Coating Moving Substrate Patents (Class 205/137)
  • Patent number: 10954603
    Abstract: A substrate holder includes: a first holding member having a surface configured to come into contact with the substrate; and a second holding member, between which and the first holding member the substrate is put and held. The second holding member includes a removal portion that is disposed along an outer circumference of the substrate and configured to come into contact with the substrate and remove an insulating material on the substrate when the substrate is put between the first holding member and the second holding member, and an electric contact portion that is disposed along the outer circumference of the substrate and configured to come into contact with a region on the substrate in which the removal portion has removed the insulating material when the substrate is put and held between the first holding member and the second holding member.
    Type: Grant
    Filed: February 8, 2018
    Date of Patent: March 23, 2021
    Assignee: EBARA CORPORATION
    Inventor: Jumpei Fujikata
  • Patent number: 10749388
    Abstract: A stator includes a first core including a plurality of non-oriented electromagnetic steel sheets that is stacked and having an insertion hole penetrating the plurality of non-oriented electromagnetic steel sheets in an axial direction of the stator and a second core arranged in the insertion hole and including a plurality of oriented electromagnetic steel sheets that is stacked. The first core has a thin-wall part adjoining the second core, and a conditional expression of 0.5tm?ta?2tm is satisfied, where ta denotes a thickness of the thin-wall part when the first core is viewed in the axial direction and tm denotes a sheet thickness of one non-oriented electromagnetic steel sheet in the plurality of non-oriented electromagnetic steel sheets.
    Type: Grant
    Filed: May 30, 2016
    Date of Patent: August 18, 2020
    Assignee: Mitsubishi Electric Corporation
    Inventors: Kazuhiko Baba, Masahiro Nigo
  • Patent number: 10692754
    Abstract: A method includes disposing a wafer in a cup of a clamshell of an electroplating apparatus. The wafer is clamped using the cup and a cone of the clamshell. First pressure forces of contacts of the cup applied by the wafer is detected. The first pressure forces are respective compared with corresponding predetermined pressure ranges.
    Type: Grant
    Filed: October 3, 2018
    Date of Patent: June 23, 2020
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Yung-Chang Huang, Tsun-En Kuo
  • Patent number: 10316425
    Abstract: A substrate holder according to the present invention comprises a first power supply member and a second power supply member which allow power to be supplied to substrates having different properties. The first power supply member comprises a first power supply member end part which extends toward the inside of a substrate holding surface and is disposed at a first position of the substrate holding surface. The second power supply member comprises a second power supply member end part which extends toward the inside of the substrate holding surface and is disposed at a second position of the substrate holding surface. The first position is located on the center side of the substrate holding surface relative to the second position.
    Type: Grant
    Filed: February 27, 2015
    Date of Patent: June 11, 2019
    Assignee: EBARA CORPORATION
    Inventors: Toshikazu Yajima, Mitsutoshi Yahagi, Masaaki Kimura
  • Patent number: 10214830
    Abstract: A substrate holder for holding a substrate, such as a wafer, is disclosed. The substrate holder includes a seal ring which can be brought into contact with a peripheral portion of the substrate, a support ring supporting the seal ring, and a fixing ring pressing the seal ring against the support ring. The fixing ring includes an annular portion having an inner circumferential surface and an outer circumferential surface, each of which is constituted by a tapered surface. The fixing ring further includes a seal-ring pressing portion connected to the annular portion, and a regulation ring projecting radially inwardly from the seal-ring pressing portion. The regulation ring has an inside diameter which is smaller than an inside diameter of the seal ring.
    Type: Grant
    Filed: October 14, 2015
    Date of Patent: February 26, 2019
    Assignee: EBARA CORPORATION
    Inventors: Mitsutoshi Yahagi, Masaaki Kimura, Yusuke Tamari
  • Patent number: 9984910
    Abstract: A plating apparatus allows a substrate holder to be serviced easily while ensuring easy access to the substrate holder and while a substrate is being processed in the plating apparatus. The plating apparatus includes a plating section for plating a substrate, a substrate holder for holding the substrate, a substrate holder transporter for holding and transporting the substrate holder, a stocker for storing the substrate holder, and a stocker setting section for storing the stocker therein. The stocker includes a moving mechanism for moving the stocker into and out of the stocker setting section.
    Type: Grant
    Filed: June 22, 2017
    Date of Patent: May 29, 2018
    Assignee: EBARA CORPORATION
    Inventor: Yoshio Minami
  • Patent number: 9876397
    Abstract: An electrical machine, in particular an electric motor of a motor vehicle, having a stator and having a rotor which has a rotation axis. An electrical machine can be a brushless electric motor (DC motor) or a synchronous machine, but also a generator. The stator or the rotor has an electromagnet structure, and the other has a permanent-magnet structure which comprises a first quantity of permanent magnets and a second quantity of permanent magnets. At at least the operating temperature (T), the magnetic coercive field strength (Hcji) of the first quantity is greater than the magnetic coercive field strength (Hcj2) of the second quantity. Further, two methods for producing hybrid magnets are provided.
