Abstract: An integrated circuit structure includes a triple-axis accelerometer, which further includes a proof-mass formed of a semiconductor material; a first spring formed of the semiconductor material and connected to the proof-mass, wherein the first spring is configured to allow the proof-mass to move in a first direction in a plane; and a second spring formed of the semiconductor material and connected to the proof-mass. The second spring is configured to allow the proof-mass to move in a second direction in the plane and perpendicular to the first direction. The triple-axis accelerometer further includes a conductive capacitor plate including a portion directly over, and spaced apart from, the proof-mass, wherein the conductive capacitor plate and the proof-mass form a capacitor; an anchor electrode contacting a semiconductor region; and a transition region connecting the anchor electrode and the conductive capacitor plate, wherein the transition region is slanted.

Abstract: A system and a method for selectively coating a substrate includes a removable mask including a magnetic member having a first surface contour shaped to conform to the outside surface of the substrate and a magnetizable member having a second surface contour shaped to conform to the inside surface of the substrate. The method for coating the substrate includes magnetically coupling a removable mask to at least one surface of the substrate; forming a coating of a coating material on the at least one surface of the substrate with the magnetically coupled removable mask using a bath containing the coating material; and selectively decoupling the removable mask from the at least one coated surface to reveal a portion of the coated surface without the coating.

Abstract: The invention relates to a coating mask (1) for electrolytically coating the piston ring groove (39) of a piston (38), which is made of an elastically deformable material and has openings (3 to 10) that are arranged axially and are distributed in a uniform manner over the periphery, into which rods (11 to 18) of an expansion device (19) can be introduced, the rods being arranged in a displaceable manner such that the expansion device (19) can increase the radial diameter of the coating mask (1) and also the inner opening (2) so that the piston (38) can be introduced into the inner opening (2). The radial diameter of the coating mask (1) is selected in such a manner that after the reduction of radial diameter of the coating mask (1) and the inner opening, the elastically tensed coating mask (1) presses sealing lips (44, 45) of the coating groove (37) against the piston (38), on both sides of the piston ring groove (39).

Abstract: Electrochemical fabrication processes and apparatus for producing single layer or multi-layer structures where each layer includes the deposition of at least two materials and wherein the formation of at least some layers includes operations for reducing stress and/or curvature distortion when the structure is released from a sacrificial material which surrounded it during formation and possibly when released from a substrate on which it was formed. Six primary groups of embodiments are presented which are divide into eleven primary embodiments. Some embodiments attempt to remove stress to minimize distortion while others attempt to balance stress to minimize distortion.

Abstract: There is provided a method of manufacturing a wiring substrate. The method includes: (a) forming a first resist layer having first openings therein on a first surface of a support plate, forming first plated films in the first openings by an electrolytic plating method, and removing the first resist layer; (b) forming a second resist layer having second openings therein on the first surface of the support plate, forming second plated films in the second openings by an electrolytic plating method, and removing the second resist layer; (c) forming a wiring layer and an insulating layer such that the wiring layer is electrically connected to the first and second plated films; and (d) removing the support plate to expose the first and second plated films.

Abstract: Tin or tin alloy plating liquid with a sufficient plated deposit can be formed in the opening without causing burns on the plated film surface or abnormal deposits, and which has a good via filling effect. When a specific ?,?-unsaturated carbonyl compound is added into the tin or tin alloy plating liquid, the plating liquid with good via filling performance can be obtained, and the deposit which is substantially free of voids and burns or abnormal deposits on the deposit surface are reduced.

Abstract: A method of depositing nano-dots on a substrate includes forming a template on the base, the template defining nano-pores, at least partially filling the nano-pores with a pillar material to define nano-pillars, depositing a dot material on the nano-pillars to define nano-dots on the nano-pillars, and contact printing the substrate with the array of nano-dots.

Abstract: A high strength, low friction engineered material includes a low friction material filling interstices of a metal microlattice. The metal typically comprises 5 volume % to 25 volume % and the interstices typically comprise 75 volume % to 95 volume %, based on the total volume of the metal microlattice and the interstices. The low friction material preferably fills 100 volume % of the interstices. The metal microlattice can be formed of a single layer, or multiple layers, for example layers of nickel, copper, and tin. The low friction material is typically a polymer, such as polytetrafluoroethylene (PTFE), polyamide (PAI), polyetheretherketone (PEEK), polyethylene (PE), or polyoxymethylene (POM). The low friction material can also include additive particles to modify the material properties. The engineered material can be used in various automotive applications, for example as a bearing, or non-automotive applications.

