Abstract: Provided is a metal film forming apparatus capable of forming a uniform metal film on a surface of a substrate by uniformly pressurizing an electrolyte membrane against the surface of the substrate. The film forming apparatus includes first and second film forming units, a coupling portion that couples the first and second film forming units together, a pressure device including a pressure unit that pressurizes substrates with electrolyte membranes of the respective film forming units via the coupling portion, and a power supply unit adapted to apply a voltage across each anode and each substrate. The film forming units are coupled to the coupling portion via their respective first elastic bodies that elastically deform in the pressurization direction of the pressure unit.

Abstract: An electrolytic processing jig configured to perform an electrolytic processing on a processing target substrate by using a processing liquid supplied to the processing target substrate includes a base body having a flat plate shape; and a direct electrode provided on a front surface of the base body and configured to be brought into contact with the processing liquid to apply a voltage between the processing target substrate and the direct electrode. An irregularity pattern is formed on a front surface of the electrolytic processing jig at a processing target substrate side.

Abstract: Provided is a metal film forming apparatus capable of forming a uniform metal film on a surface of a substrate by uniformly pressurizing an electrolyte membrane against the surface of the substrate. The film forming apparatus includes first and second film forming units, a coupling portion that couples the first and second film forming units together, a pressure device including a pressure unit that pressurizes substrates with electrolyte membranes of the respective film forming units via the coupling portion, and a power supply unit adapted to apply a voltage across each anode and each substrate. The film forming units are coupled to the coupling portion via their respective first elastic bodies that elastically deform in the pressurization direction of the pressure unit.

Abstract: An apparatus and a method for manufacturing a continuous reactor type core-shell catalyst electrode, which may manufacture a large amount of continuous reactor type core-shell catalyst electrodes by improving coating efficiency of shell metal by using reaction chambers disposed in a circular shape or in a line are provided. The apparatus for manufacturing a continuous reactor type core-shell catalyst electrode includes: a main body; reaction chambers which are disposed plurally in a circular shape inside the main body, store reaction solution inside thereof, are equipped with a movable member and counter electrodes, and are coupled with a reference electrode to a lateral portion thereof; a palladium sheet which is moved by the movable member and immersed in the reaction solution as the movable member moves downward; a power supply which applies a voltage to the electrodes.

Abstract: A chip arrangement including a chip comprising a chip back side; a back side metallization on the chip back side, the back side metallization including a plurality of layers; a substrate comprising a surface with a metal layer; a zinc-based solder alloy configured to attach the back side metallization to the metal layer, the zinc-based solder alloy having by weight 8% to 20% aluminum, 0.5% to 20% magnesium, 0.5% to 20% gallium, and the balance zinc; wherein the metal layer is configured to provide a good wettability of the zinc-based solder alloy on the surface of the substrate. The plurality of layers may include one or more of a contact layer configured to contact a semiconductor material of the chip back side; a barrier layer; a solder reaction, and an oxidation protection layer configured to prevent oxidation of the solder reaction layer.

Abstract: To provide a fabricating method and a fabricating apparatus for a lithium-ion secondary battery having stable charge characteristics and lifetime characteristics. A positive electrode is subjected to an electrochemical reaction in a large amount of electrolytic solution in advance before a secondary battery is completed. In this manner, the positive electrode can have stability. The use of the positive electrode enables fabrication of a highly reliable secondary battery. Similarly, a negative electrode is subjected to an electrochemical reaction in a large amount of electrolytic solution in advance. The use of the negative electrode enables fabrication of a highly reliable secondary battery.

Abstract: A determination is made of a real-time azimuthal position of a notch alignment feature located on a support surface of a substrate holder relative to a fixed reference ray extending perpendicularly away from a rotational axis of the substrate holder as the substrate holder rotates about the rotational axis. A determination is made of an approach initiation azimuthal position of the notch alignment feature relative to the fixed reference ray at which vertical movement of the substrate holder should initiate in order to have the notch alignment feature located at a prescribed azimuthal position relative to the fixed reference ray when the substrate holder reaches a prescribed vertical position. A determination is made of a time delay required to have the notch alignment feature located at the approach initiation azimuthal position. Vertical movement of the substrate holder is initiated in accordance with the determined time delay.