    Type: Grant
    Filed: September 12, 2014
    Date of Patent: January 23, 2018
    Assignee: Brose Fahrzeugteile GmbH & Co. KG, Wuerzburg
    Inventors: Sunny Zhang, Matthias Koch, Axel Steinshorn
  • Patent number: 9587322
    Abstract: Methods described herein manage wafer entry into an electrolyte so that air entrapment due to initial impact of the wafer and/or wafer holder with the electrolyte is reduced and the wafer is moved in such a way that an electrolyte wetting wave front is maintained throughout immersion of the wafer also minimizing air entrapment.
    Type: Grant
    Filed: April 14, 2015
    Date of Patent: March 7, 2017
    Assignee: Novellus Systems, Inc.
    Inventors: Manish Ranjan, Shantinath Ghongadi, Frederick Dean Wilmot, Douglas Hill, Bryan L. Buckalew
  • Patent number: 9293364
    Abstract: There is provided an electroless plating apparatus which, despite using a high-productivity batch processing method, can reduce the amount of a liquid chemical brought out of a processing tank, thereby reducing the cleaning time in a cleaning step, and can perform flushing easily and quickly. The electroless plating apparatus includes a pre-plating treatment module including a pre-plating treatment tank, a plating module, and an inter-module substrate transport device. The pre-plating treatment tank is provided with a pre-plating treatment solution circulation line having a temperature control function for a pre-plating treatment solution. The plating tank is provided with a plating solution circulation line having a filter and a temperature control function for a plating solution. The plating solution circulation line is connected to a flushing line for flushing the interior of the plating solution circulation line and the interior of the plating tank.
    Type: Grant
    Filed: November 15, 2012
    Date of Patent: March 22, 2016
    Assignees: Ebara Corporation, Screen Holdings Co., Ltd.
    Inventors: Hiroyuki Kanda, Junichiro Tsujino, Junko Mine, Makoto Kubota, Tsutomu Nakada, Kenichiro Arai
  • Patent number: 9028666
    Abstract: Methods described herein manage wafer entry into an electrolyte so that air entrapment due to initial impact of the wafer and/or wafer holder with the electrolyte is reduced and the wafer is moved in such a way that an electrolyte wetting wave front is maintained throughout immersion of the wafer also minimizing air entrapment.
    Type: Grant
    Filed: April 30, 2012
    Date of Patent: May 12, 2015
    Assignee: Novellus Systems, Inc.
    Inventors: Manish Ranjan, Shantinath Ghongadi, Frederick Dean Wilmot, Douglas Hill, Bryan L. Buckalew
  • Patent number: 8926803
    Abstract: It is an object of this disclosure to provide high productivity, low cost-of-ownership manufacturing equipment for the high volume production of photovoltaic (PV) solar cell device architecture. It is a further object of this disclosure to reduce material processing steps and material cost compared to existing technologies by using gas-phase source silicon. The present disclosure teaches the fabrication of a sacrificial substrate base layer that is compatible with a gas-phase substrate growth process. Porous silicon is used as the sacrificial layer in the present disclosure. Further, the present disclosure provides equipment to produce a sacrificial porous silicon PV cell-substrate base layer.
    Type: Grant
    Filed: January 15, 2010
    Date of Patent: January 6, 2015
    Assignee: Solexel, Inc.
    Inventors: Doug Crafts, Mehrdad Moslehi, Subramanian Tamilmani, Joe Kramer, George D. Kamian, Somnath Nag
  • Publication number: 20140262802
    Abstract: A process for treating a surface of an electrically conductive workpiece is provided, comprising placing a movable workpiece within a reaction chamber, wherein the reaction chamber includes an anode, and wherein the workpiece is a cathode; creating a gap between the anode and the cathode, wherein the anode includes a plurality of orifices; applying an aqueous electrolyte into the reaction chamber through the orifices in the anode and onto the workpiece, and applying the aqueous electrolyte from below the workpiece, to establish an electrically conductive medium around the workpiece, applying a DC voltage to the electrically conductive medium in excess of 30 VDC, such that a foam is formed within the reaction chamber, wherein the foam comprises a gas/vapor phase and a liquid phase which fills the entire reaction chamber; adjusting the voltage to establish an electro-plasma discharge between the anode and workpiece, sufficient to cause positive ions in the electrically conductive medium to become concentrated n
    Type: Application
    Filed: March 17, 2014
    Publication date: September 18, 2014
    Applicant: CAP TECHNOLOGIES, LLC
    Inventors: Edward O. Daigle, Pratheesh George
  • Patent number: 8821699
    Abstract: An apparatus (1) for continuous electrolytic surface finishing of bars (2) is described, comprising at least one cathode (3), one electrolytic cell (4) containing an electrolyte (5) and comprising an inlet (6) and an outlet (7) for the bars (2), and at least one longitudinal anode (8) along the route of the bars (2) inside the electrolytic cell (4), and means (9) for feeding the bars (2) along the axis of the bars (2) for introducing the bars (2) into the cell (4). Said at least one cathode (3) consists of a plurality of sliding contacts (11), each of which is provided with a selectively and independently actuatable energetic source (30) thereof.
    Type: Grant
    Filed: April 30, 2010
    Date of Patent: September 2, 2014
    Assignee: Plating Innovation s.r.l.