Abstract: A method of forming a tool marking structure includes: a coloring step of coloring a predetermined position of the first protective layer so as to form a marking area with a color layer and forming the first protective layer on a bottom surface of the marking area, and a second-time surface processing step of forming a second protective layer on a non-marking area of the tool and forming the first protective layer on a bottom surface of the second protective layer; wherein the color of the first protective layer is different from that of the second protective layer.

Abstract: A method of forming a channel layer of an electric device according to an embodiment is provided. First, a conductive substrate including an insulating layer on the substrate is provided. The conductive substrate and a metal to be plated are used as respective electrodes to carry out electroplating within an electrolyte solution. In this case, electrons provided by a tunneling current passing through the insulating layer from the conductive substrate are bonded with ions of the metal within the electrolyte solution to form a metal channel layer on the insulating layer.

Abstract: Selectively accelerated or selectively inhibited metal deposition is performed to form metal structures of an electronic device. A desired pattern of an accelerator or of an inhibitor is applied to the substrate; for example, by stamping the substrate with a patterned stamp or spraying a solution using an inkjet printer. In other embodiments, a global layer of accelerator or inhibitor is applied to a substrate and selectively modified in a desired pattern. Thereafter, selective metal deposition is performed.

Abstract: Electrochemical fabrication processes and apparatus for producing multi-layer structures where each layer includes the deposition of at least two materials and wherein the formation of at least some layers including operations for providing coatings of dielectric material that isolate at least portions of a first conductive material from (1) other portions of the first conductive material, (2) a second conductive material, or (3) another dielectric material, and wherein the thickness of the dielectric coatings are thin compared to the thicknesses of the layers used in forming the structures. In some preferred embodiments, portions of each individual layer are encapsulated by dielectric material while in other embodiments only boundaries between distinct regions of materials are isolated from one another by dielectric barriers.

Abstract: A manufacturing method of an interposed substrate is provided. A photoresist layer is formed on a metal carrier. The photoresist layer has plural of openings exposing a portion of the metal carrier. Plural of metal passivation pads and plural of conductive pillars are formed in the openings. The metal passivation pads cover a portion of the metal carrier exposed by openings. The conductive pillars are respectively stacked on the metal passivation pads. The photoresist layer is removed to expose another portion of the metal carrier. An insulating material layer is formed on the metal carrier. The insulating material layer covers the another portion of the metal carrier and encapsulates the conductive pillars and the metal passivation pads. An upper surface of the insulating material layer and a top surface of each conductive pillar are coplanar. The metal carrier is removed to expose a lower surface of the insulating material layer.

Abstract: A method for fabricating a conductive structure of a substrate includes the steps of: providing an insulating substrate having opposite first and second surfaces and forming an insulating adhesive film on the second surface of the insulating substrate; forming at least a through hole penetrating the insulating substrate and the insulating adhesive film and forming a conductive foil on the insulating adhesive film so as to cover the through hole; and forming a shielding material on the conductive foil and the second surface of the insulating substrate and performing an electrochemical deposition process through the conductive foil so as to fill the through hole with a conductive material along a direction towards the first surface of the insulating substrate, thereby preventing the formation of voids in the through hole and hence reducing the overall resistance and preventing a blister effect from occurring.

Abstract: Methods of forming a conductive metal layers on substrates are disclosed which employ a seed layer to enhance bonding, especially to smooth, low-roughness or hydrophobic substrates. In one aspect of the invention, the seed layer can be formed by applying nanoparticles onto a surface of the substrate; and the metallization is achieved by electroplating an electrically conducting metal onto the seed layer, whereby the nanoparticles serve as nucleation sites for metal deposition. In another approach, the seed layer can be formed by a self-assembling linker material, such as a sulfur-containing silane material.

Abstract: A coating method for forming a pattern on a workpiece is provided. First, a workpiece surface is provided. Second, a mask having a shape conforming to a predetermined pattern is provided. Next, the workpiece surface includes a first portion exposed outside and a second portion shielded by the mask. A shielding layer is formed on the exposed first portion of the workpiece surface. The mask is removed from the workpiece to expose the second portion. A coating layer over the shielding layer and the exposed second portion is formed. The coating layer consists of a first part overlaying the shielding layer and a second part overlaying the second portion. The mask is attached onto the coating layer and aligned with the second portion of the workpiece surface. The first part of the coating layer, the shielding layer, and the mask are then removed.