Abstract: An apparatus for electroplating metal on a semiconductor substrate with improved azimuthal uniformity includes in one aspect: a plating chamber configured to contain an electrolyte and an anode; a substrate holder configured to hold the semiconductor substrate; an ionically resistive ionically permeable element (“the element”) configured to be positioned proximate the substrate; and a shield configured for providing azimuthally asymmetrical shielding and positioned between the substrate holder and the element such that the closest distance between the substrate-facing surface of the shield and the working surface of the substrate is less than 2 mm. In some embodiments there is an electrolyte-filled gap between the substrate-facing surface of the element and the shield during electroplating. The substrate-facing surface of the shield may be contoured such that the distance from different positions of the shield to the substrate is varied.

Abstract: Aspects of the disclosure herein relate to systems and methods for heating, cooling, and/or displaying food. A food display system may include a base; a support engaged with the base; a canopy supported by the support, the canopy having a top surface, a bottom surface, and an edge surface between the top and bottom surfaces, the edge surface having at least a first portion and a second portion; and a light source configured to provide light to the first portion of the edge surface of the canopy and illuminate the second portion of the edge surface of the canopy. The canopy may be configured to be located above a food item.

Abstract: Formation of an authentication element by deposition of a metal layer with embedded particles on a metal substrate, wherein the embedded particles are configured to convert energy from one wavelength to another. The embedded particles may be upconverters, downconverters, or phosphorescent phosphors, which can be detected and measured with analytical equipment when deposited in the metal layer. A metal substrate may include coinage.

Abstract: The invention relates to a resistor, in particular a low-resistance current-measuring resistor, comprising a first connection part (1) that consists of a conductor material for introducing an electrical current (I), a second connection part (2) that consists of a conductor material for discharging said electrical current (I), and a resistor element (3) that consists of a resistor material and is arranged between the two connection parts (1, 2) in the direction of the current, also comprising a resistor coating (7) that consists of a metallic material for the purpose of achieving protection from corrosion, and/or improving solderability. According to the invention, the metallic coating (7) is applied directly to the entire free surface of the resistor element (3) without any insulation layer.

Abstract: An electroplating apparatus for plating a metal onto a surface of a wafer is disclosed. The apparatus comprises a wafer support configured to support a wafer and a processing base. The processing base has a scroll pump oriented to pump a plating solution in a substantially perpendicular direction with respect to the surface of the wafer. Further, the scroll pump includes a first scroll and a second scroll, at least one of which is configured as an anode. In one embodiment, the processing base includes an anolyte chamber including the scroll pump, a catholyte chamber, and a membrane separating the anolyte chamber from the catholyte chamber.

Abstract: To provide a barrel electroplating method which is less prone to bare spots and adhesion failure such as blisters and peeling, and which makes it possible to obtain uniform plated coatings free from burnt deposits and poor brightness, irrespective of the amount of workpieces. The present invention provides a method for performing barrel electroplating by use of an aluminum or aluminum alloy plating bath, the method comprising rotating, swinging, or vibrating an anode (6) placed inside a barrel (4) receiving workpieces, and simultaneously rotating, swinging, or vibrating the barrel, with a voltage being applied between the anode and a cathode provided on an inner wall surface of the barrel.

Abstract: An electroplating apparatus that promotes uniform electroplating on the substrates having thin seed layers includes a convex anisotropic high resistance ionic current source (AHRICS), such as an electrolyte-permeable resistive domed plate. The AHRICS is positioned in close proximity of the substrate, so that a distance from the central portion of the AHRICS to the substrate is smaller than the distance from the edge portion of the AHRICS to the substrate. The apparatus further includes a plating chamber configured to hold the electrolyte and an anode. The apparatus further includes a substrate holder configured to hold the substrate. In some embodiments, the apparatus further includes a secondary (thief) cathode configured to divert ionic current from the near-edge region of the substrate.

Abstract: Described are apparatus and methods for electroplating one or more metals onto a substrate. Embodiments include electroplating apparatus configured for plating highly uniform metal layers. In specific embodiments, the apparatus includes a flow-shaping element made of an ionically resistive material and having a plurality of channels made through the flow shaping element. The channels allow for transport of the electrolyte through the flow shaping element during electroplating. The channel openings are arranged in a spiral-like pattern on the substrate-facing surface of the flow shaping element such that the center of the spiral-like pattern is offset from the center of the flow shaping element.

Abstract: Described are apparatus and methods for electroplating one or more metals onto a substrate. Embodiments include electroplating apparatus configured for plating highly uniform metal layers. In specific embodiments, the apparatus includes a flow-shaping element made of an ionically resistive material and having a plurality of channels made through the flow shaping element. The channels allow for transport of the electrolyte through the flow shaping element during electroplating. The channel openings are arranged in a spiral-like pattern on the substrate-facing surface of the flow shaping element such that the center of the spiral-like pattern is offset from the center of the flow shaping element.