    Inventors: Nicola Nisco, Ilaria Muratori
  • Publication number: 20140216940
    Abstract: An apparatus for substrate metallization from electrolyte is provided. The apparatus comprises: an immersion cell containing metal salt electrolyte; at least one electrode connecting to at least one power supply; an electrically conductive substrate holder holding at least one substrate to expose a conductive side of the substrate to face the at least one electrode; an oscillating actuator for oscillating the substrate holder with an amplitude and a frequency; at least one ultrasonic device with an operating frequency and an intensity, disposed in the metallization apparatus; at least one ultrasonic power generator connecting to the ultrasonic device; at least one inlet for metal slat electrolyte feeding; and at least one outlet for metal salt electrolyte draining.
    Type: Application
    Filed: June 24, 2011
    Publication date: August 7, 2014
    Applicant: ACM Research (Shanghai) Inc.
    Inventors: Hui Wang, Yue Ma, Chuan He, Xi Wang
  • Patent number: 8747640
    Abstract: Arrangements for plating a single surface of a thin foil are described. In one aspect, a metal foil is wrapped tightly at least partially around a plating solution drum. The drum is partially immersed in a plating solution such that the waterline of the metal plating solution is below a break point where the metallic foil strip begins to unwind from the plating solution drum. With this arrangement, one side of the metallic foil strip is exposed to the metal plating solution, while the opposing back side of the metallic foil strip does not come in substantial contact with the metal plating solution. In this manner, the exposed side of the foil is plated while the back surface of the foil is not plated. The drum may be rotated to convey the foil through the plating solution.
    Type: Grant
    Filed: September 26, 2012
    Date of Patent: June 10, 2014
    Assignee: Texas Instruments Incorporated
    Inventors: Jaime Bayan, Nghia Tu, Will Wong
  • Patent number: 8721863
    Abstract: A method for plating a belt substrate including conveying a belt substrate through a plating tank, contacting an immersed cathode power-supply device and/or an auxiliary cathode power-supply device with the belt substrate conveyed into the interior of the plating tank such that the belt substrate becomes a cathode, and electrically plating a surface of the belt substrate in the interior of the plating tank while the immersed cathode power-supply device and/or the auxiliary cathode power-supply device maintains cathode power-supply to the belt substrate conveyed into the interior portion of the plating tank. The immersed cathode power-supply device and the auxiliary cathode power-supply device are positioned in the interior portion of the plating tank and are electrically connected by a short circuit wiring.
    Type: Grant
    Filed: November 30, 2011
    Date of Patent: May 13, 2014
    Assignee: Ibiden Co., Ltd.
    Inventors: Yasuaki Tachi, Shigeki Sawa, Toshiyuki Kasuga
  • Patent number: 8557099
    Abstract: An electrically conductive protective coating or film is provided over the surface of a reflective coating of a solar mirror by flowing or directing a cation containing liquid and an anion containing liquid onto the conductive surface. The cation and the anion containing liquids are spaced from, and preferably out of contact with one another on the surface of the reflective coating as an electric current is moved through the anion containing liquid, the conductive surface between the liquids and the cation containing liquid to coat the conductive surface with the electrically conductive coating.
    Type: Grant
    Filed: October 25, 2010
    Date of Patent: October 15, 2013
    Assignee: PPG Industries Ohio, Inc.
    Inventors: Benjamin Kabagambe, Donald W. Boyd, Michael J. Buchanan, Patrick Kelly, Luke A. Kutilek, James W. McCamy, Douglas A. McPheron, Gary R. Orosz, Raymond D. Limbacher
  • Patent number: 8545687
    Abstract: Apparatus for the electrolytic treatment of the product L using a treatment agent is used to make the treatment of a plate-shaped product more uniform. This apparatus includes devices 40, 42 for retaining the product L in the apparatus, one or more flow devices 10, which each include at least one nozzle 15 and are disposed situated opposite the product L, one or more counter electrodes 30, which are inert relative to the treatment agent and are disposed parallel to at least one treatment surface, eccentric motor means for generating a relative movement 44 between the product L, on the side, and the flow devices 10 and/or the counter electrodes 30, on the other side, in at least one direction parallel to a treatment surface. The product L can be immersed in the treatment agent during treatment.
    Type: Grant
    Filed: June 3, 2008
    Date of Patent: October 1, 2013
    Assignee: Atotech Deutschland GmbH
    Inventors: Reinhard Schneider, Henry Kunze, Ferdinand Wiener
  • Publication number: 20130240363
    Abstract: The present invention relates to CIGS solar cell fabrication. The invention discloses a method for fabricating CIGS thin film solar cells using a roll-to-roll apparatus. The invention discloses method to fabricate semiconductor thin film Cu(InGa)(SeS)2 by sequentially electroplating a stack of multiple precursor layers comprising of copper, indium, gallium, and selenium elements or their alloys followed by selenization at a temperature between 450° C. and 700° C.