Abstract: An article is provided, the article including a substrate having a surface with a first wettability characteristic. A nano-structure array is formed on the surface of the substrate to provide a nano-structured surface having a second wettability characteristic. A thin-layer surface coating is formed on the nano-structured surface, the thin-layer surface coating being configured to tune the nano-structured surface to a target wettability characteristic.

Abstract: A method of forming a micro-structure (100, 100?, 100?, 100??) involves forming a multi-layered structure (10) including i) an oxidizable material layer (14) on a substrate (12) and ii) another oxidizable material layer (16) on the oxidizable material layer (14). The oxidizable material layer (14) is formed of an oxidizable material having an expansion coefficient, during oxidation, that is more than 1. The method further involves forming a template (16?), including a plurality of pores (18), from the other oxidizable material layer (16), and growing a nano-pillar (20) inside each pore (18). The nano-pillar (18) has a predefined length (L) that terminates at an end (21). A portion of the template (16?) is selectively removed to form a substantially even plane (23) that is oriented in a position opposed to the substrate (12).

Abstract: Provided is a method for preparing an epoxy substrate having a nanopattern, including: (a) forming a titanium oxide film by anodizing a titanium substrate; (b) obtaining a titanium substrate having a concave shape formed on the surface by removing the titanium oxide film from the titanium substrate on which the titanium oxide film has been formed; (c) coating an epoxy resin onto the titanium substrate on which the concave shape has been formed; and (d) obtaining an epoxy substrate having a nanopattern of convex surfaces by removing the titanium substrate.

Abstract: A substrate structure, a semiconductor package device and a manufacturing method of substrate structure are provided. The substrate structure comprises a conductive structure comprising a first metal layer, a second metal layer and a third metal layer. The second metal layer is disposed on the first metal layer. The third metal layer is disposed on the second metal layer. Each of the second metal layer and the third metal layer has a first surface and a second surface opposite to the first surface. The first surface of the third metal layer is connected to the second surface of the second metal layer. The surface area of the first surface of the third metal layer is larger than that of the second surface of the second metal layer. A substrate structure, semiconductor package device, and a manufacturing method of substrate structure are provided. The substrate structure includes a conductive structure, comprising a first metal layer, a second metal layer, and a third metal layer.

Abstract: Disclosed herein are a plating pattern and a method of manufacturing the same. The plating pattern includes: a base substrate; a conductive polymer formed on the base substrate and patterned to be selectively deactivated by having a deactivator added thereto; and a plating layer formed on portions of the conductive polymer except for the deactivated portions.

Abstract: Disclosed is an electrolytic plating method which includes forming plating films 5 and 6 having predetermined thicknesses in a plurality of regions 14 and 15 on a substrate 1. The electrolytic plating method includes arranging a resistive element 4 having ohmic characteristics in at least one of paths through which electrolytic plating currents flow into the plurality of the regions 14 and 15 on the substrate 1, respectively, and simultaneously growing the plating films 5 and 6 in the plurality of the regions 14 and 15 by electrolytic plating. The electrolytic plating method can form the plating films having different or same thicknesses in the plurality of the regions on the substrate.

Abstract: Lithographic and nanolithographic methods that involve patterning a first compound on a substrate surface, exposing non-patterned areas of the substrate surface to a second compound and removing the first compound while leaving the second compound intact. The resulting hole patterns can be used as templates for either chemical etching of the patterned area of the substrate or metal deposition on the patterned area of the substrate.

Abstract: Electrochemical fabrication processes and apparatus for producing single layer or multi-layer structures where each layer includes the deposition of at least two materials and wherein the formation of at least some layers includes operations for reducing stress and/or curvature distortion when the structure is released from a sacrificial material which surrounded it during formation and possibly when released from a substrate on which it was formed. Six primary groups of embodiments are presented which are divide into eleven primary embodiments. Some embodiments attempt to remove stress to minimize distortion while others attempt to balance stress to minimize distortion.

Abstract: Methods of forming a conductive metal layers on substrates are disclosed which employ a seed layer to enhance bonding, especially to smooth, low-roughness or hydrophobic substrates. In one aspect of the invention, the seed layer can be formed by applying nanoparticles onto a surface of the substrate; and the metallization is achieved by electroplating an electrically conducting metal onto the seed layer, whereby the nanoparticles serve as nucleation sites for metal deposition. In another approach, the seed layer can be formed by a self-assembling linker material, such as a sulfur-containing silane material.