Abstract: A partial plating device includes a drum jig which has a plurality of positioning pins provided on the outer peripheral surface thereof, and which feeds a metal member around the outer periphery thereof by engaging the metal member with the positioning pins; a rotating shaft which rotatably supports the drum jig, a jet unit that supplies plating liquid to the metal member, and a brake unit that reduces the circumferential speed of the drum jig, and which is fitted to the rotating shaft. A plating device and a partial plating method in which plating is not carried out on the first region of a metal member on the carrying-in side of the drum jig, but in which plating is carried out on the second region of a metal member on the carrying-out side.

Abstract: An electroplating apparatus includes an anode configured to electrically communicate with an electrical voltage and an electrolyte solution. A cathode module includes a cathode that is configured to electrically communicate with a ground potential and the electrolyte solution. The cathode module further includes a wafer in electrical communication with the cathode. The wafer is configured to receive metal ions from the anode in response to current flowing through the anode via electrodeposition. The electroplating apparatus further includes at least one agitating device interposed between the wafer and the anode. The agitating device is configured to apply a force to gas bubbles adhering to a surface of the wafer facing the agitating device.

Abstract: An apparatus for substrate metallization from electrolyte is provided. The apparatus comprises: an immersion cell containing metal salt electrolyte; at least one electrode connecting to at least one power supply; an electrically conductive substrate holder holding at least one substrate to expose a conductive side of the substrate to face the at least one electrode; an oscillating actuator for oscillating the substrate holder with an amplitude and a frequency; at least one ultrasonic device with an operating frequency and an intensity, disposed in the metallization apparatus; at least one ultrasonic power generator connecting to the ultrasonic device; at least one inlet for metal slat electrolyte feeding; and at least one outlet for metal salt electrolyte draining.

Abstract: It is an object of the present invention to derive the optimum operating condition parameters for plating operation accurately and efficiently. At first, a preliminary test operation is carried out under the energized condition (S12), then in light of such result, a sequential operations such as a first test operation (step S14) in which no energization is carried out for plurality of operating pattern candidates and a second test operation (step S16) under the energized condition are carried out, and then the optimum operating conditions are registered (step S18).

Abstract: An apparatus, a method, a planar insulating substrate and a chipset have been presented, comprising at least one module configured to establish a predefined pattern on a planar insulating substrate so that conductive particles can gather according to the predefined pattern. At least one another module is configured to transfer the conductive particles to the planar insulating substrate, wherein the conductive particles are arranged to gather according to the predefined pattern. A sintering module is configured to fuse the conductive particles on the planar insulating substrate, wherein the conductive particles are arranged to fuse according to the predefined pattern to establish a conductive plane on the planar insulating substrate. Embodiment of the invention relate to printable or printing electronics on a fibrous web.

Abstract: A method for use in producing a stator for a progressing cavity apparatus which includes the use of electroforming to produce the stator tube. A stator tube for a progressing cavity apparatus which is produced using electroforming and a stator for a progressing cavity apparatus which includes a stator tube produced using electroforming.

Abstract: The embodiments herein relate to methods and apparatus for electroplating one or more materials onto a substrate. In many cases the material is a metal and the substrate is a semiconductor wafer, though the embodiments are no so limited. Typically, the embodiments herein utilize a channeled plate positioned near the substrate, creating a cross flow manifold defined on the bottom by the channeled plate, on the top by the substrate, and on the sides by a cross flow confinement ring. During plating, fluid enters the cross flow manifold both upward through the channels in the channeled plate, and laterally through a cross flow side inlet positioned on one side of the cross flow confinement ring. The flow paths combine in the cross flow manifold and exit at the cross flow exit, which is positioned opposite the cross flow inlet. These combined flow paths result in improved plating uniformity.

Abstract: Provided is a metal covered polyimide composite comprising a tie-coat layer and a metal seed layer formed on a surface of a polyimide film by electroless plating or a drying method, and a copper layer or a copper alloy layer formed thereon by electroplating, wherein the copper plated layer or copper alloy plated layer comprises three layers to one layer of the copper layer or copper alloy layer, and there is a concentrated portion of impurities at the boundary of the copper layer or copper alloy layer when the copper layer or copper alloy layer is three layers to two layers, and there is no concentrated portion of impurities when the copper layer or copper alloy layer is a single layer. Additionally provided are a method of producing the composite and a method of producing an electronic circuit board.