    Type: Application
    Filed: March 25, 2013
    Publication date: September 19, 2013
    Inventor: Delin Li
  • Patent number: 8529746
    Abstract: This method enables the use of nanowire or nano-textured forms of Polyaniline and other conductive polymers in energy storage components. The delicate nature of these very high surface area materials are preserved during the continuous electrochemical synthesis, drying, solvent application and physical assembly. The invention also relates to a negative electrode that is comprised of etched, lithiated aluminum that is safer and lighter weight than conventional carbon based lithium-ion negative electrodes. The invention provides for improved methods for making negative and positive electrodes and for energy storage devices containing them. The invention provides sufficient stability in organic solvent and electrolyte solutions, where the prior art processes commonly fail. The invention further provides stability during repetitive charge and discharge. The invention also provides for novel microstructure protecting support membranes to be used in an energy storage device.
    Type: Grant
    Filed: February 1, 2011
    Date of Patent: September 10, 2013
    Assignee: Nanoscale Components, Inc.
    Inventors: Robert W. Grant, Matthew Sweetland
  • Patent number: 8486237
    Abstract: An apparatus for continuously forming thin ceramic coatings on metal sheets, foils or wires. The apparatus has a reaction chamber, perforated nylon sheets, nylon bar guides, copper rods attached to a power supply, nylon collecting rods, and an inlet and an outlet. The reaction chamber is capable of containing an electrolytic solution. The copper rods are separately connected to the R, Y, or B phase of the power supply. Each phase is provided with two thyristors and the output of the thyristors is connected to the copper rods using current transformers. A process for continuously forming thin ceramic coatings on metal sheets, foils or wires is also provided.
    Type: Grant
    Filed: October 14, 2009
    Date of Patent: July 16, 2013
    Assignee: International Advanced Research Centre for Powder Metallurgy and New Materials (ARCI)
    Inventors: Lingamaneni Rama Krishna, Nitin Pandurang Wasekar, Govindan Sundararajan
  • Patent number: 8419917
    Abstract: An electroplating head is disposed above and proximate to an upper surface of a wafer. Cations are transferred from an anode to an electroplating solution within the electroplating head. The electroplating solution flows downward through a porous electrically resistive material at an exit of the electroplating head to be disposed on the upper surface of the wafer. An electric current is established between the anode and the upper surface of the wafer through the electroplating solution. The electric current is uniformly distributed by the porous electrically resistive material present between the anode and the upper surface of the wafer. The electric current causes the cations to be attracted to the upper surface of the wafer.
    Type: Grant
    Filed: June 10, 2009
    Date of Patent: April 16, 2013
    Assignee: Lam Research Corporation
    Inventors: Yezdi Dordi, Bob Maraschin, John Boyd, Fred C. Redeker
  • Patent number: 8394245
    Abstract: An object of the present invention is to provide a production apparatus for electro-deposited metal foil or the like that can reduce thickness fluctuation of electro-deposited metal foil. To achieve the object, a production apparatus for electro-deposited metal foil or the like in which a cathode and an insoluble anode apart from each other, supplying an electrolytic solution through a gap between the cathode and the anode, making the cathode move along to the insoluble anode, electrodepositing a metal component on an electro-deposition surface of the moving cathode is applied.
    Type: Grant
    Filed: March 31, 2010
    Date of Patent: March 12, 2013
    Assignee: Permelec Electrode Ltd.
    Inventors: Yusuke Ozaki, Akira Kunimatsu
  • Patent number: 8377267
    Abstract: Arrangements for plating a single surface of a thin foil are described. In one aspect, a metal foil is wrapped tightly at least partially around a plating solution drum. The drum is partially immersed in a plating solution such that the waterline of the metal plating solution is below a break point where the metallic foil strip begins to unwind from the plating solution drum. With this arrangement, one side of the metallic foil strip is exposed to the metal plating solution, while the opposing back side of the metallic foil strip does not come in substantial contact with the metal plating solution. In this manner, the exposed side of the foil is plated while the back surface of the foil is not plated. The drum may be rotated to convey the foil through the plating solution.
    Type: Grant
    Filed: September 30, 2009
    Date of Patent: February 19, 2013
    Assignee: National Semiconductor Corporation
    Inventors: Jaime A. Bayan, Nghia Thuc Tu, Will K. Wong
  • Publication number: 20120298518
    Abstract: Provided is an electroplating apparatus including: a copper electrode plate that is disposed with a gap from an upper surface of an insulating substrate on which seed electrodes are formed; a driving unit that makes the copper electrode plate move along a rectilinear line; a power supply that applies electric current between the copper electrode plate and each of the seed electrodes; and spacers that are provided on the lower surface of the copper electrode plate to thereby make an electrolyte stay by surface tension between the copper electrode plate and the insulating substrate, and that maintains the gap between the copper electrode plate and the insulating substrate so that the electrolyte may move together with the copper electrode plate. Accordingly, a uniform copper film can be formed on the surface of a large substrate.
    Type: Application
    Filed: July 14, 2011
    Publication date: November 29, 2012
    Inventor: Seung Ki JOO
  • Patent number: 8318552
    Abstract: A process for forming gate structures is described. A web comprises a substrate, a plurality of conductive elements disposed on the substrate, and a conductive anodization bus. The web is moved through an anodization station to form a plurality of gate structures comprising a plurality of gate dielectrics adjacent to a plurality of gate electrodes. A process for forming electronic devices further providing a semiconductor, a source electrode, and a drain electrode is described.