Abstract: One exemplary embodiment includes a method of selectively electroplating an electrically conductive coating on portions of a first face of a bipolar plate for use in a proton exchange membrane (PEM) fuel cell. The first face of the bipolar plate defines at least one reactant gas flow channel and a plurality of lands adjacent the at least one channel. The electrically conductive coating may be selectively electroplated on a plurality of first portions of the lands leaving second portions of the lands uncoated by the electrically conductive coating.

Abstract: The present invention relates to a method for manufacturing a stamper for injection molding, and more particularly, to a method for manufacturing a stamper for injection molding which can prevent a scratch from forming thereon and has an excellent durability owing to high hardness even after manufacturing of the metal stamper with micro patterns formed thereon is finished. The method for manufacturing a stamper for injection molding includes a pattern forming step for forming a predetermined micro pattern on a substrate, a metal plating step for making metal plating on the substrate to form a stamper having the micro pattern transcribed thereto, a stamper separating step for separating the stamper of the metal plating from the substrate, and a protective layer coating step for coating a protective layer on the stamper for maintaining a mirror surface.

Abstract: A metal identification platelet equipped with an identification code, while the identification code comprises a hologram. A method of producing the identification platelet with the identification code, including the following steps: A shield from an electro-insulation material is formed on a shim with a holographic motif. Then, the shim is galvanized in the places not covered by the shield from the electro-insulation material. And the completed metal identification platelets are removed from the shim.

Abstract: Metalized plastic substrates, and methods thereof are provided herein. The method includes providing a plastic substrate having a plurality of accelerators dispersed in the plastic substrate. The accelerators have a formula selected from the group consisting of: CuFe2O4-?, Ca0.25Cu0.75TiO3-?, and TiO2-?, wherein ?, ?, ? denotes oxygen vacancies in corresponding accelerators and 0.05???0.8, 0.05???0.5, and 0.05???1.0. The method further includes removing at least a portion of a surface of the plastic substrate to expose at least a first accelerator. The method further includes plating the exposed surface of the plastic substrate to form at least a first metal layer on the at least first accelerator, and then plating the first metal layer to form at least a second metal layer.

Abstract: A method includes providing a voltage switchable dielectric material having a characteristic voltage, exposing the voltage switchable dielectric material to a source of ions associated with an electrically conductive material, and creating a voltage difference between the source and the voltage switchable dielectric material that is greater than the characteristic voltage. Electrical current is allowed to flow from the voltage switchable dielectric material, and the electrically conductive material is deposited on the voltage switchable dielectric material. A body comprises a voltage switchable dielectric material and a conductive material deposited on the voltage switchable dielectric material using an electrochemical process. In some cases, the conductive material is deposited using electroplating.

Abstract: The inventive method and device for vacuum-compression micro plasma oxidation relate to electrochemical processing of metal, in particular to micro plasma treatment in electrolyte solutions. The aim of said invention is to develop a method for obtaining qualitatively homogeneous coatings by micro-plasma oxidation on large-sized parts, including irregular shaped parts, or simultaneously on a great number of small parts. The second aim of the invention is to design a device for processing parts, having an extended surface area, by using low-power supplies. The inventive method for vacuum-compression micro-plasma oxidation of parts consists in dipping a processable part into an electrolyte solution pre-filled in a sealed container, in generating micro-plasma discharges on the surface of said part and, subsequently, in forming a coating, wherein the micro-plasma discharges are formed in low-pressure conditions above the electrolyte solution.

Abstract: A method includes forming a first substrate by (a) applying an electrodepositable dielectric coating onto a conductive surface; (b) curing the dielectric coating; (c) depositing an adhesion layer and a seed layer onto the dielectric coating; (d) applying a layer of a first removable material to the seed layer; (e) forming openings in the first removable material to expose areas of the seed layer; (f) electroplating a first conductive material to the exposed areas of the seed layer; (g) applying a layer of a second removable material; (h) forming openings in the second removable material to expose areas of the first conductive material; (i) plating a second conductive material to the exposed areas of the first conductive material; (j) removing the first and second removable materials; (k) removing unplated portions of the seed layer; repeating steps (a) through (k) to form a second substrate; and laminating the first and second substrates together with a layer of dielectric material between the first and secon

Abstract: A method for fabricating metal nanodots on a substrate is provided. The method includes: preparing a nanoporous polysulfone membrane; applying the nanoporous polysulfone membrane onto a substrate; depositing a metal into the pores of the polysulfone membrane thereby forming metal nanodots on the substrate; and removing the nanoporous polysulfone membrane.