Abstract: A workpiece has a glossy coating layer disposed thereon. A barrel plating device is electrified with an alternating current, which has a voltage between 1V and 100V, a current density between 0.02 A/dm2 and 50 A/dm2, and a frequency between 1 Hz to 60 KHz. The alternating current is rectified by a low ripple DC rectifier into a direct current whose ripple coefficient is between 0.3% and 26%. Thereby, a surface of the workpiece is electroplated with the glossy coating layer, which contributes to a glossy and even effect on the surface of the workpiece.

Abstract: An electrodeposited nano-twins copper layer, a method of fabricating the same, and a substrate comprising the same are disclosed. According to the present invention, at least 50% in volume of the electrodeposited nano-twins copper layer comprises plural grains adjacent to each other, wherein the said grains are made of stacked twins, the angle of the stacking directions of the nano-twins between one grain and the neighboring grain is between 0 to 20 degrees. The electrodeposited nano-twins copper layer of the present invention is highly reliable with excellent electro-migration resistance, hardness, and Young's modulus. Its manufacturing method is also fully compatible to semiconductor process.

Abstract: The invention relates to a device and a method of applying a coating on a workpiece by electrodeposition. In the method, a workpiece is mounted on the mandrel of a lathe. A vessel, connected to a current generator and containing a bath of electrolyte and a conductor forming an anode, is placed beneath the workpiece. All or part of the workpiece is immersed in the bath by moving the vessel into a first position. The workpiece is turned by the lathe so that the entire surface of the workpiece is immersed at least once in the bath while a material is electrodeposited on the workpiece. The vessel is moved into a second position to break contact between the workpiece and the bath of electrolyte.

Abstract: A clam shell wafer holder includes a base and a lid pivotally connected with the base by an integral hinge. The base includes a rotatable wafer support, and the lid includes a universal frame and a pin holder attachment spaced inwardly from the frame. Only two contact pins are formed in a wafer-facing surface of the pin holder attachment. The contact pins are manually aligned with and contact two points on a wafer when the lid is closed against the base. A method for holding a wafer for plating is provided using the disclosed holder apparatus.

Abstract: Disclosed herein is a barrel plating apparatus. The barrel plating apparatus includes a barrel plating tank filled with an electrolytic solution, a barrel container immersed in the electrolytic solution of the barrel plating tank and filled with chip parts and media, a power supply unit for supplying current to an anode part and a cathode part which transfer the current to the barrel container and the electrolytic solution of the barrel plating tank, a driving motor for rotating the barrel container, and a hall current sensor formed in at least one cathode rod of the cathode part, coming into direct contact with the chip parts, the hall current sensor measuring the current. Accordingly, in the barrel plating apparatus, the currents of respective cathode rods are measured by hall current sensors, and thus variations in plating thickness can be reduced.

Abstract: Methods described herein manage wafer entry into an electrolyte so that air entrapment due to initial impact of the wafer and/or wafer holder with the electrolyte is reduced and the wafer is moved in such a way that an electrolyte wetting wave front is maintained throughout immersion of the wafer also minimizing air entrapment.

Abstract: Improved methods and apparatus for cleaning substrates and enhancing diffusion limited reaction at substrate surfaces use piezoelectric transducers operating in the gigasonic domain. The resonator assemblies include plural transducer stacks each including a thin film piezoelectric element coupled to a resonator plate that faces the substrate. At the disclosed frequencies and powers used, Eckart or Rayleigh streaming can be induced in a liquid treatment medium without substantial generation of cavitation.

Abstract: An apparatus for electroplating a rotogravure cylinder out of a plating solution is disclosed. The apparatus includes a plating tank adapted to support the cylinder and to contain a plating solution so that the cylinder is at least partially disposed into the plating solution. The apparatus also includes a non-dissolvable anode at least partially disposed within the plating solution. A current source is electrically connected to the non-dissolvable anode and to the cylinder. An ultrasonic system may be provided to introduce wave energy into the plating solution includes at least one transducer element mountable within the tank and a power generator adapted to provide electrical energy to the transducer element. A holding tank having a circulation pump, a mixing system and heating and cooling elements for the plating solution may be provided.