    Type: Grant
    Filed: May 20, 2008
    Date of Patent: November 27, 2012
    Assignee: 3M Innovative Properties Company
    Inventors: Jeffrey H. Tokie, Michael A. Haase, Robert J. Schubert, Michael W. Bench, Donald J. McClure, Grace L. Ho
  • Patent number: 8298384
    Abstract: A method and apparatus for plating parts like lug nuts or other metal parts that have both an easily plated outside surface as well as a recessed cavity. The invention works in combination with a standard multi-station plating process. Also, a method and apparatus for preventing areas of electrode contact on a part from being non-plated. The present invention drains and plates a part containing a cavity by moving the part from a position where the cavity is facing around 45 degrees down to a position where the cavity is facing around 45 degrees up and then back down at various times during the process. The moving is generally initiated when the rack moving along a track above the fluid tanks encounters a roller. The roller causes a depression bar to activate a mechanical mechanism that shifts the position of the part. Other embodiments of the present invention can also rotate the part on an electrode finger as a roller on the track is encountered by the rack to avoid non-plated regions on the part.
    Type: Grant
    Filed: January 29, 2009
    Date of Patent: October 30, 2012
    Assignee: Century Plating Co.
    Inventors: George Koltse, Victor LaPorta
  • Patent number: 8282805
    Abstract: An improved process for treating an electrically conductive surface of a workpiece by cleaning or coating the surface is provided, comprising the steps of deploying the electrically conducting surface of the workpiece to form a cathode in an electrolytic cell; establishing a DC voltage between the cathode and an anode; forming a working gap between the anode and the cathode, and establishing a seal around the working gap to form a sealed treatment zone; delivering into the working gap an electrically conductive medium selected from the group consisting of: (A) an aqueous electrolyte from which a foam is created; (B) a foam; and a mixture of components (A) and (B), so that electrically conductive medium consisting of a foam comprising a gas/vapor phase and a liquid phase fills the working gap, wherein said electrically conductive medium enters the electrolytic cell through tubes having discharge ends oriented at approximately ten degrees from parallel to the workpiece, and wherein turbulence is created within
    Type: Grant
    Filed: November 2, 2005
    Date of Patent: October 9, 2012
    Inventor: Edward O. Daigle
  • Patent number: 8253035
    Abstract: A plating processing method comprises performing a continuous electrolytic plating of the surface of a film having a surface resistivity in the range of 1 ?f/Sq to 1000 ?/Sq, wherein a distance between the lowest contacting part of a negative electrode with the film and a plating liquid is in the range of 0.5 cm to 15 cm.
    Type: Grant
    Filed: March 14, 2006
    Date of Patent: August 28, 2012
    Assignee: FUJIFILM Corporation
    Inventor: Jun Matsumoto
  • Patent number: 8246809
    Abstract: An apparatus and a method deposits a metal coating on an electrically conductive substrate in a continuous way. The apparatus includes at least one plating vessel for receiving an electrolyte solution and at least one plating unit. The plating unit includes a first zone comprising at least one first electrode (anode) connected to a positive pole of a power supply; a second zone comprising at least one second electrode (cathode) connected to a negative pole of the power supply; and an intermediate zone between the first zone and the second zone. The intermediate zone separates the first zone from the second zone by a predetermined distance larger than zero. The substrate functions as a cathode having a current density Jc when the substrate is facing the first electrode, and as an anode having a current density Ja when the substrate is facing the second electrode.
    Type: Grant
    Filed: June 19, 2007
    Date of Patent: August 21, 2012
    Assignee: NV Bekaert SA
    Inventors: Roger Francois, Luc Hofman
  • Publication number: 20120205249
    Abstract: To provide a barrel electroplating method which is less prone to bare spots and adhesion failure such as blisters and peeling, and which makes it possible to obtain uniform plated coatings free from burnt deposits and poor brightness, irrespective of the amount of workpieces. The present invention provides a method for performing barrel electroplating by use of an aluminum or aluminum alloy plating bath, the method comprising rotating, swinging, or vibrating an anode (6) placed inside a barrel (4) receiving workpieces, and simultaneously rotating, swinging, or vibrating the barrel, with a voltage being applied between the anode and a cathode provided on an inner wall surface of the barrel.
    Type: Application
    Filed: October 19, 2010
    Publication date: August 16, 2012
    Applicants: HONDA MOTOR CO., LTD., DIPSOL CHEMICALS CO., LTD.
    Inventors: Manabu Inoue, Tadahiro Ohnuma, Toshiki Inomata, Tsutomu Miyadera
  • Patent number: 8231771
    Abstract: An apparatus and system for electromotively coating a part can include a conveyor that has a plurality of hangars that are configured to be positively connected to respective parts that are to be coated. An attachment mechanism can be provided on the hangar and the part, the attachment mechanism being configured to exert force in more than a single direction. The part can be a conductive plastic part and can include an attachment structure that is formed thereon, for example, screw threads integrally formed in the part. The hangar can include a similar fastener that is configured to connect to the attachment structure of the part. For example, the fastener of the hangar can be a screw thread that mates with threads integrally or otherwise formed on the part.
    Type: Grant
    Filed: August 31, 2007
    Date of Patent: July 31, 2012
    Assignee: Honda Motor Co., Ltd.
    Inventors: Carmen Crowley, Thomas H. Croyle, Todd Fitz, James Paul Ryan, Masahiro Ishikawa
  • Patent number: 8221608
    Abstract: Methods for plating substrates are herein defined. One method includes providing a plating assembly having a plating source in a plating fluid and a plating facilitator in the plating fluid, and defining a plating meniscus between the plating source and the plating facilitator. The plating meniscus being contained in a path of the plating assembly. The method further includes traversing a substrate through the path of the plating assembly. The substrate being charged so that plating ions are attracted to a surface of the substrate when the plating meniscus is present on the surface of the substrate, wherein the substrate traversing through the path of the plating assembly enables plating across the surface of the substrate. And, inducing a uniform charge in the path where the plating meniscus is formed, such that charge from the plating source is substantially uniformly directed toward the plating facilitator as the substrate that is charged moves through the path of the plating assembly.
    Type: Grant
    Filed: October 6, 2010
    Date of Patent: July 17, 2012
    Assignee: Lam Research Corporation
    Inventors: Carl A. Woods, Yezdi N. Dordi, Jacob Wylie, Robert Maraschin
  • Publication number: 20120061244
    Abstract: An electric contact in the outer edge thereof, is used for electroplating substrates, e.g. as a wafer in a cup plater. In order to obtain an even electroplating result, at least two electrolytic partial cells are formed which are supplied with current by respective electroplating current sources (9?) and (9?) that can be individually adjusted. The partial cathode (12?) and the associated partial anode (7?) are supplied in the region of the diametrically remote partial cathode (12?). Conversely, the partial cathode (12?) is supplied via the base layer of the partial cathode (12?). The required levelling of the layer thickness distribution is inter alia carried out by alternate different adjustments of the quantity of the electroplating current of the two partial cells and by the electrodes (7,12) that rotate relative to each other.
    Type: Application
    Filed: May 18, 2010
    Publication date: March 15, 2012
    Applicant: SOMONT GMBH
    Inventor: Egon Engmark Hübel
  • Patent number: 8110076
    Abstract: An improved apparatus and method of producing metal foam is provided which involves optimizing the natural convection of electrolyte through a foam being electroplated by inclining the foam during plating. A diagonal flow of electrolyte though the foam enhances electrolyte turnover within the foam while increasing electroplating efficiency. Further increases in plating efficiency are provided by shifting current density from higher plating zones to lower plating zones.
    Type: Grant
    Filed: June 5, 2006
    Date of Patent: February 7, 2012
    Assignee: Inco Limited
    Inventor: Victor Ettel
  • Patent number: 8097143
    Abstract: A plating method comprising: continuously electroplating a surface of a film having a surface resistivity of from 1 to 1,000?/? in a plurality of times, wherein the plurality of times are equally divided into a former half stage and a latter half stage, and wherein an average plating time of the former half stage of the electroplating step is shorter than an average plating time of the latter half stage of the electroplating step or an average plating voltage at the latter half stage of the electroplating step is 60% or less of an average plating voltage at the former half stage of the electroplating step.
    Type: Grant
    Filed: June 6, 2006
    Date of Patent: January 17, 2012
    Assignee: Fujifilm Corporation
    Inventor: Yoshihiro Fujita
  • Patent number: 8080147
    Abstract: A disclosed electrolytic plating method includes a first step of immersing a substrate in electrolytic plating liquid including copper salt to form a first Cu layer on the substrate; and a second step of forming a second Cu layer over the first Cu layer. The first step is continued for ten seconds or less after the immersion. In the first step, the substrate is rotated at a first speed N (rpm) which satisfies D×N×??6000×? (mm/min), where D is the diameter of the substrate (mm), and D×N×? represents the peripheral speed of the substrate, and a current is supplied to the substrate at a first density of 10 mA/cm2 or less. In the second step, the substrate is rotated at a second speed higher than the first speed, and the current is supplied to the substrate at a second density higher than the first density.
    Type: Grant
    Filed: January 29, 2009
    Date of Patent: December 20, 2011
    Assignee: Fujitsu Semiconductor Limited
    Inventor: Motonobu Sato
  • Publication number: 20110259751
    Abstract: The present invention provides a method for producing solar cells, comprising the steps of—providing silicon containing vitreous substrates, each provided with an electrically conductive material on at least one side thereof, —successively transporting at least a portion of each substrate through an electrolytic solution that is present in an electrolytic bath, —connecting said electrically conductive material as the cathode during the transport of the substrates through the electrolytic bath for the purpose of electrodepositing material from the electrolytic solution onto the electrically conductive material during said transport, wherein the substrates are suspended from a conveyor element during transport and extend in the transport direction. The invention further provides a device for producing solar cells.
    Type: Application
    Filed: April 7, 2009
    Publication date: October 27, 2011
    Applicant: MECO EQUIPMENT ENGINEERS B.V.