Abstract: A copper electroplating method including dipping a substrate in a copper electroplating solution, the substrate including a seed layer; and forming a copper electroplating layer on the seed layer, wherein the copper electroplating solution includes water, a copper supply source, an electrolytic material, and a first additive, the first additive includes a compound represented by Formula 1, below:

Abstract: To provide a barrel electroplating method which is less prone to bare spots and adhesion failure such as blisters and peeling, and which makes it possible to obtain uniform plated coatings free from burnt deposits and poor brightness, irrespective of the amount of workpieces. The present invention provides a method for performing barrel electroplating by use of an aluminum or aluminum alloy plating bath, the method comprising rotating, swinging, or vibrating an anode (6) placed inside a barrel (4) receiving workpieces, and simultaneously rotating, swinging, or vibrating the barrel, with a voltage being applied between the anode and a cathode provided on an inner wall surface of the barrel.

Abstract: The invention relates to a method for treating surfaces of hollow parts, this method being a conversion treatment such as an anodizing, and to a method according to which the hollow pieces are completely immersed inside at least one treatment tank containing a liquid, characterized in that each hollow piece is immersed while making it execute at least one rotational movement so that air bubbles likely to be created inside the tank are removed from the inner wall of the hollow part.

Abstract: The disclosure relates generally to semiconductor device fabrication, and more particularly to methods of electroplating used in semiconductor device fabrication. A method of electroplating includes: immersing an in-process substrate into an electrolytic plating solution to form a first metal layer on the in-process substrate; then performing a first chemical-mechanical polish to a liner on the in-process substrate followed by immersing the in-process substrate into the electrolytic plating solution to form a second metal layer on the first metal layer and the liner; and performing a second chemical-mechanical polish to the liner.

Abstract: An electric contact in the outer edge thereof, is used for electroplating substrates, e.g. as a wafer in a cup plater. In order to obtain an even electroplating result, at least two electrolytic partial cells are formed which are supplied with current by respective electroplating current sources (9?) and (9?) that can be individually adjusted. The partial cathode (12?) and the associated partial anode (7?) are supplied in the region of the diametrically remote partial cathode (12?). Conversely, the partial cathode (12?) is supplied via the base layer of the partial cathode (12?). The required levelling of the layer thickness distribution is inter alia carried out by alternate different adjustments of the quantity of the electroplating current of the two partial cells and by the electrodes (7,12) that rotate relative to each other.

Abstract: Described are apparatus and methods for electroplating one or more metals onto a substrate. Embodiments include electroplating apparatus configured for, and methods including, efficient mass transfer during plating so that highly uniform plating layers are obtained. In specific embodiments, the mass transfer is achieved using a combination of impinging flow and shear flow at the wafer surface.

Abstract: Manufacture of semiconductor products such as LCD driver requires a bump plating step for forming a gold bump electrode having a size of from about 15 to 20 ?m. This bump plating step is performed by electroplating with a predetermined plating solution, but projections intermittently appear on the bump electrode during a mass production process. In the invention, abnormal growth of projections over the gold bump electrode is prevented by adding, prior to the gold bump plating step, a step of circulating and stirring a plating solution while erecting a plating cup and efficiently dissolving/discharging a precipitate. This step is performed for each wafer to be treated.

Abstract: An apparatus for electroplating a rotogravure cylinder out of a plating solution is disclosed. The apparatus includes a plating tank adapted to support the cylinder and to contain a plating solution so that the cylinder is at least partially disposed into the plating solution. The apparatus also includes a non-dissolvable anode at least partially disposed within the plating solution. A current source is electrically connected to the non-dissolvable anode and to the cylinder. An ultrasonic system may be provided to introduce wave energy into the plating solution includes at least one transducer element mountable within the tank and a power generator adapted to provide electrical energy to the transducer element. A holding tank having a circulation pump, a mixing system and heating and cooling elements for the plating solution may be provided.

Abstract: The invention relates to a coating method for a workpiece, including the following method steps: a) applying a coating liquid to the workpiece, wherein the coating liquid comprises an ionic liquid containing ions of at least one element, b) electrochemically depositing a layer of the at least one element from the coating liquid on the workpiece, c) removing the workpiece from the coating liquid, d) removing excess coating liquid from the workpiece. In order to suggest an industrially suitable coating process, particularly for workpieces having at least a partial metal surface, using stable, durable baths, it is provided that the temperature of the workpiece is set such that the temperature of the coating liquid deviates by no more than 10° C.

Abstract: The invention relates to a device and a method of applying a coating on a workpiece by electrodeposition. A vessel is provided that is suitable for filling with a bath of electrolyte, anode-forming conductor means being placed in the vessel and connected to a current generator, a cathode-forming workpiece mounted on the mandrel of a lathe, and guidance and movement means for guiding and moving the vessel relative to the lathe, the guidance and movement means enabling the workpiece to be immersed in full or in part in the bath of electrolyte.