    Inventors: Ronald Langereis, Gregorius Johannes Bertens
  • Patent number: 8029660
    Abstract: Manufacture of semiconductor products such as LCD driver requires a bump plating step for forming a gold bump electrode having a size of from about 15 to 20 ?m. This bump plating step is performed by electroplating with a predetermined plating solution, but projections intermittently appear on the bump electrode during a mass production process. In the invention, abnormal growth of projections over the gold bump electrode is prevented by adding, prior to the gold bump plating step, a step of circulating and stirring a plating solution while erecting a plating cup and efficiently dissolving/discharging a precipitate. This step is performed for each wafer to be treated.
    Type: Grant
    Filed: October 23, 2008
    Date of Patent: October 4, 2011
    Assignee: Renesas Electronics Corporation
    Inventors: Tota Maitani, Taku Kanaoka
  • Patent number: 8012330
    Abstract: A plating method, employing a face-down manner of plating and using a resistor body between a substrate and an anode, can securely bring an entire surface to be plated of the substrate into contact with a plating solution without permitting intrusion of air bubbles to the surface to be plated. A resistor body is disposed above the anode and immersed in the plating solution, allowing the plating solution to flow along an upper surface of the resistor body from the periphery toward the center of the resistor body. Thus, a raised portion of the plating solution is created in the center of the upper surface of the resistor body. The substrate is then lowered with the surface facing downwardly so as to fill the space between the surface to be plated of the substrate and the upper surface of the resistor body with the plating solution.
    Type: Grant
    Filed: February 25, 2008
    Date of Patent: September 6, 2011
    Assignee: Ebara Corporation
    Inventors: Takashi Kawakami, Tsutomu Nakada
  • Patent number: 7955487
    Abstract: The invention relates to a device and method for electrolytically treating flat work pieces (1), more especially for electrolytically treating electrically conductive structures S that are electrically insulated against each other on the surfaces of the work pieces. The method comprises conveying and processing the work pieces (1) on the conveying paths T?, T? in the device, said device comprising at least one assembly A located between tow conveying paths, said assembly including a first and a second rotatable contacting electrode (2, 8) with the contacting electrodes being associated each with one of the conveying paths, and first contacting electrodes (2) abutting against the work pieces being conveyed in a first conveying path T?, and being spaced from the second conveying path T? and second contacting electrodes (8) abutting against the work pieces being conveyed in the second conveying path T? and being spaced to the first conveying path T?.
    Type: Grant
    Filed: June 15, 2005
    Date of Patent: June 7, 2011
    Assignee: Atotech Deutschland GmbH
    Inventors: Franz Kohnle, Klaus Hechler
  • Publication number: 20110073483
    Abstract: A method and apparatus for plating a metal onto a substrate. One embodiment of the present invention provides an apparatus for electroplating a substrate. The apparatus comprises a fluid basin, an anode disposed near a bottom of the fluid basin, a restrictor disposed above the anode, and a substrate support member configured to move the substrate within the fluid basin among different elevations relative to the restrictor. Plating profiles on the substrate may be adjusted by changing the elevation of the substrate during plating.
    Type: Application
    Filed: December 7, 2010
    Publication date: March 31, 2011
    Inventors: HOOMAN HAFEZI, Aron Rosenfeld
  • Patent number: 7906430
    Abstract: A peeling prevention layer for preventing an insulation film and a protection layer from peeling is formed in corner portions of a semiconductor device. The peeling prevention layer can increase its peeling prevention effect more when formed in a vacant space of the semiconductor device other than the corner portions, for example, between ball-shaped conductive terminals. In a cross section of the semiconductor device, the peeling prevention layer is formed on the insulation film on the back surface of the semiconductor substrate, and the protection layer formed of a solder resist or the like is formed covering the insulation film and the peeling prevention layer. The peeling prevention layer has a lamination structure of a barrier seed layer and a copper layer formed thereon when formed by an electrolytic plating method.
    Type: Grant
    Filed: April 25, 2008
    Date of Patent: March 15, 2011
    Assignees: Sanyo Electric Co., Ltd., Kanto Sanyo Semiconductors Co., Ltd.
    Inventors: Mitsuo Umemoto, Kojiro Kameyama, Akira Suzuki
  • Publication number: 20110017605
    Abstract: Methods for plating substrates are herein defined. One method includes providing a plating assembly having a plating source in a plating fluid and a plating facilitator in the plating fluid, and defining a plating meniscus between the plating source and the plating facilitator. The plating meniscus being contained in a path of the plating assembly. The method further includes traversing a substrate through the path of the plating assembly. The substrate being charged so that plating ions are attracted to a surface of the substrate when the plating meniscus is present on the surface of the substrate, wherein the substrate traversing through the path of the plating assembly enables plating across the surface of the substrate. And, inducing a uniform charge in the path where the plating meniscus is formed, such that charge from the plating source is substantially uniformly directed toward the plating facilitator as the substrate that is charged moves through the path of the plating assembly.