Abstract: A copper foil reducing transmission loss at a high frequency and excellent in bond strength with a resin substrate, including at least a granular layer and a columnar layer in its thickness direction, the columnar layer being formed on at least one surface of the granular layer forming the copper foil or the granular layer being formed on at least one surface of the columnar layer forming the copper foil, the relation of the thickness A of the granular layer and the thickness B of the columnar layer in the copper foil being preferably A/(A+B)=40 to 99%, a method of production and apparatus for production for the same, and a high frequency circuit using the same.

Abstract: A plating film is provided with enough hardness before anodic oxidation, which is hard to be damaged during handling, and also the production method of the plating film. This problem can be solved by an aluminum plating film with aluminum concentration of 98 wt. % or lower, and with a Vickers hardness of 250 or higher. Here, by containing oxygen, carbon, sulfur, and a halogen element as impurities, the hardness becomes higher. The impurity concentration is controlled by adjusting the current density, the plating temperature, or the plating bath composition.

Abstract: A disclosed electrolytic plating method includes a first step of immersing a substrate in electrolytic plating liquid including copper salt to form a first Cu layer on the substrate; and a second step of forming a second Cu layer over the first Cu layer. The first step is continued for ten seconds or less after the immersion. In the first step, the substrate is rotated at a first speed N (rpm) which satisfies D×N×n?6000×? (mm/min), where D is the diameter of the substrate (mm), and D×N×? represents the peripheral speed of the substrate, and a current is supplied to the substrate at a first density of 10 mA/cm2 or less. In the second step, the substrate is rotated at a second speed higher than the first speed, and the current is supplied to the substrate at a second density higher than the first density.

Abstract: Embodiments of the invention are directed to methods of electroplating copper onto at least one surface of a substrate in which more uniform electrical double layers are formed adjacent to the at least one surface being electroplated (i.e., the cathode) and an anode of an electrochemical cell, respectively. In one embodiment, the electroplated copper may be substantially-free of dendrites, exhibit a high-degree of (111) crystallographic texture, and/or be electroplated at a high-deposition rate (e.g., about 6 ?m per minute or more) by electroplating the copper under conditions in which a ratio of a cathode current density at the at least one surface to an anode current density at an anode is at least about 20. In another embodiment, a porous anodic film may be formed on a consumable copper anode using a long conditioning process that promotes forming a more uniform electrical double layer adjacent to the anode.

Abstract: The present invention provides a copper plating method and apparatus for a gravure cylinder in which copper plating with more uniform thickness can be provided over a full length of a gravure cylinder without causing defects such as rashes and pits irrespective of a size of the gravure cylinder, concentration of a copper plating solution can be managed automatically, a consumption amount of an additive is reduced to make it possible to perform a plating treatment within a short period of time, a power supply cost is reduced, and handling is easy with excellent visibility. A gravure cylinder in a hollow cylindrical shape is held at both ends in a longitudinal direction. The gravure cylinder is accommodated in a plating bath filled with a copper plating solution. The gravure cylinder is energized so that the gravure cylinder functions as a cathode while being rotated at a predetermined speed.

Abstract: A method for applying a strike voltage to one or more substrates during plating. During this method, the substrates are moved in a planetary manner while being held at their exterior edges by a set of parallel mandrels. (The substrates are held in a mutually parallel orientation, typically vertically, during plating.) A voltage is applied to the substrates via a contact pin, a contact plate, a set of ball bearings, a rack end-plate, and the mandrels.

Abstract: An apparatus that performs an electrolytic plating on a plating surface of a belt substrate is provided. The apparatus includes a plating tank, a conveyor device configured to carry a belt substrate through an interior of the plating tank, an immersed cathode power-supply section provided within the interior of the plating tank, an auxiliary cathode power-supply section provided within the interior of the plating tank, and short-circuit wiring configured to short-circuit the immersed cathode power-supply section to the auxiliary cathode power-supply section. A plating method for performing electrolytic plating on a plating surface of a belt substrate is provided.

Abstract: A device and a method for metallic electrolytic coating of an object of electrically conductive material, wherein the object has at least two surface portions that are desired to be coated with layers of different thicknesses. The device includes an anode. The device is designed to receive the object in such a way that the object constitutes a cathode and that, upon receipt of the object, a space is formed for receiving a liquid-absorbing material and an electrolyte for coating the object. The body of the anode includes at least two surface portions) that have different electrical conductivity and that are arranged opposite to the surface portions of the received object.