    Type: Application
    Filed: October 6, 2010
    Publication date: January 27, 2011
    Inventors: Carl A. Woods, Yezdi N. Dordi, Jacob Wylie, Robert Maraschin
  • Patent number: 7842176
    Abstract: A method for horizontally electroplating or electro deposition a thin film on a substrate comprises the steps of transferring and positioning a substrate on a substrate supporter; the substrate being positioned approximately horizontally; moving a plurality of stop plates to enclose horizontal edges of the substrate so as to form with an enclosure around an edge of the substrate; moving a first electrode to be in contact with a portion of the substrate; the portion being a non-wired area; moving a second electrode to be above and not in contact with the substrate; wherein the second electrode has a polarity opposite to that of the first electrode; and filling electroplating liquid into the enclosure formed by the stop plates so as to be in contact with the second electrode above the substrate for electroplating or electro deposition.
    Type: Grant
    Filed: July 17, 2006
    Date of Patent: November 30, 2010
    Inventor: Yen-Chen Liao
  • Patent number: 7828951
    Abstract: A multi-layered wafer support apparatus is provided for performing an electroplating process on a semiconductor wafer (“wafer”). The multi-layered wafer support apparatus includes a bottom film layer and a top film layer. The bottom film layer includes a wafer placement area and a sacrificial anode surrounding the wafer placement area. The top film layer is defined to be placed over the bottom film layer. The top film layer includes an open region to be positioned over a surface of the wafer to be processed, i.e., electroplated. The top film layer provides a liquid seal between the top film layer and the wafer, about a periphery of the open region. The top film layer further includes first and second electrical circuits that are each defined to electrically contact a peripheral top surface of the wafer at diametrically opposed locations about the wafer.
    Type: Grant
    Filed: June 23, 2009
    Date of Patent: November 9, 2010
    Assignee: Lam Research Corporation
    Inventor: Carl Woods
  • Publication number: 20100258444
    Abstract: The invention relates generally to electrodeposition apparatus and methods. The invention finds particular use in fabricating thin film solar cells. Electrodeposition is improved by using a continuous thin film flow of electrodeposition solution between a substrate and a counter electrode, positioned in close proximity to each other, while the plating current is applied. Apparatus for carrying out methods described herein are highlighted particularly by flow manifolds that allow electrodeposition in the manner described.
    Type: Application
    Filed: April 12, 2010
    Publication date: October 14, 2010
    Applicant: REEL SOLAR, INC.
    Inventors: Kurt H. Weiner, Gaurav Verma, Doron Gal
  • Publication number: 20100221606
    Abstract: A method of fabricating an energy storage device with a large surface area electrode comprises: providing an electrically conductive substrate; depositing a semiconductor layer on the electrically conductive substrate, the semiconductor layer being a first electrode; anodizing the semiconductor layer, wherein the anodization forms pores in the semiconductor layer, increasing the surface area of the first electrode; after the anodization, providing an electrolyte and a second electrode to form the energy storage device. The substrate may be a continuous film and the electrode of the energy storage device may be fabricated using linear processing tools. The semiconductor may be silicon and the deposition tool may be a thermal spray tool. Furthermore, the semiconductor layer may be amorphous. The energy storage device may be rolled into a cylindrical shape. The energy storage device may be a battery, a capacitor or an ultracapacitor.
    Type: Application
    Filed: March 2, 2009
    Publication date: September 2, 2010
    Inventors: Omkaram Nalamasu, Steven Verhaverbeke
  • Publication number: 20100200060
    Abstract: A high quality, highly adherent layer of a metal and oxygen material such as a transparent electrically conductive oxide material is electro deposited onto a substrate in a solution deposition process. The substrate is activated prior to the electro deposition of the metal and oxygen material thereonto by contacting it with a multidentate activating agent which promotes the adhesion of the metal and oxygen material to the substrate. Use of the activation agent eliminates the need to pre-deposit a “seed” layer of the metal and oxygen material onto the substrate by a vacuum deposition process. Process parameters are controlled so as to result in the deposition of a high quality layer of material which is suitable for use in a back reflector structure of a high efficiency photovoltaic device In particular instances the activation method may be implemented in a continuous, roll-to-roll process.
    Type: Application
    Filed: February 19, 2010
    Publication date: August 12, 2010
    Applicant: United Solar Ovonic LLC
    Inventor: Shengzhong LIU
  • Publication number: 20100200413
    Abstract: A metal and oxygen material such as a transparent electrically conductive oxide material is electro deposited onto a substrate in a solution deposition process. Process parameters are controlled so as to result in the deposition of a high quality layer of material which is suitable for use in a back reflector structure of a high efficiency photovoltaic device. The deposition may be carried out in conjunction with a masking member which operates to restrict the deposition of the metal and oxygen material to specific portions of the substrate. In particular instances the deposition may be implemented in a continuous, roll-to-roll process. Further disclosed are semiconductor devices and components of semiconductor devices made by the present process, as well as apparatus for carrying out the process.
    Type: Application
    Filed: February 11, 2009
    Publication date: August 12, 2010
    Applicant: United Solar Ovonic LLC
    Inventors: Shengzhong Liu, Chaolan Hu, Yanhua Zhou, Arindam Banerjee, Jeffrey Yang, Subhendu Guha